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Inlay/ Prelam
Wallis
| Usayizi: | |
|---|---|
| Ubuningi: | |
I-Wallis 13.56MHz HF RFID PVC prelam inlay sheets akhiwe njengomnyombo wokusebenza wamakhadi ahlakaniphile angenakuthinta, amakhadi omazisi, amakhadi okufinyelela, amakhadi okhiye behhotela, amakhadi obulungu, amakhadi okuthutha nezinhlelo zekhadi ezinikwe amandla yi-NFC. Ishidi ngalinye lihlanganisa i-chip ye-HF ekhethiwe kanye ne-antenna ngaphakathi kwesakhiwo se-PVC esilawulwayo, esilungele ukugcinwa kwekhadi lomzimba wokugcina, ukuphrinta, ukubhoboza nokwenza kube ngokwakho.
Amaphrojekthi we-B2B angenziwa ngezifiso ngemodeli ye-chip, iphrothokholi, inkumbulo, ijometri ye-antenna, usayizi weshidi, ukwakheka kwekhadi, ukushuba kwe-inlay, indawo ye-chip, impahla, ukwakhiwa kwekhadi lokugcina kanye nokupakishwa. Izinkomba zesakhiwo esijwayelekile zifaka phakathi 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kanye no-4 × 10, nezakhiwo zamakhadi amaningi zangokwezifiso ezitholakalayo kumapuleti athile okugcoba kanye nemishini yokubhoboza.
Imindeni yama-chip akumele ifakwe ngaphansi kwesimangalo esisodwa sokusebenzisana emhlabeni wonke. Imikhiqizo ye-MIFARE Classic, i-MIFARE Ultralight, i-NTAG kanye ne-MIFARE DESFire isebenza endaweni ye-ISO/IEC 14443 yohlobo A, kuyilapho imikhiqizo ye-ICODE ngokuvamile isekelwe ku-ISO/IEC 15693. I-chip ngqo, umfundi, isofthiwe yohlelo lokusebenza kanye nemfuneko yokuphepha kufanele kuqinisekiswe ngaphambi kokushuna kwe-antenna nokukhiqizwa kwenqwaba.
| Uhlobo Lomkhiqizo | 13.56MHz HF RFID ishidi le-inlay elingenantambo lokwenziwa kwamakhadi epulasitiki |
| Imvamisa | 13.56MHz HF; iphrothokholi nesixhumi esibonakalayo somoya kuncike ku-chip ekhethiwe |
| Izakhiwo Ezijwayelekile | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 nezakhiwo ngokwezifiso |
| Ireferensi Yamanje Yokuqina Kwekhasi | Cishe u-0.45 ± 0.02mm wezakhiwo ezikhethiwe ze-HF; qinisekisa ngechip, uthi, impahla kanye nesitaki sokugcina sekhadi |
| Izinto Eziyisisekelo | I-PVC emhlophe noma esobala; I-PETG kanye namaphrojekthi ahambisana ne-polycarbonate angaphansi kokuqinisekiswa kwenqubo ehlukene |
| Izinketho ze-Antenna | Intambo yethusi eshumekiwe, i-aluminium egxilile kanye nokwakhiwa kwe-antenna eqondene nephrojekthi |
| Izinsizakalo ze-B2B | I-Chip sourcing, i-antenna design, i-RF tuning, ubunjiniyela besakhiwo, amasampula, izivivinyo ze-lamination, ukuhlolwa kukagesi, imibiko ye-QC kanye nokuhlinzekwa kwamanye amazwe |
Cela amasampuli we-HF RFID Inlay kanye ne-Quote
I-prelam inlay ishidi lokukhiqiza ikhadi eliphakathi nendawo eliqukethe i-chip ye-RFID, uxhumano lwe-chip-to-antenna kanye nesakhiwo se-antenna esishuniwe ngaphakathi kwezendlalelo zepulasitiki. Ngokuvamile akulona ikhadi eliphelele eliphrintekayo. Abakhiqizi bamakhadi bahlanganisa i-prelam namashidi angumongo aphrintiwe kanye nembondela esobala, bese i-laminate, ipholile, ibhoboze futhi izenzele amakhadi aqediwe.
I-antenna ithola amandla enkambini yomfundi bese idlulisela idatha phakathi komfundi ne-chip eshumekiwe. Ukusebenza kwe-RF kuncike kujometri ye-antenna, ukumelana kwe-conductor, amandla e-chip, i-resonance, izinto zekhadi, insimbi eseduze, ukujiya kwekhadi lokugcina namandla enkundla yokufunda.
Amashidi ayinhloko e-PVC aphrintiwe, imbondela ebonisa ngale, izinto ezinamathelayo, imigqa kazibuthe, amaphaneli esiginesha kanye nokuqedwa kokuvikela kwengeza ukujiya okuzungeze i-prelam. Ugqinsi lwekhadi eliphothuliwe okuhlosiwe kufanele luhlelwe kusukela kusitaki esiphelele kunokusuka kugeji ye-prelam iyodwa.
Ukushintsha umndeni we-chip, usayizi we-antenna, i-conductor, impahla yekhadi noma indawo yekhadi kungashintsha ukuzwakala futhi kuguqule ukusebenza kokufunda. Idizayini egunyazwe i-chip eyodwa akufanele iphinde isetshenziswe ngokuzenzakalelayo kwenye i-chip ngaphandle kokukalwa kwe-RF.
