Iphepha le-Teslin® Synthetic le- RFID kunye noKhuseleko lokwenziwa kweKhadi

Iphepha le-Teslin® Synthetic le- RFID kunye noKhuseleko lweKhadi lokuVelisa

UWallis ubonelela ngephepha elenziwe ngeTeslin® ukwenzela RFID ukwenziwa kwamakhadi , iinkcukacha ezikhuselekileyo zesazisi, amakhadi okufikelela, amakhadi ezitshixo zehotele, amakhadi obulungu, amakhadi ahlakaniphileyo kunye neemveliso zamakhadi alaminated. Ubume bayo be-microporous buxhasa ukushicilelwa kwenkcazo ephezulu, i-anchorage eyomeleleyo ye-laminate kunye ne-cushioning ejikeleze iitshiphusi ezifakwe ngaphakathi kunye nee-eriyali.

Kubavelisi bekhadi le-B2B, abavelisi abaqinisekisiweyo, RFID abaguquleli kunye neenkampani zokushicilela, ibakala elichanekileyo le-Teslin substrate kufuneka likhethwe ngokwenkqubo yokushicilela, inkqubo ye-laminate, ukwakhiwa kwekhadi eligqityiweyo kunye neemfuno zokusetyenziswa kokuphela. IWallis ixhasa ubungakanani beshiti eliqhelekileyo, ukukhetha ubukhulu, isiqinisekiso sesampulu, ukusika kunye nokupakishwa kokuthumela ngaphandle.

Ukuchongwa kwezinto: I-TESLIN® luphawu lwentengiso olubhalisiweyo lwe- PP G Industries. Abathengi kufuneka baqinisekise ukuba ikowuteshini ibandakanya i-genuine PP G TESLIN® substrate, ibakala lemveliso ethile kunye namaxwebhu axhasayo. 'Iphepha leTeslin' akufuneki lisetyenziswe njengenkcazo yegeneric kumaphepha okwenziwa anganxulumananga.

INkcazelo yeNkcazo yeKhadi ye-Teslin ye-Substrate

Parameter	B2B IsiKhokelo sokucaciswa
Imveliso	I-microporous polyolefin-based synthetic card substrate; ngokwenene PP ibakala le-G TESLIN® liza kuqinisekiswa kwikoteyishini kunye nesampulu evunyiweyo.
Ubungakanani bePhepha eliMgangatho	I-A4 210 × 297mm ukusuka kwinkcazo yemveliso yangoku; ubungakanani bephepha lemveliso yekhadi lesiko lingaphononongwa.
Ukutyeba	Uluhlu lwangoku lwephepha leWallis: 100–300 microns. Ubukhulu bokugqibela obukhoyo buxhomekeke kwibakala elikhethiweyo leTeslin, ifomathi yesitokhwe kunye nemfuneko yokuguqulwa.
Umphezulu	Umphezulu omhlophe we-matte microporous; umgangatho, thermally stabilized, inkjet-coated, digital-print okanye amabakala okhuseleko angachazwa ngokweprojekthi.
Ukushicilela	I-offset, isikrini, i-flexographic, i-gravure, i-thermal transfer, i-laser, i-inkjet kunye neenkqubo ezikhethiweyo zedijithali, ngokuxhomekeke kwibakala kunye nesiqinisekiso sezixhobo.
Lamination	Iyahambelana neplaten okanye i-roll lamination xa ihambelana nelaminate evunyiweyo, ubushushu, uxinzelelo, ixesha lokuhlala kunye nomjikelo wokupholisa.
IZakhiwo zeKhadi	Umaleko wekhadi eliprintiweyo, i-substrate ephakathi okanye i-cushioning layer edibeneyo PVC , PET , PETG , PC , ii-overlays, RFID ii-inlays, imigca yamagnetic okanye amanye amacandelo avunyiweyo.
Ukwenza ngokwezifiso	Imilinganiselo yamaphepha, ubukhulu/ibakala, ukusika, indlela yoshicilelo, ukudityaniswa kwelaminate, ukupakishwa, iilebhile kunye neemfuno zokuhlolwa.
Amaxwebhu asemgangathweni	Ukuchongwa kwezinto eziphathekayo, ulwazi lweqashiso, uxwebhu oluchazayo, ingxelo yohlolo kunye namanye amaxwebhu axhomekeke kumda wobonelelo oluqinisekisiweyo.

