0.178mm & 0.254mm White Teslin ID Card Substrate

0.178mm kunye 0.254mm White Teslin ID Card Substrate

I-Wallis 0.178mm kunye ne-0.254mm iphepha le-Teslin elimhlophe lokwenziwa kwe-synthetic libonelelwa ngamakhadi e-ID ane-laminated, amakhadi obulungu, iziqinisekiso zokufikelela, amakhadi asehotele, amakhadi e-RFID, iibheji zesiganeko kunye nezinye iinkqubo zekhadi eziprintiweyo. I-microporous substrate yamkela i-inki, i-toner, i-adhesive kunye ne-laminate kwisakhiwo sayo, inceda abavelisi bekhadi ukuba bafezekise ushicilelo oluhlala ixesha elide kunye nokuqina okuqinileyo.

Iigeyiji ezimbini zihambelana nefomathi ye-substrate ye-7 mil kunye ne-10 mil. Ukutyeba kufuneka kukhethwe njengenxalenye yokwakhiwa kwekhadi elipheleleyo kunohlobo lwekhadi kuphela. Ukuprintwa kwelinye okanye kumacala omabini, ubukhulu be-overlay, i-RFID inlay, umgca wemagnethi, i-adhesive, uxinzelelo lwe-lamination kunye nobukhulu bekhadi eligqityiweyo kufuneka zonke zibandakanywe kwiinkcukacha.

I-Wallis ixhasa abathengi be-B2B ngamashiti eesampuli, ukusika isiko, izilingo zokuprinta, ukuhlolwa kwe-lamination, ukuphononongwa kwesakhiwo sekhadi kunye nokupakishwa kwamanye amazwe. Abathengi kufuneka baqinisekise ibakala elichanekileyo leTeslin, umenzi, ukunyamezela ubukhulu, imeko ephezulu kunye namaxwebhu okuthotyelwa ngaphambi kokuvuma ukuveliswa kobuninzi.

Uhlobo lweMveliso	I-white microporous synthetic-paper substrate yamakhadi aprintiweyo kunye ne-laminated
Ukutyeba Iinketho	0.178mm / 178μm / 7 mil kunye 0.254mm / 254μm / 10 mil
Iindlela Zokushicilela	I-offset, i-silk-screen kunye noshicilelo lwedijithali; iinkqubo ezongezelelweyo zifuna uvavanyo lwebakala kunye nezixhobo
Izicelo zeKhadi	Isazisi, ubulungu, ukunyaniseka, isitshixo sehotele, ukufikelela, isiganeko, ukhathalelo lwempilo kunye namakhadi e-RFID akhethiweyo
Iinketho zokubonelela	Amaphepha asemgangathweni okanye anqunyulwe ngokwesiko, ukupakishwa kwangaphakathi okukhuselweyo, iibhokisi kunye neepaliti zokuthumela ngaphandle
Iinkonzo ze-B2B	Iisampulu, isiqinisekiso soshicilelo, izilingo ze-lamination, uphononongo lwesakhiwo se-RFID, ukucwangciswa kwe-QC kunye nobonelelo oluninzi

Cela i-Teslin Card Substrate Samples

Yintoni iPhepha leTeslin Synthetic?

I-Teslin substrate yi-microporous, i-polyolefin-based synthetic material equlethe umlinganiselo ophezulu we-inorganic filler kunye nomthamo womoya wangaphakathi. Ngokungafaniyo nephepha leplastiki elishinyeneyo, ubume bayo obunobuqhophololo bufunxa ii-inki, iitoni, izincamathelisi kunye ne-laminate etyhidiweyo, idala iibhondi ezidibeneyo zomatshini ngaphakathi kwe-substrate.

Ulwakhiwo lweMicroporous loShicilelo kunye noBonding

I-inki kunye ne-toner inokungena kumphezulu kunokuba ihlale kuphela njengomaleko osuswayo. Ngexesha le-lamination, i-laminate ehambelanayo okanye i-adhesive flows kwi-pores, inceda ukukhusela umbhalo oshicilelweyo, iifoto, iikhowudi ze-QR kunye ne-barcodes ukusuka kwi-abrasion okanye ukuzama ukwahlula umaleko.

I-Flexible Cushioning yeeNgxelo eziZinzisiweyo

Isakhiwo esicinezelayo sinokukhusela imivimbo yamagnetic, i-eriyali, iitshiphusi kunye nezinye izinto ezifakwe ngaphakathi. Oku akuphelisi isidingo sobunjineli be-inlay: ubukhulu becandelo, uyilo lwecavity, ukusabalalisa uxinzelelo kunye novavanyo oluphindaphindiweyo lwe-flex luhlala lubalulekile.

