Custom 13.56MHz HF RFID PVC Prelam Inlay Sheets
Wallis 13.56MHz HF RFID PVC prelam inlay sheets are engineered as the functional core for contactless smart cards, ID cards, access cards, hotel key cards, membership cards, transport cards and NFC-enabled card programs. Each sheet integrates a selected HF chip and antenna inside a controlled PVC structure, ready for final card-body lamination, printing, punching and personalization.
B2B projects can be customized by chip model, protocol, memory, antenna geometry, sheet size, card layout, inlay thickness, chip position, material, final card construction and packaging. Standard layout references include 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 and 4 × 10, with custom multi-card layouts available for specific lamination plates and punching equipment.
Chip families must not be grouped under one universal compatibility claim. MIFARE Classic, MIFARE Ultralight, NTAG and MIFARE DESFire products operate in ISO/IEC 14443 Type A environments, while ICODE products are typically based on ISO/IEC 15693. The exact chip, reader, application software and security requirement should be confirmed before antenna tuning and bulk production.
| Product Type | 13.56MHz HF RFID contactless prelaminated inlay sheet for plastic-card manufacturing |
| Frequency | 13.56MHz HF; protocol and air interface depend on the selected chip |
| Standard Layouts | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 and custom layouts |
| Current Page Thickness Reference | Approximately 0.45 ± 0.02mm for selected HF structures; confirm by chip, antenna, material and final card stack |
| Base Materials | White or transparent PVC; PETG and polycarbonate-compatible projects subject to separate process validation |
| Antenna Options | Embedded copper wire, etched aluminum and project-specific antenna constructions |
| B2B Services | Chip sourcing, antenna design, RF tuning, layout engineering, samples, lamination trials, electrical testing, QC reports and export supply |
Request HF RFID Inlay Samples and Quote
What Is a 13.56MHz HF RFID Prelam Inlay Sheet?
A prelam inlay is an intermediate card-manufacturing sheet containing the RFID chip, chip-to-antenna connection and tuned antenna structure inside plastic layers. It is not normally the finished printable card. Card manufacturers combine the prelam with printed core sheets and transparent overlays, then laminate, cool, punch and personalize the finished cards.
The Inlay Provides the Contactless Function
The antenna receives energy from the reader field and transfers data between the reader and the embedded chip. RF performance depends on antenna geometry, conductor resistance, chip capacitance, resonance, card materials, nearby metal, final card thickness and reader field strength.
The Prelam Is Only One Layer of the Finished Card
Printed PVC core sheets, transparent overlays, adhesives, magnetic stripes, signature panels and protective finishes add thickness around the prelam. The target finished card thickness must be planned from the complete stack rather than from the prelam gauge alone.
Chip and Antenna Must Be Designed as a Matched System
Changing the chip family, antenna size, conductor, card material or card environment can shift resonance and alter read performance. A design approved for one chip should not automatically be reused for another chip without RF measurement.
![13.56MHz HF RFID PVC prelam inlay sheet with embedded chip and antenna for smart cards]( "13.56MHz HF RFID PVC Prelam Inlay Sheet")
Embedded HF Chip and Antenna Structure
![HF RFID smart card prelam sheet for access ID membership hotel and NFC card production]( "HF RFID Smart Card Prelam Sheet")
Multi-Card Sheet Layout for Lamination
HF Chip and Protocol Selection
The chip should be selected from the reader protocol, memory requirement, security level, transaction speed, lifecycle, certification and software ecosystem. Brand names such as MIFARE, NTAG and ICODE are product families rather than interchangeable generic terms.
