|
Inlay/ Prelam
Wallis
| Boholo: | |
|---|---|
| Bongata: | |
Wallis 13.56MHz HF RFID PVC prelam inlay sheets e entsoe e le motheo oa ts'ebetso bakeng sa likarete tse bohlale tse se nang contactless, likarete tsa ID, likarete tsa phihlello, likarete tsa linotlolo tsa hotele, likarete tsa litho, likarete tsa lipalangoang le mananeo a likarete a lumelletsoeng ke NFC. Letlapa le leng le le leng le kopanya chip e khethiloeng ea HF le antenna ka har'a sebopeho se laoloang sa PVC, se lokiselitsoeng ho qetela karete-'mele lamination, khatiso, punching le botho.
Merero ea B2B e ka etsoa ka mokhoa oa chip, protocol, memori, geometry ea antenna, boholo ba leqephe, sebopeho sa karete, botenya ba inlay, boemo ba chip, thepa, kaho ea karete ea ho qetela le ho paka. Litšupiso tse tloaelehileng tsa sebopeho li kenyelletsa 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 le 4 × 10, ka mekhoa e tloaelehileng ea likarete tse ngata tse fumanehang bakeng sa lipoleiti tse khethehileng tsa lamination le lisebelisoa tsa ho phunya.
Malapa a li-Chip ha a tlameha ho hlophisoa tlas'a tleleime e le 'ngoe ea ho lumellana hohle. Lihlahisoa tsa MIFARE Classic, MIFARE Ultralight, NTAG le MIFARE DESFire li sebetsa tikolohong ea ISO/IEC 14443 Mofuta oa A, ha lihlahisoa tsa ICODE ka tloaelo li thehiloe ho ISO/IEC 15693. The chip e nepahetseng, 'mali, software ea kopo le tlhokahalo ea ts'ireletso li lokela ho netefatsoa pele ho tokiso ea li-antenna le tlhahiso ea bongata.
| Mofuta oa Sehlahisoa | 13.56MHz HF RFID lakane e se nang mabitso e kentsoeng pele bakeng sa tlhahiso ea likarete tsa polasetiki |
| Khafetsa | 13.56MHz HF; protocol le sebopeho sa moea li ipapisitse le chip e khethiloeng |
| Mekhoa e Tloaelehileng | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 le mekhoa e tloaelehileng |
| Tšupiso ea Botenya ba Leqephe la Hona joale | Hoo e ka bang 0.45 ± 0.02mm bakeng sa mehaho e khethiloeng ea HF; netefatsa ka chip, antenna, thepa le karete ea ho qetela ea karete |
| Lisebelisoa tsa Motheo | PVC e tšoeu kapa e bonaletsang; PETG le diporojeke tse di tsamaelanang le polycarbonate di laolwa ke netefatso e e kgaoganeng ya thulaganyo |
| Likhetho tsa Antenna | terata ea koporo e kentsoeng, aluminium e kentsoeng le meaho e ikhethileng ea li-antenna |
| Litšebeletso tsa B2B | Tlhophiso ea chip, moralo oa li-antenna, tokiso ea RF, boenjiniere ba sebopeho, lisampole, liteko tsa lamination, tlhahlobo ea motlakase, litlaleho tsa QC le phepelo ea kantle ho naha. |
Kopa HF RFID Inlay Samples le Quote
Prelam inlay ke leqephe la mahareng la tlhahiso ea likarete le nang le chip ea RFID, khokahano ea chip-to-antenna le sebopeho se hlophisitsoeng sa lenakana ka har'a likarolo tsa polasetiki. Hangata ha se karete e phethiloeng e ka hatisoang. Baetsi ba likarete ba kopanya prelam le lipampiri tsa mantlha tse hatisitsoeng le li-overlays tse pepeneneng, ebe li laminate, tse pholileng, li otla le ho iketsetsa likarete tse felileng.
Antenna e fumana matla ho tsoa tšimong ea 'mali' me e fetisetsa data pakeng tsa 'mali le chip e kentsoeng. Ts'ebetso ea RF e ipapisitse le geometry ea antenna, khanyetso ea conductor, bokhoni ba chip, resonance, lisebelisoa tsa karete, tšepe e haufi, botenya ba karete ea ho qetela le matla a lebala la 'mali.
Lipampiri tsa mantlha tsa PVC tse hatisitsoeng, likoahelo tse pepeneneng, likhomaretsi, likhoele tsa makenete, liphanele tsa ho saena le liphetho tse sireletsang li eketsa botenya ho potoloha prelam. Botenya ba karete bo phethiloeng bo tlameha ho reroa ho tsoa ho stack e felletseng ho fapana le ho tloha ho prelam gauge feela.
Ho fetola lelapa la chip, boholo ba antenna, conductor, thepa ea karete kapa tikoloho ea karete ho ka fetola molumo oa molumo le ho fetola ts'ebetso ea ho bala. Moralo o amohetsoeng bakeng sa chip e le 'ngoe ha oa lokela ho sebelisoa hape bakeng sa chip e 'ngoe ntle le tekanyo ea RF.
