Inlay / prelam
Wallis
| Ubungakanani: | |
|---|---|
| Ukufumaneka: | |
| Ubungakanani: | |
I-Wallis 13.56MHz HF RFID PVC i-prelam inlay sheets yenziwe njengondoqo osebenzayo wamakhadi angena-contactless, amakhadi e-ID, amakhadi okufikelela, amakhadi angundoqo ehotele, amakhadi obulungu, amakhadi okuthutha kunye neenkqubo zekhadi ze- NFC . Iphepha ngalinye lidibanisa i-chip ekhethiweyo HF kunye ne-eriyali ngaphakathi kwesakhiwo esilawulwayo PVC , esilungele ukugqitywa kwekhadi-umzimba wokugqibela, ukuprintwa, ukubethelwa kunye nokuzenzela.
Iiprojekthi ze-B2B zinokulungiswa ngokwemodeli yetshiphu, iprothokholi, inkumbulo, ijometri ye-eriyali, ubungakanani beshiti, uyilo lwekhadi, ubukhulu be-inlay, indawo yetshiphu, imathiriyeli, ukwakhiwa kwekhadi lokugqibela kunye nokupakishwa. Iimbekiselo zoyilo olusemgangathweni zibandakanya i-2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kunye ne-4 × 10, kunye noyilo lwekhadi le-multi-card elikhoyo kwiipleyiti ezithile ze-lamination kunye nezixhobo zokubhoboza.
Iintsapho zeChip akufuneki zidityaniswe phantsi kwebango elinye lokuhambelana jikelele. I-MIFARE Classic, i-MIFARE Ultralight, i-NTAG kunye ne-MIFARE DESFire iimveliso zisebenza kwindawo ye- ISO / IEC 14443 Uhlobo lwe-A, ngelixa iimveliso ze-ICODE zisekelwe ngokuqhelekileyo kwi- ISO /IEC 15693. I-chip echanekileyo, umfundi, isofthiwe yesicelo kunye nemfuneko yokhuseleko kufuneka iqinisekiswe phambi kokulungiswa kwe-antenna kunye nokuveliswa kobuninzi.
| Uhlobo lweMveliso | 13.56MHz HF RFID ngaphandle kokuqhagamshelwa kwi-inlay sheet yokwenziwa kwekhadi leplastiki |
| Ukuphindaphinda | 13.56MHz HF ; Iprotocol kunye nojongano lomoya luxhomekeke kwitshiphu ekhethiweyo |
| UYilo olusemgangathweni | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 kunye noyilo ngokwesiko |
| Isalathiso sangoku sokutyeba kwephepha | Ngokumalunga ne-0.45 ± 0.02mm yezakhiwo ezikhethiweyo HF ; qinisekisa ngetshiphu, i-eriyali, izinto kunye nekhadi lokugqibela |
| Izinto ezisisiseko | Mhlophe okanye elubala PVC ; PETG kunye neeprojekthi ezihambelana ne-polycarbonate eziphantsi kokuqinisekiswa kwenkqubo eyahlukileyo |
| Iinketho ze-eriyali | Icingo lobhedu olufakwe ngaphakathi, i-aluminiyam efakiweyo kunye nolwakhiwo oluthile lwe-eriyali yeprojekthi |
| Iinkonzo zeB2B | I-Chip sourcing, uyilo lwe-eriyali, ukulungiswa kweRF, ubunjineli boyilo, iisampulu, iimvavanyo ze-lamination, uvavanyo lombane, iingxelo ze-QC kunye nobonelelo kumazwe angaphandle. |
Isicelo HF RFID Inlay Iisampulu kunye neQuote
I-prelam inlay yi-intermediate card-menufacturing sheet equlethe i- RFID i-chip, i-chip-to-antenna uqhagamshelo kunye nesakhiwo se-eriyali esilungisiweyo ngaphakathi kweeleya zeplastiki. Ayilokhadi eliprintiweyo eligqityiweyo. Abavelisi bamakhadi badibanisa i-prelam kunye namaphepha angundoqo aprintiweyo kunye ne-transparent Filamu ya overlay s, emva koko i-laminate, ipholile, i-punch kwaye izenzele amakhadi agqityiweyo.
I-eriyali ifumana amandla kwintsimi yomfundi kwaye idlulisela idatha phakathi komfundi kunye ne-chip edibeneyo. Ukusebenza kwe-RF kuxhomekeke kwijometri ye-eriyali, ukuxhathisa kwe-conductor, amandla etshiphu, iresonance, imathiriyeli yekhadi, intsimbi ekufutshane, ubukhulu bekhadi lokugqibela kunye namandla okufunda.
Amaphepha ashicilelweyo PVC angundoqo, akhanyelayo Filamu ya overlay s, izinto zokuncamathelisa, imigca kazibuthe, iiphaneli zesignesha kunye nokugqitywa kokukhusela kongeza ubukhulu obujikeleze i-prelam. Ithagethi egqityiweyo ubukhulu bekhadi kufuneka icwangciswe ukusuka kwi-stack epheleleyo kunokuba ukusuka kwigeji ye-prelam yodwa.
Ukutshintsha usapho lwetshiphu, isayizi ye-eriyali, i-conductor, imathiriyeli yekhadi okanye imeko yekhadi inokutshintsha i-resonance kwaye iguqule ukusebenza kokufunda. Uyilo oluvunyiweyo lwetshiphu enye akufuneki lusetyenziswe ngokuzenzekelayo kwenye itshiphu ngaphandle komlinganiselo weRF.
