ngokwezifiso 125kHz & 13.56MHz RFID PVC I-inlay elaminethwe ngaphambilini s

125kHz ngokwezifiso kanye no-13.56MHz RFID PVC I-inlay elaminethwe ngaphambilini AmaSpredishithi

I-Wallis ihlinzeka ngo-125kHz LF , 13.56MHz HF kanye ne LF HF ]} dual-frequency RFID PVC prelam inlay shidi amakhadi okulawula ukufinyelela, omazisi besisebenzi, amakhadi okhiye behhotela, ubulungu besistimu yekhampasi ye-cred, ubulungu besistimu yokuthutha Ishidi ngalinye lihlanganisa i-chip ekhethiwe, i-antenna eshuniwe kanye nezendlalelo zokusekela zepulasitiki, ezilungele ukukhishwa kwekhadi lokugcina, ukuphrinta, ukubhoboza nokwenza kube ngokwakho.

Izinkomba zesakhiwo ezijwayelekile zifaka 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kanye no-4 × 10. Osayizi beshidi ngokwezifiso, izikhala zamakhadi, indawo ye-chip, amajiyometri wezimpondo, izakhiwo zempahla nogqinsi kungathuthukiswa ukuze kusetshenziswe amapuleti omthengi acwebezelayo, amashidi amathuluzi okuphrinta kanye nezingqimba.

Imvamisa iyodwa ayikhombisi ukuhambisana. I-TK4100, EM4200 kanye ne-ATA5577 yohlobo lwemikhiqizo yefrikhwensi ephansi inokuziphatha okuhlukile kokufunda kuphela noma ukufunda/ukubhala, izinketho zokubhala kanye nokumisa. HF ama-chips angase asebenzise okuthi ISO /IEC 14443 Type A, ISO /IEC 14443 Type B, ISO /IEC 15693 noma NFC Ukucaciswa kweforamu. Isifundi esiqondile, imodeli ye-chip, iphrothokholi, inkumbulo, ukuphepha kanye nesofthiwe yohlelo lokusebenza kufanele kuqinisekiswe ngaphambi kokwakhiwa kwe-antenna nokukhiqizwa ngobuningi.

Uhlobo Lomkhiqizo	LF , HF noma i-dual-frequency RFID ishidi le-inlay elakhiwe ngaphambilini lokwenziwa kwamakhadi epulasitiki
Izinketho Zemvamisa	125kHz LF , 13.56MHz HF , LF + HF ingxubevange kanye nezakhiwo ezithize zephrojekthi yobuchwepheshe obuningi
Izakhiwo Ezijwayelekile	2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 kanye nezakhiwo zamakhadi ngokwezifiso
Uqobo LF Inkomba yokuqina	Cishe u-0.50–0.60mm wezakhiwo ezikhethiwe ze LF ; Ukujiya okuqondile kuncike ku-chip, uthi, impahla kanye nesitaki sokugcina sekhadi
Izinketho Zezinto ezibonakalayo	Okumhlophe noma obala PVC ; PETG kanye nezakhiwo ezihambisana ne-polycarbonate ezingaphansi kweziqu ezihlukene
Izinketho ze-Antenna	Intambo yethusi eshumekiwe LF / HF amakhoyili, i-aluminium egxishiwe HF izinti kanye nemiklamo yangokwezifiso yezinti ezimbili
Ukusekelwa kwe-B2B	Ukukhetha i-chip, ubunjiniyela be-antenna, ukwakheka kwe-CAD, amasampula, izivivinyo zokulahlwa, ukuhlolwa kwe-RF, ukubhala ngekhodi, imibiko ye-QC kanye nokuhlinzekwa kokuthekelisa

Cela RFID prelam Amasampuli kanye ne-Quote

Liyini Ishidi RFID PVC I-inlay elaminethwe ngaphambilini ?

I- RFID i-prelam inlay iyishidi elisebenzayo langaphakathi elisetshenziselwa ukukhiqiza ikhadi lepulasitiki elingenakuthinta. I-antenna, isekethe ehlanganisiwe nokuxhumana kukagesi kushunyekwa phakathi kwezendlalelo zepulasitiki ngaphambi kokuba umthengi engeze amashidi awumongo aphrintiwe kanye nokubonisa ngale Ifilimu ye-overlay s. Isitaki esiqediwe senziwe nge-laminated, sipholiswe, sishaywa futhi senziwe samuntu siqu emakhadini aqediwe.

I- prelam Akulona Ikhadi Eliphrintekayo Eliphelile

I-prelam ngokuvamile ayiphethe umsebenzi wobuciko wamakhasimende. Ukuphrinta kusetshenziswa ekuhlukaniseni amashidi aphambili nangemuva, okusiza ukuvikela i-chip ne-antenna kuyilapho kuvumela umbala olawulwayo, Ifilimu ye-overlay nokukhiqizwa kwesici sokuvikeleka.

LF kanye ne HF Sebenzisa Amasistimu Ahlukene Antenna

Ikhadi le-dual-frequency liqukethe amasekhethi LF ahlukene kanye HF . Ama-chips amabili awabi iphrothokholi eyodwa. Ifrikhwensi ngayinye kufanele yakhelwe, ishunwe, ifundwe futhi—lapho kusekelwa khona—ibhalwe kusetshenziswa ukusebenzelana komfundi okufanele.

Ikhadi Eliqediwe Linquma Ukusebenza Kwangempela

Izendlalelo eziphrintiwe, ihluzo ezenziwe ngensimbi, imigqa kazibuthe, okunamathelayo, ukujiya kwekhadi, insimbi eseduze kanye nejometri yokufunda kungashintsha ukusebenza kwe-RF. Ngakho-ke ukufaneleka kufanele kufake ikhadi eligcwele laminated futhi elibhontshiwe, hhayi kuphela i-prelam engenalutho.

