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Inlay/ Okusooka okukola
Wallis
| Sayizi: | |
|---|---|
| Omuwendo: | |
Wallis 13.56MHz HF RFID PVC prelam inlay sheets zikoleddwa nga yinginiya ng’omusingi ogukola ku smart cards ezitaliiko kukwatagana, ID cards, access cards, hotel key cards, membership cards, transport cards ne NFC-enabled card programs. Buli lupapula lugatta chip ya HF ne antenna erongooseddwa munda mu nsengeka ya PVC efugibwa, nga yeetegefu okukola lamination ya card-body esembayo, okukuba ebitabo, okukuba ebikonde n’okugifuula ey’obuntu.
Pulojekiti za B2B zisobola okulongoosebwa okusinziira ku mutindo gwa chip, protocol, memory, antenna geometry, sheet size, card layout, inlay thickness, chip position, material, okuzimba kaadi esembayo n’okugipakira. Ebiwandiiko ebikwata ku nsengeka eya bulijjo mulimu 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ne 4 × 10, nga waliwo ensengeka za kaadi nnyingi ez’enjawulo eziriwo ku pulati ez’enjawulo ez’okusiba n’ebyuma ebikuba ebikonde.
Famire za chip tezirina kugattibwa wansi w’okugamba okumu okw’okukwatagana okw’ensi yonna. Ebintu bya MIFARE Classic, MIFARE Ultralight, NTAG ne MIFARE DESFire bikola mu mbeera za ISO/IEC 14443 Type A, ate ebintu bya ICODE bitera okusinziira ku ISO/IEC 15693. Chip entuufu, omusomi, pulogulaamu y’okukozesa n’obwetaavu bw’obukuumi birina okukakasibwa nga tebannaba kulongoosa antenna n’okufulumya mu bungi.
| Ekika ky’Ebintu | 13.56MHz HF RFID contactless prelaminated inlay sheet okukola obuveera-kaadi |
| Emirundi | 13.56MHz HF eriko amaanyi ga 13.56MHz; protocol ne air interface bisinziira ku chip erongooseddwa |
| Ensengeka z’omutindo | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 n’ensengeka ez’enjawulo |
| Ekiwandiiko ekijuliziddwa ku buwanvu bw’olupapula obuliwo kati | Nga 0.45 ± 0.02mm ku bizimbe bya HF ebirondeddwa; kakasa nga okozesa chip, antenna, material ne card stack esembayo |
| Ebikozesebwa Ebisookerwako | PVC enjeru oba entangaavu; Pulojekiti ezikwatagana ne PETG ne polycarbonate nga zirina okukakasibwa kw’enkola ey’enjawulo |
| Enkola za Antenna | Waya y’ekikomo eyingiziddwamu, aluminiyamu ewandiikiddwa n’okuzimba antenna ezikwata ku pulojekiti |
| Empeereza ya B2B | Okunoonya chip, okukola antenna, RF tuning, layout engineering, samples, okugezesa lamination, okugezesa amasannyalaze, QC reports n’okutunda ebweru w’eggwanga |
Saba HF RFID Inlay Samples ne Quote
Prelam inlay ye lupapula olukola kaadi olw’omu makkati nga lulimu chip ya RFID, okuyungibwa ku chip-to-antenna n’ensengeka ya antenna erongooseddwa munda mu layers z’obuveera. Mu budde obutuufu si ye kaadi ewedde okukubibwa. Abakola kaadi bagatta prelam ne printed core sheets ne transparent overlays, olwo ne bakola laminate, cool, punch ne bakola ku kaadi eziwedde.
Antenna efuna amaanyi okuva mu kifo ky’omusomi era n’etambuza data wakati w’omusomi ne chip eyingiziddwa. Omulimu gwa RF gusinziira ku geometry ya antenna, okuziyiza kondakita, capacitance ya chip, resonance, ebikozesebwa mu kaadi, ebyuma ebiriraanyewo, obuwanvu bwa kaadi obusembayo n’amaanyi g’ennimiro y’omusomi.
PVC core sheets ezikubiddwa, ebibikka ebitangaavu, ebisiiga, emisono gya magineeti, signature panels n’okumaliriza okukuuma byongera obuwanvu okwetoloola prelam. Obugumu bwa kaadi emaliriziddwa ebigendererwa bulina okutegekebwa okuva ku stack enzijuvu okusinga okuva ku prelam gauge yokka.