I-Teslin yiSubstrate, hayi iNkqubo yoKhuseleko epheleleyo

Ukhuseleko lwekhadi luxhomekeke kuyilo olupheleleyo, kubandakanywa umsebenzi wobugcisa olawulwayo, idatha eguquguqukayo, iimpawu zeholographic, ii-inki ze-UV, ii-overlays, iitshiphusi, imigca yemagnethi kunye neenkqubo zokukhutshwa. I-substrate emhlophe eqhelekileyo akufuneki ichazwe njengequlethe ii-watermark okanye i-covert features ngaphandle kokuba ibakala elichanekileyo linezo mpawu zakhelwe ngaphakathi.

0.178mm vs. 0.254mm Teslin Substrate

Zombini ubukhulu bunokuprintwa kwicala elinye okanye omabini. Ukhetho oluchanekileyo luxhomekeke kwigalelo elifunekayo le-substrate kubukhulu bekhadi lilonke, ukuqina, i-cushioning, i-lamination stack kunye neefilimu ezifumanekayo ezingaphezulu-kungekhona nje ukuba umzobo ucalanye okanye uphindwe kabini.

Into yokuKhetha	0.178mm / 7 mil	0.254mm / 10 mil
Igalelo leSubstrate	Igalelo eliphantsi kubukhulu bekhadi elipheleleyo; ishiya indawo eyongezelelekileyo yokwaleka okanye iileya ezongezelelweyo	Igalelo eliphakamileyo kubunzima obupheleleyo kunye ne-cushioning
Ukuba bhetyebhetye	Ubhetyebhetye ngakumbi phambi kokuba lamination	Imvakalelo eyongezelelekileyo ngakumbi phambi kokuba i-lamination
Ukusetyenziswa kweProjekthi eqhelekileyo	Amakhadi alaminethiweyo anondoqo, iibheji, iithegi kunye nezakhiwo ezisebenzisa utyando olutyebileyo	I-cores enzima, i-cushion ephuculweyo kunye nezakhiwo zisebenzisa ii-overlays ezincinci
RFID / Chip Ulwakhiwo	Iluncedo apho inlay kunye nezigqubuthelo ezingaphezulu sele zisebenzisa ubukhulu obuninzi	Inokubonelela nge-cushion engaphezulu, kodwa isitakhi esipheleleyo kunye noxinzelelo kufuneka zibalwe kwakhona
Indlela yokuvunywa	Shicilela, i-laminate, imeko kwaye ulinganise iisampuli ezigqityiweyo	Shicilela, i-laminate, imeko kwaye ulinganise iisampuli ezigqityiweyo

7 Mil kunye 10 Mil Ukutyeba Iinketho

Cwangcisa ukutyeba kweKhadi elipheleleyo

Ikhadi le-ID elaminethiweyo yinkqubo ye-substrate, ukuprinta, ukugqithiswa, ukunamathela kunye nezinto ezikhethiweyo ze-elektroniki. Ubunzima obugqityiweyo kufuneka bubalwe kwi-stack yonke kwaye buqinisekiswe emva kokuba ikhadi lipholile kwaye licolisekile. Ukutyeba

kweCandelo leKhadi	kunye nokuqwalaselwa kweNkqubo
I-Teslin Print Core	Sebenzisa i-0.178mm okanye i-0.254mm ngokwestakhi esivunyiweyo kunye ne-cushioning efunekayo
Ukwaleka kwangaphambili nasemva	Igeyiji yokwaleka, into encamathelayo kunye nokugqitywa komphezulu kuqinisekisa ukhuseleko kunye nokuziva kwekhadi lokugqibela
I-Ink eprintiweyo / iToner	Ukugquma okuqinileyo okuqinileyo kunokuchaphazela ukufuma, ukuvalela, ukunyibilika kunye ne-dimensional balance
RFID Inlay okanye Chip	Bandakanya i-eriyali, i-chip bump, i-adhesive kunye nawuphi na umngxuma okanye i-spacer layers
Umtya weMagnetic / Hologram	Qinisekisa ikhefu lomgca, ukuhambelana kophahla kunye nokufakwa kweekhowudi emva kokulanywa okanye ukuhlolwa
Ikhadi eligqityiweyo	Ukulinganisa ubukhulu, ukucaba, imilinganiselo kunye nokusebenza emva kokupholisa kunye nokulungiswa

Ukuhambelana nokuShicilela kunye noKhetho lweBanga

Amabanga ahlukeneyo eTeslin alungiselelwe iinkqubo ezahlukeneyo zoshicilelo. Abathengi akufanele bacinge ukuba iphepha elinye elimhlophe liya kuvelisa umphumo ofanayo kwi-offset, i-inkjet yedayi, i-pigment inkjet, i-laser, i-Indigo, isikrini okanye i-thermal-transfer-transfer equipment. Ukufaneleka kwebakala elichanekileyo, umshicileli kunye nesistim ye-inki iyafuneka.

