|
Wallis chena Teslin synthetic bepa rinotsigira laminated ID, nhengo uye RFID kadhi kugadzirwa mu 0.178mm uye 0.254mm geji, ine miyedzo yekudhinda, kucheka tsika, samples uye yakawanda B2B kupihwa.
kadhi zvinhu
WALLIS
| Chishandiso: | |
|---|---|
| Hukobvu: | |
| Rudzi rwekudhinda: | |
| Huwandu: | |
Wallis 0.178mm uye 0.254mm chena Teslin synthetic bepa rinopihwa laminated ID makadhi, makadhi enhengo, magwaro ekuwana, makadhi kiyi yehotera, makadhi eRFID, mabheji echiitiko uye zvimwe zvakadhindwa makadhi zvirongwa. Iyo microporous substrate inogamuchira inki, toner, adhesive uye laminate muchimiro chayo, ichibatsira vagadziri makadhi kuwana kudhinda kwakasimba uye yakasimba layer yekubatanidza.
Iwo mageji maviri anowirirana neakajairwa 7 mil uye 10 mil substrate mafomati. Hukobvu hunofanira kusarudzwa sechikamu chekuvakwa kwekadhi rakazara kwete nemhando yekadhi chete. Kudhinda kune rimwe kana mativi ese, ukobvu hwepamusoro, RFID inlay, magineti mutsara, adhesive, lamination pressure uye kupera-kadhi ukobvu hunofanirwa kuverengerwa mune yakatarwa.
Wallis inotsigira vatengi veB2B nemashizha emuenzaniso, kucheka tsika, miedzo yekudhinda, kuongororwa kwelamination, kadhi-chimiro chekuongorora uye kurongedza kunze. Vatengi vanofanirwa kusimbisa iyo chaiyo Teslin giredhi, mugadziri, ukobvu kushivirira, mamiriro epamusoro uye magwaro ekuteerera vasati vabvumidza kugadzirwa kwakawanda.
| Product Type | White microporous synthetic-pepa substrate yemakadhi akadhindwa uye laminated |
| Makobvu Options | 0.178mm / 178μm / 7 mil uye 0.254mm / 254μm / 10 mil |
| Kuprinda Nzira | Offset, silk-screen uye digital kudhinda; mamwe maitiro anoda giredhi uye midziyo yekuongorora |
| Kadhi Applications | ID, nhengo, kuvimbika, kiyi yehotera, kuwana, chiitiko, hutano uye akasarudzwa makadhi eRFID |
| Supply Options | Mashizha akajairwa kana akachekwa-akachekwa, akadzivirirwa kurongedza kwemukati, makatoni uye ekunze pallets |
| B2B Services | Samples, kudhinda qualification, lamination miedzo, RFID chimiro ongororo, QC kuronga uye kuwanda kupa |
Kumbira Teslin Kadhi Substrate Samples
Teslin substrate iine microporous, polyolefin-based synthetic material ine yakakwira chikamu cheinorganic filler uye yemukati mhepo vhoriyamu. Kusiyana nedense pepa repurasitiki, chimiro chayo cheporous chinotora ingi, toner, adhesives uye yakanyungudutswa laminate, ichigadzira inopindirana mechanic zvisungo mukati meiyo substrate.
Ingi uye toner zvinogona kupinda pamusoro pane kungogara sechinhu chinobviswa chepamusoro. Munguva yelamination, laminate inoenderana kana adhesive inoyerera ichipinda mumapores, ichibatsira kuchengetedza zvakadhindwa zvinyorwa, mafoto, QR macode uye mabarcode kubva kune abrasion kana kuyedza kupatsanurwa.
Iyo compressible chimiro inogona cushion magineti mitsetse, antennas, machipisi uye zvimwe zvakamisikidzwa zvinhu. Izvi hazvibvise kudiwa kweinjiniya inlay: ukobvu hwechikamu, dhizaini dhizaini, kugovera kudzvanywa uye kudzokororwa-flex kuyedza kunoramba kwakakosha.
