|
Inlay/ Prelam
Wallis
| Ubungakanani: | |
|---|---|
| Ubungakanani: | |
Wallis 13.56MHz HF RFID PVC inlay sheets inlay zenziwe njengondoqo osebenzayo wamakhadi e-smart ngaphandle koqhagamshelwano, amakhadi esazisi, amakhadi okufikelela, amakhadi ezitshixo zehotele, amakhadi obulungu, amakhadi othutho kunye neenkqubo zekhadi ezinikwe i-NFC. Iphepha ngalinye lidibanisa i-chip ye-HF ekhethiweyo kunye ne-eriyali ngaphakathi kwesakhiwo se-PVC esilawulwayo, silungele ukugqitywa kwekhadi-umzimba wokugqibela, ukuprintwa, ukubethelwa kunye nobuntu.
Iiprojekthi ze-B2B zinokulungiswa ngokwemodeli yetshiphu, iprothokholi, inkumbulo, ijometri ye-eriyali, ubungakanani beshiti, uyilo lwekhadi, ubukhulu be-inlay, indawo yetshiphu, imathiriyeli, ukwakhiwa kwekhadi lokugqibela kunye nokupakishwa. Iimbekiselo zoyilo olusemgangathweni ziquka i-2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kunye ne-4 × 10, kunye noyilo lwekhadi le-multi-card elikhoyo kwiipleyiti ezithile zokuqhawula kunye nezixhobo zokubhoboza.
Iintsapho zeChip akufuneki zidityaniswe phantsi kwebango elinye lokuhambelana jikelele. I-MIFARE Classic, i-MIFARE Ultralight, i-NTAG kunye ne-MIFARE DESFire iimveliso zisebenza kwi-ISO/IEC 14443 Uhlobo lwe-A, ngelixa iimveliso ze-ICODE ngokuqhelekileyo zisekelwe kwi-ISO/IEC 15693. I-chip echanekileyo, umfundi, isofthiwe yesicelo kunye neemfuno zokhuseleko kufuneka ziqinisekiswe phambi kokulungiswa kwe-antenna kunye nokuveliswa kobuninzi.
| Uhlobo lweMveliso | I-13.56MHz ye-HF RFID ngaphandle koqhagamshelwano yangaphambili yephepha elifakwe kwi-inlay yokwenziwa kwekhadi leplastiki |
| Ukuphindaphinda | 13.56MHz HF; Iprotocol kunye nojongano lomoya luxhomekeke kwitshiphu ekhethiweyo |
| UYilo olusemgangathweni | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 kunye noyilo ngokwesiko |
| Isalathiso sangoku sokutyeba kwephepha | Malunga ne-0.45 ± 0.02mm kwizakhiwo ezikhethiweyo zeHF; qinisekisa ngetshiphu, i-eriyali, izinto kunye nekhadi lokugqibela |
| Izinto ezisisiseko | I-PVC emhlophe okanye ecacileyo; I-PETG kunye neeprojekthi ezihambelana ne-polycarbonate ezixhomekeke ekuqinisekiseni inkqubo eyahlukileyo |
| Iinketho ze-eriyali | Icingo lobhedu olufakwe ngaphakathi, i-aluminiyam efakiweyo kunye nolwakhiwo oluthile lwe-eriyali yeprojekthi |
| Iinkonzo zeB2B | I-Chip sourcing, uyilo lwe-eriyali, ukulungiswa kweRF, ubunjineli boyilo, iisampulu, iimvavanyo ze-lamination, uvavanyo lombane, iingxelo ze-QC kunye nobonelelo kumazwe angaphandle. |
Cela iisampulu ze-HF RFID Inlay kunye neQuote
I-prelam inlay liphepha eliphakathi lokwenziwa kwekhadi eliqulethe itshiphu yeRFID, uqhagamshelo lwetshiphu ukuya kwi-eriyali kunye nolwakhiwo lwe-eriyali elungelelanisiweyo ngaphakathi kweeleya zeplastiki. Ayilokhadi eliprintiweyo eligqityiweyo. Abavelisi bamakhadi badibanisa i-prelam kunye namaphepha angundoqo aprintiweyo kunye nokugqithisa okucacileyo, emva koko i-laminate, ipholile, i-punch kwaye izenzele amakhadi agqityiweyo.
I-eriyali ifumana amandla kwintsimi yomfundi kwaye idlulisela idatha phakathi komfundi kunye ne-chip edibeneyo. Ukusebenza kwe-RF kuxhomekeke kwijometri ye-eriyali, ukuxhathisa kwe-conductor, amandla etshiphu, iresonance, imathiriyeli yekhadi, intsimbi ekufutshane, ubukhulu bekhadi lokugqibela kunye namandla okufunda.
Amaphepha angundoqo e-PVC aprintiweyo, ii-overlays ezicacileyo, izinto zokuncamathelisa, imigca kazibuthe, iipaneli zokutyikitya kunye nokugqitywa kokukhusela kongeza ubukhulu obujikeleze i-prelam. Ithagethi egqityiweyo ubukhulu bekhadi kufuneka icwangciswe ukusuka kwi-stack epheleleyo kunokuba ukusuka kwigeji ye-prelam yodwa.
Ukutshintsha usapho lwetshiphu, ubungakanani be-eriyali, i-conductor, imathiriyeli yekhadi okanye imeko yekhadi inokutshintsha i-resonance kwaye iguqule ukusebenza kokufunda. Uyilo oluvunyiweyo lwetshiphu enye akufuneki lusetyenziswe ngokuzenzekelayo kwenye itshiphu ngaphandle komlinganiselo weRF.