Okukyusa famire ya chip, sayizi ya antenna, kondakita, ekintu kya kaadi oba embeera ya kaadi kiyinza okukyusa resonance n’okukyusa omutindo gw’okusoma. Dizayini ekkiriziddwa ku chip emu tesaana kuddamu kukozesebwa mu ngeri ya otomatiki ku chip endala nga tewali kipimo kya RF.
Embedded HF Chip ne Enzimba ya Antenna
Ensengeka y’empapula za kaadi nnyingi okusobola okukola Lamination
Chip erina okulondebwa okuva mu nkola y’omusomi, obwetaavu bw’okujjukira, omutindo gw’obukuumi, sipiidi y’okutunda, obulamu, satifikeeti n’enkola ya pulogulaamu. Amannya g’ebika nga MIFARE, NTAG ne ICODE maka ga bikozesebwa okusinga ebigambo eby’enjawulo ebikyusibwakyusibwa.
| Chip Family / Option | Protocol Positioning | Pulojekiti eya bulijjo Fit | Ekikulu B2B Note |
|---|---|---|---|
| Fudan F08 / Enkola ya Legacy 1K ekwatagana | Ekitera okusabibwa ku nkola ezikwatagana ne ISO/IEC 14443 Type A; ennamba y’ekitundu entuufu erina okukakasibwa | Pulojekiti z’okuyingira mu nsi, obwammemba n’okukyusa abasomi abateekeddwawo | Kakasa omukozi, memory, UID, okukakasa, okukwatagana kw'omusomi n'ennyonnyola y'ekika mu mateeka |
| MIFARE Classic EV1 1K / 4K nga zino zigenda mu maaso | ISO/IEC 14443-3 Ekika kya A, 106kbit/s | Ebikozesebwa mu ntambula, tikiti, okuyingira n’okuzannya emizannyo ebiriwo | Famire y’ebintu eby’edda; kozesa enkola essiddwawo we yeetaaga yokka era weekenneenye eky’omulembe eky’obukuumi ku dizayini empya |
| MIFARE ekika kya Ultralight EV1 | ISO/IEC 14443 Ekika kya A embeera | Tikiti ezikozesebwa ekitono, emikolo, obwesigwa ne pulogulaamu ennyangu ezitaliiko kukwatagana | Gkwataganya ebikozesebwa mu kujjukira, ekigambo ky'okuyingira n'obusookerwako n'enkola y'okutiisatiisa enkola |
| NTAG 213 / 215 / 216. Enkola y’okukola emirimu egy’enjawulo | NFC Forum Ekika 2 Tag ne ISO/IEC 14443 Ekika A | Bizinensi kaadi za NFC, enkolagana y’okukakasa, okukwatagana ku ssimu n’ebintu ebiyungiddwa | Ekijjukizo ky’omukozesa kyawukana okusinziira ku muze; okukakasa obunene bwa NDEF, ekigambo ky'okuyingira n'ebyetaago by'obuzaale |
| MIFARE DESFire EV3 | ISO/IEC 14443 Ebitundu eby’ekika kya A 1–4 nga biriko enkola ez’obukuumi ez’omutendera ogwa waggulu | Kaadi z’okuyingira mu ngeri ey’obukuumi, entambula, kampusi, endagamuntu, obwesigwa n’okusaba emirundi mingi | Yeetaaga okuddukanya ebisumuluzo, okulongoosa enkola n’okugatta omusomi/software |
| ICODE SLIX2 / ISO 15693 Amaka | ISO/IEC 15693, NFC Forum Ekika kya 5 okuteeka mu kifo | Vicinity-card, library, asset, identification ne pulojekiti ez’ebanga eddene | Tekikyusibwakyusibwa na basomi ba ISO/IEC 14443 Type A; kakasa protocol y'omusomi ne sayizi ya antenna |
Omutindo omungi ogutaliiko kukwatagana gukola ku 13.56MHz. Omusomi ayinza okuwagira ISO/IEC 14443 Ekika A, Ekika B, ISO/IEC 15693, ebika bya tag ya NFC Forum oba layeri y'enkola ey'obwannannyini. Frequency yokka tegimala kukkiriza kukwatagana.
