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Iphepha le-Wallis elimhlophe le-Teslin lokwenziwa lixhasa i-ID elaminated, ubulungu kunye nokuveliswa kwekhadi le-RFID kwi-0.178mm kunye ne-0.254mm ye-gauges, kunye neemvavanyo zokuprinta, ukusika isiko, iisampuli kunye nokubonelela nge-B2B eninzi.
izinto zekhadi
WALLIS
| Isixhobo: | |
|---|---|
| Ukutyeba: | |
| Uhlobo loShicilelo: | |
| Ubungakanani: | |
I-Wallis 0.178mm kunye ne-0.254mm iphepha le-Teslin elimhlophe lokwenziwa kwe-synthetic libonelelwa ngamakhadi e-ID ane-laminated, amakhadi obulungu, iziqinisekiso zokufikelela, amakhadi asehotele, amakhadi e-RFID, iibheji zesiganeko kunye nezinye iinkqubo zekhadi eziprintiweyo. I-microporous substrate yamkela i-inki, i-toner, i-adhesive kunye ne-laminate kwisakhiwo sayo, inceda abavelisi bekhadi ukuba bafezekise ushicilelo oluhlala ixesha elide kunye nokuqina okuqinileyo.
Iigeyiji ezimbini zihambelana nefomathi ye-substrate ye-7 mil kunye ne-10 mil. Ukutyeba kufuneka kukhethwe njengenxalenye yokwakhiwa kwekhadi elipheleleyo kunohlobo lwekhadi kuphela. Ukuprintwa kwelinye okanye kumacala omabini, ubukhulu be-overlay, i-RFID inlay, umgca wemagnethi, i-adhesive, uxinzelelo lwe-lamination kunye nobukhulu bekhadi eligqityiweyo kufuneka zonke zibandakanywe kwiinkcukacha.
I-Wallis ixhasa abathengi be-B2B ngamashiti eesampuli, ukusika isiko, izilingo zokuprinta, ukuhlolwa kwe-lamination, ukuphononongwa kwesakhiwo sekhadi kunye nokupakishwa kwamanye amazwe. Abathengi kufuneka baqinisekise ibakala elichanekileyo leTeslin, umenzi, ukunyamezela ubukhulu, imeko ephezulu kunye namaxwebhu okuthotyelwa ngaphambi kokuvuma ukuveliswa kobuninzi.
| Uhlobo lweMveliso | I-white microporous synthetic-paper substrate yamakhadi aprintiweyo kunye ne-laminated |
| Ukutyeba Iinketho | 0.178mm / 178μm / 7 mil kunye 0.254mm / 254μm / 10 mil |
| Iindlela Zokushicilela | I-offset, i-silk-screen kunye noshicilelo lwedijithali; iinkqubo ezongezelelweyo zifuna uvavanyo lwebakala kunye nezixhobo |
| Izicelo zeKhadi | Isazisi, ubulungu, ukunyaniseka, isitshixo sehotele, ukufikelela, isiganeko, ukhathalelo lwempilo kunye namakhadi e-RFID akhethiweyo |
| Iinketho zokubonelela | Amaphepha asemgangathweni okanye anqunyulwe ngokwesiko, ukupakishwa kwangaphakathi okukhuselweyo, iibhokisi kunye neepaliti zokuthumela ngaphandle |
| Iinkonzo ze-B2B | Iisampulu, isiqinisekiso soshicilelo, izilingo ze-lamination, uphononongo lwesakhiwo se-RFID, ukucwangciswa kwe-QC kunye nobonelelo oluninzi |
Cela i-Teslin Card Substrate Samples
I-Teslin substrate yi-microporous, i-polyolefin-based synthetic material equlethe umlinganiselo ophezulu we-inorganic filler kunye nomthamo womoya wangaphakathi. Ngokungafaniyo nephepha leplastiki elishinyeneyo, ubume bayo obunobuqhophololo bufunxa ii-inki, iitoni, izincamathelisi kunye ne-laminate etyhidiweyo, idala iibhondi ezidibeneyo zomatshini ngaphakathi kwe-substrate.
I-inki kunye ne-toner inokungena kumphezulu kunokuba ihlale kuphela njengomaleko osuswayo. Ngexesha le-lamination, i-laminate ehambelanayo okanye i-adhesive flows kwi-pores, inceda ukukhusela umbhalo oshicilelweyo, iifoto, iikhowudi ze-QR kunye ne-barcodes ukusuka kwi-abrasion okanye ukuzama ukwahlula umaleko.
