Views: 0 Author: Sayt Ɛditɔ Pɔblish Taym: 2025-11-24 Ɔrijin: Ples
RFID wet inlay ɛn dray inlay na kɔr kɔmpɔnɛnt dɛn we dɛn kin yuz fɔ mek smat lɛbl, NFC stika, RFID kad, tikɛt, pak tag, ɛtɛt lɛbl ɛn ɛmbaded RFID prɔdak. Pan ɔl we dɛn ɔl tu gɛt RFID chip ɛn ɛntena, dɛn de saplae dɛn na difrɛn kɔnstrɔkshɔn dɛn ɛn dɛn mek dɛn fɔ difrɛn dawtstrim kɔnvɔyt prɔses.
Fɔ di wan dɛn we de bay B2B, fɔ pik bitwin wet inlay ɛn dray inlay nɔ fɔ jɔs bi bay we adhesive de. Di kɔrɛkt chukchuk dipen bak pan frikshɔn, protɔkɔl, chip famili, ɛntena dimɛnshɔn, tag matirial, target rid rɛnj, adhesive rikwaymɛnt, lamination prɔses, rol fɔmat, ɛnkɔdin ɛn fayn prodak kɔnstrɔkshɔn.
Dis gayd de ɛksplen 10 prɛktikal difrɛns bitwin RFID wet ɛn dray inlay ɛn sho aw kɔnvɔta, kad manifakta, pak kɔmni, RFID intagreta ɛn distribyushɔn kin pik di kɔrɛkt inlay fɔ dɛn prodakshɔn prɔses.

Wan RFID wet inlay nɔmal wan kin gɛt wan RFID chip we dɛn bon to wan ɛntena pan wan kyaria, we dɛn jɔyn wit prɛshɔn-sɛnsitiv adeziv ɛn wan rilis layna. I kin saplae fɔ kɔmpitabl dairekt-aplikeshɔn projɛkt ɔ yuz am as sɛmi-finish kɔmpɔnɛnt insay RFID lɛbl kɔnvɔshɔn.
Wet inlay nɔ fɔ ɔtomɛtiks bi se na RFID lɛbl we dɛn kin print we dɔn dɔn. Bɔku kɔmɛshɔnal RFID lɛbl dɛn kin ad ɔda pepa, PET , PP ɔ ɔda fes matirial ɔp di inlay togɛda wit di fayn adeziv, day-kat shep, printin ɛn rol spɛsifikɛshɔn.
Wan RFID dray inlay gɛt di chip-ɛn-antena asɛmbli pan PET ɔ ɔda fayn kyaria we nɔ gɛt di fayn prɛshɔn-sɛnsitiv adhesive ɛn rilis-layn kɔnstrɔkshɔn we dɛn yuz fɔ wan sɛlf-adhesive lɛbl.
Dɛn kin pik dray inlay dɛn we di RFID kɔmpɔnɛnt go lamin, ɛmbas, ɛnkapsul ɔ kɔnvɔyt to ɔda prɔdak lɛk PVC kad, PET kad, tikɛt, wristband, mold kɔmpɔnɛnt ɔ kɔstɔmayz RFID lɛbl.

| Komponent | wet inlay | dray inlay |
|---|---|---|
| RFID Chip we de na di wɔl | Yɛs | Yɛs |
| Antena we dɛn kɔl | Etched aluminium, kɔpa ɔ prɔjek-spɛsifi k dizayn | Etched aluminium, kɔpa ɔ prɔjek-spɛsifi k dizayn |
| Kɛriɔ / Sabstret | Tipikli PET ɔ ɔda aprɔv kyaria | Tipikli PET ɔ ɔda matirial we dɛn pik fɔ intagreshɔn |
| Adhesive we de mek pɔsin gɛt prɛshɔn | Insay de | Nɔ inklud as di las sɛlf-adhesive kɔnstrɔkshɔn |
| Rilis Layna | Insay de | Nɔmal wan nɔto pat pan di fayn dray-inlay strɔkchɔ |
| Fes Stok we yu kin print | Yu kin ad am di tɛm we dɛn de chenj di lɛbl | Yu kin ad am di tɛm we dɛn de kɔnvɔyt ɔ ɛmbas afta dat |
Wan pan di mistek dɛm we dɛn kin mek fɔ sɔs na fɔ tek am se wet inlay ɛn we dɔn dɔn RFID lɛbl na di sem. Insay prɔfɛshɔnal lɛbl kɔnvɔyt, bɔku tɛm dɛn kin bi difrɛn prodakshɔn stej dɛn.