| Chip Family / Option | Protocol Positioning | Typical Project Fit | Important B2B Note |
| Fudan F08 / Compatible Legacy 1K Option | Commonly requested for ISO/IEC 14443 Type A compatible systems; exact part number must be confirmed | Legacy access, membership and installed-reader replacement projects | Confirm manufacturer, memory, UID, authentication, reader compatibility and legal brand description |
| MIFARE Classic EV1 1K / 4K | ISO/IEC 14443-3 Type A, 106kbit/s | Existing transport, ticketing, access and gaming infrastructures | Legacy product family; use only where the installed system requires it and evaluate a modern secure alternative for new designs |
| MIFARE Ultralight EV1 | ISO/IEC 14443 Type A environment | Limited-use tickets, events, loyalty and simple contactless programs | Match memory, password and originality features to the application threat model |
| NTAG 213 / 215 / 216 | NFC Forum Type 2 Tag and ISO/IEC 14443 Type A | NFC business cards, authentication links, mobile engagement and connected products | User memory differs by model; confirm NDEF size, password and originality requirements |
| MIFARE DESFire EV3 | ISO/IEC 14443 Type A parts 1–4 with higher-layer secure applications | Secure access, transport, campus, identity, loyalty and multi-application cards | Requires key management, application personalization and reader/software integration |
| ICODE SLIX2 / ISO 15693 Family | ISO/IEC 15693, NFC Forum Type 5 positioning | Vicinity-card, library, asset, identification and longer-coupling-distance projects | Not interchangeable with ISO/IEC 14443 Type A readers; confirm reader protocol and antenna size |
“13.56MHz” Does Not Define the Protocol
Multiple contactless standards operate at 13.56MHz. The reader may support ISO/IEC 14443 Type A, Type B, ISO/IEC 15693, NFC Forum tag types or a proprietary application layer. Frequency alone is not enough to approve compatibility.
Payment and Regulated Cards Require More Than a Compatible Chip
Banking, payment, government identity and regulated transit projects may require certified chips, secure key injection, audited manufacturing, scheme approval and application testing. A generic HF inlay should not be marketed as payment-ready without the required qualification.
Sheet Layout, Size and Thickness Options
| Parameter | Available Direction | Production Control |
| 2 × 5 Layout | A4-type prototype and smaller-volume card production | Confirm exact sheet dimensions, card pitch and registration marks |
| 3 × 7 / 3 × 8 | Common industrial smart-card sheet layouts | Match lamination plates, punching tool, printed cores and collation direction |
| 4 × 8 / 4 × 10 / 5 × 5 | Higher-output layouts and customer-specific equipment | Control RF interaction between adjacent antennas and sheet deformation |
| Custom Layout | Custom card dimensions, key fobs, mini cards or special punching formats | Provide CAD drawing, finished-product outline, chip position, antenna zone and cutting clearance |
| Prelam Thickness | Current page reference approximately 0.45 ± 0.02mm; custom structures available | Confirm average, point variation, chip-bump zone and final-card stack calculation |
| Material | White PVC, transparent PVC and project-specific PETG or PC-compatible structures | Validate shrinkage, bonding, heat, RF tuning and finished-card durability |
Finished Card Thickness Must Be Calculated Separately
A common CR80/ID-1 card is normally designed near 0.76mm, but the exact tolerance depends on the card and equipment specification. Printed cores, front and back overlays, adhesives and local chip thickness must be included in the calculation.
Chip Bump and Antenna Crossovers Affect Local Thickness
The sheet may be within average gauge tolerance while the chip zone is locally thicker. Cavity design, cushioning, press pressure and layer selection should prevent visible bumps, weak bonding and chip damage.
Antenna Technology and RF Tuning
| Antenna Factor | Effect on the Card | Required Validation |
| Coil Geometry | Controls inductance, coupling area and available cutting clearance | Match chip capacitance, card dimensions, reader and target environment |
| Copper Wire Antenna | Supports embedded coil designs and flexible geometry | Wire diameter, embedding depth, crossover, bond joint and continuity |
| Etched Aluminum Antenna | Supports high-volume patterned antenna production | Trace width, resistance, corrosion protection, chip attachment and lamination behavior |
| Chip Capacitance | Changes the resonance of the antenna/chip circuit | Retune when changing chip family or package |
| Card Stack | Plastic, ink, foil, metalized graphics and overlays can change coupling and detune the antenna | Test the completed card, not only the bare prelam |
| Use Environment | Metal surfaces, phones, wallets, nearby cards and liquids can affect performance | Evaluate the intended reader, mounting condition and user handling |
Read Range Is Not a Fixed Inlay Specification
Read distance depends on the chip, antenna area, quality factor, reader power, reader antenna, protocol, card orientation, final card stack and environment. The quotation should specify a test reader and pass/fail distance rather than use one universal number.