E kenyellelitsoeng HF Chip le Sebopeho sa Antenna
Multi-Card Sheet Layout for Lamination
Chip e lokela ho khethoa ho tsoa ho protocol ea 'mali, tlhoko ea mohopolo, boemo ba ts'ireletso, lebelo la transaction, lifecycle, certification le software ecosystem. Mabitso a marang-rang a kang MIFARE, NTAG le ICODE ke malapa a lihlahisoa ho e-na le mantsoe a tloaelehileng.
| Chip Family / Option | Protocol Positioning | Tloaelehileng Project Fit | Keletso ea Bohlokoa ea B2B |
|---|---|---|---|
| Fudan F08 / Lefa le Lumellanang 1K Khetho | Hangata e kopuoa bakeng sa litsamaiso tse lumellanang tsa ISO/IEC 14443 Mofuta oa A; nomoro ea karolo e nepahetseng e tlameha ho netefatsoa | Phihlello ea lefa, ho ba setho le merero e ncha ea sebali se kentsoeng | Netefatsa moetsi, memori, UID, netefatso, tšebelisano ea 'mali le tlhaloso ea lebitso la molao |
| MIFARE Classic EV1 1K / 4K | ISO/IEC 14443-3 Mofuta oa A, 106kbit/s | Lipalangoang tse teng, litekete, phihlello le lisebelisoa tsa lipapali | Lelapa la sehlahisoa sa lefa; sebelisa feela moo sistimi e kentsoeng e e hlokang 'me u hlahlobe mokhoa o mong oa sejoale-joale o sireletsehileng bakeng sa meralo e mecha |
| MIFARE Ultralight EV1 | ISO/IEC 14443 Mofuta oa A tikoloho | Litekete tsa tšebeliso e fokolang, liketsahalo, botšepehi le mananeo a bonolo a se nang mabitso | Bapisa memori, phasewete le likarolo tsa mantlha le mofuta oa ts'okelo ea ts'ebeliso |
| NTAG 213 / 215 / 216 | NFC Forum Type 2 Tag le ISO/IEC 14443 Mofuta oa A | Likarete tsa khoebo tsa NFC, likhokahano tsa netefatso, puisano ea mehala le lihlahisoa tse hokahaneng | Mehopolo ea mosebelisi e fapana ka mohlala; netefatsa boholo ba NDEF, password le litlhoko tsa mantlha |
| MIFARE DESFRE EV3 | ISO/IEC 14443 Likarolo tsa 1-4 tsa mofuta oa A tse nang le lits'ebetso tse sireletsehileng tsa lera le phahameng | Sireletsehile ho fihlella, lipalangoang, khamphase, boitsebiso, botšepehi le likarete tsa lisebelisoa tse ngata | E hloka taolo ea bohlokoa, ho iketsetsa motho ka mong ts'ebeliso le ho kopanya 'mali / software |
| ICODE SLIX2 / ISO 15693 Lelapa | ISO/IEC 15693, NFC Forum Mofuta oa 5 boemo ba maemo | Karete ea tikoloho, laeborari, thepa, boitsebahatso le merero e hokahanyang nako e telele | Ha e fetoloe le babali ba ISO/IEC 14443 Mofuta oa A; netefatsa protocol ea 'mali le boholo ba antenna |
Maemo a mangata a se nang mabitso a sebetsa ho 13.56MHz. 'Mali a ka tšehetsa ISO/IEC 14443 Mofuta oa A, Mofuta oa B, ISO/IEC 15693, mefuta ea tag ea Foramo ea NFC kapa lera la kopo ea mong'a ntlo. Maqhubu a le mong ha a lekana ho fana ka tumello ea ho lumellana.
Ho banka, ho lefa, boitsebiso ba 'muso le merero e laoloang ea lipalangoang e ka hloka li-chips tse netefalitsoeng, ente ea senotlolo e sireletsehileng, tlhahiso e hlahlobiloeng, tumello ea moralo le tlhahlobo ea kopo. HF e kenyellelitsoeng ka kakaretso ha ea lokela ho rekisoa e le e loketseng ho lefa ntle le mangolo a hlokahalang.