Kuchengetedzwa kwekadhi kunoenderana nedhizaini yakazara, inosanganisira inodzorwa mifananidzo, data rakasiyana, holographic maficha, UV ingi, akavharika, machipisi, magineti mitsetse uye nzira dzekuburitsa. Yakajairika chena substrate haifanirwe kurondedzerwa seine mawatermark kana maficha ekuvanzika kunze kwekunge giredhi chairo rine izvo zvakavakwa mukati.
White Microporous Kadhi Substrate
Rinodhinda uye Lamination-Hushamwari Sheet
Iwo makubvu ese ari maviri anogona kudhindwa kune rimwe kana mativi ese. Sarudzo chaiyo inotsamira pane inodiwa substrate mupiro kune yakazara kadhi ukobvu, kuomarara, cushioning, lamination stack uye anowanikwa overlay mafirimu-kwete kungoti dhizaini iri rimwechete-divi kana maviri-mativi.
| Sarudzo Factor | 0.178mm / 7 mil | 0.254mm / 10 mil |
|---|---|---|
| Substrate Mupiro | Mupiro wakaderera kune yakazara kadhi ukobvu; inosiya imwe nzvimbo yekufukidzira kana mamwe machira | Mupiro wepamusoro kuhupamhi hwese uye cushioning |
| Kuchinja-chinja | More flexible before lamination | Kunzwa kwakanyanya pamberi pelamination |
| Common Project Use | Matete-core laminated makadhi, mabheji, ma tag uye zvimiro achishandisa akaturikidzana | Inorema macores, yakakwidziridzwa cushioning uye zvimiro zvinoshandisa matete akafukidza |
| RFID / Chip Chimiro | Inobatsira apo inlay uye zvakafukidzirwa zvinotopedza hukuru hwakakura | Inogona kupa yakawanda cushioning, asi yakazara stack uye kumanikidza kunofanirwa kuverengerwa |
| Mvumo Nzira | Dhinda, laminate, mamiriro uye kuyera akapedza samples | Dhinda, laminate, mamiriro uye kuyera akapedza samples |
7 Mil uye 10 Mil Makobvu Sarudzo
A laminated ID kadhi isystem ye substrate, print, overlays, adhesive uye sarudzo yemagetsi zvikamu. Ukobvu hwakapedzwa hunofanira kuverengerwa kubva kudura rese uye kusimbiswa mushure mekunge kadhi ratonhora uye rakagadziriswa.
| Kadhi Chikamu | Ukobvu uye Maitiro Kufunga |
|---|---|
| Teslin Print Core | Shandisa 0.178mm kana 0.254mm zvinoenderana neyakabvumidzwa stack uye inodiwa cushioning |
| Kumberi uye Kumashure Kufukidzira | Kuwedzeredza geji, anonamira uye kupedzisa kwepamusoro kunotaridza dziviriro uye yekupedzisira kadhi kunzwa |
| Yakadhindwa Ink / Toner | Kuvhara kwakasimba kwakasimba kunogona kukanganisa hunyoro, kuvharira, lamination uye dimensional chiyero |
| RFID Inlay kana Chip | Sanganisira antenna, chip bump, adhesive uye chero mhango kana spacer layer |
| Magnetic Stripe / Hologram | Simbisa mitsetse recess, overlay kuenderana uye post-lamination encoding kana kuongorora |
| Finished Card | Kuyera ukobvu, flatness, hukuru uye kushanda mushure mekutonhora uye kugadzirisa |
ID, Kuwana uye Membe Makadhi
Yakapedza Laminated Card Zvirongwa
Akasiyana Teslin mamakisi akagadziridzwa kune akasiyana masisitimu ekudhinda. Vatengi havafanire kufunga kuti pepa chena rimwe chete richaburitsa mhedzisiro yakafanana paoffset, dhayi inkjet, pigment inkjet, laser, Indigo, skrini kana thermal-transfer michina. Kufanirwa kwegiredhi chairo, printer uye inki system inodiwa.