Izinketho Zomkhiqizo Ezingu-Single-Frequency kanye Ne-Dual-Frequency Product

Inlay Uhlobo	Lokwakha	Ukusetshenziswa Okujwayelekile kwe-B2B
125kHz LF prelam	I-chip LF eyodwa kanye nekhoyili eyodwa yethusi eshuniwe yefrikhwensi ephansi	Ukufinyelela kwefa, indawo yokupaka, ubulungu kanye nezinhlelo zokuhlonza
13.56MHz HF prelam	I-chip HF eyodwa kanye nothiyo olulodwa ISO / NFC -oluhambisanayo olukhethelwe uhlelo lokusebenza	Vikela ukufinyelela, ezokuthutha, ikhampasi, ihhotela, NFC namakhadi ezicelo eziningi
LF + HF I-Dual-Frequency prelam	Hlukanisa i LF kanye HF nama-chip anamakhoyili ahlukene ngaphakathi komzimba wekhadi elilodwa	Ukufuduka kusuka kubafundi befa abangu-125kHz kuya kungqalasizinda yamakhadi ahlakaniphile HF yesimanje
LF + UHF noma HF + UHF	Ama-chips amaningi nama-antenna aqondene ne-frequency esakhiweni esisodwa	Ukufinyelela kanye nemoto yebanga elide, impahla noma ukulandelela abasebenzi
Xhumana + I-Hybrid Engathinteki	RFID i-prelam kanye ne-milled-module yokuxhumana noma i-dual-interface architecture	Vikela ubunikazi, i-telecom, ibhange noma amaphrojekthi wokuqinisekisa alawulwayo ngemuva kweziqu

I-Dual-Frequency Cards Isekela Ukufuduka

Izinhlangano zingakhipha isitifiketi esisodwa esisebenza nabafundi abadala be- LF nabafundi abasha be- HF kuyilapho ingqalasizinda ithuthukiswa. Isizindalwazi sokulawula ukufinyelela kusafanele sibambe imephu futhi silawule izihlonzi noma izinhlelo zokusebenza ezivela kubo bobabili ubuchwepheshe.

I-Hybrid Inlay s Idinga Ubunjiniyela Obuhlukile

Ukwengeza i-chip yesibili kukhulisa ukushuba kwendawo, ukuminyana kwezinti, ukugeleza kwempahla nokuba yinkimbinkimbi kokuhlola. Idizayini yefrikhwensi eyodwa akufanele iguqulelwe kumafrikhwensi amabili ngaphandle kwesakhiwo esisha, isilingo se-lamination kanye nokufaneleka kwe-RF.

LF 125kHz Ukukhetha Kwe-Chip

LF Inketho Ye-Chip	Funda / Bhala Ukuma Ukuma	Okujwayelekile Sebenzisa	Inothi Lokuthenga le-B2B
I-TK4100-Uhlobo	Ukulungiselelwa kokufunda kuphela kwefa elivamile; umphakeli kanye nombhalo wekhodi kufanele kuqinisekiswe	Ukulawula ukufinyelela okuyisisekelo kanye nezinhlelo zokuhlonza	Nikeza ngesampula yomfundi kanye nefomethi edingekayo yokuphumayo; ungacabangi ukuthi yonke 'TK4100' imikhiqizo iyefana
EM4200	Umazisi wokufunda kuphela we-IC ohlelwe yifekthri-imvamisa ephansi	Ukulawula ukufinyelela, ukuphathwa kukadoti namafomethi okuhlonza akhethiwe	Qinisekisa ubude bekhodi, ukuguquguquka, inketho yemaski kanye nokuhambisana komfundi ngaphambi kokukhiqiza
I-ATA5577 / T5577-Uhlobo	Okuhlelekayo LF funda/ubhale i-transponder enemodulation elungisekayo kanye nekhodi	Ukuhlonza okulungisekayo, ukufuduka, ukuhlola namafomethi wefa ahambisanayo	Chaza ibhulokhi yokumisa, ifomethi yedatha, iphasiwedi, izingcezu zokukhiya nokuqinisekisa uhlelo
EM4305 / Enye i-R/W LF	Funda/bhala LF izinketho ezitholakalayo kumafomethi aqondene nohlelo lokusebenza	Ukufinyelela, ukuhlonza izimboni kanye nemininingwane ehlelekayo	Qinisekisa isimo se-IC esinembile, inkumbulo, ukuvikelwa nokusekelwa komhleli

Funda Kuphela futhi Funda/Ubhale LF Ama-chips ayimikhiqizo Ehlukile

Ukuqinisekisa kohlobo lwe-EM4200 kuvame ukudlulisa isihlonzi esihlelwe ngokwefekthri, kuyilapho amadivayisi ohlobo lwe-ATA5577 angalungiselelwa futhi abhalwe umhleli ohambisanayo. Ikhotheshini kufanele isho ukuthi ingabe umthengi udinga inombolo egxilile, umbhalo wekhodi wekhasimende noma okungenalutho okulungisekayo.

ISO 11784/11785 Ukuhambisana Kucacisiwe Ngokucushwa

Lawa mazinga ahlotshaniswa nezakhiwo zedatha yokuhlonza izilwane kanye namafomethi esixhumi somoya. Akufanele zisetshenziswe njengesimangalo esiphelele kuwo wonke amakhadi okufinyelela e-TK4100, EM4200 noma T5577. Qinisekisa i-chip enembile, ukumisa kanye nesistimu yokufunda.

