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Teslin® synthetic paper for RFID , okuyingira, wooteeri, obwammemba n’endagamuntu ezikuumibwa. Custom grade, obuwanvu, obunene bw'olupapula n'okusala, nga waliwo samples ez'okukuba, lamination n'okugezesa kaadi OEM mu nsi yonna.
ebikozesebwa ku kaadi
WALLIS
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Wallis egaba Teslin® synthetic paper for RFID card manufacturing , ebiwandiiko ebikwata ku ndagamuntu ebikuumi, kaadi z’okuyingira, kaadi z’ebisumuluzo bya wooteeri, kaadi z’obwammemba, kaadi ez’amagezi n’ebintu bya kaadi eziriko laminated. Ensengeka yaayo eya microporous ewagira okukuba ebitabo mu ngeri ey’amaanyi, okusiba okw’amaanyi okwa laminate n’okusiba okwetooloola chips ne antenna eziteekeddwamu.
Ku bakola kaadi ya B2B, abakola ebiwandiiko ebikakasa, RFID abakyusa ne kkampuni ezikuba ebitabo, ekigero kya Teslin substrate ekituufu kirina okulondebwa okusinziira ku nkola y’okukuba ebitabo, enkola ya laminate, okuzimba kaadi eziwedde n’ebyetaago by’okukozesa enkomerero. Wallis ewagira sayizi z’empapula ezikoleddwa ku mutindo, okulonda obuwanvu, ebisaanyizo bya sampuli, okusala n’okupakinga ebweru w’eggwanga.
Okuzuula ebintu: TESLIN® kabonero ka busuubuzi akawandiisiddwa aka PP G Industries. Abaguzi balina okukakasa oba ekiwandiiko ekijuliziddwa kikwata ku PP G TESLIN® substrate entuufu, ekika ky’ebintu ekigere n’ebiwandiiko by’ebintu ebiwagira. 'Empapula za Teslin' tezirina kukozesebwa nga ennyonyola eya bulijjo ku mpapula ez'obutonde ezitali zikwatagana.
| Parameter | B2B Ebikwata ku Bulagirizi |
|---|---|
| Ekyamaguzi | Ekintu ekikolebwa mu kaadi ey’obutonde (synthetic card substrate) nga kikoleddwa mu microporous polyolefin; genuine PP G TESLIN® grade okukakasibwa mu quotation ne sample ekkiriziddwa. |
| Sayizi y’olupapula olwa Standard | A4 210 × 297mm okuva ku nsengeka y’ebintu eriwo kati; sayizi z’empapula z’okufulumya kaadi ezikoleddwa mu ngeri ey’enjawulo zisobola okwekenneenya. |
| Obugumu | Olupapula lwa Wallis oluliwo kati: 100–300 microns. Obugumu obusembayo obuliwo businziira ku ddaala lya Teslin erongooseddwa, enkola ya sitooka n’obwetaavu bw’okukyusa. |
| Ku ngulu | Ensigo enjeru matte microporous ku ngulu; standard, thermally stabilized, inkjet-coated, digital-print oba security grades ziyinza okulagibwa okusinziira ku pulojekiti. |
| Okukuba ebitabo | Offset, screen, flexographic, gravure, thermal transfer, laser, inkjet n’enkola za digito ezirondeddwa, okusinziira ku ddaala n’ebisaanyizo by’ebyuma. |
| Okukyusakyusa (Lamination). | Ekwatagana ne platen oba roll lamination nga ekwatagana ne laminate ekkiriziddwa, ebbugumu, puleesa, obudde bw’okubeera n’enzirukanya y’okunyogoza. |
| Enzimba ya Kaadi | Layer ya kaadi ewandiikiddwa, substrate wakati oba cushioning layer nga egattibwa wamu ne PVC , PET , PETG , PC , ebibikka, RFID inlays, magnetic stripes oba ebitundu ebirala ebikkirizibwa. |
| Okukola ku mutindo | Ebipimo by’empapula, obuwanvu/grade, okusala, ekkubo ly’okukuba ebitabo, okugatta laminate, okupakinga, ebiwandiiko n’ebyetaago by’okukebera. |
| Ebiwandiiko Ebikwata ku Mutindo | Okuzuula ebintu, ebikwata ku looti, olupapula olulaga ebikwata ku bintu, lipoota y’okukebera n’ebiwandiiko ebirala nga bigoberera obuwanvu bw’okugaba obukakasibwa. |
Teslin substrate si lupapula lwa cellulose olwa bulijjo. Kiba kya layeri emu, microporous, ekijjudde ennyo polyolefin-based synthetic material. Matrix yaayo ey’obutuli ekkiriza yinki, toners, adhesives, coatings ne laminates mu kizimbe okusinga okuzireka ku kifo ekiweweevu kyokka.