Yintoni iTeslin® Synthetic Paper?

I-Teslin substrate ayilophepha leselulosi eqhelekileyo. Yimathiriyeli ene-single-layer, microporous, igcwele kakhulu ipololefin-based synthetic. I-matrix yayo ene-porous yamkela i-inki, i-toners, i-adhesives, i-coatings kunye ne-laminates kwisakhiwo kunokuba ishiye kuphela kwindawo egudileyo.

Esi sakhiwo sinokuphucula i-anchorage yokushicilela, i-laminate bonding kunye nokuchasana nokususwa kwedatha. Isenokubonelela ngokujikeleza RFID iitshiphusi, uqhagamshelo lwe-eriyali kunye nezinye izinto zombane ezifakwe ngaphakathi xa ulwakhiwo lwekhadi eligcweleyo luyinjineli ngokufanelekileyo.

I-Teslin ayiboneleli RFID iSebenzisa ngokwalo

Umsebenzi we- RFID unikezelwa yitshiphu ekhethiweyo, i-eriyali, ubeko lobeko kunye neprothokholi yokufunda. I-Teslin yi-substrate eprintwayo okanye eyakhiweyo ejikeleze loo macandelo. RFID ukuhambelana ngoko kufuneka kuqinisekiswe ngeyona nto LF , HF , NFC okanye UHF inlay, i-laminate structure kunye nenkqubo yokufunda.

IBanga leTeslin kunye nokutyeba kufuneka kuqinisekiswe

Amagama emveliso afana ne-SP, TS, IJWP, Digital kunye neBanga loKhuseleko lichaza iithagethi zokusebenza ezahlukeneyo. Inkcazo yegeneric '100–300 micron Teslin sheet' ayanelanga ukuvunywa kwemveliso. Ibakala, ubukhulu begama, isalathiso samaphepha, indlela yokuprinta kunye nenkqubo yelaminate kufuneka irekhodwe kwiinkcukacha ezivunyiweyo.

UKhetho lweBanga leTeslin kwiiProjekthi zeKhadi

Udidi	oluQhelekileyo loMsebenzi	weKhadi-Ukuqwalaselwa kweProjekthi
SP Standard Grade	Ushicilelo lwenjongo ngokubanzi kunye nezicelo ze-laminated.	Qinisekisa inombolo yebakala le-SP ngqo, ubukhulu, inkqubo ye-inki kunye ne-laminate adhesion ngokusebenzisa iimvavanyo zemveliso.
I-TS Thermally Stabilized	Usetyenziso olufuna ulawulo olungqongqo lwe-thermal-shrinkage.	Iluncedo xa ukubhaliswa koshicilelo, ukucaca kweshiti okanye ukubonakaliswa kobushushu okuphindaphindiweyo kubalulekile; qinisekisa umjikelo opheleleyo we-lamination.
IJWP Inkjet iBanga	Imifanekiso ye-inkjet esekwe kwidayi enecala elimbini lokuprinta.	Musa ukucinga ukuba ibakala elingagqunywanga liza kubonelela ngokubamba i-inki efanayo, ukomisa okanye ukuxhathisa kwamanzi.
IBanga leDigital Shicilela	Amaqonga athile oshicilelo lwedijithali okanye iinkqubo ezifanelekileyo ze-electrophotographic.	Imodeli yomshicileli, ubushushu bengubo, itoner/inki encamathelayo kunye nokubaleka kufuneka ibe nesiqinisekiso.
IBanga loKhuseleko	Iziqinisekiso ezikhuselekileyo ezifuna iimpawu zokhuseleko ezizinzisiweyo okanye zenkqubo ethile.	Ubukho, ugunyaziso, ikhonkco lokugcinwa kunye namaxwebhu eprojekthi kufuneka aqinisekiswe ngokwahlukeneyo.
IPhepha eliLinganayo le-Synthetic	Enye i-microporous okanye i-coated synthetic substrates.	Akufunekanga ithengiswe njengeTeslin yokwenyani ngaphandle kokuba inikezelwe phantsi kophawu olusemthethweni kunye nebakala.

