|
impahla yekhadi
Wallis
| Umbala: | |
|---|---|
| Okubalulekile: | |
| Isicelo: | |
| Ubuningi: | |
Ishidi le-PVC lombala we-Wallis elinoqweqwe olumhlophe liyi-substrate yamakhadi ephrintekayo eyenzelwe amakhadi asebhange, amakhadi ezezimali, amakhadi omazisi, amakhadi ahlakaniphile, amakhadi okufinyelela, amakhadi obulungu nezinye izinhlelo zamakhadi epulasitiki ane-laminated. Ihlanganisa isisekelo esiqinile se-PVC esinombala onesendlalelo sokuphrinta esimhlophe esilawulwayo ukuze abakhiqizi bathole indawo yesithombe ekhanyayo kuyilapho begcina umgogodla noma umphetho wekhadi elinombala ohlukile.
Izinto ezisetshenziswayo zingenziwa ngokwezifiso ngombala wesisekelo, ukumbozwa okumhlophe okunamathelayo, ukujiya kweshidi, usayizi weshidi, isiphetho sendawo kanye nebanga lokuphrinta. Ukuze kukhiqizwe ngobuningi okuthembekile, ibanga eliqondile kufanele likhethwe ngokuya ngomshini wokunyathelisa, isistimu kayinki, isakhiwo sokumbondelana, umjikelezo we-lamination, idizayini ye-chip noma i-antenna kanye nezidingo zokugcina zokuhlolwa kwekhadi.
| Ipharamitha | B2B Ukucaciswa |
|---|---|
| Okubalulekile | Ishidi lekhadi le-PVC eliqinile elinesisekelo esinemibala kanye nenamathela ephrintekayo emhlophe |
| Imibala Eyisisekelo | Imibala ebomvu, eluhlaza okwesibhakabhaka, eluhlaza, ephuzi kanye neyangokwezifiso esekelwe esithenjwa sombala esigunyaziwe |
| Ukugqoka | Isendlalelo sokuphrinta esimhlophe; ukumbozwa kwe-coating kanye nokucushwa kohlangothi olulodwa noma okubili kufanele kuqinisekiswe ngesikhathi sokusampula |
| Ubukhulu | Kwenziwe ngokwezifiso ngokwesendlalelo esiphrintiwe, isakhiwo esiwumongo, inhlanganisela yembondela kanye nokujiya kwekhadi eliqediwe eliqondiwe |
| Usayizi Weshidi | Amafomethi ajwayelekile weshidi lokukhiqiza amakhadi noma ubukhulu bangokwezifiso obususelwe kusakhiwo sokuphrinta nokushaya |
| Ibanga Lokuphrinta | I-offset, isikrini sikasilika noma ibanga lokuphrinta le-UV elikhethiwe ngokusho kukayinki nezinto zokusebenza; i-digital ezinikele noma i-inkjet enamathela idinga ukuqinisekiswa okuhlukile |
| Ukucubungula phansi | Ukuphrinta, i-hot lamination, i-die cutting, ukubhoboza, ukushumeka kwe-chip, ukuhlanganiswa komugqa kazibuthe nokwenza ikhadi kube ngokwakho |
| Izinhlelo zokusebenza | Amakhadi ebhange, amakhadi esikweletu nawemali, amakhadi omazisi, amakhadi okufinyelela, amakhadi ehhotela, amakhadi obulungu, amakhadi esipho namakhadi ahlakaniphile enziwe ngokwezifiso |
| Ukuvunyelwa kwesampula | Umbala, ukunamathela, ukunamathela kokuphrinta, i-lamination nokusebenza kwekhadi eliqediwe kufanele kuvunywe ngaphambi kokukhiqizwa kwenqwaba |
Ishidi le-PVC elinombala omhlophe liwumsebenzi wekhadi lemisebenzi eminingi elihlanganisa i-substrate eqinile ye-PVC enombala kanye nongqimba olungaphezulu olumhlophe oludizayinelwe ukuthola ihluzo eziphrintiwe. Isisekelo esinombala sihlala sibonakala ezindaweni ezikhethiwe noma eceleni konqenqema lwekhadi, kuyilapho ukunamathela okumhlophe kudala ingemuva elimaphakathi lamalogo, ukuma ngobude, umbhalo ocolekile, amabhakhodi, amaphethini okuvikela nemibala yebhrendi.
