Inlay / prelam
Wallis
| 2 * 5: | |
|---|---|
| 3 * 8: | |
| 3 * 7: | |
| Customizable: | |
| Chip: | |
| Okubeerawo: | |
| Omuwendo: | |
Wallis egaba 125kHz LF , 13.56MHz HF ne LF + HF dual-frequency RFID PVC prelam inlay sheets ku kaadi ezifuga okuyingira, endagamuntu z’abakozi, kaadi z’ebisumuluzo bya wooteeri, kaadi z’obwammemba, kaadi za kampusi, ebiwandiiko ebikakasa entambula n’okutambuza enkola pulojekiti. Buli lupapula lugatta chip, tuned antenna ne plastic support layers ezirondeddwa, nga zeetegefu okukola final card lamination, okukuba ebitabo, punching n’okukola personalization.
Ebiwandiiko ebikwata ku nsengeka eya bulijjo mulimu 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ne 4 × 10. Sayizi z’empapula ez’enjawulo, ebifo bya kaadi, ebifo bya chip, geometry za antenna, ensengekera z’ebintu n’obugumu bisobola okukolebwa ku pulati z’omuguzi ezikola lamination, empapula z’okukuba ebitabo n’ebikozesebwa mu kukuba ebikonde.
Frequency yokka tekakasa kukwatagana. Ebintu eby’ekika kya TK4100, EM4200 ne ATA5577 ebya frequency entono birina enneeyisa ey’enjawulo ey’okusoma yokka oba okusoma/okuwandiika, okuwandiika enkoodi n’okusengeka. HF chips ziyinza okukozesa ISO /IEC 14443 Ekika A, ISO /IEC 14443 Ekika B, ISO /IEC 15693 oba NFC Ebikwata ku Forum. Sofutiweya w’omusomi omutuufu, omuze gwa chip, protocol, memory, security ne application birina okukakasibwa nga tebannaba kukola dizayini ya antenna n’okukola mu bungi.
| Ekika ky’Ebintu | LF , HF oba dual-frequency RFID prelaminated inlay sheet okukola kaadi z'obuveera |
| Enkola z’Okulonda Emirundi | 125kHz LF , 13.56MHz HF , LF + HF ensengekera za tekinologiya omungi ez’omugatte n’ezikwata ku pulojekiti |
| Ensengeka z’omutindo | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 n’ensengeka za kaadi ez’enjawulo |
| Original LF Ekiwandiiko ekijuliziddwa ku buwanvu | Nga 0.50–0.60mm ku bizimbe LF ebirondeddwa; obuwanvu obutuufu businziira ku chip, antenna, material ne final card stack |
| Ebintu Ebiyinza Okulonda | Enjeru oba entangaavu PVC ; PETG n’ebizimbe ebikwatagana ne polycarbonate nga birina ebisaanyizo eby’enjawulo |
| Enkola za Antenna | Embedded copper-wire LF / HF coils, etched aluminiyamu HF antennas ne dizayini za antenna bbiri eza bulijjo |
| Obuwagizi bwa B2B | Okulonda chip, yinginiya wa antenna, ensengeka ya CAD, samples, okugezesa lamination, okugezesa RF, encoding, QC reports n’okutunda ebweru w’eggwanga |
Saba RFID prelam Sampuli n'okujuliza
RFID prelam inlay ye lupapula olukola munda olukozesebwa okukola kaadi ya pulasitiika etaliiko kukwatagana. Antenna, integrated circuit n’ebiyungo by’amasannyalaze biteekebwa wakati wa layers za pulasitiika nga omuguzi tannayongerako printed core sheets ne transparent Firimu ya overlay s. Stack emaliriziddwa ekolebwako laminated, cooled, punched ne personalized ne zifuuka cards eziwedde.
Prelam mu budde obutuufu tetambuza bifaananyi bya kasitoma. Okukuba ebitabo kukozesebwa okwawula empapula z'omusingi ogw'omu maaso n'emabega, okuyamba okukuuma chip ne antenna ate nga kisobozesa langi efugibwa, Firimu ya overlay n'okufulumya eby'obukuumi.
Kaadi ya frequency bbiri erimu LF ne HF circuit ezenjawulo. Chips zombi tezifuuka protocol emu. Buli frequency erina okukolebwa, okulongoosebwa, okusomebwa era —we wawagirwa —okuwandiikibwa okuyita mu nkola y’omusomi etuukirawo.
Layers ezikubiddwa, ebifaananyi ebikubiddwa ebyuma, emisono gya magineeti, ebisiiga, obuwanvu bwa kaadi, ebyuma ebiriraanyewo ne geometry y’omusomi bisobola okukyusa omulimu gwa RF. N’olwekyo ebisaanyizo birina okubeeramu kaadi eriko laminated mu bujjuvu ne punched, so si bare prelam yokka.