Ifakwe HF IChip kunye neSakhiwo se-antenna
UYilo lwePhepha elinaMakhadi amaninzi lokuLamination
I-chip kufuneka ikhethwe kwiprothokholi yokufunda, imfuno yememori, inqanaba lokhuseleko, isantya sentengiselwano, umjikelo wobomi, isiqinisekiso kunye nenkqubo yendalo. Amagama eebhrendi afana ne-MIFARE, NTAG kunye ne-ICODE ziintsapho zeemveliso kunokuba zitshintshe amagama aqhelekileyo.
| I-Chip Family / Option | Protocol Positioning | Eqhelekileyo yeProjekthi Fit | Inqaku le-B2B ebalulekileyo |
|---|---|---|---|
| Fudan F08 / Ifa elihambelanayo 1K Option | Ngokuqhelekileyo ukucelwa kwiinkqubo ezihambelanayo ze- ISO /IEC 14443 Uhlobo A; inombolo yenxalenye echanekileyo kufuneka iqinisekiswe | Ukufikelela kwilifa, ubulungu kunye neeprojekthi ezifakelweyo zokutshintsha umfundi | Qinisekisa umenzi, imemori, i-UID, uqinisekiso, ukuhambelana komfundi kunye nenkcazo yebhrendi esemthethweni |
| MIFARE Classic EV1 1K / 4K | ISO /IEC 14443-3 Uhlobo A, 106kbit/s | Izithuthi ezikhoyo, amatikiti, ufikelelo kunye neziseko zemidlalo | Usapho lwemveliso yelifa; sebenzisa kuphela apho isixokelelwano esifakelweyo siyifuna khona kwaye uvavanye enye indlela ekhuselekileyo yangoku yoyilo olutsha |
| I-MIFARE Ultralight EV1 | ISO /IEC 14443 Uhlobo lokusingqongileyo | Amatikiti asetyenziswa kancinci, imisitho, ukuthembeka kunye neenkqubo ezilula zokungaqhagamshelwa | Tshatisa inkumbulo, igama lokugqitha kunye neempawu zentsusa kwimodeli yesoyikiso yesicelo |
| NTAG 213 / 215 / 216 | NFC Uhlobo lweForam 2 Tag kunye ISO /IEC 14443 Uhlobo A | NFC amakhadi oshishino, amakhonkco okuqinisekisa, uthethathethwano lweselula kunye neemveliso eziqhagamshelweyo | Inkumbulo yomsebenzisi iyohluka ngokwemodeli; qinisekisa ubungakanani be-NDEF, igama lokugqitha kunye neemfuno zoqobo |
| I-MIFARE DESFRE EV3 | ISO /IEC 14443 Uhlobo A iinxalenye 1–4 ezinomgangatho ophezulu wosetyenziso olukhuselekileyo | Ukufikelela ngokukhuselekileyo, uthutho, ikhampasi, isazisi, ukuthembeka kunye namakhadi osetyenziso oluninzi | Ifuna ulawulo oluphambili, usetyenziso lomntu siqu kunye nokudibanisa umfundi / isoftwe |
| ICODE SLIX2 / ISO 15693 Sapho | ISO /IEC 15693, NFC Uhlobo lweForam ye-5 yokubeka | Ikhadi lendawo, ithala leencwadi, i-asethi, isazisi kunye neeprojekthi ezidityanisiweyo ezide | Ayinakutshintshelwa ISO /IEC 14443 Uhlobo A abafundi; qinisekisa umthetho olandelwayo womfundi kunye nobungakanani be-eriyali |
Iimigangatho ezininzi zokungaqhagamshelwa zisebenza kwi-13.56MHz. Umfundi unokuxhasa ISO /IEC 14443 Uhlobo A, Uhlobo lwe-B, ISO /IEC 15693, NFC Iintlobo zethegi zeForam okanye umaleko wesicelo sobunikazi. Ukuphindaphinda kukodwa akwanelanga ukuvuma ukuhambelana.
Ukubhankisha, intlawulo, iinkcukacha zikarhulumente kunye neeprojekthi zothutho ezilawulwayo zinokufuna iitshiphusi eziqinisekisiweyo, inaliti yesitshixo ekhuselekileyo, ukwenziwa okuphicothiweyo, ukuvunywa kwenkqubo kunye novavanyo lwesicelo. Igeneric HF inlay akufunekanga ithengiswe njengentlawulo-sele ilungile ngaphandle kwesiqinisekiso esifunekayo.
