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Inlay/ Prelam
Wallis
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| Huwandu: | |
Wallis 13.56MHz HF RFID PVC prelam inlay sheets akagadzirwa seyakanyanya kushanda yeasina kuonana smart makadhi, zvitupa, makadhi ekupinda, makadhi kiyi ehotera, makadhi enhengo, makadhi ekufambisa uye NFC-inogonesa kadhi zvirongwa. Pepa rega rega rinobatanidza yakasarudzwa HF chip uye antenna mukati meinodzorwa PVC chimiro, yakagadzirira yekupedzisira kadhi-muviri lamination, kudhinda, punching uye munhu.
B2B mapurojekiti anogona kugadzirwa ne chip modhi, protocol, ndangariro, antenna geometry, saizi yeshiti, kadhi dhizaini, inlay ukobvu, chip chinzvimbo, zvinhu, yekupedzisira kadhi kuvaka uye kurongedza. Manongedzo akajairika anosanganisira 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 uye 4 × 10, ine tsika yakawanda-kadhi marongero anowanikwa kune chaiwo lamination mahwendefa uye punching midziyo.
Mhuri dzeChip hadzifanirwe kuiswa muboka pasi pechido chimwe chete chepasi rose chekuenderana. MIFARE Classic, MIFARE Ultralight, NTAG uye MIFARE DESFire zvigadzirwa zvinoshanda mu ISO/IEC 14443 Rudzi rweA, nepo ICODE zvigadzirwa zvinowanzoenderana ne ISO/IEC 15693. Iyo chaiyo chip, muverengi, software yekushandisa uye chengetedzo zvinodiwa zvinofanirwa kusimbiswa pamberi peantenna tuning uye kugadzirwa kwakawanda.
| Product Type | 13.56MHz HF RFID isingabatanidzi prelaminated inlay sheet yekugadzira epurasitiki-kadhi |
| Frequency | 13.56MHz HF; protocol uye air interface zvinoenderana neiyo chip yakasarudzwa |
| Standard Layouts | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 uye tsika marongerwo |
| Current Page Kukobvu Reference | Inenge 0.45 ± 0.02mm yezvimiro zveHF zvakasarudzwa; simbisa ne chip, antenna, zvinhu uye yekupedzisira kadhi stack |
| Base Materials | PVC yakachena kana yakajeka; PETG uye polycarbonate-inoenderana mapurojekiti ari pasi peakaparadzana maitiro kusimbiswa |
| Antenna Options | Yakamisikidzwa waya yemhangura, yakamisikidzwa aluminium uye purojekiti-yakananga antenna zvivakwa |
| B2B Services | Chip sourcing, antenna dhizaini, RF tuning, dhizaini engineering, samples, lamination miedzo, magetsi ekuyedza, QC mishumo uye kutumira kunze kwenyika. |
Kumbira HF RFID Inlay Samples uye Quote
A prelam inlay ipepa repakati-kadhi rekugadzira rine RFID chip, chip-to-antenna yekubatanidza uye yakagadziridzwa antenna chimiro mukati memapuranga epurasitiki. Haisi kazhinji kadhi rakapedzwa rinodhinda. Vagadziri vemakadhi vanosanganisa prelam nemapepa akadhindwa epakati uye akafukidzira akajeka, ipapo laminate, inotonhorera, punch uye gadzirisa makadhi apera.
Iyo antenna inogamuchira simba kubva kumunda wevaverengi uye inotamisa data pakati pemuverengi neyakaiswa chip. Kuita kweRF kunoenderana neantenna geometry, conductor kuramba, chip capacitance, resonance, makadhi zvinhu, simbi iri padyo, yekupedzisira kadhi ukobvu uye muverengi simba remunda.
Yakadhindwa PVC musimboti mashiti, akajeka akafukidzira, anonamira, magineti mitsetse, siginecha mapaneru uye anodzivirira anopedzisa anowedzera ukobvu kutenderedza prelam. Iyo inonangwa yakapedzwa kadhi ukobvu hunofanirwa kurongwa kubva kune yakazara stack kwete kubva kune prelam gauge chete.
Kuchinja iyo chip mhuri, antenna size, conductor, kadhi zvinhu kana kadhi nharaunda inogona kushandura resonance uye kuchinja kuverenga kuverenga. Dhizaini yakatenderwa chip imwe haifanirwe kungoshandiswa zvakare kune imwe chip isina kuyerwa kweRF.