Isakhiwo esicinezelayo sinokukhusela imivimbo yamagnetic, i-eriyali, iitshiphusi kunye nezinye izinto ezifakwe ngaphakathi. Oku akuphelisi isidingo sobunjineli be-inlay: ubukhulu becandelo, uyilo lwecavity, ukusabalalisa uxinzelelo kunye novavanyo oluphindaphindiweyo lwe-flex luhlala lubalulekile.
Ukhuseleko lwekhadi luxhomekeke kuyilo olupheleleyo, kubandakanywa umsebenzi wobugcisa olawulwayo, idatha eguquguqukayo, iimpawu zeholographic, ii-inki ze-UV, ii-overlays, iitshiphusi, imigca yemagnethi kunye neenkqubo zokukhutshwa. I-substrate emhlophe eqhelekileyo akufuneki ichazwe njengequlethe ii-watermark okanye i-covert features ngaphandle kokuba ibakala elichanekileyo linezo mpawu zakhelwe ngaphakathi.
I-White Microporous Card Substrate
Iphepha eliprintwayo kunye neLamination-Friendly
Zombini ubukhulu bunokuprintwa kwicala elinye okanye omabini. Ukhetho oluchanekileyo luxhomekeke kwigalelo elifunekayo le-substrate kubukhulu bekhadi lilonke, ukuqina, i-cushioning, i-lamination stack kunye neefilimu ezifumanekayo ezingaphezulu-kungekhona nje ukuba umzobo ucalanye okanye uphindwe kabini.
| Into yokuKhetha | 0.178mm / 7 mil | 0.254mm / 10 mil |
|---|---|---|
| Igalelo leSubstrate | Igalelo eliphantsi kubukhulu bekhadi elipheleleyo; ishiya indawo eyongezelelekileyo yokwaleka okanye iileya ezongezelelweyo | Igalelo eliphakamileyo kubunzima obupheleleyo kunye ne-cushioning |
| Ukuba bhetyebhetye | Ubhetyebhetye ngakumbi phambi kokuba lamination | Imvakalelo eyongezelelekileyo ngakumbi phambi kokuba i-lamination |
| Ukusetyenziswa kweProjekthi eqhelekileyo | Amakhadi alaminethiweyo anondoqo, iibheji, iithegi kunye nezakhiwo ezisebenzisa utyando olutyebileyo | I-cores enzima, i-cushion ephuculweyo kunye nezakhiwo zisebenzisa ii-overlays ezincinci |
| RFID / Chip Ulwakhiwo | Iluncedo apho inlay kunye nezigqubuthelo ezingaphezulu sele zisebenzisa ubukhulu obuninzi | Inokubonelela nge-cushion engaphezulu, kodwa isitakhi esipheleleyo kunye noxinzelelo kufuneka zibalwe kwakhona |
| Indlela yokuvunywa | Shicilela, i-laminate, imeko kwaye ulinganise iisampuli ezigqityiweyo | Shicilela, i-laminate, imeko kwaye ulinganise iisampuli ezigqityiweyo |
7 Mil kunye 10 Mil Ukutyeba Iinketho
Ikhadi le-ID elaminethiweyo yinkqubo ye-substrate, ukuprinta, ukugqithiswa, ukunamathela kunye nezinto ezikhethiweyo ze-elektroniki. Ubunzima obugqityiweyo kufuneka bubalwe kwi-stack yonke kwaye buqinisekiswe emva kokuba ikhadi lipholile kwaye licolisekile. Ukutyeba
| kweCandelo leKhadi | kunye nokuqwalaselwa kweNkqubo |
|---|---|
| I-Teslin Print Core | Sebenzisa i-0.178mm okanye i-0.254mm ngokwestakhi esivunyiweyo kunye ne-cushioning efunekayo |
| Ukwaleka kwangaphambili nasemva | Igeyiji yokwaleka, into encamathelayo kunye nokugqitywa komphezulu kuqinisekisa ukhuseleko kunye nokuziva kwekhadi lokugqibela |
| I-Ink eprintiweyo / iToner | Ukugquma okuqinileyo okuqinileyo kunokuchaphazela ukufuma, ukuvalela, ukunyibilika kunye ne-dimensional balance |
| RFID Inlay okanye Chip | Bandakanya i-eriyali, i-chip bump, i-adhesive kunye nawuphi na umngxuma okanye i-spacer layers |
| Umtya weMagnetic / Hologram | Qinisekisa ikhefu lomgca, ukuhambelana kophahla kunye nokufakwa kweekhowudi emva kokulanywa okanye ukuhlolwa |
| Ikhadi eligqityiweyo | Ukulinganisa ubukhulu, ukucaba, imilinganiselo kunye nokusebenza emva kokupholisa kunye nokulungiswa |
I-ID, Amakhadi okuFikelela kunye nobulungu
Iinkqubo ezigqityiweyo zeKhadi leLaminated
Amabanga ahlukeneyo eTeslin alungiselelwe iinkqubo ezahlukeneyo zoshicilelo. Abathengi akufanele bacinge ukuba iphepha elinye elimhlophe liya kuvelisa umphumo ofanayo kwi-offset, i-inkjet yedayi, i-pigment inkjet, i-laser, i-Indigo, isikrini okanye i-thermal-transfer-transfer equipment. Ukufaneleka kwebakala elichanekileyo, umshicileli kunye nesistim ye-inki iyafuneka.
