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0.178mm & 0.254mm White Teslin ID Card Substrate

Wallis white Teslin synthetic paper supports laminated ID, membership and RFID card production in 0.178mm and 0.254mm gauges, with print trials, custom cutting, samples and bulk B2B supply.

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0.178mm and 0.254mm White Teslin ID Card Substrate

Wallis 0.178mm and 0.254mm white Teslin synthetic paper is supplied for laminated ID cards, membership cards, access credentials, hotel key cards, RFID cards, event badges and other printed card programs. The microporous substrate accepts ink, toner, adhesive and laminate into its structure, helping card manufacturers achieve durable print and strong layer bonding.

The two gauges correspond to common 7 mil and 10 mil substrate formats. Thickness should be selected as part of the complete card construction rather than by card type alone. Printing on one or both sides, overlay thickness, RFID inlay, magnetic stripe, adhesive, lamination pressure and finished-card thickness must all be included in the specification.

Wallis supports B2B buyers with sample sheets, custom cutting, printing trials, lamination evaluation, card-structure review and export packing. Buyers should confirm the exact Teslin grade, manufacturer, thickness tolerance, surface condition and compliance documents before approving mass production.

Product Type White microporous synthetic-paper substrate for printed and laminated cards
Thickness Options 0.178mm / 178μm / 7 mil and 0.254mm / 254μm / 10 mil
Printing Methods Offset, silk-screen and digital printing; additional processes require grade and equipment testing
Card Applications ID, membership, loyalty, hotel key, access, event, healthcare and selected RFID cards
Supply Options Standard or custom-cut sheets, protected inner packing, cartons and export pallets
B2B Services Samples, print qualification, lamination trials, RFID structure review, QC planning and bulk supply

Request Teslin Card Substrate Samples

What Is Teslin Synthetic Paper?

Teslin substrate is a microporous, polyolefin-based synthetic material containing a high proportion of inorganic filler and internal air volume. Unlike dense plastic sheet, its porous structure absorbs inks, toners, adhesives and molten laminate, creating interlocking mechanical bonds within the substrate.

Microporous Structure for Printing and Bonding

Ink and toner can penetrate the surface rather than remaining only as a removable surface layer. During lamination, compatible laminate or adhesive flows into the pores, helping protect printed text, photographs, QR codes and barcodes from abrasion or attempted layer separation.

Flexible Cushioning for Embedded Components

The compressible structure can cushion magnetic stripes, antennas, chips and other embedded elements. This does not eliminate the need for inlay engineering: component thickness, cavity design, pressure distribution and repeated-flex testing remain essential.

Teslin Is a Substrate, Not a Complete Security System

Card security depends on the full design, including controlled artwork, variable data, holographic features, UV inks, overlays, chips, magnetic stripes and issuance procedures. Standard white substrate should not be described as containing watermarks or covert features unless the exact grade has those features built in.

White Teslin synthetic paper substrate for printed and laminated ID cards

White Microporous Card Substrate

Teslin sheet for card printing lamination die cutting and credential production

Printable and Lamination-Friendly Sheet

0.178mm vs. 0.254mm Teslin Substrate

Both thicknesses can be printed on one or both sides. The correct choice depends on the required substrate contribution to total card thickness, stiffness, cushioning, lamination stack and available overlay films—not simply whether the artwork is single-sided or double-sided.

Selection Factor 0.178mm / 7 mil 0.254mm / 10 mil
Substrate Contribution Lower contribution to total card thickness; leaves more room for overlays or additional layers Higher contribution to total thickness and cushioning
Flexibility More flexible before lamination More substantial feel before lamination
Common Project Use Thin-core laminated cards, badges, tags and structures using thicker overlays Heavier cores, enhanced cushioning and structures using thinner overlays
RFID / Chip Structure Useful where inlay and overlays already consume substantial thickness May provide more cushioning, but total stack and pressure must be recalculated
Approval Method Print, laminate, condition and measure finished samples Print, laminate, condition and measure finished samples

0.178mm and 0.254mm white Teslin paper thickness options for card manufacturing

7 Mil and 10 Mil Thickness Options

Plan the Complete Card Thickness

A laminated ID card is a system of substrate, print, overlays, adhesive and optional electronic components. The finished thickness should be calculated from the entire stack and verified after the card has cooled and conditioned.