Ensengeka eno esobola okulongoosa print anchorage, laminate bonding n’okuziyiza okuggyawo data. Era esobola okuwa cushioning okwetoloola RFID chips, antenna connections ne embedded electronics endala nga embedded card construction nga yinginiya bulungi.
Omulimu RFID guweebwa chip, antenna, inlay layout ne reader protocol erongooseddwa. Teslin ye substrate okukuba oba enzimba eyeetoolodde ebitundu ebyo. RFID okukwatagana n'olwekyo kulina okukakasibwa n'enkola entuufu LF , HF , NFC oba UHF inlay, laminate structure n'enkola y'omusomi.
Amannya g’ebintu nga SP, TS, IJWP, Digital ne Security Grade gannyonnyola ebiruubirirwa by’emirimu eby’enjawulo. Ennyonnyola eya bulijjo '100–300 micron Teslin sheet' temala kukkirizibwa kukola. Ekigero, obuwanvu obw’erinnya, obulagirizi bw’olupapula, enkola y’okukuba ebitabo n’enkola ya laminate birina okuwandiikibwa mu nnyiriri ezikkiriziddwa.
| Ekika ky’Ekibiina | Omulimu ogwa bulijjo Ebirina | okulowoozebwako ku Kaadi-Pulojekiti |
|---|---|---|
| SP Ekibiina kya Standard | Okukozesa okukuba ebitabo n’okukozesa laminated mu ngeri ey’enjawulo. | Kakasa ennamba entuufu eya SP grade, obuwanvu, enkola ya yinki n’okunywerera kwa laminate ng’oyita mu kugezesa okufulumya. |
| TS Etebenkedde mu bbugumu | Enkola ezeetaaga okufuga okunywevu okw’okukendeera kw’ebbugumu. | Kya mugaso nga okuwandiisa okukuba ebitabo, okupapajjo kw’empapula oba okuddiŋŋana ebbugumu kikulu nnyo; okukakasa enzirukanya ya lamination enzijuvu. |
| IJWP Ekika kya Yinki | Okukuba ebifaananyi mu yinki nga kwesigamiziddwa ku langi nga kuliko ekizigo ekirongooseddwa mu kukuba ebitabo ku njuyi bbiri. | Tolowooza nti grade ya standard etasiigiddwako ejja kuwa yinki holdout y’emu, okukala oba okugumira amazzi. |
| Ekigero ky’okukuba ebitabo mu ngeri ya digito | Emikutu egy’enjawulo egy’amawulire egya digito oba enkola z’okukuba ebifaananyi ez’amasannyalaze ezirina ebisaanyizo. | Omutindo gwa printa, ebbugumu ly’omufaliso, okunywerera kwa toner/yinki n’okudduka birina okuba n’ebisaanyizo. |
| Ekibiina ky'ebyokwerinda | Ebiwandiiko ebikuumibwa ebyetaagisa ebikozesebwa mu by’okwerinda ebiteekeddwamu oba ebikwata ku pulogulaamu. | Okubeerawo, olukusa, olujegere lw’okulabirira n’ebiwandiiko bya pulojekiti birina okukakasibwa okwawukana. |
| Olupapula Olusengekeddwa Ezenkanankana | Ebintu ebirala ebiyitibwa microporous oba coated synthetic substrates. | Tekirina kutundibwa nga Teslin entuufu okuggyako nga eweereddwa wansi w’akabonero akatuufu n’eddaala. |
Teslin substrate ewagira tekinologiya ow’enjawulo ow’okukuba ebitabo, naye grade entuufu ekwata ku nkola. Amakolero ga kaadi galina okugezesa density y’ebifaananyi, dot gain, okukala oba okuwonya, toner adhesion, variable-data quality, okuwandiisa n’okulabika post-lamination nga tebannakkiriza bulk material.