| Inkqubo yoShicilelo | iMfuneko yoQinisekiso lwe-B2B |
|---|---|
| Ushicilelo lwe-Offset | Ukuseta i-Ink, ukuxinana, ukubambisa, ukomisa, inqanaba lomgubo, ukuthintela kunye nokuchasana kwe-lamination |
| I-Silk-Screen yoShicilelo | Ubungqingqwa be-inki, ukuhambelana kwe-solvent, ukunyanga, ukuguquguquka kunye nokudibanisa umaleko |
| Digital Laser Printing | Ubushushu be-Fuser, ukunamathela kwi-toner, ukuthuthwa kwamaphepha, ulawulo oluzinzileyo kunye nesiqinisekiso sezixhobo |
| Inkjet yoShicilelo | Sebenzisa ibakala elihambelana ne-inkjet; Idayi yovavanyo okanye inki ye-pigment, ixesha elomileyo, ukumelana namanzi kunye neprofayili yombala |
| HP Indigo / Digital Press | Qinisekisa ibakala elifanelekileyo, imfuneko ye-primer, ubushushu bengubo kunye ne-post-print lamination |
| Ngqo-to-iKhadi Umshicileli | Ngokuqhelekileyo iprinta ikhadi eligqityiweyo elingenanto kunokuba ishidi leTeslin elikhululekile; uvavanyo kuphela emva lamination ikhadi kunye ngenqindi |
Ukuprintwa kwamacala amabini kulawulwa yinkqubo yokushicilela, ibakala, ibhalansi yokufuma, ukugubungela umsebenzi wobugcisa kunye nokubhaliswa-kungekhona nje ukusebenzisa i-0.254mm impahla. Uyilo olulungelelanisiweyo lwangaphambili nasemva lunokunceda ukunciphisa i-curl emva kokushicilela kunye ne-lamination.
Imizobo elungisiweyo idla ngokuprintwa kumaphepha angaphantsi komhlaba phambi kokuba i-lamination. Amagama aguquguqukayo, iifoto, amanani okanye iibhakhowudi zinokudityaniswa ngexesha loshicilelo lwamaphepha okanye kamva kwikhadi eligqityiweyo, ngokuxhomekeke kukuhanjiswa komsebenzi wokukhutshwa.
I-Offset, iScreen kunye ne-Digital Printing Trials
I-Teslin substrate ingaba yi-platen-laminated okanye i-roll-laminated kunye neefilimu ezihambelanayo. Ukudibanisa okunamandla kwenzeka xa i-laminate okanye i-adhesive igeleza kwisakhiwo se-microporous. Iisetingi zokugqibela kufuneka zisekwe ngebakala lokwenyani le-substrate, i-overlay, i-inki, i-press kunye ne-card stack.