I-HF Chip Eshumekiwe kanye Nesakhiwo Se-Antenna
Isakhiwo Seshidi Lamakhadi amaningi Wokucwengwa
I-chip kufanele ikhethwe kuphrothokholi yomfundi, imfuneko yenkumbulo, ileveli yokuphepha, isivinini sokwenziwe, umjikelezo wempilo, ukuqinisekiswa kanye ne-ecosystem yesofthiwe. Amagama ebhrendi afana ne-MIFARE, NTAG kanye ne-ICODE ayimindeni yemikhiqizo kunemigomo ejwayelekile eshintshashintshayo.
| I-Chip Family / Option | Protocol Positioning | Ejwayelekile Yephrojekthi Efanelekile | Inothi Le-B2B Elibalulekile |
|---|---|---|---|
| Fudan F08 / Ifa Elihambisanayo 1K Option | Okuvame ukucelwa kumasistimu ahambisanayo we-ISO/IEC 14443 Uhlobo A; inombolo yengxenye eqondile kufanele iqinisekiswe | Ukufinyelela kwefa, ubulungu kanye namaphrojekthi okushintsha umfundi afakiwe | Qinisekisa umkhiqizi, inkumbulo, i-UID, ukufakazela ubuqiniso, ukuhambisana komfundi nencazelo yebhrendi esemthethweni |
| I-MIFARE Classic EV1 1K / 4K | ISO/IEC 14443-3 Uhlobo A, 106kbit/s | Izinto zokuthutha ezikhona, amathikithi, ingqalasizinda yokufinyelela neyokudlala | Umndeni womkhiqizo wefa; sebenzisa kuphela lapho isistimu efakiwe idinga khona futhi uhlole enye indlela yesimanje evikelekile yemiklamo emisha |
| I-MIFARE Ultralight EV1 | I-ISO/IEC 14443 Uhlobo A imvelo | Amathikithi asebenziseka kancane, imicimbi, ukwethembeka nezinhlelo ezilula zokungathinteki | Qondanisa inkumbulo, igama-mfihlo kanye nezici zokwangempela kumodeli yosongo yohlelo lokusebenza |
| NTAG 213 / 215 / 216 | I-NFC Forum Type 2 Tag kanye ne-ISO/IEC 14443 Type A | Amakhadi ebhizinisi e-NFC, izixhumanisi zokuqinisekisa, ukusebenzelana kweselula nemikhiqizo exhunyiwe | Inkumbulo yomsebenzisi ihluka ngemodeli; qinisekisa usayizi we-NDEF, iphasiwedi kanye nezidingo zoqobo |
| I-MIFARE DESFRE EV3 | I-ISO/IEC 14443 Uhlobo A izingxenye 1–4 ezinezinhlelo zokusebenza ezivikelekile zesendlalelo esiphezulu | Vikela ukufinyelela, ezokuthutha, ikhampasi, ubunikazi, ukwethembeka namakhadi ezicelo eziningi | Idinga ukuphathwa okuyinhloko, ukwenza kube ngokwakho uhlelo lokusebenza kanye nokuhlanganiswa komfundi/isofthiwe |
| ICODE SLIX2 / ISO 15693 Umndeni | ISO/IEC 15693, NFC Forum Uhlobo 5 ukuma | Ikhadi lendawo, umtapo wolwazi, impahla, ukuhlonza kanye namaphrojekthi amabanga amade wokuhlanganisa | Ayishintsheki ne-ISO/IEC 14443 yohlobo A lwabafundi; qinisekisa umthetho olandelwayo womfundi kanye nosayizi we-antenna |
Amazinga amaningi okuxhumana asebenza ku-13.56MHz. Umfundi angase asekele i-ISO/IEC 14443 Uhlobo A, Uhlobo B, ISO/IEC 15693, izinhlobo zamathegi weforamu ye-NFC noma isendlalelo sesicelo sobunikazi. Imvamisa iyodwa akwanele ukugunyaza ukuhambisana.
Ukubhanga, ukukhokha, ubuwena bukahulumeni kanye namaphrojekthi wezokuthutha alawulwayo angase adinge amashidi aqinisekisiwe, umjovo wokhiye ovikelekile, ukukhiqizwa okuhloliwe, ukugunyazwa kohlelo nokuhlolwa kwesicelo. I-inlay ye-HF ejwayelekile akufanele imakethwe njengokulungele ukukhokha ngaphandle kweziqu ezidingekayo.