Bbanka, okusasula, endagamuntu ya gavumenti ne pulojekiti z’okutambuza abantu ezifugibwa ziyinza okwetaagisa chips ezikakasibwa, okukuba empiso y’ebisumuluzo ebikuumi, okukola ebintu ebibaliriddwa, okukkiriza enteekateeka n’okugezesa okusaba. Generic HF inlay tesaana kusuubulibwa nga eyeetegefu okusasula nga tewali bisaanyizo ebyetaagisa.
| Parameter | Available Direction | Production Control |
|---|---|---|
| 2 × 5 Ensengeka | Prototype ey’ekika kya A4 n’okufulumya kaadi ez’obunene obutono | Kakasa ebipimo by’olupapula ebituufu, eddoboozi lya kaadi n’obubonero bw’okwewandiisa |
| 3 × 7 / 3 × 8 nga bwe kiri | Ensengeka z’empapula za smart-card eza bulijjo ez’amakolero | Match lamination plates, ekintu ekikuba ebikonde, printed cores n'obulagirizi bw'okugatta |
| 4 × 8 / 4 × 10 / 5 × 5. Obubaka bwa Buganda | Ensengeka z’ebifulumizibwa eby’oku ntikko n’ebyuma ebikwata ku bakasitoma | Fuga enkolagana ya RF wakati wa antenna eziriraanye n’okukyukakyuka kw’empapula |
| Ensengeka ya Custom | Ebipimo bya kaadi ebya custom, ebisumuluzo, mini cards oba enkola ez’enjawulo ez’okukuba ebikonde | Okuwa ekifaananyi kya CAD, ensengeka y’ebintu ebiwedde, ekifo kya chip, zone ya antenna n’okusala clearance |
| Prelam Obugumu | Olupapula olujuliziddwa mu kiseera kino nga 0.45 ± 0.02mm; ebizimbe eby’ennono ebiriwo | Kakasa average, enkyukakyuka y’obubonero, chip-bump zone n’okubalirira kwa final-card stack |
| Ekikozesebwa | PVC enjeru, PVC entangaavu n’ebizimbe ebikwatagana ne PETG oba PC ebikwata ku pulojekiti | Okukakasa okukendeera, okukwatagana, ebbugumu, RF tuning n’okuwangaala kwa kaadi ewedde |
Kaadi eya bulijjo eya CR80/ID-1 mu budde obutuufu ekolebwa kumpi mm 0.76, naye okugumiikiriza okutuufu kisinziira ku kaadi n’ebyuma ebigikwatako. Cores ezikubiddwa, ebibikka mu maaso n’emabega, adhesives n’obuwanvu bwa chip ez’omu kitundu birina okuteekebwa mu kubala.
Sheet eyinza okuba mu average gauge tolerance ate nga chip zone ebeera locally thicker. Dizayini y’ebituli, okugiteekako emitto, puleesa y’okunyiga n’okulonda layeri birina okuziyiza ebikonde ebirabika, okukwatagana okunafu n’okwonooneka kwa chip.
| Antenna Factor | Effect ku Card | Ekyetaagisa Okukakasa |
|---|---|---|
| Geometry ya Koyilo | Afuga inductance, coupling area n’okusala clearance eriwo | Okukwataganya capacitance ya chip, ebipimo bya kaadi, embeera y’omusomi n’egenderera |
| Antenna ya Waya y’ekikomo | Awagira dizayini za koyilo eziteekeddwamu ne geometry ekyukakyuka | Dyaamu ya waya, obuziba bw’okuyingiza, okusalako, ekiyungo kya bond n’okugenda mu maaso |
| Antenna ya Aluminiyamu eriko ebifaananyi | Awagira okufulumya antenna eziriko ebifaananyi eby’obuzito obw’amaanyi | Obugazi bwa trace, okuziyiza, okukuuma okukulukuta, okukwata chip n’enneeyisa ya lamination |
| Obusobozi bwa Chip | Ekyusa resonance ya antenna/chip circuit | Retune nga okyusa chip family oba package |
| Omutwalo gwa Kaadi | Obuveera, yinki, foyili, ebifaananyi eby’ebyuma n’ebibikka bisobola okukyusa okuyungibwa n’okulongoosa antenna | Gezesa kaadi ewedde, si bare prelam yokka |
| Kozesa Obutonde bw’Ensi | Ebyuma, amasimu, waleti, kaadi eziri okumpi n’amazzi bisobola okukosa omulimu | Weekenneenye omusomi gw’agenderera, embeera y’okussaako n’engeri omukozesa gy’akwatamu |
Ebanga ly’okusoma lisinziira ku chip, ekitundu kya antenna, ensonga y’omutindo, amaanyi g’omusomi, antenna y’omusomi, protocol, orientation ya card, stack ya card esembayo n’obutonde. Ekiwandiiko ekijuliziddwa kirina okulaga omusomi w’okugezesa n’ebanga ly’okuyita/okulemererwa okusinga okukozesa ennamba emu ey’ensi yonna.