Esakhiweni sekhadi elakhiwe nge-laminated, ishidi eliphrintiwe ngokuvamile lihlanganiswa nezimbondela ezihambisanayo futhi, lapho kudingekile, inlay ye-RFID, indawo yemojula yokuxhumana, umugqa kazibuthe, iphaneli yesiginesha noma olunye ungqimba olusebenzayo. Inhlanganisela yokugcina yezinto kufanele ihlolwe njengesitaki sekhadi esiphelele kunokuhlola ishidi elinamekiwe lodwa.
| Nohlobo Lwempahla Yeshidi Eliphrintekayo Elimhlophe Umsebenzi | Oyinhloko | Isizathu Esivamile Sokukhetha |
|---|---|---|
| Umbala we-PVC Core Sheet | Ihlinzeka ngesakhiwo kanye nengqikithi enombala ebonakalayo noma unqenqema | Ukuhlukaniswa kwebhrendi, ukubukeka kwekhadi le-premium noma isendlalelo sombala sangaphakathi esichaziwe |
| Faka umbala we-PVC nge-White Coating | Ihlanganisa isisekelo esinemibala nendawo ephrintiwe ekhanyayo | Amaphrojekthi adinga kokubili i-substrate enemibala kanye nokukhiqizwa kabusha okunembile komsebenzi wobuciko ophrintiwe |
| Ishidi le-PVC Eliphrintekayo Elimhlophe | Inikeza i-substrate yokuphrinta emhlophe efanayo | Umsebenzi wobuciko wekhadi ojwayelekile lapho kungekho ingqikithi enombala noma indawo enemibala edingekile |
| I-Inkjet ezinikezele noma Ibanga Ledijithali | Isebenzisa okokunamathela okwenzelwe iphrinta nesistimu kayinki ethile | Ukugeleza komsebenzi okudijithali okungakwazi ukusebenzisa i-offset evamile noma indawo yesikrini sikasilika |
Ukuphrinta ngokuqondile phezu kwe-substrate enemibala egcwele kungashintsha amanani e-CMYK futhi kunciphise ukugqama. Isendlalelo esimhlophe esilawulwayo sidala isisekelo esimaphakathi, esiza iphrinta ukuthi ikhiqize kabusha amalogo, ukuma ngobude, imigqa emihle kanye nezithombe zamakhadi eziguquguqukayo ngokungaguquki.
Ukugqoka kungahlukanisa isithombe esiphrintiwe kumbala oyisisekelo ongaphansi. Ukufiphala kwe-coating, ukujiya kanye nokumboza kufanele kuvunywe ngokumelene nomsebenzi wobuciko wangempela ngoba imibala ehlukene nemidwebo yezithombe kudinga ukusebenza kokufihla okuhlukile.
Isisekelo se-PVC esinemibala singahlala sibonakala onqenqemeni lwekhadi noma ezindaweni eziklanywe ngamabomu ezingamboziwe. Lokhu kuvumela abakhiphile nemikhiqizo yamakhadi ukuthi bakhe ukuhlonza okubonakalayo ngaphandle kokudela ingemuva elimhlophe lokuphrinta elidingekayo ukuze uthole izithombe ezinemininingwane.
Isendlalelo esiboshwe kufanele sigcine ukunamathela kukayinki futhi sihlale siboshelwe kusisekelo se-PVC ngemva kokushisa nokucindezela. Ngakho-ke ukuhlolwa kokugunyazwa kufanele kufake ukuphrinta, ukuphulukisa, ukumboza imbobo, ukubhoboza kanye nokuhlolwa kokuguquguquka kwekhadi eliqedile.