| iParameter | ekhoyo | yoLawulo lweMveliso yoMkhombandlela |
|---|---|---|
| 2 × 5 Uyilo | Iprototype yohlobo lwe-A4 kunye nemveliso yekhadi elincinci lomthamo | Qinisekisa ubungakanani bephepha elichanekileyo, inani lekhadi kunye namanqaku obhaliso |
| 3 × 7 / 3 × 8 | Uyilo oluqhelekileyo lwamakhadi e-smart kwishishini | Tshatisa iipleyiti zelamination, isixhobo sokubhoboza, iicores eziprintiweyo kunye nesalathiso sokudibanisa |
| 4 × 8 / 4 × 10 / 5 × 5 | Uyilo lwemveliso ephezulu kunye nezixhobo ezijoliswe kubathengi | Lawula intsebenziswano ye-RF phakathi kwee-eriyali ezikufutshane kunye nokuguqulwa kwamaphepha |
| UYilo oluSiko | Imilinganiselo yekhadi eliqhelekileyo, iifobs eziphambili, amakhadi amancinci okanye iifomathi ezikhethekileyo zokubetha | Nikeza umzobo we-CAD, ulwandlalo lwemveliso egqityiweyo, indawo yetshiphu, indawo ye-eriyali kunye nemvume yokusika |
| prelam Ukutyeba | Isalathiso sephepha langoku malunga ne-0.45 ± 0.02mm; izakhiwo zesiko ezikhoyo | Qinisekisa i-avareji, ukwahluka kwamanqaku, indawo ye-chip-bump kunye nokubalwa kwesitaki sekhadi lokugqibela |
| Izinto eziphathekayo | Mhlophe PVC , esobala PVC kunye neprojekthi ethile PETG okanye PC -izakhiwo ezihambelanayo | Qinisekisa ukucutheka, ukudibanisa, ubushushu, ukulungiswa kweRF kunye nokuqina kwekhadi eligqityiweyo |
Ikhadi eliqhelekileyo le-CR80 / ID-1 lidla ngokuyilwa kufutshane ne-0.76mm, kodwa ukunyamezela okuchanekileyo kuxhomekeke kwikhadi kunye neenkcukacha zezixhobo. Ii-cores eziprintiweyo, ngaphambili nangasemva Filamu ya overlay s, izinto zokuncamathelisa kunye nobukhulu betshiphu yendawo kufuneka zibandakanywe ekubaleni.
Ishiti linokuba phakathi kwe-avareji yegeyiji yokunyamezela ngelixa indawo yetshiphu ijiyile ekuhlaleni. Uyilo lwe-Cavity, i-cushioning, uxinzelelo lwe-press kunye nokukhethwa kwe-layer kufuneka kuthintele ama-bumps abonakalayo, ukudibanisa okubuthakathaka kunye nomonakalo we-chip.
| Antenna Factor | Effect kwiKhadi | elifunekayo uQinisekiso |
|---|---|---|
| Ijiyometri yeKhoyili | Ilawula i-inductance, indawo yokudibanisa kunye nemvume yokusika ekhoyo | Tshatisa amandla etshiphu, imilinganiselo yekhadi, umfundi kunye nokusingqongileyo okujoliswe kuko |
| I-Antenna yocingo lobhedu | Ixhasa uyilo lwekhoyili kunye nejometri eguquguqukayo | Idayamitha yocingo, ubunzulu bokufaka, i-crossover, ibhondi edibeneyo kunye nokuqhubeka |
| I-Antenna yeAluminiyam efakiweyo | Ixhasa imveliso ye-eriyali enepateni ephezulu | Landela ububanzi, ukuxhathisa, ukukhuselwa komhlwa, uncamathiselo lwetshiphu kunye nokuziphatha kokulanywa |
| Chip Capacitance | Ukutshintsha i-resonance ye-eriyali/i-chip circuit | Buyisela kwakhona xa utshintsha usapho lwetshiphu okanye iphakheji |
| Isitaki sekhadi | Iplastiki, i-inki, ifoyile, imizobo eyenziwe ngesinyithi kunye Filamu ya overlay inokutshintsha ukudibanisa kunye nokukhupha i-eriyali. | Vavanya ikhadi eligqityiweyo, hayi iprelam engenanto kuphela |
| Sebenzisa Okusingqongileyo | Umphezulu wesinyithi, iifowuni, izipaji, amakhadi akufutshane kunye nolwelo kunokuchaphazela ukusebenza | Vavanya umfundi ocetywayo, imeko yokunyuka kunye nokuphathwa komsebenzisi |
Umgama wokufunda uxhomekeke kwi-chip, indawo ye-eriyali, umgangatho womgangatho, amandla omfundi, i-eriyali yokufunda, iprotocol, ukuqhelaniswa nekhadi, istaki sokugqibela sekhadi kunye nokusingqongileyo. Ucaphulo kufuneka lucacise umfundi wovavanyo kwaye lupasile/lomgama ongaphumeleliyo kunokusebenzisa inani elilinganayo jikelele.
Iintenna kwiphepha elinamakhadi amaninzi zifuna izithuba ezaneleyo ukusuka kwimigca yokusika, imingxuma yokubhalisa kunye neendawo ezikufutshane. Uvavanyo lwe-RF olukwinqanaba leshiti kufuneka luchaze ukudityaniswa kwee-eriyali phambi kokuba amakhadi abethelwe.
| oMsebenzi | woLawulo | oluPhambili |
|---|---|---|
| Ngaphambili Filamu ya overlay | Ikhusela imizobo eprintiweyo kwaye ibonelela ngeglosi, imatte, iqabaka okanye isiphelo sokhuseleko | Ukutyeba, ukudibanisa, ukukrazula kunye nokuhambelana kobuntu |
| Undoqo Oshicilelwe Phambili | Ithwala imizobo esisigxina, umbhalo, uphawu kunye noshicilelo lokhuseleko | Ubhaliso loshicilelo, unyango lwe-inki, ukushwabana kunye ne-RF-ekhuselekileyo yentsimbi |
| HF Inlay iliyolaminishwa awali | Iqulethe itshiphu, i-eriyali, amalungu ombane kunye namaleko eplastiki axhasayo | Ukulungiswa kweRF, indawo yetshiphu, ubukhulu, ulungelelwaniso, ibhondi kunye nesivuno sombane |
| Umqolo Oshicilelweyo Core | Ulungelelanisa umaleko wangaphambili kwaye uthwale umzobo wecala elingasemva | Ibhalansi yegeyiji, indawo yomgca wemagnethi kunye noshicilelo |
| Emva Filamu ya overlay | Ikhusela umsebenzi wobugcisa kwaye inokubandakanya umgca, ipaneli yotyikityo okanye uphawu lokhuseleko | Ukudityaniswa, ukucaba, ikhowudi kunye nomphezulu wokugqibela |
Iifoyile ezinkulu ezenziwe ngesinyithi, ii-inki eziqhubayo okanye iileya zetsimbi ezikufutshane ne-eriyali zinokunciphisa ukudityaniswa okanye ukulungiswa kokutshintsha. Bandakanya izinto zokuhombisa zokugqibela kwiimvavanyo zeRF kwaye ugcine iindawo ezicacileyo apho zifuneka khona.