HF 13.56MHz I-Chip Selection

HF	Isiqondiso Sephrothokholi Yomndeni we-Chip Inothi	Elivamile	Lokukhetha Isicelo
I-MIFARE Classic / Ifa Elihambisanayo 1K	ISO /IEC 14443 Uhlobo A lwe-ecosystem yefa	Ukufinyelela okufakiwe, amathikithi namasistimu amadala avaliwe	Sebenzisa lapho ingqalasizinda ekhona idinga khona; hlola ezinye izindlela zesimanje ezivikelekile zamasistimu amasha
I-MIFARE Ultralight	ISO /IEC 14443 Uhlobo A imvelo	Amathikithi asetshenziswa kancane, imicimbi kanye nezinhlelo ezilula zokungathinteki	Qinisekisa inkumbulo, okwangempela, iphasiwedi kanye nezidingo zomjikelezo wempilo
NTAG 213 / 215 / 216	NFC I-Forum Type 2 Tag kanye ne ISO /IEC 14443 Uhlobo A	NFC amakhadi ebhizinisi, izixhumanisi zeselula, ukufakazela ubuqiniso nokuzibandakanya kwedijithali	Khetha ngememori ye-NDEF, ubude be-URL, iphasiwedi kanye nezidingo zoqobo
I-MIFARE DESFRE EV3	ISO /IEC 14443 Uhlobo A olunezinhlelo zokusebenza ezivikelekile zesendlalelo esiphezulu	Vikela ukufinyelela, ikhampasi, ezokuthutha, ubunikazi kanye namakhadi ezicelo eziningi	Idinga ukwakheka kohlelo lokusebenza, ukuphathwa kokhiye, ukwenza kube ngokwakho kanye nokuhlanganiswa komfundi/isoftware
ICODE / ISO 15693 Umndeni	ISO /IEC 15693 kanye NFC nokuma kweForamu Uhlobo 5	Ilabhulali, impahla, ikhadi lendawo kanye nezinhlelo zokusebenza zokuhlanganisa-ibanga elide	Iphrothokholi yokufunda kanye nosayizi we-antenna kuyahluka kumasistimu we ISO /IEC 14443 Type A

'13.56MHz Iyahambelana' Akukona Ukucaciswa Okuphelele

Umfundi angasebenza ku-13.56MHz futhi aqhubeke esekela amazinga akhethiwe kuphela noma imiyalo. Cacisa Uhlobo A, Uhlobo B, ISO 15693 noma NFC usekelo lweforamu kanye nemodeli ye-chip enembile kanye nesofthiwe yohlelo lokusebenza.

Ama-chips avikelekile adinga ukwenza kube ngokwakho okuvikelekile

Ukunikeza i-chip ye-DESFire-class akudali ngokuzenzakalelayo imininingwane evikelekile. Okhiye, izinhlelo zokusebenza, amalungelo okufinyelela, ukuhlukahluka, izinqubo zabakhiphi kanye nokuqinisekiswa kwe-backend kumele kwenziwe ngokuhlukana.

I-Dual-Frequency Antenna kanye ne-Card Engineering

Engineering Factor	Dual-Frequency Requirency
Ukuhlukaniswa kwe-Antenna	Isikhundla LF kanye HF namakhoyili ukuze kwehliswe ukunqwabelana ngokomzimba, ukugxila kokucindezela kanye nokuhlangana okungahlosiwe
Isikhundla seChip	Gcina womabili ama-chips ecacile emigqeni yokubhoboza, izikhala, izimbotshana zemojuli yokuxhumana kanye nezindawo ezinengcindezi ephezulu
Ubukhulu bendawo	Nxephezela ama-IC amabili, amakhoyili okuphambana kanye nezindawo zokuxhuma ngaphandle kokudala amabhampa abonakalayo
LF Ukushuna	Qondanisa amandla ekhoyili LF ne-chip nemvamisa yokufunda, ukubhala ngekhodi nokusebenza kokufunda okuqondiwe
HF Ukushuna	Shuna okuthi HF nge-chip yokugcina, isitaki sekhadi, izendlalelo eziphrintiwe kanye nesifundi esihlosiwe
Imephu Yesistimu	Chaza ukuthi LF isihlonzi kanye HF I-UID/uhlelo lokusebenza zihlobana kanjani nerekhodi lomnikazi wekhadi elilodwa
Ukuqinisekiswa Komsebenzisi	Hlola ikhadi eliqediwe elifanayo kuwo wonke amafa adingekayo kanye nemodeli entsha yokufunda

Ukusekelwa Kwezifundi Kumelwe Kuqinisekiswe Kuzo Zombili Amafrikhwensi

Isifundi se-dual-frequency singasekela kuphela amafomethi we LF akhethiwe kanye namaphrothokholi akhethiwe we HF . Nikeza ngomkhiqizo womfundi, imodeli, i-firmware kanye nokuphumayo okulindelekile ukuze ikhadi lihlolwe ngokumelene nesistimu yangempela.

Ibanga Lokufunda Kufanele Licaciswe Ngendlela Yokuhlola

LF kanye nokuthi HF amabanga okufunda ayahluka futhi ancike emandleni omfundi, i-antenna geometry, umumo wekhadi, ukubhala ikhodi, isitaki sekhadi sokugcina nendawo. Sebenzisa amabanga ahlukene okudlula/okufeyila kanye nezinhlawulo zokuhlola kusixhumi esibonakalayo ngasinye.

Isakhiwo Seshidi,

Ipharamitha Yokuhlela Usayizi Nokuqina Koqobo	/ Inketho Etholakalayo ye	-B2B Yokulawula
2 × 5	Ireferensi ye-A4 210 × 297mm	Qinisekisa ukuphakama kwekhadi, amamajini onqenqema, ukuma kwe-antenna nezimbobo zokubhalisa
3 × 7	Cishe 295 × 460mm	Qondanisa ingqikithi ephrintiwe, ipuleti le-lamination kanye nethuluzi lokubhoboza
3 × 8	Cishe 295 × 485mm	Chaza ukubhaliswa komsebenzi wobuciko kanye nesiqondiso sezinombolo zekhadi
4 × 8 / 5 × 5 / 4 × 10	Izakhiwo zezimboni ezinomphumela ophezulu	Ukulawula ukucaba kweshidi, isikhala se-antenna kanye nokufinyelela kokuhlolwa kukagesi
Isakhiwo Ngokwezifiso	Amakhadi ngokwezifiso, ama-key fobs, amakhadi amancane namathuluzi obunikazi	Nikeza i-CAD, uhlaka oluqediwe, imvume yokusika kanye nezixhumanisi ze-chip/antenna
LF Ireferensi yokuqina	Cishe u-0.50–0.60mm ukusuka ekhasini lokuqala	Qinisekisa isilinganiso, igeji yendawo ye-chip-zone kanye nokubala kwekhadi eliphelile
Ukuqina Okubili-Imvamisa	Iphrojekthi ethile futhi ivamise ukuthonywa ama-chips amabili kanye nezinhlelo ezimbili ze-antenna	Gunyaza imephu yokuqina, ukucaba kwekhadi kanye nesinxephezelo sengcindezi yendawo

prelam Ubukhulu Abuqediwe Ukuqina Kwekhadi

Ikhadi elivamile le-CR80/ID-1 lakhiwe lizungeze ukujiya okuzisholo eduze kuka-0.76mm, kodwa umphumela wokugcina uncike kuma-cores aphrintiwe, Ifilimu ye-overlay s, ukugeleza okunamathelayo, izindawo ze-chip nokuminyanisa kwe-lamination. Linganisa ikhadi eliqediwe elinesimo.