Ibanga elilungile lomkhiqizo lincike kubuchwepheshe bokuphrinta kanye nekhemistri yeyinki. Ishidi elichazwa njenge-offset eliphrintekayo akufanele lithathwe ngokuzenzakalelayo njengelihambisana ne-inkjet esekelwe emanzini, i-electrophotographic noma yonke isistimu yedijithali ye-UV. U-Wallis uncoma ukuthi kuqinisekiswe imodeli yokunyathelisa, uhlobo lukayinki, indlela yokwelapha kanye nesivinini esilindelwe sokuphrinta ngaphambi kokulungiselela isampula.
| Senqubo Yokuphrinta | Isidingo Esibalulekile | Ukuqinisekisa Okunconyiwe |
|---|---|---|
| Ukuphrinta kwe-Offset | Amandla angaphezulu alawulwayo, ukushelela kwe-coating kanye ne-inki anchorage | Ukuminyana kukayinki oqinile, ukukhiqizwa kabusha kwamachashazi, ukomiswa, ukunamathela kwetheyiphu kanye nokuhlolwa kwekhasi le-post-lamination |
| Ukuphrinta kwesikrini sikasilika | Ukuhambisana ne-solvent ekhethiwe noma uyinki we-UV kanye nokufakwa kwe-coating edingekayo | Ukubukeka kwe-Mesh-mark, ukuphulukiswa, ukunamathela kanye nokumelana ngemva kokucwenga |
| Ukuphrinta Kwedijithali kwe-UV | Ubuso bufaniswe nephrinta, i-primer kanye nesistimu kayinki ye-UV | Ukunamathela kwe-cross-hatch, ukugoba, ukunwaya nokumbondelana |
| Ukuphrinta kwe-Inkjet | Isembozo esizinikele sokwamukela uyinki senzelwe ikhemistri kayinki | Ukuminyana kwesithombe, ukomiswa, ukumelana namanzi, ukungcofa kanye nokuhambisana kwe-lamination |
| Ukuphrinta Okushisayo noma Okuzenzelayo | Imbondela yokugcina nokuqedwa kwengaphezulu kukhethelwe inqubo yokwenza kube ngokwakho | Ukudluliswa kweribhoni, ukuhuzuka, ukuphatha isifundi sekhadi nokuqina kwedatha eguquguqukayo |
Ikhadi elenziwe elayiniwe elijwayelekile lingase lihlanganise imbondela ekhanyelayo, ishidi le-PVC elinemibala emhlophe eliphrintiwe, ungqimba olulodwa noma ngaphezulu noma izendlalelo ze-inlay, isendlalelo sesibili esiphrintiwe kanye nembondela engemuva. Amakhadi ane-Dual-interface noma angathintwa angaphinde ahlanganise uthi ne-chip inlay. Ugqinsi lwengxenye ngayinye kufanele lubalwe ndawonye ukuze kuzuzwe ukwakhiwa okucacisiwe kwekhadi eliqediwe.
Imbondela engaphambili esobala noma esebenzayo
Ishidi le-PVC eliphrintiwe ngaphambili elinombala omhlophe
I-PVC core, i-RFID prelam noma isendlalelo esiphakathi esisebenzayo
Ishidi eliphrintiwe ngemuva noma isendlalelo esiyinhloko esinombala
Imbondela engemuva enomugqa ozikhethela wona, iphaneli yesiginesha noma isici sokuvikela
Amashidi e-PVC anombala omhlophe afanele izinhlelo zekhadi le-B2B ezidinga ingemuva lokuphrinta elilawulwayo kanye ne-substrate enombala noma umphetho onemibala. Izinto ezisetshenziswayo zingathuthukiselwa amakhadi avamile kanye ne-chip kanye nezakhiwo ezingaxhunywanga ngemva kokuhlolwa kwezinga lesistimu.