125kHz LF Enzimba ya Chip ne Coil
Olupapula lwa Kaadi nnyingi ez’okukola Lamination mu makolero
| Inlay Ekika ky’okuzimba | Enkozesa | ya B2B eya bulijjo |
|---|---|---|
| 125kHz LF prelam | Chip emu LF ne koyilo emu eya firikwensi entono eya tuned | Enkola z’okuyingira okumpi ez’edda, okusimba mmotoka, obwammemba n’okuzuula omuntu |
| 13.56MHz HF prelam | Chip emu HF ne antenna emu ISO / NFC -ekwatagana eyalondeddwa olw'okukozesa | Okuyingira okunywevu, entambula, kampusi, wooteeri, NFC ne kaadi z’okusaba okungi |
| LF + HF Emirundi ebiri prelam | Yawula LF ne HF chips nga zirina coils ezenjawulo munda mu mubiri gwa kaadi gumu | Okusenguka okuva ku basomi ba 125kHz ab'edda okudda ku nkola ya smart-card ey'omulembe HF |
| LF + UHF oba HF + UHF | Chips eziwera ne antenna ezikwata ku frequency mu kizimbe kimu | Okuyingira nga kwogasse n’okulondoola mmotoka, eby’obugagga oba abakozi ebigenda ewala |
| Okukwatagana + Hybrid etaliiko kukwatagana | RFID prelam nga kwogasse n'ekisenge ky'okukwatagana-module ekisibiddwa oba enzimba y'enkolagana bbiri | Okukuuma densite, amasimu, bbanka oba pulojekiti eziweebwa ebiwandiiko ebifugibwa oluvannyuma lw’okufuna ebisaanyizo |
Ebibiina bisobola okufulumya ekiwandiiko ekimu ekikolagana n'abasomi LF abakadde n'abasomi abapya HF nga ebikozesebwa birongooseddwa. Database y’okufuga okuyingira ekyalina okukola maapu n’okuddukanya ebimanyisa oba enkola okuva mu tekinologiya zombi.
Okwongerako chip eyookubiri kyongera ku buwanvu bw’ekitundu, okuzimba antenna, okutambula kw’ebintu n’obuzibu bw’okugezesa. Dizayini ya frequency emu tesaana kukyusibwa ku dual frequency nga tewali layout mpya, lamination trial n’ebisaanyizo bya RF.
| LF Chip Option | Soma / Okuwandiika Okuteeka mu kifo | Enkozesa eya bulijjo | B2B Buying Note |
|---|---|---|---|
| TK4100-Ekika kya | Ensengeka y'okumpi ey'okusoma kwokka ey'omusika eya bulijjo; omugabi omutuufu n'enkodi birina okukakasibwa | Enkola ezisookerwako ez’okufuga okuyingira n’okuzuula | Okuwa sampuli y’omusomi n’enkola y’ebifulumizibwa eyeetaagisa; tokitwala nti ebintu byonna 'TK4100' bifaanagana |
| EM4200 | Factory-programmed low-frequency okusoma yokka okuzuula IC | Okufuga okutuuka, okuddukanya kasasiro n’enkola ezirondeddwa ez’okuzuula | Kakasa obuwanvu bwa koodi, modulation, mask option n'okukwatagana kw'omusomi nga tonnafulumya |
| ATA5577 / T5577-Ekika | Programmable LF okusoma/okuwandiika transponder nga erina configurable modulation ne coding | Okuzuula, okusenguka, okugezesa n'ensengeka ez'edda ezikwatagana | Lambulula ensengeka y’ebiziyiza, ensengeka ya data, ekigambo ky’okuyingira, ebitundu by’okusiba n’okukakasa pulogulaamu |
| EM4305 / Ebirala R/W LF | Soma/wandiika LF ebyokulonda ebiriwo ku nsengeka ezikwata ku nkola | Okufuna, okuzuula amakolero n’ebiwandiiko ebikakasa ebiyinza okuteekebwa mu pulogulaamu | Kakasa embeera ya IC entuufu, memory, obukuumi n'obuyambi bwa programmer |
Ebiwandiiko eby’ekika kya EM4200 mu budde obutuufu biweereza ekimanyisa ekikoleddwa mu kkolero, ate ebyuma eby’ekika kya ATA5577 bisobola okutegekebwa n’okuwandiikibwa omukugu mu pulogulaamu akwatagana. Ekiwandiiko ekijuliziddwa kirina okulaga oba omuguzi yeetaaga ennamba etakyukakyuka, enkodi ya kasitoma oba ekifo ekitaliimu programmable.
Emitendera gino gikwatagana n’ensengeka za data ezizuula ebisolo n’ensengeka z’empewo-interface. Tezirina kusiigibwa nga blanket claim ku buli TK4100, EM4200 oba T5577 access card. Kakasa chip entuufu, ensengeka n'enkola y'omusomi.