| Parameter | Available Direction | Production Control |
|---|---|---|
| 2 × 5 Moralo | Prototype ea mofuta oa A4 le tlhahiso ea likarete tse nyane tsa molumo | Netefatsa litekanyo tse nepahetseng tsa leqephe, palo ea karete le matšoao a ngoliso |
| 3 × 7 / 3 × 8 | Mehaho e tloaelehileng ea likarete tse bohlale tsa indasteri | Bapisa lipoleiti tsa lamination, sesebelisoa sa ho phunya, li-cores tse hatisitsoeng le tataiso ea ho kopanya |
| 4 × 8 / 4 × 10 / 5 × 5 | Mehaho ea lihlahisoa tse phahameng le lisebelisoa tse khethehileng tsa bareki | Laola tšebelisano ea RF lipakeng tsa li-antenna tse haufi le deformation ea lakane |
| Sebopeho se Tloaelehileng | Litekanyo tsa likarete tse tloahelehileng, li-fobs tsa linotlolo, likarete tse nyane kapa lifomate tse khethehileng tsa ho phunya | Fana ka setšoantšo sa CAD, kemiso ea sehlahisoa se felileng, boemo ba chip, sebaka sa antenna le tumello ea ho seha |
| Prelam Thickness | Tšupiso ea leqephe la hajoale e ka bang 0.45 ± 0.02mm; meaho e tloaelehileng e fumanehang | Netefatsa karolelano, phapang ea lintlha, sebaka sa chip-bump le lipalo tsa karete ea ho qetela |
| Lintho tse bonahalang | PVC e tšoeu, PVC e pepeneneng le PETG kapa meaho e tsamaellanang le PC. | Netefatsa shrinkage, tlamahano, mocheso, tokiso ea RF le ho tšoarella ha karete e felileng |
Karete e tloaelehileng ea CR80/ID-1 hangata e entsoe haufi le 0.76mm, empa mamello e nepahetseng e ipapisitse le lintlha tsa karete le lisebelisoa. Li-cores tse hatisitsoeng, likoahelo tse ka pele le tse ka morao, likhomaretsi le botenya ba chip ea lehae li tlameha ho kenyelletsoa palong.
Letlapa le ka ba ka har'a tekanyo ea mamello ea tekanyo ha sebaka sa chip se tenya sebakeng sa heno. Moralo oa li-cavity, cushioning, khatello ea khatiso le khetho ea lera e lokela ho thibela maqhubu a bonahalang, bonding bo fokolang le tšenyo ea chip.
| Antenna Factor | Effect ka Card | e Hlokehang Tiisetso |
|---|---|---|
| Coil Geometry | E laola inductance, sebaka sa ho kopanya le sebaka se fumanehang sa ho itšeha | Bapisa bokhoni ba chip, boholo ba likarete, 'mali le tikoloho eo u e batlang |
| Antenna ea Copper Wire | E ts'ehetsa meralo ea li-coil e kentsoeng le geometry e bonolo | Botebo ba terata, botebo ba ho kenya, crossover, bond joint and continuity |
| Antenna ea Aluminium e kentsoeng | E ts'ehetsa tlhahiso ea li-antenna tse nang le sebopeho se phahameng haholo | Lekola bophara, ho hanyetsa, ts'ireletso ea kutu, sehokelo sa chip le boits'oaro ba lamination |
| Chip Capacitance | E fetola molumo oa potoloho ea antenna/chip | Fetola ha u fetola lelapa la chip kapa sephutheloana |
| Sekhahla sa karete | Plastiki, enke, foil, lits'oants'o tse entsoeng ka tšepe le likoahelo li ka fetola ho kopanya le ho hlakola antenna. | Lekola karete e phethiloeng, eseng feela prelam e se nang letho |
| Sebelisa Tikoloho | Libaka tsa tšepe, lifono, li-wallet, likarete tse haufi le metsi li ka ama ts'ebetso | Lekola 'mali ea reriloeng, boemo bo ntseng bo eketseha le ho sebetsana le basebelisi |
Sebaka sa ho bala se itšetlehile ka chip, sebaka sa antenna, ntlha ea boleng, matla a ho bala, antenna ea ho bala, protocol, mokhoa oa karete, pokello ea karete ea ho qetela le tikoloho. Khopolo e lokela ho hlakisa sebali sa teko le sebaka sa ho feta/ho hloleha ho e-na le ho sebelisa nomoro e le 'ngoe e akaretsang.
Li-antenna tse leqepheng la likarete tse ngata li hloka sebaka se lekaneng ho tloha ho mela e sehang, masoba a ngoliso le libaka tsa boahelani. Liteko tsa RF tsa boemo ba leqephe li lokela ho ikarabella bakeng sa ho kopana lipakeng tsa manakana pele likarete li thunngoa.
| Layer | Function | Key Control |
|---|---|---|
| Sekoahelo se ka Pele | E sireletsa litšoantšo tse hatisitsoeng 'me e fana ka gloss, matte, frosted kapa qetello ea tšireletso | Botenya, tlamahano, abrasion le botho bo lumellana |
| Front Printed Core | E na le litšoantšo tse tsitsitseng, mongolo, letšoao le khatiso ea tšireletso | Ngoliso ea khatiso, pheko ea enke, shrinkage le litlamorao tse sireletsehileng tsa tšepe tsa RF |
| HF Prelam Inlay | E na le chip, antenna, manonyeletso a motlakase le likarolo tsa polasetiki tse tšehetsang | Tokiso ea RF, boemo ba chip, botenya, tekano, bond le tlhahiso ea motlakase |
| Back Printed Core | E leka-lekanya karolo e ka pele 'me e jara litšoantšo tse ka morao | Tekanyo ea likhakanyo, boemo ba mothapo oa makenete le tšireletso ea khatiso |
| Koahelo e ka Morao | E sireletsa mesebetsi ea bonono 'me e ka kenyelletsa mela, phanele ea ho saena kapa karolo ea ts'ireletso | Bonding, flatness, encoding le ho qetela bokaholimo |
Li-foil tse kholo tsa tšepe, li-inks tse tsamaisang kapa likarolo tsa tšepe tse haufi le antenna li ka fokotsa ho kopanya kapa ho fetola tokiso. Kenyelletsa lisebelisoa tsa ho qetela tsa mekhabiso litekong tsa RF le ho boloka libaka tse hlakileng moo ho hlokahalang.