Antenna eziri ku lupapula lwa kaadi nnyingi zeetaaga ebanga erimala okuva ku layini ezisala, ebituli by’okuwandiisa n’ebifo ebiriraanyewo. Ebigezo bya RF ku ddaala lya sheet birina okubala okuyungibwa wakati wa antenna nga kaadi tezinnaba kukubwa.
| gwa layeri | Okufuga | ekisumuluzo |
|---|---|---|
| Okubikka mu maaso | Ekuuma ebifaananyi ebikubiddwa era egaba gloss, matte, frosted oba security finish | Obugumu, okukwatagana, okusika n’okukwatagana kw’omuntu |
| Omusingi ogukubiddwa mu maaso | Atambuza ebifaananyi ebinywevu, ebiwandiiko, akabonero n’okukuba ebitabo mu by’okwerinda | Okuwandiisa okukuba ebitabo, okuwonya yinki, okukendeera n’ebikolwa by’ebyuma ebitali bya RF |
| HF Prelam Inlay nga bano | Mulimu chip, antenna, ebiyungo by’amasannyalaze ne layers za pulasitiika eziwanirira | RF tuning, chip position, obuwanvu, alignment, bond n’amakungula g’amasannyalaze |
| Back Printed Core | Egerageranya layeri y’omu maaso era etambuza ebifaananyi eby’emabega | Bbalansi ya gaagi, ekifo kya magnetic-stripe n’okubikka okukuba ebitabo |
| Okubikka emabega | Ekuuma artwork era esobola okubeeramu stripe, signature panel oba security feature | Bonding, flatness, encoding n’okungulu okusembayo |
Foyilo ennene eziriko ebyuma, yinki ezitambuza oba layers ez’ebyuma okumpi ne antenna zisobola okukendeeza ku coupling oba shift tuning. Teekamu ebintu ebisembayo eby’okuyooyoota mu kukebera kwa RF era okuume zoni ezitangaavu we kyetaagisa.
Ebipima layeri mu maaso n’emabega, obulagirizi bw’ebintu n’okubikka okukuba ebitabo birina okuba nga bikwatagana we kisoboka. Asymmetrical stacks zisobola okuvaamu card curl oluvannyuma lw’okubugumya n’okunyogoza.
Kakasa stack ekkiriziddwa: Wandiika buli overlay, printed core, inlay, adhesive, stripe ne security layer.
Okulongoosa ebipande byonna: Okutebenkeza ebintu mu mbeera y’okufulumya era bikuume nga biyonjo, bipapajjo era nga bikalu.
Kakasa obulagirizi: Gkwataganya obulagirizi bw’olupapula, eddoboozi lya kaadi, ekifo kya chip, ekifo kya antenna, ebifaananyi by’ebifaananyi n’obubonero bw’okukuba ebikonde.
Okukulaakulanya enzirukanya ya lamination: Teekawo ebbugumu, puleesa, okubeera, okumaliriza pulati, okufulumya ekipande n’okunyogoza ku mugogo gw’ebintu omutuufu.
Kuuma ekitundu kya chip: Fuga puleesa y’ekitundu era weewale obutundutundu obukalu, obulema mu pulati oba okutambula kw’ebintu okuyitiridde okwetooloola IC.
Okunyogoza wansi wa puleesa efugibwa: Okunyogoza kukwata ku bupapajjo, okunywerera kwa layeri, okunyigirizibwa kwa chip n’okutebenkera kw’ebipimo.
Gezesa nga tonnaba kukuba kikonde: Kebera enkola y’amasannyalaze ku ddaala ly’ekipande, endabika, obuwanvu, okukwatagana n’okuwandiisa.