| HF Chip Family | Protocol Obulagirizi Okulonda | enkola eya bulijjo | Note |
|---|---|---|---|
| MIFARE Classic / Ekwatagana ne Legacy 1K | ISO /IEC 14443 Ekika A ensengekera y'obutonde ey'edda | Yateekebwawo enkola z’okuyingira, okutunda tikiti n’enkola enkadde eziggaddwa | Kozesa awali ebikozesebwa ebiriwo we byetaaga; okwekenneenya ebirala eby’omulembe ebikuumiddwa ku nkola empya |
| MIFARE Ekitangaala kya Ultralight | ISO /IEC 14443 Ekika A embeera | Tikiti ezikozesebwa ekitono, emikolo ne pulogulaamu ennyangu ezitaliiko kukwatagana | Kakasa ebyetaago by’okujjukira, obutonde, ekigambo ky’okuyingira n’obulamu |
| NTAG 213 / 215 / 216. Enkola y’okukola emirimu egy’enjawulo | NFC Forum Ekika 2 Tag ne ISO /IEC 14443 Ekika A | NFC kaadi za bizinensi, enkolagana z’essimu, okukakasa n’okukwatagana mu dijitwali | Londa okusinziira ku jjukira lya NDEF, obuwanvu bwa URL, ekigambo ky'okuyingira n'ebyetaago by'obusookerwako |
| MIFARE DESFire EV3 | ISO /IEC 14443 Ekika A nga kiriko enkola ez'obukuumi ez'omutendera ogwa waggulu | Okuyingira mu ngeri ey’obukuumi, kampusi, entambula, densite n’okusaba okungi | Yeetaaga okukola dizayini y’enkola, okuddukanya ebisumuluzo, okulongoosa n’okugatta omusomi/software |
| ICODE / ISO 15693 Amaka | ISO /IEC 15693 ne NFC Okuteeka mu kifo eky'ekika kya Forum 5 | Etterekero, eby’obugagga, vicinity-card ne longer-coupling-distance applications | Enkola y'omusomi n'obunene bwa antenna byawukana ku ISO /IEC 14443 Enkola ez'ekika kya A |
Omusomi asobola okukola ku 13.56MHz era nga akyawagira omutindo oba ebiragiro ebirondeddwa byokka. Laga Ekika A, Ekika B, ISO 15693 oba NFC Obuwagizi bwa Forum nga kwogasse n'ekyokulabirako kya chip ekituufu ne pulogulaamu y'okukozesa.
Okuwa chip ya DESFire-class tekitondawo kiwandiiko kya bukuumi. Ebisumuluzo, enkola, eddembe ly’okuyingira, okukyusakyusa, enkola z’abafulumya n’okukakasa eby’emabega birina okukolebwa yinginiya okwawukana.
LF Okumpi Inlay Ekyokulonda
Okugatta Chip ne Antenna eza Custom
| Factor | Ekyetaagisa eky’emirundi ebiri |
|---|---|
| Okwawula Antenna | Teeka LF ne HF coils okukendeeza ku physical overlap, pressure concentration n’okuyungibwa okutali kwa kigendererwa |
| Ekifo kya Chip | Kuuma chips zombi nga teziriimu layini z’okukuba, ebituli, ebituli bya contact-module ne zone za puleesa enkulu |
| Obugumu bw’Ekitundu | Okuliyirira IC bbiri, coil crossovers ne connection points nga tokola bumps ezirabika |
| LF Okulongoosa | Gyaakanya LF coil ne chip capacitance ne frequency y'omusomi, coding n'omutindo gw'okusoma ogugendereddwa |
| HF Okulongoosa | Tune HF antenna ne chip esembayo, card stack, layers ezikubiddwa n'omusomi ogugendereddwa |
| Okukola Maapu y’Enkola | Nnyonnyola engeri LF ekimanyisa ne HF UID/enkola gye bikwataganamu ne likodi emu ey'omuntu alina kaadi |
| Okukakasa Omukozesa Enkomerero | Gezesa kaadi y’emu ewedde ku buli musika eyeetaagisa n’omulembe gw’omusomi omupya |
Omusomi wa frequency bbiri ayinza okuwagira ensengeka za LF zokka ezirondeddwa n'enkola za HF ezirondeddwa. Gabira ekika ky’omusomi, ekika, firmware n’ebifulumizibwa ebisuubirwa olwo kaadi esobole okugezesebwa okusinziira ku nkola yennyini.
LF ne HF amabanga g'okusoma gaawukana era gasinziira ku maanyi g'omusomi, geometry ya antenna, orientation ya card, coding, final card stack n'obutonde. Kozesa amabanga ag’enjawulo ag’okuyita/okulemererwa n’ebikozesebwa mu kugezesa ku buli nkolagana.