Inkqubo yoShicilelo	iMfuneko yoQinisekiso lwe-B2B
Ushicilelo lwe-Offset	Ukuseta i-Ink, ukuxinana, ukubambisa, ukomisa, inqanaba lomgubo, ukuthintela kunye nokuchasana kwe-lamination
I-Silk-Screen yoShicilelo	Ubungqingqwa be-inki, ukuhambelana kwe-solvent, ukunyanga, ukuguquguquka kunye nokudibanisa umaleko
Digital Laser Printing	Ubushushu be-Fuser, ukunamathela kwi-toner, ukuthuthwa kwamaphepha, ulawulo oluzinzileyo kunye nesiqinisekiso sezixhobo
Inkjet yoShicilelo	Sebenzisa ibakala elihambelana ne-inkjet; Idayi yovavanyo okanye inki ye-pigment, ixesha elomileyo, ukumelana namanzi kunye neprofayili yombala
HP Indigo / Digital Press	Qinisekisa ibakala elifanelekileyo, imfuneko ye-primer, ubushushu bengubo kunye ne-post-print lamination
Ngqo-to-iKhadi Umshicileli	Ngokuqhelekileyo iprinta ikhadi eligqityiweyo elingenanto kunokuba ishidi leTeslin elikhululekile; uvavanyo kuphela emva lamination ikhadi kunye ngenqindi

Omabini ubutyebe bunokuxhasa uShicilelo olunaMacala amabini

Ukuprintwa kwamacala amabini kulawulwa yinkqubo yokushicilela, ibakala, ibhalansi yokufuma, ukugubungela umsebenzi wobugcisa kunye nokubhaliswa-kungekhona nje ukusebenzisa i-0.254mm impahla. Uyilo olulungelelanisiweyo lwangaphambili nasemva lunokunceda ukunciphisa i-curl emva kokushicilela kunye ne-lamination.

Shicilela i-Substrate phambi koBuchule beKhadi lokugqibela

Imizobo elungisiweyo idla ngokuprintwa kumaphepha angaphantsi komhlaba phambi kokuba i-lamination. Amagama aguquguqukayo, iifoto, amanani okanye iibhakhowudi zinokudityaniswa ngexesha loshicilelo lwamaphepha okanye kamva kwikhadi eligqityiweyo, ngokuxhomekeke kukuhanjiswa komsebenzi wokukhutshwa.

I-Offset, iScreen kunye ne-Digital Printing Trials

Inkqubo yokuLamination Thermal kunye neRoll

I-Teslin substrate ingaba yi-platen-laminated okanye i-roll-laminated kunye neefilimu ezihambelanayo. Ukudibanisa okunamandla kwenzeka xa i-laminate okanye i-adhesive igeleza kwisakhiwo se-microporous. Iisetingi zokugqibela kufuneka zisekwe ngebakala lokwenyani le-substrate, i-overlay, i-inki, i-press kunye ne-card stack.

Lamination Control	Kucetyiswa Practice
Imeko yokufuma	Umqathango we-substrate kunye namaphepha aprintiweyo phambi kwe-lamination; izinto ezomileyo kakhulu okanye ezifumileyo kakhulu zinokuwunciphisa umgangatho
Ubushushu	Beka ngokuhambelana nomthengisi we-laminate kunye nobushushu obuqinisekisiweyo be-substrate; musa ukuthembela kuphela kumatshini wokubonisa ubushushu
Uxinzelelo kunye nexesha	Ukubonelela ngokugeleza okwaneleyo kwiipores ngaphandle kokutyumza iitshiphusi, ukugqwesa umsebenzi wobugcisa okanye ukudala ukucudisa okugqithisileyo
Ukupholisa	Ukupholisa phantsi koxinzelelo olulawulwayo ukuphucula ukuthambeka kunye nokuzinza kwe-dimensional
Amandla e-Peel	Vavanya i-laminate egqityiweyo emva kokulungiswa kwemeko kunye nokuvezwa kokusingqongileyo
Ukutywinwa komda	Izakhiwo ezihambelanayo zeTeslin ze-laminate zihlala zifa-zinqunyulwe emva kwe-lamination ngaphandle komda otywiniweyo ohlukeneyo; qinisekisa ngefilimu ekhethiweyo

Musa ukukopa iresiphi yeGeneric Lamination

Iiparamitha zokuqalisa ezipapashiweyo zinokunceda kulingo, kodwa ukuhanjiswa kobushushu okwenene kuyahluka ngepleyiti, ucinezelo, ubude bestaki, ikhemistri egqunyiweyo kunye nekhava eprintiweyo. Rekhoda iqondo lokushisa elivunyiweyo le-substrate, uxinzelelo, ukuhlala, ukupholisa kunye nokukhulula-ubumbeko lwefilimu yokuveliswa kwakhona.