| Kudhinda Maitiro | B2B Validation Chinodiwa |
|---|---|
| Offset Printing | Inki yekumisikidza, density, kuteya, kuomesa, nhanho yehupfu, kuvharira uye kuravira kuramba |
| Silk-Screen Printing | Inki ukobvu, solvent kuenderana, kurapwa, kuchinjika uye layer bonding |
| Digital Laser Printing | Fuser tembiricha, toner adhesion, kutakura pepa, static control uye qualification yemidziyo |
| Inkjet Printing | Shandisa inkjet-inoenderana giredhi; bvunzo dhayi kana pigment inki, nguva yakaoma, kuramba mvura uye chimiro chemavara |
| HP Indigo / Digital Press | Simbisa giredhi inokodzera, primer inodiwa, tembiricha yegumbeze uye post-print lamination |
| Yakananga-kune-Kadhi Printer | Kazhinji anodhinda kadhi rakapedzwa risina chinhu pane pepa reTeslin rakasununguka; bvunzo chete mushure mekadhi lamination uye punching |
Kudhinda kwemativi maviri kunodzorwa nemaitiro ekudhinda, giredhi, mwando mwero, kufukidzwa kwemifananidzo uye kunyoresa-kwete nekungoshandisa 0.254mm zvinhu. Iyo yakaenzana kumberi-uye-kumashure dhizaini inogona zvakare kubatsira kuderedza curl mushure mekudhinda uye lamination.
Fixed graphics anowanzo kudhindwa pa substrate sheets pamberi lamination. Mazita akasiyana, mapikicha, manhamba kana mabhakodhi anogona kuwedzerwa panguva yekudhinda mapepa kana kuti gare gare pakadhi rakapedzwa, zvichienderana nekufambiswa kwebasa.
Offset, Screen uye Digital Printing Miedzo
Teslin substrate inogona kuve platen-laminated kana roll-laminated nemafirimu anoenderana. Kubatana kwakasimba kunoitika kana laminate kana adhesive ichiyerera ichipinda mune microporous chimiro. Iwo ekupedzisira marongero anofanirwa kusimbiswa neiyo chaiyo substrate giredhi, pamusoro, inki, kudzvanya uye kadhi stack.
| Lamination Control | Inokurudzirwa Kudzidzira |
|---|---|
| Moisture Condition | Condition substrate uye akadhindwa mashizha pamberi lamination; zvinhu zvakanyanya kuoma kana kunyorova zvinogona kuderedza kunaka |
| Tembiricha | Seta zvinoenderana nemupi we laminate uye yakasimbiswa substrate tembiricha; usatsamire chete pamushini kuratidza tembiricha |
| Kumanikidza uye Nguva | Ipa kuyerera kwakaringana mumapores pasina kupwanya machipisi, kukanganisa mifananidzo kana kugadzira zvakanyanya kusvina-kunze |
| Kutonhodza | Kutonhorera pasi pekumanikidzwa kunodzorwa kuvandudza flatness uye dimensional kugadzikana |
| Peel Simba | Edza iyo yapera laminate mushure mekugadzirisa uye kuratidzwa kwezvakatipoteredza |
| Edge Kuvhara | Inowirirana Teslin laminate zvimiro zvinogona kazhinji kufa-kucheka mushure mekucheka pasina muganho wakavharwa wakasiyana; simbisa nefirimu rakasarudzwa |
Maparamendi ekutanga akatsikiswa anogona kubatsira nemiedzo, asi kupisa chaiko kuchinjika kunosiyana nendiro, kudhindwa, kureba kwemastake, kemesitiri yepamusoro uye kudhindwa kwakadhindwa. Rekodha tembiricha yakatenderwa substrate, kumanikidza, kugara, kutonhora uye kuburitsa-firimu kumisikidzwa yekudzokorora kugadzirwa.
Yakavharirwa mwando, kupisa kusina kukwana, laminate isingaenderane, inki inorema kana kutonhora kwakashata kunogona kugadzira mabhuru, silvering, haze kana curl. Ongorora zvese pepa uye makadhi akaroverwa mushure mekugadzirisa.
