|
kad we dɔn dɔn
| Kɔlɔ: | |
|---|---|
| Matirial: | |
| advantej: | |
| Kwantiti: | |
Bayodigradabl PLA RFID kad dεm de kכmbayn wan plant-bεys polilaktik asid kad bכdi wit kכntaktlεs RFID כ NFC fכnshכnaliti. Dɛn de gi PVC -fri kad-bɔdi opshɔn fɔ ɔtel, akses kɔntrol, mɛmbaship program, ivintɛns, lɔyalti skim ɛn ɔda kɔntaktlɛs aplikeshɔn dɛn.
Wallis kin saplae kɔstɔmayz finish PLA RFID kad ɛn evalyu PLA shit rikwaymɛnt fɔ kad manufakchurin. Kad dimɛnshɔn, chip sɛlɛkshɔn, printin, ɛnkɔdin ɛn finishin dɛn kɔnfyus fɔ ɛni prɔjek fɔ mek i mach di rida, sistɛm ɛn branding rikwaymɛnt dɛn.
Di Aylayt dɛn bɔt di Prodak
Bayo-based PLA kad bɔdi • RFID ɔ NFC intagreshɔn • Kastɔm printin • Opshɔnal ɛnkɔdin ɛn vayriɔbul data • Finish kad ɔ kad-mɛkin shit • Projɛkt-spɛsifi k dɔkyumentri
PLA, ɔ polilaktik asid, na bayɔ-bɛs tɛmplastik we dɛn kin mek frɔm fɛmɛnt shuga we dɛn kin pul frɔm rinuɔbal fidstɔk lɛk kɔn ɔ shugaken. Yuz PLA fɔ di kad bɔdi kin ridyus di rilayns pan kɔvɛnshɔnal petrolium-bɛs PVC .
PLA kin bayɔdigrɛd ɔnda kɔntrol industrial kɔmpɔstin kɔndishɔn wit fayn ɔt, mɔstɔ, ɔksijɛn ɛn maykrobial aktiviti. Nɔ fɔ tek am se i de brok kwik kwik wan na nɔmal grɔn, kɔmpɔst na os, marin ɛnvayrɔmɛnt ɔ landfil.
RFID kad kin gɛt chip ɛn ɛntena bak ɛn i kin gɛt adeziv, ink ɔ kɔtin. PLA kad bɔdi nɔ min ɔtomɛtik wan se di kɔmplit ilɛktronik kad na 100% biodegradable. Di wan dɛn we de bay fɔ aks fɔ pruf we gɛt fɔ du wit di prɔdak bifo dɛn tɔk bɔt di envayrɔmɛnt.
Wan PLA smart kad we nɔ gɛt kɔntakt gɛt maykrochip ɛn ɛntena. We di kad go insay di ɔpreshɔn fil fɔ wan kɔmpitabl rida, di rida ɛn di chip kin kɔmyuniket wayales wan ɛn pas di kad data to di kɔnɛkt akses, aydentifikeshɔn, tikɛt ɔ mɛmbaship sistɛm.
PLA de diskraib di sabstret we de rawnd di RFID inlay; i nɔ de disayd aw di sistɛm go kɔmpit. Di chip famili, frikshɔn, protɔkɔl, mɛmori, sikyɔriti fɛnshɔn, ɛntena ɛn ɛnkɔdin fɔ mach di rida ɔ lɔk sistɛm.
Prodakt fɔmat: dɔn dɔn PLA RFID / NFC kad ɔ PLA kad-mɛkin shit.
Material: PLA kad bɔdi wit wan projɛkt-match chip ɛn ɛntena.
Dimenshɔn: standad ɔ kɔstɔmayz saiz ɛn tik.
Print: kɔstɔmayt kɔlɔ, logo, tɛks ɛn frɔnt ɛn bak art wok.
Pɔsnalayzeshɔn: ɛnkɔdin, siriɔs nɔmba, nem, barɔd ɔ QR kɔd.
Dokumɛnt: dɛn kin aks fɔ di ditel dɛn bɔt di kɔmpozishɔn ɔ ripɔt dɛn we dɛn kin yuz fɔ rivyu.
PLA de yuz rinuɔbal bayolojikal fidstɔk ɛn gi sastaynabiliti-fɔs bayer dɛn ɔda sabstret opshɔn we dɛn de riples kɔvɛnshɔnal PVC kad bɔdi dɛn.
Wit di kɔrɛkt chip ɛn ɛnkɔdin, PLA kad dɛn kin sɔpɔt ɔtel lɔk, akses kɔntrol, aydentifikeshɔn, tikɛt, mɛmbaship ɛn NFC ɛnjɔymɛnt wokflɔ.
Yu kin put logo, kɔlɔ, instrɔkshɔn ɛn sastaynabiliti mɛsej insay di kad dizayn. Enkodin ɛn vayriɔbul data kin evalyu bak fɔ ɛni prɔjek.
Ɔtel ɛn risɔt dɛn kin yuz kɔstɔmayz PLA RFID ki kad dɛn as ɔda we fɔ yuz kɔvɛnshɔnal PVC kad dɛn. Di chip ɛn di ɛnkɔdin fɔ mach wit di lɔk sistem we dɛn dɔn instɔl.
