Wallis white Teslin synthetic paper supports laminated ID, membership and RFID card production in 0.178mm and 0.254mm gauges, with print trials, custom cutting, samples and bulk B2B supply.
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Wallis 0.178mm and 0.254mm white Teslin synthetic paper is supplied for laminated ID cards, membership cards, access credentials, hotel key cards, RFID cards, event badges and other printed card programs. The microporous substrate accepts ink, toner, adhesive and laminate into its structure, helping card manufacturers achieve durable print and strong layer bonding.
The two gauges correspond to common 7 mil and 10 mil substrate formats. Thickness should be selected as part of the complete card construction rather than by card type alone. Printing on one or both sides, overlay thickness, RFID inlay, magnetic stripe, adhesive, lamination pressure and finished-card thickness must all be included in the specification.
Wallis supports B2B buyers with sample sheets, custom cutting, printing trials, lamination evaluation, card-structure review and export packing. Buyers should confirm the exact Teslin grade, manufacturer, thickness tolerance, surface condition and compliance documents before approving mass production.
| Product Type | White microporous synthetic-paper substrate for printed and laminated cards |
| Thickness Options | 0.178mm / 178μm / 7 mil and 0.254mm / 254μm / 10 mil |
| Printing Methods | Offset, silk-screen and digital printing; additional processes require grade and equipment testing |
| Card Applications | ID, membership, loyalty, hotel key, access, event, healthcare and selected RFID cards |
| Supply Options | Standard or custom-cut sheets, protected inner packing, cartons and export pallets |
| B2B Services | Samples, print qualification, lamination trials, RFID structure review, QC planning and bulk supply |
Request Teslin Card Substrate Samples
Teslin substrate is a microporous, polyolefin-based synthetic material containing a high proportion of inorganic filler and internal air volume. Unlike dense plastic sheet, its porous structure absorbs inks, toners, adhesives and molten laminate, creating interlocking mechanical bonds within the substrate.
Ink and toner can penetrate the surface rather than remaining only as a removable surface layer. During lamination, compatible laminate or adhesive flows into the pores, helping protect printed text, photographs, QR codes and barcodes from abrasion or attempted layer separation.
The compressible structure can cushion magnetic stripes, antennas, chips and other embedded elements. This does not eliminate the need for inlay engineering: component thickness, cavity design, pressure distribution and repeated-flex testing remain essential.
Card security depends on the full design, including controlled artwork, variable data, holographic features, UV inks, overlays, chips, magnetic stripes and issuance procedures. Standard white substrate should not be described as containing watermarks or covert features unless the exact grade has those features built in.
White Microporous Card Substrate
Printable and Lamination-Friendly Sheet
Both thicknesses can be printed on one or both sides. The correct choice depends on the required substrate contribution to total card thickness, stiffness, cushioning, lamination stack and available overlay films—not simply whether the artwork is single-sided or double-sided.
| Selection Factor | 0.178mm / 7 mil | 0.254mm / 10 mil |
|---|---|---|
| Substrate Contribution | Lower contribution to total card thickness; leaves more room for overlays or additional layers | Higher contribution to total thickness and cushioning |
| Flexibility | More flexible before lamination | More substantial feel before lamination |
| Common Project Use | Thin-core laminated cards, badges, tags and structures using thicker overlays | Heavier cores, enhanced cushioning and structures using thinner overlays |
| RFID / Chip Structure | Useful where inlay and overlays already consume substantial thickness | May provide more cushioning, but total stack and pressure must be recalculated |
| Approval Method | Print, laminate, condition and measure finished samples | Print, laminate, condition and measure finished samples |

7 Mil and 10 Mil Thickness Options
A laminated ID card is a system of substrate, print, overlays, adhesive and optional electronic components. The finished thickness should be calculated from the entire stack and verified after the card has cooled and conditioned.