Iigeyiji zomaleko ongaphambili nasemva, isikhokelo semathiriyeli kunye noshicilelo kufuneka lulungelelaniswe apho kunokwenzeka. Izitaki ze-asymmetrical zinokuvelisa i-curl yekhadi emva kokufudumeza kunye nokupholisa.
Qinisekisa isitaki esivunyiweyo: Rekhoda zonke Filamu ya overlay , undoqo oshicilelweyo, inlay, incamathelisa, umgca kunye nokhuseleko.
Imeko kuwo onke amaphepha: Zinzise imathiriyeli kwindawo yemveliso kwaye uzigcine zicocekile, zisicaba kwaye zomile.
Qinisekisa ukuqhelaniswa: Tshatisa iphepha lephepha, inowuthi yekhadi, indawo yetshiphu, indawo ye-eriyali, umsebenzi wobugcisa kunye namanqaku okungqinga.
Phuhlisa umjikelo we-lamination: Misa ubushushu, uxinzelelo, ukuhlala, ukugqiba ipleyiti, ukukhutshwa kweshiti kunye nokupholisa kwesona sitaki semathiriyeli.
Khusela indawo ye-chip: Lawula uxinzelelo lwendawo kwaye ugweme amasuntswana aqinileyo, iziphene zeplate okanye ukuhamba okugqithisileyo kwe-IC.
Ukupholisa phantsi koxinzelelo olulawulwayo: Ukupholisa kuphembelela ukucaba, ukunamathela kwingqimba, uxinzelelo lwetshiphu kunye nokuzinza komda.
Uvavanyo ngaphambi kokubetha: Khangela umsebenzi wombane wenqanaba leshidi, inkangeleko, ubukhulu, ukudibanisa kunye nokubhaliswa.
Uvavanyo lwamakhadi agqityiweyo: Punch, lungisa kwaye uqinisekise ukusebenza kweRF, imilinganiselo, ukugoba kunye nokuhambelana kwesicelo.
| Umngcipheko | onokubakho unobangela | woLuleko |
|---|---|---|
| Ukusilela kweChip | Ukushisa okugqithisileyo, uxinzelelo lwendawo, umonakalo we-electrostatic okanye uxhumano lwe-chip olubuthathaka | Phonononga imida yephakheji ye-chip, uxinzelelo lwenkqubo, ulawulo lwe-ESD kunye nomgangatho woqhagamshelwano |
| Vula iSekethe ye-Antenna | I-conductor eyaphukileyo, i-joint embi, umonakalo wokusika okanye ukolula okugqithisileyo | Hlola ukuqhubeka, indlela yomqhubi, ukukhutshwa kwenqindi kunye noxinzelelo lomatshini |
| Uluhlu lokufunda olubuthathaka | I-detuning, ilahleko ye-conductor, ukungafani komfundi, umzobo owenziwe ngesinyithi okanye utshintsho lwekhadi-stack | Ukulinganisa i-resonance kunye nohlengahlengiso usebenzisa ikhadi eligqityiweyo kunye nesifundi ekujoliswe kuso |
| I-Chip Bump ebonakalayo | Imbuyekezo engonelanga, ubukhulu bemodyuli egqithisileyo okanye uxinzelelo olungalinganiyo | Lungiselela imingxunya yasekhaya, iigeyiji zomaleko, i-cushioning kunye neemeko zokucinezela |
| I-Delamination | Ukungcola, izinto ezingahambelaniyo, ukushisa okuphantsi okanye ukupholisa kakubi | Hlaziya ukuhambelana kwezinto, ukucoceka, umjikelo kunye nokusebenza kwe-peel |
| Iphepha okanye iKhadi leWarpage | Isitaki esingalungelelananga, ubushushu obugqithisileyo, uxinzelelo olungalinganiyo okanye ukupholisa ngokukhawuleza okungalawulekiyo | Ukulinganisa iileya kunye nokwandisa ukufudumeza, ukucaca kwepleyiti kunye nokupholisa |
| Into | ecetyiswayo kuLawulo lwe-B2B |
|---|---|
| Isazisi seChip | Qinisekisa umenzi, inani elichanekileyo, imemori, ukhetho lwe-UID, iprotocol kunye nokulandelelwa kweqashiso |
| Umsebenzi woMbane | Funda i-UID yetshiphu, imemori okanye umyalelo ochaziweyo oseti kwindawo nganye yekhadi ngokwesicwangciso sokuhlola |
| Ukuqhubekeka kwe-antenna | Khangela iisekethe ezivulekileyo, iifutshane, amajoyina abuthathaka, iziphene zomqhubi kunye nee-crossovers ezonakalisiweyo |
| Resonance / RF Performance | Ukulinganisa ipharamitha yeRF ekuvunyelwene ngayo okanye umgama osebenzayo wokufunda usebenzisa izixhobo zovavanyo ezichaziweyo kunye nesixhobo |
| Isikhundla seChip kunye ne-Antenna | Jonga indawo ekuyo ngokuchasene neCAD, ulwandlalo lwekhadi, ipunch clearance kunye nee-eriyali ezingabamelwane |
| Imilinganiselo yePhepha | Ubude, ububanzi, isikwere, i-pitch yekhadi, imingxuma yokubhalisa kunye nomgangatho we-edge |
| Ukutyeba kunye noBucaba | Umndilili wobunzima, ubukhulu bendawo yetshiphu-zone, i-curl, isaphetha kunye ne-point-to-point umahluko |
| UHlolo Olubonwayo | Usulelo, amaqamza, imibimbi, amabala amnyama, ukuba sesichengeni somqhubi, imikrwelo kunye neziphene zomaleko |
| UVavanyo lweKhadi eligqityiweyo | Umsebenzi we-RF, imilinganiselo, ubukhulu, ukugoba, ukukrazula, ubushushu, ukufuma, amaxolo kunye nokuhambelana komfundi |
| Ukulandeleka | Iqashiso leChip, i-eriyali, PVC iqashiso, umhla wemveliso, uyilo, inkqubo yovavanyo, inombolo yephepha kunye nerekhodi yokupakisha |
Uhlolo olupheleleyo lunokubhekisa kuvavanyo lokufunda umbane kwindawo nganye, ngelixa uvavanyo lwe-dimensional, peel and wonakalisayo luqhele ukwenziwa iisampulu. Inkcazo yokuthenga kufuneka ichaze izinto zovavanyo, ukulungiswa, iinqobo zokwamkelwa, isicwangciso sesampulu kunye nengxelo.