Teslin substrate inogona kutsigira yakaturikidzana dhizaini, asi kuchengetedza maficha anogadzirwa neiyo yakazara gwaro chirongwa. Zvigadzirwa zvekutengesa zvakajairika hazvingove nekuvanda yehurumende-giredhi kana forensic zvinhu.
| Chengetedzo Feature | Integration Chinodiwa |
|---|---|
| Microtext uye Fine-Line Printing | High-resolution artwork, controlled plate kana digital imaging uye post-lamination legibility |
| UV-Fluorescent Ink | Ink supplier qualification, kumashure fluorescence control uye kuongorora mushure mekugadzirisa |
| Holographic Overlay | Yakanyoreswa yakavharika, laminate kuenderana, kujeka kwemaziso uye kukanganisa maitiro |
| QR Code uye Barcode | Dhinda musiyano, kurongeka kwedimensional, kuverenga kwe scanner uye kudzivirira abrasion |
| Tsika Chengetedzo-Giredhi Substrate | Chirongwa-chaiyo chakamisikidzwa mamaki anoda mvumo yakachengeteka yakachengeteka cheni uye haina kuenzana neyakajairwa pepa jena. |
Layered Chengetedzo uye Laminate Dziviriro
Teslin substrate inogona kuchengetedza nekuchengetedza RFID inlay, asi kusarudza 0.254mm pachinzvimbo che 0.178mm hakuite otomatiki kadhi rakakodzera zvemagetsi zvemberi. Iyo inlay, chip, antenna, adhesives, overlay uye lamination kutenderera kunofanirwa kugadzirwa sechinhu chimwe.
| Smart Card Factor | Inodiwa Kusimbiswa |
|---|---|
| Chip uye Frequency | Simbisa chip modhi, frequency, protocol, ndangariro uye system yekuverenga |
| Antenna Geometry | Chengetedza antenna kuteedzera panguva yelamination, punching uye kadhi-kumucheto kupedzisa |
| Inlay Ukobvu | Verenga chip bump, antenna, mutakuri uye anonamira mukati meiyo yakazara kadhi stack |
| Pressure Distribution | Shandisa cushioning yakakodzera uye cavities kudzivirira chip kana antenna kukuvara |
| Functional Testing | Edza kuverenga / kunyora kuita usati waraswa, mushure mekucheka, mushure mekurova uye mushure mekuchinjika |
| Application | Inokurudzirwa Project Focus |
|---|---|
| Corporate ID Cards | Hunhu hwemifananidzo, data rakasiyana, bhakodhi, kusimba kwepamusoro uye kushandiswa kwebheji zuva nezuva |
| Makadhi eVadzidzi neVadzidzisi | Yakakwira-vhoriyamu kudhinda, personalization, magineti kana RFID basa uye kwenguva refu inoshanduka |
| Makadhi Enhengo uye Kuvimbika | Rudzi rwemhando, bhakodhi kana QR kuverenga, kusimba kwechikwama uye inodhura-inoshanda pepa kugadzirwa |
| Makadhi Akakosha eHotera | Magnetic-stripe kana RFID kuenderana, kukiya kuyedzwa uye pfupi-kusvika-yepakati sevhisi hupenyu |
| Zvitupa zvehutano nevarwere | Kutendeseka, kuchenesa kuratidzwa, barcode scanning uye inodzorwa kuburitswa |
| Chiitiko uye Mabheji eVaenzi | Pfupi-run dhijitari kudhinda, slots, lanyards, QR makodhi uye nekukurumidza munhu |
| Maitirwo | Emhando Yekudzora Poindi |
|---|---|
| Guillotine Kucheka | Squareness, kudhindwa kunyoreswa, blade mamiriro uye stack compression |
| Kadhi Punching / Die Kucheka | Kadhi zviyero, radius yekona, mipendero yakachena uye hapana kupatsanurwa kwelaminate |
| Slot uye Hole Punching | Position, edge distance, lanyard load uye crack resistance |
| Embossing kana Foil Stamping | Yakapedzwa-kadhi chimiro, kupisa, kumanikidza, foil adhesion uye legibility |
| Thermal / Retransfer Personalization | Printer transport, ribhoni kuendesa, pamusoro pesimba, kupisa kukanganisa uye kusimba kwemufananidzo |
