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Wallis -PLA Shit we de na di wɔl
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WALLIS kɔstɔm PLA kad shit matirial na fɔ kad manifakta dɛn, printa dɛn, RFID inlay kɔnvɔta dɛn, gift-kad saplay dɛn ɛn sastaynabiliti-fɔs kad program dɛn we de luk fɔ wan bayɔ-bɛs ɔltɛrnativ to kɔvɛnshɔnal PVC sabstret dɛn. Di opshɔn dɛn we de inklud wayt, transparent, blak ɛn kɔstɔm-kɔlɔ shit dɛn we gɛt bɔku gej fɔ print kɔr, ɔvlay, prɔmoshɔnal kad, mɛmbaship kad, ɔtel ki kad ɛn sɔm RFID kɔnstrɔkshɔn dɛn we dɛn dɔn pik.
PLA kad prodakshɔn de yuz difrɛn prɔses winda frɔm PVC, PETG ɛn polycarbonate. Printin ink, sɔfayz tritmɛnt, sheet ɔriɛnteshɔn, lamineshɔn tɛmpracha, prɛshɔn, kol, adhesive sɛlɛkshɔn, day kɔt ɛn finish-kad tɛst fɔ validet as wan sistɛm. Dɛn kin rikɔmɛnd fɔ tray fɔ du sampul bifo bɔku bɔku prodakshɔn, mɔ fɔ multilayer, RFID, magnetic-stripe ɛn long-savis-layf kad projɛkt dɛn.
'Bio-based,' 'biodegradable,' 'industrially compostable' ɛn 'risaykul' de diskrayb difrɛn envayrɔmɛnt atribyut dɛn. Ɛni klem fɔ mach di ɛksaktɔ PLA gred ɛn di kɔmplit finish-kad kɔnstrɔkshɔn. Chips, ɛntena, ink, ɔvlay, adeziv, magnɛtik strɛp ɛn kɔtin kin chenj di ɛnd-ɔf-layf rod ɛn kin mek di kad we dɔn dɔn nɔ kwalifay fɔ kɔmpɔstabiliti klem.
| Tayp fɔ Prodakt | PLA kad kor sheet, printable sheet ɛn projɛkt-spɛsifi k kad ɔvlay matirial |
| Standart Tiknɛs dɛn | 0,08mm, 0,15mm, 0,17mm, 0.20mm ɛn 0.35mm; ɔda gej dɛn we de ɔnda prodakshɔn rivyu |
| Standart Shit Sayz | 300 × 480mm ɔ kɔstɔmayz saiz akɔdin to printin ɛn kad-layout rikwaymɛnt |
| Di tin dɛn we yu kin pik fɔ gɛt kɔlɔ | Wait, klia, translucent, blak ɔ kɔstɔmayz kɔlɔ we de ɔnda MOQ ɛn fɔmyulashɔn |
| Kad Aplikeshɔn dɛn | Gift, mɛmbaship, lɔyalti, ivin, ɔtel ki, biznɛs, prɔmoshɔnal ɛn sɔm RFID kad dɛn we dɛn dɔn pik |
| B2B Savis dɛn | Sampul shit, kɔstɔm gej, printin trayal, lamineshɔn tɛst, kad-strɔkchɔ rivyu, QC spɛsifikɛshɔn ɛn ɛkspɔt saplai |
Rikwest PLA Kad Shit Sampul ɛn Kot
Polilaktik asid, we dɛn kin kɔl PLA, na tɛmplastik polyɛsta we dɛn kin mek frɔm fidstɔk dɛn we dɛn kin pul frɔm plant dɛn we dɛn kin yuz bak. Fɔ mek kad, dɛn kin chenj PLA to flat sheet dɛn we kin bi print kɔr layt, dɛkɔretiv layt, transparent layt ɔ sɔpɔt layt insay laminated kad strɔkchɔ.
Di rinuɔbal ɔrijin fɔ PLA nɔ de ɔtomɛtik garanti fɔ mek kad de te, print adheshon ɔ kɔmpɔstabiliti. Rɛsin gred, kristaliniti, aditiv, pigmɛnt, shit ɔryenteshɔn ɛn kad kɔnstrɔkshɔn de ditɛm di fayn mɛkanikal, tɛmal ɛn envayrɔmɛnt prɔpati dɛn.
