|
Wallis -PLA Sheet
| Ruvara: | |
|---|---|
| Saizi: | |
| Chishandiso: | |
| Chishandiso: | |
| mukana: | |
| Kuwanda: | |
WALLIS tsika yePLA kadhi pepa zvinhu zvakagadzirirwa vagadziri vemakadhi, vanodhinda, RFID inlay converter, zvipo-kadhi vatengesi uye inosimudzira-yakatarisana nemakadhi zvirongwa zvichitsvaga bio-based imwe nzira kune yakajairwa PVC substrates. Sarudzo dziripo dzinosanganisira machena, akajeka, matema uye akajairwa-mavara-mashiti mumageji akawanda eakadhindwa macores, akafukidzira, makadhi ekusimudzira, makadhi enhengo, makadhi kiyi ehotera uye akasarudzwa RFID zvivakwa.
Kugadzirwa kwekadhi rePLA kunoshandisa hwindo rekuita zvakasiyana kubva kuPVC, PETG uye polycarbonate. Kudhinda inki, kurapwa kwepamusoro, kutaridzika kweshizha, tembiricha yekupisa, kudzvanywa, kutonhora, sarudzo yekunamatira, kucheka kufa uye kupedzisa-kadhi kuyedzwa kunofanirwa kusimbiswa seimwe system. Sample miedzo inokurudzirwa pamberi pekugadzirwa kwakawanda, kunyanya kune multilayer, RFID, magineti-stripe uye-refu-sevhisi-hupenyu kadhi mapurojekiti.
'Bio-based,' 'biodegradable,' 'industrial compostable' uye 'recyclable' inotsanangura zvakasiyana siyana zvezvakatipoteredza. Chero chikumbiro chinofanirwa kuenderana neiyo PLA giredhi uye yakazara yakapera-kadhi kuvaka. Chips, antennas, ingi, overlays, adhesives, magineti mitsetse uye machira anogona kushandura nzira yekupedzisira-yehupenyu uye inogona kudzivirira kadhi rakapedzwa kubva pakukodzera compostability claim.
| Product Type | PLA kadhi repakati pepa, rinodhindwa shiti uye purojekiti-chaiwo kadhi pamusoro pezvinhu |
| Ukobvu hwakakwana | 0.08mm, 0.15mm, 0.17mm, 0.20mm uye 0.35mm; mamwe mageji ari pasi pekuongororwa kwekugadzirwa |
| Standard Sheet Size | 300 × 480mm kana saizi yakagadziridzwa zvinoenderana nekudhinda uye kadhi-magadzirirwo zvinodiwa |
| Mavara Sarudzo | Ichena, yakajeka, inopenya, yakasviba kana yakasarudzika ruvara zvichienderana neMOQ uye kugadzirwa |
| Kadhi Applications | Chipo, nhengo, kuvimbika, chiitiko, kiyi yehotera, bhizinesi, yekusimudzira uye yakasarudzwa makadhi eRFID |
| B2B Services | Mashizha emuenzaniso, mageji echinyakare, miedzo yekudhinda, kuyedzwa kwelamination, kadhi-chimiro chekuongorora, QC yakatarwa uye kutumira kunze kwenyika. |
Kumbira PLA Kadhi Sheet Samples uye Quote
Polylactic acid, inowanzonzi PLA, ndeye thermoplastic polyester iyo inogona kugadzirwa kubva kune inovandudzwa-inotorwa zvirimwa zvekudya. Pakugadzira makadhi, PLA inoshandurwa kuita mashizha akapfava anogona kushanda seyakadhindwa yepakati layer, yekushongedza dhizaini, yakajeka dhizaini kana inotsigira layer mune laminated kadhi chimiro.
Mabviro anodzokororwa ePLA haangozvivimbisi kusimba kwekadhi, kudhinda adhesion kana compostability. Resin giredhi, crystallinity, additives, pigment, sheet orientation uye kuvakwa kwekadhi kunotaridza iyo yekupedzisira mechanika, inopisa uye yezvakatipoteredza zvivakwa.