| Fɔmat | Tipik Kɔnstrɔkshɔn | Tipik Baya |
|---|---|---|
| Dray Inlay we dɔn dray | Chip + antena + kariɔ we nɔ gɛt fayn PSA lɛbl kɔnstrɔkshɔn | Kad manifakta, tag kɔnvɔta ɔ prodak intagreta |
| Wet Inlay we dɛn mek | Chip + antena + kyaria + prɛshɔn-sɛnsitiv adhesive + rilis layna | Lebul kɔnvɔta, pak kɔnvɔta ɔ RFID intagreta |
| Finished RFID Lebul we dɛn dɔn mek | RFID inlay + printabl fes stok + aplikeshɔn adeziv + layna + fayn day kɔt | Ritayl, westɛm, lɔjistik, wɛlbɔdi biznɛs ɔ ɛnd-yuz program |
'Wet' ɛn 'dry' de diskrayb di fizik inlay kɔnstrɔkshɔn. Dɛn nɔ de difayn di RFID frikshɔn ɔ kɔmyunikeshɔn protɔkɔl.
Wallis naw de fos in men wet/dray inlay prodakt rɛnj pan 13.56 MHz HF / NFC ɛn 860–960 MHz UHF RFID . LF RFID kin de bak na ɔda transpɔnda kɔnstrɔkshɔn dɛn, bɔt i nɔ fɔ tek am ɔtomɛtik wan fɔ yuz di sem standad wet/dray prodak akitɛkɛt we dɛn de gi fɔ HF ɛn UHF prɔjek dɛn.
| Teknɔlɔji | HF / NFC Inlay | UHF RFID Inlay |
|---|---|---|
| Ɔmɔs tɛm | 13,56 MHz we yu de yuz | Tipikli 860–960 MHz wit rijinol tuning |
| Tipik Prɔtokɔlɔ dɛn | ISO /IEC 14443 Tayp A, ISO /IEC 15693, NFC Fɔm tayp dɛn dipen pan chip | E PC Klas 1 Jɛn 2 / ISO /IEC 18000-63 |
| Tipik Ridin Biɛvhɔ | Short-rɛnj tap ɔ proksimiti ridin | Short rɛnj to sɔm mita dɛn dipen pan di sistɛm dizayn |
| Kɔmɔn Aplikeshɔn dɛn | NFC intarakshɔn, ɔthɛntishɔn, laybri, akses, tikɛt ɛn smat kad | Ritayl invɛntari, klos, lɔjistik, westɛm, katɔn ɛn ɛset trakin |
| Ki Selekshɔn Input we yu de yuz | Fɔn/rida, protɔkɔl, mɛmori, sikyɔriti ɛn ɛntena saiz | Rijyɔn, rida pawa, tag matirial, ɔriɛnteshɔn, density ɛn target rid zon |
Tu wet inlay kin du rili difrɛn ivin we dɛn gɛt di sem ɛksternal dimɛnshɔn. Na di sem tin kin apin to tu dray inlays. RF pefɔmɛns dipen strɔng wan pan di chip we dɛn dɔn pik, ɛntena jɔyometri, ɛntena matirial, tuning ɛn fayn aplikeshɔn ɛnvayrɔmɛnt.
Dipen pan di sistem, Wallis kin tɔk bɔt chip famili dɛn lɛk NTAG213, NTAG215, NTAG216, MIFARE Ultralight, MIFARE Klasik, DESFire, ICODE, F08 ɛn ɔda kɔmpitabl HF / NFC opshɔn dɛn.
UHF projɛkt dɛn kin yuz NXP UCODE, Impinj M730/M750 ɔ Monza famili dɛn, Alien Higgs ɛn ɔda chips dɛn we dɛn pik akɔdin to E PC mɛmori, TID, yuz mɛmori, sɛnsitiviti ɛn di rida ɛnvayrɔmɛnt we dɛn want.