Ukuhambelana koShicilelo kunye noVavanyo lwangaphambili lweMveliso

I-Teslin substrate ixhasa uluhlu olubanzi lwetekhnoloji yoshicilelo, kodwa ibakala elichanekileyo liyinkqubo ethile. Iifektri zamakhadi kufuneka zivavanye ukuxinana kwemifanekiso, ukufumana amachaphaza, ukomiswa okanye ukunyangwa, ukuncamathelwa kwetoner, umgangatho wedatha eguquguqukayo, ubhaliso kunye nenkangeleko yasemva kokulanywa phambi kokwamkela imathiriyeli eninzi.

Inkqubo yoShicilelo	ecetyisiweyo	imingcipheko engundoqo yokuHlolwa
ILithography ye-Offset	Qinisekisa uthotho lwe-inki, indlela yokomisa, ukugqunywa kwe-inki iyonke kunye nokutyisa amaphepha.	Ukuseta, ibhalansi yokufunxa i-inki, ukuxinana kombala kunye nokugqwetheka emva kokulanyiswa.
Ushicilelo lweSkrini	Qinisekisa i-inki chemistry, i-mesh, ubukhulu bediphozithi kunye neemeko zokunyanga.	Ukuthintela, iileya ze-inki ezibrittle kunye ne-laminate bonding phezu kwe-inki enzima yokugubungela.
I-Laser / iToner eyomileyo	Sebenzisa ibakala eliwufanelekeleyo umshicileli ngqo kunye noluhlu lweqondo lobushushu.	I-Curl, i-shrinkage, i-toner offset, i-jamming kunye ne-toner adhesion.
Inkjet esekelwe kwidayi	Cacisa ibakala elifanelekileyo le-inkjet elifana ne-IJWP apho kufuneka khona.	Ukopha, ukugcwala ngokugqithisileyo, ixesha lokumisa, ukuxinana kombala kunye nokunganyangeki kwamanzi.
HP Indigo / Digital Press	Qinisekisa ibakala elivunyiweyo kunye nemodeli yeendaba echanekileyo.	Ukuhambelana kwengubo, ifestile yokusebenza, ukudluliselwa kwe-inki kunye nokunamathela.
Ukudluliselwa kweThermal kunye neDatha eGuquguqukayo	Uhlobo lweribhoni yovavanyo, amandla okuprinta, ibakala lebhakhowudi kunye nokumelana nokuqhawuka.	Inkcazo yecala elibi, ukuchasana okuphantsi okanye umonakalo wedatha ngexesha le-lamination.

Umgaqo wokufaneleka: 'Offset / screen / digital compatible' akuthethi ukuba ibakala elinye lizilungele ngokuzenzekelayo umshicileli ngamnye. Ulwamkelo lokugqibela kufuneka lusebenzise owona mshicileli womthengi, i-inki okanye itoner, ukhuselo lomsebenzi wobugcisa kunye nesantya semveliso.

RFID kunye noLwakhiwo lwekhadi eliSmart

Isiqhelo RFID okanye ubungqina obukhuselekileyo bunokudibanisa iileya zeTeslin eziprintiweyo kunye ne-inlay engaxhunywanga kunye neefilimu ezikhuselayo zangaphandle. Ulwakhiwo lokugqibela kufuneka luyinjineli njengenkqubo epheleleyo kunokuvavanya iphepha elenziweyo lodwa.