Amakhadi ebhange, esikweletu, edebhithi nawesikhokhelo
Amakhadi ezezimali ane-Dual-interface nangaphandle kokuthinta
Omazisi bakahulumeni, abasebenzi kanye nekhampasi
Ukulawula ukufinyelela namakhadi okhiye behhotela
Ubulungu, ukwethembeka, i-VIP namakhadi esipho
Amakhadi ebhrendi enziwe ngokwezifiso anamadizayini anomphetho onemibala
Imibala eyisisekelo ingathuthukiswa kusukela kunkomba ebonakalayo, isampula elabhorethri egunyaziwe noma ikhodi yombala eyaziwayo. Ngenxa yokuthi ukwakheka kwe-PVC, ukuphela kwendawo nokukhanya kuthonya ukubukeka okubonakalayo, isampula yokukhiqiza egunyaziwe kufanele igcinwe njengereferensi yombala yokuphinda ama-oda.
Abathengi kufanele bacacise ukuthi i-coating igcwele noma ikhethiwe, inohlangothi olulodwa noma izinhlangothi ezimbili, nokuthi izindawo ezinemibala engagcotshiwe kufanele zihlale zibonakala. Ukubhaliswa kobuciko kanye nokubekezelelana komkhawulo kufanele kuhlolwe ngesikhathi sokusampula.
Ukuqedwa kwe-Matte, okubushelelezi noma okunye okuqondene nephrojekthi kungaxoxwa ngokuya ngenqubo yokuphrinta kanye ne-lamination. Ibanga elingaphezulu kufanele ligunyazwe ngoyinki wangempela, iphrinta, imbondela kanye nemingcele yokukhanyisa.
Ubukhulu beshidi kufanele bufane nomshini wekhasimende, ukuhlanganisa kanye nesakhiwo sokubhoboza. I-RFQ kufanele ihlanganise usayizi weshidi eliqediwe, okusanhlamvu noma ukuqondiswa komshini lapho kufanele, i-matrix yekhadi, izimpawu zokubhalisa nesimo sonqenqema esamukelekayo.
| Abalulekile | Kungani Ibalulekile | Indlela Yokugunyaza |
|---|---|---|
| Umbala Oyisisekelo | Ilawula ukubukeka komkhiqizo kanye nokuvumelana kwe-oda eliphindaphindiwe | Qhathanisa nesampula yombala esayiniwe ngaphansi kwezimo zokukhanyisa okuvunyelwene ngazo |
| Umbala Wokumboza Omhlophe nokungafihli | Ithinta ukugqama kwemisebenzi yobuciko kanye nokufihla isisekelo esinombala | Ukuqhathanisa okubonakalayo kanye nombala othize wephrojekthi noma ukulinganisa kokungabonakali lapho kudingeka |
| I-Coating Adhesion | Yehlisa ukuxebuka ngesikhathi sokuphrinta, i-lamination kanye nokusetshenziswa kwekhadi | Itheyiphu, i-cross-hatch noma ukuhlolwa kwekhasi okuvunyelwene ngakho ngaphambi nangemuva kokulanyiswa |
| Ukujiya kanye Ukucaba | Isekela ukubhaliswa kokuphrinta, ukugoqa kanye nokulawula ukujiya kwekhadi lokugcina | Isilinganiso samaphuzu amaningi kanye nokuhlolwa kokucaba |
| Amandla Angaphezulu Nokunamathela Kokuphrinta | Kuthonya ukumanzisa, ukomisa kanye nokuqina kwesithombe | I-Dyne noma ukuhlolwa kwendawo okuvunyelwene ngayo okulandelwa ukuhlolwa kokunamathela koyinki wokukhiqiza |
| I-Lamination Bonding | Ivimbela amabhamuza, ukuphakama komphetho kanye nokuhlukaniswa kwesendlalelo | Hlola isitaki sekhadi esiphelele ngezinga lokushisa elihlosiwe, ingcindezi kanye nomjikelezo |
| Ukusebenza Kwekhadi Eliphelile | Iqinisekisa ukuthi ukwakhiwa okugcwele kuyasebenza ngemuva kokuguqulwa | Ukubhoboza, ukugoba, ukukhwehlela, ukuhuzuka kanye nokuhlolwa kokusebenza kwekhadi njengoba kusebenza |
Nikeza uhlelo lokugcina lwekhadi, isitaki sesendlalelo, ukujiya okuhlosiwe okuqediwe, umklamo we-chip noma othi, uhlobo lwembondela kanye nenqubo ehleliwe yomuntu siqu.