Gezesa kaadi eziwedde: Pun, personalize era okakasa omulimu gwa RF, ebipimo, okubeebalama n’okukwatagana kw’okukozesa.
| Lamination Obulabe | Ekiyinza okuvaako | Okutereeza Obulagirizi |
|---|---|---|
| Okulemererwa kwa Chip | Ebbugumu erisukkiridde, puleesa y’ekitundu, okwonooneka kw’amasannyalaze oba okuyungibwa kwa chip okunafu | Weekenneenye ekkomo ku chip package, puleesa y’enkola, ebifuga ESD n’omutindo gw’okuyungibwa |
| Ggulawo Circuit ya Antenna | Kondakita emenyese, ekiyungo ekibi, okusala okwonooneka oba okugolola ekisusse | Kebera okugenda mu maaso, ekkubo lya kondakita, ekkubo ly’okukuba ebikonde n’okunyigirizibwa kw’ebyuma |
| Weak Read Range | Detuning, okufiirwa kondakita, obutakwatagana mu musomi, artwork ey’ekyuma oba okukyusa card-stack | Pima resonance era retune ng’okozesa card ne target reader ewedde |
| Chip Bump erabika | Okuliyirira okutamala, obuwanvu bwa modulo obuyitiridde oba puleesa etali ya bwenkanya | Okulongoosa ebituli by’omu kitundu, ebipima layeri, embeera z’okusiba n’okunyiga |
| Okuwugulaza (Delamination). | Obujama, ebintu ebitakwatagana, ebbugumu ettono oba okunyogoga obubi | Weekenneenye okukwatagana kw’ebintu, obuyonjo, enzirukanya n’enkola y’ebikuta |
| Olupapula oba Kaadi Warpage | Stack etali ya bbalansi, okubuguma ennyo, puleesa etali ya bwenkanya oba okunyogoga okw’amangu okutafugibwa | Balance layers era optimize ebbugumu, plate flatness n'okunyogoza |
| Ekintu | Ekisemba Okufuga B2B |
|---|---|
| Endagamuntu ya Chip | Kakasa omukozi, ennamba y’ekitundu entuufu, memory, UID option, protocol ne lot traceability |
| Omulimu gw’amasannyalaze | Soma chip UID, memory oba ekiragiro ekitegeerekese ekiteekeddwa ku buli kifo kya kaadi okusinziira ku nteekateeka y’okukebera |
| Okugenda mu maaso kwa Antenna | Zuula open circuits, shorts, joints enafu, conductor obulema ne crossovers ezonoonese |
| Enkola ya Resonance / RF | Pima RF parameter oba functional read distance ekkaanyiziddwaako ng’okozesa ebyuma ebigezesebwa ebitegeerekese n’ekintu ekinyweza |
| Ekifo kya Chip ne Antenna | Kebera ekifo okusinziira ku CAD, card outline, punch clearance ne antennas eziriraanyewo |
| Ebipimo by’Empapula | Obuwanvu, obugazi, squareness, card pitch, ebituli by’okuwandiisa n’omutindo gw’empenda |
| Obugumu n’Obupapajjo | Obugumu bwa wakati, obuwanvu bwa chip-zone obw’omu kitundu, curl, bow n’enjawulo okuva ku point-to-point |
| Okukebera n’amaaso | Obujama, ebiwujjo, enviiri, amabala amaddugavu, okulaga kondakita, okukunya n’obulema mu layeri |
| Okugezesebwa kwa Kaadi Okumaliriziddwa | Omulimu gwa RF, ebipimo, obuwanvu, okubeebalama, okukyusakyusa, ebbugumu, obunnyogovu, okusekula n’okukwatagana kw’omusomi |
| Okulondoola | Chip lot, antenna lot, PVC lot, olunaku lwe yafulumizibwa, layout, program y’okugezesa, sheet number ne packing record |
Okukebera mu bujjuvu kuyinza okutegeeza okugezesa okusoma kw’amasannyalaze mu buli kifo, ate okugezesa okw’ebipimo, okusekula n’okusaanyaawo kutera okutwalibwa sampuli. Ebiwandiiko ebikwata ku kugula birina okunnyonnyola ebintu ebigezesebwa, fixture, emisingi gy’okukkiriza, enteekateeka y’okutwala sampuli ne lipoota.