Isakhiwo Kumele Sifanise Ithuluzi Lomthengi

I-'3 × 8' ayichazi bonke ubukhulu beshidi, uphawu lokubhalisa noma ukuphakama kwekhadi. Umdwebo wokugcina kufanele usayinwe ngaphambi kokukhiqizwa kwe-antenna ngoba amaphutha okubhoboza ne-chip angalimaza isivuno sikagesi.

Iqedile Ikhadi elihlakaniphile

Wesendlalelo Sesendlalelo	Womsebenzi	Ukulawula Ukhiye
Ngaphambili Ifilimu ye-overlay	Ivikela ukuphrinta futhi inikeze isicwebezelisi, i-matte, isithwathwa noma isiphetho sokuphepha	Isilinganiso, ukubopha, ukuhuzuka kanye nokuhambisana nokwenza kube ngokwakho
I-Front Printed Core	Iphethe imidwebo, umbhalo, amalogo nokuphrinta kokuphepha	Ukubhaliswa, ukwelapha uyinki, ukushwabana kanye nezindawo ezicacile ze-metallic-print
RFID Prelam Inlay	Iqukethe i-chip eyodwa noma ngaphezulu, izimpondo nezixhumo zikagesi	Ukushuna kwe-RF, ukuma kwe-chip, ukujiya, isivuno sikagesi nokuqondanisa
Emuva I-Core Ephrintiwe	Ibhalansisa ingaphambili futhi iphathe umsebenzi wobuciko obheke emuva	Ibhalansi yesendlalelo, ukuma komugqa kanye nokufakwa kokuphrinta
Emuva Ifilimu ye-overlay	Ivikela ikhadi futhi ingase ihlanganise umugqa kazibuthe noma iphaneli yesiginesha	Ukubopha, ukucaba, ukubhala ngekhodi kanye nendawo yokugcina

I-Metallic Foil kanye Noyinki Osebenzayo Kungashintsha Ukusebenza Kwe-RF

Izindawo ezinkulu zensimbi eduze kothi lwe HF zinganciphisa ukuhlangana noma ukushintshwa kwe-shift resonance. Faka konke ukuphrinta kwe-metalized, i-holographic foil kanye nezingxenye kazibuthe ekuhlolweni kwe-RF kwekhadi lokugcina.

Izendlalelo Ezilinganisiwe Yehlisa I-Warpage

Amageji afanayo angaphambili nangemuva, isiqondiso sempahla elawulwayo kanye nokufakwa kokuphrinta okunokulinganisela kunganciphisa ama-curl. Izakhiwo eziphindwe kabili zidinga ukunakwa okwengeziwe ngoba izindawo ze-chip nezinti zingase zibe-asymmetrical.

I-Lamination Process ye- LF , HF kanye ne-Hybrid Inlay s

1. Gunyaza umdwebo wesitaki: Rekhoda zonke Ifilimu ye-overlay , ingqikithi ephrintiwe, inlay, ingcina, umugqa kanye nesendlalelo sokuvikela.

2. Isimo sezinto ezisetshenziswayo: Misa amashidi endaweni yokukhiqiza ehlanzekile futhi uwavikele othulini nasemswakeni.

3. Qinisekisa ukuma: Qondanisa ukuphakama kwekhadi, indawo ye-chip, izindawo zezinti, umsebenzi wobuciko kanye nezimpawu zokuhlaba.

4. Thuthukisa umjikelezo wokushisa: Misa izinga lokushisa, ingcindezi, indawo yokuhlala, ukukhipha izinto kanye nokupholisa ukuze kwakhiwe ngqo.

5. Vikela ama-chip zone: Gwema izinhlayiya eziqinile, ukucindezela kwasendaweni okudlulele kanye nokukhubazeka kwamapuleti phezu kwanoma iyiphi i-chip.

6. Ukuphola ngaphansi kwengcindezi elawulwayo: Ukupholisa kuthinta ukucaba, ukucindezelwa kwe-chip, ukubopha kanye nokuvumelana kwe-RF.

7. Hlola ishidi elaminate: Hlola ukujiya, ukuma, ukubukeka kanye nakho kokubili ukuxhumana kwe-RF ngaphambi kokushaya.

8. Qinisekisa amakhadi aqediwe: Punch, yenza kube ngokwakho, faka ikhodi futhi uhlole LF kanye nokusebenza kwe HF kumasistimu ahlosiwe.

Ingozi Evamile	Engaba Imbangela Yokuqondisa	Indlela Yokulungisa
Ukuhluleka kwe-Chip	Ukushisa okudlulele, ingcindezi, i-ESD noma uxhumano lwe-chip olubuthakathaka	Buyekeza imikhawulo ye-chip, ingcindezi yenqubo, ukulawula kwe-ESD nekhwalithi yokuxhuma
Vula Ikhoyili	I-conductor ephukile, ilunga elingalungile, ukulimala okusikiwe noma ukunyakaza kwezinto ezibonakalayo	Hlola ukuqhubeka, indlela ye-conductor, amandla ahlangene kanye ne-punch clearance
Bubuthakathaka LF noma HF Ububanzi	Ukukhipha, ukungafani komfundi, ukushintsha kwesitaki sekhadi noma ukuphazamiseka kwensimbi	Shuna kabusha futhi uhlole isixhumi esibonakalayo ngasinye ngekhadi eliqediwe nesifundi esiqondiwe
I-Chip Bump Ebonakalayo	Isinxephezelo segeji enganele noma ukujiya kwasendaweni okweqile	Lungiselela ama-cavities, ama-layer gauge, i-cushioning kanye nokusabalalisa kwengcindezi
I-Delamination	Ukungcola, izinto ezingahambelani, ukushisa okuphansi noma ukupholisa okubi	Buyekeza ukuhambisana kwezinto, ukuhlanzwa, umjikelezo wokushisa namandla ekhasi
I-Warpage yekhadi	Isitaki esingalingani, ukushisa ngokweqile, ingcindezi engalingani noma ukupholisa ngokushesha	Linganisa izendlalelo futhi uthuthukise ukushisisa, ukucaba kwamapuleti nokupholisa