Li-gauge tse ka pele le tse ka morao, tataiso ea thepa le khaso ea khatiso li lokela ho leka-lekana moo ho khonehang. Li-asymmetrical stacks li ka hlahisa li-curl tsa karete ka mor'a ho futhumatsa le ho pholile.
Netefatsa stack e amohetsoeng: Rekota sekoaelo se seng le se seng, mantlha e hatisitsoeng, inlay, sekhomaretsi, mela le lera la tšireletso.
Beha maqephe ohle: Tsitsisa thepa tikolohong ea tlhahiso 'me u e boloke e hloekile, e bataletse ebile e omme.
Netefatsa maemo: Match sheet sheet, bophahamo ba karete, boemo ba chip, boemo ba antenna, mosebetsi oa bonono le matšoao a ho phunya.
Ntlafatsa potoloho ea lamination: Theha mocheso, khatello, ho lula, ho qeta poleiti, lakane ea ho lokolla le ho pholisa bakeng sa stack e nepahetseng.
Sireletsa chip zone: Laola khatello ea lehae 'me u qobe likaroloana tse thata, bofokoli ba poleiti kapa phallo e feteletseng ea thepa ho potoloha IC.
Ho pholile tlas'a khatello e laoloang: Pholiso e susumetsa ho bata, ho khomarela lera, khatello ea chip le botsitso ba sebopeho.
Teko pele o phunya: Lekola ts'ebetso ea motlakase ea boemo ba leqephe, chebahalo, botenya, tlamahano le ngoliso.
Likarete tse phethiloeng ho etsa liteko: Puta, etsa motho ka mong 'me u netefatse ts'ebetso ea RF, litekanyo, ho kobeha le tšebelisano ea ts'ebeliso.
| Lamination Kotsi | E ka Etsahalang Sesosa | Tataiso e Lokisoang |
|---|---|---|
| Ho hloleha ha Chip | Mocheso o feteletseng, khatello ea lehae, tšenyo ea electrostatic kapa khokahanyo e fokolang ea chip | Lekola meeli ea sephutheloana sa chip, khatello ea ts'ebetso, taolo ea ESD le boleng ba khokahano |
| Bula Antenna Circuit | Mokhanni ea robehileng, lenonyeletso le fokolang, tšenyo ea ho itšeha kapa ho otlolla ho feteletseng | Hlahloba tsoelo-pele, tsela ea conductor, ho phunya clearance le khatello ea mochine |
| Range e fokolang ea ho bala | Detuning, tahlehelo ea conductor, ho se lumellane ha 'mali, litšoantšo tse entsoeng ka tšepe kapa phetoho ea karete ea karete | Lekanya resonance le retune o sebelisa karete e tlatsitsoeng le sebali sa sepheo |
| E Bonahalang Chip Bump | Matšeliso a sa lekaneng, botenya bo feteletseng ba module kapa khatello e sa lekaneng | Ntlafatsa li-cavities tsa lehae, li-layer gauges, cushioning le maemo a ho hatella |
| Delamination | Tšilafalo, thepa e sa lumellaneng, mocheso o fokolang kapa ho futhumala ho fokolang | Hlahloba tšebelisano ea thepa, bohloeki, potoloho le ts'ebetso ea peel |
| Leqephe kapa karete ea Warpage | Stack e sa leka-lekaneng, ho futhumala ho feteletseng, khatello e sa lekaneng kapa ho pholisa ho sa laoleheng ka potlako | Leka-lekanya likarolo le ho ntlafatsa ho futhumatsa, ho bata ha poleiti le ho bata |
| Ntho ea Tlhahlobo | e khothalelitsoeng Taolo ea B2B |
|---|---|
| Chip Identity | Netefatsa moetsi, nomoro ea karolo e nepahetseng, memori, khetho ea UID, protocol le traceability ea lotho |
| Mosebetsi oa Motlakase | Bala chip UID, memori kapa taelo e hlalositsoeng e behiloeng sebakeng se seng le se seng sa karete ho latela moralo oa tlhahlobo |
| Antenna Continuity | Fumana li-circuits tse bulehileng, lifupi, manonyeletso a fokolang, liphoso tsa conductor le li-crossovers tse senyehileng |
| Resonance / RF Performance | Lekanya paramethara ea RF e lumellanoeng kapa sebaka se sebetsang sa ho bala u sebelisa lisebelisoa tse hlalositsoeng tsa tlhahlobo |
| Boemo ba Chip le Antenna | Lekola boemo khahlano le CAD, kemiso ea karete, punch clearance le li-antenna tsa boahelani |
| Litekanyo tsa Leqephe | Bolelele, bophara, squareness, bophahamo ba karete, masoba a ngoliso le boleng bo holimo |
| Botenya le Bophahamo | Karolelano ea botenya, botenya ba sebaka sa chip-zone, curl, bow le phapang ea ntlha-to-point |