| Ipharamitha | Etholakalayo | Ukulawulwa Kwezikhombisi -ndlela |
|---|---|---|
| 2 × 5 Isakhiwo | I-prototype yohlobo lwe-A4 kanye nokukhiqizwa kwekhadi levolumu encane | Qinisekisa ubukhulu beshidi obunembile, ukuphakama kwekhadi kanye namamaki okubhalisa |
| 3 × 7 / 3 × 8 | Izakhiwo ezijwayelekile zeshidi lamakhadi ahlakaniphile ezimbonini | Qondanisa amapuleti lamination, ithuluzi isibhakela, cores ephrintiwe kanye collation direction |
| 4 × 8 / 4 × 10 / 5 × 5 | Izakhiwo eziphuma phambili nezisetshenziswa eziqondene nekhasimende | Lawula ukusebenzisana kwe-RF phakathi kwama-antenna aseduze nokuguqulwa kweshidi |
| Isakhiwo Ngokwezifiso | Ubukhulu bekhadi langokwezifiso, ama-key fobs, amakhadi amancane noma amafomethi okubhoboza akhethekile | Nikeza umdwebo we-CAD, uhlaka lomkhiqizo oqediwe, indawo ye-chip, indawo ye-antenna kanye nemvume yokusika |
| Ubukhulu be-Prelam | Ireferensi yekhasi lamanje cishe ngu-0.45 ± 0.02mm; izakhiwo ngokwezifiso ezitholakalayo | Qinisekisa isilinganiso, ukuhluka kwephoyinti, indawo ye-chip-bump kanye nokubala kwesitaki sekhadi lokugcina |
| Okubalulekile | I-PVC emhlophe, i-PVC esobala kanye ne-PETG eqondene nephrojekthi ethile noma izakhiwo ezihambisana ne-PC | Qinisekisa ukuncipha, ukubopha, ukushisa, ukulungisa i-RF nokuqina kwekhadi eliphelile |
Ikhadi elivamile le-CR80/ID-1 livamise ukuklanywa eduze kuka-0.76mm, kodwa ukubekezelela okuqondile kuncike ekhadini nasekucacisweni kwezinto zokusebenza. Ama-cores aphrintiwe, imbondela yangaphambili nangemuva, izinto ezinamathelayo kanye nogqinsi lwe-chip yendawo kufanele kufakwe esibalweni.
Ishidi lingase libe phakathi kwesilinganiso sokubekezelela igeji kuyilapho indawo ye-chip ishubile endaweni. Idizayini ye-cavity, i-cushioning, ingcindezi yokucindezela kanye nokukhetha kongqimba kufanele kuvimbele amaqhubu abonakalayo, ukubopha okubuthakathaka kanye nokulimala kwe-chip.
| Antenna Factor | Effect Ekhadini | Lokuqinisekisa Okudingekayo |
|---|---|---|
| I-Coil Geometry | Ilawula i-inductance, indawo yokuhlanganisa kanye nemvume yokusika etholakalayo | Qondanisa amandla e-chip, ubukhulu bekhadi, umfundi nendawo okuqondiswe kuyo |
| I-Copper Wire Antenna | Isekela imiklamo yekhoyili egxilile kanye nejometri eguquguqukayo | Ububanzi bentambo, ukujula kokushumeka, i-crossover, i-bond joint kanye nokuqhubeka |
| I-Antenna ye-Aluminium efakiwe | Isekela ukukhiqizwa kwe-antenna enephethini yevolumu ephezulu | Landelela ububanzi, ukumelana, ukuvikela ukugqwala, okunamathiselwe kwe-chip nokuziphatha kokucwenga |
| I-Chip Capacitance | Ishintsha i-resonance ye-antenna/chip circuit | Hlaziya lapho ushintsha umndeni we-chip noma iphakheji |
| Isitaki Sekhadi | Ipulasitiki, uyinki, ucwecwe, ihluzo ezenziwe ngensimbi nokumbondelana kungashintsha ukuhlanganisa nokukhipha uthi. | Hlola ikhadi eligcwalisiwe, hhayi kuphela i-prelam engenalutho |
| Sebenzisa Imvelo | Indawo yensimbi, amafoni, izikhwama zemali, amakhadi aseduze noketshezi kungathinta ukusebenza | Linganisa umfundi ohlosiwe, isimo sokukhweza kanye nokusingatha komsebenzisi |
Ibanga lokufunda lincike ku-chip, indawo ye-antenna, isici sekhwalithi, amandla omfundi, i-antenna yokufunda, umthetho olandelwayo, umumo wekhadi, isitaki sekhadi sokugcina nendawo. Ikhotheshini kufanele icacise isifundi sokuhlola futhi idlule/ihluleke ibanga kunokusebenzisa inombolo eyodwa yendawo yonke.
Izinti eshidini elinamakhadi amaningi zidinga isikhala esanele kusuka kolayini bokusika, izimbobo zokubhalisa kanye nezindawo ezingomakhelwane. Ukuhlolwa kwe-RF yezinga leshidi kufanele kubhekane nokuhlangana phakathi kwezimpondo ngaphambi kokuba amakhadi ashaywe.
| Ukhiye | Lomsebenzi Wokulawula Ukhiye | Ukulawula |
|---|---|---|
| Imbondela yangaphambili | Ivikela ihluzo eziphrintiwe futhi inikeze isicwebezelisi, i-matte, isithwathwa noma isiphetho sokuphepha | Ukujiya, ukubopha, ukuhuzuka kanye nokuhambisana nokwenza kube ngokwakho |
| I-Front Printed Core | Ithwala imifanekiso engaguquki, umbhalo, ilogo nokuphrinta kokuphepha | Ukubhaliswa kokuphrinta, ukwelashwa kwe-inki, ukushwabana kanye ne-RF-safe metallic effects |
| I-HF Prelam Inlay | Iqukethe i-chip, i-antenna, amalunga kagesi kanye nezendlalelo zepulasitiki ezisekelayo | Ukushuna kwe-RF, ukuma kwe-chip, ukujiya, ukuqondanisa, ibhondi kanye nesivuno sikagesi |
| Emuva I-Core Ephrintiwe | Ibhalansisa isendlalelo sangaphambili futhi iphathe umsebenzi wobuciko obheke emuva | Ibhalansi yegeyiji, ukuma komugqa kazibuthe kanye nokufakwa kokuphrinta |
| Imbondela Emuva | Ivikela umsebenzi wobuciko futhi ingafaka umugqa, iphaneli yesiginesha noma isici sokuvikela | Ukubopha, ukucaba, ukubhala ngekhodi kanye nendawo yokugcina |
Amafoyili amakhulu enziwe ngensimbi, oyinki abaqhubayo noma izendlalelo zensimbi eduze kothi kunganciphisa ukuhlangana noma ukushintshashintsha. Faka izinto zokuhlobisa zokugcina ekuhlolweni kwe-RF futhi ugcine izindawo ezicacile lapho kudingeka khona.