Zvigadzirwa zvakawanda zvePLA zvakagadzirirwa kudzorwa indasitiri composting ine inogadziriswa kupisa, mwando uye aeration. Pepa rePLA harifanirwe kurondedzerwa sekukurumidza kunyangarika mumarara, ivhu rakajairwa, nzizi kana makungwa. Kadhi rakapedzwa rinofanirwa kuongororwa sechinhu chakakwana chisati chashandiswa compostability logo kana kudai.
General thermoforming PLA sheet inogona kusapa kupfava, kushata kwepamusoro, kudhinda kana hunhu hunodiwa pakugadzira kadhi. Vatengi vanofanirwa kukumbira kadhi-giredhi yakatarwa uye kuyedza iro pepa chairo nemichina yavo, ingi, akavharira uye laminator.
PLA Sheet yeSustainable Card Manufacturing
| Parameter | Typical Matauriro / Project Inodiwa |
|---|---|
| Material | PLA kana yakagadziridzwa PLA kadhi-giredhi kuumbwa; chaiyo resin uye yekuwedzera package inofanirwa kuvharwa nekodhi yechigadzirwa |
| Ukobvu | 0.08, 0.15, 0.17, 0.20 uye 0.35mm kana customized; kushivirira kunofanirwa kubvumirana kune yega geji |
| Sheet size | 300 × 480mm kana customized fomati yakavakirwa pakuisirwa, kudzvanya mubhedha uye lamination ndiro |
| Tensile Simba | Machine direction ≥25MPa (reference value); simbisa iyo yakabvumiranwa bvunzo nzira, mamiriro uye transverse-direction inodiwa kune yega yega |
| Kukasharara Kwepamusoro | 0.8–3.0μm referenzi renji; sarudza maererano nekudhinda, inki holdout uye lamination zvinodiwa |
| Surface Finish | Matte, semi-matte, glossy, corona-treated kana coated printable surface inoenderana nemiedzo. |
| Color | Ichena, yakajeka, dema, tsika Pantone kana opacity-inodzorwa giredhi zvichienderana nekuumbwa uye MOQ |
| Packing | Mashizha akafuratira ane firimu rekudzivirira kana kupindirana, kunyorova-kuvharira kurongedza, katoni uye pallet kuchengetedza |
Kadhi rakapedzwa rekuzivikanwa rinowanzo kuvakwa kubva kune akawanda akaturikidzana kwete rimwe gobvu shizha. ISO/IEC 7810 inotaridza iyo yakajairwa ID-1 kadhi fomati inosvika 85.60 × 53.98mm ine ukobvu hwezita hwe0.76mm. Iyo chaiyo PLA layer musanganiswa inofanirwa kuverengera kudhinda, kunamira, pamusoro, chip kana antenna ukobvu uye post-lamination shrinkage.
| Layer | Typical Function | PLA Project Kutariswa |
|---|---|---|
| Front Overlay | Inodzivirira kudhindwa uye inopa kupera kwepamusoro | Simbisa kubatana, kujeka, kuramba kwekukwenya uye kuenderana kwezvakatipoteredza-kudaidza |
| Yakadhindwa Core Sheet | Inotakura mifananidzo, zvinyorwa, dhizaini yekuchengetedza uye kumashure kwemavara | Kurapa kwepamusoro uye inki system inofanirwa kupona lamination pasina ruvara shanduko kana delamination |
| Center Core | Inovaka ukobvu, opacity uye kukotama kuoma | Shandisa yakaenzana kutaridzika uye symmetrical kuvaka kudzikisa curl |
| RFID Inlay Layer | Iine chip uye antenna yekusabatika basa | Account ye inlay ukobvu, antenna adhesion, chip cavity uye lamination pressure |
| Back Printed Sheet / Overlay | Inopa reverse magiraidhi uye kuchengetedzwa kwepamusoro | Balance kumberi uye kumashure maseru kubata dimensional shanduko |
Zvisina kuenzana kumberi uye kumashure maseru anogona kugadzira curl mushure mekudziya uye kutonhora. Pazvinogoneka, shandisa geji dzakafananidzwa, madhindindi akafanana uye akafukidzira akaenzanirana pamativi ese. Makadhi apedzwa anofanira kuongororwa mushure mekugadzirisa, kwete pakarepo mushure mekugadzirisa.