| Lamination Control | Kucetyiswa Practice |
|---|---|
| Imeko yokufuma | Umqathango we-substrate kunye namaphepha aprintiweyo phambi kwe-lamination; izinto ezomileyo kakhulu okanye ezifumileyo kakhulu zinokuwunciphisa umgangatho |
| Ubushushu | Beka ngokuhambelana nomthengisi we-laminate kunye nobushushu obuqinisekisiweyo be-substrate; musa ukuthembela kuphela kumatshini wokubonisa ubushushu |
| Uxinzelelo kunye nexesha | Ukubonelela ngokugeleza okwaneleyo kwiipores ngaphandle kokutyumza iitshiphusi, ukugqwesa umsebenzi wobugcisa okanye ukudala ukucudisa okugqithisileyo |
| Ukupholisa | Ukupholisa phantsi koxinzelelo olulawulwayo ukuphucula ukuthambeka kunye nokuzinza kwe-dimensional |
| Amandla e-Peel | Vavanya i-laminate egqityiweyo emva kokulungiswa kwemeko kunye nokuvezwa kokusingqongileyo |
| Ukutywinwa komda | Izakhiwo ezihambelanayo zeTeslin ze-laminate zihlala zifa-zinqunyulwe emva kwe-lamination ngaphandle komda otywiniweyo ohlukeneyo; qinisekisa ngefilimu ekhethiweyo |
Iiparamitha zokuqalisa ezipapashiweyo zinokunceda kulingo, kodwa ukuhanjiswa kobushushu okwenene kuyahluka ngepleyiti, ucinezelo, ubude bestaki, ikhemistri egqunyiweyo kunye nekhava eprintiweyo. Rekhoda iqondo lokushisa elivunyiweyo le-substrate, uxinzelelo, ukuhlala, ukupholisa kunye nokukhulula-ubumbeko lwefilimu yokuveliswa kwakhona.
Ukufuma okubanjiweyo, ubushushu obungonelanga, i-laminate engahambelaniyo, i-inki enzima okanye ukupholisa kakubi kunokudala amaqamza, isilivere, inkungu okanye i-curl. Hlola zombini iphepha kunye namakhadi afakwe ngenqindi emva kokulungiswa.
I-Teslin substrate inokuxhasa uyilo lwesiqinisekiso esinemaleko, kodwa iimpawu zokhuseleko zenziwe yinkqubo yoxwebhu olupheleleyo. Imathiriyeli yorhwebo esemgangathweni ayiqulathanga ngokuzenzekelayo i-covert yebakala likarhulumente okanye izinto ezisemthethweni.
| lweFeature yoKhuseleko | Imfuneko yoHlanganiso |
|---|---|
| Microtext kunye neFine-line Printing | Umsebenzi wobugcisa obuphezulu, ipleyiti elawulwayo okanye i-digital imaging kunye ne-post-lamination legibility |
| UV-Fluorescent Ink | Isiqinisekiso somthengisi we-inki, ulawulo lwe-fluorescence yangasemva kunye nokuhlolwa emva kokulanyiswa |
| Ukwaleka kweHolographic | Ukwaleka okubhalisiweyo, ukuhambelana kwe-laminate, ukucaca kwe-optical kunye nokuziphatha kwe-tamper |
| Ikhowudi yeQR kunye neBarcode | Umahluko woshicilelo, ukuchaneka kobukhulu, ukufundeka kweskena kunye nokukhuselwa kwe-abrasion |
| Ukhuseleko oluSiko lwe-Substrate yeBanga | Amanqaku abethelelwe ngenkqubo ethile afuna ikhonkco lonikezelo eligunyazisiweyo elikhuselekileyo kwaye alilingani nephepha elimhlophe eliqhelekileyo. |
Ukhuseleko lweLayered kunye noKhuseleko lweLaminate
I-Teslin substrate inokukhusela kwaye ikhusele i-RFID inlay, kodwa ukukhetha i-0.254mm endaweni ye-0.178mm ayenzi ngokuzenzekelayo ikhadi elilungele i-electronics ephezulu. I-inlay, i-chip, i-eriyali, i-adhesives, i-overlay kunye ne-lamination cycle kufuneka iyilwe njengesakhiwo esinye.