| Tlhahlobo ea Pono | Tšilafalo, lipululana, masoebe, matheba a matšo, ho pepeseha ha conductor, mengoapo le likoli. |
| Tlhahlobo ea Karete e Feletseng | Ts'ebetso ea RF, boholo, botenya, ho kobeha, torsion, mocheso, mongobo, lekhapetla le ho lumellana ha 'mali |
| Traceability | Chip lot, antenna lot, PVC lot, letsatsi la tlhahiso, moralo, lenaneo la liteko, nomoro ea lakane le rekoto ea ho paka |
Tlhahlobo e felletseng e ka bua ka tlhahlobo ea ho bala motlakase sebakeng se seng le se seng, athe liteko tsa boholo, peel le tse senyang hangata li nkuoa lisampole. Litlhaloso tsa theko li lokela ho hlalosa lintho tsa tlhahlobo, sebopeho, litekanyetso tsa kamohelo, moralo oa sampole le tlaleho.
Prelam e ka fetisa tlhahlobo ea motlakase mme e ntse e hloleha ka mor'a mocheso o feteletseng, khatello, ho otla kapa ho iketsetsa motho. Litšoaneleho tsa B2B li lokela ho kenyelletsa ts'ebetso ea likarete tse kenang le tse felileng.
| Application | Chip / Protocol Direction | Netefatso ea Bohlokoa |
|---|---|---|
| Likarete tsa Basebetsi le Phihlello | Mofuta oa Lefa oa A, MIFARE Plus kapa DESFire ho latela sistimi e kentsoeng ea phihlello | Tšebelisano ea 'mali, taolo ea bohlokoa, ho ingolisa le ho feto-fetoha ha letsatsi le letsatsi |
| Likarete tsa Key Hotel | Chip e hlokoa ke sethala sa senotlolo sa hotele | Lock encoder, sistimi ea taolo ea baeti, botenya ba likarete le ho pepeseha ha mongobo |
| Likarete tsa Lipalangoang le tsa Khamphase | Sireletsa chip ea lisebelisoa tse ngata joalo ka DESFire moo meralo ea sistimi e e hlokang | Lebelo la transaction, tšireletseho, boemo ba 'mali, ho iketsetsa motho le bophelo |
| Likarete tsa Botho le Botšepehi | Tlanya chip ea memori ea A, NTAG kapa chip e sireletsehileng ea ts'ebeliso ho latela moralo oa lenaneo | Tšebeliso ea 'mali kapa mohala, database, lekunutu le tšebeliso e pheta-phetoang |
| Likarete tsa Khoebo le Lipapatso tsa NFC | NTAG kapa chip e 'ngoe e lumellanang le Foramo ea NFC | Bokhoni ba NDEF, tšebeliso ea mohala, ts'ireletso ea URL le boemo ba scan |
| Likarete tsa Laeborari, Matlotlo le Libaka | ISO/IEC 15693 / ICODE-mofuta oa tharollo | Protocol ea 'mali, boholo ba li-antenna, sebaka sa sepheo, ho thibela ho thulana le litlhoko tsa EAS |
| Secure Identity and Payment Projects | Chip e netefalitsoeng e netefalitsoeng le moralo oa kopo o amohetsoeng | Setifikeiti, ente ea bohlokoa, ketane ea phepelo e hlahlobiloeng le tumello e khethehileng ea morero |
Likopo tsa HF RFID Inlay bakeng sa Mananeo a Smart Card
| Data / Tšireletso Ntho | e Hlokahalang B2B |
|---|---|
| UID | Netefatsa bolelele ba UID, boits'oaro bo tsitsitseng kapa bo sa reroang ba ID, sebopeho sa database le tšehetso ea 'mali |
| Khoutu ea Memori | Hlalosa sebopeho sa data, likarolo/lifaele/maqephe, rekoto ea NDEF, linotlolo le netefatso |
| Linotlolo tsa netefatso | Hlalosa botho ba bohlokoa, ts'ebetso ea ente, ts'ireletso ea lipalangoang, mefuta-futa le tsela ea tlhahlobo |
| Phasewete / Tlhophiso ya phihlello | Hlalosa li-password, li-bits, li-counters, licheke tsa ho qala le tlhahlobo ea lock-state moo e tšehetsoeng |
| Lintlha tse hatisitsoeng tse feto-fetohang | Kopanya nomoro e hatisitsoeng, barcode kapa khoutu ea QR ho chip data ka poelano e laoloang |
| Likarete tse Hanoang | Arola, bala le ho senya likarete ka mokhoa o sireletsehileng tse nang le linotlolo tse phelang, li-identifiers kapa data e kentsoeng |
Sistimi e fanang ka phihlello feela ho tsoa ho sekhetho se baloang phatlalatsa e ka ba tlokotsing ea ho kopitsoa kapa ho etsisoa. Merero e tsotellang ts'ireletso e lokela ho sebelisa meralo ea chip le backend e ts'ehetsang netefatso e nepahetseng ea li-cryptographic.