Adjacent Card Positions Must Not Damage Each Other
Antennas on a multi-card sheet require sufficient spacing from cutting lines, registration holes and neighboring positions. Sheet-level RF tests should account for coupling between antennas before the cards are punched.
Smart Card Layer Structure
| Layer | Function | Key Control |
| Front Overlay | Protects printed graphics and provides gloss, matte, frosted or security finish | Thickness, bonding, abrasion and personalization compatibility |
| Front Printed Core | Carries fixed graphics, text, logo and security printing | Print registration, ink cure, shrinkage and RF-safe metallic effects |
| HF Prelam Inlay | Contains the chip, antenna, electrical joints and supporting plastic layers | RF tuning, chip position, thickness, alignment, bond and electrical yield |
| Back Printed Core | Balances the front layer and carries reverse-side artwork | Gauge balance, magnetic-stripe position and print coverage |
| Back Overlay | Protects artwork and can include stripe, signature panel or security feature | Bonding, flatness, encoding and final surface |
Metallic Printing Can Affect Contactless Performance
Large metalized foils, conductive inks or metallic layers near the antenna can reduce coupling or shift tuning. Include final decorative materials in RF tests and maintain clear zones where required.
Balanced Layers Improve Flatness
Front and back layer gauges, material direction and print coverage should be balanced where possible. Asymmetrical stacks can produce card curl after heating and cooling.
HF RFID Prelam Lamination Process
Confirm the approved stack: Record every overlay, printed core, inlay, adhesive, stripe and security layer.
Condition all sheets: Stabilize materials in the production environment and keep them clean, flat and dry.
Verify orientation: Match sheet direction, card pitch, chip position, antenna position, artwork and punching marks.
Develop the lamination cycle: Establish heat, pressure, dwell, plate finish, release sheet and cooling for the exact material stack.
Protect the chip zone: Control local pressure and avoid hard particles, plate defects or excessive material flow around the IC.
Cool under controlled pressure: Cooling influences flatness, layer adhesion, chip stress and dimensional stability.
Test before punching: Check sheet-level electrical function, appearance, thickness, bonding and registration.
Test finished cards: Punch, personalize and verify RF performance, dimensions, bending and application compatibility.
| Lamination Risk | Possible Cause | Corrective Direction |
| Chip Failure | Excessive heat, local pressure, electrostatic damage or weak chip connection | Review chip package limits, process pressure, ESD controls and connection quality |
| Open Antenna Circuit | Broken conductor, poor joint, cutting damage or excessive stretch | Inspect continuity, conductor path, punching clearance and mechanical stress |
| Weak Read Range | Detuning, conductor loss, reader mismatch, metalized artwork or card-stack change | Measure resonance and retune using the completed card and target reader |
| Visible Chip Bump | Insufficient compensation, excessive module thickness or uneven pressure | Optimize local cavities, layer gauges, cushioning and pressing conditions |
| Delamination | Contamination, incompatible material, low heat or poor cooling | Review material compatibility, cleanliness, cycle and peel performance |
| Sheet or Card Warpage | Unbalanced stack, overheating, uneven pressure or rapid uncontrolled cooling | Balance layers and optimize heating, plate flatness and cooling |
Electrical, RF and Mechanical Quality Control
| Inspection Item | Recommended B2B Control |
| Chip Identity | Verify manufacturer, exact part number, memory, UID option, protocol and lot traceability |
| Electrical Function | Read chip UID, memory or defined command set at every card position according to the inspection plan |
| Antenna Continuity | Detect open circuits, shorts, weak joints, conductor defects and damaged crossovers |
| Resonance / RF Performance | Measure agreed RF parameter or functional read distance using defined test equipment and fixture |
| Chip and Antenna Position | Check position against CAD, card outline, punch clearance and neighboring antennas |
| Sheet Dimensions | Length, width, squareness, card pitch, registration holes and edge quality |
| Thickness and Flatness | Average thickness, local chip-zone thickness, curl, bow and point-to-point variation |
| Visual Inspection | Contamination, bubbles, wrinkles, black spots, conductor exposure, scratches and layer defects |
| Finished Card Test | RF function, dimensions, thickness, bending, torsion, heat, humidity, peel and reader compatibility |
| Traceability | Chip lot, antenna lot, PVC lot, production date, layout, test program, sheet number and packing record |
Define What “100% Inspection” Includes
Full inspection may refer to electrical read testing at every position, while dimensional, peel and destructive tests are commonly sampled. The purchase specification should define the test items, fixture, acceptance criteria, sampling plan and report.