I-Chip efakwe kwi-HF kunye ne-Antenna Structure
UYilo lwePhepha elinaMakhadi amaninzi lokuLamination
Itshiphu kufuneka ikhethwe kwiprothokholi yokufunda, imfuno yenkumbulo, inqanaba lokhuseleko, isantya sentengiselwano, umjikelo wobomi, isiqinisekiso kunye nenkqubo yendalo. Amagama eebhrendi afana ne-MIFARE, NTAG kunye ne-ICODE ziintsapho zeemveliso kunokuba zitshintshe amagama aqhelekileyo.
| I-Chip Family / Option | Protocol Positioning | Eqhelekileyo yeProjekthi Fit | Inqaku le-B2B ebalulekileyo |
|---|---|---|---|
| Fudan F08 / Ifa elihambelanayo 1K Option | Ngokuqhelekileyo kucelwe kwiinkqubo ezihambelanayo ze-ISO/IEC 14443 Uhlobo A; inombolo yenxalenye echanekileyo kufuneka iqinisekiswe | Ukufikelela kwilifa, ubulungu kunye neeprojekthi ezifakelweyo zokutshintsha umfundi | Qinisekisa umenzi, imemori, i-UID, uqinisekiso, ukuhambelana komfundi kunye nenkcazo yebhrendi esemthethweni |
| MIFARE Classic EV1 1K / 4K | ISO / IEC 14443-3 Uhlobo A, 106kbit / s | Uthutho olukhoyo, amatikiti, ufikelelo kunye neziseko zemidlalo | Usapho lwemveliso yelifa; sebenzisa kuphela apho isixokelelwano esifakelweyo siyifuna khona kwaye uvavanye enye indlela ekhuselekileyo yangoku yoyilo olutsha |
| I-MIFARE Ultralight EV1 | I-ISO/IEC 14443 Uhlobo A lokusingqongileyo | Amatikiti asetyenziswa kancinci, imisitho, ukuthembeka kunye neenkqubo ezilula zokungaqhagamshelwa | Tshatisa inkumbulo, igama lokugqitha kunye neempawu zentsusa kwimodeli yesoyikiso yesicelo |
| NTAG 213 / 215 / 216 | IForam ye-NFC Type 2 Tag kunye ne-ISO/IEC 14443 Uhlobo A | Amakhadi oshishino e-NFC, amakhonkco okuqinisekisa, ukubandakanyeka kweselula kunye neemveliso eziqhagamshelweyo | Inkumbulo yomsebenzisi iyohluka ngokwemodeli; qinisekisa ubukhulu be-NDEF, igama lokugqitha kunye neemfuno zoqobo |
| I-MIFARE DESFRE EV3 | I-ISO/IEC 14443 Uhlobo A iinxalenye 1–4 ezinomgangatho ophezulu wosetyenziso olukhuselekileyo | Ufikelelo olukhuselekileyo, uthutho, ikhampasi, isazisi, ukunyaniseka kunye namakhadi osetyenziso oluninzi | Ifuna ulawulo oluphambili, usetyenziso lomntu siqu kunye nokudibanisa umfundi / isoftwe |
| ICODE SLIX2 / ISO 15693 yoSapho | I-ISO / IEC 15693, iForam yeNFC Uhlobo lwe-5 yokubeka | Ikhadi lendawo, ithala leencwadi, i-asethi, isazisi kunye neeprojekthi ezidityanisiweyo ezide | Ayinakutshintshiselwa nge-ISO/IEC 14443 yodidi A abafundi; qinisekisa umthetho olandelwayo womfundi kunye nobungakanani be-eriyali |
Iimigangatho ezininzi zokungaqhagamshelwa zisebenza kwi-13.56MHz. Umfundi unokuxhasa i-ISO/IEC 14443 Uhlobo A, Uhlobo lwe-B, i-ISO/IEC 15693, iintlobo zethegi yeForam ye-NFC okanye umaleko wesicelo sobunikazi. Ukuphindaphinda kukodwa akwanelanga ukuvuma ukuhambelana.
Ukubhankisha, intlawulo, iinkcukacha zikarhulumente kunye neeprojekthi zothutho ezilawulwayo zinokufuna iitshiphusi eziqinisekisiweyo, inaliti yesitshixo ekhuselekileyo, ukwenziwa okuphicothiweyo, ukuvunywa kwenkqubo kunye novavanyo lwesicelo. I-HF yegeneric inlay akufunekanga ithengiswe njengentlawulo-sele ilungile ngaphandle kwesiqinisekiso esifunekayo.