Yakamisikidzwa HF Chip uye Antenna Chimiro
Multi-Card Sheet Layout yeLamination
Iyo chip inofanira kusarudzwa kubva muverengi protocol, ndangariro chinodiwa, chengetedzo level, transaction kumhanya, lifecycle, certification uye software ecosystem. Mazita emhando akadai seMIFARE, NTAG uye ICODE imhuri dzezvigadzirwa kwete zvinochinjika mazwi egeneric.
| Chip Mhuri / Sarudzo | Protocol Positioning | Yakajairika Project Fit | Yakakosha B2B Cherechedzo |
|---|---|---|---|
| Fudan F08 / Inowirirana Nhaka 1K Sarudzo | Inowanzo kukumbirwa ISO/IEC 14443 Type A inoenderana masisitimu; nhamba chaiyo yechikamu inofanira kusimbiswa | Nhaka yekuwana, nhengo uye yakaiswa-muverengi anotsiva mapurojekiti | Simbisa mugadziri, ndangariro, UID, huchokwadi, kuenderana muverengi uye pamutemo mhando tsananguro |
| MIFARE Classic EV1 1K / 4K | ISO/IEC 14443-3 Rudzi A, 106kbit/s | Zvekufambisa zviripo, matiketi, kupinda uye zvemitambo zvivakwa | Legacy chigadzirwa mhuri; shandisa chete apo iyo yakaiswa sisitimu inoida uye ongorora yazvino yakachengeteka imwe nzira yezvigadziriso zvitsva |
| MIFARE Ultralight EV1 | ISO/IEC 14443 Rudzi A nharaunda | Matikiti ekushandisa mashoma, zviitiko, kuvimbika uye akapusa asingabatike zvirongwa | Batanidza ndangariro, password uye ekutanga maficha kune yekushandisa kutyisidzira modhi |
| NTAG 213 / 215 / 216 | NFC Forum Type 2 Tag uye ISO/IEC 14443 Rudzi A | NFC bhizinesi makadhi, echokwadi zvinongedzo, nharembozha kubatanidzwa uye zvigadzirwa zvakabatana | Kuyeuka kwemushandisi kunosiyana nemuenzaniso; simbisa NDEF saizi, password uye zvekutanga zvinodiwa |
| MIFARE DESFire EV3 | ISO/IEC 14443 Rudzi rweA zvikamu 1-4 ine yakakwirira-layer yakachengeteka maapplication | Kupinda kwakachengeteka, kutakurwa, kambasi, chitupa, kuvimbika uye akawanda-ekushandisa makadhi | Inoda kiyi manejimendi, application personalization uye muverengi / software kubatanidzwa |
| ICODE SLIX2 / ISO 15693 Mhuri | ISO/IEC 15693, NFC Forum Rudzi 5 chinzvimbo | Vicinity-card, raibhurari, asset, chitupa uye kureba-kubatanidza-kure mapurojekiti | Haisi kuchinjika ne ISO/IEC 14443 Type A vaverengi; simbisa muverengi protocol uye saizi yeantenna |
Multiple contactless standards anoshanda pa13.56MHz. Muverengi anogona kutsigira ISO/IEC 14443 Rudzi A, Rudzi B, ISO/IEC 15693, NFC Forum tag mhando kana proprietary application layer. Frequency chete haina kukwana kubvumidza kuenderana.
Kubhengi, kubhadhara, kuzivikanwa kwehurumende uye mapurojekiti ekufambisa angangoda machipisi akasimbiswa, jekiseni rakachengeteka, kugadzirwa kwakaongororwa, kubvumidzwa kwechirongwa uye kuongororwa kwekushandisa. Iyo generic HF inlay haifanirwe kutengeswa sekubhadhara-yakagadzirira pasina hunhu hunodiwa.