Test Before and After Final Card Lamination
A prelam can pass electrical testing and still fail after excessive heat, pressure, punching or personalization. B2B qualification should include both incoming-inlay and finished-card performance.
Applications of 13.56MHz HF PVC Prelam Inlays
| Application | Chip / Protocol Direction | Critical Validation |
| Employee and Access Cards | Legacy Type A, MIFARE Plus or DESFire according to the installed access system | Reader compatibility, key management, enrollment and daily bending |
| Hotel Key Cards | Chip required by the hotel-lock platform | Lock encoder, guest-management system, card thickness and humidity exposure |
| Transport and Campus Cards | Secure multi-application chip such as DESFire where system architecture requires it | Transaction speed, security, reader estate, personalization and lifecycle |
| Membership and Loyalty Cards | Type A memory chip, NTAG or secure application chip according to program design | Reader or phone compatibility, database, privacy and repeat use |
| NFC Business and Marketing Cards | NTAG or other NFC Forum compatible chip | NDEF capacity, phone compatibility, URL security and scan position |
| Library, Asset and Vicinity Cards | ISO/IEC 15693 / ICODE-type solution | Reader protocol, antenna size, target range, anti-collision and EAS requirements |
| Secure Identity and Payment Projects | Certified secure chip and approved application architecture | Certification, key injection, audited supply chain and scheme-specific approval |
![13.56MHz HF RFID smart card applications for access ID hotel transit and NFC programs]( "13.56MHz HF RFID Smart Card Applications")
HF RFID Inlay Applications for Smart Card Programs
Security, UID and Data Personalization
| Data / Security Item | B2B Requirement |
| UID | Confirm UID length, fixed or random ID behavior, database format and reader support |
| Memory Encoding | Define data structure, sectors/files/pages, NDEF record, lock bits and verification |
| Authentication Keys | Define key ownership, injection process, transport protection, diversification and audit trail |
| Password / Access Configuration | Specify password, access bits, counters, originality checks and lock-state testing where supported |
| Printed Variable Data | Link printed number, barcode or QR code to chip data through controlled reconciliation |
| Rejected Cards | Segregate, count and securely destroy cards containing live keys, identifiers or encoded data |
UID Alone Is Not Strong Authentication
A system that grants access only from a publicly readable identifier may be vulnerable to copying or emulation. Security-sensitive projects should use a chip and backend architecture that supports appropriate cryptographic authentication.
Key Injection Is a Separate Secure Service
Supplying a secure chip does not automatically include application setup or key management. Define who creates, stores, loads and verifies keys, and whether an audited secure-personalization environment is required.
Hybrid and Multi-Frequency Inlay Options
A hybrid smart card can combine HF with LF, UHF, a contact chip or another HF application. These structures require more space, careful antenna separation, additional local thickness control and a dedicated lamination and testing program.
| Hybrid Structure | Use Case | Engineering Risk |
| LF + HF | Migration from legacy proximity access to HF smart-card systems | Antenna space, mutual interaction, card thickness and dual-reader testing |
| HF + UHF | Short-range identity plus longer-range tracking | Different antenna systems, material effects and UHF sensitivity near the body or metal |
| Two HF Chips | Separate applications or independent issuer domains | Reader selection, antenna coupling, data ownership and card-layout constraints |
| Contact + Contactless | Dual-interface secure identity, telecom or payment architecture | Module cavity, antenna connection, lamination, certification and personalization |
Hybrid Designs Are Separate Products
A standard single-frequency HF prelam should not be described as automatically supporting LF or UHF. Multi-frequency structures need their own drawing, chip list, RF tests, thickness specification and price.