Prelam esobola okuyita mu kukeberebwa kw’amasannyalaze n’ekyalemererwa oluvannyuma lw’ebbugumu erisukkiridde, puleesa, okukuba ebikonde oba okukola omuntu. Ebisaanyizo bya B2B birina okubeeramu omutindo gwa incoming-inlay ne finished-card.
| Okukozesa | Chip / Protocol Direction | Okukakasa okukulu |
|---|---|---|
| Kaadi z’abakozi n’okuyingira | Legacy Type A, MIFARE Plus oba DESFire okusinziira ku nkola y’okuyingira eyateekebwawo | Okukwatagana kw’abasomi, okuddukanya ebisumuluzo, okwewandiisa n’okufukamira buli lunaku |
| Kaadi z'ebisumuluzo bya wooteeri | Chip eyeetaagibwa ku pulatifomu ya hotel-lock | Lock encoder, enkola y’okuddukanya abagenyi, obuwanvu bwa kaadi n’obunnyogovu |
| Kaadi z’ebyentambula ne kampusi | Secure multi-application chip nga DESFire nga system architecture gyetaaga | Obwangu bw’okutunda, obukuumi, eby’obugagga by’omusomi, okulongoosa n’obulamu |
| Kaadi z’obwammemba n’obwesigwa | Type A memory chip, NTAG oba secure application chip okusinziira ku nteekateeka ya pulogulaamu | Okukwatagana kw’omusomi oba essimu, database, eby’ekyama n’okukozesa enfunda eziwera |
| Kaadi za NFC eza Bizinensi n'Okutunda | NTAG oba chip endala ekwatagana ne NFC Forum | Obusobozi bwa NDEF, okukwatagana kw’essimu, obukuumi bwa URL n’ekifo kya sikaani |
| Kaadi z’etterekero ly’ebitabo, eby’obugagga n’ebitundu ebiriraanyewo | ISO/IEC 15693 / Ekigonjoola eky'ekika kya ICODE | Enkola y’omusomi, sayizi ya antenna, ekifo we bagenda okutuuka, okulwanyisa okutomeragana n’ebyetaago bya EAS |
| Pulojekiti z’endagamuntu n’okusasula ezikuumibwa | Chip obukuumi ekakakasiddwa n’enzimba y’okukozesa ekkiriziddwa | Okukakasa, okukuba empiso y’ebisumuluzo, enkola y’okugaba ebintu ebaliriddwa n’okukkirizibwa okukwata ku nteekateeka |
Enkola za HF RFID Inlay ku Pulogulaamu za Smart Card
| Data / Ekintu ky’obukuumi | B2B Ekyetaagisa |
|---|---|
| UID | Kakasa obuwanvu bwa UID, enneeyisa ya ID etakyukakyuka oba etali ya bulijjo, ensengeka ya database n'obuwagizi bw'omusomi |
| Okuwandiika Enkodi mu Memory | Lambulula ensengeka ya data, sectors/files/pages, likodi ya NDEF, lock bits n'okukakasa |
| Ebisumuluzo by’Okukakasa | Lambulula obwannannyini obukulu, enkola y’okukuba empiso, okukuuma entambula, okukyusakyusa n’omutendera gw’okubala ebitabo |
| Okusengeka Password / Okuyingira | Laga password, access bits, counters, originality checks n'okugezesa lock-state we biwagirwa |
| Ebiwandiiko ebikyukakyuka ebikubiddwa | Gatta ennamba ewandiikiddwa, bbaakoodi oba QR code ku chip data nga oyita mu kutabaganya okufugibwa |
| Kaadi Ezigaanibwa | Okwawula, bala n’okusaanyaawo mu ngeri ey’obukuumi kaadi ezirimu ebisumuluzo ebiramu, ebimanyisa oba data eriko enkodi |
Enkola ekkiriza okuyingira okuva ku kimanyisa ekisomebwa mu lujjudde kyokka eyinza okuba mu bulabe bw’okukoppa oba okukoppa. Pulojekiti ezikwata ku by’okwerinda zirina okukozesa enzimba ya chip ne backend ewagira okukakasa okutuufu okw’ekyama.
Okuwa chip obukuumi tekizingiramu kuteekawo nkola oba okuddukanya ebisumuluzo mu ngeri ey’otoma. Lambulula ani atonda, atereka, atikka n'okukakasa ebisumuluzo, era oba embeera y'obukuumi-ey'omuntu ebalirirwa yeetaagibwa.