Uluhlu	uMsebenzi	lweNdawo yokuVumela
Uphahla lwangaphambili okanye iLaminate	Ikhusela ushicilelo kwaye inokuthwala iholographic, UV okanye iimpawu zokhuseleko lomphezulu.	Ukucaca, ukudibanisa, ukukrazula, ukugoba kunye nokuhambelana komntu.
Uluhlu lweTeslin oluprintiweyo ngaphambili	Iphatha iifoto, umbhalo, iigrafiki, iikhowudi zebhakhowudi, iikhowudi zeQR kunye noshicilelo lokhuseleko.	Ibakala lokuprinta, ukubhaliswa, umgangatho womfanekiso kunye nokunamathela kwe-laminate.
RFID Inlay / Chip kunye ne-antenna	Ibonelela ngomsebenzi we-elektroniki ongaqhagamshelwanga.	Ukuphindaphinda, iprotocol, indawo ye-eriyali, ukuphakama kwetshiphu, uluhlu lokufunda kunye nokufakwa kweekhowudi.
Ngasemva Eprintiweyo Teslin Layer	Ilinganisa ulwakhiwo kwaye ithwala imizobo esecaleni-ngasemva okanye idatha.	Iinkozo/umkhomba-ndlela, ubukhulu be-symmetry kunye nokuhambelana kwe-print-lamination.
Ukwaleka ngasemva okanye iLaminate	Ibonelela ngokhuseleko kunye nokusebenza komphezulu wekhadi lokugqibela.	Amandla e-Peel, ukumelana nomkrwelo kunye nomgca wemagnethi / ukuhambelana kwepaneli yotyikityo.

UkuLamination, Ukusika kunye nokuguqulwa kweKhadi

Ukukhethwa kweLaminate

I-laminate kufuneka ihambelane nebakala leTeslin, inkqubo yokuprinta kunye nobukhulu bekhadi eligqityiweyo. Iifektri zamakhadi kufuneka ziqinisekise i-laminate chemistry, ubukhulu, ukunyibilika okanye uluhlu olusebenzayo kunye nokusebenza kokugqibela kwamaxolo. Iresiphi efanayo ye-lamination akufanele icingelwe PVC , PET , PETG kunye PC iifilimu zokugubungela.

Ubushushu, Uxinzelelo kunye nokuPholisa

Ukushisa okugqithisileyo okanye ixesha lokuhlala lingabangela ukuncipha, ukugoba, ukunyakaza komfanekiso okanye RFID uxinzelelo lwecandelo. Ukushisa okungonelanga okanye uxinzelelo kunokubangela ukudibanisa okubuthathaka. Rekhoda ubushushu beplaten okanye umqulu, uxinzelelo, ixesha lokuhlala, ixesha lokupholisa kunye nolwakhiwo lwesitaki ngexesha lokuvunywa kwesampulu.

Die Ukusika kunye noVavanyo olugqityiweyo lwekhadi

Emva kwe-lamination, hlola i-flatness yekhadi, ingqibelelo yomphetho, umgangatho wekona, ubukhulu, ukumelana nokuguquguquka kunye nokusebenza kombane. RFID iimvavanyo zokufunda kufuneka ziphindwe emva kwe-lamination kunye nokusika ukufa ngenxa yokuba ukulungiswa kwe-antenna kunye nokudibanisa i-chip kunokuchaphazeleka kwisakhiwo sekhadi lokugqibela.

Izicelo zeTeslin Card Substrate

I-Teslin substrate isetyenziselwa apho ukuqina kokushicilela, ukubopha i-laminate kunye nokukhuselwa kwedatha edibeneyo okanye i-electronics ibalulekile. Ibakala lemathiriyeli elichanekileyo kunye nokwakhiwa kwekhadi elipheleleyo kufuneka kuvunywe ukusetyenziswa kwesiphelo ngasinye.