| iParameter | ekhoyo | yoLawulo lweMveliso yoMkhombandlela |
|---|---|---|
| 2 × 5 Uyilo | Iprototype yohlobo lwe-A4 kunye nemveliso yekhadi elincinci lomthamo | Qinisekisa ubungakanani bephepha elichanekileyo, inani lekhadi kunye namanqaku obhaliso |
| 3 × 7 / 3 × 8 | Uyilo oluqhelekileyo lwamakhadi e-smart kwishishini | Tshatisa iipleyiti zelamination, isixhobo sokubhoboza, iicores eziprintiweyo kunye nesalathiso sokudibanisa |
| 4 × 8 / 4 × 10 / 5 × 5 | Uyilo lwemveliso ephezulu kunye nezixhobo ezijoliswe kubathengi | Lawula intsebenziswano ye-RF phakathi kwee-eriyali ezikufutshane kunye nokuguqulwa kwamaphepha |
| UYilo oluSiko | Imilinganiselo yekhadi eliqhelekileyo, iifobs eziphambili, amakhadi amancinci okanye iifomathi ezikhethekileyo zokubetha | Ukubonelela ngomzobo we-CAD, ulwandlalo lwemveliso egqityiweyo, indawo ye-chip, indawo ye-eriyali kunye nokusikwa kwemvume |
| Prelam Ukutyeba | Isalathiso sephepha langoku malunga ne-0.45 ± 0.02mm; izakhiwo zesiko ezikhoyo | Qinisekisa i-avareji, ukwahluka kwamanqaku, indawo ye-chip-bump kunye nokubalwa kwesitaki sekhadi lokugqibela |
| Izinto eziphathekayo | I-PVC emhlophe, i-PVC ecacileyo kunye neprojekthi ethile ye-PETG okanye izakhiwo ezihambelana ne-PC | Qinisekisa ukucutheka, ukudibanisa, ubushushu, ukulungiswa kweRF kunye nokuqina kwekhadi eligqityiweyo |
Ikhadi le-CR80 / ID-1 eliqhelekileyo lidla ngokuyilwa kufuphi ne-0.76mm, kodwa ukunyamezela okuchanekileyo kuxhomekeke kwikhadi kunye neenkcukacha zezixhobo. Ii-cores eziprintiweyo, ii-overlays zangaphambili nangemuva, i-adhesives kunye nobukhulu be-chip yendawo kufuneka bufakwe ekubaleni.
Ishiti linokuba phakathi kwe-avareji yegeyiji yokunyamezela ngelixa indawo yetshiphu ijiyile ekuhlaleni. Uyilo lwe-Cavity, i-cushioning, uxinzelelo lwe-press kunye nokukhethwa kwe-layer kufuneka kuthintele ama-bumps abonakalayo, ukudibanisa okubuthakathaka kunye nomonakalo we-chip.
| Antenna Factor | Effect kwiKhadi | elifunekayo uQinisekiso |
|---|---|---|
| Ijiyometri yeKhoyili | Ilawula i-inductance, indawo yokudibanisa kunye nemvume yokusika ekhoyo | Tshatisa amandla etshiphu, imilinganiselo yekhadi, umfundi kunye nokusingqongileyo okujoliswe kuko |
| I-Antenna yocingo lobhedu | Ixhasa uyilo lwekhoyili kunye nejometri eguquguqukayo | Idayimitha yocingo, ubunzulu bokufaka, i-crossover, ibhondi edibeneyo kunye nokuqhubeka |
| I-Antenna yeAluminiyam efakiweyo | Ixhasa imveliso ye-eriyali enepateni ephezulu | Landela ububanzi, ukuxhathisa, ukukhuselwa komhlwa, uncamathiselo lwetshiphu kunye nokuziphatha kokulanywa |
| Chip Capacitance | Itshintsha i-resonance ye-eriyali/i-chip circuit | Buyisela kwakhona xa utshintsha usapho lwetshiphu okanye iphakheji |
| Isitaki sekhadi | Iplastiki, i-inki, ifoyile, imizobo eyenziwe ngesinyithi kunye nokwaleka kunokutshintsha ukudibanisa kunye nokukhupha i-eriyali. | Vavanya ikhadi eligqityiweyo, hayi i-prelam engenanto kuphela |
| Sebenzisa Okusingqongileyo | Umphezulu wesinyithi, iifowuni, izipaji, amakhadi akufutshane kunye nolwelo kunokuchaphazela ukusebenza | Vavanya umfundi ocetywayo, imeko yokunyuka kunye nokuphathwa komsebenzisi |
Umgama wokufunda uxhomekeke kwi-chip, indawo ye-eriyali, umgangatho womgangatho, amandla omfundi, i-eriyali yokufunda, iprotocol, ukuqhelaniswa nekhadi, istaki sekhadi lokugqibela kunye nokusingqongileyo. Ucaphulo kufuneka lucacise umfundi wovavanyo kwaye lupasile/lomgama ongaphumeleliyo kunokusebenzisa inani elilinganayo jikelele.
Iintenna kwiphepha elinamakhadi amaninzi zifuna izithuba ezaneleyo ukusuka kwimigca yokusika, imingxuma yokubhalisa kunye neendawo ezikufutshane. Uvavanyo lwe-RF olukwinqanaba leshiti kufuneka luchaze ukudityaniswa kwee-eriyali phambi kokuba amakhadi abethelwe.
| soMaleko | oMsebenzi | woLawulo oluPhambili |
|---|---|---|
| Ukwaleka kwangaphambili | Ikhusela imizobo eprintiweyo kwaye ibonelela ngeglosi, imatte, iqabaka okanye isiphelo sokhuseleko | Ukutyeba, ukudibanisa, ukukrazula kunye nokuhambelana kobuntu |
| Undoqo Oshicilelwe Phambili | Ithwala imizobo esisigxina, umbhalo, uphawu kunye noshicilelo lokhuseleko | Ukubhaliswa koshicilelo, unyango lwe-inki, ukushwabana kunye ne-RF-ekhuselekileyo yentsimbi |
| HF Prelam Inlay | Iqulethe itshiphu, i-eriyali, amalungu ombane kunye namaleko eplastiki axhasayo | Ukulungiswa kweRF, indawo yetshiphu, ubukhulu, ulungelelwaniso, ibhondi kunye nesivuno sombane |
| Umqolo Oshicilelweyo Core | Ulungelelanisa umaleko wangaphambili kwaye uthwale umzobo wecala elingasemva | Ibhalansi yegeyiji, indawo yomgca wemagnethi kunye noshicilelo |
| Ukwaleka ngasemva | Ikhusela umsebenzi wobugcisa kwaye inokubandakanya umgca, ipaneli yotyikityo okanye uphawu lokhuseleko | Ukudityaniswa, ukucaba, ikhowudi kunye nomphezulu wokugqibela |
Iifoyile ezinkulu ezenziwe ngesinyithi, ii-inki eziqhubayo okanye iileya zetsimbi ezikufutshane ne-eriyali zinokunciphisa ukudityaniswa okanye ukulungiswa kokutshintsha. Bandakanya izinto zokuhombisa zokugqibela kwiimvavanyo zeRF kwaye ugcine iindawo ezicacileyo apho zifuneka khona.