Ingi, inonamira, RFID inlay, tambo yemagineti uye inodzivirira coating zvese zvinobatsira mukukora kwekupedzisira. A zita remashizha stack iyo inokwana 0.76mm isati yacheneswa inogona kusaburitsa kadhi rakapedzwa rinoenderana mushure mekutsikirirwa uye kupera.
| Kudhinda Nzira | Inogona Kushandiswa | Kunodiwa Kusimbiswa |
|---|---|---|
| Offset Printing | Akakwira-vhoriyamu mapepa ane process color, Pantone uye kuchengetedza kumashure | Inki adhesion, kuomesa, kuvharira, ruvara density uye lamination kuramba |
| UV Inkjet | Short run, personalization, serial graphics uye prototyping | Surface simba, kurapa nhanho, kuchinjika, kunhuwa uye kuvharika chisungo |
| Kudhinda Screen | Opaque chena, simbi, ruvara rwemavara uye anoshanda akaturikidzana | Inki ukobvu, solvent kuenderana, kurapa uye lamination bond |
| Indigo / Digital Printing | Yakasiyana-siyana data, mapfupi anomhanya uye akasarudzika emakadhi zvirongwa | Primer kuenderana, tembiricha yegumbeze, toner adhesion uye yakadzika lamination |
| Thermal / Retransfer Personalization | Kupedzwa-kadhi manhamba, mapikicha, mabhakodhi uye zvitupa | Kuratidzwa kwekupisa, kufambisa ribhoni, flatness uye printa yekufambisa yekuongorora |
Corona kurapwa inogona kuora panguva yekuchengetedza. Vatengi vanoshandisa UV inkjet, kudhinda skrini kana machira akasarudzika vanofanirwa kubvumirana pane inotangwa dyne level, nzira yekuyedza uye yakanyanya kuchengetedza nguva isati yadhinda.
Kubata kwakanaka kwekutanga kudhinda hakuvimbisi kuramba kupisa, kudzvanywa uye kubata kunonamira. Mashizha akadhindwa anofanirwa kuve akacheneswa, kutonhodzwa uye kuongororwa-mapepa asati abvumidzwa mabasa emifananidzo uye inki.
Rinodhindwa PLA Card Sheet
Lamination uye Kushandura Miedzo
PLA kazhinji inopfava pane yakaderera tembiricha pane PVC, PETG kana polycarbonate kadhi zvinhu. Iyo yakajairwa PVC lamination resipi inogona kukonzera yakawandisa shrinkage, chiratidzo chepamusoro, kukanganisa, kuvharira kana kukuvara kwechip. Kutenderera kwakaringana kunofanirwa kuvandudzwa neiyo chaiyo layer stack nemidziyo.
Gadzirisa mapepa: Chengetedza uye uenzanise mapepa ePLA, akadhindwa akadhindwa uye inlays pasi pekudzora tembiricha uye hunyoro.
Simbisa kutarisisa: Chengetedza muchina uye anochinjika mafambiro anoenderana mukati meiyo stack kubata shrinkage.
Tanga neinochengetedza kupisa kutenderera: Shandisa muyedzo wakadzika-tembiricha pane wakajairika PVC kutenderera uye wedzera chete mushure mekuongorora kusimba kwebhondi nehukuru.
Balance tembiricha, kudzvanywa uye kugara: Kudzvinyirira kwakanyanya kunogona kumaka pamusoro kana kukuvadza zvikamu zveRFID; simba risina kukwana rinogona kukonzera delamination.
Kutonhorera pasi pekumanikidzwa kunodzorwa: Kutonhora kunokanganisa flatness, shrinkage uye kuvhara.