Amageji ezendlalelo zangaphambili nangemuva, isiqondiso sezinto ezibonakalayo kanye nokufakwa kokuphrinta kufanele kulingane lapho kungenzeka khona. Izitaki ze-asymmetrical zingakhiqiza i-curl yekhadi ngemuva kokufudumeza nokupholisa.
Qinisekisa isitaki esigunyaziwe: Rekhoda yonke imbondela, umongo ophrintiwe, inlay, ingcina, umugqa kanye nesendlalelo sokuvikela.
Beka wonke amashidi: Zinzisa izinto zokwakha endaweni yokukhiqiza futhi uzigcine zihlanzekile, ziyisicaba futhi zomile.
Qinisekisa ukuma: Qondanisa isiqondiso seshidi, ukuphakama kwekhadi, indawo ye-chip, indawo ye-antenna, umsebenzi wobuciko kanye namamaki ahlabayo.
Thuthukisa umjikelezo we-lamination: Misa ukushisa, ingcindezi, indawo yokuhlala, ukuphela kwepuleti, ishidi lokukhulula kanye nokupholisa kwesitaki sezinto ezibonakalayo.
Vikela indawo ye-chip: Lawula ingcindezi yendawo futhi ugweme izinhlayiya eziqinile, ukonakala kwamapuleti noma ukugeleza kwempahla eningi ezungeze i-IC.
Ukupholisa ngaphansi kwengcindezi elawulwayo: Ukupholisa kuthonya ukucaba, ukunamathela kongqimba, ukucindezelwa kwe-chip nokuzinza kwe-dimensional.
Hlola ngaphambi kokushaya: Hlola ukusebenza kukagesi ezingeni leshidi, ukubukeka, ukujiya, ukubopha kanye nokubhaliswa.
Hlola amakhadi aqediwe: Punch, yenza kube ngokwakho futhi uqinisekise ukusebenza kwe-RF, ubukhulu, ukugoba nokuhambisana nesicelo.
| Lamination Risk | Imbangela | Yendlela Yokulungisa |
|---|---|---|
| Ukuhluleka kwe-Chip | Ukushisa okudlulele, ingcindezi yendawo, ukulimala kwe-electrostatic noma uxhumano lwe-chip olubuthakathaka | Buyekeza imikhawulo yephakheji ye-chip, ingcindezi yenqubo, izilawuli ze-ESD nekhwalithi yokuxhuma |
| Vula i-Antenna Circuit | I-conductor ephukile, ilunga elingalungile, ukulimala kokusika noma ukwelula ngokweqile | Hlola ukuqhubeka, indlela yomqhubi, imvume yokubhoboza kanye nokucindezeleka komshini |
| Ibanga lokufunda elibuthakathaka | Ukukhipha, ukulahleka kwe-conductor, ukungafani komfundi, umsebenzi wobuciko owenziwe ngensimbi noma ukushintsha kwesitaki sekhadi | Linganisa ukuzwakala nokushuna kabusha usebenzisa ikhadi eligcwalisiwe nesifundi esiqondiwe |
| I-Chip Bump Ebonakalayo | Isinxephezelo esinganele, ukujiya kwemojula ngokweqile noma ingcindezi engalingani | Lungiselela izimbotshana zasendaweni, amageji ongqimba, izimo zokugudluza nezicindezelayo |
| I-Delamination | Ukungcola, izinto ezingahambelani, ukushisa okuphansi noma ukupholisa okungekuhle | Buyekeza ukuhambisana kwezinto, ukuhlanzeka, umjikelezo nokusebenza kwekhasi |
| Ishidi noma I-Warpage Yekhadi | Isitaki esingalingani, ukushisa ngokweqile, ingcindezi engalingani noma ukupholisa okungalawuleki okusheshayo | Linganisa izendlalelo futhi uthuthukise ukushisisa, ukucaba kwamapuleti nokupholisa |
| Into | Enconyiwe Ukulawulwa kwe-B2B |
|---|---|
| I-Chip Identity | Qinisekisa umkhiqizi, inombolo yengxenye eqondile, inkumbulo, inketho ye-UID, iphrothokholi kanye nokulandeleka kwenkatho |
| Umsebenzi kagesi | Funda i-chip UID, inkumbulo noma umyalo ochaziwe usethwe endaweni ngayinye yekhadi ngokohlelo lokuhlola |
| Ukuqhubeka kwe-Antenna | Thola ama-circuits avulekile, izikhindi, amalunga abuthakathaka, amaphutha e-conductor nama-crossovers alimele |
| I-Resonance / Ukusebenza kwe-RF | Linganisa ipharamitha ye-RF okuvunyelwene ngayo noma ibanga lokufunda elisebenzayo usebenzisa okokusebenza kokuhlola okuchaziwe kanye nesakhiwo |
| Isikhundla se-Chip kanye ne-Antenna | Hlola indawo ngokumelene ne-CAD, uhlaka lwekhadi, imvume yokushaya kanye nezimpondo ezingomakhelwane |
| Ubukhulu beshidi | Ubude, ububanzi, isikwele, ukuphakama kwekhadi, izimbobo zokubhalisa kanye nekhwalithi yomkhawulo |
| Ukujiya kanye Ukucaba | Ukujiya okumaphakathi, ukujiya kwendawo ye-chip-zone, ukugoqa, umnsalo nokuhluka kokukhomba-kuya-iphuzu |
| Ukuhlola Okubonakalayo | Ukungcola, amabhamuza, imibimbi, amabala amnyama, ukuchayeka ku-conductor, imihuzuko kanye nokukhubazeka kwezingqimba |
| Ukuhlolwa Kwekhadi Eliqedile | Umsebenzi we-RF, ubukhulu, ukujiya, ukugoba, ukukhwehlela, ukushisa, umswakama, ikhasi nokuhambisana komfundi |
| Ukulandeleka | I-chip lot, i-antenna lot, i-PVC lot, usuku lokukhiqiza, isakhiwo, uhlelo lokuhlola, inombolo yeshidi kanye nerekhodi lokupakisha |
Ukuhlola okuphelele kungase kubhekisele ekuhlolweni kokufunda ugesi kuzo zonke izindawo, kuyilapho ukuhlolwa kobukhulu, ukuxebuka nokulimazayo kuvame ukusampula. Ukucaciswa kokuthenga kufanele kuchaze izinto zokuhlola, ukulungiswa, indlela yokwamukela, uhlelo lwamasampula kanye nombiko.