Bɔku PLA prodak dɛm dɛn mek fɔ kɔntrol industrial kɔmpɔstin wit manejmɛnt ɔt, mɔstɔ ɛn aɛreshɔn. Dɛn nɔ fɔ tɔk bɔt PLA sheet se i de lɔs kwik kwik wan na say dɛn we dɛn kin trowe dɔti, ɔdinari grɔn, riva ɔ si. Di kad we dɔn dɔn fɔ asɛs as kɔmplit tin bifo dɛn yuz kɔmpɔstabiliti logo ɔ klem.
Jɛnɛral thermoforming PLA sheet nɔ kin gi di flatnɛs, surface roughness, printability ɔ lamination bihayvya we dɛn nid fɔ kad prodakshɔn. Di wan dɛn we de bay fɔ aks fɔ kad-grɛd spɛsifikɛshɔn ɛn tɛst di ɛksaktɔl sheet wit dɛn prɛs, ink, ɔvlay ɛn laminatɔ.
PLA Sheet fɔ Sastaynɛbul Kad Manufakchurin
| Paramita | Tipik Spɛsifikeshɔn / Projɛkt Rikwaymɛnt |
|---|---|
| Tin dɛn | PLA ɔ modifyed PLA kad-grɛd fɔmyulashɔn; ekzak rεsin εn aditiv pakej fכ lכk bay prodak kכd |
| Tik we i tik | 0.08, 0.15, 0.17, 0.20 ɛn 0.35mm ɔ kɔstɔmayt; tolɛreshɔn fɔ gri fɔ ɛni gej |
| Sayz fɔ di Shit | 300 × 480mm ɔ kɔstɔmayz fɔmat bays pan impɔzishɔn, prɛs bed ɛn lamineshɔn plet |
| Tensile Strɔng we pɔsin kin gɛt | Mashin dairekshɔn ≥25MPa (rɛfrɛns valyu); kɔnfɔm di tɛst we dɛn gri pan, kɔndishɔn ɛn transvas-dayrɛkshɔn rikwaymɛnt fɔ ɛni ɔda |
| Surface Roughness we di ples gɛt | 0.8–3.0μm rεfrεns rεnj; pik akɔdin to printin, ink holdout ɛn lamination rikwaymɛnt |
| Surface Finish na di wɔl | Mat, sɛmi-mat, glos, korona-trit ɔ kɔt printabl sɔfays we de sɔbjɛkt to prɔses trayal |
| Kɔlɔ | Wait, transparent, blak, kɔstɔm Pantone ɔ opasiti-kɔntrol gred we de ɔnda fɔmyulashɔn ɛn MOQ |
| Fɔ pak tin dɛn | Flat sheet wit protɛktiv film ɔ intaliv, mɔstɔ-baria pak, katon ɛn palet protɛkshɔn |
Nɔmal wan dɛn kin bil aydentifikeshɔn kad we dɔn dɔn wit bɔku layers pas wan tik tik sheet. ISO/IEC 7810 de aydentify di kɔmɔn ID-1 kad fɔmat na lɛk 85.60 × 53.98mm wit wan nominal tiknes we na 0.76mm. Di ekzak PLA layt kɔmbaynshɔn fɔ akɔn fɔ printin, adhesive, ɔvlay, chip ɔ antena tiknɛs ɛn post-lamination shrinkage.
| Layer | Tipik Fɔnkshɔn | PLA Projɛkt Kɔnsidɛreshɔn |
|---|---|---|
| Frɔnt Ɔvlay | Protɛkt print ɛn gi sɔfays finish | Kɔnfɛm bonding, klia, skrach rɛsistɛns ɛn envayrɔmɛnt-klɛm kɔmpatibiliti |
| Di Kɔr Shit we dɛn Print | I de kɛr grafik, tɛks, sikyɔriti dizayn ɛn bakgrɔn kɔlɔ | Surface tritmεnt εn ink sistεm mכs liv lamination witout kכla shift כ delamination |
| Sɛntral Kɔr | Bil tik, opasiti ɛn bɛnd stiffnɛs | Yuz balans ɔriɛnteshɔn ɛn simɛtrik kɔnstrɔkshɔn fɔ ridyus kɔl |
| RFID Inlay Layer we yu kin yuz | I gɛt chip ɛn ɛntena fɔ kɔntaktlɛs wok | Akכnt fכ inlay tiknes, antena adheshon, chip kaviti εn lamination prεshכn |
| Bak Print Shit / Ɔvlay | Gi rivays grafik ɛn sɔfayz protɛkshɔn | Balans frɔnt ɛn bak layers fɔ manej dimɛnshɔnal chenj |
Fכnt εn bak layεr dεm we nכ ikwal kin mek kכl afta dεn hεt εn kol. We i pɔsibul, yuz gej dɛn we mach, di sem kayn print kɔvarej ɛn balans ɔvlay na ɔl tu di say dɛn. Dɛn fɔ chɛk di kad dɛn we dɔn dɔn afta dɛn dɔn kondishɔn, nɔto jɔs afta dɛn dɔn lamin dɛn.