• RFID amakhadi olawulo lokufikelela kunye nenkcazi zabasebenzi

• NFC ubulungu, ukunyaniseka kunye namakhadi enkonzo yeendwendwe

• Amakhadi angundoqo ehotele ahambelana netshixo yenkqubo echaziweyo

• Khusela amakhadi esazisi, iipemethe kunye neziqinisekiso zikarhulumente

• I-inshurensi, ithala leencwadi, ezempilo kunye namakhadi emfundo

• Ukudlula kwesiganeko, iithegi eziphambili kunye neebheji ezilaminethiweyo ezomeleleyo

• Amakhadi ahlakaniphile aneetphuphu, ii-eriyali, imigca kazibuthe okanye iibhakhowudi

Iintlawulo kunye neenkqubo zikarhulumente: ukufaneleka kwamakhadi ebhanki, iziqinisekiso zesazisi ezisemthethweni okanye iinkqubo zokhuseleko ezilawulwayo kufuneka zisekwe ngeenkcukacha zobugcisa zomniki, iimfuno zokhuseleko kunye neziqinisekiso ezifunekayo. Ukukhetha izinto kuphela akumiseli ukuthotyelwa.

Ulawulo loMgangatho weB2B Card Abavelisi

Inqaku lokuHlola	into omawuyiqinisekise
Isazisi Material	Uphawu, ibakala lemveliso, inombolo yeqashiso kunye namaxwebhu acacisayo axhasayo.
Ukutyeba kunye neSiseko sobunzima	Ixabiso legama, ukunyamezela okuvunyelweneyo kunye nendlela yokulinganisa.
Imilinganiselo yePhepha	Ubude, ububanzi, isikwere, imeko yomda kunye nolwalathiso lokusika.
Imbonakalo	Ubumhlophe, ukufana komphezulu, uthuli, amanqaku, imibimbi kunye nokusuleleka.
Ukushicilela	Ubuninzi bombala, ukusonjululwa komfanekiso, ukufundeka kwebhakhowudi, ukuncamathela kwetoner/inki nokomisa.
Lamination	Amandla e-Peel, amaqamza, isilivere, i-curl, i-shrinkage kunye nokuphazamiseka okubonakalayo.
RFID Ukusebenza	Impendulo ye-Chip, uluhlu lokufunda, i-encoding, i-UID / ukuqinisekiswa kwedatha kunye nesivuno se-post-lamination.
Ikhadi eligqityiweyo	Ukutyeba, ukuba tyaba, ukugoba, umgangatho womphetho, ukukrazuka kunye novavanyo lokusingqongileyo olufunwa ngumthengi.

Ukuvunywa kweSampuli kunye neNkqubo yeSampuli yeGolide

1. Ngenisa idatha yeprojekthi: ukusetyenziswa kwekhadi, ubungakanani obugqityiweyo, ubume bomaleko, imodeli yomshicileli, i-laminate kunye ne- RFID inlay.

2. Qinisekisa imathiriyeli: ubume bophawu lweTeslin lokwenyani, ibakala, ubukhulu, ubungakanani beshiti kunye namaxwebhu afunekayo.

3. Qhuba izilingo zokuprinta: vavanya umgangatho womfanekiso, idatha eguquguqukayo, iikhowudi zebhakhowudi kunye ne-inki okanye itoner adhesion.

4. Qhuba ulingo lwe-lamination: rekhoda ubushushu obupheleleyo, uxinzelelo, ukuhlala kunye nokupholisa iresiphi.

5. Uvavanyo lwamakhadi agqityiweyo: hlola i-peel, i-flex, i-fae cut, inkangeleko kunye RFID nokusebenza.

6. Yamkela iSampuli yeGolide: sebenzisa isampuli esayiniweyo kunye neenkcukacha ekuvunyelwene ngazo njengereferensi yokuvelisa isambuku.