| Enkola y’okukuba ebitabo Ebisaanyizo | ebisemba | Obulabe obukulu obw’okukebera |
|---|---|---|
| Okuwandiika kw’amayinja mu ngeri ya Offset | Kakasa omuddirirwa gwa yinki, enkola y’okukala, okubikka yinki yonna n’okuliisa ku lupapula. | Set-off, bbalansi y’okunyiga yinki, density ya langi n’okukyusakyusa oluvannyuma lw’okusiba. |
| Okukuba ebitabo ku ssirini | Okukakasa kemiko ya yinki, akatimba, obuwanvu bw’okutereka n’embeera y’okuwonya. | Okuziyiza, layers za yinki ezikutuka n’okusiba laminate ku kubikka yinki enzito. |
| Laser / Toner Enkalu | Kozesa ddaala eririna ebisaanyizo ku bbugumu lyennyini erya printer ne fusing-temperature range. | Curl, shrinkage, toner offset, okuzibikira n’okunyweza toner. |
| Yinki Ekoleddwa mu langi | Laga ekigero kya yinki ekituufu nga IJWP we kyetaagisa. | Okuvaamu omusaayi, okujjula ennyo, obudde bw’okukala, langi n’okuziyiza amazzi. |
| HP Indigo / Ekitongole ky'amawulire ekya Digital | Kakasa ekigezo ekikkirizibwa n’engeri entuufu ey’okuwandiika. | Okukwatagana kwa bulangiti, eddirisa ly’okukola, okutambuza yinki n’okunywerera. |
| Okutambuza ebbugumu n’ebiwandiiko ebikyukakyuka | Gezesa ekika kya ribiini, amaanyi g’okukuba, ekigero kya bbaakoodi n’okuziyiza okunyiga. | Ennyonyola embi ey’empenda, enjawulo entono oba okwonooneka kwa data mu kiseera kya lamination. |
Etteeka ly'ebisaanyizo: 'Offset / screen / digital compatible' tekitegeeza nti grade emu esaanira buli printer mu ngeri ey'otoma. Okukkiriza okusembayo kulina okukozesa printer yennyini ey’omuguzi, yinki oba toner, okubikka artwork n’obwangu bw’okufulumya.
Ekiwandiiko ekya bulijjo RFID oba ekikuumibwa kiyinza okugatta layeri za Teslin ezikubiddwa n’ekintu ekiyingiziddwa ekitaliiko kukwatagana ne firimu ez’obukuumi ez’ebweru. Enzimba esembayo erina okukolebwa yinginiya ng’enkola enzijuvu okusinga okwekenneenya empapula ezikoleddwa mu ngeri ey’ekikugu yokka.
| Layer | Typical Function | Ekifo eky'okukkiriza |
|---|---|---|
| Okubikka mu maaso oba Laminate | Ekuuma okukuba ebitabo era eyinza okubeera n'ebintu eby'obukuumi ebya holographic, UV oba ku ngulu. | Obutangaavu, okukwatagana, okunyiga, okuzingulula n’okukwatagana kw’omuntu. |
| Emmanju Ekubiddwa Teslin Layer | Atambuza ebifaananyi, ebiwandiiko, ebifaananyi, bbaakoodi, QR code n’ebiwandiiko by’obukuumi. | Ekigero ky’okukuba ebitabo, okwewandiisa, omutindo gw’ebifaananyi n’okunyweza laminate. |
| RFID Inlay / Chip ne Antenna | Ewa omulimu gw’ebyuma ebitaliiko kukwatagana. | Frequency, protocol, ekifo kya antenna, obuwanvu bwa chip, read range ne encoding. |
| Emabega Ekubiddwa Teslin Layer | Ebalansiza enzimba era etambuza ebifaananyi oba data ezidda emabega. | Empeke/obulagirizi, symmetry y’obuwanvu n’okukwatagana kw’okukuba ebitabo-lamination. |
| Okubikka emabega oba Laminate | Ewa obukuumi n'omutindo gwa kaadi ogusembayo ku ngulu. | Amaanyi g’okusekula, okuziyiza okukunya n’okukwatagana kwa magnetic stripe/signature panel. |
Laminate erina okukwatagana n’omutindo gwa Teslin, enkola y’okukuba ebitabo n’obuwanvu bwa kaadi ewedde. Amakolero ga kaadi galina okukakasa kemiko ya laminate, obuwanvu, okusaanuuka oba okukola range n’omutindo gw’okusekula ogusembayo. Enkola y’emu ey’okukola lamination tesaana kulowoozebwa ku PVC , PET , PETG ne PC firimu ezibikka.