Ink, adeziv, RFID inlay, magnɛtik strɛp ɛn protɛktiv kɔtin ɔl de kɔntribyut to fayn tik. Wan nominal shit stak we totכl 0.76mm bifo laminεshכn kin nכ prodyuz wan kompliant finish kad afta kכmprεshכn εn shrinkεj.
| Printin Mɛtɔd Pɔtɛnɛshɛl | Yuz | Rikwayd Validɛshɔn |
|---|---|---|
| Ɔfset Printin we yu de print | High-volume sheets wit proses kala, Pantone ɛn sikyɔriti bakgrɔn | Ink adheshon, drying, blok, kala density en lamination resistance |
| Inkjet we gɛt UV | Shot rɔn, pɔsnalayzeshɔn, siriɔs grafik ɛn protɔtayp | Surface enaji, kur levul, fleksibiliti, odor en ovalay bonding |
| Fɔ Print na Skrin | Opaque wayt, metallic, spot kala ɛn funkshɔnal layers | Ink tiknes, solvent kompitibiliti, curing ɛn lamination bond |
| Indigo / Dijital Printin we dɛn de print | Variable data, shɔt rɔn ɛn pɔsnalayz kad program dɛn | Prayma kompitibiliti, blanket temperechur, toner adheshon en daunstrim lamination |
| Thermal / Ritransfεr Pɔsnalayzeshɔn | Finished-kad nɔmba, foto, barɔd ɛn kredibiliti | Ɔt ɛksplɔshɔn, ribin transfa, flatnɛs ɛn printa transpɔt tɛst |
Korona tritmɛnt kin rɔtin we dɛn de kip am. Baya dɛn we de yuz UV inkjet, skrin printin ɔ spɛshal kɔtin fɔ gri pan wan target dain lɛvɛl, tɛst we ɛn maksimam stɔrɔj tɛm bifo dɛn print.
Gud initial print adheshon nɔ de garanti fɔ rɛsistɛns to ɔt, prɛshɔn ɛn adhesive kɔntakt. Dɛn fɔ laminate di sheet dɛn we dɛn print, kol ɛn tɛst dɛn fɔ pul dɛn kɔmɔt bifo dɛn gri fɔ mek dɛn yuz art wok ɛn ink sistem.
PLA Kad Sheet we yu kin print
Lamination ɛn Kɔnvɔyt Trayal dɛn
PLA kin sof pan tɛmpracha we smɔl pas PVC, PETG ɔ polycarbonate kad matirial dɛn. Wan standad PVC lamination resipi kin mek shrinkage pasmak, surface marking, distortion, blok ɔ chip damej. Di kɔrɛkt saykl fɔ divɛlɔp wit di aktual layt stak ɛn di ikwipmɛnt.
Kɔndishɔn di shit dɛn: Stɔr ɛn ikwal di PLA shit dɛn, print layers ɛn inlays ɔnda kɔntrol tɛmpracha ɛn humiditi.
Kɔnfɔm ɔryenteshɔn: Kip di mashin ɛn transvas dairekshɔn kɔnsistɛns insay di stak fɔ manej shrinkage.
Start wit wan kɔnsavayv ɔt saykl: Yuz wan lɔwa-tɛmpracha trayal pas di nɔmal PVC saykl ɛn inkrisayz ɔl afta yu dɔn rivyu di bond trɛnk ɛn dimɛnshɔn.
Balans tɛmpracha, prɛshɔn ɛn dwɛl: Prɛshɔn we pasmak kin mak di sɔfa ɔ damej di RFID kɔmpɔnɛnt dɛn; if yu nɔ gɛt bɛtɛ ɛnaji i kin mek yu nɔ gɛt bɛtɛ pawa.
Kul ɔnda kɔntrol prɛshɔn: Kul de afɛkt flat, shrinkage ɛn blɔk.