I-prelam inokudlula uvavanyo lombane kwaye isahluleke emva kobushushu obugqithisileyo, uxinzelelo, ukubetha okanye ukwenza umntu. Isiqinisekiso se-B2B kufuneka siquke zombini i-inlay-inlay kunye nokusebenza kwekhadi eligqityiweyo.
| Isicelo | seChip / iProtocol Direction | uQinisekiso olubalulekileyo |
|---|---|---|
| Amakhadi oMsebenzi kunye noFikelelo | Uhlobo lweLifa A, i-MIFARE Plus okanye i-DESFFire ngokwenkqubo yofikelelo efakiweyo | Ukuhambelana komfundi, ulawulo oluphambili, ukubhaliswa kunye nokugoba kwansuku zonke |
| Amakhadi angundoqo ehotele | I-chip efunwa liqonga lokutshixa ihotele | Isifaki khowudi sokutshixa, inkqubo yolawulo lweendwendwe, ubukhulu bekhadi kunye nokuba sesichengeni sokufuma |
| Amakhadi ezoThutho kunye neKhampasi | Khusela i-chip yezicelo ezininzi ezifana ne-DESFire apho uyilo lwenkqubo lufuna khona | Isantya sentengiselwano, ukhuseleko, ilifa lomfundi, ukwenziwa komntu kunye nomjikelo wobomi |
| Amakhadi obulungu kunye nokunyaniseka | Uhlobo lwememori ye-chip, i-NTAG okanye i-chip ekhuselekileyo yesicelo ngokoyilo lwenkqubo | Ukufunda okanye ukuhambelana kwefowuni, isiseko sedatha, ubumfihlo kunye nokusetyenziswa okuphindaphindiweyo |
| NFC Amakhadi oShishino kunye neNtengiso | NTAG okanye enye NFC Iqonga lecwecwe elihambelanayo | Umthamo we-NDEF, ukuhambelana kwefowuni, ukhuseleko lwe-URL kunye nesimo sokuskena |
| AmaKhadi eThala leeNcwadi, ii-Asethi kunye neNdawo | ISO /IEC 15693 / ICODE-uhlobo lwesisombululo | Iprothokholi yokufunda, ubungakanani be-antenna, uluhlu olujoliswe kuyo, ukuchasana nokungqubana kunye neemfuno ze-EAS |
| Ukhuseleko lwesazisi kunye neeProjekthi zeNtlawulo | I-chip eqinisekisiweyo ekhuselekileyo kunye nolwakhiwo oluvunyiweyo lwesicelo | Izatifikethi, inaliti engundoqo, isixokelelwano sobonelelo esiphicothiweyo kunye nokuvunywa kwenkqubo ethile |

HF RFID Inlay Izicelo ze Kadi janja Iinkqubo
| weDatha / iMfuneko ye- | B2B yoKhuseleko |
|---|---|
| I-UID | Qinisekisa ubude be-UID, ukuziphatha okuzinzileyo okanye okungahleliwe kwe-ID, ifomathi yedathabheyisi kunye nenkxaso yomfundi |
| Ufakelo lweekhowudi kwiMemori | Chaza ubume bedatha, amacandelo/iifayile/amaphepha, irekhodi yeNDEF, amasuntswana okutshixa kunye nokuqinisekisa |
| Amaqhosha oQinisekiso | Chaza ubunini obuphambili, inkqubo yokutofa, ukukhuselwa kwezothutho, ukwahlukahlukana kunye nomkhondo wophicotho |
| Igama lokugqithisa / Uqwalaselo loFikelelo | Cacisa igama eliyimfihlo, iibhithi zokufikelela, izinto zokubala, iitshekhi zoqobo kunye novavanyo lwemeko yokutshixa apho kuxhaswa khona |
| Idatha eShicileleyo eguquguqukayo | Xhuma inombolo eprintiweyo, ikhowudi yebhakhowudi okanye ikhowudi yeQR kwidatha yechip ngoxolelwaniso olulawulwayo |
| Amakhadi awaliweyo | Yahlula, ubale kwaye utshabalalise ngokukhuselekileyo amakhadi aqulathe izitshixo eziphilayo, izichazi okanye idatha ekhowudiweyo |
Inkqubo enika ufikelelo kuphela kwisichongi esifundeka esidlangalaleni sinokuba sesichengeni sokukopa okanye ukuxelisa. Iiprojekthi ezijonga ukhuseleko kufuneka zisebenzise i-chip kunye ne-backend architecture exhasa ungqinisiso olufanelekileyo lwe-cryptographic.