| Magnetic Encoding / RFID Encoding | Encoding goho, kuenderana kwemuverengi uye post-stress basa |
| Material | Strengths | Mafungiro makuru |
|---|---|---|
| Teslin Substrate | Yakakwira kudhinda kunyura, yakasimba laminate bonding, kuchinjika uye cushioning yemagetsi | Inowanzo shandiswa seyakadhindwa musimboti mukati meiyo laminate chimiro kwete seyakafumurwa yakapera kadhi |
| PVC | Yakasimbiswa kadhi maitiro, yakakura kupa uye yakajairika nzira dzemunhu | Yakasiyana yemamiriro ekunze chimiro, yakaderera kupisa kupisa uye kushomeka kudzokorodza mumisika mizhinji |
| PETG | Kuoma, kujeka uye yakasimba multilayer kadhi kadhi application | Ink adhesion uye lamination resipi inosiyana kubva kune porous Teslin substrate |
| Polycarbonate | Kusimba kwepamusoro, kupisa kupisa uye laser-personalization kugona mumakiredhi akazvitsaurira | Yakakwirira zvinhu uye mutengo wekugadzira; inoshandiswa kutsvaga zvitupa zveupenyu hurefu |
| Inspection Item | Inokurudzirwa Kudzora |
|---|---|
| Material Identity | Mugadziri, giredhi, ukobvu kodhi, batch uye chitupa referensi |
| Hukobvu uye Saizi | Avhareji yegeji, kushivirira, kureba kweshizha, hupamhi, squareness uye kutema chaiko |
| Chitarisiko | Kuchena, mumvuri, mavara matema, kusvibiswa, wrinkles, dents uye kumucheto kukuvadza |
| Flatness uye Kunyorova | Curl, uta, mamiriro ekuchengetedza uye hunyoro chiyero pamberi pekudhinda uye lamination |
| Print Qualification | Density, adhesion, kuomesa, ruvara, mufananidzo ruzivo, barcode kuverenga uye kuvharika |
| Lamination Trial | Peel simba, mabubbles, haze, kupatsanurwa kwemupendero, kupeta uye kupera ukobvu |
| Yakapedza Kadhi Muedzo | Dimensions, kuchinjika, abrasion, personalization, slot simba, encoding uye kuverenga basa |
| Packing uye Traceability | Yakachengetedzwa stack, kuverenga, katoni label, pallet kumisikidzwa, nhamba yejenya uye yekuongorora report |
Teslin substrate inomanikidzika uye inofanirwa kuchengetedzwa kubva pakupisa, mwenje weUV, kusvibiswa, kusaenzana kwehunyoro uye yakawandisa stack kumanikidza. Kuchengetedza kwakaringana kunobatsira kuchengetedza ruvara, flatness, kudhinda kuita uye kusimba kwelamination.
Chengeta zvinhu zvakavharwa munzvimbo yakachena kure neutsi hunopfuta uye zvinosvibisa mumba.
Dzivirira mashiti kubva kune yakananga UV mwenje uye tembiricha pamusoro peiyo yakatenderwa kuchengetedza muganho.
Chengeta mapepa akachekwa akati sandara panzvimbo yakasimba, yakatsigirwa.
Usaise mitoro inorema kana mapaleti akaturikidzwa kaviri pamakatoni akachekwa-pepa.
Dzivisa tambo dzakasimba zvakanyanya dzinogona kudzvanya mipendero kana kumaka stack yepepa.
Chengetedza mapaketi akaputirwa patsva kudzivirira huruva, kushanduka kwemavara uye hunyoro.
Mapepa emamiriro emukamuri yekugadzira asati adhinda kana kuchenesa kana mamiriro eimba yekuchengetera akasiyana.
Wallis inotsigira vagadziri vemakadhi uye vanogovera zvinhu ne substrate sourcing, tsika yekucheka pepa, yakachengetedzwa kurongedza uye yakarongedzerwa kadhi-zvinhu zvekushandisa. Odha yega yega inofanirwa kuve yakabatana neyakatenderwa sampuli uye yakanyorwa yakanyorwa inovhara giredhi, ukobvu, dhinda maitiro, lamination chimiro uye rakapedzwa-kadhi zvinodiwa.