Nikeza ngombala oyisisekelo odingekayo, ukumbozwa okumhlophe, ukuphrinta amafayela nokuhlosiwe okubalulekile kombala webhrendi. Bonisa ukuthi izindawo ezinemibala kufanele zihlale ziveziwe ngemva kokuphrinta.
Qalisa isampula emshinini ohlosiwe usebenzisa i-inki yokukhiqiza, izilungiselelo zokuphulukisa, imbondela kanye nomjikelezo we-lamination. Hlola ukuminyana kwesithombe, ukunamathela kokunamathela, ukubopha ungqimba kanye nokucaba kwekhadi.
Sayina futhi ugcine ishidi eligunyaziwe nekhadi eliqediwe njengereferensi yombala, okokunamathelayo, umphumela wokuphrinta, i-lamination kanye nokuhlolwa kwe-oda lokuphinda.
I-Wallis ihlinzeka ngezinto zokukhiqiza amakhadi zabakhiqizi, iziguquli, izihlanganisi zephrojekthi nabasabalalisi. Ukwesekwa kungabandakanya imibala eyisisekelo yangokwezifiso, ukuthuthukiswa kokumboza, ukufanisa usayizi weshidi, ukulungiswa kwesampula, ukuxhumanisa kwesakhiwo sekhadi kanye nokupakishwa kokuthekelisa.
Umbala wangokwezifiso nokuthuthukiswa kokunamathela okumhlophe okusekelwe kumasampuli agunyaziwe
Ukusekelwa kwezinto ezibonakalayo zokuphrinta, ukumboza i-lamination nokuguqulwa kwekhadi
Usayizi weshidi othize wephrojekthi, ukujiya kanye nezinketho zendawo
Ukugunyazwa kwesampula kanye Nesampula Yegolide ngaphambi kokukhiqizwa kwevolumu
Ukupakisha okuthekelisa kanye nokuxhumana kwe-oda le-B2B
Ukuhlolwa kweshidi nokupakishwa kufanele kuvikele indawo emboziwe othulini, imihuzuko, umswakama, ukuvinjwa kanye nokuguqulwa. Ukucushwa kokupakisha kungaxoxwa ngokuhambisana nobukhulu beshidi, umthamo we-oda, indlela yokuthutha kanye nezidingo zokulebula ikhasimende.
| Imininingwane Edingekayo | Ukuze Kuhlinzekwe |
|---|---|
| Isicelo Sekhadi | Ikhadi lasebhange, ikhadi le-ID, ikhadi lokufinyelela, ikhadi lobulungu, ikhadi lesipho noma enye iphrojekthi |
| Umbala we-PVC oyisisekelo | Ikhodi yombala, isampula ebonakalayo noma ireferensi ekhona egunyaziwe |
| I-White Coating | Uhlangothi olulodwa noma ezimbili, ukumbozwa okugcwele noma okukhethiwe, umgomo odingekayo wokuqeda nokungafihli |
| Inqubo Yokuphrinta | Cindezela imodeli, uhlobo lukayinki, indlela yokwelapha kanye nenombolo yezinhlangothi zokuphrinta |
| Ukucaciswa Kweshidi | Ubukhulu, ububanzi, ubude, ubuningi nokupakisha okuthandwayo |
| Ukwakhiwa Kwekhadi | Imbondela, ingqikithi, inlay, umugqa kazibuthe, i-chip kanye nezidingo zokujiya kokugcina |
| Umbandela Wekhwalithi | Ukubekezelela umbala, ukunamathela kokunamathela, amandla angaphezulu, i-lamination kanye nokuhlolwa kwamakhadi aphelile |
Kuyi-substrate yekhadi le-PVC elinemibala eqinile enongqimba lwangaphezulu oluphrintekayo olumhlophe. Isisekelo esinombala sinikeza ubunikazi bekhadi, kuyilapho ungqimba olumhlophe lusekela ukukhiqizwa kabusha kwemisebenzi yobuciko ecace futhi ebikezelwe.