Mamiriro asati ayera: Tarisa zviyero, curl, kunamatira uye ukobvu hwekadhi mushure menguva yakabvumiranwa yekudzoreredza.
Kiya iyo yakatenderwa resipi: Rekodha ndiro yemhando, stack kutaridzika, tembiricha mbiri, kudzvanywa, nguva uye kutonhora mamiriro.
Mamwe anowirirana ePLA akaturikidzana anogona kusungirirwa nemafuta, nepo zvimwe zvimiro zvinoda chinonamira kana tie layer. Iyo yakasarudzwa bonding system inofanirwa kuongororwa kusimba kwepeel, kuchembera, kuenderana nekudhinda uye mhedzisiro yayo pakuda kwezvakatipoteredza.
Gloss, matte uye mahwendefa ane mavara anoburitsa akasiyana chitarisiko chepamusoro uye maitiro ekuburitsa. Edza kuburitsa mafirimu uye ndiro inopera yekunamira, mhute, gloss kusiyanisa uye kusingadiwe kutamisa mameseji.
| Kushandura Nhanho | Kiyi Kudzora |
|---|---|
| Sheet Guillotine Kucheka | Yakapinza blade, yakatsigirwa stack, yakaderera kupisa kuvaka-up uye dimensional kurongeka |
| Card Punching | Tool clearance, tembiricha, kutariswa kwekadhi uye kusavapo kwekupwanya kwekona |
| Slot uye Hole Punching | Edge whitening, notch sensitivity, gomba chinzvimbo uye kurembera-mutoro kuramba |
| Chip Cavity Milling | Kucheka kumhanya, kupisa, kubviswa kweguruva, kudzika kwegomba uye kusungirirana |
| Edge Inspection | Burrs, delamination, cracks, whitening, sharpness uye layer registration |
PLA kadhi pepa rinogona kuongororwa kune asingabatanidzi makadhi, asi pepa rinongova chikamu chimwe chehurongwa. Iyo antenna, chip, inlay substrate, adhesive uye lamination kutenderera kunofanirwa kuramba kuine magetsi uye nemichina yakagadzikana mukati mekugadzira makadhi uye sevhisi.
| Smart Card Inodiwa | Kusimbisa Chinhu |
|---|---|
| RFID Frequency uye Chip | Simbisa muverengi system, chip mhuri, ndangariro, protocol uye encoding zvinodiwa usati wavaka sampuli |
| Antenna Geometry | Ita shuwa kumucheto kwekadhi, chip chinzvimbo uye kucheka marongero hazvikuvadze antenna |
| Inlay Bonding | Tarisa kuenderana kwekunamatira, kupisa kupisa, voids uye kwenguva refu delamination |
| Verenga Performance | Yedza kuverenga chinhambwe, kutaridzika, kukanganiswa kwekadhi stack uye kukiya/kuenderana muverengi |
| Environmental Claim | Usatsanangure kadhi remagetsi seine compostable zvizere kunze kwekunge chinhu chakazara chakasimbiswa |
| Chikumbiro | Chigadzirwa Chekutarisa | Yakakosha Muedzo |
|---|---|---|
| Makadhi Echipo uye Okuvimbika | Kudhinda kwemhando yepamusoro, barcode, magineti mutsetse kana RFID sarudzo | Printer kuenderana, kushandiswa kwechikwama, kukotama uye hupenyu hwechirongwa hunotarisirwa |
| Makadhi Akakosha eHotera | Pfupi-shandisa makadhi eRFID ane branded graphics uye yekuvhara-system kuenderana | Chip kuenzanisa, encoding, kuverenga kwekuverenga, humidity uye inodzokororwa kubata |
| Chiitiko uye Makadhi Evashanyi | Kusvika kwenguva pfupi, kuisa chiratidzo, slot punching uye data inosiyana | Lanyard mutoro, kudhinda kusimba uye nzira yekurasa chiitiko |