| I-Smart Card Factor | efunekayo uQinisekiso |
|---|---|
| I-Chip kunye nokuQhosha | Qinisekisa imodeli yechip, frequency, protocol, inkumbulo kunye nenkqubo yokufunda |
| Ijometri yeAntenna | Khusela umkhondo we-eriyali ngexesha lokutshiza, ukubetha kunye nokugqitywa kwekhadi |
| Inlay Ukutyeba | Bala i-chip bump, i-eriyali, i-carrier kunye ne-adhesive ngaphakathi kwe-stack yekhadi lilonke |
| Ukusasazwa koxinzelelo | Sebenzisa i-cushioning efanelekileyo kunye nemingxuma ukunqanda umonakalo wetshiphu okanye i-eriyali |
| Uvavanyo olusebenzayo | Uvavanyo lokufunda / ukubhala ukusebenza ngaphambi kokuthambisa, emva kokulanyiswa, emva kokubetha nangemva kokuguquguquka |
| nesicelo seNgcaciso yeSicelo | esiCetyisiweyo kuJoliso lweProjekthi |
|---|---|
| Iikhadi zeSazisi zeNkampani | Umgangatho wefoto, idatha eguquguqukayo, ikhowudi yebhakhowudi, ukuqina okungaphezulu kunye nokusetyenziswa kwebheji yemihla ngemihla |
| Amakhadi oMfundi kunye neFaculty | Ukushicilelwa komthamo ophezulu, ukwenziwa komntu, umsebenzi wemagnethi okanye weRFID kunye nokuguquguquka kwexesha elide |
| Amakhadi obulungu kunye nokunyaniseka | Umbala webhrendi, ibhakhowudi okanye ukufundeka kwe-QR, ukuqina kwe-wallet kunye nokuveliswa kweshiti ngeendleko ezifanelekileyo |
| Amakhadi angundoqo ehotele | Ukuhambelana komgca weMagnetic okanye i-RFID, uvavanyo lokutshixa kunye nobomi benkonzo obufutshane ukuya kwephakathi |
| Izazisi zezempilo kunye nezigulane | Ukuba semthethweni, ukucoca ukuvezwa, ukuskena ibhakhowudi kunye nokukhutshwa okulawulwayo |
| Iibheji zoMnyhadala kunye neeNdwendwe | Ushicilelo olufutshane lwedijithali, iindawo zokubeka, iilanyards, iikhowudi ze-QR kunye nokukhawuleza kobuntu |
| beNkqubo | yokuLawula uMgangatho weNdawo |
|---|---|
| I-Guillotine Cutting | I-Squareness, ukubhaliswa okuprintiweyo, imeko ye-blade kunye noxinzelelo lwe-stack |
| Card Punching / Die Cutting | Imilinganiselo yekhadi, i-radius yekona, i-edges ecocekileyo kwaye akukho kwahlukana kwe-laminate |
| Slot kunye Hole Punching | Isikhundla, umgama osekupheleni, umthwalo welanyard kunye nokumelana nokuqhekeka |
| I-Embossing okanye i-Foil Stamping | Ukwakhiwa kwekhadi eligqityiweyo, ubushushu, uxinzelelo, ukubambelela kwi-foil kunye nokufundeka |
| Thermal / Retransfer Personalization | Ukuthuthwa komshicileli, ukuhanjiswa kweribhoni, amandla angaphezulu, ukuphazamiseka kobushushu kunye nokuqina komfanekiso |
| Ufakelo lweekhowudi kwiMagnetic / RFID Encoding | Imveliso ye-encoding, ukuhambelana komfundi kunye nomsebenzi wasemva koxinzelelo |
| Amandla | oMathiriyeli | Iingcamango eziphambili |
|---|---|---|
| Teslin Substrate | Ukufunxwa koshicilelo oluphezulu, ukuhlangana okuqinileyo kwe-laminate, ukuguquguquka kunye nokuthotywa kwe-elektroniki | Ngokuqhelekileyo isetyenziswe njengengundoqo eprintiweyo ngaphakathi kwesakhiwo se-laminate kunokuba njengekhadi eligqityiweyo eliveziweyo |
| I-PVC | Inkqubo yekhadi esekiweyo, unikezelo olubanzi kunye neendlela eziqhelekileyo zobuntu | Iprofayili eyahlukileyo yokusingqongileyo, ukumelana nobushushu obuphantsi kunye nokuhlaziywa okulinganiselweyo kwiimarike ezininzi |
| I-PETG | Ukuqina, ukucaca kunye nezicelo ezinamandla zekhadi le-multilayer | Iresiphi yokuncamathelisa i-inki kunye ne-lamination yahlukile kwi-Teslin substrate ene-porous |