| Card Component | Thickness and Process Consideration |
|---|---|
| Teslin Print Core | Use 0.178mm or 0.254mm according to the approved stack and required cushioning |
| Front and Back Overlay | Overlay gauge, adhesive and surface finish determine protection and final card feel |
| Printed Ink / Toner | Heavy solid coverage can affect moisture, blocking, lamination and dimensional balance |
| RFID Inlay or Chip | Include antenna, chip bump, adhesive and any cavity or spacer layers |
| Magnetic Stripe / Hologram | Confirm stripe recess, overlay compatibility and post-lamination encoding or inspection |
| Finished Card | Measure thickness, flatness, dimensions and functionality after cooling and conditioning |
ID, Access and Membership Cards
Finished Laminated Card Programs
Different Teslin grades are optimized for different printing systems. Buyers should not assume that one white sheet will produce the same result on offset, dye inkjet, pigment inkjet, laser, Indigo, screen or thermal-transfer equipment. Qualification of the exact grade, printer and ink system is required.
| Printing Process | B2B Validation Requirement |
|---|---|
| Offset Printing | Ink setting, density, trapping, drying, powder level, blocking and lamination resistance |
| Silk-Screen Printing | Ink thickness, solvent compatibility, cure, flexibility and layer bonding |
| Digital Laser Printing | Fuser temperature, toner adhesion, sheet transport, static control and equipment qualification |
| Inkjet Printing | Use an inkjet-compatible grade; test dye or pigment ink, dry time, water resistance and color profile |
| HP Indigo / Digital Press | Confirm the qualified grade, primer requirement, blanket temperature and post-print lamination |
| Direct-to-Card Printer | Normally prints a finished blank card rather than a loose Teslin sheet; test only after card lamination and punching |
Double-sided printing is controlled by the printing process, grade, moisture balance, artwork coverage and registration—not simply by using 0.254mm material. A balanced front-and-back design can also help reduce curl after printing and lamination.
Fixed graphics are commonly printed on substrate sheets before lamination. Variable names, photographs, numbers or barcodes may be added during sheet printing or later on the finished card, depending on the issuance workflow.

Offset, Screen and Digital Printing Trials
Teslin substrate can be platen-laminated or roll-laminated with compatible films. Strong bonding occurs when laminate or adhesive flows into the microporous structure. The final settings must be established with the actual substrate grade, overlay, ink, press and card stack.
| Lamination Control | Recommended Practice |
|---|---|
| Moisture Condition | Condition substrate and printed sheets before lamination; material that is too dry or too moist can reduce quality |
| Temperature | Set according to the laminate supplier and verified substrate temperature; do not rely only on machine display temperature |
| Pressure and Time | Provide enough flow into the pores without crushing chips, distorting artwork or creating excessive squeeze-out |
| Cooling | Cool under controlled pressure to improve flatness and dimensional stability |
| Peel Strength | Test the finished laminate after conditioning and environmental exposure |
| Edge Sealing | Compatible Teslin laminate structures can often be die-cut after lamination without a separate sealed border; confirm with the selected film |
Published starting parameters may help with trials, but actual heat transfer varies by plate, press, stack height, overlay chemistry and printed coverage. Record the approved substrate temperature, pressure, dwell, cooling and release-film configuration for repeat production.
Trapped moisture, insufficient heat, incompatible laminate, heavy ink or poor cooling can create bubbles, silvering, haze or curl. Inspect both the sheet and punched cards after conditioning.
Teslin substrate can support a layered credential design, but security features are created by the complete document program. Standard commercial material does not automatically contain government-grade covert or forensic elements.
| Security Feature | Integration Requirement |
|---|---|
| Microtext and Fine-Line Printing | High-resolution artwork, controlled plate or digital imaging and post-lamination legibility |
| UV-Fluorescent Ink | Ink supplier qualification, background fluorescence control and inspection after lamination |
| Holographic Overlay | Registered overlay, laminate compatibility, optical clarity and tamper behavior |
| QR Code and Barcode | Print contrast, dimensional accuracy, scanner readability and abrasion protection |
| Custom Security-Grade Substrate | Program-specific embedded markers require an authorized secure supply chain and are not equivalent to standard white sheet |

Layered Security and Laminate Protection
Teslin substrate can cushion and protect an RFID inlay, but choosing 0.254mm instead of 0.178mm does not automatically make a card suitable for advanced electronics. The inlay, chip, antenna, adhesives, overlay and lamination cycle must be designed as one structure.
