Teslin® Synthetic Paper for RFID and Secure Card Manufacturing
Wallis supplies Teslin® synthetic paper for RFID card manufacturing, secure ID credentials, access cards, hotel key cards, membership cards, smart cards and laminated card products. Its microporous structure supports high-definition printing, strong laminate anchorage and cushioning around embedded chips and antennas.
For B2B card manufacturers, credential producers, RFID converters and printing companies, the correct Teslin substrate grade must be selected according to the printing process, laminate system, finished-card construction and end-use requirements. Wallis supports custom sheet sizes, thickness selection, sample qualification, cutting and export packaging.
Material identification: TESLIN® is a registered trademark of PPG Industries. Buyers should confirm whether the quotation covers genuine PPG TESLIN® substrate, the specific product grade and the supporting material documentation. “Teslin paper” should not be used as a generic description for unrelated synthetic papers.
Teslin Card Substrate Specifications
| Parameter | B2B Specification Guidance |
| Product | Microporous polyolefin-based synthetic card substrate; genuine PPG TESLIN® grade to be confirmed in the quotation and approved sample. |
| Standard Sheet Size | A4 210 × 297mm from the current product specification; custom card-production sheet sizes can be reviewed. |
| Thickness | Current Wallis page range: 100–300 microns. Final available thickness depends on the selected Teslin grade, stock format and conversion requirement. |
| Surface | White matte microporous surface; standard, thermally stabilized, inkjet-coated, digital-print or security grades may be specified according to the project. |
| Printing | Offset, screen, flexographic, gravure, thermal transfer, laser, inkjet and selected digital systems, subject to grade and equipment qualification. |
| Lamination | Compatible with platen or roll lamination when matched with an approved laminate, temperature, pressure, dwell time and cooling cycle. |
| Card Structures | Printed card layer, central substrate or cushioning layer combined with PVC, PET, PETG, PC, overlays, RFID inlays, magnetic stripes or other approved components. |
| Customization | Sheet dimensions, thickness/grade, cutting, printing route, laminate pairing, packaging, labels and inspection requirements. |
| Quality Documents | Material identification, lot information, specification sheet, inspection report and other documents subject to the confirmed supply scope. |
What Is Teslin® Synthetic Paper?
Teslin substrate is not conventional cellulose paper. It is a single-layer, microporous, highly filled polyolefin-based synthetic material. Its porous matrix accepts inks, toners, adhesives, coatings and laminates into the structure rather than leaving them only on a smooth surface.
This structure can improve print anchorage, laminate bonding and resistance to data removal. It can also provide cushioning around RFID chips, antenna connections and other embedded electronics when the full card construction is properly engineered.
Teslin Does Not Provide RFID Function by Itself
The RFID function is supplied by the selected chip, antenna, inlay layout and reader protocol. Teslin is the printable or structural substrate surrounding those components. RFID compatibility therefore must be validated with the actual LF, HF, NFC or UHF inlay, laminate structure and reader system.
Teslin Grade and Thickness Must Be Confirmed
Product names such as SP, TS, IJWP, Digital and Security Grade describe different performance targets. A generic “100–300 micron Teslin sheet” description is not sufficient for production approval. The grade, nominal thickness, sheet direction, print method and laminate system should be recorded in the approved specification.
![Teslin synthetic paper benefits for printed RFID and secure cards]( "Advantages of Teslin substrate for RFID cards")
Teslin Grade Selection for Card Projects
| Grade Category | Typical Function | Card-Project Considerations |
| SP Standard Grade | General-purpose print and laminated applications. | Confirm the exact SP grade number, thickness, ink system and laminate adhesion through production trials. |
| TS Thermally Stabilized | Applications requiring tighter thermal-shrinkage control. | Useful when print registration, sheet flatness or repeated heat exposure is critical; verify the complete lamination cycle. |
| IJWP Inkjet Grade | Dye-based inkjet imaging with a two-sided print-optimized coating. | Do not assume a standard uncoated grade will provide the same ink holdout, drying or water resistance. |
| Digital Print Grade | Specific digital press platforms or qualified electrophotographic systems. | Printer model, blanket temperature, toner/ink adhesion and runnability must be qualified. |
| Security Grade | Secure credentials requiring embedded or program-specific security features. | Availability, authorization, chain of custody and project documentation must be confirmed separately. |
| Equivalent Synthetic Paper | Alternative microporous or coated synthetic substrates. | Must not be marketed as genuine Teslin unless supplied under the legitimate brand and grade identification. |
Printing Compatibility and Pre-Production Testing
Teslin substrate supports a broad range of print technologies, but the correct grade is process-specific. Card factories should test image density, dot gain, drying or curing, toner adhesion, variable-data quality, registration and post-lamination appearance before approving bulk material.