Yu kin yuz ɔl tu di aluminiɔm ɛn kɔpa ɛntena kɔnstrɔkshɔn dɛn dipen pan di prɔdak dizayn. Di kɔrɛkt chukchuk fɔ tink bɔt ilɛktrik pefɔmɛns, manufakchurin prɔses, ɛntena jɔyometri, tik, fleksibiliti, laminɛshɔn tɛmpracha ɛn kɔst.
Wet inlays dɛn kin jɔs lɛk we di kɔnvɔta nid sɛlf-adhesive RFID kɔmpɔnɛnt we dɛn kin jɔyn wit printabl fes stok, day-katin ɛn rol kɔnvɔyt.
UHF wet inlays kin chenj to apɛl, rital ɛn invɛntari lɛbl fɔ ɔtomatik stok visibiliti ɛn aytem aydentifikeshɔn.
Dɛn kin put adhesive RFID inlays insay katon lɛbl ɛn lɔjistik lɛbl, provid dɛn pik di ɛntena fɔ di katon kɔntinyu, rida sɛtup ɛn rid zon we dɛn nid.
HF / NFC wet inlays kin chenj to finish NFC stika fɔ prodak infɔmeshɔn, dijital kɔntinyu, prɔmoshɔn, warranty ɛn ɔthɛntishɔn wokflɔ we dɛn pik wan kɔmpitabl chip ɛn bakɛnd sistem.
RFID kin sɔpɔt aydentifikeshɔn, invɛntari ɛn ɔthɛntishɔn wokflɔ insay wɛlbɔdi biznɛs ɛn famasi pak, bɔt di dɔn lɛbl kɔnstrɔkshɔn, adeziv, rigyuletɔri rikwaymɛnt ɛn sikyɔriti akitɛkɛt fɔ validet fɔ di aplikeshɔn we dɛn want.
Wan dray inlay de gi di dawtstrim manifakta big fridɔm fɔ disayn di fayn kad, tag ɔ ɛmbaded prodak bikɔs i nɔ de kam as wan finish prɛshɔn-sɛnsitiv lɛbl kɔnstrɔkshɔn.
Dray inlays kin intagret insay fayn PVC , PET , PETG ɔ PC kad strɔkchɔ dɛn we di chip pozishɔn, di dimɛnshɔn fɔ di ɛntena, di totɛl kad tiknes, lamineshɔn tɛmpracha ɛn panch layout kɔmpitabl.
Kontaktlɛs inlays kin inkɔrpɔret insay akses, ɔtel, lɔyalti ɛn mɛmbaship kad bɔdi dɛn we di chip ɛn protɔkɔl mach di rida sistɛm we dɛn want.
Dray inlays kin intagret bak insay wristband, tikɛt, mold pat, pak strɔkchɔ ɛn kɔstɔm transpɔnda usay di RFID kɔmpɔnɛnt fɔ protɛkt insay di finish prodak.
Wan jenɛrik RFID dray inlay nɔ fɔ ɔtomɛtik diskrayb as bank-kad ɔ pemɛnt-kad inlay. Peymɛnt aplikeshɔn dɛn nid fɔ gɛt di rayt sikyuɔr chips, sɛtifiket kad kɔnstrɔkshɔn, pɔsnalayzeshɔn, ki manejmɛnt, di isyu aprɔval ɛn di rilevɛns pemɛnt-sistim rikwaymɛnt dɛn.

Wet inlay versus dray inlay nɔmɔ nɔ de disayd di rid rɛnj. Wan fri-ɛya labɔraytri rizɔlt kin chenj bad bad wan afta dɛn dɔn tay di inlay pan katon, bɔtul, plastic kɔntena, kad bɔdi ɔ ɔda tin.
Impɔtant tin dɛn na:
Chip sɛnsitiviti we pɔsin kin gɛt
Antena saiz ɛn tuning
Rida tayp ɛn transmit pawa
Rida antena polarizeshɔn
Tag oriɛnteshɔn
Rijinal UHF frikshɔn
Di prodakt matirial ɛn wetin de insay
Mɛtal ɔ likwid we de nia de
Tag populeshɔn ɛn rid-zon jɔyometri
Wan standad RFID inlay nɔ fɔ ɔtomɛtik ataya dairekt to mɛtal. Metal kin detune ɔ chenj di antena pefɔmɛns bad bad wan. On-metal aplikeshכn nכmal wan nid spεshal εnjinia tεg, spεshal, fכm כ fεrayt strכkchכ.