Ebbugumu erisukkiridde oba obudde bw’okubeera kiyinza okuleeta okukendeera, okuzingulula, okutambula kw’ekifaananyi oba RFID okunyigirizibwa kw’ekitundu. Ebbugumu oba puleesa obutamala kiyinza okuvaako okukwatagana okunafu. Wandiika ebbugumu lya platen oba roll, puleesa, obudde bw’okubeera, obudde bw’okunyogoza n’okuzimba stack mu kiseera ky’okukkiriza sampuli.
Oluvannyuma lw’okusiba, kebera obuwanvu bwa kaadi, obulungi bw’empenda, omutindo gw’enkoona, obuwanvu, obuziyiza okunyiga n’okukola kw’ebyuma. RFID ebigezo by’okusoma birina okuddibwamu oluvannyuma lw’okusala lamination n’okusala die kubanga okulongoosa antenna n’okuyungibwa kwa chip bisobola okukosebwa ensengeka ya kaadi esembayo.
Teslin substrate ekozesebwa nga okuwangaala kw’okukuba ebitabo, okusiba laminate n’okukuuma data oba ebyuma ebiteekeddwamu bikulu. Ekigero ky’ebintu ekituufu n’okuzimba kaadi mu bujjuvu birina okukkirizibwa ku buli nkozesa ey’enkomerero.
RFID kaadi ezifuga okuyingira n'ebiwandiiko by'abakozi
NFC kaadi z’obwammemba, obwesigwa n’okuweereza abagenyi
Kaadi z’ebisumuluzo bya wooteeri zaali zikwatagana ne chip eya lock-system eragiddwa
Okukuuma endagamuntu, olukusa n’ebiwandiiko bya gavumenti
Kaadi za yinsuwa, etterekero, ebyobulamu n’ebyenjigiriza
Event passes, key tags ne badge eziwangaala eziriko laminated
Smart cards eziriko chips, antennas, magnetic stripes oba bbaakoodi
Enteekateeka z’okusasula ne gavumenti: okusaanira kaadi za bbanka, endagamuntu entongole oba pulogulaamu z’obukuumi ezifugibwa kulina okuteekebwawo okuyita mu biwandiiko eby’ekikugu eby’oyo abigaba, ebyetaago by’obukuumi n’okuweebwa satifikeeti ezeetaagisa. Okulonda ebintu kwokka tekuteekawo kugoberera.
| Ekintu eky'okukebera | By'olina okukakasa |
|---|---|
| Endagamuntu y’Ebintu | Brand, product grade, lot number n’ebiwandiiko ebiwagira specification. |
| Obugumu n’obuzito bwa Basis | Omuwendo ogw’erinnya, okugumiikiriza okukkaanyiziddwaako n’enkola y’okupima. |
| Ebipimo by’Empapula | Obuwanvu, obugazi, squareness, embeera y’empenda n’obulagirizi bw’okusala. |
| Endabika | Obweru, okubeera ku ngulu, enfuufu, obubonero, enviiri n’obucaafu. |
| Okukuba ebitabo | Densite ya langi, okusalawo kw’ebifaananyi, okusoma kwa bbaakoodi, okunywerera kwa toner/yinki n’okukala. |
| Okukyusakyusa (Lamination). | Amaanyi g’okusekula, ebiwujjo, okufuuka ffeeza, okuzingulula, okukendeera n’okukyusakyusa okulaba. |
| RFID Enkola y'emirimu | Chip response, read range, encoding, okukakasa UID/data n’amakungula oluvannyuma lw’okusiba. |
| Kaadi Emaliriziddwa | Obugumu, obupapajjo, okunyiga, omutindo gw’empenda, okunyiga n’okugezesebwa kw’obutonde bw’ensi ebyetaagisa omuguzi. |
Waayo data ya pulojekiti: enkozesa ya kaadi, sayizi ewedde, ensengeka ya layeri, model ya printer, laminate ne RFID inlay.