| Parameter | Original / Available Option | B2B Control Point |
|---|---|---|
| 2 × 5 nga bwe kiri | A4 ekijuliziddwa 210 × 297mm | Kakasa eddoboozi lya kaadi, ku mabbali g’empenda, okutunula kwa antenna n’ebituli by’okuwandiisa |
| 3 × 7 nga bwe kiri | Nga 295 × 460mm | Match printed core, lamination plate n’ekintu ekikuba ebikonde |
| 3 × 8 nga bwe kiri | Nga 295 × 485mm | Lambulula okuwandiisa ebifaananyi by’ebifaananyi n’obulagirizi bw’okussaako ennamba za kaadi |
| 4 × 8 / 5 × 5 / 4 × 10 nga bwe kiri | Ensengeka z’amakolero ezifulumya ebintu eby’amaanyi | Control sheet flatness, antenna spacing n’okuyingira mu kugezesa amasannyalaze |
| Ensengeka ya Custom | Kaadi ezikoleddwa ku mutindo, ebisumuluzo, mini kaadi n’ebikozesebwa eby’obwannannyini | Okuwa CAD, outline ewedde, okusala clearance ne chip/antenna coordinates |
| LF Ekiwandiiko ekijuliziddwa ku buwanvu | Nga 0.50–0.60mm okuva ku lupapula olwasooka | Kakasa average, local chip-zone gauge n’okubalirira kwa kaadi ewedde |
| Obugumu bwa Dual-Frequency | Project-specific era nga mu budde obutuufu ekwatibwako chips bbiri n’enkola za antenna bbiri | Kiriza maapu y’obuwanvu, obuwanvu bwa kaadi n’okuliyirira puleesa y’ekitundu |
Kaadi ya CR80/ID-1 eya bulijjo ekolebwa okwetoloola obuwanvu obw’erinnya okumpi ne mm 0.76, naye ekisembayo kisinziira ku misingi egyawandiikibwa, Firimu ya overlay s, okutambula kw’okusiiga, ebitundu bya chip n’okunyigirizibwa kwa lamination. Pima kaadi ewedde nga eriko embeera.
'3 × 8' tetegeeza buli kipimo kya lupapula, akabonero k'okwewandiisa oba eddoboozi lya kaadi. Ekifaananyi ekisembayo kisaana okuteekebwako omukono nga tebannaba kukola antenna kubanga ensobi mu kukuba ebikonde n’ekifo kya chip ziyinza okusaanyaawo amakungula g’amasannyalaze.
Ensengeka y’olupapula olw’ennono n’okuwandiisa
HF Enkola y'ensengeka ya Chip ne Antenna
| gwa layeri | Okufuga | ekisumuluzo |
|---|---|---|
| Mu maaso Firimu ya overlay | Ekuuma okukuba ebitabo n’okuwa gloss, matte, frosted oba security finish | Gauge, bonding, abrasion ne personalization okukwatagana |
| Omusingi ogukubiddwa mu maaso | Atambuza ebifaananyi, ebiwandiiko, obubonero n’ebiwandiiko by’obukuumi | Okwewandiisa, okuwonya yinki, okukendeera n’ebyuma-print clear zones |
| RFID Prelam Inlay | Mulimu chips emu oba eziwera, antenna n’ebiyungo by’amasannyalaze | RF tuning, chip position, obuwanvu, amakungula g’amasannyalaze n’okukwatagana |
| Back Printed Core | Etebenkeza emmanju era etambuza ebifaananyi eby’emabega | Layer balance, stripe position n’okubikka okukuba ebitabo |
| Okudda emabega Firimu ya overlay | Ekuuma kaadi era eyinza okubeeramu magnetic stripe oba signature panel | Bonding, flatness, encoding n’okungulu okusembayo |
Ebitundu ebinene eby’ebyuma okumpi ne HF antenna biyinza okukendeeza ku kuyungibwa oba okukyuka okuwuuma. Muteekemu ebitundu byonna eby’okukuba ebyuma, holographic foil n’ebitundu bya magineeti mu kugezesebwa kwa kaadi okusembayo okwa RF.
Gaagi ezifaanagana mu maaso n’emabega, obulagirizi bw’ebintu obufugibwa n’okubikka ebitabo mu ngeri ey’enjawulo bisobola okukendeeza ku kuzimba. Ensengekera za firikwensi bbiri zeetaaga okufaayo okw’enjawulo kubanga ebifo bya chip ne antenna biyinza okuba nga tebikwatagana.
Kiriza okukuba ekifaananyi ky’omutambi: Wandiika buli Firimu ya overlay , omusingi ogukubiddwa, inlay, adhesive, stripe ne security layer.
Ebikozesebwa bitereeze: Teekateeka ebipande mu mbeera ennyonjo ey’okufulumya era bikuume okuva ku nfuufu n’obunnyogovu.
Kakasa orientation: Gkwataganya eddoboozi lya kaadi, ebifo bya chip, zone za antenna, artwork n’obubonero bw’okukuba ebikonde.
Okukulaakulanya enzirukanya y’ebbugumu: Teekawo ebbugumu, puleesa, okubeera, okufulumya ebintu n’okunyogoza olw’okuzimba okutuufu.
Kuuma zoni za chip: Weewale obutundutundu obukalu, puleesa y’ekitundu esukkiridde n’obulema bwa pulati ku chip zonna.
Okunyogoza wansi wa puleesa efugibwa: Okunyogoza kukosa obupapajjo, okunyigirizibwa kwa chip, okukwatagana n’obutakyukakyuka bwa RF.
Gezesa ekipande ekikoleddwa mu laminated: Kebera obuwanvu, ekifo, endabika n’enkolagana zombi eza RF nga tonnaba kukuba kikonde.