Iigeyiji zomaleko ongaphambili nasemva, isikhokelo semathiriyeli kunye noshicilelo kufuneka lulungelelaniswe apho kunokwenzeka. Izitaki ze-asymmetrical zinokuvelisa i-curl yekhadi emva kokufudumeza kunye nokupholisa.
Qinisekisa isitakhi esivunyiweyo: Rekhoda lonke umaleko, undoqo oshicilelweyo, inyayi, into encamathelayo, imigca kunye nomaleko wokhuseleko.
Imeko kuwo onke amaphepha: Zinzise imathiriyeli kwindawo yemveliso kwaye uzigcine zicocekile, zisicaba kwaye zomile.
Qinisekisa ukuqhelaniswa: Tshatisa iphepha lephepha, inowuthi yekhadi, indawo yetshiphu, indawo ye-eriyali, umsebenzi wobugcisa kunye namanqaku okungqinga.
Phuhlisa umjikelo we-lamination: Misa ubushushu, uxinzelelo, ukuhlala, ukugqiba ipleyiti, ukukhutshwa kweshiti kunye nokupholisa kwesona sitaki semathiriyeli.
Khusela indawo ye-chip: Lawula uxinzelelo lwendawo kwaye ugweme amasuntswana aqinileyo, iziphene zeplate okanye ukuhamba okugqithisileyo kwe-IC.
Ukupholisa phantsi koxinzelelo olulawulwayo: Ukupholisa kuphembelela ukucaba, ukunamathela kwingqimba, uxinzelelo lwetshiphu kunye nokuzinza komda.
Uvavanyo ngaphambi kokubetha: Khangela umsebenzi wombane wenqanaba leshidi, inkangeleko, ubukhulu, ukudibanisa kunye nokubhaliswa.
Uvavanyo lwamakhadi agqityiweyo: Punch, lungisa kwaye uqinisekise ukusebenza kweRF, imilinganiselo, ukugoba kunye nokuhambelana kwesicelo.
| Lamination Risk | enokwenzeka Isizathu | sokuLuleka |
|---|---|---|
| Ukusilela kweChip | Ukushisa okugqithisileyo, uxinzelelo lwendawo, umonakalo we-electrostatic okanye uxhumano lwe-chip olubuthathaka | Phonononga imida yephakheji ye-chip, uxinzelelo lwenkqubo, ulawulo lwe-ESD kunye nomgangatho woqhagamshelwano |
| Vula iSekethe ye-Antenna | I-conductor eyaphukileyo, i-joint embi, umonakalo wokusika okanye ukolula okugqithisileyo | Hlola ukuqhubeka, indlela yomqhubi, ukukhutshwa kwenqindi kunye noxinzelelo lomatshini |
| Uluhlu lokufunda olubuthathaka | I-detuning, ilahleko ye-conductor, ukungafani komfundi, umzobo owenziwe ngesinyithi okanye utshintsho lwekhadi-stack | Ukulinganisa i-resonance kunye nohlengahlengiso usebenzisa ikhadi eligqityiweyo kunye nesifundi ekujoliswe kuso |
| I-Chip Bump ebonakalayo | Imbuyekezo engonelanga, ubukhulu bemodyuli egqithisileyo okanye uxinzelelo olungalinganiyo | Lungiselela imingxunya yasekhaya, iigeyiji zomaleko, i-cushioning kunye neemeko zokucinezela |
| I-Delamination | Ukungcola, izinto ezingahambelaniyo, ukushisa okuphantsi okanye ukupholisa kakubi | Hlaziya ukuhambelana kwezinto, ukucoceka, umjikelo kunye nokusebenza kwe-peel |
| Iphepha okanye iKhadi leWarpage | Isitaki esingalungelelananga, ubushushu obugqithisileyo, uxinzelelo olungalinganiyo okanye ukupholisa ngokukhawuleza okungalawulekiyo | Ukulinganisa iileya kunye nokwandisa ukufudumeza, ukucaca kwepleyiti kunye nokupholisa |
| Into | ecetyiswayo kuLawulo lwe-B2B |
|---|---|
| Isazisi seChip | Qinisekisa umenzi, inani elichanekileyo, imemori, ukhetho lwe-UID, iprotocol kunye nokulandelelwa kweqashiso |
| Umsebenzi woMbane | Funda i-UID yetshiphu, imemori okanye umyalelo ochaziweyo oseti kwindawo nganye yekhadi ngokwesicwangciso sokuhlola |
| Ukuqhubekeka kwe-antenna | Khangela iisekethe ezivulekileyo, iifutshane, amajoyina abuthathaka, iziphene zomqhubi kunye nee-crossovers ezonakalisiweyo |
| Resonance / RF Performance | Ukulinganisa ipharamitha yeRF ekuvunyelwene ngayo okanye umgama osebenzayo wokufunda usebenzisa izixhobo zovavanyo ezichaziweyo kunye nesixhobo |
| Isikhundla seChip kunye ne-Antenna | Jonga indawo ekuyo ngokuchasene neCAD, ulwandlalo lwekhadi, ipunch clearance kunye nee-eriyali ezingabamelwane |
| Imilinganiselo yePhepha | Ubude, ububanzi, isikwere, i-pitch yekhadi, imingxuma yokubhalisa kunye nomgangatho we-edge |
| Ukutyeba kunye noBucaba | Umndilili wobunzima, ubukhulu bendawo yetshiphu-zone, i-curl, isaphetha kunye ne-point-to-point umahluko |