| Parameter | Inowanikwa Dhizaini | Yekugadzira Kudzora |
|---|---|---|
| 2 × 5 Layout | A4-mhando prototype uye diki-vhoriyamu kadhi kugadzirwa | Simbisa hukuru hwepepa chaihwo, kukwirira kwekadhi uye mamakisi ekunyoresa |
| 3 × 7 / 3 × 8 | Yakajairwa maindasitiri akangwara-kadhi mapepa marongero | Match lamination plate, punching tool, akadhindwa macores uye collation direction |
| 4 × 8/4 × 10/5 × 5 | Yakakwirira-inobuda marongero uye mutengi-chaiwo michina | Kudzora kupindirana kweRF pakati peantenna ari padyo uye shizha deformation |
| Custom Layout | Zviyero zvekadhi, makiyi fobs, mini makadhi kana yakakosha punching mafomati | Ipa CAD kudhirowa, yapera-chigadzirwa chinyorwa, chip chinzvimbo, antenna zone uye yekucheka clearance |
| Prelam Ukobvu | Yazvino peji referensi inosvika 0.45 ± 0.02mm; zvimiro zvetsika zviripo | Simbisa pakati, poindi musiyano, chip-bump zone uye yekupedzisira-kadhi stack kuverenga |
| Material | White PVC, yakajeka PVC uye purojekiti-yakananga PETG kana PC-inoenderana zvimiro. | Simbisa shrinkage, kubatana, kupisa, RF tuning uye kupera-kadhi kusimba |
Yakajairwa CR80/ID-1 kadhi inowanzogadzirwa padyo ne0.76mm, asi kushivirira chaiko kunoenderana nekadhi uye nemidziyo yakatarwa. Akadhindwa macores, kumberi uye kumashure akafukidzira, anonamira uye emunharaunda chip ukobvu anofanira kuverengerwa mukuverenga.
Iyo shiti inogona kunge iri mukati meavhareji geji kushivirira nepo iyo chip zone iri munharaunda yako gobvu. Cavity dhizaini, cushioning, kudzvanya kudzvanywa uye kusarudzwa kwemusara kunofanirwa kudzivirira mabumps anooneka, isina kusimba kubatanidza uye chip kukuvara.
| Antenna Factor | Effect paKadhi | Inodiwa Kusimbiswa |
|---|---|---|
| Nhoroondo yeCoil Geometry | Inodzora inductance, nzvimbo yekubatanidza uye inowanikwa yekucheka clearance | Match chip capacitance, zviyero zvekadhi, muverengi uye nharaunda yakanangana |
| Mhangura Wire Antenna | Inotsigira yakamisikidzwa coil dhizaini uye inoshanduka geometry | Wire dhayamita, kudzika kudzika, crossover, bond joint uye kuenderera mberi |
| Yakaiswa Aluminium Antenna | Inotsigira yakakwirira-vhoriyamu patterned antenna kugadzirwa | Tevera hupamhi, kuramba, kudzivirira ngura, chip attachment uye lamination maitiro |
| Chip Capacitance | Inoshandura resonance yeantenna/chip circuit | Dzokorora kana uchichinja chip mhuri kana pasuru |
| Kadhi Stack | Plastiki, inki, foil, metalized girafu uye akafukidzira anogona kushandura coupling uye kubvisa antenna. | Edza kadhi rakapedzwa, kwete chete prelam isina chinhu |
| Shandisa Zvakatipoteredza | Metal nzvimbo, mafoni, wallet, makadhi ari pedyo uye zvinwiwa zvinogona kukanganisa kuita | Ongorora muverengi anodiwa, kukwira mamiriro uye mushandisi kubata |
Verenga chinhambwe zvinoenderana ne chip, antenna nzvimbo, mhando yemhando, simba rekuverenga, muverengi antenna, protocol, kutaridzika kwekadhi, yekupedzisira kadhi stack uye nharaunda. Kotesheni inofanira kutsanangura muverengi webvunzo uye kupasa/kufoira chinhambwe pane kushandisa nhamba imwe chete yepasi rose.
Antennas papepa remakadhi akawanda anoda nzvimbo yakakwana kubva mumitsara yekucheka, maburi ekunyoresa uye nzvimbo dzakavakidzana. Sheet-level RF bvunzo dzinofanirwa kuverengera kubatanidza pakati peantenna makadhi asati arohwa.
| Layer | Function | Key Control |
|---|---|---|
| Front Overlay | Inodzivirira magiraidhi akadhindwa uye inopa gloss, matte, frosted kana kuchengetedza kupera | Ukobvu, kubatana, abrasion uye personalization kuenderana |
| Front Printed Core | Inotakura yakagadziriswa magirafu, zvinyorwa, logo uye chengetedzo kudhinda | Dhinda kunyoresa, inki kurapwa, shrinkage uye RF-yakachengeteka simbi mhedzisiro |
| HF Prelam Inlay | Iine chip, antenna, magetsi majoini uye anotsigira epurasitiki layer | RF tuning, chip chinzvimbo, ukobvu, kurongeka, bond uye goho remagetsi |
| Back Printed Core | Inodzikamisa chikamu chemberi uye inotakura reverse-side artwork | Gauge chiyero, magineti-mutsetse chinzvimbo uye kudhinda kuvharika |
| Back Overlay | Inodzivirira artwork uye inogona kusanganisira mitsetse, siginecha pani kana kuchengetedza chimiro | Bonding, flatness, encoding uye yekupedzisira nzvimbo |
Mafoiri makuru ane simbi, ingi dzinoitisa kana simbi dzakaturikidzana padyo neantenna dzinogona kuderedza kubatanidza kana kuchinjika tuning. Sanganisira zvekupedzisira zvekushongedza zvinhu muRF bvunzo uye chengetedza nzvimbo dzakajeka pazvinodiwa.