Ugesi, i-RF kanye Nokuhlola Ikhwalithi Yomshini

Into	Enconyiwe Ukulawulwa kwe-B2B
I-Chip Identity	Qinisekisa umkhiqizi, inombolo yengxenye eqondile, imvamisa, iphrothokholi, inkumbulo nokulandeleka kwenkatho
LF Ukuhlolwa Okusebenzayo	Funda i-ID echaziwe noma amabhlogo ahleliwe ngefomethi ye LF yokufunda neyokukhiphayo okuvunyelwene ngayo
HF Ukuhlolwa Okusebenzayo	Funda i-UID nemiyalo ekhethiwe, inkumbulo noma uhlelo lokusebenza ngokuya nge-chip HF ngqo
Ukuqhubeka kwe-Antenna	Thola amasekhethi avuliwe, izikhindi, amajoyinti abuthaka kanye nokukhubazeka kwamakhoyili awo womabili amakhoyili
Ukusebenza kwe-RF	Sebenzisa okuhlukile kwe LF kanye ne HF yokuhlola, amamodeli okufunda, umumo namabanga okudlula
Isikhundla se-Chip kanye ne-Antenna	Hlola ngokumelene ne-CAD, uhlaka lwekhadi, imvume yokubhoboza, izikhala kanye nezimbotshana zamamojula
Ubukhulu beshidi	Ubude, ububanzi, isikwele, ukuphakama kwekhadi, izimbobo zokubhalisa kanye nekhwalithi yomkhawulo
Ukujiya kanye Ukucaba	Ukujiya okumaphakathi, izindawo ze-chip zasendaweni, umnsalo, ukugoqa nokuhluka kokukhomba-kuya-iphuzu
Ukuhlolwa Kwekhadi Eliqedile	LF / HF ukusebenza, ubukhulu, ukugoba, ukuxubha, ukushisa, umswakama, ikhasi kanye nokuhambisana komfundi
Ukulandeleka	Ama-chip lot, idizayini ye-antenna, PVC inkatho, inombolo yeshidi, uhlelo lokuhlola, umphumela wokuhlola kanye nerekhodi lokupakisha

Chaza Ububanzi 'kokuhlola okungu-100%'

Ukufunda okugcwele kukagesi kuzo zonke izindawo zekhadi kungacaciswa, kuyilapho ukuhlolwa kwekhasi elilimazayo, ukugoba kanye nezigaba ezinqamulayo kuvame ukusebenzisa amasampula. Ukucaciswa kokuthenga kufanele kuchaze imiyalo, izifundi, ukulungiswa, imikhawulo nemibiko.

I-Dual-Frequency Yield Kumele Imboze Zombili I-interface

Ikhadi elidlula LF kodwa lehluleke HF -noma lidlule HF kodwa lehluleke LF -akulona ikhadi le-dual-frequency card. Indlela yokwamukela kufanele idinge ukuthi bobabili ubuchwepheshe budlulele endaweni efanayo yekhadi eliqediwe.

Izicelo ze LF , HF kanye ne-Dual-Frequency Cards

Isicelo	Esinconyiwe Sesiqondiso Sobuchwepheshe	Ukuqinisekisa Okubalulekile
Ukulawula Ukufinyelela Kwefa	125kHz yokufunda kuphela noma ehlelekayo LF chip edingwa isifundi esifakiwe	Ifomethi yokufunda, okukhipha i-ID, umumo wekhadi kanye nesizindalwazi sokufinyelela
Ukufuduka Kwesistimu Yokufinyelela	LF + vikela HF ukuqinisekisa kwe-dual-frequency	Kokubili isibalo sabafundi, imephu yobunikazi, ukuphathwa okubalulekile nohlelo lokukhishwa
Amakhadi Abalulekile Ehhotela	I-chip eshiwo inkundla yokukhiya ihhotela; ubuchwepheshe obukabili lapho izingidi ezixubile zikhona	Isifaki khodi, i-firmware yokukhiya, ukujiya kwekhadi, umswakama nokusetshenziswa okuphindaphindiwe
Omazisi besisebenzi kanye nekhampasi	HF uhlelo lokusebenza oluvikelekile noma LF + HF phakathi nokufuduka	Ukufinyelela emnyango, ukuya, inkokhelo, ukuphrinta kanye nomjikelezo wempilo
NFC Ubulungu Nokumaketha	I-NTAG noma enye NFC i-chip ehambisana neforamu HF	Ukuhambisana kwefoni, idatha ye-NDEF, ukuphepha kwe-URL kanye nokuma kwe-antenna
Ezokuthutha kanye Nokuvikela Multi-Application	Vikela i HF chip nesakhiwo sesistimu esiqinisekisiwe	Ukusebenza kokwenziwe, i-cryptography, umjovo wokhiye nokuvunyelwa kohlelo

Ukufaka ikhodi, i-UID kanye Yokulawulwa Kokuphepha

Nento Yedatha	Iyadingeka Incazelo
LF Isihlonzi	Ikhodi yefekthri engashintshi, ifomethi ehleliwe, ikhodi yendawo, inombolo yekhadi nokuhleleka kokuphumayo
HF I-UID / CSN	Ubude be-UID, ukuziphatha okungaguquki noma okungahleliwe, ifomethi yesizindalwazi nokuhumusha komfundi
HF Inkumbulo / Isicelo	I-NDEF, imikhakha, amakhasi, amafayela, amalungelo okufinyelela, izinto zokubala kanye nesimo sokukhiya
Okhiye namaphasiwedi	Ubunikazi, ukukhiqiza, umjovo, ukuhlukahluka, ezokuthutha kanye nomkhondo wokuhlola
Imephu ye-Dual-ID	Ubudlelwano phakathi kwenombolo LF , HF I-UID/isicelo nenombolo yekhadi ephrintiwe
Ukubuyisana	Amarekhodi ekhadi ayimpinda, alahlekile, anqatshiwe futhi acekelwe phansi kuzo zombili izixhumanisi

I-UID noma Inombolo Ye-serial Iyodwa Ayiyona Ukuqinisekisa Okuqinile

Izihlonzi ezisesidlangalaleni zingakopishwa noma zilingiswe. Amasistimu azwelayo kwezokuvikela kufanele asebenzise ukuqinisekiswa kwe-cryptographic okufanele, izilawuli ezingemuva kanye nezinqubo zokhipha esikhundleni sokuthembela kuphela enombolweni ebonakalayo noma efundekayo.