I-prelam ingadlula ukuhlolwa kukagesi futhi isahluleke ngemva kokushisa okudlulele, ingcindezi, ukubhoboza noma ukwenza kube ngokwakho. Ukufaneleka kwe-B2B kufanele kufake kokubili ukusebenza kwekhadi elingenayo kanye neliqediwe.
| Application | Chip / Isiqondiso Sephrothokholi | Ukuqinisekisa Okubalulekile |
|---|---|---|
| Amakhadi Abasebenzi kanye Nokufinyelela | Uhlobo Lwefa A, i-MIFARE Plus noma i-DESFire ngokuya ngesistimu yokufinyelela efakiwe | Ukuhambisana komfundi, ukuphatha okubalulekile, ukubhaliswa kanye nokugoba kwansuku zonke |
| Amakhadi Abalulekile Ehhotela | I-chip idingwa inkundla yokukhiya ihhotela | Isifaki khodi sokukhiya, isistimu yokuphatha isivakashi, ukujiya kwekhadi nokuchayeka komswakamo |
| Amakhadi Ezokuthutha kanye Nekhampasi | Vikela i-chip yezinhlelo zokusebenza eziningi njenge-DESFire lapho i-architecture yesistimu idinga khona | Isivinini sokwenziwe, ukuphepha, indawo yokufunda, ukwenza kube ngokwakho kanye nomjikelezo wempilo |
| Amakhadi Obulungu Nobuqotho | Thayipha i-chip yememori, i-NTAG noma i-chip yohlelo lokusebenza evikelekile ngokuya ngomklamo wohlelo | Ukuhambisana kokufunda noma kwefoni, isizindalwazi, ubumfihlo kanye nokuphinda ukusetshenziswa |
| Amakhadi e-NFC Business and Marketing | I-NTAG noma enye i-chip ehambisanayo ye-NFC Forum | Umthamo we-NDEF, ukuhambisana kwefoni, ukuphepha kwe-URL kanye nesimo sokuskena |
| Amakhadi eLabhulali, Ifa kanye Nendawo | ISO/IEC 15693 / ICODE-uhlobo lwesixazululo | Iphrothokholi yokufunda, usayizi we-antenna, ibanga eliqondiwe, izidingo zokunqanda ukushayisana kanye nezidingo ze-EAS |
| Vikela Ubunikazi Nemiklamo Yokukhokha | I-chip evikelekile eqinisekisiwe kanye nesakhiwo sohlelo lokusebenza esigunyaziwe | Isitifiketi, umjovo wokhiye, uchungechunge lokuhlinzeka oluhloliwe kanye nokugunyazwa okuqondene nohlelo oluthile |
Izicelo ze-HF RFID Inlay zezinhlelo ze-Smart Card
| / | Imfuneko Yento Yokuphepha ye-B2B |
|---|---|
| I-UID | Qinisekisa ubude be-UID, ukuziphatha kwe-ID okungashintshi noma okungahleliwe, ifomethi yesizindalwazi nokusekelwa komfundi |
| Umbhalo Wekhodi Wenkumbulo | Chaza ukwakheka kwedatha, imikhakha/amafayela/amakhasi, irekhodi le-NDEF, izingcezu zokukhiya nokuqinisekisa |
| Okhiye bokuqinisekisa | Chaza ubunikazi obuyinhloko, inqubo yokujova, ukuvikelwa kwezokuthutha, ukuhlukahluka kanye nomkhondo wokuhlola |
| Iphasiwedi / Ukufinyelela Ukucushwa | Cacisa iphasiwedi, izingcezu zokufinyelela, izinto zokubala, amasheke oqobo nokuhlola isimo sokukhiya lapho kusekelwa khona |
| Idatha Eguquguqukayo Ephrintiwe | Xhuma inombolo ephrintiwe, ibhakhodi noma ikhodi ye-QR ukuze uhlanganise idatha ngokubuyisana okulawulwayo |
| Amakhadi Anqatshiwe | Hlukanisa, bala futhi ucekele phansi ngokuphephile amakhadi aqukethe okhiye ababukhoma, izihlonzi noma idatha efakwe ikhodi |
Isistimu enikeza ukufinyelela kuphela kusihlonzi esifundeka esidlangalaleni singase sibe sengcupheni yokukopishwa noma sokulingiswa. Amaphrojekthi azwelayo kwezokuvikela kufanele asebenzise i-chip ne-backend architecture esekela ukuqinisekiswa kwe-cryptographic okufanele.