Card Component Thickness and Process Consideration
Teslin Print Core Use 0.178mm or 0.254mm according to the approved stack and required cushioning
Front and Back Overlay Overlay gauge, adhesive and surface finish determine protection and final card feel
Printed Ink / Toner Heavy solid coverage can affect moisture, blocking, lamination and dimensional balance
RFID Inlay or Chip Include antenna, chip bump, adhesive and any cavity or spacer layers
Magnetic Stripe / Hologram Confirm stripe recess, overlay compatibility and post-lamination encoding or inspection
Finished Card Measure thickness, flatness, dimensions and functionality after cooling and conditioning
Teslin ID card substrate for corporate student access and membership cards

ID, Access and Membership Cards

Finished laminated Teslin cards for hotel loyalty event and RFID programs

Finished Laminated Card Programs

Printing Compatibility and Grade Selection

Different Teslin grades are optimized for different printing systems. Buyers should not assume that one white sheet will produce the same result on offset, dye inkjet, pigment inkjet, laser, Indigo, screen or thermal-transfer equipment. Qualification of the exact grade, printer and ink system is required.

Printing Process B2B Validation Requirement
Offset Printing Ink setting, density, trapping, drying, powder level, blocking and lamination resistance
Silk-Screen Printing Ink thickness, solvent compatibility, cure, flexibility and layer bonding
Digital Laser Printing Fuser temperature, toner adhesion, sheet transport, static control and equipment qualification
Inkjet Printing Use an inkjet-compatible grade; test dye or pigment ink, dry time, water resistance and color profile
HP Indigo / Digital Press Confirm the qualified grade, primer requirement, blanket temperature and post-print lamination
Direct-to-Card Printer Normally prints a finished blank card rather than a loose Teslin sheet; test only after card lamination and punching

Both Thicknesses Can Support Double-Sided Printing

Double-sided printing is controlled by the printing process, grade, moisture balance, artwork coverage and registration—not simply by using 0.254mm material. A balanced front-and-back design can also help reduce curl after printing and lamination.

Print the Substrate Before Final Card Personalization

Fixed graphics are commonly printed on substrate sheets before lamination. Variable names, photographs, numbers or barcodes may be added during sheet printing or later on the finished card, depending on the issuance workflow.

Printable white Teslin synthetic paper for offset screen and digital ID card printing

Offset, Screen and Digital Printing Trials

Thermal and Roll Lamination Process

Teslin substrate can be platen-laminated or roll-laminated with compatible films. Strong bonding occurs when laminate or adhesive flows into the microporous structure. The final settings must be established with the actual substrate grade, overlay, ink, press and card stack.

Lamination Control Recommended Practice
Moisture Condition Condition substrate and printed sheets before lamination; material that is too dry or too moist can reduce quality
Temperature Set according to the laminate supplier and verified substrate temperature; do not rely only on machine display temperature
Pressure and Time Provide enough flow into the pores without crushing chips, distorting artwork or creating excessive squeeze-out
Cooling Cool under controlled pressure to improve flatness and dimensional stability
Peel Strength Test the finished laminate after conditioning and environmental exposure
Edge Sealing Compatible Teslin laminate structures can often be die-cut after lamination without a separate sealed border; confirm with the selected film

Do Not Copy a Generic Lamination Recipe

Published starting parameters may help with trials, but actual heat transfer varies by plate, press, stack height, overlay chemistry and printed coverage. Record the approved substrate temperature, pressure, dwell, cooling and release-film configuration for repeat production.

Evaluate Bubbles, Silvering and Curl

Trapped moisture, insufficient heat, incompatible laminate, heavy ink or poor cooling can create bubbles, silvering, haze or curl. Inspect both the sheet and punched cards after conditioning.

Security Feature Integration

Teslin substrate can support a layered credential design, but security features are created by the complete document program. Standard commercial material does not automatically contain government-grade covert or forensic elements.

Security Feature Integration Requirement
Microtext and Fine-Line Printing High-resolution artwork, controlled plate or digital imaging and post-lamination legibility
UV-Fluorescent Ink Ink supplier qualification, background fluorescence control and inspection after lamination
Holographic Overlay Registered overlay, laminate compatibility, optical clarity and tamper behavior
QR Code and Barcode Print contrast, dimensional accuracy, scanner readability and abrasion protection
Custom Security-Grade Substrate Program-specific embedded markers require an authorized secure supply chain and are not equivalent to standard white sheet

Teslin card substrate for holographic overlay UV printing barcode and security feature integration

Layered Security and Laminate Protection

RFID, NFC and Smart Card Structures

Teslin substrate can cushion and protect an RFID inlay, but choosing 0.254mm instead of 0.178mm does not automatically make a card suitable for advanced electronics. The inlay, chip, antenna, adhesives, overlay and lamination cycle must be designed as one structure.

