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Wallis -Olupapula lwa PLA
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WALLIS custom PLA card sheet material ekoleddwa eri abakola kaadi, abakuba ebitabo, abakyusa RFID inlay converters, abagaba kaadi z’ebirabo ne pulogulaamu za kaadi ezissa essira ku kuyimirizaawo nga banoonya eky’okuddako ekyesigamiziddwa ku biramu okusinga PVC substrates eza bulijjo. Ebintu ebiriwo mulimu empapula enjeru, entangaavu, enjeru n’eya langi ez’enjawulo mu bipimo ebingi eby’emisingi egy’okukuba, ebibikka, kaadi z’okutumbula, kaadi z’obwammemba, kaadi z’ebisumuluzo bya wooteeri n’ebizimbisibwa ebya RFID ebirondeddwa.
Okukola kaadi za PLA kukozesa eddirisa ly’enkola ery’enjawulo okuva ku PVC, PETG ne polycarbonate. Yinki y’okukuba ebitabo, okulongoosa kungulu, okulungamya empapula, ebbugumu ly’okusiba, puleesa, okunyogoza, okulonda adhesive, okusala die n’okugezesa kaadi ewedde birina okukakasibwa ng’enkola emu. Okugezesa sampuli kirungi nga tebannaba kukola mu bungi naddala ku pulojekiti za kaadi ezikola layeri nnyingi, RFID, magnetic-stripe ne long-service-life.
'Bio-based,' 'biodegradable,' 'makolero nnakavundira' ne 'recyclable' zinnyonnyola engeri ez'enjawulo ez'obutonde. Okwewozaako kwonna kulina okukwatagana n’ekigero kya PLA ekituufu n’okuzimba kwa kaadi okuwedde okujjuvu. Chips, antennas, inks, overlays, adhesives, magnetic stripes and coatings bisobola okukyusa ekkubo ly’enkomerero y’obulamu era biyinza okulemesa kaadi ewedde okubeera n’ebisaanyizo by’okusaba nti esobola okukola nnakavundira.
| Ekika ky’Ebintu | PLA card core sheet, printable sheet n’ebintu ebibikka kaadi ebikwata ku pulojekiti |
| Obugumu obw’omutindo | 0.08mm, 0.15mm, 0.17mm, 0.20mm ne 0.35mm; gaagi endala ezirina okwekenneenya okufulumya |
| Sayizi y’olupapula olwa Standard | 300 × 480mm oba sayizi erongooseddwa okusinziira ku byetaago by’okukuba ebitabo n’ensengeka ya kaadi |
| Ebintu Ebiyinza Okulonda Langi | Langi enjeru, entangaavu, etangalijja, enjeru oba erongooseddwa okusinziira ku MOQ n’ensengeka |
| Okusaba Kaadi | Ekirabo, obwammemba, obwesigwa, omukolo, ekisumuluzo kya wooteeri, bizinensi, okutumbula ne kaadi za RFID ezirondeddwa |
| Empeereza ya B2B | Sample sheets, custom gauges, okugezesa okukuba ebitabo, okugezesa lamination, card-structure review, QC specifications n'okutunda ebweru w'eggwanga |
Saba Sampuli za PLA Card Sheet ne Quote
Asidi wa polilactic, atera okuyitibwa PLA, ye poliyesita wa pulasitiika ow’ebbugumu era asobola okukolebwa okuva mu bimera ebizzibwa obuggya ebiva mu bimera. Ku kukola kaadi, PLA ekyusibwa n’efuuka empapula empanvu eziyinza okukola nga layeri y’omusingi ewandiikiddwa, layeri ey’okuyooyoota, layeri entangaavu oba layeri ewagira mu nsengeka ya kaadi eriko laminated.
Ensibuko ya PLA ezzibwa obuggya tekakasa nti kaadi ewangaala, enywerera ku biwandiiko oba okufuuka nnakavundira. Ekigero kya resin, obutafaali, ebigattibwa, langi, okutunula kw’empapula n’okuzimba kaadi bye bisalawo eby’obutonde ebisembayo eby’ebyuma, ebbugumu n’obutonde.
Ebintu bingi ebya PLA bikoleddwa okufugibwa okukola nnakavundira mu makolero nga biddukanyizibwa ebbugumu, obunnyogovu n’okufuuwa empewo. Olupapula lwa PLA terulina kwogerwako nga olubula mangu mu kasasiro, ettaka erya bulijjo, emigga oba ennyanja. Kaadi ewedde erina okwekebejjebwa ng’ekintu ekijjuvu nga tebannaba kukozesebwa kabonero oba claim ya compostability.