Ukunikeza i-chip evikelekile akubandakanyi ngokuzenzakalelayo ukusethwa kohlelo noma ukuphathwa kokhiye. Chaza ukuthi ubani odala, agcine, alayishe futhi aqinisekise okhiye, nokuthi ingabe imvelo ehloliwe yokwenza kube ngokwakho iyadingeka.
Ikhadi elihlakaniphile eliyingxube lingahlanganisa i-HF ne-LF, i-UHF, i-chip contact noma olunye uhlelo lwe-HF. Lezi zakhiwo zidinga isikhala esengeziwe, ukuhlukaniswa ngokucophelela kwe-antenna, ukulawulwa okwengeziwe kwendawo okujiya kanye nohlelo lokuhlola oluzinikele lwe-lamination.
| I-Hybrid Structure | Use Case | Engineering Ingozi |
|---|---|---|
| LF + HF | Ukufuduka kusuka ekufinyeleleni okuseduze kwefa kumasistimu e-HF smart-card | Isikhala se-antenna, ukusebenzisana, ukujiya kwamakhadi nokuhlolwa komfundi okabili |
| HF + UHF | Ubunikazi bebanga elifushane kanye nokulandelela ibanga elide | Amasistimu we-antenna ahlukene, imiphumela yezinto ezibonakalayo kanye nokuzwela kwe-UHF eduze komzimba noma insimbi |
| Ama-chips amabili we-HF | Hlukanisa izinhlelo zokusebenza noma izizinda ezikhiphile ezizimele | Ukukhethwa komfundi, ukuhlanganisa i-antenna, ubunikazi bedatha kanye nezingqinamba zokwakheka kwekhadi |
| Xhumana + Ngaphandle kokuthinta | Ubunikazi obuvikelekile obukabili, i-telecom noma i-architecture yokukhokha | I-module cavity, uxhumano lwe-antenna, i-lamination, isitifiketi kanye nokwenza kube ngokwakho |
I-prelam ye-single-frequency ejwayelekile akufanele ichazwe njengesekela ngokuzenzakalelayo i-LF noma i-UHF. Izakhiwo zama-multi-frequency zidinga owazo umdwebo, uhlu lwama-chip, izivivinyo ze-RF, ukucaciswa kogqinsi kanye nentengo.
Gcina amashidi e-prelam ayisicaba emaphaketheni avaliwe, ahlanzekile futhi omile kude nelanga eliqondile nokushisa.
Sebenzisa amabhodi aqinile, amabhokisi aphuma phakathi navikelekile ukuze uvimbele ukugoba, ukuklwebheka kanye nomfutho we-chip-zone.
Gwema ukukhishwa kwe-electrostatic okuqinile futhi usebenzise izilawuli zokubamba ze-ESD ezifanele lapho kudingeka.
Ungabeki imithwalo esindayo engalingani esitakini seshidi noma uvumele i-pallet overhang.
Impahla yesimo egumbini lokuhlobisa ngaphambi kokucutshungulwa lapho izimo zeshede nezimo zokukhiqiza zihluka.
Khomba iphakethe ngalinye ngemodeli ye-chip, idizayini ye-antenna, isakhiwo, ukujiya, iqoqo kanye nesimo sokuhlola.
Sebenzisa i-inventory yokuqala, eyokuqala futhi uhlole kabusha okokusebenza ngemva kwesitoreji eside noma ukuchayeka kwezokuthutha.
Ukupakishwa kwe-Flat okuvikelwe kwe-HF RFID Prelam Sheets
Ukukhiqizwa kwe-prelam okuthembekile kudinga ukushumeka noma ukushumeka kwe-antenna okulawulwayo, okunamathiselwe kwe-chip, ukubhaliswa kweshidi, i-plastic lamination, ukuhlolwa kukagesi, ukuhlolwa kwe-dimensional, ukuphatha okuhlanzekile kanye nokulandeleka kwenqwaba. I-chip egunyaziwe, umdwebo we-antenna kanye nendlela yokuhlola ye-RF kufanele ihlale ingashintshile ukuze iphinde i-oda ngaphandle uma kuvunyelwana ngoshintsho olulawulwayo.
I-RFID Inlay Project kanye neThimba Lobuchwepheshe
I-Prelam Inlay Production Workshop
I-Antenna kanye nokulawulwa kwenqubo ye-Inlay
Ukuhlola Ugesi Nobukhulu
Ukukhethwa kwe-chip okusekelwe kuhlelo lokusebenza: Ukufinyelela kwefa, i-NFC, izinhlelo zokusebenza eziningi ezivikelekile kanye namaphrojekthi we-ISO 15693 angahlukaniswa ngesisekelo somthetho kanye nesidingo sokuphepha.