| Printing Process | Recommended Qualification | Key Risks to Check |
| Offset Lithography | Confirm ink series, drying method, total ink coverage and sheet feeding. | Set-off, ink absorption balance, color density and distortion after lamination. |
| Screen Printing | Validate ink chemistry, mesh, deposit thickness and curing conditions. | Blocking, brittle ink layers and laminate bonding over heavy ink coverage. |
| Laser / Dry Toner | Use a grade qualified for the exact printer and fusing-temperature range. | Curl, shrinkage, toner offset, jamming and toner adhesion. |
| Dye-Based Inkjet | Specify a suitable inkjet grade such as IJWP where required. | Bleeding, over-saturation, drying time, color density and water resistance. |
| HP Indigo / Digital Press | Confirm the approved grade and the exact press model. | Blanket compatibility, operating window, ink transfer and adhesion. |
| Thermal Transfer and Variable Data | Test ribbon type, print energy, barcode grade and abrasion resistance. | Poor edge definition, low contrast or data damage during lamination. |
Qualification rule: “Offset / screen / digital compatible” does not mean one grade is automatically suitable for every printer. Final approval should use the buyer’s actual printer, ink or toner, artwork coverage and production speed.
RFID and Smart Card Layer Construction
A typical RFID or secure credential may combine printed Teslin layers with a contactless inlay and external protective films. The final structure must be engineered as a complete system rather than evaluating the synthetic paper alone.
| Layer | Typical Function | Approval Point |
| Front Overlay or Laminate | Protects printing and may carry holographic, UV or surface security features. | Clarity, bonding, abrasion, curling and personalization compatibility. |
| Front Printed Teslin Layer | Carries photos, text, graphics, barcodes, QR codes and security print. | Print grade, registration, image quality and laminate adhesion. |
| RFID Inlay / Chip and Antenna | Provides the contactless electronic function. | Frequency, protocol, antenna position, chip height, read range and encoding. |
| Back Printed Teslin Layer | Balances the construction and carries reverse-side graphics or data. | Grain/direction, thickness symmetry and print-lamination compatibility. |
| Back Overlay or Laminate | Provides protection and final card surface performance. | Peel strength, scratch resistance and magnetic stripe/signature panel compatibility. |
Lamination, Cutting and Card Conversion
Laminate Selection
The laminate must be matched to the Teslin grade, print process and finished-card thickness. Card factories should verify laminate chemistry, thickness, melting or activation range and final peel performance. The same lamination recipe should not be assumed for PVC, PET, PETG and PC cover films.
Temperature, Pressure and Cooling
Excessive temperature or dwell time can cause shrinkage, curl, image movement or RFID component stress. Insufficient heat or pressure can cause weak bonding. Record platen or roll temperature, pressure, dwell time, cooling time and stack construction during sample approval.
Die Cutting and Finished-Card Testing
After lamination, inspect card flatness, edge integrity, corner quality, thickness, flex resistance and electronic performance. RFID read tests should be repeated after lamination and die cutting because antenna tuning and chip connections can be affected by the final card structure.
![Printing and card conversion methods for Teslin synthetic paper]( "Printing methods for Teslin card substrate")
Applications for Teslin Card Substrate
Teslin substrate is used where print durability, laminate bonding and protection of embedded data or electronics are important. The correct material grade and complete card construction should be approved for each end use.
RFID access control cards and employee credentials
NFC membership, loyalty and guest-service cards
Hotel key cards matched to the specified lock-system chip
Secure ID cards, permits and government credentials
Insurance, library, healthcare and education cards
Event passes, key tags and durable laminated badges
Smart cards with chips, antennas, magnetic stripes or barcodes
Payment and government programs: suitability for bank cards, official identity credentials or regulated security programs must be established through the issuer’s technical specifications, security requirements and required certifications. Material selection alone does not establish compliance.
Quality Control for B2B Card Manufacturers
| Inspection Item | What to Confirm |
| Material Identity | Brand, product grade, lot number and supporting specification documents. |
| Thickness and Basis Weight | Nominal value, agreed tolerance and measurement method. |
| Sheet Dimensions | Length, width, squareness, edge condition and cutting direction. |
| Appearance | Whiteness, surface uniformity, dust, marks, wrinkles and contamination. |
| Printing | Color density, image resolution, barcode readability, toner/ink adhesion and drying. |
| Lamination | Peel strength, bubbles, silvering, curl, shrinkage and visual distortion. |
| RFID Performance | Chip response, read range, encoding, UID/data verification and post-lamination yield. |
| Finished Card | Thickness, flatness, flex, edge quality, abrasion and environmental tests required by the buyer. |
Sample Approval and Golden Sample Process
Submit project data: card use, finished size, layer structure, printer model, laminate and RFID inlay.
Confirm material: genuine Teslin brand status, grade, thickness, sheet size and required documentation.