Vavanya iiBubbles, isilivere kunye neCurl

Ukufuma okubanjiweyo, ubushushu obungonelanga, i-laminate engahambelaniyo, i-inki enzima okanye ukupholisa kakubi kunokudala amaqamza, isilivere, inkungu okanye i-curl. Hlola zombini iphepha kunye namakhadi afakwe ngenqindi emva kokulungiswa.

Udibaniso lweNdawo yoKhuseleko

I-Teslin substrate inokuxhasa uyilo lwesiqinisekiso esinemaleko, kodwa iimpawu zokhuseleko zenziwe yinkqubo yoxwebhu olupheleleyo. Imathiriyeli yorhwebo esemgangathweni ayiqulathanga ngokuzenzekelayo i-covert yebakala likarhulumente okanye izinto ezisemthethweni.

lweFeature yoKhuseleko	Imfuneko yoHlanganiso
Microtext kunye neFine-line Printing	Umsebenzi wobugcisa obuphezulu, ipleyiti elawulwayo okanye i-digital imaging kunye ne-post-lamination legibility
UV-Fluorescent Ink	Isiqinisekiso somthengisi we-inki, ulawulo lwe-fluorescence yangasemva kunye nokuhlolwa emva kokulanyiswa
Ukwaleka kweHolographic	Ukwaleka okubhalisiweyo, ukuhambelana kwe-laminate, ukucaca kwe-optical kunye nokuziphatha kwe-tamper
Ikhowudi yeQR kunye neBarcode	Umahluko woshicilelo, ukuchaneka kobukhulu, ukufundeka kweskena kunye nokukhuselwa kwe-abrasion
Ukhuseleko oluSiko lwe-Substrate yeBanga	Amanqaku abethelelwe ngenkqubo ethile afuna ikhonkco lonikezelo eligunyazisiweyo elikhuselekileyo kwaye alilingani nephepha elimhlophe eliqhelekileyo.

Ukhuseleko lweLayered kunye noKhuseleko lweLaminate

I-RFID, i-NFC kunye ne-Smart Card Structures

I-Teslin substrate inokukhusela kwaye ikhusele i-RFID inlay, kodwa ukukhetha i-0.254mm endaweni ye-0.178mm ayenzi ngokuzenzekelayo ikhadi elilungele i-electronics ephezulu. I-inlay, i-chip, i-eriyali, i-adhesives, i-overlay kunye ne-lamination cycle kufuneka iyilwe njengesakhiwo esinye.

I-Smart Card Factor	efunekayo uQinisekiso
I-Chip kunye nokuQhosha	Qinisekisa imodeli yechip, frequency, protocol, inkumbulo kunye nenkqubo yokufunda
Ijometri yeAntenna	Khusela umkhondo we-eriyali ngexesha lokutshiza, ukubetha kunye nokugqitywa kwekhadi
Inlay Ukutyeba	Bala i-chip bump, i-eriyali, i-carrier kunye ne-adhesive ngaphakathi kwe-stack yekhadi lilonke
Ukusasazwa koxinzelelo	Sebenzisa i-cushioning efanelekileyo kunye nemingxuma ukunqanda umonakalo wetshiphu okanye i-eriyali
Uvavanyo olusebenzayo	Uvavanyo lokufunda / ukubhala ukusebenza ngaphambi kokuthambisa, emva kokulanyiswa, emva kokubetha nangemva kokuguquguquka

Ikhadi le-ID kunye

nesicelo seNgcaciso yeSicelo	esiCetyisiweyo kuJoliso lweProjekthi
Iikhadi zeSazisi zeNkampani	Umgangatho wefoto, idatha eguquguqukayo, ikhowudi yebhakhowudi, ukuqina okungaphezulu kunye nokusetyenziswa kwebheji yemihla ngemihla
Amakhadi oMfundi kunye neFaculty	Ukushicilelwa komthamo ophezulu, ukwenziwa komntu, umsebenzi wemagnethi okanye weRFID kunye nokuguquguquka kwexesha elide
Amakhadi obulungu kunye nokunyaniseka	Umbala webhrendi, ibhakhowudi okanye ukufundeka kwe-QR, ukuqina kwe-wallet kunye nokuveliswa kweshiti ngeendleko ezifanelekileyo
Amakhadi angundoqo ehotele	Ukuhambelana komgca weMagnetic okanye i-RFID, uvavanyo lokutshixa kunye nobomi benkonzo obufutshane ukuya kwephakathi
Izazisi zezempilo kunye nezigulane	Ukuba semthethweni, ukucoca ukuvezwa, ukuskena ibhakhowudi kunye nokukhutshwa okulawulwayo
Iibheji zoMnyhadala kunye neeNdwendwe	Ushicilelo olufutshane lwedijithali, iindawo zokubeka, iilanyards, iikhowudi ze-QR kunye nokukhawuleza kobuntu