Ho fana ka chip e sireletsehileng ha ho kenyelletse ho seta ha sesebelisoa kapa taolo ea linotlolo ka bo eona. Hlalosa hore na ke mang ea etsang, a bolokang, a lata le ho netefatsa linotlolo, le hore na ho hlokahala tikoloho e hlahlobiloeng e sireletsehileng ea ho iketsetsa motho.
Karete e bohlale e nyalisitsoeng e ka kopanya HF le LF, UHF, chip ea puisano kapa sesebelisoa se seng sa HF. Mehaho ena e hloka sebaka se eketsehileng, karohano e hlokolosi ea li-antenna, taolo e eketsehileng ea botenya ea lehae le lenaneo le inehetseng la lamination le tlhahlobo.
| Hybrid Structure | Sebelisa Case | Engineering Kotsi |
|---|---|---|
| LF + HF | Ho falla ho tloha ho phihlello e haufi ea lefa ho lisebelisoa tsa likarete tse bohlale tsa HF | Sebaka sa li-antenna, tšebelisano-'moho, botenya ba likarete le tlhahlobo ea libali tse peli |
| HF + UHF | Boitsebahatso ba nako e khuts'oane hammoho le ho latedisa nako e telele | Sistimi e fapaneng ea li-antenna, litlamorao tsa thepa le kutlo ea UHF haufi le 'mele kapa tšepe |
| Li-chips tse peli tsa HF | Arola lits'ebetso kapa libaka tse fanang ka boikemelo | Khetho ea 'mali, ho kopanya manakana, ho ba beng ba data le litšitiso tsa sebopeho sa likarete |
| Ikopanye + Ha u ikopanye | Identity e sireletsehileng ea li-Dual-interface, telecom kapa meralo ea ho lefa | Module cavity, kgokelo ya antenna, lamination, certification le personalization |
HF prelam e tloaelehileng ea maqhubu a le mong ha ea lokela ho hlalosoa e le e tšehetsang LF kapa UHF ka bo eona. Meaho e nang le maqhubu a mangata e hloka setšoantšo sa eona, lenane la li-chip, liteko tsa RF, litlhaloso tsa botenya le theko.
Boloka maqephe a prelam a bataletse ka har'a sephutheloana se tiisitsoeng, se hloekileng le se omeletseng hole le khanya ea letsatsi le mocheso.
Sebelisa liboto tse thata, mabokose a kenelletseng le a sirelelitsoeng ho thibela ho kobeha, mengoapo le khatello ea chip-zone.
Qoba ho tsoa ka matla ka motlakase 'me u sebelise li-control tse nepahetseng tsa ESD moo ho hlokahalang.
Se ke oa beha meroalo e boima e sa lekaneng holim'a stack ea lakane kapa ua lumella pallet overhang.
Lintho tse nang le maemo ka kamoreng ea lamination pele li sebetsa ha maemo a polokelo le tlhahiso a fapana.
Hlalosa pakete e 'ngoe le e' ngoe ka mohlala oa chip, moralo oa antenna, sebopeho, botenya, beche le boemo ba tlhahlobo.
Sebelisa lintho tsa pele, tse tsoang pele, 'me u boele u hlahlobe ka mor'a ho boloka nako e telele kapa ho pepesehela lipalangoang.
E Sirelelitsoeng Flat Packing bakeng sa HF RFID Prelam Sheets
Tlhahiso e ka tšeptjoang ea prelam e hloka ho kenngoa kapa ho kenngoa ha li-antenna tse laoloang, sephutheloana sa chip, ngoliso ea lakane, polasetiki ea polasetiki, tlhahlobo ea motlakase, tlhahlobo ea mahlakore, ho ts'oaroa ka mokhoa o hloekileng le traceability ea batch. Chip e amohetsoeng, setšoantšo sa antenna le mokhoa oa tlhahlobo oa RF li lokela ho lula li tsitsitse bakeng sa ho pheta-pheta litaelo ntle le haeba ho lumellanoe ka phetoho e laoloang.