| Smart Card Factor | Required Validation |
|---|---|
| Chip and Frequency | Confirm chip model, frequency, protocol, memory and reader system |
| Antenna Geometry | Protect antenna traces during lamination, punching and card-edge finishing |
| Inlay Thickness | Calculate chip bump, antenna, carrier and adhesive within the total card stack |
| Pressure Distribution | Use suitable cushioning and cavities to avoid chip or antenna damage |
| Functional Testing | Test read/write performance before lamination, after lamination, after punching and after flexing |
| Application | Recommended Project Focus |
|---|---|
| Corporate ID Cards | Photo quality, variable data, barcode, overlay durability and daily badge use |
| Student and Faculty Cards | High-volume printing, personalization, magnetic or RFID function and long-term flexing |
| Membership and Loyalty Cards | Brand color, barcode or QR readability, wallet durability and cost-efficient sheet production |
| Hotel Key Cards | Magnetic-stripe or RFID compatibility, lock testing and short-to-medium service life |
| Healthcare and Patient IDs | Legibility, cleaning exposure, barcode scanning and controlled issuance |
| Event and Visitor Badges | Short-run digital printing, slots, lanyards, QR codes and rapid personalization |
| Process | Quality Control Point |
|---|---|
| Guillotine Cutting | Squareness, printed registration, blade condition and stack compression |
| Card Punching / Die Cutting | Card dimensions, corner radius, clean edges and no laminate separation |
| Slot and Hole Punching | Position, edge distance, lanyard load and crack resistance |
| Embossing or Foil Stamping | Finished-card structure, heat, pressure, foil adhesion and legibility |
| Thermal / Retransfer Personalization | Printer transport, ribbon transfer, surface energy, heat distortion and image durability |
| Magnetic Encoding / RFID Encoding | Encoding yield, reader compatibility and post-stress function |
| Material | Strengths | Key Considerations |
|---|---|---|
| Teslin Substrate | High print absorption, strong laminate bonding, flexibility and cushioning for electronics | Usually used as a printed core within a laminate structure rather than as an exposed finished card |
| PVC | Established card process, broad supply and familiar personalization methods | Different environmental profile, lower heat resistance and limited recycling in many markets |
| PETG | Toughness, clarity and strong multilayer card applications | Ink adhesion and lamination recipe differ from porous Teslin substrate |
| Polycarbonate | High durability, heat resistance and laser-personalization capability in dedicated grades | Higher material and production cost; used for demanding long-life credentials |
| Inspection Item | Recommended Control |
|---|---|
| Material Identity | Manufacturer, grade, thickness code, batch and certificate reference |
| Thickness and Size | Average gauge, tolerance, sheet length, width, squareness and cutting accuracy |
| Appearance | Whiteness, shade, black spots, contamination, wrinkles, dents and edge damage |
| Flatness and Moisture | Curl, bow, storage condition and moisture balance before printing and lamination |
| Print Qualification | Density, adhesion, drying, color, image detail, barcode readability and blocking |
| Lamination Trial | Peel strength, bubbles, haze, edge separation, curl and finished thickness |
| Finished Card Test | Dimensions, flexing, abrasion, personalization, slot strength, encoding and reader function |
| Packing and Traceability | Protected stack, count, carton label, pallet configuration, lot number and inspection report |
Teslin substrate is compressible and should be protected from heat, UV light, pollution, moisture imbalance and excessive stack pressure. Correct storage helps maintain color, flatness, print performance and lamination strength.
Store covered material in a clean area away from combustion fumes and indoor pollutants.
Protect sheets from direct UV light and temperatures above the approved storage limit.
Keep cut sheets flat on a solid, supported surface.
Do not place heavy loads or double-stacked pallets on cut-sheet cartons.
Avoid overly tight strapping that can compress edges or mark the sheet stack.
Keep partial packs rewrapped to prevent dust, discoloration and moisture changes.
Condition sheets in the production room before printing or lamination when warehouse conditions differ.
Wallis supports card manufacturers and material distributors with substrate sourcing, custom sheet cutting, protected packing and coordinated card-material supply. Each order should be linked to an approved sample and written specification covering grade, thickness, printing process, lamination structure and finished-card requirements.

Card Material Processing and Export Supply
Two standard card gauges: 0.178mm and 0.254mm options for different laminated card structures.
Printing-process support: Offset, silk-screen and digital printing trials can be coordinated before bulk approval.
Lamination-focused development: Substrate, overlay, adhesive, temperature and card thickness can be reviewed as one system.
RFID card experience: Inlay thickness, cushioning, chip protection and reader tests can be included in sample validation.