Packing and Storage of RFID Prelam Sheets
Store prelam sheets flat in sealed, clean and dry packaging away from direct sunlight and heat.
Use rigid boards, interleaving and protected cartons to prevent bending, scratches and chip-zone pressure.
Avoid strong electrostatic discharge and use appropriate ESD handling controls where required.
Do not place heavy uneven loads on the sheet stack or allow pallet overhang.
Condition material in the lamination room before processing when warehouse and production conditions differ.
Identify every pack by chip model, antenna design, layout, thickness, batch and inspection status.
Use first-in, first-out inventory and retest material after prolonged storage or transport exposure.
![Protected RFID prelam inlay sheet packaging for international smart card B2B supply]( "RFID Prelam Inlay Sheet Packaging")
Protected Flat Packing for HF RFID Prelam Sheets
Team, Workshop and Smart Card Production Support
Reliable prelam production requires controlled antenna embedding or etching, chip attachment, sheet registration, plastic lamination, electrical testing, dimensional inspection, clean handling and batch traceability. The approved chip, antenna drawing and RF test method should remain fixed for repeat orders unless a controlled change is agreed.
![Wallis smart card material and RFID prelam inlay project team]( "Wallis Smart Card Material Team")
RFID Inlay Project and Technical Team
![RFID prelam inlay production workshop for chip antenna and smart card sheet manufacturing]( "RFID Prelam Inlay Production Workshop")
Prelam Inlay Production Workshop
![HF RFID inlay manufacturing equipment for antenna embedding and card sheet production]( "HF RFID Inlay Manufacturing Equipment")
Antenna and Inlay Process Control
![RFID smart card prelam sheet quality inspection and production traceability]( "RFID Smart Card Sheet Quality Inspection")
Electrical and Dimensional Inspection
Why Choose Wallis for 13.56MHz HF Prelam Inlays?
Application-based chip selection: Legacy access, NFC, secure multi-application and ISO 15693 projects can be separated by protocol and security need.
Custom antenna engineering: Coil geometry, conductor, chip capacitance, card outline and target reader can be reviewed together.
Flexible sheet layouts: Standard multi-card arrangements and customer-specific card pitches are available.
Card-material integration: PVC prelam can be coordinated with printed cores, overlays, magnetic stripes and finished-card structures.
Qualification support: Samples, lamination trials, RF testing, thickness checks and finished-card verification reduce project risk.
Factory-direct B2B supply: Suitable for smart-card factories, printers, converters, system integrators, issuers, importers and distributors.
Information Needed for a Fast B2B Quotation
Application, reader brand/model, protocol and installed software platform.
Exact chip manufacturer and part number, memory, UID and security requirements.
Sheet layout, total dimensions, card pitch, registration marks and quantity.
Card size, antenna clear zone, chip position and punching drawing.
Prelam material, color, nominal thickness and tolerance.
Antenna technology, target resonance or functional read-range test.
Final card stack, printed cores, overlays, metallic printing, stripe or signature panel.
Lamination press, heat, pressure, dwell, cooling and plate dimensions.
Electrical test, RF test, dimensional inspection and acceptance criteria.
Encoding, key injection, UID list, variable data or database reconciliation.
Prototype quantity, annual forecast, repeat-order schedule and change-control requirements.
Packing, inspection documents, destination port and requested delivery date.
Discuss Your HF RFID Inlay Project
Frequently Asked Questions
What is a 13.56MHz HF RFID prelam inlay?
It is a card-manufacturing core sheet containing a 13.56MHz chip and antenna inside plastic layers. It is laminated with printed cores and overlays to produce finished contactless cards.
Is a prelam inlay the same as a finished smart card?
No. A prelam is an intermediate functional layer. Finished cards require additional printing, overlays, lamination, cooling, punching and optional personalization or encoding.
Which 13.56MHz protocols are available?
Projects may use ISO/IEC 14443 Type A, Type B, ISO/IEC 15693 or NFC Forum compatible chips. The exact protocol depends on the selected IC and reader system.
Are MIFARE, NTAG and ICODE interchangeable?
No. They are different product families with different protocols, memory, commands, security and applications. Confirm the exact chip and reader before ordering.