Ukubonelela ngetshiphu ekhuselekileyo akuquki ngokuzenzekelayo ukusetwa kwesicelo okanye ulawulo lwesitshixo. Chaza ukuba ngubani odala, ogcinayo, ulayisha kwaye uqinisekisa izitshixo, kunye nokuba indawo ephicothiweyo yokhuseleko-yobuqu iyafuneka.
Ikhadi elihlanganisiweyo le-smart linokudibanisa HF kunye LF , UHF , i-chip yoqhagamshelwano okanye esinye isicelo se- HF . Ezi zakhiwo zifuna indawo eyongezelelweyo, ukwahlukana ngokucophelela kwe-eriyali, ulawulo olongezelelweyo lwendawo kunye neprogram yokuzinikela kunye nokuvavanya.
| ISakhiwo seHybrid | Use Case | Engineering Risk |
|---|---|---|
| LF + HF | Ukufuduka ukusuka ekufikeleleni kwilifa ukuya HF kwiinkqubo ze-smart-card | Isithuba se-antenna, ukusebenzisana, ubukhulu bekhadi kunye novavanyo lokufunda kabini |
| HF + UHF | Isazisi soluhlu olufutshane kunye nokulandelwa kuluhlu olude | Iinkqubo ezahlukeneyo ze-eriyali, iziphumo zezinto kunye ne- UHF ubuntununtunu kufutshane nomzimba okanye isinyithi |
| Ezimbini HF IiChips | Ukwahlula izicelo okanye imimandla ezimeleyo ekhuphayo | Ukukhetha umfundi, ukudityaniswa kwe-eriyali, ubunini bedatha kunye nemiqobo yokwakheka kwekhadi |
| Qhagamshelana + Ukungaqhagamshelwa | Isazisi esikhuselekileyo esijongana kabini, umnxeba okanye uyilo lwentlawulo | Imodyuli yemodyuli, uqhagamshelo lwe-eriyali, i-lamination, isiqinisekiso kunye nobuntu |
I-standard-frequency single-frequency HF prelam ayifanele ichazwe njengexhasa ngokuzenzekelayo LF okanye UHF . Ulwakhiwo olusebenza ngokuphindaphindiweyo ludinga olwabo umzobo, uludwe lwetshiphu, uvavanyo lweRF, ukucaciswa kobukhulu kunye nexabiso.
Gcina amaphepha e-prelam acwebileyo kwindawo evaliweyo, ecocekileyo kwaye eyomileyo kude nelanga kunye nobushushu.
Sebenzisa iibhodi eziqinileyo, iibhokisi ezidibeneyo nezikhuselweyo ukuthintela ukugoba, imikrwelo kunye noxinzelelo lwe-chip-zone.
Kuphephe ukukhupha okuqinileyo kwe-electrostatic kwaye usebenzise ulawulo lokuphatha olufanelekileyo lwe-ESD apho kuyimfuneko.
Musa ukubeka imithwalo enzima engalinganiyo kwi-sheet stack okanye uvumele i-pallet overhang.
Izinto zokubeka imo kwigumbi lokuhlambela phambi kokulungiswa xa indawo yokugcina kunye neemeko zokuvelisa zahlukile.
Chonga yonke ipakethe ngemodeli yetshiphu, uyilo lwe-eriyali, uyilo, ubukhulu, ibhetshi kunye nobume bokuhlolwa.
Sebenzisa i-first-in, i-inventory yokuqala kunye nemathiriyeli yokuvavanya kwakhona emva kokugcinwa ixesha elide okanye ukubonakaliswa kwezithuthi.

Ukupakishwa kweFlethi okuKhuselweyo ukwenzela HF RFID prelam Amaxwebhu
Imveliso ye-prelam ethembekileyo idinga ukubethelwa okanye ukubethelwa kwe-eriyali elawulwayo, ukudibanisa i-chip, ukubhaliswa kwamaphepha, i-lamination yeplastiki, ukuvavanywa kombane, ukuhlolwa kwe-dimensional, ukuphathwa okucocekileyo kunye nokulandelwa kwebhetshi. Itshiphu evunyiweyo, umzobo we-eriyali kunye nendlela yovavanyo lweRF kufuneka zihlale zingatshintshi ukuze ziphinde iiodolo ngaphandle kokuba utshintsho olulawulwayo kuvunyelwene ngalo.
RFID Inlay Iprojekthi kunye neQela lobuGcisa
Inlay iliyolaminishwa awali Iworkshop yeMveliso
I-antenna kunye Inlay Ulawulo lweNkqubo
UHlolo loMbane kunye neDimensional
Ukukhetha i-chip esekelwe kwisicelo: Ukufikelela kwilifa, NFC , ukhuseleko lwezicelo ezininzi kunye ISO iiprojekthi ze-15693 zinokwahlulwa ngeprotocol kunye nesidingo sokhuseleko.