Umjovo Owukhiye Uyinqubo Ehlukile Evikelekile

I-chip ye- HF evikelekile idinga ukudalwa kohlelo lokusebenza olulawulwayo nokulayisha ukhiye. Chaza indawo evikelekile, ukushintshana kwedatha, ukuqinisekiswa, ukuphathwa kwamakhadi anqatshiwe kanye nezimfuneko zokucwaninga ngaphambi kokukhiqiza.

I-Prototype, OEM kanye Nenqubo Yokulawula Ukushintsha

1. Ukubuyekezwa kwesidingo: Qinisekisa izifundi, ama-chips, izivumelwano, ukwakheka kwekhadi, isitaki samakhadi nemikhawulo yokuhlola.

2. Umdwebo wobunjiniyela: Gunyaza usayizi weshidi, ukuphakama kwekhadi, indawo ye-chip, izindlela ze-antenna kanye nezimvume zokusika.

3. I-prototype inlay: Khiqiza iqoqo lonjiniyela elincane lokuhlola ugesi, i-RF, ukujiya kanye ne-lamination.

4. Ukuhlolwa kwekhadi eliqedile: Phrinta, laminate, punch, encode kanye namakhadi okuhlola kuwo wonke amasistimu adingekayo.

5. Ukugunyazwa kwesampula okusagolide: Sayina ikhadi eligunyaziwe, ukwakheka kwedatha, ukuhlolwa komfundi nezinga elibonakalayo.

6. Ukukhiqizwa kwenqwaba: Lawula i-chip lot, inqubo ye-antenna, ubukhulu, ukuhlolwa kukagesi kanye nokulandeleka.

7. Guqula isilawuli: Thola imvume ngaphambi kokushintsha umthombo we-chip, iphakheji, uthi, PVC , okunamathelayo, isakhiwo noma okokusebenza kokuhlola.

Amasampula Esitoko kanye Nezibonelo Zangokwezifiso Zifeza Izinjongo Ezihlukene

Isampula yesitoko ibonisa ubuciko obujwayelekile. I-prototype yangokwezifiso iqinisekisa i-chip, izimpondo, isakhiwo, isitaki sekhadi, izifundi kanye nezinto zokusebenza ezidingwa umthengi.

I-MOQ Incike Ekwenzeni ngokwezifiso kwe-Chip kanye ne-Antenna

Imiklamo ejwayelekile engaphakathi kusitoko ingase isekele ama-oda amasampula amancane. Ama-chips angokwezifiso, izakhiwo ze-dual-frequency, ithuluzi le-antenna, ukubhala ngekhodi okuvikelekile kanye nobukhulu beshidi obungajwayelekile ngokuvamile kudinga i-MOQ yokukhiqiza.

Ithimba kanye RFID prelam Nosekelo Lokukhiqiza

Ukukhiqizwa kwe-prelam RFID okuzinzile kudinga ukutholakala kwe-chip elawulwayo, ukwakheka kwezinti, uxhumo lwe-chip-to-coil, i-plastic collation, i-lamination, ukuhlolwa kukagesi, ukuhlolwa kobukhulu kanye nokulandeleka kwenkatho. Ama-oda aphindaphindiwe kufanele asebenzise i-chip egunyaziwe, umdwebo we-antenna, isitaki sezinto ezibonakalayo nendlela yokuhlola ngaphandle kwalapho ushintsho olubhalwe phansi lwamukelwe.

Ukupakisha, Isitoreji kanye Nokuthekelisa Okuthekelisa

• Gcina amashidi ayisicaba emaphaketheni avaliwe, ahlanzekile futhi omile kude nokushisa kanye nelanga eliqondile.

• Sebenzisa amabhodi aqinile, amabhokisi axhumene futhi aqinisiwe ukuze uvikele izinti nama-chip zone.

• Gwema imithwalo ye-pallet engalingani, ukugoba, imithelela ebukhali kanye nokucindezela kwezitaki ngokweqile.

• Sebenzisa izilawuli zokuphatha ezifanele ze-ESD ngezinqubo zokukhiqiza eziveziwe nokuhlola.

• Amashidi wesimo egunjini lokugcoba lapho izimo zokugcina izinto kanye nezimo zokukhiqiza zihluka.

• Lebula iphakethe ngalinye ngenhlanganisela ye-chip, idizayini ye-antenna, isakhiwo, ukujiya, ubuningi nenqwaba.

• Faka i-inventory yokuqala, ephuma kuqala bese uhlola kabusha impahla ngemva kwesitoreji eside noma ukuchayeka okungavamile kwezokuthutha.

Ukupakishwa Kwefulethi Okuvikelwe Kwama-oda Wamazwe Ngamazwe e-B2B

Kungani Khetha i-Wallis ye- RFID PVC I-inlay elaminethwe ngaphambilini s?

• LF , HF kanye nekhono eliyingxubevange: Amaphrojekthi wefrikhwensi eyodwa kanye nama-dual-frequency angathuthukiswa kusukela ku-ecosystem yomfundi wangempela.

• Ubunjiniyela obuqondene ne-Chip: Izinketho zokufunda kuphela, ezihlelekayo, NFC nezivikelekile ze HF zihlukaniswa ngephrothokholi nokusetshenziswa.