Mageji ekumberi uye kumashure, kutungamira kwezvinhu uye kuvharwa kwedhinda kunofanirwa kuenzana pazvinogoneka. Asymmetrical stacks inogona kuburitsa kadhi curl mushure mekudziya uye kutonhora.
Simbisa chitunha chakatenderwa: Rekodha zvese zvakavharika, zvakadhindwa core, inlay, adhesive, mitsetse uye kuchengetedza layer.
Mamiriro ese mapepa: Gadzirisa zvinhu munzvimbo yekugadzira uye zvichengetedze zvakachena, zvakapfava uye zvakaoma.
Simbisa kutariswa: Match sheet kutungamira, kadhi kukwirira, chip chinzvimbo, antenna chinzvimbo, artwork uye kubaya mamaki.
Gadzira kutenderera kwelamination: Gadzira kupisa, kumanikidza, kugara, kupera kweplate, kuburitsa pepa uye kutonhora kweiyo chaiyo stack.
Dzivirira chip zone: Dzora kudzvinyirirwa kwenzvimbo uye dzivirira zvimedu zvakaomesesa, kukanganiswa kweplate kana kuyerera kwakanyanya kutenderedza IC.
Kutonhodza pasi pekudzvinyirirwa: Kutonhora kunokanganisa flatness, layer adhesion, chip stress uye dimensional kugadzikana.
Edza usati wabaya: Tarisa shizha-level magetsi kushanda, chitarisiko, ukobvu, kubatana uye kunyoresa.
Edza makadhi apera: Punch, gadzirisa uye simbisa RF kuita, zviyero, kubhenda uye kuenderana kwekushandisa.
| Lamination Risk | Inogona Kukonzera | Kururamisa Direction |
|---|---|---|
| Chip Kukundikana | Kupisa kwakanyanya, kudzvanywa kwenzvimbo, kukuvadzwa kwemagetsi kana kushomeka kwechip chip | Wongorora chip package muganho, process pressure, ESD kudzora uye yekubatanidza mhando |
| Vhura Antenna Circuit | Kondakita akatyoka, kubatana kwakashata, kukuvara kwekucheka kana kutambanudza zvakanyanya | Ongorora kuenderera, conductor nzira, punching clearance uye mechanic stress |
| Weak Read Range | Detuning, conductor kurasikirwa, muverengi kusawirirana, metalized artwork kana kadhi-stack shanduko | Yera resonance uye retune uchishandisa kadhi rakapedzwa uye chinangwa chekuverenga |
| Inooneka Chip Bump | Kusakwana muripo, kuwandisa module ukobvu kana kusaenzana kumanikidza | Gadzirisa magonhi emunharaunda, majeji ekuyera, cushioning uye kudzvanya mamiriro |
| Delamination | Kusvibiswa, zvinhu zvisingaenderani, kupisa kwakaderera kana kutonhora kwakashata | Ongorora kuenderana kwezvinhu, kuchena, kutenderera uye peel kuita |
| Sheet kana Kadhi Warpage | Unbalanced stack, overheating, kusaenzana kumanikidzwa kana kukurumidza kusingadzoreki kutonhora | Balance layers uye optimize kudziyisa, plate flatness uye kutonhora |
| Yekuongorora Chinhu | Inokurudzirwa B2B Kudzora |
|---|---|
| Chip Identity | Simbisa mugadziri, chaiyo chikamu nhamba, ndangariro, UID sarudzo, protocol uye yakawanda traceability |
| Zvemagetsi Basa | Verenga chip UID, ndangariro kana yakatsanangurwa mirairo yakaiswa panzvimbo yega yega kadhi zvinoenderana nechirongwa chekuongorora |
| Antenna Kuenderera mberi | Ziva maseketi akavhurika, zvikabudura, majoini asina simba, makondukita akaremara uye akakuvadzwa crossover |
| Resonance / RF Performance | Eresa yakabvumiranwa RF paramende kana inoshanda yekuverenga chinhambwe uchishandisa yakatsanangurwa bvunzo michina uye gadziriso |
| Chip uye Antenna Position | Tarisa chinzvimbo uchipokana neCAD, kadhi rondedzero, punch clearance uye akavakidzana antennas |
| Sheet Dimensions | Hurefu, hupamhi, squareness, kadhi pitch, maburi ekunyoresa uye edge mhando |
| Ukobvu uye flatness | Avhareji ukobvu, yemuno chip-zone ukobvu, curl, uta uye kunongedza-kune-kusiyanisa kusiyana |
| Visual Inspection | Kusvibiswa, mabubbles, wrinkles, mavara matema, conductor exposure, kukwenya uye kukanganiswa |
| Yakapedza Kadhi Muedzo | RF basa, zviyero, ukobvu, kukotama, torsion, kupisa, humidity, peel uye kuenderana muverengi |
| Traceability | Chip mijenya, antenna yakawanda, PVC yakawanda, zuva rekugadzira, dhizaini, chirongwa chekuyedza, nhamba yepepa uye rekodhi yekurongedza |
Kuongorora kwakazara kunogona kureva kuyedza kuverenga kwemagetsi panzvimbo yega yega, nepo diki, peel uye bvunzo dzinoparadza zvinowanzo sampuli. Mamiriro ekutenga anofanirwa kutsanangura zvinhu zvekuyedza, zvigadziriso, maitiro ekugamuchira, chirongwa chesampling uye chirevo.