General thermoforming PLA sheet eyinza obutawa buwanvu, surface roughness, printability oba lamination enneeyisa eyeetaagisa okukola card. Abaguzi balina okusaba ekiwandiiko ekiraga omutindo gwa kaadi ne bagezesa ekipande ekituufu n’ebyuma byabwe ebikuba ebitabo, yinki, ebibikka ne laminators.
PLA Sheet for Okukola Kaadi mu ngeri ey’Obuwangaazi
| Parameter | Typical Specification / Project requirement |
|---|---|
| Ekikozesebwa | PLA oba enkola ya PLA ekyusiddwa mu ddaala lya kaadi; resin entuufu ne additive package zirina okusibirwa ku code y’ebintu |
| Obugumu | 0.08, 0.15, 0.17, 0.20 ne 0.35mm oba nga zikoleddwa ku mutindo; okugumiikiriza kulina okukkaanyibwako ku buli gaagi |
| Sayizi y’Empapula | 300 × 480mm oba enkola eya customized okusinziira ku impposition, press bed ne lamination plate |
| Amaanyi g’okusika | Obulagirizi bw’ekyuma ≥25MPa (omuwendo gw’okujuliza); okukakasa enkola y’okugezesa gye bakkiriziganyizzaako, okulongoosa n’obwetaavu bw’okulaga obulagirizi obuwanvu ku buli ndagiriro |
| Obukaluba bw’okungulu | 0.8–3.0μm ekifo eky’okujuliza; londa okusinziira ku kukuba ebitabo, okukwata yinki n’ebyetaago by’okusiba |
| Okumaliriza ku ngulu | Matte, semi-matte, glossy, corona-treated oba coated surface eyinza okukubibwa nga egezesebwa mu nkola |
| Erangi | Enjeru, entangaavu, enjeru, Pantone eya custom oba opacity-controlled grade okusinziira ku formulation ne MOQ |
| Okupakinga ebintu | Ebipande ebipapajjo nga biriko firimu ekuuma oba okuyunga, okupakinga okuziyiza obunnyogovu, okukuuma bbaasa ne paleeti |
Kaadi y’endagamuntu ewedde mu budde obutuufu ezimbibwa okuva mu layeri eziwera okusinga ku lupapula lumu oluwanvu. ISO/IEC 7810 eraga ensengeka ya kaadi ya ID-1 eya bulijjo ku mm nga 85.60 × 53.98 nga obuwanvu obw’erinnya bwa mm 0.76. Omugatte gwa layeri ya PLA entuufu gulina okubala okukuba ebitabo, okusiiga, okubikka, obuwanvu bwa chip oba antenna n’okukendeera oluvannyuma lw’okusiba.
| Layer | Typical Function | PLA Okulowooza ku pulojekiti |
|---|---|---|
| Okubikka mu maaso | Akuuma okukuba ebitabo n’okuwa okumaliriza kungulu | Kakasa okukwatagana, okutegeera obulungi, okuziyiza okukunya n’okukwatagana kw’obutonde-okuwoza |
| Olupapula lw’Omusingi olukubiddwa | Atambuza ebifaananyi, ebiwandiiko, dizayini y’obukuumi ne langi y’emabega | Okulongoosa kungulu n’enkola ya yinki birina okuwangaala mu kuzimbulukuka awatali kukyusa langi oba okukutula |
| Omusingi gwa Center | Azimba obuwanvu, obutafaali n’obugumu bw’okubeebalama | Kozesa balanced orientation ne symmetrical construction okukendeeza ku curl |
| Layer y'okuyingiza RFID | Mulimu chip ne antenna okukola emirimu nga tezikwatagana | Account for inlay obuwanvu, antenna adhesion, chip cavity ne puleesa ya lamination |
| Olupapula olukubiddwa emabega / Overlay | Ewa ebifaananyi eby’emabega n’obukuumi ku ngulu | Bbalansi layeri z’omu maaso n’ez’emabega okuddukanya enkyukakyuka mu bipimo |
Layer z’omu maaso n’ez’emabega ezitali zenkanankana zisobola okuleeta curl oluvannyuma lw’okubuguma n’okunyogoza. We kisoboka, kozesa ebipima ebikwatagana, ebibikka ebiwandiiko ebifaanagana n’ebibikka ebikwatagana ku njuyi zombi. Kaadi eziwedde zirina okukeberebwa oluvannyuma lw’okuzirongoosa, so si mangu ddala nga zimaze okuzikolako lamination.