Kakasa ebintu: embeera ya Teslin brand entuufu, grade, obuwanvu, sheet size n’ebiwandiiko ebyetaagisa.
Dukanya okugezesa okukuba ebitabo: okwekenneenya omutindo gw’ebifaananyi, data ekyukakyuka, bbaakoodi n’okunywerera kwa yinki oba toner.
Run lamination trials: wandiika enkola y’ebbugumu, puleesa, okubeera n’okunyogoza mu bujjuvu.
Gezesa kaadi eziwedde: kebera peel, flex, die cutting, endabika ne RFID performance.
Kkiriza Sampuli ya Zaabu: kozesa sampuli eriko omukono n’ebiragiro ebikkaanyiziddwaako ng’ekijuliziddwa ku kukola mu bungi.
| Amawulire Ageetaagisa | Ebyokulabirako |
|---|---|
| Ebintu Ebyetaagisa | G TESLIN® entuufu PP oba ekyenkanankana nayo ekikkirizibwa; SP, TS, IJWP, Ekigero kya Digital oba eky’ebyokwerinda. |
| Obugumu n’obunene | Nominal micron/mil, A4 oba custom sheet dimensions, okugumiikiriza okusala n’obungi. |
| Ebikozesebwa mu Kukuba Ebitabo | Offset press, screen line, laser printer, inkjet model, HP Indigo oba ekyuma ekirala ekya digito. |
| Okuzimba Kaadi | Laminate y’omu maaso/emabega, layers za Teslin, RFID inlay, magnetic stripe, signature panel n’obugumu obusembayo. |
| RFID Enkola | Chip, frequency, protocol, layout ya antenna, model y’omusomi, encoding n’obuwanvu bw’okusoma ekigendererwa. |
| Okugezesa n’Ebiwandiiko | TDS, lipoota y’okukebera, obungi bwa sampuli, okulangirira okugoberera amateeka n’okulondoola looti. |
| Ebikwata ku by'obusuubuzi | Omuwendo gw’okugezesa, obwetaavu buli mwaka, ekifo we batuusa, okupakinga ne Incoterm. |
Ebipande birina okukuumibwa okuva ku nfuufu, obunnyogovu, okwonooneka ku mbiriizi, okubeebalama n’ebbugumu eritafugibwa nga bitereka n’okubitambuza. Okupakinga kuyinza okuli okuzinga munda okusibiddwa, bbaasa enkalu, okukuuma paleeti, ebiwandiiko ebikoleddwa ku mutindo n’okulaga looti okusinziira ku kiragiro kye bakkiriziganyizzaako.
Ebintu bikuume nga bipapajjo mu ngeri gye byasooka okupakiddwa era bireke okumanyiira ekisenge omukubirwa ebitabo nga tonnaggulawo. Embeera ezenjawulo ez’okutereka n’obulagirizi bw’obulamu bw’okutereka zirina okugoberera ebiwandiiko bya ddaala ebikakasibwa n’ebiragiro by’omugabi.
Wallis ewagira abakola kaadi n’abakyusa n’okulonda ebintu, okusala empapula ku mutindo, okugezesa sampuli n’okukwasaganya ekifo kimu ku mpapula z’omusingi gwa kaadi, ebibikka, RFID inlays n’ensengekera za kaadi eziwedde.