| UHlolo Olubonwayo | Usulelo, amaqamza, imibimbi, amabala amnyama, ukuba sesichengeni somqhubi, imikrwelo kunye neziphene zomaleko |
| UVavanyo lweKhadi eligqityiweyo | Umsebenzi we-RF, imilinganiselo, ubukhulu, ukugoba, ukukrazula, ubushushu, ukufuma, amaxolo kunye nokuhambelana komfundi |
| Ukulandeleka | Iqashiso leChip, i-antenna lot, PVC lot, umhla wokuvelisa, uyilo, inkqubo yovavanyo, inombolo yephepha kunye nerekhodi yokupakisha |
Uhlolo olupheleleyo lunokubhekisa kuvavanyo lokufunda umbane kwindawo nganye, ngelixa uvavanyo lwe-dimensional, peel and wonakalisayo luqhele ukwenziwa iisampulu. Inkcazo yokuthenga kufuneka ichaze izinto zovavanyo, ukulungiswa, iinqobo zokwamkelwa, isicwangciso sesampulu kunye nengxelo.
I-prelam inokudlula uvavanyo lombane kwaye isahluleke emva kobushushu obugqithisileyo, uxinzelelo, ukubetha okanye ukwenza umntu. Isiqinisekiso se-B2B kufuneka siquke zombini i-inlay-inlay kunye nokusebenza kwekhadi eligqityiweyo.
| Application | Chip / iProtocol Direction | eBalulekileyo |
|---|---|---|
| Amakhadi oMsebenzi kunye noFikelelo | Uhlobo lweLifa A, i-MIFARE Plus okanye i-DESFFire ngokwenkqubo yofikelelo efakiweyo | Ukuhambelana komfundi, ulawulo oluphambili, ukubhaliswa kunye nokugoba kwansuku zonke |
| Amakhadi angundoqo ehotele | I-chip efunwa liqonga lokutshixa ihotele | Isifaki khowudi sokutshixa, inkqubo yolawulo lweendwendwe, ubukhulu bekhadi kunye nokuba sesichengeni sokufuma |
| Amakhadi ezoThutho kunye neKhampasi | Khusela i-chip yezicelo ezininzi ezifana ne-DESFire apho uyilo lwenkqubo lufuna khona | Isantya sentengiselwano, ukhuseleko, ilifa lomfundi, ukwenziwa komntu kunye nomjikelo wobomi |
| Amakhadi obulungu kunye nokunyaniseka | Uhlobo lwememori ye-chip, i-NTAG okanye i-chip ekhuselekileyo yesicelo ngokoyilo lwenkqubo | Ukufunda okanye ukuhambelana kwefowuni, isiseko sedatha, ubumfihlo kunye nokusetyenziswa okuphindaphindiweyo |
| I-NFC Business and Marketing Cards | I-NTAG okanye enye iQonga le-NFC ehambelanayo chip | Umthamo we-NDEF, ukuhambelana kwefowuni, ukhuseleko lwe-URL kunye nesimo sokuskena |
| AmaKhadi eThala leeNcwadi, iAsethi kunye neNdawo | ISO / IEC 15693 / ICODE-uhlobo lwesisombululo | Iprothokholi yokufunda, ubungakanani be-antenna, uluhlu olujoliswe kuyo, ukuchasana nokungqubana kunye neemfuno ze-EAS |
| Ukhuseleko lwesazisi kunye neeProjekthi zeNtlawulo | I-chip eqinisekisiweyo ekhuselekileyo kunye nolwakhiwo oluvunyiweyo lwesicelo | Izatifikethi, inaliti engundoqo, isixokelelwano sobonelelo esiphicothiweyo kunye nokuvunywa kwenkqubo ethile |
Izicelo ze-HF RFID Inlay yeeNkqubo zeSmart Card
| weDatha / iMfuneko ye- | B2B yoKhuseleko |
|---|---|
| I-UID | Qinisekisa ubude be-UID, ukuziphatha okuzinzileyo okanye okungahleliwe kwe-ID, ifomathi yedathabheyisi kunye nenkxaso yomfundi |
| Ufakelo lweekhowudi kwiMemori | Chaza ubume bedatha, amacandelo/iifayile/amaphepha, irekhodi yeNDEF, amasuntswana okutshixa kunye nokuqinisekisa |
| Amaqhosha oQinisekiso | Chaza ubunini obuphambili, inkqubo yokutofa, ukukhuselwa kwezothutho, ukwahlukahlukana kunye nomkhondo wophicotho |
| Igama lokugqithisa / Uqwalaselo loFikelelo | Cacisa igama eliyimfihlo, iibhithi zokufikelela, izinto zokubala, iitshekhi zoqobo kunye novavanyo lwemeko yokutshixa apho kuxhaswa khona |
| Idatha eShicileleyo eguquguqukayo | Xhuma inombolo eprintiweyo, ikhowudi yebhakhowudi okanye ikhowudi yeQR kwidatha yechip ngoxolelwaniso olulawulwayo |
| Amakhadi awaliweyo | Yahlula, ubale kwaye utshabalalise ngokukhuselekileyo amakhadi aqulathe izitshixo eziphilayo, izichazi okanye idatha ekhowudiweyo |
Inkqubo enika ufikelelo kuphela kwisichongi esifundeka esidlangalaleni sinokuba sesichengeni sokukopa okanye ukuxelisa. Iiprojekthi ezijonga ukhuseleko kufuneka zisebenzise i-chip kunye ne-backend architecture exhasa ungqinisiso olufanelekileyo lwe-cryptographic.