Yinki, adhesive, RFID inlay, magnetic stripe n’okusiiga okukuuma byonna biyamba ku buwanvu obusembayo. Omutwalo gw’empapula ogw’erinnya oguwera mm 0.76 nga tegunnakolebwa lamination guyinza obutavaamu kaadi ewedde ekwatagana oluvannyuma lw’okunyigirizibwa n’okukendeera.
| Enkola y’okukuba ebitabo Enkozesa | eyinza | okubaawo eyetaagisa Okukakasa |
|---|---|---|
| Okukuba ebitabo mu Offset | Ebipande ebinene nga biriko langi y’enkola, Pantone n’eby’okwerinda | Okunywerera kwa yinki, okukala, okuzibira, density ya langi n’okuziyiza lamination |
| Ekyuma ekiyitibwa UV Inkjet | Emisinde emimpi, okulongoosa omuntu, ebifaananyi eby’omuddiring’anwa n’okukola prototyping | Amasoboza ag’okungulu, omutindo gw’okuwonya, okukyukakyuka, okuwunya n’okukwatagana kw’okubikka |
| Okukuba ebitabo ku ssirini | Opaque white, metallic, langi ya spot ne layers ezikola | Obugumu bwa yinki, okukwatagana kw’ekizimbulukusa, okuwonya n’okusiba (lamination bond). |
| Indigo / Okukuba ebitabo mu ngeri ya digito | Data ezikyukakyuka, emisinde emimpi ne pulogulaamu za kaadi ezikoleddwa ku muntu | Okukwatagana kwa Primer, ebbugumu ly’omufaliso, okunywerera kwa toner n’okusiba wansi |
| Thermal / Okuddamu okukyusa Okwefuula | Ennamba za kaadi eziwedde, ebifaananyi, bbaakoodi n’ebiwandiiko ebikakasa | Okugezesa ebbugumu, okutambuza ribiini, obupapajjo n’okutambuza ppirinta |
Obujjanjabi bwa Corona buyinza okuvunda nga butereka. Abaguzi abakozesa UV inkjet, screen printing oba special coatings balina okukkaanya ku target dyne level, enkola y’okugezesa n’obudde obusinga obunene obw’okutereka nga tebannakuba print.
Okunywerera obulungi mu kukuba ebitabo mu kusooka tekukakasa kuziyiza bbugumu, puleesa n’okukwatagana kw’okusiiga. Ebipande ebikubiddwa birina okuteekebwako laminated, okunyogozebwa n’okugezesebwa okusekula nga tebinnaba kukkirizibwa kukola artwork ne ink systems.
Olupapula lwa PLA Card oluyinza okukubibwa
Okugezesebwa kwa Lamination n’okukyusa
PLA etera okugonvuwa ku bbugumu erya wansi okusinga ebikozesebwa mu kaadi ya PVC, PETG oba polycarbonate. Enkola ya PVC lamination eya bulijjo esobola okuleeta okukendeera okuyitiridde, okussaako obubonero ku ngulu, okukyusakyusa, okuzibikira oba okwonooneka kwa chip. Enzirukanya entuufu erina okukulaakulanyizibwa n’omutambi gwa layeri yennyini n’ebyuma.
Okulongoosa empapula: Teeka n’okutebenkeza empapula za PLA, layers ezikubiddwa n’ebiyingizibwa wansi w’ebbugumu n’obunnyogovu ebifugibwa.
Kakasa obulagirizi: Kuuma endagiriro z’ekyuma n’ez’obuwanvu nga zikwatagana munda mu mugogo okuddukanya okukendeera.
Tandika n’enzirukanya y’ebbugumu erikuuma: Kozesa okugezesa okw’ebbugumu erya wansi okusinga enzirukanya ya PVC eya bulijjo era oyongeze oluvannyuma lw’okwekenneenya amaanyi g’ekiyungo n’ebipimo byokka.
Balance temperature, pressure and dwell: Puleesa esukkiridde esobola okussaako akabonero ku ngulu oba okwonoona ebitundu bya RFID; amasoboza agatali gamala gayinza okuleeta delamination.
Okunyogoza wansi wa puleesa efugibwa: Okunyogoza kukosa obupapajjo, okukendeera n’okuzibikira.
Embeera nga tonnapima: Kebera ebipimo, okuzingulula, okunywerera n’obuwanvu bwa kaadi oluvannyuma lw’ekiseera ekikkaanyiziddwaako eky’okudda engulu.