Okukubaganya ebirowoozo okw'ekikugu nga kwesigamiziddwa ku nkola ya printer, laminate ne RFID yennyini
Custom sheet size, okulonda obuwanvu, okusala n'okupakinga obuyambi
Okukkirizibwa kwa Sampuli ne Sampuli ya Zaabu nga tebannaba kukola mu bungi
Okukwasaganya ebintu ebiteekebwa mu kaadi, ebibikka, ebiyingizibwa n’ebintu ebikwatagana ne kaadi
Okupakinga ebweru w’eggwanga, okussaako obubonero ku by’okusindika n’okuwagira ebiwandiiko bya pulojekiti
Nedda TESLIN® ye brand ya PP G ewandiisiddwa ku microporous, polyolefin-based synthetic substrate eyeetongodde. Empapula endala ezikoleddwa mu ngeri ey’ekikugu ziyinza okuba n’obutonde obw’enjawulo, enneeyisa y’okukuba ebitabo n’enkola y’okukola lamination.
Teslin substrate ekolebwa PP G. Wallis asobola okukola nga card-material supplier oba converter. Ekiwandiiko ekijuliziddwa kirina okulaga bulungi ekika, ekigero, obuwanvu n’ebiwandiiko ebiwagira ebizingirwa mu bunene bw’okugaba.
Eky’okuddamu kisinziira ku printer, laminate, thermal cycle, ensengeka ya card n’ebyetaago by’obukuumi. Ebigezo bya SP, TS, IJWP, Digital ne Security bikola ebigendererwa eby’enjawulo, kale ebisaanyizo bya sampuli byetaagibwa.
Yee, naye ekigezo ekituufu kirina okulondebwa. Okukozesa yinki eyesigamiziddwa ku langi kuyinza okwetaagisa ekigero ekirongooseddwa mu kukuba nga IJWP. Okugezesebwa kwa printer, yinki, okukala n’okuziyiza amazzi kulina okuggwa nga tebannaba kukola.
Grade ezisaanira ziyinza okuba nga zisobola okukubibwa mu layisi, naye omutindo gwa printa omutuufu, ebbugumu ly’okufuyira, obuwanvu bw’olupapula, okuzingulula n’okunyweza toner birina okugezesebwa. Ebigambo ebikwata ku kukwatagana mu ngeri ey’enjawulo (generic compatibility claims) tebimala kukkirizibwa kukola.
Nedda Teslin ye substrate ya kaadi eyinza okukubibwa oba ey’enzimba. Omulimu gwa RFID guva mu chip ne antenna inlay ezenjawulo ezirina okulondebwa ku frequency ezeetaagisa, protocol ne reader system.
Ensengekera yaayo eya microporous esobola okuwa cushioning mu laminated credential ekoleddwa obulungi. Obukuumi bukyasinziira ku buwanvu bwa chip, ensengeka ya antenna, okulonda laminate, puleesa, ebbugumu n’okugezesa kaadi ewedde.
Nedda Kiyinza okudda mu kifo oba okujjuliza PVC mu bizimbe ebimu, naye obugumu bwa kaadi, obuwanvu, enkola y’okukuba ebitabo, kemiko wa laminate, okukwatibwa obutonde n’ebyetaago by’amateeka birina okwekenneenyezebwa ku buli pulojekiti.
Ekintu ekikolebwa mu butonde kigumira amazzi n’obunnyogovu, naye obuwangaazi bwa kaadi esembayo era businziira ku kukuba ebitabo, okusiba laminate, ku mbiriizi ezisaliddwa, ebisiiga n’ebitundu ebiteekeddwamu.
Okusala ebipande ku mutindo n’okulonda obuwanvu bisobola okwekenneenya. Okubeerawo kisinziira ku ddaala lya Teslin erongooseddwa, enkola ya master-sheet, obungi bwa order n’ebyetaago by’okusala.
Abaguzi balina okugezesa omutindo gw’okukuba ebitabo, okunywerera kwa toner oba yinki, okusekula kwa lamination, shrinkage, curl, okusala die, finished-card flex ne RFID okusoma omutindo nga bakozesa ebyuma ebituufu eby’okufulumya.
Waayo ekibinja ekyetaagisa n’ekigero, obuwanvu, sayizi y’olupapula, omutindo gwa printa, ensengeka ya laminate, RFID chip ne antenna, obungi, ebyetaago by’ebiwandiiko, okupakinga n’ekifo w’otuusa.