Custom cutting and packing: Sheet format, stack protection, cartons and pallets can be tailored to production and export needs.
Factory-direct B2B service: Suitable for card factories, printers, converters, RFID companies, importers and distributors.
Card application, expected service life and destination market.
Required thickness: 0.178mm / 7 mil or 0.254mm / 10 mil.
Sheet length, width, tolerance, squareness and quantity.
Printing process, printer model, ink or toner and one- or two-sided artwork.
Overlay material, thickness, finish, adhesive and lamination equipment.
Target finished card dimensions, thickness and corner radius.
RFID chip, antenna, inlay, magnetic stripe, hologram or other component.
Security printing, barcode, QR code and personalization requirements.
Required certificates, material traceability and inspection report.
Trial quantity, annual forecast, destination port and delivery schedule.
Discuss Your Teslin Card Project
The 0.178mm substrate is 7 mil, while the 0.254mm substrate is 10 mil. The thicker grade contributes more to total card thickness and cushioning, but both require testing in the complete laminate structure.
Yes. Single- or double-sided printing depends on the substrate grade, printing process, ink system, artwork balance and registration—not simply on sheet thickness.
There is no universal choice. Calculate the substrate, front and back overlays, adhesive, printing and optional inlay, then laminate and measure the conditioned finished card.
The polyolefin-based substrate resists water, but print durability depends on the exact ink, grade and lamination. A finished card should be tested for water, humidity and cleaning exposure.
Use an inkjet-compatible Teslin grade and test the specific dye or pigment ink. Standard grades and coated inkjet grades can behave differently in dry time, color and water resistance.
Suitable grades can be laser printed, but fuser temperature, sheet transport, toner adhesion and printer qualification must be checked. Do not use material that is not approved for the equipment.
Most direct-to-card printers are designed for finished blank cards, not loose substrate sheets. Print and laminate the sheet first, punch the cards, and then test personalization on the finished blanks.
Multiple thermal laminates and adhesive films may work, but compatibility depends on activation temperature, flow, thickness and finished-card requirements. Approve the exact substrate-and-film combination through peel tests.
Properly laminated Teslin structures can often be cut to the finished shape without a separate sealed border because the laminate bonds into the porous matrix. Confirm this with the chosen laminate and process.
Possible causes include excess moisture, insufficient heat, trapped air, heavy ink, incompatible laminate or inadequate pressure. Condition the sheets and verify actual substrate temperature.
Yes. Its cushioning can help protect electronics, but chip, antenna, inlay thickness, adhesive, pressure and finished read performance must be validated.
Not automatically. A thicker substrate may provide more cushioning, but it also changes total card thickness and pressure distribution. The complete inlay structure determines performance.
Standard white substrate provides print and lamination benefits but should not be described as containing covert security markers. Program-specific security-grade material is a separate controlled product.
Yes. Holographic overlays, UV inks, microtext and other features can be integrated through separate printing and lamination processes. Their visibility and durability must be tested after production.
Environmental performance depends on raw materials, card construction, service life, manufacturing, transport and available disposal routes. Avoid a broad superiority claim without a defined life-cycle assessment.
Recycling depends on local collection and the complete card structure. Laminates, inks, magnetic stripes, chips and antennas can require specialist separation or disposal.
Keep sheets covered, flat, dry and protected from UV light, heat, fumes, dust and excessive stack pressure. Condition them before printing or lamination.
Custom cutting can be discussed according to printing layout, lamination plate, card imposition, tolerance, quantity and packing requirements.
Yes. Print, laminate, cool, condition, punch and personalize sample cards using the intended production equipment before approving the material.
MOQ depends on grade, thickness, sheet size, custom cutting, printing qualification, packing and annual forecast.
Provide thickness, sheet size, printing process, overlay, lamination equipment, finished card thickness, RFID or stripe requirements, quantity, destination and delivery schedule.
Contact Wallis Plastic for 0.178mm and 0.254mm white Teslin synthetic paper for laminated ID, membership, hotel key, event and RFID card projects. Our team supports thickness selection, custom cutting, printing and lamination trials, card-structure review, quality specifications and factory-direct B2B supply.
Teslin is a registered trademark of PPG Industries Ohio, Inc. Confirm the exact supplied grade, source and documentation for each order.
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