Siba enkola ekkiriziddwa: Wandiika ekika ky’ebbakuli, okutunula kw’omutambi, embeera y’ebbugumu, puleesa, obudde n’embeera y’okunyogoga.
Layer ezimu eza PLA ezikwatagana ziyinza okukwatagana mu bbugumu, ate ebizimbe ebirala byetaaga layeri eyeesiiga oba ey’okusiba. Enkola y’okusiba erongooseddwa erina okwekenneenya amaanyi g’ebikuta, okukaddiwa, okukwatagana kw’okukuba ebitabo n’engeri gye kikwata ku kwewozaako kw’obutonde.
Gloss, matte ne textured plates zikola endabika ey’enjawulo ku ngulu n’enneeyisa y’okufulumya. Test release films ne plate finishes okusobola okukwata, haze, gloss variation n’okukyusa texture okuteetaagibwa.
| Ekisumuluzo Okufuga | Okukyusa Omutendera |
|---|---|
| Okusala Ebipande Guillotine | Sharp blade, supported stack, okuzimba ebbugumu eritono n’obutuufu bw’ebipimo |
| Okukuba Ebikonde ku Kaadi | Okufuluma kw’ebikozesebwa, ebbugumu, okutunula kwa kaadi n’obutabaawo kwatika mu nsonda |
| Okukuba Ebituli n’Ebituli | Edge whitening, notch sensitivity, ekifo ekituli n’okuziyiza okuwanirira-omugugu |
| Okusiba Ebituli mu Chip | Sipiidi y’okusala, ebbugumu, okuggya enfuufu, obuziba bw’ekituli n’okusiba |
| Okukebera ku mbiriizi | Burrs, delamination, cracks, okwerusa, okusongovu n’okuwandiisa layeri |
Olupapula lwa kaadi lwa PLA lusobola okwekenneenyezebwa ku kaadi ezitaliiko kukwatagana, naye olupapula luno kitundu kimu kyokka ku nkola. Enzirukanya ya antenna, chip, inlay substrate, adhesive ne lamination zirina okusigala nga zinywevu mu masannyalaze ne makanika mu kiseera kyonna eky’okukola kaadi n’okuweereza.
| ekyetaagisa ku Smart Card | Ekintu ekikakasa |
|---|---|
| RFID Frequency ne Chip | Kakasa enkola y’omusomi, famire ya chip, memory, protocol ne encoding ebyetaago nga tonnazimba samples |
| Geometry ya Antenna | Kakasa nti card edge, chip position ne cutting layout tebyonoona antenna |
| Inlay Bonding | Kebera okukwatagana kw’ebisiiga, okugumira ebbugumu, obuziba n’okukutuka okumala ebbanga eddene |
| Soma Enkola y’Okukola | Gezesa ebanga ly’okusoma, okulungamya, okutaataaganyizibwa mu mugogo gwa kaadi n’okukwatagana kw’okusiba/omusomi |
| Okwewozaako ku butonde bw’ensi | Toyogera ku kaadi ya kompyuta ng’esobola okukola nnakavundira mu bujjuvu okuggyako ng’ekintu ekijjuvu kikakasibwa |
| Okusaba | Product Focus | Critical Test |
|---|---|---|
| Kaadi z’ebirabo n’obwesigwa | Okukuba ebitabo okw’omutindo ogwa waggulu, bbaakoodi, magnetic stripe oba RFID options | Okukwatagana kwa printa, enkozesa ya waleti, okubeebalama n’obulamu bwa pulogulaamu obusuubirwa |
| Kaadi z'ebisumuluzo bya wooteeri | Kaadi za RFID ezikozesebwa mu bumpimpi nga zirina ebifaananyi ebiriko akabonero n’okukwatagana n’enkola y’okusiba | Okukwataganya chip, encoding, enkola y’omusomi, obunnyogovu n’okugikwata enfunda eziwera |
| Kaadi z’Emikolo n’Abagenyi | Okutuuka ku bbanga ettono, okussaako akabonero, okukuba slot punch ne data ekyukakyuka | Omugugu gwa lanyard, okuwangaala kw’okukuba ebitabo n’ekkubo ly’okusuula emikolo |
| Kaadi z’obwammemba | Kaadi ezikubiddwa era ezikoleddwa ku muntu ku bubwe eza kiraabu, jjiimu ne pulogulaamu z’ebyamaguzi | Okusuubira obulamu bw’obuweereza, okunyiga, okubeebalama n’entambula ya card-printer |