| Polycarbonate | Ukuqina okuphezulu, ukuxhathisa ubushushu kunye nokukwazi ukwenza i-laser-personalization kumabakala azinikeleyo | Izinto eziphezulu kunye neendleko zemveliso; isetyenziselwa ukufuna iziqinisekiso zobomi obude |
| Inspection Item | eCetyisiweyo |
|---|---|
| Isazisi Material | Umenzi, ibakala, ikhowudi yobukhulu, ibhetshi kunye nereferensi yesatifikethi |
| Ukutyeba kunye nobukhulu | I-avareji yegeyiji, ukunyamezela, ubude beshiti, ububanzi, isikwere kunye nokuchaneka kokusika |
| Imbonakalo | Ubumhlophe, umthunzi, amabala amnyama, ungcoliseko, imibimbi, imibimbi kunye nomonakalo osemaphethelweni |
| Ukucaba kunye nokufuma | I-Curl, isaphetha, imeko yokugcina kunye nokulinganisela komswakama ngaphambi kokuprintwa kunye ne-lamination |
| Printa iMfaneleko | Ubuninzi, ukunamathela, ukomisa, umbala, iinkcukacha zomfanekiso, ukufundwa kwebhakhowudi kunye nokuthintela |
| Uvavanyo lweLamination | Amandla e-Peel, amaqamza, inkungu, ukwahlukana komphetho, ukugoba kunye nobukhulu obugqityiweyo |
| UVavanyo lweKhadi eligqityiweyo | Imilinganiselo, ukuguquguquka, ukukrazula, ukwenziwa komntu, amandla eslot, i-encoding kunye nomsebenzi wokufunda |
| Ukupakisha kunye nokulandeleka | Isitaki esikhuselweyo, ukubala, ileyibhile yeekhathoni, ukucwangciswa kwepalethi, inombolo yeqashiso kunye nengxelo yokuhlola |
I-Teslin substrate iyacinezeleka kwaye kufuneka ikhuselwe kubushushu, ukukhanya kwe-UV, ungcoliseko, ukungalingani kokufuma kunye noxinzelelo olugqithisileyo. Ukugcinwa okuchanekileyo kunceda ukugcina umbala, ukucaca, ukusebenza kokushicilela kunye namandla okukhanya.
Gcina izinto ezigqunyiweyo kwindawo ecocekileyo kude nomsi ovuthayo kunye nezingcolisi zangaphakathi.
Khusela amashiti ekukhanyeni okuthe ngqo kwe-UV kunye namaqondo obushushu angaphezu komda wogcino oluvunyiweyo.
Gcina amashiti asikiweyo ethe tyaba kwindawo eqinileyo, exhaswayo.
Musa ukubeka imithwalo enzima okanye iipalethi ezipakishwe kabini kwiibhokisi ezisikiweyo zamaphepha.
Kuphephe ukubopha imitya eqinileyo enokuthi icinezele imiphetho okanye iphawule isitaki samaphepha.
Gcina iipakethi ezingaphelelanga zisongelwe ngokutsha ukunqanda uthuli, ukuguquka kombala kunye nokutshintsha kokufuma.
Amaphepha emeko kwigumbi lemveliso phambi kokuprintwa okanye ukulanyiswa xa iimeko zokugcina iimpahla zahlukile.
I-Wallis ixhasa abavelisi bamakhadi kunye nabasasazi bezinto eziphathekayo ngokufumana i-substrate, ukusika amaphepha angokwezifiso, ukupakishwa okukhuselweyo kunye nokubonelela ngekhadi-material elungelelanisiweyo. Umyalelo ngamnye kufuneka uqhagamshelwe kwisampulu evunyiweyo kunye nenkcazo ebhaliweyo egqumayo ibakala, ubukhulu, inkqubo yoshicilelo, ulwakhiwo lwelamination kunye neemfuno zekhadi eligqityiweyo.
Ukwenziwa kweMathiriyeli yeKhadi kunye nokuThunyelelwa kwamanye amazwe
Iigeyiji ezimbini zekhadi eliqhelekileyo: 0.178mm kunye ne-0.254mm iinketho zezakhiwo zekhadi elaminethiweyo.
Inkxaso yenkqubo yoshicilelo: I-Offset, i-silk-screen kunye nolingo loshicilelo lwedijithali lunokulungelelaniswa phambi kokuvunywa okuninzi.
Uphuhliso olugxile kwi-Lamination: I-Substrate, i-overlay, i-adhesive, ubushushu kunye nobukhulu bekhadi bunokuhlaziywa njengenkqubo enye.
Amava ekhadi le-RFID: Ubukhulu be-Inlay, i-cushioning, ukukhuselwa kwe-chip kunye neemvavanyo zomfundi zingabandakanywa kwisampuli yokuqinisekisa.
Ukusika kunye nokupakisha ngokwezifiso: Ifomethi yePhepha, ukukhuselwa kwe-stack, iibhokisi kunye neepallets ziyakwazi ukulungelelaniswa neemfuno zemveliso kunye nokuthumela ngaphandle.