Prelam inogona kupasa bvunzo dzemagetsi uye ichiri kutadza mushure mekupisa kwakanyanya, kudzvanywa, kubaya kana kuita munhu. B2B qualification inofanira kusanganisira zvose zvinopinda-inlay uye kupedza-kadhi kuita.
| Application | Chip / Protocol Direction | Critical Validation |
|---|---|---|
| Makadhi eVashandi uye Ekupinda | Legacy Type A, MIFARE Plus kana DESFire zvinoenderana neyakaiswa yekuwana system | Kuenderana kwevaverengi, kiyi manejimendi, kunyoresa uye kubhenda kwemazuva ese |
| Makadhi Akakosha eHotera | Chip inodiwa nehotera-kiya chikuva | Kiya encoder, muenzi-management system, ukobvu hwekadhi uye kuratidzwa kwehunyoro |
| Kutakura uye Makadhi Kampasi | Chengetedza akawanda-application chip senge DESFire uko system yekuvaka inoida | Transaction kumhanya, chengetedzo, kuverenga estate, personalization uye lifecycle |
| Makadhi Enhengo uye Kuvimbika | Type A memory chip, NTAG kana yakachengeteka application chip zvinoenderana nechirongwa dhizaini | Kuverenga kana kuenderana kwefoni, dhatabhesi, kuvanzika uye kudzokorora kushandiswa |
| NFC Bhizinesi uye Makadhi Ekushambadzira | NTAG kana imwe NFC Forum inoenderana chip | NDEF huwandu, kuenderana kwefoni, URL chengetedzo uye chinzvimbo chekutarisa |
| Makadhi eraibhurari, Asset uye Enharaunda | ISO/IEC 15693 / ICODE-mhando mhinduro | Reader protocol, saizi yeantenna, nhanho yechinangwa, anti-kudhumhana uye EAS zvinodiwa |
| Chengetedza Identity uye Payment Projects | Certified yakachengeteka chip uye yakatenderwa application architecture | Certification, kiyi jekiseni, yakaongororwa keteni yekugovera uye chirongwa-chaicho mvumo |
HF RFID Inlay Zvikumbiro zveSmart Card Zvirongwa
| Dhata / Chengetedzo Chinhu | B2B Chinodiwa |
|---|---|
| UID | Simbisa urefu hweUID, yakagadziriswa kana isina kurongeka ID maitiro, dhatabhesi fomati uye rutsigiro rwevaverengi |
| Memory Encoding | Tsanangura chimiro chedhata, zvikamu/mafaira/mapeji, NDEF rekodhi, kukiya mabhiti uye ongororo. |
| Authentication Keys | Tsanangura hunhu hwakakosha, maitiro ejekiseni, kuchengetedzwa kwekutakura, kusiyanisa uye nzira yekuongorora |
| Password / Access Configuration | Taura pasiwedhi, mabhiti ekupinda, zviverengero, macheki ekutanga uye kukiya-nyika kuyedzwa uko kunotsigirwa |
| Yakadhindwa Variable Data | Batanidza nhamba yakadhindwa, barcode kana QR kodhi kune chip data kuburikidza inodzorwa kuyananisa |
| Makadhi Akarambwa | Govera, verenga uye paradza zvakachengeteka makadhi ane makiyi mhenyu, zviziviso kana encoded data |
Sisitimu inopa mukana chete kubva kune inoverengeka pachena inogona kuve panjodzi yekukopa kana kutevedzera. Chengetedzo-sensitive mapurojekiti anofanirwa kushandisa chip uye backend architecture inotsigira yakakodzera cryptographic authentication.