Imibala eyisisekelo emnyama noma egcwele ingashintsha amanani e-CMYK futhi yehlise ukugqama. Isendlalelo esimhlophe sivala umbala ongaphansi futhi sinikeza ingemuva elingathathi hlangothi lombhalo, amalogo, ukuma ngobude nezithombe zokuphepha.
Amamaki e-offset angahlinzekwa, kodwa ishidi kufanele lihlolwe ngoyinki wangempela wekhasimende, umshini wokunyathelisa, izimo zokomisa, umjikelezo wokumbondela kanye nokukhishwa kwe-lamination ngaphambi kokukhiqizwa ngobuningi.
Hhayi ngokuzenzakalelayo. I-inkjet esekelwe emanzini kanye nezinye izinhlelo zedijithali zidinga i-inki enamathelayo eyamukelayo. Imodeli yephrinta kanye nekhemistri kayinki kufanele kuqinisekiswe ngaphambi kokukhetha ibanga lezinto ezibonakalayo.
Yebo. Imibala yangokwezifiso ingathuthukiswa kusuka kukhodi yombala noma inkomba ebonakalayo. Isampula esayiniwe kufanele isetshenziswe njengezinga lokukhiqiza nokuphinda-oda.
Ukugqoka ohlangothini olulodwa noma okubili kungaxoxwa ngokusho komklamo wekhadi kanye nesakhiwo sokunyathelisa. Ukumbozwa kwe-coating, ukubhaliswa kanye nezidingo zangaphezulu kufanele kuchazwe ku-RFQ.
Ukugqoka okukhethekile noma umklamo wobuciko ungase ushiye izindawo ezikhethiwe ezinemibala zibonakala. Umngcele wokumboza nokubhaliswa kokuphrinta kufanele kuqinisekiswe ngamasampula.
Ingahlolwa njengesendlalelo esiphrintiwe ngaphakathi kokwakhiwa kwe-dual-interface. Isitaki esiphelele, okuhlanganisa ne-RFID inlay, imbondela, umgodi we-chip kanye nemingcele yokuhlobisa, kufanele ihlolwe ndawonye.
Amasheke anconyiwe afaka umbala oyisisekelo, umthunzi omhlophe onamathelayo kanye nokungafihli kahle, ukujiya, ukucaba, ukunamathela kokunamathela, amandla angaphezulu, ukunamathela kokuphrinta, ukubopha kwe-lamination kanye nokuhlolwa kwemishini kwamakhadi aphelile.
Amasampula kungaxoxwa ngawo ukuze kuhlolwe umbala, ukunameka, ukuphrinta kanye nokuhlolwa kwe-lamination. Ukuthuthukiswa okwenziwe ngendlela oyifisayo kungase kudinge umsebenzi wobuciko, izinkomba zemibala kanye nemininingwane yesakhiwo sekhadi ngaphambi kokulungiselela isampula.
Gcina Isampula Legolide esayiniwe futhi uchaze indlela yokuqhathanisa okuvunyelwene ngayo. Ama-oda aphindaphindiwe kufanele ahlolwe ngokumelene nombala wesisekelo ofanayo, i-coating kanye nereferensi yekhadi eliqediwe.
Nikeza uhlelo lokusebenza, umbala oyisisekelo, ukumboza, indlela yokuphrinta, ubukhulu beshidi, ukujiya, ubuningi, isakhiwo sesendlalelo sekhadi, indlela yokuhlola kanye nezidingo zokupakisha.
Thumela u-Wallis inkomba yakho yombala, imfuneko yokwemboza, indlela yokuphrinta, ukucaciswa kweshidi, ukwakheka kwekhadi kanye nenani le-oda elilinganiselwe. Amaqembu ezobuchwepheshe nawokuthengisa angalungiselela isincomo sempahla eqondene nephrojekthi kanye nohlelo lwesampula.