Ubunjineli be-antenna yesiko: Ijiyometri yekhoyili, i-conductor, i-chip capacitance, ulwandlalo lwekhadi kunye nesifundi ekujoliswe kuso sinokujongwa kunye.
Uyilo lwamaphepha aguquguqukayo: Ulungiselelo oluqhelekileyo lwamakhadi amaninzi kunye neepitshi zamakhadi axhomekeke kumthengi ziyafumaneka.
Ukuhlanganiswa kwezinto zekhadi: PVC i-prelam inokulungelelaniswa kunye neengqungquthela eziprintiweyo, Filamu ya overlay s, imivimbo yamagnetic kunye nezakhiwo zekhadi ezigqityiweyo.
Inkxaso yokufaneleka: Iisampulu, iimvavanyo ze-lamination, uvavanyo lwe-RF, ukutshekisha ubukhulu kunye nokuqinisekiswa kwekhadi eligqityiweyo kuyanciphisa umngcipheko weprojekthi.
Ubonelelo nge-B2B yomzi-mveliso: Ilungele iifektri zamakhadi e-smart, abashicileli, abaguquli, abahlanganisi benkqubo, abakhuphi, abarhwebi kunye nabasasazo.
Usetyenziso, uphawu lomfundi/imodeli, iprotocol kunye neqonga lesoftware elifakiweyo.
Kanye umenzi wetshiphu kunye nenxalenye yenombolo, imemori, i-UID kunye neemfuno zokhuseleko.
Uyilo lwephepha, imilinganiselo epheleleyo, inowuthi yekhadi, amanqaku obhaliso kunye nobungakanani.
Ubungakanani bekhadi, indawo ecacileyo ye-eriyali, indawo yetshiphu kunye nomzobo wokubetha.
prelam imathiriyeli, umbala, ubukhulu begama kunye nokunyamezela.
Itekhnoloji ye-antenna, i-resonance ekujoliswe kuyo okanye uvavanyo olusebenzayo loluhlu lokufunda.
Isitaki sekhadi lokugqibela, ii-cores eziprintiweyo, Filamu ya overlay s, ushicilelo lwesinyithi, ipaneli yomgca okanye utyikityo.
I-Lamination press, ubushushu, uxinzelelo, ukuhlala, ukupholisa kunye nobukhulu beepleyiti.
Uvavanyo lombane, uvavanyo lweRF, ukuhlolwa komgangatho kunye neendlela zokwamkelwa.
Ukufakwa kweekhowudi, inaliti engundoqo, uluhlu lwe-UID, idatha eguquguqukayo okanye ulungelelwaniso lwedatha.
Ubungakanani beprototype, uqikelelo lonyaka, ishedyuli yokuphinda-odola kunye neemfuno zolawulo lotshintsho.
Ukupakishwa, amaxwebhu okuhlola, indawo yokufikela kunye nomhla wokuhanjiswa oceliweyo.
Xoxa ngeprojekthi yakho HF RFID Inlay
Liphepha elingundoqo lokwenziwa kwekhadi eliqulethe i-chip ye-13.56MHz kunye ne-eriyali ngaphakathi kweplastiki. Ilayitelwe ngeecores eziprintiweyo kunye Filamu ya overlay s ukuvelisa amakhadi agqityiweyo angenalo uqhagamshelwano.
Hayi. I-prelam ngumaleko osebenzayo ophakathi. Amakhadi agqityiweyo afuna ushicilelo olongezelelweyo, Filamu ya overlay s, lamination, cooling, punching and optional personalization or encoding.
Iiprojekthi zingasebenzisa ISO /IEC 14443 Uhlobo A, Uhlobo B, ISO /IEC 15693 okanye NFC Iichips ezihambelana neForam. Umgaqo ochanekileyo uxhomekeke kwi-IC ekhethiweyo kunye nenkqubo yokufunda.
Hayi. Ziintsapho ezahlukeneyo zeemveliso ezineeprothokholi ezahlukeneyo, inkumbulo, imiyalelo, ukhuseleko kunye nezicelo. Qinisekisa itshiphu echanekileyo kunye nomfundi phambi koku-odola.
Iinketho ezinjalo ze-1K ezihambelana nelifa zingaxoxwa. Nikeza imfuno yetshiphu echanekileyo kunye nesampulu yomfundi, kuba umenzi, i-UID, imemori kunye nokuhambelana koqinisekiso kufuneka kuqinisekiswe.
Ihlala ifanelekile kwiinkqubo zelifa ezifakiweyo, kodwa iiprojekthi zanamhlanje ezikhuselekileyo kufuneka zivavanye ezinye iindlela zangoku ezifana ne-MIFARE DESFire okanye i-MIFARE Plus ngokwenkqubo yolwakhiwo.
NTAG 213, 215 okanye 216 kunye nezinye NFC iitshiphusi ezihambelana neForam ziinketho eziqhelekileyo. Khetha imodeli kwimemori ye-NDEF efunekayo, ukuhambelana kwefowuni kunye neempawu zokhuseleko.
I-chip ye-multi-application chip ekhuselekileyo efana ne-MIFARE DESFire inokufaneleka, kodwa inkxaso yomfundi, ulawulo oluphambili, isatifikethi, iifayile zesicelo kunye nesofthiwe kufuneka ziqinisekiswe.
ISO /IEC 15693 isetyenziselwa izicelo zekhadi lendawo apho umfundi, ubungakanani be-eriyali kunye nomgama wokudibanisa okujoliswe kuyo kwahluka kwiinkqubo zekhadi elikufutshane elisekelwe kwi- ISO /IEC 14443.