| Makadhi Enhengo | Akadhindwa uye akasarudzika makadhi emakirabhu, ejimu uye zvirongwa zvekutengesa | Sevhisi-hupenyu hwekutarisira, abrasion, kukotama uye kadhi-inodhinda kutakura |
| Bhizinesi uye Makadhi Ekusimudzira | Yekutanga yekuona kupedzisa, kujeka, yakakosha ruvara uye pfupi-run personalization | Dhinda adhesion, kukwenya kuramba, edge mhando uye kuchengetedza flatness |
| RFID Access Cards | Kuvakwa kwekadhi kusingabatanidzwe neinofananidzwa inlay uye yakaderera-tembiricha lamination | Kuita kwemagetsi, kuchinjika, delamination uye kuenderana kwevaverengi |
Chipo, Nhengo uye Makadhi Ekusimudzira
Akapedza PLA Kadhi Zvirongwa
| Material | Strengths | Key Limitations |
|---|---|---|
| PLA | Bio-yakavakirwa inogona, yakasarudzika nyaya yekusimudzira uye maindasitiri-compostability mukana wezvimiro zvakasimbiswa | Kudzikira kupisa kuramba, maitiro senitivity, brittleness njodzi uye mashoma ekuunganidza zvivakwa |
| PVC | Yakasimbiswa yakaderera-mutengo kadhi maitiro, yakafara kudhinda uye lamination ruzivo | Fossil-based, chlorine-ine uye kushomeka kudzokorodza zvakare muzvirongwa zvakawanda zvemakadhi |
| PETG | Yakanaka lamination, kuoma, pachena uye kadhi-kugadzira kujairana | Haisi compostable uye kuraswa kunoenderana nemasisitimu ekudzokorodza emunharaunda |
| Polycarbonate | High durability, kupisa kuramba uye kukodzera kwelaser engraving | Mutengo wepamusoro uye wakasiyana kusimudzira / kuguma-kwehupenyu |
| Yakagadzirwazve PVC / RPETG | Inoderedza kudiwa kwemhandara-yepurasitiki uchichengeta yakajairwa kadhi kugadzirisa | Zvemukati zvakadzokororwa, ruvara, kuenderana uye kudzokorora zvinoda humbowo |
PLA haisiyo yega yakanakisa zvinhu kune zvese zvinongedzo. Hupenyu hupfupi hotera, muenzi, chiitiko, chipo uye makadhi ekusimudzira anogona kunge ari vamiriri vakasimba. Zvitupa zvehurumende zvehupenyu hurefu, makadhi ekubhadhara, zvitupa zvepamusoro-tembiricha uye makadhi anoda laser engraving angangoda PETG, polycarbonate kana chimwe chivakwa chakasimbiswa.
| Claim | Chaiyo B2B Dudziro |
|---|---|
| Bio-Yakavakirwa | Inoreva kune inogona kuvandudzwa kabhoni yemukati uye inofanirwa kutsigirwa nezvinyorwa zvinyorwa kana kuyedzwa |
| Industrial Compostable | Inoda certification yeinodzorwa maneja kana maindasitiri aerobic composting mamiriro |
| Kumba Compostable | Inoda yakaparadzana imba-compost certification; certification yeindasitiri haina kukwana |
| Biodegradable | Haina kukwana pasina bvunzo nharaunda, nzira uye nguva yakatarwa |
| Recyclable | Nehunyanzvi zvinogoneka murukova rwakatsaurirwa rwePLA, asi makadhi haagamuchirwe zvakanyanya muyakajairwa PET kana yakasanganiswa-purasitiki kudzokorodza. |
| Zadzisa Kadhi Mhosva | Iyo chip, antenna, inki, coating, adhesive uye magineti mutsetse unofanirwa kuverengerwa muongororo. |
Setifiketi rePLA sheet haigone kutsigira otomatiki chikumbiro cheRFID kadhi, magineti-stripe kadhi kana kadhi rakadhindwa. Zvigadzirwa zvemagetsi uye zvesimbi zvingada kubviswa, nyanzvi kudzokorodza kana imwe nzira yekurasa.