Kɔndishɔn bifo yu mɛzhɔ: Chɛk di dimɛnshɔn, kɔl, adheshon ɛn kad tik afta di tɛm we dɛn gri fɔ mek yu gɛt bak.
Lɔk di apruv rɛsipɛkt: Rikɔd di kayn plet, di stak ɔriɛnteshɔn, tɛmpracha profayl, prɛshɔn, tɛm ɛn kol kɔndishɔn.
sכm kompitibl PLA layεr dεm kin tεmכl bכnd, we כda strכkchכ dεm nid fכ adhesive כ tay layεr. Di bonding sistem we dɛn dɔn pik fɔ bi evaluate fɔ di peel strength, aging, print compatibility ɛn in ifɛkt pan di envayrɔmɛnt klem.
Glos, mat ɛn tɛkstɔr plet dɛn de prodyuz difrɛn sɔfayz apinɛns ɛn rilis bihayvya. Test rilis film ɛn plet finish fɔ stik, haz, gloss vɛryushɔn ɛn tɛkstɔr transfɔm we yu nɔ want.
| Kɔnvɔyt Step | Ki Kɔntrol |
|---|---|
| Sheet Gilotine Kɔt we dɛn de kɔt | Shap bled, sɔpɔt stak, lɔw ɔt bild-ap ɛn dimɛnshɔnal akkuracy |
| Kad we dɛn de panch | Tul kliarens, tɛmpracha, kad ɔriɛnteshɔn ɛn absɛns ɔf kɔna krak |
| Slot ɛn Ɔl Panch | Edj waytin, notch sɛnsitiviti, ol pozishɔn ɛn hang-lɔd rɛsistɛns |
| Chip Kaviti Milling we dɛn kin yuz | Kכt spid, hεt, dכst rεmov, cavity dip εn adhesive bonding |
| Edj Inspekshɔn we dɛn de du | Bur, delamination, krak, waytin, shap ɛn layt rɛjista |
PLA kad shit kin evalyu fɔ kɔntaktlɛs kad, bɔt di shit na jɔs wan pat pan di sistɛm. Di ɛntena, chip, inlay sabstret, adhesive ɛn lamination saykl fɔ de ilɛktrik ɛn mɛkanikal stebul ɔlsay na di kad prodakshɔn ɛn savis.
| Smart Kad Rikwaymɛnt | Valideshɔn Aytem |
|---|---|
| RFID Frikyuɛnsi ɛn Chip | Kɔnfɛm rida sistɛm, chip famili, mɛmori, protɔkɔl ɛn ɛnkɔdin rikwaymɛnt bifo yu bil sɛmpul dɛn |
| Antena Jɔmɛtri | Mek shɔ se di kad ed, di chip pozishɔn ɛn di layout we dɛn de kɔt nɔ pwɛl di ɛntena |
| Inlay Bonding we dɛn kin yuz | Chek adhesive kompitibiliti, ɔt rɛsistɛns, voids ɛn lɔng tɛm delamination |
| Rid Pɔfɔmɛnshɔn | Test rid distans, oriɛnteshɔn, kad stak intafɛreshɔn ɛn lɔk/rida kɔmpatibiliti |
| Envayrɔmɛnt Klɛm | Nɔ tɔk bɔt ilɛktronik kad se i kin ful-ɔp wit kɔmpɔst pas nɔmɔ dɛn gɛt sɛtifiket fɔ di kɔmplit tin |
| Aplikeshɔn | Prodakt Fokus | Kritikal Tɛst |
|---|---|---|
| Gift ɛn Loyalty Kad dɛn | Ay-kwaliti printin, barɔd, magnɛtik strɛp ɔ RFID opshɔn dɛn | Printa kɔmpatibiliti, walet yus, bɛnd ɛn ɛkspɛkt program layf |
| Hotel Ki Kad dɛn | Short-yuz RFID kad wit branded grafik ɛn lɔk-sistim kɔmpatibiliti | Chip maching, ɛnkɔdin, rida ɔpreshɔn, humiditi ɛn ripit hanlin |
| Ivint ɛn Vizita Kad dɛn | Shot-tɛm akses, branding, slot panch ɛn vayriɔbul data | Lanyard lod, print durabiliti ɛn ivent dispɔzishɔn rod |
| Membaship Kad dɛn | Print ɛn pɔsnalayz kad fɔ klab, jim ɛn rital program dɛn | Savis-layf ɛkspɛkteshɔn, abrashɔn, bɛnd ɛn kad-printa transpɔt |