Iinketho eziqhelekileyo ziquka i-2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kunye ne-4 × 10. Uyilo oluqhelekileyo lunokuveliswa kwi-lamination yomthengi kunye ne-punching drawing.
Iphepha lemveliso yangoku libhekisa malunga ne-0.45 ± 0.02mm kulwakhiwo olukhethiweyo HF . Ubukhulu bokugqibela buxhomekeke kwitshiphu, i-eriyali, imathiriyeli, isitakhi sekhadi kunye neemfuno zendawo yetshiphu.
Ewe. Ukubonelela ngethagethi egqityiweyo-khadi ubukhulu, Filamu ya overlay kunye ne-printed-core gauges, ipakethe yechip kunye nenkqubo yokuthambisa ukuze isitaki esipheleleyo sibalwe.
Ewe. Ijometri ye-antenna inokuphuhliswa malunga ne-chip capacitance, ubungakanani bekhadi, umfundi, ukusebenza okujoliswe kuyo, indawo ye-chip kunye nokukhutshwa kokusika.
Izinketho ezifakwe kwi-copper-wire kunye ne-etched-aluminium zingaxoxwa. Olona lwakhiwo lungcono luxhomekeke kumthamo, ukumelana, ubukhulu, ukudityaniswa, ukuyilwa kwekhadi kunye nethagethi yeRF.
Akukho luhlu lwendalo yonke. Kuxhomekeke kwitshiphu, i-eriyali, umfundi, isitaki sekhadi, ukuqhelaniswa nokusingqongileyo. Chaza umfundi wovavanyo kunye nomgama omncinci osebenzayo.
Ingasetyenziswa emva kovavanyo lweRF. Ifoyile enkulu yesinyithi okanye i-inki eqhubayo kufutshane ne-eriyali inokudityaniswa okanye ikhusele ujongano olungenanxibelelwano.
Izakhiwo zemathiriyeli ezizezinye zinokujongwa kwakhona, kodwa ukushwabana, ukudityaniswa, ubushushu be-lamination, ukulungiswa kweRF kunye nokuqina kwekhadi eligqityiweyo kufuneka kuqinisekiswe ngokwahlukeneyo.
I-prelam idla ngokubonelelwa njengondoqo ongasebenziyo. Ukushicilelwa ngokuqhelekileyo kusetyenziswa kumaphepha angundoqo ahlukeneyo, nangona ulwakhiwo oluthile lweprojekthi lunokuxoxwa.
Akukho sicwangciso selizwe lonke kufuneka sipapashwe kwisakhiwo ngasinye. Phuhlisa ubushushu, uxinzelelo, ukuhlala kunye nokupholisa malunga neyona ndawo ichanekileyo PVC , Filamu ya overlay , i-inki, i-chip kunye nokwakhiwa kwe-eriyali.
Sebenzisa ukupakishwa kwe-chip ehambelanayo, ubukhulu bendawo obulawulwayo, iipleyiti ezicocekileyo, uxinzelelo olulungeleleneyo, umjikelo wobushushu ovunyiweyo kunye novavanyo lombane ngaphambi nangemva kokulanyiswa.
Uvavanyo olupheleleyo lombane lunokuchazwa. Isivumelwano sokuthenga kufuneka sichaze ukuba yeyiphi imiyalelo etshekishwayo kwindawo nganye kwaye zeziphi iimvavanyo ezitshabalalisayo okanye ezinobungakanani obusebenzisa iisampulu.
Ukufundwa kwe-UID, ukufakwa kweekhowudi kwimemori, ukubhala kwe-NDEF okanye ukwenza isicelo ngokwaso kunokuxoxwa. Iinkonzo ze-Secure-key zifuna inkcazo elawulwayo eyahlukileyo.
Uyilo lweHybrid lunokuphuhliswa njengemveliso eyahlukileyo. Zifuna ii-eriyali ezizinikezelekileyo zoyilo, ukucwangcisa ubukhulu, iimvavanyo zomfundi kunye namaxabiso.
Ewe. Inkqubo ekhethwayo kukuvavanya i-prelam, ukulambisa istaki sekhadi elipheleleyo, amakhadi epunch kunye nokuqinisekisa iRF, ukusebenza koomatshini kunye nokuzenzela.
I-MOQ ixhomekeke ekufumanekeni kwe-chip, isixhobo se-antenna yesiko, ukwakheka, izinto, ubukhulu, inkqubo yovavanyo, i-encoding kunye nokuba uyilo oluqhelekileyo oluvunyiweyo lunokusetyenziswa.
Nikeza itshiphu echanekileyo, umfundi, umthetho olandelwayo, uyilo, ubungakanani beshiti, umzobo wekhadi, ubukhulu, i-eriyali ekujoliswe kuyo, istaki sekhadi lokugqibela, iimvavanyo, ubungakanani, ukupakishwa kunye nendawo ekuyiwa kuyo.
Qhagamshelana Wallis Plastic ukulungiselela 13.56MHz ngokwezifiso HF RFID PVC prelam inlay sheets ukufikelela, ID, ihotele, ubulungu, ezothutho, NFC kunye nokwenziwa smart-card. Iqela lethu lixhasa ukhetho lwe-chip, uyilo lwe-eriyali, uyilo lweshiti, ukulungiswa kwe-RF, ukuvavanywa kwe-lamination, uvavanyo lombane, ukufakwa kweekhowudi, ukucaciswa komgangatho kunye nobonelelo lwe-B2B ngqo kumzi-mveliso.
Qala iProjekthi yakho kunye nathi