Liquid kin chenj RF pefomans bak, patikula fכ UHF sistεm dεm. So dɛn fɔ tɛst wan lɛbl we dɛn mek na fri ɛya na di las bɔtul ɔ kɔntena we dɛn ful-ɔp na di rial say we dɛn de put am.

| Ficha | wet inlay | dry inlay |
|---|---|---|
| Faynal PSA Adhesive we dɛn kin yuz | Insay de | Nɔto insay de |
| Rilis Layna | Insay de | Nɔmal wan nɔto pat pan di las kɔnstrɔkshɔn |
| Men Kɔnvɔshɔn Path | Lebul kɔnvɔshɔn ɛn kɔmpitabl dairekt aplikeshɔn | Embedding, lamination ɛn kɔstɔm kɔnvɔyt |
| Adhesive Fleksibiliti we pɔsin kin ebul fɔ du | Difayn bay we dɛn gi wet-inlay kɔnstrɔkshɔn pas dɛn kɔnvɔyt am bak | Kɔnvɔta kin pik di fayn adhesive sistem |
| Tipik Delivri we Dɛn De Du | Rol | Rol ɔ sheet dipen pan di dawtstrim prɔses |
| Tipik Baya dɛn | Lebul kɔnvɔta, pak kɔmni ɛn RFID intagreta | Kad mek, tag manifakta ɛn ɛmbaded-prɔdak intagreta |
| I kin te fɔ lɔng tɛm | Dipen pan fainal label kɔnstrɔkshɔn ɛn envayrɔmɛnt | Dipen pan fainal lamination, enkapsuleshɔn ɔ prodakt strɔkchɔ |
| Pe | Dipen pan adhesive, layna, kɔnvɔshɔn ɛn ɔda volyum | Dipen pan intagreshɔn, laminɛshɔn ɛn dawɔnstrim prɔsesin |
Fɔ industrial RFID bay, di chip nem ɛn inlay dimɛnshɔn na jɔs pat pan di spɛsifikɛshɔn. Rol jɔyometri ɛn kɔnvɔyt ditil kin no if di prɔdak de rɔn kɔrɛkt wan na di pɔsin we bay in prodakshɔn layn.
Kor dayamita
Maksimal rol ɔta dayamita
Di wɛb wit
Inlay pitch we dɛn kin yuz
Gap bitwin inlays dɛn
Winding dairekshɔn
Kwantiti fɔ ɛni rol
Splais lɔ dɛn
Bad-tag aydentifikeshɔn ɔ mak
Dipen pan di teknɔlɔji we yu dɔn pik, dɛn kin gi inlay dɛn wit aprɔv data ɔpreshɔn lɛk NDEF URL raytin, E PC ɛnkɔdin, siriɔs-nɔmba asaynmɛnt ɔ ɔda data we di kɔstɔma dɔn difayn.
Mɛmori kapasiti fɔ spɛsifa bay di aktual chip mɔdel pas fɔ kot as wan yunivasal NFC ɔ UHF mɛmori figa.
Bulk prodakshɔn fɔ inklud difayn ilɛktrik ɛn RF kwaliti-kɔntrol prosidyuz. Di wan dɛn we de bay fɔ gri pan difrɛns-inlay aydentifikeshɔn, rol rɛkɔd, chip verifyeshɔn, ɛnkɔdin chɛk ɛn rilevɛns pefɔmɛns krayteria bifo dɛn prodyuz.
Wet inlay kin jɔs fayn we di RFID kɔmpɔnɛnt go kɔnvɔyt to sɛlf-adhesive lɛbl ɔ ataya am dairekt insay wan kɔmpatibl aplikeshɔn.
Wan dray inlay kin lɛk we dɛn go lamin di RFID kɔmpɔnɛnt insay kad, ɛmbas insay wan prɔdak ɔ intagret insay kɔstɔm kɔnstrɔkshɔn usay di manifakta want fɔ kɔntrol di fayn adeziv ɛn protɛktiv strɔkchɔ.