Ubunjiniyela be-antenna yangokwezifiso: I-coil geometry, i-conductor, i-chip capacitance, uhlaka lwekhadi kanye nesifundi esiqondiwe kungabuyekezwa ndawonye.
Izakhiwo zeshidi eziguquguqukayo: Amalungiselelo ajwayelekile wamakhadi amaningi kanye nezigatshana zamakhadi eziqondene nekhasimende ziyatholakala.
Ukuhlanganiswa kwezinto zekhadi: I-PVC prelam ingaxhunyaniswa nama-cores aphrintiwe, ukumbondelana, imigqa kazibuthe kanye nezakhiwo zamakhadi aphelile.
Ukusekelwa kokufaneleka: Amasampula, izivivinyo zokucwenga, ukuhlolwa kwe-RF, ukuhlola ukushuba kanye nokuqinisekiswa kwekhadi eliqediwe kunciphisa ubungozi bephrojekthi.
Ukunikezwa kwe-B2B eqondile efekthri: Ifanele izimboni zamakhadi ahlakaniphile, amaphrinta, iziguquli, izihlanganisi zesistimu, abakhiphi, abangenisa kwamanye amazwe nabasabalalisi.
Uhlelo lokusebenza, uhlobo lomfundi/imodeli, iphrothokholi kanye nenkundla yesoftware efakiwe.
Umkhiqizi we-chip wangempela kanye nengxenye yenombolo, inkumbulo, i-UID nezidingo zokuphepha.
Isakhiwo seshidi, ubukhulu obuphelele, ukuphakama kwekhadi, amamaki okubhalisa kanye nenani.
Usayizi wekhadi, indawo ecacile ye-antenna, indawo ye-chip nomdwebo wokubhoboza.
Impahla ye-Prelam, umbala, ukujiya okuzisholo nokubekezelelana.
Ubuchwepheshe be-antenna, i-resonance eqondiwe noma ukuhlolwa kobubanzi bokufunda obusebenzayo.
Isitaki sekhadi sokugcina, ama-cores aphrintiwe, imbondela, ukuphrinta kwensimbi, iphaneli yomugqa noma yesiginesha.
I-Lamination press, ukushisa, ingcindezi, indawo yokuhlala, ukupholisa kanye nobukhulu bamapuleti.
Ukuhlolwa kukagesi, ukuhlolwa kwe-RF, ukuhlolwa kobukhulu kanye nemibandela yokwamukela.
Umbhalo wekhodi, umjovo wokhiye, uhlu lwe-UID, idatha eguquguqukayo noma ukubuyisana kwesizindalwazi.
Ubuningi bephrothokholi, isibikezelo sonyaka, ishejuli yokuphinda-oda kanye nezidingo zokulawula ushintsho.
Ukupakisha, amadokhumenti okuhlola, indawo lapho uya khona kanye nosuku oluceliwe lokulethwa.
Xoxa ngephrojekthi yakho ye-HF RFID Inlay
Kuyishidi eliwumgogodla wokukhiqiza amakhadi eliqukethe i-chip engu-13.56MHz kanye nothi ngaphakathi kwezendlalelo zepulasitiki. Yenziwe nge-laminated ngama-cores aphrintiwe kanye nembondela ukuze kukhiqizwe amakhadi aphelele angaxhunywanga.
Cha. I-prelam iyisendlalelo esisebenzayo esimaphakathi. Amakhadi aqediwe adinga ukuphrinta okwengeziwe, ukumbondelana, ukucwala, ukupholisa, ukubhoboza nokwenza kube ngokwakho noma ukubhala ngekhodi.
Amaphrojekthi angasebenzisa i-ISO/IEC 14443 Uhlobo A, Uhlobo B, ISO/IEC 15693 noma ama-chip ahambisanayo we-NFC Forum. Iphrothokholi eqondile incike ku-IC ekhethiwe kanye nesistimu yokufunda.
Cha. Imindeni yemikhiqizo ehlukene enezivumelwano ezihlukene, inkumbulo, imiyalo, ukuphepha nezinhlelo zokusebenza. Qinisekisa i-chip kanye nesifundi esiqondile ngaphambi koku-oda.
Izinketho ezinjalo ezihambisana ne-1K zefa zingaxoxwa. Nikeza ngesidingo esiqondile se-chip nesampula yokufunda, ngoba umkhiqizi, i-UID, inkumbulo nokuhambisana kokuqinisekisa kufanele kuqinisekiswe.
Ihlala ifanelekile kumasistimu wefa afakiwe, kodwa amaphrojekthi esimanje avikelekile kufanele ahlole ezinye izindlela zamanje njenge-MIFARE DESFire noma i-MIFARE Plus ngokuya ngesakhiwo sesistimu.
I-NTAG 213, 215 noma 216 namanye ama-chips ahambisanayo we-NFC Forum ayizinketho ezivamile. Khetha imodeli kumemori ye-NDEF edingekayo, ukusebenzisana kwefoni nezici zokuphepha.
I-chip evikelekile yezicelo eziningi efana ne-MIFARE DESFire ingase ifaneleke, kodwa ukusekelwa komfundi, ukuphathwa kokhiye, ukuqinisekiswa, amafayela ohlelo lokusebenza nesofthiwe kufanele kuqinisekiswe.
I-ISO/IEC 15693 isetshenziselwa izinhlelo zokusebenza zamakhadi endawo lapho umfundi, usayizi we-antenna nebanga lokuhlanganisa okuqondiwe kuhluke ezinhlelweni zamakhadi e-proximity asekelwe ku-ISO/IEC 14443.