| Kaadi za Bizinensi n’Okutumbula | Premium visual finish, obwerufu, langi ey’enjawulo n’okukola personalization mu bbanga ettono | Okunyweza okukuba ebitabo, okuziyiza okukunya, omutindo gw’empenda n’obuwanvu bw’okutereka |
| Kaadi z’okuyingira mu RFID | Okuzimba kaadi ezitaliiko kukwatagana nga zirina inlay ezikwatagana ne lamination ya bbugumu eri wansi | Enkola y’amasannyalaze, flexing, delamination n’okukwatagana kw’omusomi |
Kaadi z'ebirabo, obwammemba n'okutumbula
Enteekateeka za PLA Card ziwedde
| Amaanyi g’ebintu | Ebikulu | Ebikoma |
|---|---|---|
| PLA | Obusobozi obusinziira ku biramu, emboozi ey’enjawulo ey’okuyimirizaawo n’obusobozi bw’okukola nnakavundira mu makolero ku bizimbe ebikakasibwa | Okuziyiza ebbugumu okutono, okutegeera enkola, akabi k’okumenya n’ebikozesebwa ebitono eby’okukung’aanya |
| PVC | Yatandikawo enkola ya kaadi ey’ebbeeyi entono, okumanya okukuba ebitabo okugazi n’okukola lamination | Ebikozesebwa mu bifo eby’edda, ebirimu chlorine n’okuddamu okukozesebwa okutono mu pulogulaamu nnyingi eza kaadi |
| PETG | Lamination ennungi, toughness, transparency n'okumanyiira okukola card | Teziyinza kukola nnakavundira era okusuula kisinziira ku nkola z’okuddamu okukola ebintu mu kitundu |
| Ekirungo kya Polycarbonate | Ewangaala nnyo, egumira ebbugumu n’okusaanira okukuba layisi | Ensimbi ezisingako n’engeri ey’enjawulo ey’okuyimirizaawo/enkomerero y’obulamu |
| PVC / RPETG ezzeemu okukozesebwa | Ekendeeza ku bwetaavu bwa virgin-plastic ate nga esigazza enkola ya card emanyiddwa | Ebintu ebiddamu okukozesebwa, langi, obutakyukakyuka n’okuddamu okukozesebwa byetaaga obujulizi |
PLA si automatically ekintu ekisinga obulungi ku buli credential. Kaadi za wooteeri ez’obulamu obutono, omugenyi, omukolo, ebirabo n’okutumbula ziyinza okuba ez’amaanyi. Endagamuntu za gavumenti eziwangaala, kaadi z’okusasula, ebiwandiiko ebikakasa ebbugumu eringi ne kaadi ezeetaaga okukuba layisi ziyinza okwetaaga PETG, polycarbonate oba okuzimba okulala okukakasibwa.
| Okwewozaako | Okuvvuunula okutuufu okwa B2B |
|---|---|
| Ebikwata ku bulamu bw’omuntu | Kitegeeza ebirimu kaboni azzibwa obuggya era kisaana okuwagirwa ebiwandiiko by’ebintu oba okugezesa |
| Ekikola nnakavundira mu makolero | Yeetaaga satifikeeti ku mbeera z’okukola nnakavundira ezifugibwa munisipaali oba ez’amakolero ezikola aerobic |
| Awaka Ebikolebwa mu Nnakavundira | Yeetaaga satifikeeti ey’enjawulo ey’okukola nnakavundira mu maka; satifikeeti y’amakolero tekimala |
| Ebiramu ebivunda | Tekituukiridde awatali mbeera y’okugezesa, enkola n’ekiseera |
| Ebiyinza okuddamu okukozesebwa | Mu by’ekikugu kisoboka mu mugga gwa PLA ogwetongodde, naye kaadi tezikkirizibwa nnyo mu mutindo gwa PET oba okuddamu okukola obuveera obutabuliddwa |
| Okusaba Kaadi mu bujjuvu | Chip, antenna, yinki, okusiiga, adhesive ne magnetic stripe birina okuteekebwa mu kwekenneenya |
Satifikeeti ya PLA sheet tesobola kuwagira mu ngeri ya otomatiki okusaba kwa kaadi ya RFID, kaadi ya magnetic-stripe oba kaadi ewandiikiddwa essiddwako. Ebitundu by’ebyuma n’ebyuma biyinza okwetaaga okuggyibwawo, okuddamu okukozesebwa mu ngeri ey’ekikugu oba ekkubo ery’enjawulo ery’okusuula.