Ukugqibezela, ukuNgqobhoza kunye neKhadi loBuqu

beNkqubo	yokuLawula uMgangatho weNdawo
I-Guillotine Cutting	I-Squareness, ukubhaliswa okuprintiweyo, imeko ye-blade kunye noxinzelelo lwe-stack
Card Punching / Die Cutting	Imilinganiselo yekhadi, i-radius yekona, i-edges ecocekileyo kwaye akukho kwahlukana kwe-laminate
Slot kunye Hole Punching	Isikhundla, umgama osekupheleni, umthwalo welanyard kunye nokumelana nokuqhekeka
I-Embossing okanye i-Foil Stamping	Ukwakhiwa kwekhadi eligqityiweyo, ubushushu, uxinzelelo, ukubambelela kwi-foil kunye nokufundeka
Thermal / Retransfer Personalization	Ukuthuthwa komshicileli, ukuhanjiswa kweribhoni, amandla angaphezulu, ukuphazamiseka kobushushu kunye nokuqina komfanekiso
Ufakelo lweekhowudi kwiMagnetic / RFID Encoding	Imveliso ye-encoding, ukuhambelana komfundi kunye nomsebenzi wasemva koxinzelelo

I-Teslin vs. I-PVC, i-PETG kunye ne-Polycarbonate Izixhobo zeKhadi zeMaterial

Amandla	oMathiriyeli	Iingcamango eziphambili
Teslin Substrate	Ukufunxwa koshicilelo oluphezulu, ukuhlangana okuqinileyo kwe-laminate, ukuguquguquka kunye nokuthotywa kwe-elektroniki	Ngokuqhelekileyo isetyenziswe njengengundoqo eprintiweyo ngaphakathi kwesakhiwo se-laminate kunokuba njengekhadi eligqityiweyo eliveziweyo
I-PVC	Inkqubo yekhadi esekiweyo, unikezelo olubanzi kunye neendlela eziqhelekileyo zobuntu	Iprofayili eyahlukileyo yokusingqongileyo, ukumelana nobushushu obuphantsi kunye nokuhlaziywa okulinganiselweyo kwiimarike ezininzi
I-PETG	Ukuqina, ukucaca kunye nezicelo ezinamandla zekhadi le-multilayer	Iresiphi yokuncamathelisa i-inki kunye ne-lamination yahlukile kwi-Teslin substrate ene-porous
Polycarbonate	Ukuqina okuphezulu, ukuxhathisa ubushushu kunye nokukwazi ukwenza i-laser-personalization kumabakala azinikeleyo	Izinto eziphezulu kunye neendleko zemveliso; isetyenziselwa ukufuna iziqinisekiso zobomi obude

Ulawulo loMgangatho weBulk Teslin Sheet Orders

Inspection Item	eCetyisiweyo
Isazisi Material	Umenzi, ibakala, ikhowudi yobukhulu, ibhetshi kunye nereferensi yesatifikethi
Ukutyeba kunye nobukhulu	I-avareji yegeyiji, ukunyamezela, ubude beshiti, ububanzi, isikwere kunye nokuchaneka kokusika
Imbonakalo	Ubumhlophe, umthunzi, amabala amnyama, ungcoliseko, imibimbi, imibimbi kunye nomonakalo osemaphethelweni
Ukucaba kunye nokufuma	I-Curl, isaphetha, imeko yokugcina kunye nokulinganisela komswakama ngaphambi kokuprintwa kunye ne-lamination
Printa iMfaneleko	Ubuninzi, ukunamathela, ukomisa, umbala, iinkcukacha zomfanekiso, ukufundwa kwebhakhowudi kunye nokuthintela
Uvavanyo lweLamination	Amandla e-Peel, amaqamza, inkungu, ukwahlukana komphetho, ukugoba kunye nobukhulu obugqityiweyo
UVavanyo lweKhadi eligqityiweyo	Imilinganiselo, ukuguquguquka, ukukrazula, ukwenziwa komntu, amandla eslot, i-encoding kunye nomsebenzi wokufunda
Ukupakisha kunye nokulandeleka	Isitaki esikhuselweyo, ukubala, ileyibhile yeekhathoni, ukucwangciswa kwepalethi, inombolo yeqashiso kunye nengxelo yokuhlola

IiMfuno zokuGcina nokuPhatha

I-Teslin substrate iyacinezeleka kwaye kufuneka ikhuselwe kubushushu, ukukhanya kwe-UV, ungcoliseko, ukungalingani kokufuma kunye noxinzelelo olugqithisileyo. Ukugcinwa okuchanekileyo kunceda ukugcina umbala, ukucaca, ukusebenza kokushicilela kunye namandla okukhanya.