Kadhi Material Processing uye Export Supply
Maviri akajairwa makadhi ejeji: 0.178mm uye 0.254mm sarudzo dzeakasiyana laminate kadhi zvimiro.
Tsigiro yekudhinda-maitiro: Offset, sirika-screen uye miyedzo yekudhinda yedhijitari inogona kurongeka isati yabvumidzwa yakawanda.
Lamination-yakatarisana nekusimudzira: Substrate, pamusoro, anonamira, tembiricha uye kadhi ukobvu zvinogona kuongororwa seimwe system.
RFID kadhi ruzivo: Inlay gobvu, cushioning, chip kuchengetedza uye bvunzo dzemuverengi zvinogona kuverengerwa mukusimbisa sampuli.
Tsika yekucheka uye kurongedza: Mashizha fomati, chengetedzo yemasitaki, makatoni uye mapallets anogona kugadzirwa kune kugadzirwa uye kunze kwenyika zvinodiwa.
Factory-yakananga B2B sevhisi: Inokodzera mafekitori emakadhi, maprinta, anoshandura, makambani eRFID, vanopinza uye vanogovera.
Kadhi application, inotarisirwa hupenyu hwesevhisi uye musika wekuenda.
Zvaida ukobvu: 0.178mm / 7 mil kana 0.254mm / 10 mil.
Hurefu hweshiti, hupamhi, kushivirira, mativi mana uye huwandu.
Kudhinda, modhi yekudhinda, inki kana toner uye imwe- kana maviri-mativi mifananidzo.
Akafukidza zvinhu, ukobvu, kupedzisa, adhesive uye lamination midziyo.
Target akapedza kadhi zviyero, ukobvu uye kona radius.
RFID chip, antenna, inlay, magnetic stripe, hologram kana chimwe chikamu.
Chengetedzo kudhinda, barcode, QR kodhi uye personalization zvinodiwa.
Zvinodiwa zvitupa, zvinhu zvekuteedzera uye yekuongorora report.
Huwandu hwekuyedza, kufanotaura kwegore, chiteshi chengarava uye chirongwa chekuendesa.
Kurukura Yako Teslin Kadhi Project
Iyo 0.178mm substrate i7 mil, nepo 0.254mm substrate iri gumi mil. Iyo gobvu giredhi inopa yakawanda kune yakazara kadhi ukobvu uye cushioning, asi zvese zvinoda kuyedzwa mune yakazara laminate chimiro.
Ehe. Kudhinda kwekamwe- kana kaviri-mativi kunoenderana negiredhi repasi, kudhinda, inki system, artwork balance uye kunyoreswa-kwete chete pashizha ukobvu.
Hapana sarudzo yepasirese. Verenga iyo substrate, kumberi uye kumashure kuvharika, kunamira, kudhinda uye sarudzo inlay, wozo laminate uye kuyera iyo yakagadziriswa kadhi rakapedzwa.
Iyo polyolefin-based substrate inopikisa mvura, asi kudhinda kusimba kunoenderana neingi chaiyo, giredhi uye lamination. Kadhi rakapedzwa rinofanira kuongororwa mvura, humidity uye kuchenesa kuratidzwa.
Shandisa inkjet-inoenderana Teslin giredhi uye edza chaiyo dhayi kana pigment inki. Magiredhi akajairwa uye akavharidzirwa inkjet mamakisi anogona kuita zvakasiyana munguva yakaoma, ruvara uye kuramba mvura.
Magiredhi akakodzera anogona kudhindwa laser, asi fuser tembiricha, kutakura pepa, toner adhesion uye printer qualification inofanira kuongororwa. Usashandise zvinhu zvisina kutenderwa kumidziyo.
Mazhinji akananga-kune-kadhi maprinta akagadzirirwa akapedzwa makadhi asina chinhu, kwete akasununguka substrate mapepa. Dhinda uye laminate pepa kutanga, baya makadhi, uye wozoedza personalization pane zvapera blanks.
Multiple thermal laminates uye anonamira mafirimu anogona kushanda, asi kuenderana kunoenderana activation tembiricha, kuyerera, ukobvu uye kupedzisa-kadhi zvinodiwa. Bvumira iyo chaiyo substrate-uye-firimu musanganiswa kuburikidza ne peel bvunzo.