RFID Inlay Project le Team Technical
Prelam Inlay Production Workshop
Taolo ea Ts'ebetso ea Antenna le Inlay
Tlhahlobo ea Motlakase le ea Dimensional
Khetho ea chip e thehiloeng ho kopo: Phihlello ea lefa, NFC, ts'ebeliso e sireletsehileng ea lisebelisoa tse ngata le merero ea ISO 15693 e ka aroloa ka protocol le tlhoko ea ts'ireletso.
Boenjiniere ba li-antenna tse tloahelehileng: Geometry ea li-coil, conductor, chip capacitance, kemiso ea karete le sebali sa sepheo se ka hlahlojoa hammoho.
Mehaho ea maqephe a feto-fetohang: Litokisetso tse tloaelehileng tsa likarete tse ngata le likarete tse ikhethileng tsa bareki lia fumaneha.
Khokahano ea lisebelisoa tsa karete: PVC prelam e ka hokahanngoa le li-cores tse hatisitsoeng, li-overlays, likhoele tsa makenete le meaho ea likarete tse felileng.
Ts'ehetso ea litšoaneleho: lisampole, liteko tsa lamination, liteko tsa RF, licheke tsa botenya le netefatso ea karete e felileng li fokotsa kotsi ea projeke.
Phepelo ea B2B e tobileng fekthering: E loketse lifeme tsa likarete tse bohlale, liprinta, li-converter, li kopanyang tsamaiso, ba fanang ka thepa, ba tsoang kantle ho naha le ba aba.
Kopo, mofuta oa sebali / mohlala, protocol le sethala sa software se kentsoeng.
Ehlile moetsi oa chip le karolo ea nomoro, memori, UID le litlhoko tsa ts'ireletso.
Sebopeho sa maqephe, boholo ba litekanyo, bophahamo ba karete, matšoao a ngoliso le bongata.
Boholo ba karete, sebaka se hlakileng sa antenna, boemo ba chip le setšoantšo sa ho phunya.
Lisebelisoa tsa Prelam, 'mala, botenya ba lebitso le mamello.
Theknoloji ea antenna, resonance ea sepheo kapa tlhahlobo e sebetsang ea ho bala.
Pokello ea karete ea ho qetela, li-cores tse hatisitsoeng, li-overlays, khatiso ea tšepe, linepe kapa li-signature panel.
Lamination press, mocheso, khatello, bolulo, pholileng le litekanyo tsa poleiti.
Teko ea motlakase, tlhahlobo ea RF, tlhahlobo ea boholo le mekhoa ea ho amohela.
Encoding, ente ea bohlokoa, lenane la UID, data e fapaneng kapa poelano ea database.
Bongata ba prototype, ponelopele ea selemo, kemiso ea ho pheta-pheta le litlhoko tsa taolo ea phetoho.
Ho paka, litokomane tsa tlhahlobo, boema-kepe boo u eang ho bona le letsatsi la thomello le batloang.
Buisanang ka morero oa hau oa HF RFID Inlay
Ke letlapa la mantlha la tlhahiso ea likarete le nang le chip ea 13.56MHz le antenna ka har'a likarolo tsa polasetiki. E entsoe ka laminated ka li-cores tse hatisitsoeng le li-overlays ho hlahisa likarete tse se nang mabitso tse felileng.
Che. Prelam ke lera le sebetsang hantle. Likarete tse phethiloeng li hloka khatiso e eketsehileng, likoahelo, lamination, cooling, punching le boikhethelo ba motho kapa khouto.
Merero e ka sebelisa ISO/IEC 14443 Mofuta oa A, Mofuta oa B, ISO/IEC 15693 kapa lichipisi tse lumellanang le NFC Forum. Protocol e nepahetseng e itšetlehile ka IC e khethiloeng le tsamaiso ea 'mali.
Che. Ke malapa a fapaneng a lihlahisoa a nang le liprothokholo tse fapaneng, mohopolo, litaelo, ts'ireletso le lits'ebetso. Netefatsa chip le sebali hantle pele o reka.
Likhetho tse joalo tse lumellanang le 1K li ka buisanoa. Fana ka litlhoko tse nepahetseng tsa chip le sampole ea 'mali, hobane moetsi, UID, memori le tšebelisano' moho li tlameha ho netefatsoa.
E ntse e sebetsa bakeng sa litsamaiso tse kentsoeng tsa lefa, empa merero ea sejoale-joale e sireletsehileng e lokela ho lekola mekhoa e meng ea hajoale e kang MIFARE DESFire kapa MIFARE Plus ho latela meralo ea sistimi.
NTAG 213, 215 kapa 216 le li-chips tse ling tsa NFC Forum ke likhetho tse tloaelehileng. Khetha mofuta ho tsoa mohopolong o hlokahalang oa NDEF, tšebelisano ea mohala le likarolo tsa ts'ireletso.
Chip e sireletsehileng ea lisebelisoa tse ngata tse kang MIFARE DESFire e ka 'na ea e-ba e loketseng, empa tšehetso ea babali, tsamaiso ea senotlolo, setifikeiti, lifaele tsa kopo le software li tlameha ho netefatsoa.