Smart Card Factor Required Validation
Chip and Frequency Confirm chip model, frequency, protocol, memory and reader system
Antenna Geometry Protect antenna traces during lamination, punching and card-edge finishing
Inlay Thickness Calculate chip bump, antenna, carrier and adhesive within the total card stack
Pressure Distribution Use suitable cushioning and cavities to avoid chip or antenna damage
Functional Testing Test read/write performance before lamination, after lamination, after punching and after flexing

ID Card and Credential Applications

Application Recommended Project Focus
Corporate ID Cards Photo quality, variable data, barcode, overlay durability and daily badge use
Student and Faculty Cards High-volume printing, personalization, magnetic or RFID function and long-term flexing
Membership and Loyalty Cards Brand color, barcode or QR readability, wallet durability and cost-efficient sheet production
Hotel Key Cards Magnetic-stripe or RFID compatibility, lock testing and short-to-medium service life
Healthcare and Patient IDs Legibility, cleaning exposure, barcode scanning and controlled issuance
Event and Visitor Badges Short-run digital printing, slots, lanyards, QR codes and rapid personalization

Finishing, Punching and Card Personalization

Process Quality Control Point
Guillotine Cutting Squareness, printed registration, blade condition and stack compression
Card Punching / Die Cutting Card dimensions, corner radius, clean edges and no laminate separation
Slot and Hole Punching Position, edge distance, lanyard load and crack resistance
Embossing or Foil Stamping Finished-card structure, heat, pressure, foil adhesion and legibility
Thermal / Retransfer Personalization Printer transport, ribbon transfer, surface energy, heat distortion and image durability
Magnetic Encoding / RFID Encoding Encoding yield, reader compatibility and post-stress function

Teslin vs. PVC, PETG and Polycarbonate Card Materials

Material Strengths Key Considerations
Teslin Substrate High print absorption, strong laminate bonding, flexibility and cushioning for electronics Usually used as a printed core within a laminate structure rather than as an exposed finished card
PVC Established card process, broad supply and familiar personalization methods Different environmental profile, lower heat resistance and limited recycling in many markets
PETG Toughness, clarity and strong multilayer card applications Ink adhesion and lamination recipe differ from porous Teslin substrate
Polycarbonate High durability, heat resistance and laser-personalization capability in dedicated grades Higher material and production cost; used for demanding long-life credentials

Quality Control for Bulk Teslin Sheet Orders

Inspection Item Recommended Control
Material Identity Manufacturer, grade, thickness code, batch and certificate reference
Thickness and Size Average gauge, tolerance, sheet length, width, squareness and cutting accuracy
Appearance Whiteness, shade, black spots, contamination, wrinkles, dents and edge damage
Flatness and Moisture Curl, bow, storage condition and moisture balance before printing and lamination
Print Qualification Density, adhesion, drying, color, image detail, barcode readability and blocking
Lamination Trial Peel strength, bubbles, haze, edge separation, curl and finished thickness
Finished Card Test Dimensions, flexing, abrasion, personalization, slot strength, encoding and reader function
Packing and Traceability Protected stack, count, carton label, pallet configuration, lot number and inspection report

Storage and Handling Requirements

Teslin substrate is compressible and should be protected from heat, UV light, pollution, moisture imbalance and excessive stack pressure. Correct storage helps maintain color, flatness, print performance and lamination strength.

  • Store covered material in a clean area away from combustion fumes and indoor pollutants.

  • Protect sheets from direct UV light and temperatures above the approved storage limit.

  • Keep cut sheets flat on a solid, supported surface.

  • Do not place heavy loads or double-stacked pallets on cut-sheet cartons.

  • Avoid overly tight strapping that can compress edges or mark the sheet stack.

  • Keep partial packs rewrapped to prevent dust, discoloration and moisture changes.

  • Condition sheets in the production room before printing or lamination when warehouse conditions differ.

Wallis Production and B2B Supply Support

Wallis supports card manufacturers and material distributors with substrate sourcing, custom sheet cutting, protected packing and coordinated card-material supply. Each order should be linked to an approved sample and written specification covering grade, thickness, printing process, lamination structure and finished-card requirements.

Wallis card material production and B2B supply support for Teslin substrate orders

Card Material Processing and Export Supply

Why Choose Wallis for White Teslin Card Substrate?

  • Two standard card gauges: 0.178mm and 0.254mm options for different laminated card structures.

  • Printing-process support: Offset, silk-screen and digital printing trials can be coordinated before bulk approval.

  • Lamination-focused development: Substrate, overlay, adhesive, temperature and card thickness can be reviewed as one system.

  • RFID card experience: Inlay thickness, cushioning, chip protection and reader tests can be included in sample validation.

  • Custom cutting and packing: Sheet format, stack protection, cartons and pallets can be tailored to production and export needs.

  • Factory-direct B2B service: Suitable for card factories, printers, converters, RFID companies, importers and distributors.

Information Needed for a Fast B2B Quotation

  • Card application, expected service life and destination market.

  • Required thickness: 0.178mm / 7 mil or 0.254mm / 10 mil.

  • Sheet length, width, tolerance, squareness and quantity.

  • Printing process, printer model, ink or toner and one- or two-sided artwork.

  • Overlay material, thickness, finish, adhesive and lamination equipment.