Mazhinji maindasitiri ekugadzira manyowa haagamuchire akaomesesa bioplastic makadhi. Kurasa mazwi kunofanirwa kuratidza iyo chaiyo yekuunganidza hurongwa mumusika unonangwa kwete chivakwa chezvinyorwa.
| Test Area | Evaluation |
|---|---|
| Dimensions uye Ukobvu | Hurefu, hupamhi, radius yekona, ukobvu uye kushivirira mushure mekugadzirisa |
| Warpage uye Flatness | Pakarepo uye achembera curl pane inodzorwa tembiricha uye humidity |
| Layer Adhesion | Peel, edge delamination, kupisa kuchembera, humidity kuchembera uye kuchinjika |
| Kukotama uye Torsion | Kudzokororwa kuchinjika, torsion, kuputika kuumbwa uye deformation zvachose |
| Kupisa uye Dimensional Kugadzikana | Kuchengetedza munzvimbo dzinodziya, kudhinda kupisa kuratidzwa uye post-lamination shrinkage |
| Print Durability | Rub, kukwenya, kemikari kubata, UV kuratidzwa uye pamusoro pekunamatira |
| Kadhi Personalization | Yakananga-kune-kadhi, kuchinjisa, kutamisa kupisa, embossing uye encoding miedzo sezvinoshanda. |
| RFID / Magnetic Basa | Verenga / nyora, kukiya kuenderana, antenna kutendeseka uye mitsetse encoding mushure mekugadzirwa |
| Inspection Item | Quality Control |
|---|---|
| Ukobvu Profile | Avhareji yegeji, kunongedzera-kune-kusiyanisa musiyano uye mijenya-ku-mujenya kushivirira |
| Sheet Dimensions | Hurefu, hupamhi, squareness, mupendero mhando uye kucheka kushivirira |
| Flatness uye Curl | Sheet uta, kukwidziridzwa kumucheto uye kutungamira kwe curl mushure mekugadzirisa |
| Ruvara uye Opacity | L*, a*, b*, kuchena, kupenya, kupenya uye kuona kwakatenderwa mwero |
| Surface Quality | Hushasha, chiyero chekurapa, makwara, mavara matema, gels, kusvibiswa uye kudzivirira-firimu mhando |
| Mechanical Properties | Tensile, elongation, kuomarara, kukanganisa uye brittleness zvinoenderana nenzira dzakabvumiranwa |
| Lamination Trial | Bonding, shrinkage, haze, blocking, kudhinda kugadzikana uye kusunungurwa kweplate |
| Traceability | Giredhi, batch, extrusion zuva, kutaridzika, zuva rekurapa, rekuongorora rondedzero uye retifiketi retifiketi |
Pepa rePLA rinogona kuve nehanya nekupisa, hunyoro uye kuchengetedza kwenguva refu. Kusachengetedzwa kwakashata kunogona kushandura kupfava, kurapwa kwepamusoro, kudhindwa uye hunhu hwemachira. Zvido zvekuchengetedza zvinofanirwa kubvumirana kune iyo chaiyo giredhi uye yekurongedza nzira.
Chengetedza mapepa akavharwa munzvimbo inotonhorera, yakaoma uye yakachena yekuchengetera kure nechiedza chezuva uye maheater.
Chengetedza mapepa akati sandara pamapallet anotsigirwa uye dzivirira yakawandisa stack pressure.
Chengetedza nzvimbo kubva kuguruva, oiri, zvigunwe, zvikweshwa uye mwando.
Mamiriro ezvinhu muimba yekudhinda kana lamination isati yagadziriswa.
Shandisa mwando-chipingamupinyi kuputira, kudzivirira kwekona uye akasimbisa ekunze mabhokisi.
Isa yekutanga-mukati, yekutanga-kunze hevheri uye tarisazve kurapwa kwepamusoro mushure mekuchengetedza kwenguva refu.