Kakasa kaadi eziwedde: Pun, personalize, encode era okugezesa LF ne HF omulimu ku nkola ezigendereddwa.
| Obulabe obwa bulijjo | Obuyinza okuvaako | Obulagirizi obutereeza |
|---|---|---|
| Okulemererwa kwa Chip | Ebbugumu erisukkiridde, puleesa, ESD oba okuyungibwa kwa chip okunafu | Weekenneenye ekkomo ku chip, puleesa y’enkola, okufuga ESD n’omutindo gw’okuyunga |
| Open Coil | Kondakita amenyese, ekiyungo ekibi, okusala okwonooneka oba okutambula kw’ebintu okuyitiridde | Kebera okugenda mu maaso, ekkubo lya kondakita, amaanyi g’ekiyungo n’okufuluma kw’ekikonde |
| Enafu LF oba HF Ebanga | Detuning, obutakwatagana bw’omusomi, okukyusa card-stack oba okutaataaganyizibwa kw’ekyuma | Ddamu okulongoosa era ogezese buli interface ne card emaliriziddwa n'omusomi target |
| Chip Bump erabika | Okuliyirira gaagi okutamala oba obuwanvu bw’ekitundu obuyitiridde | Okulongoosa ebituli, ebipima layeri, okusiba emitto n’okugabanya puleesa |
| Okuwugulaza (Delamination). | Obujama, ebintu ebitakwatagana, ebbugumu eritono oba okunyogoga obubi | Weekenneenye okukwatagana kw’ebintu, okuyonja, enzirukanya y’ebbugumu n’amaanyi g’ebikuta |
| Olupapula lwa Kaadi | Stack etali ya bbalansi, okubuguma ennyo, puleesa etali ya bwenkanya oba okunyogoga amangu | Balance layers era optimize okubuguma, plate flatness n'okunyogoza |
| Ekintu | Ekisemba Okufuga B2B |
|---|---|
| Endagamuntu ya Chip | Kakasa omukozi, ennamba y’ekitundu entuufu, frequency, protocol, memory ne lot traceability |
| LF Okugezesebwa kw'emirimu | Soma ID etegeerekese oba bulooka ezitegekeddwa n'ensengeka y'omusomi n'okufulumya LF ekkaanyiziddwaako |
| HF Okugezesebwa kw'emirimu | Soma UID n'ebiragiro ebirondeddwa, memory oba application okusinziira ku chip entuufu HF |
| Okugenda mu maaso kwa Antenna | Zuula ebiyungo ebiggule, ebimpi, ebiyungo ebinafu n’obulema bwa kondakita ku koyilo zombi |
| Enkola ya RF | Kozesa ebikozesebwa eby'enjawulo LF ne HF eby'okugezesa, ebikozesebwa mu kusoma, okulungamya n'amabanga g'okuyita |
| Ekifo kya Chip ne Antenna | Kebera ku CAD, card outline, punching clearance, ebifo n’ebituli bya modulo |
| Ebipimo by’Empapula | Obuwanvu, obugazi, squareness, card pitch, ebituli by’okuwandiisa n’omutindo gw’empenda |
| Obugumu n’Obupapajjo | Obugumu bwa wakati, zoni za chip ez’omu kitundu, obutaasa, curl n’enjawulo okuva ku nsonga |
| Okugezesebwa kwa Kaadi Okumaliriziddwa | LF / HF enkola, ebipimo, okubeebalama, okukyusakyusa, ebbugumu, obunnyogovu, okusekula n'okukwatagana kw'omusomi |
| Okulondoola | Ebitundu bya chip, dizayini ya antenna, PVC lot, ennamba y’olupapula, pulogulaamu y’okugezesa, ebyava mu kukebera n’ebiwandiiko by’okupakinga |
Okusoma kw’amasannyalaze okujjuvu ku buli kifo kya kaadi kuyinza okulambikibwa, ate okugezesa okusaanyaawo okusekula, okubeebalama n’okusalasala mu budde obutuufu kukozesa okutwala sampuli. Ennyonyola y’okugula erina okunnyonnyola ebiragiro, abasomi, ebiteekebwamu, ekkomo ne lipoota.
Kaadi eyita LF naye n'eremererwa HF —oba n'eyita HF naye n'eremererwa LF —si kaadi ya frequency bbiri ekwatagana. Emisingi gy’okukkiriza girina okwetaagisa tekinologiya bombi okuyita mu kifo kye kimu ekya kaadi ewedde.