Can you supply Fudan F08-compatible inlays?
Such legacy 1K-compatible options can be discussed. Provide the exact chip requirement and reader sample, because manufacturer, UID, memory and authentication compatibility must be verified.
Is MIFARE Classic recommended for new secure systems?
It remains relevant for installed legacy systems, but modern secure projects should evaluate current alternatives such as MIFARE DESFire or MIFARE Plus according to the system architecture.
Which chip is suitable for NFC business cards?
NTAG 213, 215 or 216 and other NFC Forum compatible chips are common options. Select the model from required NDEF memory, phone compatibility and security features.
Which chip is suitable for secure access or transport?
A secure multi-application chip such as MIFARE DESFire may be appropriate, but reader support, key management, certification, application files and software must be confirmed.
When should ISO/IEC 15693 be selected?
ISO/IEC 15693 is used for vicinity-card applications where the reader, antenna size and target coupling distance differ from proximity-card systems based on ISO/IEC 14443.
What sheet layouts are available?
Common options include 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 and 4 × 10. Custom layouts can be produced from the buyer’s lamination and punching drawing.
What is the standard HF prelam thickness?
The current product page references approximately 0.45 ± 0.02mm for selected HF structures. Final thickness depends on chip, antenna, material, card stack and local chip-zone requirements.
Can the thickness be customized?
Yes. Provide the target finished-card thickness, overlay and printed-core gauges, chip package and lamination process so the complete stack can be calculated.
Can you customize the antenna?
Yes. Antenna geometry can be developed around the chip capacitance, card size, reader, target performance, chip position and cutting clearances.
What antenna technologies are available?
Embedded copper-wire and etched-aluminum options can be discussed. The best construction depends on volume, resistance, thickness, bonding, card design and RF target.
What read range can the card achieve?
There is no universal range. It depends on chip, antenna, reader, card stack, orientation and environment. Define a test reader and minimum functional distance.
Can metalized printing be used on the card?
It can be used after RF testing. Large metallic foil or conductive ink near the antenna may detune or shield the contactless interface.
Can the inlay be made with PETG or polycarbonate?
Alternative material structures can be reviewed, but shrinkage, bonding, lamination temperature, RF tuning and finished-card durability must be validated separately.
Can the sheets be pre-printed?
The prelam is normally supplied as a blank functional core. Printing is usually applied to separate core sheets, although project-specific constructions can be discussed.
What lamination temperature should be used?
No universal setting should be published for every structure. Develop temperature, pressure, dwell and cooling around the exact PVC, overlay, ink, chip and antenna construction.
How is chip damage prevented during lamination?
Use compatible chip packaging, controlled local thickness, clean plates, balanced pressure, an approved heat cycle and electrical testing before and after lamination.
Do you test every chip position?
Full electrical testing can be specified. The purchase agreement should define which commands are checked at every position and which destructive or dimensional tests use sampling.
Can the inlays be pre-encoded?
UID reading, memory encoding, NDEF writing or application personalization can be discussed. Secure-key services require a separate controlled specification.
Can you supply LF + HF or HF + UHF hybrid inlays?
Hybrid designs can be developed as separate products. They require dedicated antenna layouts, thickness planning, reader tests and pricing.
Can samples be tested before bulk production?
Yes. The preferred process is to test the prelam, laminate the complete card stack, punch cards and verify RF, mechanical and personalization performance.
What determines the minimum order quantity?
MOQ depends on chip availability, custom antenna tooling, layout, material, thickness, test program, encoding and whether an approved standard design can be used.
What information is required for an accurate quotation?
Provide the exact chip, reader, protocol, layout, sheet size, card drawing, thickness, antenna target, final card stack, tests, quantity, packing and destination.
Request Custom 13.56MHz HF RFID Prelam Samples
Contact Wallis Plastic for customized 13.56MHz HF RFID PVC prelam inlay sheets for access, ID, hotel, membership, transport, NFC and smart-card manufacturing. Our team supports chip selection, antenna design, sheet layout, RF tuning, lamination trials, electrical testing, encoding, quality specifications and factory-direct B2B supply.
Request Samples and Factory Quote
