Inlay/ Prelam
Wallis
| Boholo: | |
|---|---|
| Ho ba teng: | |
| Bongata: | |
Lipampiri tsa rona tsa 13.56MHz HF Chip PVC Inlay Prelam Sheets ke karolo ea mantlha e sebetsang bakeng sa likarete tse bohlale tse se nang mabitso, likarete tsa ID, likarete tsa taolo ea phihlello, likarete tsa litho le likarete tsa lipalangoang. Letlapa le leng le le leng le kopanya li-antenna tsa boleng bo holimo tsa HF le chip (mohlala, Fudan F08, Mifare Classic, Ultralight, DESFire, NTAG, ICode), e kentsoeng ka har'a PVC e tšoarellang 'me e loketse ho lamination ea ho qetela, khatiso le ho seha ka CR80 kapa liforomo tse tloaelehileng.
Ka ts'ehetso e felletseng ea sebopeho, boholo, botenya, mofuta oa chip, le moralo oa antenna, maqephe ana a inlay a prelam a fana ka ts'ebetso e tšepahalang, chai e ngata, 'me e tsamaellana hantle le mela e tloaelehileng ea tlhahiso ea likarete.
| Ntho | Lintlha tsa |
|---|---|
| Boholo ba Leqephe & Libopeho | 2×5 (A4), 3×7, 3×8, 4×8 / 5×5 / 4×10, moralo oa tloaelo / CR80 karete |
| Botenya (pele ho laminate) | HF e tloaelehileng: ~ 0.45 ± 0.02 mm; tloaelo botenya fumaneha |
| Boitsebiso ba Motheo | PVC ea boemo bo holimo (e tšoeu / e hlakileng), PETG / PC ea boikhethelo |
| Chip & Frequency | HF 13.56 MHz: Fudan F08, Mifare Classic S50/4K, Ultralight, DESFire, NTAG, ICode, joalo-joalo (ISO14443A, ISO15693 e lumellana) |
| Antenna / Coil | Foil ea koporo, foil ea aluminium, aluminium e entsoeng; meralo ea li-coil tse tloaelehileng e tšehelitsoe |
| Bokaholimo / Qetella | Blank (ha ho na khatiso) - e loketse ho lamination ka tlas'a koahelo (matte, gloss, frosted, joalo-joalo) |
| Lisebelisoa | Taolo ea phihlello, likarete tsa ID, likarete tse bohlale, lipalangoang, likarete tsa litho |
| Litšebeletso tsa Custom & OEM | Tloaelo e felletseng: sebopeho, boholo, botenya, chip, antenna, khatiso, sephutheloana |
Likarete tsa polasetiki tse se nang mabitso (botho, botšepehi, likarete tsa linotlolo tsa hotele, taolo ea phihlello)
Smart ID / Likarete tsa Phihlello (sekolo, ofisi, boikoetliso, sepetlele)
NFC / HF Contactless Cards bakeng sa tefo, lipalangoang, boitsebiso, mananeo a botšepehi
E lumellana le mela e tloaelehileng ea tlhahiso ea likarete - khatiso, lamination, cutting

100% Taolo ea Boleng ba Tlhahlobo e Felletseng - Letlapa le leng le le leng le hlahlojoa bakeng sa botšepehi ba li-coil, ho kenngoa ha chip, ho tsoela pele ha antenna, le mamello ea botenya.
Tloaelo e Felletseng le Meralo e Khethehileng - Sebopeho sa tloaelo, boholo, botenya, chip, antenna, li-inlay tse nyalisitsoeng (HF + LF/UHF).
Tsebo ea Fektheri - Boiphihlelo bo tebileng ba lisebelisoa tsa karete ea PVC bo tiisa ts'ebetso e tsitsitseng le ho lumellana ho phahameng ho lamination.
Flexible Chip Options - Fudan F08, Mifare Classic, Ultralight, DESFire, NTAG, ICode, le tse ling.
Bongata bo Thekoang Litšenyehelo le Phatlalatso ea OEM - Litheko tse tobileng fekthering tse nang le ts'ehetso ea li-prototype le liodara tse ngata.
Tšehetso e Tšepahalang ea Packaging & Theknoloji - Ho paka ka mokhoa o sireletsehileng, ho tsamaisoa ka potlako, le tšehetso ea ka mor'a thekiso ea lamination / RF-tuning.

Re tšehetsa LF, HF (13.56 MHz: Fudan F08, Mifare Classic, Ultralight, DESFire, NTAG, ICode, joalo-joalo), le UHF. Li-chips tse tloahelehileng ka kopo.
Ee - re fana ka tloaelo e felletseng: boholo ba leqephe, sebopeho, mofuta oa coil, khetho ea chip, botenya, jj.
E se nang letho ebile e entsoe ka prelaminated - e itokiselitse ho lamination, ho hatisa le ho itšeha.
E, tlhahlobo e felletseng ea 100%: Letlapa le leng le le leng le hlahlobiloe bakeng sa botšepehi ba chip / coil, ho tsamaisana, ho mamella botenya le bofokoli.
Ee - liodara tse ngata le li-run-batch tse nyane / prototype lia tšehetsoa.
Nako ea ho etella pele e ipapisitse le molumo le ho itloaetsa - liodara tse tloaelehileng hangata li romeloa ka mor'a libeke. Lipampiri li phuthetsoe ka mokhoa o sireletsehileng ho thibela tšenyo.
Qala Morero oa Hao le Rona