| Okukozesa | Obulagirizi bwa Tekinologiya obusemba | Okukakasa okukulu |
|---|---|---|
| Okufuga Okuyingira mu Legacy | 125kHz okusoma kwokka oba programmable LF chip eyeetaagibwa omusomi etekeddwa | Enkola y’omusomi, okufuluma kwa ID, okulungamya kaadi n’okuyingira mu database |
| Okusenguka kw’Enkola y’Okuyingira | LF + secure HF ekiwandiiko ekikakasa emirundi ebiri | Bombi omuwendo gw’abasomi, okukola maapu y’endagamuntu, okuddukanya ebisumuluzo n’enteekateeka y’okutambuza |
| Kaadi z'ebisumuluzo bya wooteeri | Chip eragiddwa omukutu gwa wooteeri-lock; tekinologiya ow’emirundi ebiri nga kkufulu ezitabuliddwa ziriwo | Encoder, lock firmware, obuwanvu bwa kaadi, obunnyogovu n’okukozesa enfunda eziwera |
| Endagamuntu z’abakozi ne Campus | HF enkola ey'obukuumi oba LF + HF mu kiseera ky'okusenguka | Okuyingira ku mulyango, okujja, okusasula, okukuba ebitabo n’obulamu |
| NFC Obwammemba n'okutunda | NTAG oba ekirala NFC Forum ekwatagana HF chip | Okukwatagana kw’essimu, data ya NDEF, obukuumi bwa URL n’ekifo antenna |
| Entambula n'obukuumi Multi-Application | Obukuumi HF chip n'enzimba y'enkola ekakakasiddwa | Enkola y’okutunda, okuwandiika ebikusike, okukuba ebisumuluzo n’okukkiriza enteekateeka |
| Data Ekintu | Ekyetaagisa Ennyonyola |
|---|---|
| LF Ekimanyisa | Koodi y’ekkolero eteredde, ensengeka eya pulogulaamu, koodi y’ekifo, ennamba ya kaadi n’ensengeka y’ebifulumizibwa |
| HF UID / CSN | Obuwanvu bwa UID, enneeyisa etakyukakyuka oba etali ya bulijjo, ensengeka ya database n'okutaputa kw'omusomi |
| HF Okujjukira / Okukozesa | NDEF, ebitundu, empapula, fayiro, eddembe ly'okuyingira, ebibala n'embeera y'okusiba |
| Ebisumuluzo ne Passwords | Omutendera gw’obwannannyini, okuzaala, okukuba empiso, okukyusakyusa, entambula n’okubala ebitabo |
| Okukola Maapu ya ID bbiri | Enkolagana wakati wa LF ennamba, HF UID/okusaba n'ennamba ya kaadi ekubiddwa |
| Okutabagana | Okukoppa, okubula, okugaana n'okusaanyaawo ebiwandiiko bya kaadi mu nkolagana zombi |
Ebiraga abantu bonna biyinza okukoppololwa oba okukoppa. Enkola ezikwata ku by’okwerinda zirina okukozesa okukakasa okutuufu okw’ekyama, okufuga okw’emabega n’enkola z’abafulumya mu kifo ky’okwesigamira ku nnamba erabika oba esomebwa yokka.
Chip HF obukuumi yeetaaga okutonda enkola efugibwa n'okutikka ebisumuluzo. Lambulula embeera ey’obukuumi, okuwanyisiganya data, okukakasa, okukwata kaadi ezigaanibwa n’ebyetaago by’okubala ebitabo nga tonnafulumya.
Okwekenenya ebyetaago: Kakasa abasomi, chips, protocols, ensengeka ya kaadi, card stack n’ekkomo ly’okugezesa.
Okukuba ekifaananyi kya yinginiya: Kiriza sayizi y’olupapula, eddoboozi lya kaadi, ebifo bya chip, amakubo ga antenna n’ebifo ebisala.
Prototype inlay: Okukola ekibinja ekitono ekya yinginiya okugezesa amasannyalaze, RF, obuwanvu ne lamination.
Finished-card test: Kuba, laminate, punch, encode n’okugezesa kaadi ku nkola zonna ezeetaagisa.
Golden sample approval: Omukono ku kaadi ekkiriziddwa, ensengeka ya data, okugezesebwa kw’omusomi n’omutindo gw’okulaba.
Okufulumya mu bungi: Control chip lot, enkola ya antenna, ebipimo, okugezesa amasannyalaze n’okulondoola.
Okufuga enkyukakyuka: Funa olukusa nga tonnakyusa nsibuko ya chip, package, antenna, PVC , adhesive, layout oba ebyuma ebigezesa.
Sampuli ya sitokisi eraga omulimu ogw’awamu. Enkola ya custom prototype ekakasa chip entuufu, antenna, layout, card stack, readers n’ebyuma ebikola lamination ebyetaagisa omuguzi.
Dizayini ez’omutindo eziri mu sitoowa ziyinza okuwagira oda za sampuli entonotono. Chips eza custom, layouts za frequency bbiri, antenna tooling, secure encoding ne nonstandard sheet dimensions mu budde obutuufu byetaaga MOQ y’okufulumya.
Okukola RFID prelam okutebenkera kwetaaga okufugibwa chip sourcing, okukola antenna, okuyunga chip-to-coil, okugatta obuveera, lamination, okugezesa amasannyalaze, okwekenneenya ebipimo n’okulondoola lot. Ebiragiro ebiddiŋŋana birina okukozesa chip ekkiriziddwa, okukuba antenna, material stack n’enkola y’okugezesa okuggyako ng’enkyukakyuka ewandiikiddwa ekkiriziddwa.
RFID Pulojekiti n'obuyambi obw'ekikugu
LF , HF ne Hybrid Inlay Omusomo
Ebipande bitereke nga bipapajjo mu bipapula ebisiddwa, ebiyonjo era ebikalu wala okuva ku bbugumu n’omusana obutereevu.
Kozesa ebipande ebikaluba, ebisengejja n’ebibbo ebinywezeddwa okukuuma antenna ne chip zones.