| Biznɛs ɛn Prɔmoshɔnal Kad dɛn | Premium vijual finish, transparency, spɛshal kɔlɔ ɛn shɔt-rɔn pɔsnalayzeshɔn | Print adheshon, skrat resistans, edj kwaliti ɛn stɔrɔj flatnɛs |
| RFID Akses Kad dɛn | Kontaktlɛs kad kɔnstrɔkshɔn wit mach inlay ɛn lɔw-tɛmpracha laminɛshɔn | Ilɛktrik pefɔmɛns, fleks, delamination ɛn rida kɔmpatibiliti |
Gift, Mɛmbaship ɛn Prɔmoshɔnal Kad dɛn
Finish PLA Kad Program dɛn
| Matirial | Strɔng | Ki Limiteshɔn |
|---|---|---|
| PLA we dɛn kɔl PLA | Bayo-bɛs pɔtɛnɛshɔn, difrɛn sastaynabiliti stori ɛn industrial-kɔmpɔstabiliti pɔtɛnɛshɔn fɔ sɛtifiket strɔkchɔ dɛn | Lɔwa ɔt rɛsistɛns, prɔses sɛnsitiviti, britlɛs risk ɛn limited kɔlɛkshɔn infrastukchɔ |
| PVC we dɛn kin yuz | Establish low-cost kad proses, brayt printin ɛn lamination no | Fossil-based, chlorine-containing ɛn limited risaykul insay bɔku kad program dɛn |
| PETG we dɛn kɔl PETG | Gud lamination, toughness, transparency ɛn kad-manufakchurin famili | Nɔto kɔmpɔstabl ɛn dispɔzishɔn dipen pan lokal risaykul sistɛm |
| Polikabɔnɛt we dɛn kɔl | High durability, ɔt resistans ɛn suitability fɔ laser engraving | Ay kɔst ɛn difrɛn sastaynabiliti/ɛnd-ɔf-layf prɔfayl |
| PVC we dɛn dɔn risaykul / RPETG | Ridyus di vayjin-plastik dimand we i de kip di famili kad prɔsesin | Risaykul kɔntinyu, kɔlɔ, kɔnsistɛns ɛn risaykulbiliti nid pruf |
PLA nɔto ɔtomɛtik di bɛst matirial fɔ ɛvri kredibiliti. Short-layf ɔtel, visitɔ, ivent, gift ɛn prɔmoshɔnal kad kin bi strɔng kandidet. Gɔvmɛnt ID dɛn we de liv lɔng, pemɛnt kad, ay-tɛmpracha kredibiliti ɛn kad dɛn we nid fɔ gɛt laser engraving kin nid PETG, polycarbonate ɔ ɔda validated kɔnstrɔkshɔn.
| Klɛm | Kɔrɛkt B2B Intɛpriteshɔn |
|---|---|
| Bayo-Bayz we dɛn mek | Rifer to rinuɔbal kabon kɔntinyu ɛn dɛn fɔ sɔpɔt am bay matirial dɔkyumentri ɔ tɛst |
| Indastrial Kɔmpɔstabl | I nid fɔ gɛt sɛtifiket fɔ kɔntrol munisipaliti ɔ industrial aerobik kɔmpɔstin kɔndishɔn dɛn |
| Ɔm Kɔmpɔstabl | I nid fɔ gɛt sɛpret sɛtifiket we de na os-kɔmpɔst; industrial sɛtifikeshɔn nɔ go du fɔ am |
| Bayodegradabl | Nɔ kɔmplit if yu nɔ gɛt di tɛst ɛnvayrɔmɛnt, di we aw dɛn de du am ɛn di tɛm we dɛn yuz am |
| Dɛn kin yuz am bak | Teknikli posibul insay wan dediket PLA strim, bɔt kad dɛn nɔ de aksept bɔku bɔku wan insay standad PET ɔ miks-plastik risaykul |
| Kɔmplit Kad Klɛm | Di chip, ɛntena, ink, kɔtin, adeziv ɛn magnɛtik strɛp fɔ de insay di asɛsmɛnt |
PLA shit sɛtifiket nɔ go ebul fɔ sɔpɔt ɔtomɛtik wan klem fɔ RFID kad, magnɛtik-strayp kad ɔ kɔt kad we dɛn print. Ilɛktronik ɛn mɛtal kɔmpɔnɛnt dɛn kin nid fɔ pul, spɛshal risaykul ɔ difrɛn we fɔ trowe dɛn.