Yakakwenenzverwa laminated Teslin zvimiro zvinogona kazhinji kutemwa kune yakapedzwa chimiro pasina yakaparadzaniswa yakavharwa muganho nekuti laminate zvisungo mune porous matrix. Simbisa izvi neakasarudzwa laminate uye maitiro.
Zvikonzero zvinobvira zvinosanganisira mwando wakawandisa, kupisa kusina kukwana, mhepo yakavharirwa, inki inorema, laminate isingaenderani kana kumanikidzwa kusina kukwana. Isai mapepa uye simbisai tembiricha chaiyo ye substrate.
Ehe. Cushioning yayo inogona kubatsira kuchengetedza zvemagetsi, asi chip, antenna, inlay ukobvu, adhesive, kumanikidza uye kupedza kuverenga kuita kunofanirwa kusimbiswa.
Kwete zvoga. Iyo yakakora substrate inogona kupa yakawanda cushioning, asi zvakare inoshandura yakazara kadhi ukobvu uye kudzvanywa kugovera. Iyo yakazara inlay chimiro inosarudza kuita.
Yakajairika chena substrate inopa kudhinda uye lamination mabhenefiti asi haifanirwe kurondedzerwa seine yakavanzika yekuchengetedza mamaki. Chirongwa-chaiyo chekuchengetedza-giredhi zvinhu chinhu chakasiyana chinodzorwa chigadzirwa.
Ehe. Holographic overlays, UV ingi, microtext uye zvimwe zvinhu zvinogona kubatanidzwa kuburikidza neakasiyana kudhinda uye lamination maitiro. Kuonekwa kwavo uye kusimba kunofanirwa kuongororwa mushure mekugadzirwa.
Kuita kwezvakatipoteredza kunoenderana nemidziyo, kuvaka makadhi, hupenyu hwesevhisi, kugadzira, kutakura uye nzira dziripo dzekurasa. Dzivisa chirevo chakafara chehukuru pasina yakatsanangurwa yehupenyu-kutenderera ongororo.
Kudzokorora kunoenderana nekuunganidzwa kwenzvimbo uye chimiro chemakadhi akazara. Laminates, ingi, magineti mitsetse, machipisi uye antennas zvinogona kuda nyanzvi kupatsanurwa kana kuraswa.
Chengetedza mapepa akavharwa, akapfava, akaoma uye akadzivirirwa kubva kuchiedza cheUV, kupisa, utsi, guruva uye yakawandisa stack pressure. Zvigadzirire usati wadhinda kana lamination.
Tsika yekucheka inogona kukurukurwa maererano nedhinda dhizaini, lamination ndiro, kuiswa kwekadhi, kushivirira, huwandu uye kurongedza zvinodiwa.
Ehe. Dhinda, laminate, inotonhorera, mamiriro, punch uye gadzirisa makadhi emuenzaniso uchishandisa yawakagadzirirwa kugadzira michina usati wabvumidza izvo zvinhu.
MOQ inoenderana negiredhi, ukobvu, saizi yeshiti, kucheka tsika, kudhinda qualification, kurongedza uye kufanotaura kwegore.
Ipa ukobvu, saizi yeshizha, kudhinda maitiro, kufukidza, lamination midziyo, yapera kadhi ukobvu, RFID kana mitsetse zvinodiwa, huwandu, kwekuenda uye chirongwa chekuendesa.
Bata Wallis Plastiki ye0.178mm uye 0.254mm chena Teslin synthetic bepa relaminated ID, nhengo, kiyi yehotera, chiitiko uye RFID kadhi mapurojekiti. Chikwata chedu chinotsigira kusarudzwa kwehukobvu, kucheka tsika, kudhinda uye lamination miedzo, kadhi-chimiro ongororo, mhando yemhando uye fekitori-yakananga B2B kupihwa.
Teslin ichiratidzo chakanyoreswa chePPG Industries Ohio, Inc. Simbisa giredhi chairo rakapihwa, kwakabva uye zvinyorwa zveodha yega yega.