Ebifo bingi eby’amakolero ebikola nnakavundira tebikkiriza kaadi za bioplastic nkalu. Ebigambo by’okusuula birina okulaga enkola yennyini ey’okukung’aanya mu katale akagendererwamu okusinga ekintu eky’ebintu eby’enzikiriziganya.
| Ekitundu ky’okugezesebwa | Okukebera |
|---|---|
| Ebipimo n’Obugumu | Obuwanvu, obugazi, radius y’enkoona, obuwanvu n’okugumiikiriza oluvannyuma lw’okulongoosa |
| Warpage ne Flatness | Curl amangu n’okukaddiwa ku bbugumu n’obunnyogovu ebifugibwa |
| Okunywerera ku layeri | Peel, edge delamination, okukaddiwa olw’ebbugumu, okukaddiwa kw’obunnyogovu n’okufukamira |
| Okufukamira n’okunyiganyiga | Okufukamira enfunda eziwera, okukyusakyusa, okutondebwa kw’enjatika n’okukyukakyuka okw’olubeerera |
| Ebbugumu n’okutebenkera mu bipimo | Okutereka mu bifo ebibuguma, ebbugumu lya printa n’okukendeera oluvannyuma lw’okugifuula |
| Okuwangaala kw’okukuba ebitabo | Siiga, okukunya, okukwatagana n’eddagala, okulaga UV n’okunywerera ku kubikka |
| Okukola Kaadi ey’Omuntu | Okugezesa obutereevu ku kaadi, okuddamu okukyusa, okukyusa ebbugumu, okuwandiika n’okuwandiika enkodi nga bwe kisoboka |
| RFID / Omulimu gwa Magineeti | Okusoma/okuwandiika, okukwatagana kw’okusiba, obulungi bwa antenna n’okuwandiika enkodi y’emiguwa oluvannyuma lw’okufulumya |
| Okukebera Ekintu | Okulondoola Omutindo |
|---|---|
| Profile y’obugumu | Gaagi eya wakati, enkyukakyuka okuva ku nsonga n’okugumiikiriza okuva ku kitundu |
| Ebipimo by’Empapula | Obuwanvu, obugazi, squareness, omutindo gw’empenda n’okugumiikiriza okusala |
| Okubeera Flatness ne Curl | Sheet bow, edge lift n’obulagirizi bwa curl oluvannyuma lw’okugikola conditioning |
| Langi ne Opacity | L*, a*, b*, obweru, obutatangaala, okumasamasa n’omutindo ogukkirizibwa okulaba |
| Omutindo gw’okungulu | Obukaluba, omutindo gw’obujjanjabi, enkwagulo, amabala amaddugavu, gels, obucaafu n’omutindo gwa protective-film |
| Ebintu by’Ebyuma | Okusika, okuwanvuwa, okukaluba, okukuba n’okumenya okusinziira ku nkola ezikkaanyiziddwaako |
| Okugezesebwa kwa Lamination | Bonding, shrinkage, haze, blocking, okutebenkera kw’okukuba ebitabo n’okufulumya pulati |
| Okulondoola | Grade, batch, extrusion olunaku, orientation, olunaku lw’obujjanjabi, lipoota y’okukebera n’okujuliza satifikeeti |
PLA sheet esobola okubeera ewunyiriza ebbugumu, obunnyogovu n’okutereka okumala ebbanga. Okutereka obubi kuyinza okukyusa obupapajjo, okulongoosa kungulu, okukuba ebitabo n’enneeyisa ya lamination. Ebyetaago by’okutereka birina okukkaanyibwako ku ddaala entuufu n’enkola y’okupakinga.
Teeka ebipande ebisibiddwa mu sitoowa ennyogovu, enkalu era ennyonjo okuva ku musana obutereevu n’ebyuma ebibugumya.
Kuuma ebipande nga bipapajjo ku paleedi eziwaniriddwa era weewale okunyigirizibwa okuyitiridde okw’okusiba.
Kuuma ebifo ebiri kungulu okuva ku nfuufu, amafuta, ebiwandiiko by’engalo, okukunya n’obunnyogovu.
Ebintu bitereeze mu kisenge ky’okukuba ebitabo oba eky’okusiiga nga tonnaba kubirongoosa.
Kozesa okuzinga obunnyogovu, okukuuma enkoona ne bbaasa ezinywezeddwa ebweru w’eggwanga.
Siiga inventory esooka okuyingira, esooka okufuluma era oddemu okukebera okulongoosa kungulu oluvannyuma lw’okutereka okumala ebbanga.