Ulwazi olufunekayo kwi-Quote ye-B2B eFanayo

yoLwazi	iMizekelo
IMfuneko yezinto eziphathekayo	Okwenyani PP G TESLIN® okanye evunyiweyo ngokulinganayo; SP, TS, IJWP, Digital okanye iBanga loKhuseleko.
Ukutyeba kunye nobukhulu	I-micron ye-Nominal / mil, i-A4 okanye imilinganiselo yamaphepha angokwezifiso, ukunyamezela ukusika kunye nobuninzi.
Izixhobo Zokuprinta	I-offset press, umgca wesikrini, umshicileli welaser, imodeli ye-inkjet, i-HP Indigo okanye enye i-digital press.
Ukwakhiwa kweKhadi	Ilaminate yangaphambili/ngasemva, iTeslin layers, RFID inlay, umgca wemagnethi, ipaneli yotyikityo kunye nobunzima bokugqibela.
RFID Inkqubo	I-chip, i-frequency, i-protocol, i-eriyali uyilo, imodeli yomfundi, i-encoding kunye nomgama wokufunda ojoliswe kuyo.
Uvavanyo kunye namaxwebhu	I-TDS, ingxelo yokuhlola, ubungakanani besampulu, izibhengezo zokuthotyelwa kunye nokulandeleka kweqashiso.
Iinkcukacha zoRhwebo	Ubungakanani bovavanyo, imfuno yonyaka, indawo yokuhanjiswa, ukupakishwa kunye ne-Incoterm.

Ukupakishwa, ukugcinwa kunye nokuThunyelwa kweHlabathi

Amashiti kufuneka akhuselwe kuthuli, ukufuma, umonakalo emaphethelweni, ukugoba kunye nobushushu obungalawulekiyo ngexesha lokugcinwa kunye nokuthutha. Ukupakishwa kunokubandakanya ukusongelwa kwangaphakathi okutywiniweyo, iibhokisi eziqinileyo, ukhuseleko lwepalethi, iilebhile zesiko kunye nokuchongwa kweqashiso ngokomyalelo ekuvunyelwene ngawo.

Gcina imathiriyeli ithe tyaba kwipakethe yayo yokuqala kwaye uyivumele ukuba iqhelane negumbi lokuprinta ngaphambi kokuvula. Iimeko ezithile zokugcina kunye nesikhokelo sobomi beshelufu kufuneka silandele amaxwebhu ebakala aqinisekisiweyo kunye neenkcukacha zomthengisi.

Kutheni le nto iMathiriyeli yeKhadi leTeslin evela eWallis?

I-Wallis ixhasa abavelisi bamakhadi kunye nabaguquli ngokukhetha izinto eziphathekayo, ukusika amaphepha angokwezifiso, ukuvavanywa kwesampuli kunye nokulungelelaniswa kwendawo enye yee-core card sheets, ii-overlays, RFID ii-inlay kunye nezakhiwo zekhadi eligqityiweyo.

• Ingxoxo yobugcisa esekelwe kumshicileli wokwenene, i-laminate kunye ne- RFID inkqubo

• Ubungakanani beshiti esiko, ukukhetha ubukhulu, ukusika kunye nenkxaso yokupakisha

• Isampulu kunye nemvume yeSampuli yeGolide ngaphambi kokuveliswa kobuninzi

• Ulungelelwaniso lweesubstrates zamakhadi, ii-overlays, ii-inlay kunye nemathiriyeli yekhadi enxulumeneyo

• Ukupakishwa kwamanye amazwe, ukumakisha ukuthunyelwa kunye nenkxaso yamaxwebhu eprojekthi

Ingxelo yoMthengi

Imibuzo ebuzwa qho

Ngaba iphepha leTeslin liyafana nephepha eliqhelekileyo elenziweyo?

Hayi. TESLIN® ibhalisiwe PP ibhrendi ye-G ye-microporous ethile, i-polyolefin-based synthetic substrate. Amanye amaphepha okwenziwa anokuba nokwakheka okwahlukileyo, ukuziphatha koshicilelo kunye nokusebenza kokunyibilikisa.

Ngaba iWallis ngumenzi weTeslin substrate?

I-Teslin substrate yenziwe ngu- PP G. Wallis unokusebenza njengomthengisi wekhadi-izinto eziphathekayo okanye umguquleli. Ikowuteshini kufuneka ichaze ngokucacileyo uphawu, ibakala, ubukhulu kunye namaxwebhu axhasayo aqukiweyo kumda wokubonelela.

Leliphi ibakala leTeslin elilungele amakhadi e- RFID ?