Kugovera chip yakachengeteka hakungosanganisire kuseta application kana kiyi manejimendi. Tsanangura kuti ndiani anogadzira, anochengeta, anoremedza uye anosimbisa makiyi, uye kana yakaongororwa yakachengeteka-yakasarudzika nharaunda inodiwa.
Iyo yakasanganiswa smart kadhi inogona kusanganisa HF neLF, UHF, yekubata chip kana imwe HF application. Izvi zvimiro zvinoda imwe nzvimbo, kungwarira antenna kupatsanurwa, yekuwedzera yenharaunda ukobvu kutonga uye yakatsaurirwa lamination uye yekuyedza chirongwa.
| Hybrid Structure | Shandisa Nyaya | Injiniya Ngozi |
|---|---|---|
| LF + HF | Kutama kubva kunhaka yepedyo yekuwana kune HF smart-makadhi masisitimu | Antenna nzvimbo, kudyidzana, kukora makadhi uye maviri-muverengi kuyedza |
| HF + UHF | Kuzivikanwa kwechinhambwe chipfupi pamwe nekutevera-refu-refu | Yakasiyana antenna masisitimu, zvinhu zvinokonzeresa uye UHF senitivity padyo nemuviri kana simbi |
| Maviri HF Chips | Kupatsanura maapplication kana akazvimirira anopa madomasi | Kusarudzwa kwevaverengi, kubatanidza antenna, muridzi wedata uye zvipingamupinyi zvekadhi |
| Contact + Contactless | Dual-interface yakachengeteka identity, telecom kana kubhadhara dhizaini | Module cavity, antenna yekubatanidza, lamination, certification uye personalization |
Iyo yakajairwa imwe-frequency HF prelam haifanire kurondedzerwa seinongotsigira LF kana UHF. Multi-frequency zvimiro zvinoda yavo yekudhirowa, chip rondedzero, RF bvunzo, ukobvu kutsanangurwa uye mutengo.
Chengetedza ma prelam sheets akavharwa akavharwa, akachena uye akaoma kurongedza kure nechiedza chezuva uye kupisa.
Shandisa mabhodhi akaomesesa, anopindirana uye akadzivirirwa makatoni kudzivirira kukotama, kukwenya uye chip-zone pressure.
Dzivisa kubuda kwakasimba kwemagetsi uye shandisa zvakakodzera ESD kubata zvidhinha pazvinenge zvichidikanwa.
Usaise mitoro inorema isina kuenzana papepa stack kana kubvumira pallet overhang.
Mamiriro ezvinhu mukamuri yekubikira isati yagadziriswa kana imba yekuchengetera uye mamiriro ekugadzira akasiyana.
Ziva paki yega yega ne chip modhi, dhizaini yeantenna, dhizaini, ukobvu, batch uye chimiro chekuongorora.
Shandisa yekutanga-mukati, yekutanga-yekuburitsa uye ongororazve zvinhu mushure mekuchengetedza kwenguva refu kana kuratidzwa kwekutakura.
Yakachengetedzwa Flat Packing yeHF RFID Prelam Sheets
Kuvimbika kwekugadzirwa kweprelam kunoda yakadzorwa antenna embedding kana etching, chip attachment, sheet registration, plastic lamination, magetsi ekuongorora, dimensional inspection, kubata kwakachena uye batch traceability. Iyo chip yakatenderwa, antenna dhizaini uye RF yekuyedza nzira inofanirwa kuramba yakagadziriswa yekudzokorora maodha kunze kwekunge shanduko inodzorwa yabvumidzwa.
RFID Inlay Project uye Technical Team
Prelam Inlay Production Workshop
Antenna uye Inlay Process Control
Magetsi uye Dimensional Kuongorora
Kusarudzwa-kwakavakirwa chip kusarudzwa: Nhaka yekuwana, NFC, yakachengeteka yakawanda-application uye ISO 15693 mapurojekiti anogona kupatsanurwa neprotocol uye chengetedzo inoda.
Tsika antenna engineering: Coil geometry, conductor, chip capacitance, kadhi rondedzero uye chinangwa chekuverenga chinogona kuongororwa pamwechete.