Bɔku industrial kɔmpɔstin fasiliti dɛn nɔ de aksept rigid bayɔplastik kad. Dispɔzishɔn wɔd fɔ sho di aktual kɔlɛkshɔn sistɛm na di target makit pas wan tiori matirial prɔpati.
| Tɛst Ɛria | Ɛvalueshɔn |
|---|---|
| Dimenshɔn ɛn Tiknɛs | Lɛngth, wit, kɔna rayus, tik ɛn tolɛreshɔn afta kondishɔn |
| Warpage ɛn Flatnɛs | Imɛdiet ɛn ol kɔl na kɔntrol tɛmpracha ɛn humiditi |
| Layer Adhesion we de na di wɔl | Pil, ed delamination, ɔt ol, humidity ol ɛn fleks |
| Bɛnd ɛn Tɔshɔn | Ripit fleks, torshכn, krak fכmeshכn εn pεrmanεnt difכmeshכn |
| Hɛt ɛn Dimɛnshɔnal Stebiliti | Stɔrej na wam ɛnvayrɔmɛnt, printa ɔt ɛksplɔshɔn ɛn post-laminɛshɔn shrinkage |
| Print Durability fɔ lɔng tɛm | Rɔb, skrach, kemikal kɔntakt, UV ɛksplɔshɔn ɛn ɔvlay adheshon |
| Kad Pɔsnalayzeshɔn | Dairekt-to-kad, ritransfa, tɛmal transfɔm, ɛmbos ɛn ɛnkɔdin trayal dɛn as i apɔynt |
| RFID / Magnɛtik Fɔnkshɔn | Rid/rayt, lɔk kɔmpatibiliti, ɛntena intɛgriti ɛn strɛp ɛnkɔdin afta prodakshɔn |
| Inspekshɔn Aytem | Kwaliti Kɔntrol |
|---|---|
| Tiknɛs Profayl | Avrej gej, pɔynt-to-pɔynt vɛryushɔn ɛn lɔt-to-lɔt tolɛreshɔn |
| Dimenshɔn dɛn fɔ di Sheet | Lɛngth, wit, skwea, edj kwaliti ɛn kɔt tolɛreshɔn |
| Flatness ɛn Curl | Sheet bow, edj lift ɛn dairekshɔn fɔ kɔl afta kondishɔn |
| Kɔlɔ ɛn Opasiti | L*, a*, b*, waytnɛs, opasiti, glos ɛn vijual aprɔv standad |
| Kwaliti fɔ di Surface | Raf, tritmɛnt lɛvɛl, skrach, blak spat, jel, kɔntaminɛshɔn ɛn protɛktiv-film kwaliti |
| Mekanikal Prɔpati dɛn | Tensile, elongation, stiffness, impact ɛn brittleness akɔdin to di we dɛn we dɛn gri |
| Lamineshɔn Trayal | Bonding, shrinkage, haze, blok, print stebiliti ɛn plet rilis |
| Traceability we pɔsin kin tray fɔ no | Gret, batch, extrusion de, oriɛnteshɔn, tritmɛnt de, inspekshɔn ripɔt ɛn sɛtifiket rɛfrɛns |
PLA sheet kin sɛnsitiv to ɔt, humidity ɛn fɔ kip am fɔ lɔng tɛm. Poor storage kin chenj flatness, surface treatment, printability ɛn lamination bihayvya. Dɛn fɔ gri wit di tin dɛn we dɛn nid fɔ kip fɔ di rayt gred ɛn di we aw dɛn pak am.
Stɔr sheet dɛn we dɛn dɔn sidɔm na say we kol, dray ɛn klin we fɔ kip tin dɛn we nɔ gɛt dairekt san ɛn hita.
Kip di sheet dɛn flat pan palet dɛn we dɛn sɔpɔt ɛn avɔyd fɔ prɛs di stak pasmak.
Protɛkt di say dɛn we yu de si frɔm dɔst, ɔyl, finga prɛnt, skrach ɛn mɔstɔ.
Kɔndishɔn matirial na di printin ɔ lamination rum bifo yu prosɛs.
Yuz mɔstɔ-baria wrap, kɔna protɛkshɔn ɛn riinfɔs ɛkspɔt katɔn.
Aplay fɔs-in, fɔs-ɔut invɛntari ɛn richɛk di sɔfa tritmɛnt afta yu dɔn kip am fɔ lɔng tɛm.