• Gcina izinto ezigqunyiweyo kwindawo ecocekileyo kude nomsi ovuthayo kunye nezingcolisi zangaphakathi.

• Khusela amashiti ekukhanyeni okuthe ngqo kwe-UV kunye namaqondo obushushu angaphezu komda wogcino oluvunyiweyo.

• Gcina amashiti asikiweyo ethe tyaba kwindawo eqinileyo, exhaswayo.

• Musa ukubeka imithwalo enzima okanye iipalethi ezipakishwe kabini kwiibhokisi ezisikiweyo zamaphepha.

• Kuphephe ukubopha imitya eqinileyo enokuthi icinezele imiphetho okanye iphawule isitaki samaphepha.

• Gcina iipakethi ezingaphelelanga zisongelwe ngokutsha ukunqanda uthuli, ukuguquka kombala kunye nokutshintsha kokufuma.

• Amaphepha emeko kwigumbi lemveliso phambi kokuprintwa okanye ukulanyiswa xa iimeko zokugcina iimpahla zahlukile.

Ukuveliswa kweWallis kunye neNkxaso yokuBonelelwa kweB2B

I-Wallis ixhasa abavelisi bamakhadi kunye nabasasazi bezinto eziphathekayo ngokufumana i-substrate, ukusika amaphepha angokwezifiso, ukupakishwa okukhuselweyo kunye nokubonelela ngekhadi-material elungelelanisiweyo. Umyalelo ngamnye kufuneka uqhagamshelwe kwisampulu evunyiweyo kunye nenkcazo ebhaliweyo egqumayo ibakala, ubukhulu, inkqubo yoshicilelo, ulwakhiwo lwelamination kunye neemfuno zekhadi eligqityiweyo.

Ukwenziwa kweMathiriyeli yeKhadi kunye nokuThunyelelwa kwamanye amazwe

Kutheni ukhetha i-Wallis kwi-White Teslin Card Substrate?

• Iigeyiji ezimbini zekhadi eliqhelekileyo: 0.178mm kunye ne-0.254mm iinketho zezakhiwo zekhadi elaminethiweyo.

• Inkxaso yenkqubo yoshicilelo: I-Offset, i-silk-screen kunye nolingo loshicilelo lwedijithali lunokulungelelaniswa phambi kokuvunywa okuninzi.

• Uphuhliso olugxile kwi-Lamination: I-Substrate, i-overlay, i-adhesive, ubushushu kunye nobukhulu bekhadi bunokuhlaziywa njengenkqubo enye.

• Amava ekhadi le-RFID: Ubukhulu be-Inlay, i-cushioning, ukukhuselwa kwe-chip kunye neemvavanyo zomfundi zingabandakanywa ekuqinisekiseni isampuli.

• Ukusika kunye nokupakisha ngokwezifiso: Ifomethi yePhepha, ukukhuselwa kwe-stack, iibhokisi kunye neepallets ziyakwazi ukulungelelaniswa neemfuno zemveliso kunye nokuthumela ngaphandle.

• Inkonzo ye-B2B yomzi-mveliso: Ifanelekile kwiifektri zamakhadi, abashicileli, abaguquli, iinkampani ze-RFID, abarhwebi kunye nabasasazo.

Ulwazi olufunekayo kwiNtelekelelo yeNtelekelelo yeB2B ekhawulezayo

• Isicelo sekhadi, ubomi benkonzo obulindelekileyo kunye nemarike yendawo ekuyiwa kuyo.

• Ubukhulu obufunekayo: 0.178mm / 7 mil okanye 0.254mm / 10 mill.

• Ubude bephepha, ububanzi, ukunyamezela, isikwere kunye nobuninzi.

• Inkqubo yoshicilelo, imodeli yomshicileli, i-inki okanye itoner kunye nomsebenzi wobugcisa onamacala amabini.

• Izinto ezingaphezulu, ubukhulu, ukugqiba, i-adhesive kunye nezixhobo zokulambisa.

• Imilinganiselo yekhadi ekujoliswe kuyo egqityiweyo, ubukhulu kunye nommandla wekona.

• Itshiphu yeRFID, i-eriyali, inlay, umgca wemagnethi, ihologram okanye elinye icandelo.

• Ukushicilelwa kokhuseleko, ikhowudi yebhakhowudi, ikhowudi yeQR kunye neemfuno zomntu.