• I-antenna yangokwezifiso kanye nesakhiwo: Usayizi weshidi, ukuphakama kwekhadi, indawo ye-chip, i-coil geometry kanye nokucaciswa kokubhoboza kungenziwa ngendlela oyifisayo.

• Iziqu zekhadi eliqediwe: Amasampuli angaphrintwa, afakwe elamiwe, abhotshwe, afakwe ikhodi futhi ahlolwe kubafundi okuqondiwe.

• Ukulawulwa kwekhwalithi okubhalwe phansi: Izidingo zikagesi, i-RF, ubukhulu, ezibonakalayo kanye nokulandeleka zingabhalwa ekucacisweni.

• Ukunikezwa kwe-B2B eqondile efekthri: Ifanele izimboni zamakhadi, izihlanganisi zokufinyelela, abahlinzeki besistimu yamahhotela, abakhiphi, abangenisa kwamanye amazwe nabasabalalisi.

Ulwazi Oludingekayo Ukuze Ikhotheshini Ye-B2B Esheshayo

• Uhlelo lokusebenza nokucushwa okudingekayo: LF , HF noma LF + HF imvamisa ekabili.

• Izinhlobo zokufunda, amamodeli, i-firmware, amaphrothokholi kanye nefomethi edingekayo yokuphumayo.

• Impela LF kanye HF nomkhiqizi we-chip, ingxenye yenombolo, inkumbulo kanye nemfuneko yokuphepha.

• Isakhiwo seshidi, ubukhulu, ukuphakama kwekhadi, amamaki okubhalisa kanye nenani.

• Usayizi wekhadi, ukujiya okuqediwe, izindawo ze-chip, izikhala, izimbobo nomdwebo wokubhoboza.

• prelam okokusebenza, umbala, ukujiya nokubekezelelana.

• LF kanye HF nezidingo zokuhlolwa kwebanga lokufunda nemiqondo eqondisiwe.

• Isitaki sekhadi sokugcina, Ifilimu ye-overlay s, ama-cores aphrintiwe, uyinki wensimbi, umugqa kazibuthe nezici zokuphepha.

• I-Lamination press, izinga lokushisa, ingcindezi, indawo yokuhlala, ukupholisa kanye nobukhulu bepuleti.

• Umbhalo wekhodi, uhlu lwe-UID/ID, umjovo wokhiye, izidingo zemephu yedatha nokubuyisana.

• Ubuningi be-prototype, isibikezelo sonyaka, i-MOQ target kanye nesheduli yokulethwa.

• Ukupakisha, imibhalo yokuhlola, indawo lapho kuyiwa khona kanye nemibhalo edingekayo yokuthobela imithetho.

Xoxa nge LF Yakho kanye HF Inlay Ngephrojekthi

imibuzo ejwayelekile ukubuzwa

Liyini RFID PVC ishidi le-prelam inlay?

Ishidi lekhadi elimaphakathi eliqukethe RFID chip kanye nothi ngaphakathi PVC izendlalelo. Abakhiqizi bamakhadi bengeza ama-cores aphrintiwe kanye Ifilimu ye-overlay s ngaphambi kokugcina nokushaywa ngesibhakela.

Ingabe i-prelam eyodwa ingaqukatha kokubili okungu-125kHz no-13.56MHz?

Yebo. I-dual-frequency prelam iqukethe ama-chips e LF HF ahlukene kanye nama-antenna emzimbeni wekhadi elilodwa. Kokubili ukuxhumana kudinga ukushuna okuzimele nokuhlolwa.

Kungani usebenzise ikhadi le-dual-frequency RFID ?

Ivumela isitifiketi esisodwa ukuthi sisebenze nabafundi befa abangu-125kHz kanye nezifundi zamakhadi ahlakaniphile angu-13.56MHz ngesikhathi sokufuduka kwengqalasizinda.

Ingabe i LF kanye ne HF chips zixhunywe ndawonye?

Ngokuvamile bangamasekhethi ahlukene. Izihlonzi zabo zingaxhunywa kusizindalwazi sekhasimende, kodwa zixhumana ngokuzimela nabafundi abahlukene.

Imaphi ama-chips angu-125kHz atholakalayo?

TK4100-uhlobo, EM4200, ATA5577/T5577-uhlobo nezinye izinketho ze LF kungaxoxwa ngazo. Qinisekisa ukufunda kuphela noma ukufunda/ukubhala ukuziphatha, ukubhala ngekhodi nefomethi yokufunda.

Ingabe i-EM4200 ifundwa kuphela?

I-EM4200 ibekwe njenge-IC ehlonza imvamisa ephansi yokufunda kuphela ehlelwe efekthri. Inketho yekhodi edingekayo kanye nokuhambisana komfundi kufanele kucaciswe.

Ingabe i-T5577 iyahleleka?

Amadivayisi ohlobo lwe-ATA5577/T5577 angama-transponder afundekayo/abhale LF . Ifomethi yokuhlela, iphasiwedi, izingcezu zokukhiya nokuqinisekisa kufanele kuchazwe.

Ingabe wonke amakhadi angu-125kHz ISO 11784/11785 ahambisana?

Cha. Ukuhambisana kuncike ku-chip kanye nokucushwa kwayo. Lawa mazinga akufanele asetshenziswe njengesimangalo esiphelele kuwo wonke ama-chip LF okulawula ukufinyelela.

Imaphi ama-chips angu-13.56MHz atholakalayo?

Izinketho zifaka ama-chips ohlobo lwefa, i-MIFARE Ultralight, i-NTAG, i-MIFARE DESFire kanye nemindeni ye ISO 15693/ICODE, kuncike ekutholakaleni nezimfuneko zohlelo lokusebenza.

Ingabe wonke ama-chips angu-13.56MHz ahambisana nomfundi ofanayo?

Cha. Abafundi basekela izindinganiso ezithile, imiyalo nezinhlelo zokusebenza. Qinisekisa Uhlobo A, Uhlobo B, ISO 15693 noma NFC usekelo lweforamu kanye ne-IC ngqo.

Iyiphi HF chip elungele amakhadi ebhizinisi e NFC ?