Kad-indastri fɔs: Dɛn kin rivyu di tik we di shit tik, di sɔfa, di printin ɛn di layt strɔkchɔ rawnd di rial kad-prɔdakshɔn rikwaymɛnt dɛn.
Kastom gej ɛn saiz: Dɛn kin tɔk bɔt standad 0.08–0.35mm opshɔn ɛn kɔstɔmayz shit fɔmat.
Printin ɛn lamineshɔn trayal: Dɛn kin evalyu sampul fɔ ɔfset, UV inkjet, skrin, dijital printin ɛn lɔw-tɛmpracha laminɛshɔn.
RFID projɛkt sɔpɔt: Dɛn kin rivyu di shit strɔkchɔ dɛn wit inlay tiknɛs, chip pozishɔn, ɛntena ɛn rida kɔmpitibliti.
Rispɔnsibul envayrɔmɛnt klem: Dɛn kin mach di matirial dɔkyumentri to di aktual finish-kad kɔnstrɔkshɔn ɛn makit.
Factory-direct B2B supply: I fayn fɔ kad manifakta, kɔnvɔta, printa, RFID kɔmni, impɔt ɛn distribyushɔn.
Finish kad aplikeshɔn, ɛkspɛkt savis layf ɛn dɛstineshɔn makɛt.
PLA layt we yu nid: printabl kor, senta kor, transparent layt ɔ ɔvlay.
Tik, tolɛreshɔn, sheet saiz, gren/oriɛnteshɔn ɛn kwantiti.
Wait, transparent, blak ɔ kɔstɔm kɔlɔ ɛn opasiti target.
Ɔfset, UV inkjet, skrin, Indigo ɔ ɔda printin prɔses ɛn ink sistem.
Lamination mashin, kɔrɛnt matirial, tɛmpracha profayl, prɛshɔn ɛn plet tayp.
Finished kad saiz, tiknes ɛn rikwayd ISO ɔ kɔstɔma spɛsifikɛshɔn.
RFID chip, antena, inlay tiknes, magnɛtik strɛp ɔ kɔntakt-chip rikwaymɛnt.
Kɔmpostabiliti, bayɔ-bɛs kɔntinyu, REACH, RoHS ɔ ɔda dɔkyumɛnt rikwaymɛnt dɛn.
Sampul kwantiti, ɛni ia fɔkɔs, dɛstineshɔn pɔt ɛn rikwest delivri schedule.
Tɔk bɔt Yu PLA Kad Matirial Projɛkt
Nɔto fɔ se na so i bi. Fɔ mek kad nid fɔ kɔntrol flatnɛs, sɔfays rɔf, kɔlɔ, print adheshon, tiknɛs tolɛreshɔn ɛn laminɛshɔn bihayvya. Rikwest wan gred we dɛn dɔn tɛst fɔ mek dɛn mek kad.
Di standad tiknes we de inklud 0.08, 0.15, 0.17, 0.20 ɛn 0.35mm. Customized gejs kin rivyu akɔdin to sheet extrusion, layt strɔkchɔ ɛn MOQ.
Yɛs. Wan standad shit saiz na 300 × 480mm, ɛn dɛn kin tɔk bɔt kɔstɔmayt fɔmat dɛn akɔdin to prɛs layout, kad impɔzishɔn ɛn lamineshɔn ikwipmɛnt.
PLA sheet kin evalyu fɔ ID-1 kad, bɔt di finish 85.60 × 53.98mm kad ɛn nominal 0.76mm tiknɛs fɔ ajɔst afta dɛn print, lamination, kol ɛn panch.
Dɛn kin ebul fɔ evalyu ɔfset printin wit fayn sɔfayz tritmɛnt ɛn ink. Di wan dɛn we de bay fɔ tɛst ink adheshon, drying, blok, kala density ɛn resistans to di lamination saykl.
Di rayt gred dɛn we dɛn dɔn trit ɔ we dɛn kɔt kin kɔmpit. Sɔfayz ɛnaji, ink kia, fleksibiliti, ɔda ɛn ɔvlay bonding fɔ tɛst pan di printa we dɛn want.
Di ikwipmɛnt kin yuz, bɔt dɛn nɔ fɔ tek di nɔmal PVC rɛsipɛkt. PLA jɔs nid fɔ gɛt lɔwa ɛn tek tɛm kɔntrol ɔt saykl wit validet prɛshɔn, dwɛl ɛn kol.