Kadhi-indasitiri yekutarisa: Ukobvu hweshiti, pamusoro, kudhinda uye dhizaini chimiro chinogona kuongororwa zvakatenderedza chaiyo kadhi-kugadzirwa kwezvinodiwa.
Mageji echivanhu uye saizi: Yakajairwa 0.08–0.35mm sarudzo uye akagadziridzwa mapepa mafomati anogona kukurukurwa.
Kudhinda uye kuyedzwa kwekuyedza: Samples anogona kuongororwa kuti agadzirise, UV inkjet, skrini, dhijitari kudhinda uye yakaderera-tembiricha lamination.
RFID purojekiti yekutsigira: Mashizha zvimiro zvinogona kuongororwa neinlay ukobvu, chip chinzvimbo, antenna uye kuenderana kwevaverengi.
Zvinotarisirwa kwezvakatipoteredza zvichemo: Zvinyorwa zvezvinhu zvinogona kufananidzwa neiyo chaiyo yakapedzwa-kadhi kuvaka uye musika.
Fekitari-yakananga B2B inopa: Inokodzera vagadziri vemakadhi, vashanduri, vanodhinda, makambani eRFID, vanopinza uye vanogovera.
Yakapedzwa kadhi application, inotarisirwa hupenyu hwesevhisi uye musika wekuenda.
Inodiwa PLA layer: inodhindwa musimboti, yepakati musimboti, yakajeka layer kana pamusoro.
Hukobvu, kushivirira, saizi yeshizha, zviyo/kutarisika uye huwandu.
Muchena, pachena, dema kana tsika ruvara uye opacity chinangwa.
Offset, UV inkjet, skrini, Indigo kana imwe nzira yekudhinda uye inki system.
Lamination muchina, zvazvino zvinhu, tembiricha mbiri, kumanikidza uye ndiro yemhando.
Yakapedzwa saizi yekadhi, ukobvu uye inodiwa ISO kana kutaurwa kwevatengi.
RFID chip, antenna, inlay ukobvu, magineti mutsetse kana kubata-chip zvinodiwa.
Compostability, bio-based content, REACH, RoHS kana zvimwe zvinyorwa zvinodiwa.
Sample huwandu, fungidziro yegore, yekuenda chiteshi uye yakakumbirwa yekuendesa chirongwa.
Kurukura Yako PLA Card Material Project
Kwete hazvo. Kugadzira kadhi kunoda kudzorwa flatness, kushata kwepamusoro, ruvara, kudhinda adhesion, ukobvu kushivirira uye lamination maitiro. Kumbira giredhi rakaedzwa kugadzirwa kwemakadhi.
Ukobvu huripo hunosanganisira 0.08, 0.15, 0.17, 0.20 uye 0.35mm. Yakagadzirirwa geji inogona kuongororwa zvinoenderana nepepa extrusion, layer chimiro uye MOQ.
Ehe. Saizi yeshizha yakajairwa 300 × 480mm, uye mafomati akajairwa anogona kukurukurwa maererano nedhizaini dhizaini, kuiswa kwekadhi uye midziyo yekuchenesa.
Mashizha ePLA anogona kuongororwa makadhi e-ID-1, asi iyo yakapedzwa 85.60 × 53.98mm kadhi uye yezita 0.76mm ukobvu hunofanirwa kuwanikwa mushure mekudhindwa, lamination, kutonhora uye kubaya.
Kudhinda kweoffset kunogona kuongororwa nemhando yakakodzera yekurapa uye inki. Vatengi vanofanirwa kuyedza kunamatira inki, kuomesa, kuvharira, density yemavara uye kuramba kutenderera kwelamination.
Akakodzera kurapwa kana akavharidzirwa mamakisi anogona kuenderana. Simba repamusoro, mushonga weinki, kuchinjika, kunhuhwirira uye kusungirirwa kwepamusoro kunofanirwa kuyedzwa pane inodhinda.