Run print trials: evaluate image quality, variable data, barcodes and ink or toner adhesion.
Run lamination trials: record the full temperature, pressure, dwell and cooling recipe.
Test finished cards: inspect peel, flex, die cutting, appearance and RFID performance.
Approve the Golden Sample: use the signed sample and agreed specification as the bulk-production reference.
Information Required for a Fast B2B Quotation
| Required Information | Examples |
| Material Requirement | Genuine PPG TESLIN® or approved equivalent; SP, TS, IJWP, Digital or Security Grade. |
| Thickness and Size | Nominal micron/mil, A4 or custom sheet dimensions, cutting tolerance and quantity. |
| Printing Equipment | Offset press, screen line, laser printer, inkjet model, HP Indigo or other digital press. |
| Card Construction | Front/back laminate, Teslin layers, RFID inlay, magnetic stripe, signature panel and final thickness. |
| RFID System | Chip, frequency, protocol, antenna layout, reader model, encoding and target read distance. |
| Testing and Documents | TDS, inspection report, sample quantity, compliance declarations and lot traceability. |
| Commercial Details | Trial quantity, annual demand, delivery destination, packaging and Incoterm. |
Packaging, Storage and Global Shipping
Sheets should be protected from dust, moisture, edge damage, bending and uncontrolled heat during storage and transport. Packaging may include sealed inner wrapping, rigid cartons, pallet protection, custom labels and lot identification according to the agreed order.
Keep material flat in its original packaging and allow it to acclimatize to the printroom before opening. Specific storage conditions and shelf-life guidance should follow the confirmed grade documentation and supplier specification.
![Wallis factory and converting support for Teslin card substrate]( "Wallis card material factory")
Why Source Teslin Card Material from Wallis?
Wallis supports card manufacturers and converters with material selection, custom sheet cutting, sample testing and one-stop coordination for card core sheets, overlays, RFID inlays and finished-card structures.
Technical discussion based on the actual printer, laminate and RFID system
Custom sheet size, thickness selection, cutting and packaging support
Sample and Golden Sample approval before bulk production
Coordination of card substrates, overlays, inlays and related card materials
Export packaging, shipment marking and project documentation support
Customer Feedback
![Customer feedback for Wallis synthetic paper and card materials]( "Customer feedback for Wallis card materials")
Frequently Asked Questions
Is Teslin paper the same as ordinary synthetic paper?
No. TESLIN® is a registered PPG brand for a specific microporous, polyolefin-based synthetic substrate. Other synthetic papers may have different composition, print behavior and lamination performance.
Is Wallis the manufacturer of Teslin substrate?
Teslin substrate is manufactured by PPG. Wallis can act as a card-material supplier or converter. The quotation should clearly identify the brand, grade, thickness and supporting documents included in the supply scope.
Which Teslin grade is best for RFID cards?
The answer depends on the printer, laminate, thermal cycle, card structure and security requirements. SP, TS, IJWP, Digital and Security grades serve different purposes, so sample qualification is required.
Can Teslin substrate be used with inkjet printers?
Yes, but the correct grade must be selected. Dye-based inkjet applications may require a print-optimized grade such as IJWP. Printer, ink, drying and water-resistance tests should be completed before production.
Can it be printed with laser or dry-toner equipment?
Suitable grades can be laser printable, but the exact printer model, fusing temperature, sheet thickness, curl and toner adhesion must be tested. Generic compatibility claims are not sufficient for production approval.
Does Teslin substrate contain an RFID chip?
No. Teslin is the printable or structural card substrate. The RFID function comes from a separate chip and antenna inlay that must be selected for the required frequency, protocol and reader system.
Can Teslin protect RFID chips and antennas?
Its microporous structure can provide cushioning in a properly designed laminated credential. Protection still depends on chip height, antenna layout, laminate choice, pressure, temperature and finished-card testing.
Can Teslin replace PVC in every card structure?
No. It can replace or complement PVC in some structures, but card stiffness, thickness, print process, laminate chemistry, environmental exposure and regulatory requirements must be evaluated for each project.
Is Teslin material waterproof?
The synthetic substrate is resistant to water and moisture, but the durability of the final card also depends on printing, laminate seals, cut edges, adhesives and embedded components.
Can Wallis supply custom sizes and thicknesses?
Custom sheet cutting and thickness selection can be reviewed. Availability depends on the selected Teslin grade, master-sheet format, order quantity and cutting requirements.
What tests should be completed before a bulk order?
Buyers should test print quality, toner or ink adhesion, lamination peel, shrinkage, curl, die cutting, finished-card flex and RFID read performance using the actual production equipment.
What information is needed to request a quotation?
Provide the required brand and grade, thickness, sheet size, printer model, laminate structure, RFID chip and antenna, quantity, documentation needs, packaging and delivery destination.