Kɔpɔt ɔfis, kampus, venyu ɛn fasiliti kin spɛsifa PLA kad bɔdi fɔ di wokman, visitɔ ɔ kɔntrakta kredibiliti.
PLA kɔntaktlɛs kad dɛn kin sɔpɔt admɛshɔn, atɛndans, mɛmbaship, lɔyalti ɛn klos-lɔp tikɛt program dɛn afta di sistɛm ɔpreshɔn dɔn gri fɔ di tɛknikal spɛsifikɛshɔn.
PLA de yuz bayɔ-bɛs fidstɔk, we kɔvɛnshɔnal PVC na jɔs fɔshal-bɛs. RFID pefomans fɔ ɔl tu di matirial dɛn dipen pan di inlay, chip, ɛntena ɛn ɛnkɔdin we dɛn pik pas di kad-bɔdi matirial.
PLA kad bɔdi dɛn kin fayn fɔ industrial kɔmpɔst we dɛn mit di kɔnstrɔkshɔn ɛn fasiliti rikwaymɛnt dɛn. Kɔmplit RFID kad dɛn stil gɛt ilɛktronik kɔmpɔnɛnt dɛn. Di matirial sɛlɛkshɔn fɔ tink bɔt savis layf, ɔt ɛksplɔshɔn, rida kɔmpatibiliti, printin, lokal dispɔzishɔn infrastukchɔ ɛn badjɛt.
Send di aplikeshɔn we yu want, di ditel dɛn fɔ di rida ɔ lɔk, di tin dɛn we yu nid fɔ gɛt di chip, di dimɛnshɔn fɔ di kad ɔ shit, di art wok, ɛnkɔdin, kwantiti, di kɔntri we dɛn de sɛn am ɛn di envayrɔmɛnt dɔkyumɛnt dɛn we yu nid. Wallis go rivyu matirial ɛn sistɛm kɔmpatibiliti bifo kot.
Apruv ɛn tɛst wan sampul fɔ artwok, dimɛnshɔn, rid pefɔmɛns, ɛnkɔdin, ɔt ɛksplɔshɔn, stɔrɔj ɛn wɛr bifo bɔlk prodakshɔn.
Aks di lokal industrial kɔmpɔstin ɔpreshɔn if i aksept di spɛshal PLA kɔnstrɔkshɔn ɛn if di RFID inlay fɔ kɔmɔt. If dɛn trit di kɔmplit kad lɛk ilɛktronik west, fala di lɔ we gɛt fɔ du wit di lokal kɔlekɛshɔn.
Nɔ tɔk bɔku tin dɛn lɛk 'dekɔmpɔz ɛnisay' ɔ '100% kɔmpɔstabl' pas nɔmɔ dɛn sɔpɔt am wit pruf fɔ di tin dɛn we dɔn dɔn. Wan mɔ prɛsis stetmɛnt na 'PLA kad bɔdi we dɛn mek fɔ industrial kɔmpɔst, we de ɔnda lokal fasiliti akseptɛns.'
Wallis de saplae kad-bez matirial ɛn kɔstɔmayz finish kad, we de alaw bayer fɔ tɔk bɔt di PLA sabstret, RFID intagreshɔn, artwok ɛn prodakshɔn rikwaymɛnt wit wan tim.
Fɔ gɛt kɔrɛkt kot, gi di prodak fɔmat, dimɛnshɔn, chip ɔ rida spɛsifikɛshɔn, artwok, ɛnkɔdin, kwantiti, dilivri kɔntri ɛn di envayrɔmɛnt dɔkyumentri we dɛn nid.
Kontakt Wallis fɔ Prayz ɛn Sampul dɛn
Na wan kɔntaktlɛs smat kad we de yuz PLA as in praymar kad-bɔdi matirial ɛn i gɛt RFID chip ɛn ɛntena.
Nɔto ɔtomɛtik wan. Di chip, ɛntena, adeziv, ink ɛn kɔtin nɔ kin bi tin we kin pwɛl. Kɔmplit-kad klem dɛn nid fɔ gɛt pruf fɔ di prɔdak.
PLA jɔs nid fɔ gɛt kɔntrol industrial kɔmpɔstin kɔndishɔn ɛn dɛn nɔ fɔ ɛkspɛkt fɔ brok kwik kwik wan na os kɔmpɔst, grɔn, marin ɛnvayrɔmɛnt ɔ landfil.
Dɛn kin kɔmpitabl we di chip, frikshɔn, protɔkɔl, ɛntena ɛn ɛnkɔdin mach di rida ɔ lɔk sistɛm.
Yɛs. Dimɛnshɔnal, kɔlɔ ɛn frɔnt-ɛn-bak artwok dɛn we dɛn kɔstɔmayz kin evalyu agens di PLA matirial, RFID inlay ɛn prodakshɔn prɔses.
Yɛs. Di wan dɛn we de mek kad kin sɛn dɛn dimɛnshɔn fɔ di shit we dɛn nid, di tik, di kɔlɔ, di we aw dɛn de print, di we aw dɛn de laminate ɛn di kwantiti fɔ mek dɛn ebul fɔ evaluate.
Gi di kad ɔ di shit fɔmat, saiz, tik, kwantiti, artwok, rida ɔ chip ditil, ɛnkɔdin, aplikeshɔn, ples fɔ dilivri ɛn di dɔkyumɛnt dɛn we dɛn nid.