If di projɛkt nid fɔ print ɔ prɛprint lɛbl wit fayn fes matirial, adeziv, day kɔt, ɛnkɔdin ɛn rol spɛsifikɛshɔn we dɛn dɔn ɔlrɛdi dɔn, aks fɔ kɔnvɔyt RFID lɛbl pas fɔ gɛt bɛsik wet inlay.
Adhesive selekshɔn fɔ bi bays pan di fayn aplikeshɔn sɔfa ɛn opareshɔn ɛnvayrɔmɛnt. Pepabɔd, glas, PP , PE, PET , katon dɛn we dɛn kɔt, tɛkstayl ɛn say dɛn we dɛn pent kin nid difrɛn prɛshɔn-sɛnsitiv adeziv sistɛm dɛn.
Dipen pan di prɔjek, di wan dɛn we de bay kin nid fɔ de fɔ ɔltɛm, we dɛn kin pul, we gɛt ay tak, we nɔ gɛt bɛtɛ tɛmpracha ɔ ɔda spɛshal adeziv. Dɛn fɔ tɛst di sampul dɛn fɔ tak, di trɛnk we dɛn de pul di ed, fɔ lif di ed, fɔ dispɛns ɛn fɔ si if dɛn de na di aktual prodakt sɔfays.
We dɛn laminate dray inlay insay PVC , PETG ɔ PC kad, di ɛntena ɛn chip fɔ liv di tɛmpracha, prɛshɔn ɛn di tɛm we di lamineshɔn saykl de tek.
Di wan dɛn we de mek kad fɔ kɔnfɔm:
Di tin dɛn we dɛn kin yuz fɔ mek kad
Lamination temperechur ɛn prɛshɔn
Chip ples we dɛn de
Pozishɔn fɔ di antena
Faynal kad tik
Sheet rɛjista
Kad panch pozishɔn
Dɛn nid fɔ du bɛnd ɔ mɛkanikal tɛst dɛn
Wan sampul lamination ɛn finish-kad RF tɛst fɔ dɔn bifo ay-volyum prodakshɔn.
Fɔmat: wet inlay, dray inlay ɔ dɔn RFID lɛbl.
Aplikeshɔn: rital, lɔjistik, smat kad, pak, ɛset, NFC , tikɛt ɔ ɔda yuz.
Frikyuɛnsi: HF / NFC 13.56 MHz ɔ UHF 860–960 MHz.
Protokɔlɔ: ISO /IEC 14443, ISO /IEC 15693, ISO /IEC 18000-63 ɔ spɛsifikɛd sistɛm rikwaymɛnt.
Chip: ɛksaktɔ chip mɔdel usay dɛn dɔn ɔlrɛdi difayn am.
Rida: rida, smart fon ɔ kad-sistim mɔdel.
Matirial we dɛn tag: pepa, katon, plastic, glas, tɛkstayl, mɛtal, likwid kɔntena ɔ ɔda sabstret.
Rid rikwaymɛnt: target distans, ridin dairekshɔn, tag density ɛn rid-zon kɔndishɔn.
Dimɛnshɔn dɛn fɔ di ɛntena: maksimal we de fɔ lɛbl ɔ kad spɛs.
Adhesive: pɔrmanent, we dɛn kin pul, friza-grɛd ɔ ɔda tin we dɛn nid fɔ wet inlays.
Enkodin: NDEF, E PC , siriɔs nɔmba ɔ ɔda data.
Rol spesifikeshɔn: kɔr, pitch, wɛb wit, lɛbl dɛn fɔ ɛni rol ɛn wayndin dairekshɔn.
Kwantiti: sampul, payɔt ɔda ɛn ɛkspɛkt kɔmɛshɔnal volyum.
Destination: speshali impɔtant fɔ rijinol UHF frikshɔn sɛlɛkshɔn.
RFID inlay divɛlɔpmɛnt de pe atɛnshɔn mɔ ɛn mɔ fɔ ɔptimayz ɛntena pefɔmɛns, ridyus matirial yus, impɔtant kɔnvɔshɔn efyushɔn ɛn sɔpɔt mɔ spɛshal aplikeshɔn dɛn.