Izinketho ezivamile zihlanganisa 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kanye 4 × 10. Izakhiwo ngokwezifiso zingakhiqizwa kusukela ku-lamination yomthengi kanye nomdwebo wokubhoboza.
Ikhasi lamanje lomkhiqizo libhekisela cishe ku-0.45 ± 0.02mm ngezakhiwo ezikhethiwe ze-HF. Ukujiya kokugcina kuncike ku-chip, i-antenna, impahla, isitaki sekhadi kanye nezidingo zendawo ze-chip-zone.
Yebo. Nikeza ubukhulu bekhadi eliphothuliwe eliqondiwe, imbondela kanye nezikali eziphrintiwe, iphakheji ye-chip kanye nenqubo yokuhlobisa ukuze isitaki esiphelele sibalwe.
Yebo. Ijiyomethri ye-antenna ingathuthukiswa ngokuzungeze amandla e-chip, usayizi wekhadi, isifundi, ukusebenza okuqondiwe, indawo ye-chip kanye nemvume yokusika.
Izinketho ezishumekiwe ze-copper-wire kanye ne-etched-aluminium zingaxoxwa. Ukwakhiwa okuhle kakhulu kuncike kuvolumu, ukumelana, ukujiya, ukubopha, ukwakheka kwekhadi kanye nethagethi ye-RF.
Abukho ububanzi bendawo yonke. Kuncike ku-chip, uthi, umfundi, isitaki sekhadi, umumo nendawo. Chaza isifundi sokuhlola kanye nebanga eliphansi lokusebenza.
Ingasetshenziswa ngemuva kokuhlolwa kwe-RF. Icwecwe elikhulu lensimbi noma uyinki oshayelayo eduze kothi angase akhiphe noma avikele ukuxhumana okungenakuxhumana.
Ezinye izakhiwo zezinto ezibonakalayo zingabuyekezwa, kodwa ukushwabana, ukubopha, izinga lokushisa elincibilikayo, ukulungiswa kwe-RF nokuqina kwekhadi eliphelile kufanele kuqinisekiswe ngokuhlukana.
I-prelam ivamise ukunikezwa njengomongo wokusebenza ongenalutho. Ukuphrinta kuvame ukusetshenziswa kumashidi ayinhloko ahlukene, nakuba izakhiwo eziqondene nephrojekthi zingaxoxwa.
Asikho isilungiselelo sendawo yonke okufanele sishicilelwe kuso sonke isakhiwo. Thuthukisa izinga lokushisa, ingcindezi, ukuhlala kanye nokupholisa eduze kwe-PVC ngqo, imbondela, uyinki, ukwakhiwa kwe-chip nothi.
Sebenzisa ukupakishwa kwe-chip okuhambisanayo, ukujiya kwendawo okulawulwayo, amapuleti ahlanzekile, ukucindezela okulinganiselwe, umjikelezo wokushisa ovunyelwe kanye nokuhlolwa kukagesi ngaphambi nangemuva kokulanyiswa.
Ukuhlolwa okugcwele kukagesi kungacaciswa. Isivumelwano sokuthenga kufanele sichaze ukuthi yimiphi imiyalo ehlolwayo kuzo zonke izindawo nokuthi yiziphi izivivinyo ezilimazayo noma ezinobukhulu obusebenzisa isampula.
Ukufunda i-UID, ukubhala ngekhodi, ukubhala kwe-NDEF noma ukwenza kube ngokwakho uhlelo lokusebenza kungaxoxwa ngakho. Amasevisi okhiye ovikelekile adinga ukucaciswa okuhlukile okulawulwayo.
Imiklamo ye-Hybrid ingathuthukiswa njengemikhiqizo ehlukene. Zidinga izakhiwo ezizinikele ze-antenna, ukuhlela ukujiya, ukuhlolwa komfundi kanye nentengo.
Yebo. Inqubo ekhethwayo iwukuhlola i-prelam, ukugcwalisa isitaki samakhadi esiphelele, ama-punch cards kanye nokuqinisekisa i-RF, ukusebenza komshini nokomuntu siqu.
I-MOQ incike ekutholakaleni kwe-chip, ithuluzi le-antenna yangokwezifiso, isakhiwo, impahla, ukujiya, uhlelo lokuhlola, ukubhala ngekhodi kanye nokuthi umklamo ojwayelekile ogunyaziwe ungasetshenziswa.
Nikeza nge-chip enembile, isifundi, iphrothokholi, isakhiwo, usayizi weshidi, umdwebo wekhadi, ukujiya, okuqondiwe kwe-antenna, isitaki sokugcina sekhadi, izivivinyo, ubuningi, ukupakisha nendawo oya kuyo.
Xhumana ne-Wallis Plastic ukuze uthole amashidi e-inlay enziwe ngokwezifiso angu-13.56MHz HF RFID PVC ukuze uthole ukufinyelela, i-ID, ihhotela, ubulungu, ezokuthutha, i-NFC nokukhiqizwa kwamakhadi ahlakaniphile. Ithimba lethu lisekela ukukhethwa kwe-chip, idizayini ye-antenna, ukwakheka kweshidi, ukushuna kwe-RF, ukuhlolwa kwe-lamination, ukuhlolwa kukagesi, ukubhala ngekhodi, ukucaciswa kwekhwalithi kanye nokunikezwa kwe-B2B eqondile efekthri.