Inkonzo ye-B2B yomzi-mveliso: Ifanelekile kwiifektri zamakhadi, abashicileli, abaguquli, iinkampani ze-RFID, abarhwebi kunye nabasasazo.
Isicelo sekhadi, ubomi benkonzo obulindelekileyo kunye nemarike yendawo ekuyiwa kuyo.
Ubukhulu obufunekayo: 0.178mm / 7 mil okanye 0.254mm / 10 mill.
Ubude bephepha, ububanzi, ukunyamezela, isikwere kunye nobuninzi.
Inkqubo yoshicilelo, imodeli yomshicileli, i-inki okanye itoner kunye nomsebenzi wobugcisa onamacala amabini.
Izinto ezingaphezulu, ubukhulu, ukugqiba, i-adhesive kunye nezixhobo zokulambisa.
Imilinganiselo yekhadi ekujoliswe kuyo egqityiweyo, ubukhulu kunye nommandla wekona.
Itshiphu yeRFID, i-eriyali, inlay, umgca wemagnethi, ihologram okanye elinye icandelo.
Ukushicilelwa kokhuseleko, ikhowudi yebhakhowudi, ikhowudi yeQR kunye neemfuno zomntu.
Izatifikethi ezifunekayo, ukulandelelwa kwezinto kunye nengxelo yokuhlolwa.
Ubungakanani bovavanyo, uqikelelo lonyaka, indawo yokusingwa kunye neshedyuli yokuhanjiswa.
Xoxa ngeProjekthi yakho yeKhadi leTeslin
I-0.178mm substrate yi-7 mil, ngelixa i-0.254mm substrate yi-10 mil. Ibakala elityebileyo linegalelo ngakumbi kubunzima bekhadi lilonke kunye nokuthotywa, kodwa zombini zifuna ukuvavanywa kwisakhiwo esipheleleyo se-laminate.
Ewe. Ushicilelo olunamacala omnye okanye kabini luxhomekeke kwibakala elingaphantsi, inkqubo yoshicilelo, inkqubo ye-inki, ibhalansi yomsebenzi wobugcisa kunye nokubhaliswa—kungekhona nje kubukhulu beshiti.
Akukho khetho lukazwelonke. Bala i-substrate, ii-overlays zangaphambili nangasemva, i-adhesive, printing kunye ne-inlay yokuzikhethela, emva koko i-laminate kwaye ilinganise ikhadi eligqityiweyo eligqityiweyo.
I-substrate esekelwe kwi-polyolefin ixhathisa amanzi, kodwa ukuqina kokushicilela kuxhomekeke kwi-inki, ibakala kunye ne-lamination. Ikhadi eligqityiweyo kufuneka livavanyelwe amanzi, ukufuma kunye nokucoca i-exposure.
Sebenzisa ibakala leTeslin elihambelana ne-inkjet kwaye uvavanye idayi ethile okanye inki ye-pigment. Amabakala asemgangathweni kunye namabakala e-inkjet adityanisiweyo anokuziphatha ngendlela eyahlukileyo ngexesha elomileyo, umbala kunye nokumelana namanzi.
Amabakala afanelekileyo angaprintwa ngelaser, kodwa ubushushu befuser, uthutho lwamaphepha, ukuncamathela kwetoner kunye nesiqinisekiso somshicileli kufuneka sitshekishwe. Musa ukusebenzisa imathiriyeli engavunywanga kwisixhobo.
Uninzi lwabashicileli abathe ngqo ukuya kwikhadi bayilelwe amakhadi angenanto agqityiweyo, hayi amakhasi angaphantsi akhululweyo. Shicilela kwaye ulalise iphepha kuqala, ubethe amakhadi, kwaye emva koko uvavanye ubuwena kwizikhewu ezigqityiweyo.
Iilaminates ezininzi ze-thermal kunye neefilimu ezincamathelayo zinokusebenza, kodwa ukuhambelana kuxhomekeke kubushushu bokusebenza, ukuhamba, ubukhulu kunye neemfuno zekhadi eligqityiweyo. Vuma i-substrate echanekileyo kunye nefilimu indibaniselwano ngovavanyo lwamaxolo.
Izakhiwo zeTeslin ezilayitiweyo ngokufanelekileyo zinokuthi zisikwe kwimilo egqityiweyo ngaphandle komda otywiniweyo ohlukeneyo ngenxa yokuba iibhondi ze-laminate kwi-matrix ene-porous. Qinisekisa oku nge-laminate ekhethiweyo kunye nenkqubo.