Insted fɔ yuz wan jenɛrik ɛntena fɔ ɛvri aplikeshɔn, di wan dɛn we de bay kin pik mɔ ɛn mɔ ɛntena dizayn dɛn we dɛn dɔn ɔptimayz fɔ klos, katon, kɔsmɛtik, bɔtul, prɔpati ɛn ɔda patikyula tin dɛn.
Sɔm prɔjek dɛn nid ɔl tu NFC / HF intarakshɔn ɛn UHF invɛntari funkshɔnaliti. Dɛn tin ya nid fɔ mek dɛn mek wan spɛshal kɔnstrɔkshɔn we gɛt tu frikshɔn; wan nɔmal NFC inlay nɔ kin jɔs rid bay UHF rida, ɛn wan nɔmal UHF inlay nɔ kin ebul fɔ intarakt ɔtomɛtik wan wit NFC smartfon.
Di wan dɛn we de gi di tin dɛn ɛn di wan dɛn we de kɔnvɔyt de kɔntinyu fɔ mek tin dɛn we tan lɛk tin we tan ɛn we nɔ gɛt bɛtɛ tin fɔ du wit inlay ɛn lɛbl kɔnstrɔkshɔn dɛn. Sastaynabiliti fɔ stil evalyu yuz di kɔmplit tag kɔnstrɔkshɔn, adeziv, fes stok, layna ɛn ɛnd-ɔf-layf sistɛm pas fɔ tek am se ɛvri nyu RFID inlay na ɔtomɛtik risaykul.
Wallis de saplae 13.56 MHz HF / NFC ɛn 860–960 MHz UHF RFID inlay wit chip, ɛntena ɛn protɔkɔl opshɔn dɛn we dɛn pik akɔdin to di target aplikeshɔn.
Baya dɛn kin sɔs adhesive-bak wet inlays fɔ lɛbul kɔnvɔshɔn ɔ dray inlays fɔ kad lamination, ɛmbadin ɛn kɔstɔm prodak intagreshɔn.
Antena dimɛnshɔn, inlay saiz, kyaria, adhesive kɔnstrɔkshɔn ɛn fayn delivri fɔmat kin tɔk bɔt akɔdin to di prodak spɛs we de ɛn di RF pefɔmɛns we dɛn nid.
Rol ɔ shit fɔmat, wayndin dairekshɔn, chip verifyeshɔn, ɛnkɔdin, siriɔs data, lɛbl kɔnvɔshɔn ɛn pak rikwaymɛnt dɛn kin kɔstɔmayz fɔ kɔmpitabl B2B prɔjek dɛn.
RFID pefomans fɔ evalyu pan di aktual tag aytem ɛn rida sistɛm. Wallis rikɔmɛnd fɔ kɔnfɔm RF pefɔmɛns, adhesive bihayvya, ɛnkɔdin, kɔnvɔyt ɔ kad laminɛshɔn bifo ay-volyum prodakshɔn.

Wan wet inlay inklud wan prɛshɔn-sɛnsitiv adeziv ɛn rilis layna. Wan dray inlay nɔ de inklud di fayn sɛlf-adhesive lɛbl kɔnstrɔkshɔn ɛn dɛn kin yuz am fɔ ɛmbas, lamineshɔn ɔ fɔ kɔnvɔshɔn mɔ.
Nɔto fɔ se na so i bi. Wan finish RFID lebul nɔmal wan inklud wan printabl fes stok, aplikeshɔn-spɛsifi k adeziv, fayn day-kat shep, printin ɛn rol spɛsifikɛshɔn in ad pan di RFID inlay.
Yɛs. Wan fayn prɛshɔn-sɛnsitiv adeziv ɛn rilis layna kin ad we dɛn de kɔnvɔyt fɔ mek wan wet-inlay kɔnstrɔkshɔn.
Nɔn pan dɛn tu fɔmat dɛn ya nɔ kin te fɔ ɛnitin we kin apin. Faynal durabiliti dipen pan di fes matirial, adhesive, lamination, encapsulation, edj protɛkshɔn ɛn ɔpreshɔn ɛnvayrɔmɛnt fɔ di finish prodak.