I-NTAG 213, 215 noma 216 namanye NFC ama-chips ahambisana neforamu ayizinketho ezivamile. Khetha ngememori ye-NDEF, ukuhambisana kwefoni kanye nezidingo zokuphepha.

Iyiphi HF chip elungele ukufinyelela okuphephile?

Inkundla evikelekile efana ne-MIFARE DESFire ingase ifaneleke, kodwa umfundi, okhiye, izinhlelo zokusebenza, i-backend kanye nenqubo yokwenza kube ngokwakho kufanele ihlanganiswe ndawonye.

Yiziphi izakhiwo ezitholakalayo?

Izakhiwo ezivamile zihlanganisa 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kanye no-4 × 10. Izakhiwo ngokwezifiso zingenziwa ngomdwebo we-CAD womthengi.

Buyini ubukhulu obujwayelekile be LF be-prelam?

Ikhasi langempela libhekisela cishe ku-0.50–0.60mm ezakhiweni ezikhethiwe ze LF . Igeji eqondile incike ku-chip, ikhoyili, PVC kanye nomklamo wokugcina wekhadi.

Ingabe i-dual-frequency prelam ijiyile?

Ingase idinge ukujiya okwengeziwe noma isinxephezelo sasendaweni ngoba iqukethe ama-chips amabili namasistimu amabili wezinti. Imephu yogqinsi oluphelele kufanele igunyazwe.

Ingabe idizayini ye-antenna ingenziwa ngendlela oyifisayo?

Yebo. Ijiyomethri yekhoyili ingathuthukiswa eduze kwe-chip, usayizi wekhadi, umfundi, uhla okuqondiwe kulo, indawo ye-chip kanye nemvume yokusika.

Yiluphi uhla lokufunda olungazuzwa yikhadi eliqediwe?

Ububanzi buncike ebuningini, i-chip, uthi, umfundi, isitaki sekhadi, umumo nendawo. Chaza okuhlukene LF kanye HF nabafundi bokuhlola kanye namabanga okudlula.

Ingabe i-metallic foil ingaphrintwa ekhadini le-dual-frequency?

Kungacatshangelwa ngemva kokuhlolwa. Izindawo ezinkulu ezenziwe ngensimbi zingase zithinte uthi HF futhi kufanele zifakwe ekhadini eliqediwe lokufaneleka le-RF.

Ingabe i PETG noma i-polycarbonate ingasetshenziswa esikhundleni se PVC ?

Ezinye izakhiwo zingathuthukiswa, kodwa ukubopha, ukushisa, ukushwabana, ukulungisa i-RF, ukucindezelwa kwe-chip nokuqina kwekhadi lokugcina kufanele kuqinisekiswe ngokuhlukana.

Ingabe amashidi e-prelam aphrintiwe?

Avamise ukuba ngamashidi asebenzayo angenalutho. Ihluzo zekhasimende ngokuvamile ziphrintwa emakhasini ahlukene ayisisekelo ngaphambi kokuba ikhadi eliphelele lenziwe laminated.

Yikuphi ukushisa kwe-lamination okufanele kusetshenziswe?

Akukho kulungiselelwa kwendawo yonke. Ukushisa, ingcindezi, indawo yokuhlala kanye nokupholisa kufanele kuthuthukiswe okuqondile PVC , amaphakheji e-chip, izinti, ama-cores aphrintiwe kanye ne Ifilimu ye-overlay s.

Kuvinjelwa kanjani ukulimala kwe-chip ngesikhathi sokulanyiswa?

Sebenzisa ukushuba kwendawo okulawulwayo, amapuleti ahlanzekile, ingcindezi elinganiselayo, amaphakheji e-chip ahambisanayo, imijikelezo yokushisa egunyaziwe kanye nokuhlolwa kukagesi ngaphambi nangemuva kokulanyiswa.

Ingabe yonke indawo yekhadi ingahlolwa ngogesi?

Yebo, ukuhlolwa kukagesi okugcwele kungashiwo. Ngemikhiqizo yama-dual-frequency, kokubili ukuxhumana kwe LF kanye ne HF kufanele kudlule kuzo zonke izindawo ezamukelwe.

Ingabe ama-chips angabhalwa ngekhodi ngaphambi kokulethwa?

LF ukuhlela, HF ukubhala inkumbulo, idatha ye-NDEF nokwenza kube ngokwakho uhlelo lokusebenza kungaxoxwa ngakho. Okhiye abavikelekile badinga inqubo elawulwayo ehlukile.

Ingabe amasampula angahlolwa ngaphambi kokukhiqizwa kwenqwaba?

Yebo. Iziqu ezingcono kakhulu zisebenzisa ama-chips, izimpondo, isitaki samakhadi, umshini wokucindezela i-lamination, ithuluzi lokubhoboza kanye nezifundi eziqondiwe.

Yini enquma inani elincane le-oda?

I-MOQ incike ekutholakaleni kwe-chip, imvamisa eyodwa noma ekabili, ithuluzi le-antenna, isakhiwo, impahla, umbhalo wekhodi, izidingo zokuhlola kanye nokuthi umklamo ojwayelekile uyatholakala yini.

Iluphi ulwazi oludingekayo ukuze uthole ikhotheshini enembile?

Nikeza ngokuqondile LF kanye HF nama-chips, izifundi, izivumelwano, isakhiwo, umdwebo wekhadi, ukujiya, isitaki sekhadi, imikhawulo yokuhlola, umbhalo wekhodi, inani, ukupakisha nendawo okuyiwa kuyo.

Cela Ngokwezifiso LF , HF noma I-Dual-Frequency prelam Amasampuli

Xhumana ne Wallis Plastic ukuze uthole ngokwezifiso u-125kHz LF , 13.56MHz HF kanye ne LF + HF dual-frequency RFID PVC prelam inlay sheets. Ithimba lethu lisekela ukukhethwa kwe-chip, i-antenna kanye nesakhiwo sesakhiwo, ukuhlela isitaki samakhadi, ukuhlolwa kwe-lamination, LF / HF ukuhlola, ukubhala ngekhodi, ukucaciswa kwekhwalithi kanye nokunikezwa kwe-B2B eqondile efekthri.

Cela amasampula kanye ne-Factory Quote