Ukubonelela ngetshiphu ekhuselekileyo ayiquki ngokuzenzekelayo ukusetwa kwesicelo okanye ulawulo lwesitshixo. Chaza ukuba ngubani odala, ogcinayo, ulayisha kwaye uqinisekisa izitshixo, kunye nokuba indawo ephicothiweyo yokhuseleko-yobuqu iyafuneka.
Ikhadi le-smart hybrid linokudibanisa i-HF kunye ne-LF, i-UHF, i-chip yoqhagamshelwano okanye esinye isicelo se-HF. Ezi zakhiwo zifuna indawo eyongezelelweyo, ukwahlukana ngokucophelela kwe-eriyali, ulawulo olongezelelweyo lwendawo kunye neprogram yokuvavanya kunye nenkqubo yokuvavanya.
| ISakhiwo seHybrid | Use Case | Engineering Risk |
|---|---|---|
| LF + HF | Ukufuduka ukusuka kwilifa elikufutshane ukufikelela kwiinkqubo ze-HF smart-card | Isithuba se-antenna, ukusebenzisana, ubukhulu bekhadi kunye novavanyo lokufunda kabini |
| HF + UHF | Isazisi soluhlu olufutshane kunye nokulandelwa kuluhlu olude | Iinkqubo ezahlukeneyo ze-antenna, iziphumo zempahla kunye novelwano lwe-UHF kufutshane nomzimba okanye isinyithi |
| IiChips ezimbini zeHF | Ukwahlula izicelo okanye iindawo ezizimeleyo ezikhuphayo | Ukukhetha umfundi, ukudityaniswa kwe-eriyali, ubunini bedatha kunye nemiqobo yokwakheka kwekhadi |
| Qhagamshelana + Ukungaqhagamshelwa | Isazisi esikhuselekileyo esijongana kabini, umnxeba okanye uyilo lwentlawulo | Imodyuli yemodyuli, uqhagamshelo lwe-eriyali, i-lamination, isiqinisekiso kunye nobuntu |
I-prelam eqhelekileyo ye-single-frequency ye-HF akufuneki ichazwe njengexhasa ngokuzenzekelayo i-LF okanye i-UHF. Ulwakhiwo olusebenza ngokuphindaphindiweyo ludinga olwabo umzobo, uludwe lwetshiphu, uvavanyo lweRF, ukucaciswa kobukhulu kunye nexabiso.
Gcina amaphepha e-prelam acwebileyo kwindawo evaliweyo, ecocekileyo kwaye eyomileyo kude nelanga kunye nobushushu.
Sebenzisa iibhodi eziqinileyo, iibhokisi ezidibeneyo nezikhuselweyo ukuthintela ukugoba, imikrwelo kunye noxinzelelo lwe-chip-zone.
Kuphephe ukukhupha okuqinileyo kwe-electrostatic kwaye usebenzise ulawulo lokuphatha olufanelekileyo lwe-ESD apho kuyimfuneko.
Musa ukubeka imithwalo enzima engalinganiyo kwi-sheet stack okanye uvumele i-pallet overhang.
Izinto zokubeka imo kwigumbi lokuhlambela phambi kokulungiswa xa indawo yokugcina kunye neemeko zokuvelisa zahlukile.
Chonga yonke ipakethe ngemodeli yetshiphu, uyilo lwe-eriyali, uyilo, ubukhulu, ibhetshi kunye nobume bokuhlolwa.
Sebenzisa i-first-in, i-inventory yokuqala kunye nemathiriyeli yokuvavanya kwakhona emva kokugcinwa ixesha elide okanye ukubonakaliswa kwezithuthi.
Ukupakishwa kweFlat eKhuselweyo yeHF RFID Prelam Sheets
Imveliso ye-prelam ethembekileyo idinga ukufakwa okanye ukubethelwa kwe-eriyali elawulwayo, ukudibanisa i-chip, ukubhaliswa kwamaphepha, i-lamination yeplastiki, ukuvavanywa kombane, ukuhlolwa kwe-dimensional, ukuphathwa okucocekileyo kunye nokulandelwa kwebhetshi. Itshiphu evunyiweyo, umzobo we-eriyali kunye nendlela yovavanyo lweRF kufuneka zihlale zingatshintshi ukuze ziphinde iiodolo ngaphandle kokuba utshintsho olulawulwayo kuvunyelwene ngalo.
Iprojekthi yeRFID Inlay kunye neQela lobuGcisa
Prelam Inlay Production Workshop
I-antenna kunye noLawulo lweNkqubo yokuNgena
UHlolo loMbane kunye neDimensional
Ukukhetha i-chip esekelwe kwisicelo: Ukufikelela kwifa, i-NFC, i-multi-application ekhuselekileyo kunye neeprojekthi ze-ISO 15693 zinokwahlulwa ngeprotocol kunye nesidingo sokhuseleko.