• Izatifikethi ezifunekayo, ukulandelelwa kwezinto kunye nengxelo yokuhlolwa.

• Ubungakanani bovavanyo, uqikelelo lonyaka, indawo yokusingwa kunye neshedyuli yokuhanjiswa.

Xoxa ngeProjekthi yakho yeKhadi leTeslin

Imibuzo ebuzwa qho

Uthini umahluko phakathi kwe-0.178mm kunye ne-0.254mm yeTeslin?

I-0.178mm substrate yi-7 mil, ngelixa i-0.254mm substrate yi-10 mil. Ibakala elityebileyo linegalelo ngakumbi kubunzima bekhadi lilonke kunye nokuthotywa, kodwa zombini zifuna ukuvavanywa kwisakhiwo esipheleleyo se-laminate.

Ngaba zombini ubukhulu bunokuprintwa kumacala amabini?

Ewe. Ushicilelo olunamacala omnye okanye kabini luxhomekeke kwibakala elingaphantsi, inkqubo yoshicilelo, inkqubo ye-inki, ibhalansi yomsebenzi wobugcisa kunye nokubhaliswa—kungekhona nje kubukhulu beshiti.

Bubuphi ubungqingqwa obungcono kwikhadi le-ID elilaminethiweyo?

Akukho khetho lukazwelonke. Bala i-substrate, ii-overlays zangaphambili nangasemva, i-adhesive, printing kunye ne-inlay yokuzikhethela, emva koko i-laminate kwaye ilinganise ikhadi eligqityiweyo eligqityiweyo.

Ngaba iphepha leTeslin alinamanzi?

I-substrate esekelwe kwi-polyolefin ixhathisa amanzi, kodwa ukuqina kokushicilela kuxhomekeke kwi-inki, ibakala kunye ne-lamination. Ikhadi eligqityiweyo kufuneka livavanyelwe amanzi, ukufuma kunye nokucoca i-exposure.

Ngaba iTeslin inokuprintwa ngomshicileli we-inkjet oqhelekileyo?

Sebenzisa ibakala leTeslin elihambelana ne-inkjet kwaye uvavanye idayi ethile okanye inki ye-pigment. Amabakala asemgangathweni kunye namabakala e-inkjet adityanisiweyo anokuziphatha ngendlela eyahlukileyo ngexesha elomileyo, umbala kunye nokumelana namanzi.

Ngaba iTeslin inokuprintwa ngeprinta yelaser?

Amabakala afanelekileyo angaprintwa ngelaser, kodwa ubushushu befuser, uthutho lwamaphepha, ukuncamathela kwetoner kunye nesiqinisekiso somshicileli kufuneka sitshekishwe. Musa ukusebenzisa imathiriyeli engavunywanga kwisixhobo.

Ngaba umshicileli othe ngqo-ekhadini unokuprinta amaphepha eTeslin akhululwe?

Uninzi lwabashicileli abathe ngqo ukuya ekhadini benzelwe amakhadi angenanto agqityiweyo, hayi amakhasi angaphantsi. Shicilela kwaye ulalise iphepha kuqala, ubethe amakhadi, kwaye emva koko uvavanye ubuwena kwizikhewu ezigqityiweyo.

Yeyiphi ifilimu yelaminate esebenza kunye neTeslin?

Iilaminates ezininzi ze-thermal kunye neefilimu ezincamathelayo zinokusebenza, kodwa ukuhambelana kuxhomekeke kubushushu bokusebenza, ukuhamba, ubukhulu kunye neemfuno zekhadi eligqityiweyo. Vuma i-substrate echanekileyo kunye nefilimu indibaniselwano ngovavanyo lwamaxolo.

Ngaba iTeslin ifuna itywina edge?

Izakhiwo zeTeslin ezilayitiweyo ngokufanelekileyo zinokuthi zisikwe kwimilo egqityiweyo ngaphandle komda otywiniweyo ohlukeneyo ngenxa yokuba iibhondi ze-laminate kwi-matrix ene-porous. Qinisekisa oku nge-laminate ekhethiweyo kunye nenkqubo.

Kutheni le nto amaqamza avela ngexesha lamination?

Izizathu ezinokwenzeka ziquka ukufuma okugqithisileyo, ubushushu obungonelanga, umoya ovalelweyo, i-inki enzima, i-laminate engahambelaniyo okanye uxinzelelo olungonelanga. Lungiselela amaphepha kwaye uqinisekise ubushushu be-substrate.

Ngaba iTeslin ingasetyenziselwa amakhadi eRFID kunye neNFC?

Ewe. I-cushioning yayo inokunceda ukukhusela i-electronics, kodwa i-chip, i-antenna, ubukhulu be-inlay, i-adhesive, uxinzelelo kunye nokusebenza okugqityiweyo kufuneka kuqinisekiswe.