Essira erissiddwa ku makolero ga kaadi: Obugumu bw’olupapula, kungulu, okukuba ebitabo n’ensengeka ya layeri bisobola okwekenneenyezebwa okwetoloola ebyetaago ebya nnamaddala eby’okufulumya kaadi.
Ebipima n’obunene obw’enjawulo: Enkola za mm 0.08–0.35 eza bulijjo n’ensengeka z’empapula ezikoleddwa ku mutindo bisobola okuteesebwako.
Okugezesa okukuba ebitabo n’okukola lamination: Sampuli zisobola okwekenneenyezebwa okulaba oba zirina offset, UV inkjet, screen, digital printing ne low-temperature lamination.
Obuwagizi bwa pulojekiti ya RFID: Ensengekera z’empapula zisobola okwekenneenyezebwa n’obuwanvu bwa inlay, ekifo kya chip, antenna n’okukwatagana kw’omusomi.
Ebigambo ebivunaanyizibwa ku butonde bw’ensi: Ebiwandiiko by’ebintu bisobola okukwatagana n’okuzimba n’akatale kennyini okwa kaadi eziwedde.
Factory-direct B2B supply: Esaanira abakola kaadi, abakyusa, abakuba ebitabo, kkampuni za RFID, abayingiza n’abagaba.
Okusaba kaadi ewedde, obulamu bw’obuweereza obusuubirwa n’akatale k’ekifo w’ogenda.
PLA layer eyeetaagisa: omusingi oguyinza okukubibwa, omusingi ogw’omu makkati, layeri entangaavu oba okubikka.
Obugumu, okugumiikiriza, obunene bw’ekipande, empeke/okulaga n’obungi.
Langi enjeru, entangaavu, enjeru oba eya custom ne opacity target.
Offset, UV inkjet, screen, Indigo oba enkola endala ey’okukuba ebitabo n’enkola ya yinki.
Ekyuma kya lamination, ekintu ekiriwo kati, profile y’ebbugumu, puleesa n’ekika kya plate.
Sayizi ya kaadi ewedde, obuwanvu n’obwetaavu bwa ISO oba ebiragiro bya kasitoma.
RFID chip, antenna, inlay obuwanvu, magnetic stripe oba contact-chip ekyetaagisa.
Okukola nnakavundira, ebirimu ebisinziira ku biramu, REACH, RoHS oba ebyetaago ebirala eby’ebiwandiiko.
Omuwendo gwa sampuli, okuteebereza buli mwaka, omwalo gw’ogenda n’enteekateeka y’okutuusa ebintu esabiddwa.
Teesa ku Pulojekiti Yo ey'Ebikozesebwa mu Kaadi ya PLA
Si kituufu nti. Okukola kaadi kyetaagisa okufugibwa obupapajjo, obukaluba ku ngulu, langi, okunywerera kw’okukuba ebitabo, okugumiikiriza obuwanvu n’enneeyisa ya lamination. Saba ekigezo ekigezeseddwa okukola kaadi.
Obugumu bwa mutindo obuliwo mulimu mm 0.08, 0.15, 0.17, 0.20 ne 0.35. Gaagi ezikoleddwa ku mutindo zisobola okwekenneenyezebwa okusinziira ku sheet extrusion, layer structure ne MOQ.
Yee. Sayizi y’olupapula eya mutindo eri mm 300 × 480, era ensengeka ezikoleddwa ku mutindo zisobola okuteesebwako okusinziira ku nsengeka y’amawulire, okuteeka kaadi n’ebyuma ebikola lamination.
Empapula za PLA zisobola okwekenneenyezebwa ku kaadi za ID-1, naye kaadi eya mmita 85.60 × 53.98 ewedde n’obuwanvu bwa mm 0.76 mu linnya birina okutuukibwako oluvannyuma lw’okukuba ebitabo, okuzisiiga, okunyogoza n’okukuba ebikonde.
Okukuba ebitabo mu ngeri ya offset kuyinza okwekenneenyezebwa n’okulongoosa kungulu okutuufu ne yinki. Abaguzi balina okugezesa okunywerera kwa yinki, okukala, okuzibikira, obungi bwa langi n’okuziyiza enzirukanya ya lamination.
Ebika ebisaanira ebirongooseddwa oba ebisiigiddwako eddagala biyinza okukwatagana. Amasoboza ag’okungulu, okuwonya yinki, okukyukakyuka, okuwunya n’okukwatagana kw’okubikka birina okugezesebwa ku ppirinta egenderere.