Flexible sheet marongero: Yakajairwa akawanda-kadhi gadziriro uye mutengi-chaiwo makadhi mapitch anowanikwa.
Kadhi-zvinhu kubatanidzwa: PVC prelam inogona kurongeka neakadhindwa macores, akafukidzira, magineti mitsetse uye akapedzwa-kadhi zvimiro.
Tsigiro yekufanirwa: Samples, lamination miedzo, RF kuyedzwa, ukobvu cheki uye kupedzisa-kadhi kuoneswa kunoderedza njodzi yeprojekiti.
Fekitari-yakananga B2B inopa: Inokodzera mafekitori emakadhi-akangwara, maprinta, anoshandura, masystem ekubatanidza, vanoburitsa, vanopinza uye vanogovera.
Chikumbiro, muverengi mhando / modhi, protocol uye yakaiswa software chikuva.
Chaiyo chip mugadziri uye chikamu nhamba, ndangariro, UID uye kuchengetedza zvinodiwa.
Kurongeka kwemashiti, zviyero zvakakwana, kukwirira kwekadhi, mamakisi ekunyoresa uye huwandu.
Saizi yekadhi, antenna yakajeka zone, chip chinzvimbo uye punching dhizaini.
Prelam zvinhu, ruvara, zita gobvu uye kushivirira.
Antenna tekinoroji, chinangwa resonance kana inoshanda yekuverenga-renji bvunzo.
Final card stack, akadhindwa macores, overlays, metallic printing, stripe kana signature panel.
Lamination Press, kupisa, kudzvanywa, kugara, kutonhora uye ndiro dimensions.
Muedzo wemagetsi, RF bvunzo, dimensional yekuongorora uye maitiro ekugamuchira.
Encoding, kiyi jekiseni, UID rondedzero, inochinja data kana dhatabhesi kuyananisa.
Prototype huwandu, kufanotaura kwegore, kudzokorora-odha hurongwa uye shanduko-yekudzora zvinodiwa.
Kurongedza, magwaro ekuongorora, nzvimbo yekuenda uye yekukumbira zuva rekutumira.
Kurukura Yako HF RFID Inlay Project
Ikadhi-inogadzira pepa repakati rine 13.56MHz chip uye antenna mukati mepurasitiki layer. Iyo yakanamirwa neakadhindwa macores uye akavharika kuti abudise akapedzwa asingabatike makadhi.
Kwete. A prelam inhengo yepakati inoshanda. Makadhi apedzwa anoda kumwe kudhindwa, kuvharika, lamination, kutonhora, punching uye sarudzo yemunhu kana encoding.
Mapurojekiti anogona kushandisa ISO/IEC 14443 Rudzi A, Rudzi B, ISO/IEC 15693 kana NFC Forum inoenderana machipisi. Iyo chaiyo protocol inotsamira pane yakasarudzwa IC uye muverengi system.
Kwete. Idzi mhuri dzechigadzirwa dzakasiyana dzine maprotocol akasiyana, ndangariro, mirairo, chengetedzo uye maapplication. Simbisa iyo chaiyo chip uye muverengi usati wahodha.
Nhaka yakadaro 1K-inoenderana sarudzo inogona kukurukurwa. Ipa iyo chaiyo chip chinodiwa uye sampuli yekuverenga, nekuti mugadziri, UID, ndangariro uye kuenderana kwechokwadi kunofanirwa kusimbiswa.
Iyo inoramba yakakosha kune akaiswa legacy masisitimu, asi azvino mapurojekiti akachengeteka anofanirwa kuongorora dzimwe nzira dzazvino dzakadai seMIFARE DESFire kana MIFARE Plus zvinoenderana nehurongwa hwekuvaka.
NTAG 213, 215 kana 216 uye mamwe machipi anoenderana neNFC Forum ndiwo akajairika sarudzo. Sarudza iyo modhi kubva inodiwa NDEF ndangariro, kuenderana kwefoni uye kuchengetedza maficha.
Iyo yakachengeteka yakawanda-application chip yakadai seMIFARE DESFire inogona kunge yakakodzera, asi rutsigiro rwevaverengi, kiyi manejimendi, chitupa, mafaera ekushandisa uye software inofanirwa kusimbiswa.
ISO/IEC 15693 inoshandiswa kune yepedyo-kadhi zvikumbiro apo muverengi, saizi yeantenna uye chinhambwe chekubatanidza chinosiyana kubva padhuze-kadhi masisitimu akavakirwa pa ISO/IEC 14443.