Yes, we di inlay kyaria, chip pozishɔn, ɛntena layout, lamination tɛmpracha, kad tik ɛn panch layout kɔmpitabl. I fayn fɔ mek dɛn du sampul tɛst we gɛt kad we dɔn dɔn.
NFC de wok na 13.56 MHz. Di ɛksaktɔl chip, NFC Fɔm tayp, mɛmori ɛn smartfon kɔmpatibiliti fɔ stil kɔnfyus fɔ di aplikeshɔn we dɛn bin want.
Pasiv UHF RFID kin kכmכn fכ wok insay di 860–960 MHz rεnj. Aktual ɔtorizayt frikshɔn rɛnj ɛn ɛntena tuning difrɛn bay rijyɔn, so di dɛstineshɔn makit fɔ spɛsifa.
Wan nɔmal singl-frikyuɛnsi NFC ɔ UHF inlay nɔ kin ebul fɔ sɔpɔt ɔl tu di sistɛm dɛn. Wan spɛshal dizayn dual-frikyuɛnsi prodak nid we ɔl tu NFC / HF ɛn UHF funkshɔnaliti nid.
No yunivasal rid-rɛnj figa nɔ de. NFC / HF nɔmal fɔ wok na shɔt rɛnj, we UHF kin rich frɔm shɔt distans to sɔm mita dɛn insay fayn kɔndishɔn. Faynal pefɔmɛns dipen pan chip, ɛntena, rida, tag matirial, ɔriɛnteshɔn ɛn envayrɔmɛnt.
Standard RFID inlays jεnarali nכ fכ asum fכ pכrform kכrekt we dεn put dεm dairekt pan mεtal. On-mεtal aplikεshכn nכmal wan nid wan spεshal dizayn tεg wit wan aprכpriet spεshal, fכm כ fεrayt strכkchכ.
Yes, bɔt likwid kin afɛkt RF pefɔmɛns. Test di prɔpɔz ɛntena, lɛbl pozishɔn ɛn rida sɛtup pan di fayn ful kɔntena bifo prodakshɔn.
Kɔmpatibl projɛkt dɛn kin inklud NDEF URL raytin, E PC valyu dɛn, siriɔs nɔmba dɛn ɛn ɔda aprɔv ɛnkɔdin rikwaymɛnt dɛn. Di wan dɛn we de bay fɔ gi di rayt data strɔkchɔ, sikyud ɛn verifyeshɔn lɔ dɛn.
Gi di inlay fɔmat, frikshɔn, protɔkɔl, chip, rida, tag matirial, rid rɛnj we yu want, ɛntena dimɛnshɔn, adhesive rikwaymɛnt, ɛnkɔdin, rol ɔ shit spɛsifikɛshɔn, kwantiti ɛn dɛstineshɔn makɛt.
Yɛs. Test sɛmpul dɛn yuz di rida we dɛn want, aplikeshɔn sɔfays, prɔdak kɔntinyu, ɔriɛnteshɔn, adhesive sistem ɛn kɔnvɔyt ɔ lamineshɔn prɔses bifo yu apruv kɔmɛshɔnal prodakshɔn.
di simpul difrεns bitwin wet εn dray RFID inlay na di fayn adhesive kכnstrכkshכn, bכt fכ prכfεshכnal sכs disizhכn nid bכku mכr infכmeshכn.
Di wan dɛn we de bay fɔ evalyu RFID frikshɔn, protɔkɔl, chip, ɛntena dizayn, rid ɛnvayrɔmɛnt, aplikeshɔn matirial, adeziv, rol fɔmat, lamineshɔn prɔses, ɛnkɔdin ɛn kwaliti-kɔntrol rikwaymɛnt bifo dɛn pik di fayn inlay.
Wallis de saplae wet ɛn dray RFID inlay fɔ HF / NFC ɛn UHF aplikeshɔn, togɛda wit kɔstɔmayz ɛntena dimɛnshɔn, rol ɔ shit fɔmat, ɛnkɔdin ɛn intagreshɔn sɔpɔt fɔ lɛbl kɔnvɔta, kad manifakta ɛn RFID sɔlvishɔn prɔvayda.
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