Impendulo ixhomekeke kumshicileli, i-laminate, umjikelo we-thermal, isakhiwo sekhadi kunye neemfuno zokhuseleko. I-SP, i-TS, i-IJWP, iDigital kunye noKhuseleko amabakala asebenza ngeenjongo ezahlukeneyo, ngoko ke kufuneka isiqinisekiso sesampula.

Ngaba iTeslin substrate ingasetyenziswa kunye nabashicileli be-inkjet?

Ewe, kodwa kufuneka kukhethwe ibakala elichanekileyo. Usetyenziso lwe-inkjet esekwe kwidayi lunokufuna ushicilelo oluphuculweyo olufana ne-IJWP. Umshicileli, i-inki, ukomisa kunye novavanyo lokumelana namanzi kufuneka lugqitywe phambi kokuveliswa.

Ngaba inokuprintwa ngelaser okanye ithoni eyomileyo?

Amanqaku afanelekileyo anokuprintwa ngelaser, kodwa eyona modeli yomshicileli, ubushushu bokudibanisa, ubukhulu beshiti, i-curl kunye nokuncamathela kwetoni kufuneka kuvavanywe. Amabango ahambelana nemveliso awanelanga ukuvunywa kwemveliso.

Ngaba iTeslin substrate iqulethe RFID chip?

Hayi. I-Teslin yi-substrate yekhadi eliprintwayo okanye lesakhiwo. Umsebenzi we- RFID uvela kwitshiphu eyahlukileyo kunye ne-eriyali inlay ekufuneka ikhethwe ngamaxesha afunekayo, iprotocol kunye nenkqubo yokufunda.

Ngaba iTeslin ingakhusela RFID iitshiphusi kunye nee-eriyali?

Ubume bayo be-microporous bunokubonelela nge-cushioning kwi-credential eyilwe ngokufanelekileyo ye-laminated credential. Ukukhuselwa kusaxhomekeke kubude betshiphu, ukwakheka kwe-eriyali, ukhetho lwelaminate, uxinzelelo, ubushushu kunye novavanyo lwekhadi eligqityiweyo.

Ngaba iTeslin ingathatha indawo PVC kwisakhiwo ngasinye samakhadi?

Hayi. Ingathatha indawo okanye incedise PVC kwezinye izakhiwo, kodwa ukuqina kwekhadi, ubukhulu, inkqubo yokuprinta, ikhemistri ye-laminate, ukuvezwa kokusingqongileyo kunye neemfuno zokulawula kufuneka zihlolwe kwiprojekthi nganye.

Ngaba iTeslin ayinamanzi?

I-substrate yokwenziwa iyamelana namanzi kunye nomswakama, kodwa ukuqina kwekhadi lokugqibela kuxhomekeke ekushicileleni, i-laminate seals, i-cut edges, i-adhesives kunye ne-embedded components.

Ngaba iWallis ingabonelela ngobungakanani obuqhelekileyo kunye nobukhulu?

Ukusika i-sheet yesiko kunye nokukhethwa kobukhulu kunokuhlaziywa. Ukufumaneka kuxhomekeke kwibakala elikhethiweyo leTeslin, ifomathi ye-master-sheet, ubuninzi bomyalelo kunye neemfuno zokusika.

Zeziphi iimvavanyo ekufuneka zigqitywe phambi komyalelo wesambuku?

Abathengi kufuneka bavavanye umgangatho wokushicilela, i-toner okanye i-inki yokubambelela, i-lamination peel, i-shrinkage, i-curl, i-fae cutting, i-flexible-card flex kunye RFID ukufunda ukusebenza usebenzisa izixhobo zokuvelisa zangempela.

Loluphi ulwazi olufunekayo xa ucela ikowuti?

Nika uphawu olufunekayo kunye nebakala, ubukhulu, ubungakanani beshiti, imodeli yomshicileli, isakhiwo se-laminate, RFID i-chip kunye ne-eriyali, ubuninzi, iimfuno zamaxwebhu, ukupakishwa kunye nendawo yokuhanjiswa.