Izizathu ezinokwenzeka ziquka ukufuma okugqithisileyo, ubushushu obungonelanga, umoya ovalelweyo, i-inki enzima, i-laminate engahambelaniyo okanye uxinzelelo olungonelanga. Lungiselela amaphepha kwaye uqinisekise ubushushu be-substrate.
Ewe. I-cushioning yayo inokunceda ukukhusela i-electronics, kodwa i-chip, i-antenna, ubukhulu be-inlay, i-adhesive, uxinzelelo kunye nokusebenza okugqityiweyo kufuneka kuqinisekiswe.
Ayizenzekeli. I-substrate etyebileyo inokubonelela ngakumbi nge-cushioning, kodwa iphinda itshintshe ubukhulu bekhadi elipheleleyo kunye nokusabalalisa uxinzelelo. Ulwakhiwo olupheleleyo lwe-inlay lumisela ukusebenza.
I-substrate emhlophe eqhelekileyo ibonelela ngoshicilelo kunye neenzuzo zokuthambisa kodwa akufuneki ichazwe njengequlathe iziphawuli zokhuseleko olufihlakeleyo. Inkqubo ethile yokhuseleko-ibakala yimveliso eyahlukileyo elawulwa.
Ewe. I-Holographic overlays, i-inks ye-UV, i-microtext kunye nezinye iimpawu zinokudityaniswa ngokuprintwa okuhlukeneyo kunye neenkqubo zokulayita. Ukubonakala kwazo kunye nokuqina kwazo kufuneka zivavanywe emva kwemveliso.
Ukusebenza kokusingqongileyo kuxhomekeke kwimathiriyeli ekrwada, ukwakhiwa kwamakhadi, ubomi benkonzo, ukuvelisa, uthutho kunye neendlela ezikhoyo zokulahla. Liphephe ibango elibanzi lokuphakama ngaphandle kovavanyo oluchaziweyo lomjikelo wobomi.
Ukurisayikilishwa kwakhona kuxhomekeke kwingqokelela yendawo kunye nolwakhiwo olupheleleyo lwekhadi. Ilaminates, ii-inki, imigca kazibuthe, iitshiphusi kunye nee-eriyali zinokufuna ukwahlukana okanye ukulahlwa kweengcali.
Gcina amashiti egqunyiwe, athe tyaba, omile kwaye ekhuselwe ekukhanyeni kwe-UV, ubushushu, umsi, uthuli kunye noxinzelelo olugqithileyo lwemfumba. Zibeke iimeko phambi koshicilelo okanye ukulatyuza.
Ukusika ngokwesiko kunokuxoxwa ngokuhambelana nokuhlelwa kokushicilela, i-lamination plate, ukufakwa kwekhadi, ukunyamezela, ubuninzi kunye neemfuno zokupakisha.
Ewe. Shicilela, i-laminate, ipholile, imeko, i-punch kwaye wenze amakhadi eesampuli alungele wena usebenzisa izixhobo zokuvelisa ezicetywayo ngaphambi kokuvuma imathiriyeli.
I-MOQ ixhomekeke kwibakala, ubukhulu, ubungakanani beshiti, ukusika isiko, isiqinisekiso sokushicilela, ukupakisha kunye noqikelelo lonyaka.
Ukubonelela ngobuninzi, ubungakanani beshiti, inkqubo yoshicilelo, ukugquma, izixhobo zokulambisa, ubukhulu bekhadi eligqityiweyo, iRFID okanye iimfuno zomgca, ubungakanani, indawo ekuyiwa kuyo kunye neshedyuli yokuhanjiswa.
Qhagamshelana neWallis Plastic ye-0.178mm kunye ne-0.254mm emhlophe yephepha le-Teslin eyenziwe nge-ID elaminethiweyo, ubulungu, isitshixo sehotele, isiganeko kunye neeprojekthi zekhadi le-RFID. Iqela lethu lixhasa ukukhetha ubukhulu, ukusika isiko, ukuprintwa kunye nezilingo zokuthambisa, ukuphononongwa kobume bekhadi, ukucaciswa komgangatho kunye nobonelelo lweB2B ngqo kumzi-mveliso.
I-Teslin luphawu lokuthengisa olubhalisiweyo lwe-PPG Industries Ohio, Inc.