Weewale emigugu gya paleeti egitakwatagana, okubeebalama, okukuba ebisongovu n’okunyigirizibwa kw’omutambi okuyitiridde.
Kozesa ebifuga ebituufu eby’okukwata ESD ku nkola z’okufulumya ezibikkuddwa n’okugezesa.
Condition sheets mu kisenge kya lamination nga embeera ya sitoowa n’okufulumya eyawukana.
Buli pack ssaako chip combination, antenna design, layout, obuwanvu, obungi ne batch.
Siiga ebintu ebisooka okuyingira, ebisooka okufuluma era oddemu okugezesa ebintu oluvannyuma lw’okubitereka okumala ebbanga eddene oba okubeera mu ntambula etali ya bulijjo.

Okupakinga Flat Okukuumibwa ku Orders za B2B ez'ensi yonna
LF , HF n’obusobozi bw’omugatte: Pulojekiti za frequency emu n’eza frequency bbiri zisobola okukolebwa okuva mu nsengekera y’obutonde bw’omusomi yennyini.
Yinginiya eyeetongodde ku chip: Ebintu ebisomebwa byokka, ebiyinza okuteekebwa mu pulogulaamu, NFC n'eby'obukuumi HF byawulwamu okusinziira ku nkola n'enkola.
Antenna ne layout eya custom: Sayizi ya sheet, card pitch, chip location, coil geometry ne punching clearances zisobola okulongoosebwa.
Ebisaanyizo bya kaadi ewedde: Sampuli zisobola okukubibwa, okuteekebwako laminated, okukubwa ebikonde, okuteekebwako enkodi n’okugezesebwa ku basomi ebigendererwa.
Okulondoola omutindo mu biwandiiko: Ebyetaago by’amasannyalaze, RF, ebipimo, ebirabika n’okulondoola bisobola okuwandiikibwa mu nsengeka.
Factory-direct B2B supply: Esaanira amakolero ga kaadi, abagatta okuyingira, abagaba enkola ya wooteeri, abafulumya, abayingiza n’abagaba.
Okukozesa n'okusengeka okwetaagisa: LF , HF oba LF + HF frequency bbiri.
Ebika by’abasomi, ebika, firmware, protocols n’enkola y’okufulumya eyeetaagisa.
Omukozi wa chip entuufu LF ne HF , ennamba y'ekitundu, memory n'obukuumi obwetaagisa.
Ensengeka y’olupapula, ebipimo, eddoboozi lya kaadi, obubonero bw’okwewandiisa n’obungi.
Sayizi ya kaadi, obuwanvu obuwedde, ebifo ebiteekebwamu chips, ebituli, ebituli n’okukuba ebikonde.
prelam ebintu, langi, obuwanvu n’okugumiikiriza.
LF ne HF ebyetaago by'okugezesa eby'okusoma n'okulungamya ebigendererwa.
Final card stack, Firimu ya overlay s, printed cores, yinki ey’ekyuma, omuguwa gwa magineeti n’ebintu eby’obukuumi.
Lamination press, ebbugumu, puleesa, okubeera, okunyogoza ne plate ebipimo.
Enkodi, olukalala lwa UID/ID, okukuba ebisumuluzo, okukola maapu ya data n’ebyetaago by’okutabaganya.
Omuwendo gwa prototype, okuteebereza buli mwaka, MOQ target n’enteekateeka y’okutuusa.
Okupakinga, ebiwandiiko by’okukebera, omwalo gw’ogenda n’ebiwandiiko ebyetaagisa okugoberera.
Teesa ku Pulojekiti Yo LF ne HF Inlay
Ye lupapula lwa kaadi olwa wakati olulimu RFID chip ne antenna munda mu PVC layers. Abakola kaadi bongera ku core ezikubiddwa ne Firimu ya overlay s nga tebannaba lamination esembayo n'okukuba ebikonde.
Yee. Prelam ya frequency bbiri erimu chips ne antenna ezenjawulo LF ne HF mu mubiri gwa kaadi gumu. Enkolagana zombi zeetaaga okulongoosa n’okugezesa okwetongodde.
Kisobozesa ekiwandiiko ekimu okukola n’ebisoma eby’edda ebya 125kHz n’ebisoma ebipya ebya 13.56MHz smart-card mu kiseera ky’okusenguka kw’ebikozesebwa.
Mu budde obwabulijjo ziba circuit za njawulo. Ebimanyisa byabwe bisobola okuyungibwa mu database ya kasitoma, naye biwuliziganya nga byetongodde n’abasomi ab’enjawulo.
TK4100-ekika, EM4200, ATA5577/T5577-ekika n'ebirala LF eby'okulonda bisobola okuteesebwako. Kakasa enneeyisa y'okusoma kwokka oba okusoma/okuwandiika, enkodi n'ensengeka y'omusomi.
EM4200 eteekeddwa nga IC emanyiddwa mu kkolero eya low-frequency read-only identification IC. Enkola ya koodi eyeetaagisa n'okukwatagana kw'omusomi birina okulagibwa.