Ubunjineli be-antenna yesiko: Ijiyometri yekhoyili, i-conductor, i-chip capacitance, ulwandlalo lwekhadi kunye nesifundi ekujoliswe kuso sinokujongwa kunye.
Uyilo lwamaphepha aguquguqukayo: Ulungiselelo oluqhelekileyo lwamakhadi amaninzi kunye neepitshi zamakhadi axhomekeke kumthengi ziyafumaneka.
Ukuhlanganiswa kwezinto zekhadi: I-PVC i-prelam inokulungelelaniswa kunye neengqungquthela eziprintiweyo, ii-overlays, imivimbo yamagnetic kunye nezakhiwo zekhadi ezigqityiweyo.
Inkxaso yokufaneleka: Iisampulu, iimvavanyo ze-lamination, uvavanyo lwe-RF, iitshekhi ezinobunzima kunye nokuqinisekiswa kwekhadi eligqityiweyo kunciphisa umngcipheko weprojekthi.
Ubonelelo nge-B2B yomzi-mveliso: Ifanelekile kwiifektri zamakhadi e-smart, abashicileli, abaguquli, abahlanganisi benkqubo, abakhuphi, abarhwebi kunye nabasasazo.
Usetyenziso, uphawu lomfundi/imodeli, iprotocol kunye neqonga lesoftware elifakiweyo.
Kanye umenzi wetshiphu kunye nenxalenye yenombolo, imemori, i-UID kunye neemfuno zokhuseleko.
Uyilo lwephepha, imilinganiselo epheleleyo, inowuthi yekhadi, amanqaku obhaliso kunye nobungakanani.
Ubungakanani bekhadi, indawo ecacileyo ye-eriyali, indawo yetshiphu kunye nomzobo wokubetha.
Izinto ze-Prelam, umbala, ubukhulu begama kunye nokunyamezela.
Itekhnoloji ye-antenna, i-resonance ekujoliswe kuyo okanye uvavanyo olusebenzayo loluhlu lokufunda.
Ukupakishwa kwekhadi lokugqibela, iicores eziprintiweyo, ii-overlays, i-metallic printing, imigca okanye ipaneli yotyikityo.
I-Lamination press, ubushushu, uxinzelelo, ukuhlala, ukupholisa kunye nobukhulu beepleyiti.
Uvavanyo lombane, uvavanyo lweRF, ukuhlolwa komgangatho kunye neendlela zokwamkelwa.
Ukufakwa kweekhowudi, inaliti engundoqo, uluhlu lwe-UID, idatha eguquguqukayo okanye ulungelelwaniso lwedatha.
Ubungakanani beprototype, uqikelelo lonyaka, ishedyuli yokuphinda-odola kunye neemfuno zolawulo lotshintsho.
Ukupakishwa, amaxwebhu okuhlola, izibuko kunye nomhla wokuhanjiswa oceliweyo.
Xoxa ngeProjekthi yakho ye-HF RFID Inlay
Liphepha elingundoqo lokwenziwa kwekhadi eliqulethe i-chip ye-13.56MHz kunye ne-eriyali ngaphakathi kweplastiki. I-laminated nge-cores eprintiweyo kunye ne-overlays ukuvelisa amakhadi agqityiweyo angenasiphelo.
Hayi. I-prelam ngumaleko osebenzayo ophakathi. Amakhadi agqityiweyo afuna ushicilelo olongezelelweyo, ii-overlays, i-lamination, ukupholisa, ukubethelwa kunye nokuzikhethela okanye ukufakwa kweekhowudi.
Iiprojekthi zingasebenzisa i-ISO/IEC 14443 Uhlobo A, Uhlobo lwe-B, i-ISO/IEC 15693 okanye iichips ezihambelana neForam ye-NFC. Umgaqo ochanekileyo uxhomekeke kwi-IC ekhethiweyo kunye nenkqubo yokufunda.
Hayi. Ziintsapho ezahlukeneyo zeemveliso ezineeprothokholi ezahlukeneyo, inkumbulo, imiyalelo, ukhuseleko kunye nezicelo. Qinisekisa itshiphu echanekileyo kunye nomfundi phambi koku-odola.
Iinketho ezinjalo ze-1K ezihambelana nelifa zinokuxoxwa. Nikeza ngeyona mfuno yetshiphu echanekileyo kunye nesampulu yokufunda, kuba umenzi, i-UID, inkumbulo kunye nokuhambelana koqinisekiso kufuneka kuqinisekiswe.
Ihlala ifanelekile kwiinkqubo zelifa ezifakiweyo, kodwa iiprojekthi zanamhlanje ezikhuselekileyo kufuneka zivavanye ezinye iindlela zangoku ezifana ne-MIFARE DESFire okanye i-MIFARE Plus ngokwenkqubo yolwakhiwo.
I-NTAG 213, i-215 okanye i-216 kunye nezinye iitshiphusi ezihambelanayo zeForam ye-NFC ziinketho eziqhelekileyo. Khetha imodeli kwimemori ye-NDEF efunekayo, ukuhambelana kwefowuni kunye neempawu zokhuseleko.
I-chip ye-multi-application chip ekhuselekileyo efana ne-MIFARE DESFire inokufaneleka, kodwa inkxaso yomfundi, ulawulo oluphambili, isatifikethi, iifayile zesicelo kunye nesofthiwe kufuneka ziqinisekiswe.
I-ISO/IEC 15693 isetyenziselwa usetyenziso lwekhadi lendawo apho umfundi, ubungakanani be-eriyali kunye nomgama wokudityaniswa okujoliswe kuwo kwahluka kwiinkqubo zamakhadi okufutshane asekelwe kwi-ISO/IEC 14443.