ISO/IEC 15693 e sebelisoa bakeng sa lits'ebetso tsa likarete tsa tikoloho moo 'mali, boholo ba li-antenna le sebaka se hokahaneng sa sepheo se fapaneng le lits'ebetso tsa likarete tse haufi tse thehiloeng ho ISO/IEC 14443.
Mekhoa e tloaelehileng e kenyelletsa 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 le 4 × 10
Leqephe la hajoale la sehlahisoa le supa hoo e ka bang 0.45 ± 0.02mm bakeng sa meaho e khethiloeng ea HF. Botenya ba ho qetela bo ipapisitse le chip, antenna, thepa, stack ea karete le litlhoko tsa lehae tsa chip-zone.
Ee. Fana ka botenya ba karete e phethiloeng, ho koaheloa le li-gauge tsa mantlha tse hatisitsoeng, sephutheloana sa chip le ts'ebetso ea lamination e le hore stack e felletseng e ka baloa.
Ee. Antenna geometry e ka ntlafatsoa ho potoloha matla a chip, boholo ba karete, 'mali, ts'ebetso ea sepheo, boemo ba chip le libaka tsa ho seha.
Ho ka buisanoa ka likhetho tse kentsoeng tsa mohala oa koporo le etched-aluminium. Kaho e ntle ka ho fetisisa e ipapisitse le molumo, ho hanyetsa, botenya, bonding, moralo oa karete le sepheo sa RF.
Ha ho na sebaka sa bokahohleng. E ipapisitse le chip, antenna, sebali, pokello ea likarete, sebopeho le tikoloho. Hlalosa sebali sa liteko le sebaka se tlase sa tšebetso.
E ka sebelisoa ka mor'a tlhahlobo ea RF. Foil e kholo ea tšepe kapa enke ea conductive haufi le lenakana e ka theola kapa ea sireletsa sebopeho se se nang mabitso.
Mehaho e meng ea thepa e ka hlahlojoa, empa ho honyela, ho tlamahanngoa, mocheso oa lamination, tokiso ea RF le ho tšoarella ha karete e felileng li tlameha ho netefatsoa ka thoko.
Hangata prelam e fanoa e le setsi se se nang letho se sebetsang. Khatiso e atisa ho sebelisoa maqepheng a arohaneng a mantlha, leha ho ka buisanoa ka meaho e ikhethileng ea morero.
Ha ho maemo a akaretsang a lokelang ho phatlalatsoa bakeng sa sebopeho se seng le se seng. Ntlafatsa mocheso, khatello, ho lula le ho pholisa ho pota-pota PVC e nepahetseng, sekoahelo, enke, kaho ea chip le antenna.
Sebelisa sephutheloana sa chip se lumellanang, botenya bo laoloang ba lehae, lipoleiti tse hloekileng, khatello e leka-lekaneng, potoloho e lumelletsoeng ea mocheso le tlhahlobo ea motlakase pele le ka mor'a ho lamination.
Teko e felletseng ea motlakase e ka hlalosoa. Tumellano ea ho reka e lokela ho hlalosa hore na ke litaelo life tse hlahlojoang sebakeng se seng le se seng le hore na ke liteko life tse senyang kapa tse nyenyane tse sebelisang sampole.
Ho bala UID, khouto ea memori, ho ngola NDEF kapa ho iketsetsa motho ka mong ho ka buisanoa. Litšebeletso tsa senotlolo se sireletsehileng li hloka lintlha tse laoloang ka thoko.
Meetso ea Hybrid e ka ntlafatsoa joalo ka lihlahisoa tse arohaneng. Li hloka meralo e inehetseng ea li-antenna, moralo oa botenya, liteko tsa 'mali le litheko.
Ee. Mokhoa o ratoang ke ho leka prelam, ho laminate karete e felletseng, likarete tsa punch le ho netefatsa ts'ebetso ea RF, ea mochini le ea motho ka mong.
MOQ e ipapisitse le ho fumaneha ha chip, lisebelisoa tsa antenna tse tloahelehileng, sebopeho, thepa, botenya, lenaneo la tlhahlobo, khouto le hore na moralo o amohetsoeng o ka sebelisoa.
Fana ka chip e nepahetseng, 'mali, protocol, moralo, boholo ba leqephe, setšoantšo sa karete, botenya, sepheo sa antenna, pokello ea karete ea ho qetela, liteko, bongata, ho paka le moo u eang teng.
Ikopanye le Wallis Plastic bakeng sa 13.56MHz HF RFID PVC prelam inlay sheets bakeng sa phihlello, ID, hotele, botho, lipalangoang, NFC le tlhahiso ea likarete tse bohlale. Sehlopha sa rona se ts'ehetsa khetho ea chip, moralo oa li-antenna, sebopeho sa lakane, tokiso ea RF, liteko tsa lamination, tlhahlobo ea motlakase, khouto, litlhaloso tsa boleng le phepelo ea B2B e tobileng fekthering.