Sarudzo dzakajairika dzinosanganisira 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 uye 4 × 10. Tsika marongerwo anogona kugadzirwa kubva mutengi lamination uye punching mufananidzo.
Iyo yazvino chigadzirwa peji mareferensi angangoita 0.45 ± 0.02mm kune akasarudzwa HF zvimiro. Ukobvu hwekupedzisira hunoenderana ne chip, antenna, zvinhu, kadhi stack uye zvemuno chip-zone zvinodiwa.
Ehe. Ipa chinangwa chakapedzwa-kadhi ukobvu, pamusoro uye akadhindwa-musimboti geji, chip package uye lamination process kuitira kuti yakazara stack iverenge.
Ehe. Antenna geometry inogona kuvandudzwa yakatenderedza chip capacitance, saizi yekadhi, muverengi, mashandiro echinangwa, chip chinzvimbo uye kuchekwa kwekucheka.
Yakamisikidzwa yemhangura-waya uye etched-aluminium sarudzo dzinogona kukurukurwa. Kuvaka kwakanyanya kunoenderana nevhoriyamu, kuramba, ukobvu, kubatana, dhizaini kadhi uye RF chinangwa.
Iko hakuna universal range. Izvo zvinoenderana ne chip, antenna, muverengi, kadhi stack, kutaridzika uye nharaunda. Tsanangura bvunzo yekuverenga uye shoma inoshanda chinhambwe.
Inogona kushandiswa mushure mekuyedzwa kweRF. Yakakura simbi foil kana conductive inki padyo neantenna inogona kubvisa kana kudzivirira iyo isingabatike interface.
Zvimwe zvimiro zvezvinhu zvinogona kuongororwa, asi shrinkage, bonding, lamination tembiricha, RF tuning uye kupera-kadhi kusimba kunofanirwa kusimbiswa zvakasiyana.
Iyo prelam inowanzo kupihwa sechinhu chisina chinhu chinoshanda musimboti. Kudhinda kunowanzo shandiswa kune akaparadzana mashiti epakati, kunyangwe zvivakwa-zvakanangana nemapurojekiti zvinogona kukurukurwa.
Hapana hurongwa hwepasi rose hunofanirwa kuburitswa kune yega yega chimiro. Gadzira tembiricha, kudzvanywa, kugara uye kutonhora kwakatenderedza iyo chaiyo PVC, pamusoro, inki, chip uye antenna kuvaka.
Shandisa inopindirana chip kurongedza, inodzorwa ukobvu hwenzvimbo, mahwendefa akachena, kudzvanywa kwakadzikama, kutenderera kwakabvumidzwa kwekupisa uye kuyedza magetsi pamberi uye mushure mekutsvaira.
Kuongororwa kwemagetsi kwakazara kunogona kutsanangurwa. Chibvumirano chekutenga chinofanirwa kutsanangura kuti ndeipi mirairo inotariswa panzvimbo yega yega uye ndeipi inoparadza kana chiyero bvunzo inoshandisa sampling.
UID kuverenga, ndangariro encoding, NDEF kunyora kana application personalization inogona kukurukurwa. Secure-kiyi masevhisi anoda yakaparadzana inodzorwa yakatarwa.
Hybrid dhizaini inogona kuvandudzwa seyakasiyana zvigadzirwa. Ivo vanoda yakatsaurwa antenna marongero, ukobvu kuronga, bvunzo dzevaverengi uye mitengo.
Ehe. Iyo inosarudzirwa maitiro ndeyekuyedza prelam, laminate iyo yakazara kadhi stack, punch makadhi uye simbisa RF, mechanic uye personalization kuita.
MOQ inoenderana nekuwanikwa kwechip, tsika antenna chishandiso, marongero, zvinhu, ukobvu, bvunzo chirongwa, encoding uye kana yakatenderwa dhizaini inogona kushandiswa.
Ipa iyo chaiyo chip, muverengi, protocol, dhizaini, saizi yepepa, kudhirowa kwekadhi, ukobvu, antenna chinangwa, yekupedzisira kadhi stack, bvunzo, huwandu, kurongedza uye kwekuenda.
Bata Wallis Plastiki yeyakagadziridzwa 13.56MHz HF RFID PVC prelam inlay sheets yekuwana, ID, hotera, nhengo, chekufambisa, NFC uye smart-kadhi kugadzira. Chikwata chedu chinotsigira chip kusarudzwa, antenna dhizaini, dhizaini dhizaini, RF tuning, lamination miedzo, magetsi ekuyedza, encoding, mhando yemhando uye fekitori-yakananga B2B kupa.