Iinketho eziqhelekileyo ziquka i-2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kunye ne-4 × 10. Uyilo oluqhelekileyo lunokuveliswa kwi-lamination yomthengi kunye ne-punching drawing.
Iphepha lemveliso yangoku libhekisela malunga ne-0.45 ± 0.02mm kwizakhiwo ezikhethiweyo zeHF. Ubukhulu bokugqibela buxhomekeke kwitshiphu, i-eriyali, imathiriyeli, isitakhi sekhadi kunye neemfuno zendawo yetshiphu.
Ewe. Ukubonelela ngethagethi egqityiweyo yobukhulu bekhadi, i-overlay kunye ne-printed-core gauges, iphakheji ye-chip kunye nenkqubo ye-lamination ukuze i-stack epheleleyo ingabalwa.
Ewe. Ijometri ye-antenna inokuphuhliswa malunga ne-chip capacitance, ubungakanani bekhadi, umfundi, ukusebenza okujoliswe kuyo, indawo ye-chip kunye nokukhutshwa kokusika.
Izinketho ezifakwe kwi-copper-wire kunye ne-etched-aluminium zingaxoxwa. Olona lwakhiwo lungcono luxhomekeke kumthamo, ukumelana, ubukhulu, ukudityaniswa, ukuyilwa kwekhadi kunye nethagethi yeRF.
Akukho luhlu lwendalo yonke. Kuxhomekeke kwitshiphu, i-eriyali, umfundi, isitaki sekhadi, ukuqhelaniswa nokusingqongileyo. Chaza umfundi wovavanyo kunye nomgama omncinci osebenzayo.
Ingasetyenziswa emva kovavanyo lweRF. Ifoyile enkulu yesinyithi okanye i-inki eqhubayo kufutshane ne-eriyali inokudityaniswa okanye ikhusele ujongano olungenanxibelelwano.
Izakhiwo zemathiriyeli ezizezinye zinokujongwa kwakhona, kodwa ukushwabana, ukudityaniswa, ubushushu be-lamination, ukulungiswa kweRF kunye nokuqina kwekhadi eligqityiweyo kufuneka kuqinisekiswe ngokwahlukeneyo.
I-prelam idla ngokubonelelwa njengondoqo ongasebenziyo. Ukushicilelwa ngokuqhelekileyo kusetyenziswa kumaphepha angundoqo ahlukeneyo, nangona ulwakhiwo oluthile lweprojekthi lunokuxoxwa.
Akukho sicwangciso selizwe lonke kufuneka sipapashwe kwisakhiwo ngasinye. Phuhlisa ubushushu, uxinzelelo, ukuhlala kunye nokupholisa malunga ne-PVC ngqo, i-overlay, i-inki, i-chip kunye nokwakhiwa kwe-eriyali.
Sebenzisa ukupakishwa kwe-chip ehambelanayo, ubukhulu bendawo obulawulwayo, iipleyiti ezicocekileyo, uxinzelelo olulungeleleneyo, umjikelo wobushushu ovunyiweyo kunye novavanyo lombane ngaphambi nangemva kokulanyiswa.
Uvavanyo olupheleleyo lombane lunokuchazwa. Isivumelwano sokuthenga kufuneka sichaze ukuba yeyiphi imiyalelo etshekishwayo kwindawo nganye kwaye zeziphi iimvavanyo ezitshabalalisayo okanye ezinobungakanani obusebenzisa iisampulu.
Ukufundwa kwe-UID, ukufakwa kweekhowudi kwimemori, ukubhala kwe-NDEF okanye ukwenza isicelo ngokwaso kunokuxoxwa. Iinkonzo ze-Secure-key zifuna inkcazo elawulwayo eyahlukileyo.
Uyilo lweHybrid lunokuphuhliswa njengemveliso eyahlukileyo. Zifuna ii-eriyali ezizinikezelekileyo zoyilo, ukucwangcisa ubukhulu, iimvavanyo zomfundi kunye namaxabiso.
Ewe. Inkqubo ekhethwayo kukuvavanya i-prelam, ukulalisa isitaki sekhadi elipheleleyo, amakhadi epunch kunye nokuqinisekisa iRF, ukusebenza koomatshini kunye nokwenza umntu.
I-MOQ ixhomekeke ekufumanekeni kwe-chip, isixhobo se-antenna yesiko, ukwakheka, izinto eziphathekayo, ubukhulu, inkqubo yokuvavanya, i-encoding kunye nokuba uyilo oluqhelekileyo oluvunyiweyo lunokusetyenziswa.
Nika eyona chip, umfundi, iprothokholi, uyilo, ubungakanani beshiti, umzobo wekhadi, ubukhulu, i-eriyali ekujoliswe kuyo, istaki sekhadi lokugqibela, iimvavanyo, ubungakanani, ukupakishwa kunye nendawo ekuyiwa kuyo.
Qhagamshelana neWallis Plastic kulungiselelwa i-13.56MHz HF RFID PVC prelam inlay sheets ukufikelela, i-ID, ihotele, ubulungu, uthutho, i-NFC kunye nokuveliswa kwe-smart-card. Iqela lethu lixhasa ukhetho lwe-chip, uyilo lwe-eriyali, ukwakheka kweshiti, ukulungiswa kwe-RF, ukuvavanywa kwe-lamination, uvavanyo lombane, ukufakwa kweekhowudi, ukucaciswa komgangatho kunye nobonelelo lwe-B2B ngqo kumzi-mveliso.