Di kɔmɔn tin dɛn we kin mek i apin na we di kad kin wam pasmak, layers nɔ balans, di sheet ɔriɛnteshɔn we nɔ kin kɔrɛkt, di we aw dɛn kin print di tin dɛn we nɔ ivin, we di kad nɔ kin kol fayn ɛn we dɛn kin mɛzhɔ di kad bifo i dɔn ful-ɔp.
Yɛs, i go bi se dɛn go gɛt prɔblɛm dɛn. Inlay tiknɛs, ɛntena dizayn, adeziv, chip ples, lamination prɛshɔn ɛn rida kɔmpatibiliti fɔ de insay di kad strɔkchɔ.
Dɛn kin tink bɔt PLA fɔ shɔt-yuz ɔtel ki kad dɛn we dɛn validet di chip, lɔk sistɛm, printin, humidity ɛksplɔshɔn ɛn ripit hanlin bifo dɛn prodyuz.
Pɔfɔmɛnshɔn dipen pan gred ɛn kɔnstrɔkshɔn. PLA kin fayn fɔ sɔm shɔt ɛn midul layf kad dɛn we dɛn dɔn pik, bɔt dɛn nɔ fɔ tek am se i go mach PVC, PETG ɔ PC insay ɔt rɛsistɛns, impak ɔ lɔng tɛm fleks.
Standard PLA kad sheet nɔto ɔtomɛtik wan fayn fɔ sikyuɔr laser engraving. Laser-makɛbl fɔmyulashɔn, kɔntrast, ɔt rispɔns ɛn kad durabiliti nid dediket divɛlɔpmɛnt ɛn tɛst.
Dat klem de dipen pan di envayrɔmɛnt we gɛt sɛtifiket ɛn di kɔmplit kɔnstrɔkshɔn. Plɛn PLA shit kin bi kɔmpɔstabl na industri, we ink, adeziv, chip, ɛntena, strɛp ɔ kɔtin kin chenj di kad we dɔn dɔn in stetɔs.
Na we di ɛksaktɔl kad we dɔn dɔn gɛt sɛpret sɛtifiket fɔ mek dɛn yuz am na os. Industrial-compost certification nɔ de sɔpɔt ɔtomɛtik wan hom-compost klem.
PLA εn PET na difrεn polimכr dεm εn dεn nכ fכ miks dεm nכmal wan. PLA risaykul nid fɔ gɛt wan dediket kɔlɛkshɔn strim, we nɔ de ɔlsay fɔ kad.
Wi kin tɔk bɔt wayt, klia, blak, translucent ɛn kɔstɔm kɔlɔ dɛn. Kɔlɔ masterbatch kin afɛkt print, lamination, mɛkanikal pefɔmɛns ɛn sɛtifikeshɔn skɔp.
Stɔr sial, flat ɛn dray na westɛm we dɛn kin kɔntrol fa frɔm san layt ɛn ɔt. Protɛkt di say we de ɔp frɔm dɔst, ɔyl, skrat ɛn mɔstɔ, ɛn kɔndishɔn sheet dɛn bifo yu print.
Yɛs. Sampul sheet dɛn fɔ print, lamin, kol, panch ɛn pɔsnalayz yuz di prodakshɔn prɔses we dɛn bin want bifo dɛn gri fɔ di matirial spɛsifikɛshɔn.
MOQ dipen pan tik, sheet saiz, kɔlɔ, sɔfa tritmɛnt, kɔtin, pak ɛn if di prɔjek de yuz wan kad-grɛd fɔmyulashɔn we dɔn de.
Gi di kad aplikeshɔn, layt tayp, tik, saiz, kɔlɔ, printin we, lamination prɔses, RFID ɔ strɛp rikwaymɛnt, sɛtifikeshɔn, kwantiti ɛn dɛstineshɔn.
Kɔntakt WALLIS Plastik fɔ kɔstɔm PLA kad kɔr shit, printabl shit ɛn kad-layer matirial fɔ gift, lɔyalti, ɔtel ki, ivin, prɔmoshɔnal ɛn sɛlɛkɛt RFID kad program dɛn. Wi tim de sɔpɔt gej sɛlɛkshɔn, printin ɛn laminɛshɔn trayal, kad-strɔkchɔ rivyu, envayrɔmɛnt dɔkyumentri, kwaliti spɛsifikɛshɔn ɛn faktri-dayrɛkt B2B saplai.