  • Target finished card dimensions, thickness and corner radius.

  • RFID chip, antenna, inlay, magnetic stripe, hologram or other component.

  • Security printing, barcode, QR code and personalization requirements.

  • Required certificates, material traceability and inspection report.

  • Trial quantity, annual forecast, destination port and delivery schedule.

Discuss Your Teslin Card Project

Frequently Asked Questions

What is the difference between 0.178mm and 0.254mm Teslin?

The 0.178mm substrate is 7 mil, while the 0.254mm substrate is 10 mil. The thicker grade contributes more to total card thickness and cushioning, but both require testing in the complete laminate structure.

Can both thicknesses be printed on two sides?

Yes. Single- or double-sided printing depends on the substrate grade, printing process, ink system, artwork balance and registration—not simply on sheet thickness.

Which thickness is better for a standard laminated ID card?

There is no universal choice. Calculate the substrate, front and back overlays, adhesive, printing and optional inlay, then laminate and measure the conditioned finished card.

Is Teslin paper waterproof?

The polyolefin-based substrate resists water, but print durability depends on the exact ink, grade and lamination. A finished card should be tested for water, humidity and cleaning exposure.

Can Teslin be printed with a regular inkjet printer?

Use an inkjet-compatible Teslin grade and test the specific dye or pigment ink. Standard grades and coated inkjet grades can behave differently in dry time, color and water resistance.

Can Teslin be printed with a laser printer?

Suitable grades can be laser printed, but fuser temperature, sheet transport, toner adhesion and printer qualification must be checked. Do not use material that is not approved for the equipment.

Can a direct-to-card printer print loose Teslin sheets?

Most direct-to-card printers are designed for finished blank cards, not loose substrate sheets. Print and laminate the sheet first, punch the cards, and then test personalization on the finished blanks.

Which laminate film works with Teslin?

Multiple thermal laminates and adhesive films may work, but compatibility depends on activation temperature, flow, thickness and finished-card requirements. Approve the exact substrate-and-film combination through peel tests.

Does Teslin require an edge seal?

Properly laminated Teslin structures can often be cut to the finished shape without a separate sealed border because the laminate bonds into the porous matrix. Confirm this with the chosen laminate and process.

Why do bubbles appear during lamination?

Possible causes include excess moisture, insufficient heat, trapped air, heavy ink, incompatible laminate or inadequate pressure. Condition the sheets and verify actual substrate temperature.

Can Teslin be used for RFID and NFC cards?

Yes. Its cushioning can help protect electronics, but chip, antenna, inlay thickness, adhesive, pressure and finished read performance must be validated.

Does 0.254mm Teslin automatically support an RFID chip better?

Not automatically. A thicker substrate may provide more cushioning, but it also changes total card thickness and pressure distribution. The complete inlay structure determines performance.

Does standard Teslin contain security features?

Standard white substrate provides print and lamination benefits but should not be described as containing covert security markers. Program-specific security-grade material is a separate controlled product.

Can holograms and UV inks be added?

Yes. Holographic overlays, UV inks, microtext and other features can be integrated through separate printing and lamination processes. Their visibility and durability must be tested after production.

Is Teslin more environmentally friendly than PVC?

Environmental performance depends on raw materials, card construction, service life, manufacturing, transport and available disposal routes. Avoid a broad superiority claim without a defined life-cycle assessment.

Is Teslin recyclable?

Recycling depends on local collection and the complete card structure. Laminates, inks, magnetic stripes, chips and antennas can require specialist separation or disposal.

How should Teslin sheets be stored?

Keep sheets covered, flat, dry and protected from UV light, heat, fumes, dust and excessive stack pressure. Condition them before printing or lamination.

Can Wallis provide custom sheet sizes?

Custom cutting can be discussed according to printing layout, lamination plate, card imposition, tolerance, quantity and packing requirements.

Can samples be tested before a bulk order?

Yes. Print, laminate, cool, condition, punch and personalize sample cards using the intended production equipment before approving the material.

What determines the minimum order quantity?

MOQ depends on grade, thickness, sheet size, custom cutting, printing qualification, packing and annual forecast.

What information is required for an accurate quotation?

Provide thickness, sheet size, printing process, overlay, lamination equipment, finished card thickness, RFID or stripe requirements, quantity, destination and delivery schedule.

Request White Teslin ID Card Substrate Samples

Contact Wallis Plastic for 0.178mm and 0.254mm white Teslin synthetic paper for laminated ID, membership, hotel key, event and RFID card projects. Our team supports thickness selection, custom cutting, printing and lamination trials, card-structure review, quality specifications and factory-direct B2B supply.

Teslin is a registered trademark of PPG Industries Ohio, Inc. Confirm the exact supplied grade, source and documentation for each order.

Request Samples and Factory Quote

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