Ebyuma eby'ekika kya ATA5577/T5577 biba bikyusa okusoma/okuwandiika LF ebisobola okutegekebwa. Enkola ya pulogulaamu, password, lock bits n’okukakasa birina okunnyonnyolwa.
Nedda.Okukwatagana kisinziira ku chip entuufu n’ensengeka. Emitendera gino tegisaanidde kukozesebwa nga blanket claim ku buli access-control LF chip.
Ebintu by’oyinza okulonda mulimu chips ez’edda ez’ekika kya A, MIFARE Ultralight, NTAG, MIFARE DESFire ne ISO 15693/ICODE famire, okusinziira ku kubeerawo n’ebyetaago by’okukozesa.
Nedda Abasomi bawagira emitendera egy’enjawulo, ebiragiro n’okukozesa. Kakasa Ekika A, Ekika B, ISO 15693 oba NFC Obuwagizi bwa Forum ne IC entuufu.
NTAG 213, 215 oba 216 n'ebirala NFC Chips ezikwatagana ne Forum ze nkola eza bulijjo. Londa okusinziira ku jjukira lya NDEF, okukwatagana kw’essimu n’ebyetaago by’obukuumi.
Omukutu ogw'obukuumi nga MIFARE DESFire guyinza okuba nga gusaanira, naye omusomi, ebisumuluzo, enkola, backend n'enkola y'okukola ku muntu alina okukolebwa yinginiya wamu.
Ensengeka eza bulijjo mulimu 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ne 4 × 10. Ensengeka ez’enjawulo zisobola okukolebwa okuva mu kifaananyi ky’omuguzi ekya CAD.
Olupapula olwasooka lujuliza nga 0.50–0.60mm ku bizimbisibwa LF ebirondeddwa. Ekipima ekituufu kisinziira ku chip, coil, PVC ne dizayini ya kaadi esembayo.
Kiyinza okwetaaga obuwanvu obusingako oba okuliyirira mu kitundu kubanga kirimu chips bbiri n’enkola za antenna bbiri. Maapu y’obuwanvu enzijuvu erina okukkirizibwa.
Yee. Coil geometry esobola okukolebwa okwetoloola chip, sayizi ya kaadi, omusomi, target range, chip position ne cutting clearance.
Range esinziira ku frequency, chip, antenna, reader, card stack, orientation n’obutonde. Lambulula abasomi b'okugezesa LF ne HF ab'enjawulo era oyite amabanga.
Kiyinza okulowoozebwako oluvannyuma lw’okukeberebwa. Ebitundu ebinene ebiriko ebyuma biyinza okukosa HF antenna era birina okuteekebwa mu bisaanyizo bya RF ebya kaadi ewedde.
Ensengekera endala zisobola okukolebwa, naye okukwatagana, ebbugumu, okukendeera, RF tuning, chip stress n’okuwangaala kwa kaadi esembayo birina okukakasibwa okwawukana.
Mu budde obutuufu ziba mpapula ezikola ezitaliiko kintu kyonna. Ebifaananyi bya bakasitoma bitera okukubibwa ku mpapula z’emisingi ez’enjawulo nga kaadi enzijuvu tennateekebwako laminate.
Tewali mbeera ya bonna. Ebbugumu, puleesa, okubeera n’okunyogoza birina okukolebwa ku PVC entuufu, chip packages, antennas, printed cores ne Firimu ya overlay s.
Kozesa obuwanvu bw’ekitundu obufugibwa, obubaawo obuyonjo, puleesa ekwatagana, ebipapula bya chip ebikwatagana, enzirukanya y’ebbugumu ezikkiriziddwa n’okugezesa amasannyalaze nga tonnaba kukola lamination n’oluvannyuma lw’okugikolako.
Yee, okukebera amasannyalaze mu bujjuvu kuyinza okulambikibwa. Ku bikozesebwa eby’emirundi ebiri, ensengekera zombi LF ne HF zirina okuyita ku buli kifo ekikkirizibwa.
LF programming, HF okuwandiika memory, data ya NDEF n'okulongoosa enkola bisobola okuteesebwako. Ebisumuluzo ebikuumi byetaaga enkola ey’enjawulo efugibwa.
Yee. Ebisaanyizo ebisinga obulungi bikozesa chips entuufu, antenna, card stack, lamination press, punching tool ne target readers.
MOQ esinziira ku chip okubeerawo, frequency emu oba bbiri, antenna tooling, layout, material, encoding, ebyetaago by’okugezesa n’okumanya oba standard design eriwo.
Waayo chips entuufu LF ne HF , abasomi, protocols, layout, okukuba kaadi, obuwanvu, card stack, ensalo z'okugezesa, encoding, obungi, okupakinga n'ekifo w'ogenda.
Tuukirira Wallis Plastic ku mpapula z'okuyingiza eza prelam eza 125kHz LF , 13.56MHz HF ne LF + HF ez'emirundi ebiri RFID PVC ezikoleddwa ku mutindo. Ttiimu yaffe ewagira okulonda chip, okukola antenna ne layout, okuteekateeka card-stack, okugezesa lamination, LF / HF okugezesa, encoding, omutindo specifications n'ekkolero-obutereevu B2B supply.
Tandika Pulojekiti Yo naffe