Ngaba i-0.254mm Teslin ixhasa ngokuzenzekelayo itshiphu yeRFID ngcono?

Ayizenzekeli. I-substrate etyebileyo inokubonelela ngakumbi nge-cushioning, kodwa iphinda itshintshe ubukhulu bekhadi elipheleleyo kunye nokusabalalisa uxinzelelo. Ulwakhiwo olupheleleyo lwe-inlay lumisela ukusebenza.

Ngaba iTeslin eqhelekileyo iqulethe iimpawu zokhuseleko?

I-substrate emhlophe eqhelekileyo ibonelela ngoshicilelo kunye neenzuzo zokuthambisa kodwa akufuneki ichazwe njengequlathe iziphawuli zokhuseleko olufihlakeleyo. Inkqubo ethile yokhuseleko-ibakala yimveliso eyahlukileyo elawulwa.

Ngaba iihologram kunye nee-inks zeUV zingongezwa?

Ewe. I-Holographic overlays, i-inks ye-UV, i-microtext kunye nezinye iimpawu zinokudityaniswa ngokuprintwa okuhlukeneyo kunye neenkqubo zokulayita. Ukubonakala kwazo kunye nokuqina kwazo kufuneka zivavanywe emva kwemveliso.

Ngaba iTeslin inobubele ngakumbi kokusingqongileyo kunePVC?

Ukusebenza kokusingqongileyo kuxhomekeke kwimathiriyeli ekrwada, ukwakhiwa kwamakhadi, ubomi benkonzo, ukuvelisa, uthutho kunye neendlela ezikhoyo zokulahla. Liphephe ibango elibanzi lokuphakama ngaphandle kovavanyo oluchaziweyo lomjikelo wobomi.

Ngaba iTeslin inokuphinda isetyenziswe?

Ukurisayikilishwa kwakhona kuxhomekeke kwingqokelela yendawo kunye nolwakhiwo olupheleleyo lwekhadi. Ilaminates, ii-inki, imigca kazibuthe, iitshiphusi kunye nee-eriyali zinokufuna ukwahlukana okanye ukulahlwa kweengcali.

Kufuneka agcinwe njani amaphepha eTeslin?

Gcina amashiti egqunyiwe, athe tyaba, omile kwaye ekhuselwe ekukhanyeni kwe-UV, ubushushu, umsi, uthuli kunye noxinzelelo olugqithileyo lwemfumba. Zibeke iimeko phambi koshicilelo okanye ukulatyuza.

Ngaba iWallis ingabonelela ngobungakanani bephepha elilungiselelweyo?

Ukusika ngokwesiko kunokuxoxwa ngokuhambelana nokuhlelwa kokushicilela, i-lamination plate, ukufakwa kwekhadi, ukunyamezela, ubuninzi kunye neemfuno zokupakisha.

Ngaba iisampulu zinokuvavanywa phambi kweodolo eninzi?

Ewe. Shicilela, i-laminate, ipholile, imeko, i-punch kwaye wenze amakhadi eesampuli alungele wena usebenzisa izixhobo zokuvelisa ezicetywayo ngaphambi kokuvuma imathiriyeli.

Yintoni emisela ubungakanani bomyalelo ophantsi?

I-MOQ ixhomekeke kwibakala, ubukhulu, ubungakanani beshiti, ukusika isiko, isiqinisekiso sokushicilela, ukupakisha kunye noqikelelo lonyaka.

Loluphi ulwazi olufunekayo kwikowuteshini echanekileyo?

Ukubonelela ngobuninzi, ubungakanani beshiti, inkqubo yoshicilelo, ukugquma, izixhobo zokulambisa, ubukhulu bekhadi eligqityiweyo, iRFID okanye iimfuno zomgca, ubungakanani, indawo ekuyiwa kuyo kunye neshedyuli yokuhanjiswa.

Cela iiSampulu zeSubstrate zekhadi le-ID yeTeslin emhlophe

Qhagamshelana neWallis Plastic ye-0.178mm kunye ne-0.254mm emhlophe yephepha le-Teslin eyenziwe nge-ID elaminethiweyo, ubulungu, isitshixo sehotele, isiganeko kunye neeprojekthi zekhadi le-RFID. Iqela lethu lixhasa ukukhetha ubukhulu, ukusika isiko, ukuprintwa kunye nezilingo zokuthambisa, ukuphononongwa kobume bekhadi, ukucaciswa komgangatho kunye nobonelelo lweB2B ngqo kumzi-mveliso.

I-Teslin luphawu lokuthengisa olubhalisiweyo lwe-PPG Industries Ohio, Inc.

Cela iisampulu kunye neFactory Quote