Ebyuma biyinza okuba nga bikozesebwa, naye enkola ya PVC eya bulijjo tesaana kulowoozebwa. PLA okutwalira awamu yeetaaga enzirukanya y’ebbugumu eya wansi era efugirwa n’obwegendereza nga erina puleesa ekakasiddwa, okubeera n’okunyogoga.
Ebitera okuvaako mulimu ebbugumu erisukkiridde, layers ezitali za bbalansi, okutunula kw’empapula okutali kukwatagana, okubikka ebiwandiiko mu ngeri etakwatagana, okunyogoza obubi n’okupima kaadi nga tennaba kulongoosebwa mu bujjuvu.
Yee, okusinziira ku kugezesebwa. Obugumu bwa inlay, dizayini ya antenna, adhesive, chip location, lamination pressure n’okukwatagana kw’omusomi birina okuteekebwa mu nsengeka ya card.
PLA esobola okulowoozebwako ku kaadi z’ebisumuluzo bya wooteeri ezikozesebwa mu kiseera ekitono nga chip, enkola y’okusiba, okukuba ebitabo, okulaga obunnyogovu n’okugikwata enfunda eziwera bikakasiddwa nga tebinnaba kufulumizibwa.
Enkola esinziira ku ddaala n’okuzimba. PLA eyinza okuba nga nnungi ku kaadi ezirondeddwa ez’obulamu obutono n’obw’omu makkati, naye tesaana kulowoozebwa nti ekwatagana ne PVC, PETG oba PC mu kuziyiza ebbugumu, okukuba oba okufukamira okw’ekiseera ekiwanvu.
Standard PLA card sheet si automatically esaanira ku secure laser engraving. Enkola ezimanyiddwa nga layisi, enjawulo, okuddamu ebbugumu n’okuwangaala kwa kaadi byetaaga okukulaakulanya n’okugezesa okwewaayo.
Okwewozaako okwo kwesigamye ku butonde obukakasibwa n’okuzimba okujjuvu. Ekipande kya PLA ekya bulijjo kiyinza okuba nga kya nnakavundira mu makolero, ate yinki, ebisiiga, ebikuta, antenna, emisono oba ebizigo bisobola okukyusa embeera ya kaadi ewedde.
Nga kaadi entuufu ewedde erina satifikeeti ey’enjawulo ey’okukola nnakavundira awaka. Satifikeeti ya nnakavundira mu makolero tewagira butereevu kwewozaako kwa nnakavundira w’awaka.
PLA ne PET polimeeri za njawulo era mu budde obutuufu tezirina kutabulwa. Okuddamu okukola ebintu mu PLA kyetaagisa omugga ogwetongodde ogw’okukung’aanya, ogutasangibwa nnyo ku kaadi.
Langi enjeru, entangaavu, enjeru, ezitangaala n’eza custom zisobola okuteesebwako. Langi masterbatch eyinza okukosa okukuba, lamination, omulimu gw'ebyuma n'obuwanvu bw'okuweebwa satifikeeti.
Teeka ng’osibye, nga fulaati era nga nkalu mu sitoowa efugibwa wala okuva ku musana n’ebbugumu. Kuuma kungulu okuva ku nfuufu, amafuta, okukunya n’obunnyogovu, n’okutereeza empapula nga tonnaba kukuba mu kyapa.
Yee. Sampuli empapula zirina okukubibwa, okusiigibwa laminated, okunyogozebwa, okukubwa ebikonde n’okufuulibwa omuntu nga tukozesa enkola egenderere ey’okufulumya nga tebannaba kukkirizibwa kulaga bintu.
MOQ esinziira ku buwanvu, obunene bw’ekipande, langi, okulongoosa kungulu, okusiiga, okupakinga n’okumanya oba pulojekiti ekozesa enkola eriwo eya ddaala lya kaadi.
Okuwa enkola ya kaadi, ekika kya layeri, obuwanvu, sayizi, langi, enkola y’okukuba ebitabo, enkola y’okukuba lamination, ebyetaago bya RFID oba stripe, satifikeeti, obungi n’ekifo w’ogenda.
Tuukirira WALLIS Plastic ku custom PLA card core sheets, printable sheets ne card-layer materials ku birabo, obwesigwa, ekisumuluzo kya wooteeri, omukolo, okutumbula ne pulogulaamu za RFID card ezirondeddwa. Ttiimu yaffe ewagira okulonda gauge, okukuba ebitabo n'okugezesa lamination, card-structure review, ebiwandiiko ebikwata ku butonde, omutindo specifications n'ekkolero-obutereevu B2B supply.