Iyo midziyo inogona kushandiswa, asi yakajairika PVC recipe haifanirwe kufungidzirwa. PLA inowanzoda yakaderera uye yakanyatsodzorwa kupisa kutenderera nekusimbiswa kwakasimbiswa, kugara uye kutonhora.
Zvinowanzokonzeresa zvinosanganisira tembiricha yakanyanyisa, zvidimbu zvisina kuenzana, kutariswa kwepepa risingaenderane, kudhindwa kusingaenzaniswi, kutonhora kwakashata uye kuyera kadhi risati ranyatsogadziriswa.
Hungu, pasi pemiedzo. Inlay ukobvu, antenna dhizaini, adhesive, chip nzvimbo, lamination pressure uye kuenderana kwemuverengi kunofanirwa kuverengerwa muchimiro chemakadhi.
PLA inogona kutariswa kwepfupi-kushandisa hotera kiyi makadhi kana iyo chip, yekuvhara system, kudhinda, humidity kuratidzwa uye kudzokororwa kubata kunosimbiswa isati yagadzirwa.
Kuita kunoenderana negiredhi uye kuvaka. PLA inogona kunge yakakodzera kusarudzwa makadhi mapfupi uye epakati-hupenyu, asi haifanirwe kufungidzirwa kuenderana nePVC, PETG kana PC mukupisa kupisa, kukanganisa kana kuchinjika kwenguva refu.
Yakajairwa PLA kadhi pepa haina otomatiki yakakodzera kune yakachengeteka laser engraving. Laser-inoshamisa magadzirirwo, kusiyanisa, kupisa kupindura uye kusimba kwekadhi kunoda kuvandudza kwakatsaurirwa uye kuyedzwa.
Chirevo ichocho chinoenderana nenzvimbo yakasimbiswa uye kuvakwa kwakakwana. Pepa rePLA rakajeka rinogona kuita compostable muindasitiri, nepo ingi, zvinonamira, machipisi, antennas, mitsetse kana machira anogona kushandura chimiro chekadhi rakapedzwa.
Chete kana iyo chaiyo kadhi yapera ine yakaparadzana imba-compost certification. Indasitiri-compost certification haingotsigire chirevo chemba-compost.
PLA nePET akasiyana mapolymer uye haafanire kusanganiswa. PLA kudzokorodza kunoda yakatsaurirwa kuunganidza rwizi, iyo isingawanikwe zvakanyanya kumakadhi.
Machena, akajeka, matema, anopenya uye akasarudzika mavara anogona kukurukurwa. Rudzi masterbatch inogona kukanganisa kudhinda, lamination, mechanical performance uye certification scope.
Chengetedza rakavharwa, rakati sandara uye rakaoma mudura rinodzorwa kure nechiedza chezuva nekupisa. Chengetedza pamusoro kubva kuguruva, oiri, makwara uye mwando, uye mapepa emamiriro asati adhinda.
Ehe. Sample sheets anofanirwa kudhindwa, laminated, cooled, punched and personalized using the target process process isati yabvumwa.
MOQ inotsamira pakukora, saizi yeshiti, ruvara, kurapwa kwepamusoro, kupeta, kurongedza uye kana chirongwa ichi chichishandisa iripo kadhi-giredhi yekugadzira.
Ipa iyo kadhi application, layer type, ukobvu, saizi, ruvara, nzira yekudhinda, lamination process, RFID kana mitsetse zvinodiwa, certification, huwandu uye kwekuenda.
Bata WALLIS Plastiki yetsika PLA kadhi core sheets, anodhinda mapepa uye kadhi-layer zvinhu zvechipo, kuvimbika, kiyi yehotera, chiitiko, yekusimudzira uye yakasarudzwa RFID kadhi zvirongwa. Chikwata chedu chinotsigira kusarudzwa kwegeji, kudhinda uye kuyedzwa kwelamination, kadhi-chimiro chekuongorora, zvinyorwa zvezvakatipoteredza, hunhu hwemhando uye fekitori-yakananga B2B kupa.