Smart card ya hybrid esobola okugatta HF ne LF, UHF, contact chip oba enkola endala eya HF. Ebizimbe bino byetaaga ekifo ekiwera, okwawula antenna n’obwegendereza, okufuga obuwanvu bw’ekitundu ekirala n’enteekateeka eyeetongodde ey’okusiba n’okugezesa.
| Hybrid Structure | Okukozesa Ensonga | Yinginiya Obulabe |
|---|---|---|
| LF + HF | Okusenguka okuva ku legacy proximity access okudda ku HF smart-card systems | Ekifo kya antenna, okukwatagana, obuwanvu bwa kaadi n’okugezesa abasomi babiri |
| HF + UHF | Endagamuntu ey’ebanga ettono nga kwogasse n’okulondoola okw’ebanga eddene | Enkola za antenna ez’enjawulo, ebikolwa by’ebintu n’okuwulira kwa UHF okumpi n’omubiri oba ekyuma |
| Chips za HF bbiri | Enkola ezenjawulo oba domain z'abafulumya ezeetongodde | Okulonda omusomi, okuyunga antenna, obwannannyini bwa data n’okuziyiza ensengeka ya kaadi |
| Tuukirira + Obutakwatagana | Enzimba y’endagamuntu, ey’amasimu oba ey’okusasula ey’obukuumi ey’enkolagana bbiri | Module cavity, okuyungibwa antenna, lamination, satifikeeti n’okukola personalization |
Standard single-frequency HF prelam tesaana kwogerwako nga ewagira LF oba UHF mu ngeri ey’otoma. Ensengekera za frequency eziwera zeetaaga okukuba ekifaananyi kyazo, olukalala lwa chip, okugezesebwa kwa RF, okulaga obuwanvu n’ebbeeyi.
Teeka ebipande bya prelam nga bipapajjo mu bipapula ebisiddwa, ebiyonjo era ebikalu wala okuva ku musana n’ebbugumu obutereevu.
Kozesa ebipande ebikalu, ebiyingiza n’ebibbo ebikuumibwa okuziyiza okubeebalama, okukunya ne puleesa ya chip-zone.
Weewale okufulumya amasannyalaze ag’amaanyi era kozesa ebifuga ebituufu eby’okukwata ESD we kyetaagisa.
Toteeka migugu mizito egitakwatagana ku sheet stack oba okukkiriza pallet overhang.
Ebintu ebitereeza mu kisenge kya lamination nga tonnalongoosebwa nga embeera ya sitoowa n’okufulumya eyawukana.
Laba buli pack okusinziira ku chip model, antenna design, layout, obuwanvu, batch n’embeera y’okukebera.
Kozesa yinvensulo esooka okuyingira, esooka okufuluma era oddemu okugezesa ebintu oluvannyuma lw’okubitereka oba okubitambuza okumala ebbanga eddene.
Okupakinga kwa Flat okukuumibwa ku HF RFID Prelam Sheets
Okukola prelam okwesigika kwetaaga okufugibwa antenna embedding oba etching, chip attachment, sheet registration, plastic lamination, okugezesa amasannyalaze, dimensional inspection, okukwata obuyonjo n'okulondoola batch. Enkola ya chip, okukuba antenna n’okugezesa RF ekkiriziddwa erina okusigala nga tekyukakyuka ku biragiro ebiddibwamu okuggyako nga bakkiriziganyizza ku nkyukakyuka efugibwa.
Pulojekiti ya RFID Inlay ne Ttiimu y’ebyekikugu
Omusomo gw'okufulumya ebintu mu Prelam Inlay
Okufuga Enkola ya Antenna ne Inlay
Okukebera Amasannyalaze n’Ebipimo
Okulonda chip okwesigamiziddwa ku nkola: Okuyingira okw’edda, NFC, pulojekiti ez’obukuumi ez’enkola eziwera ne ISO 15693 zisobola okwawulwamu okusinziira ku nkola n’obwetaavu bw’obukuumi.
Yinginiya wa antenna eya custom: Geometry ya coil, conductor, chip capacitance, card outline ne target reader bisobola okwekenneenya wamu.
Ensengeka z’empapula ezikyukakyuka: Enteekateeka za kaadi nnyingi eza bulijjo n’ebisaawe bya kaadi ebikwata ku bakasitoma bibaawo.
Okugatta kaadi n’ebintu: PVC prelam esobola okukwasaganyizibwa n’emisingi egy’okukuba, ebibikka, emisono gya magineeti n’ebizimbe bya kaadi ebiwedde.
Obuwagizi bw’ebisaanyizo: Sampuli, okugezesa lamination, okugezesa RF, okukebera obuwanvu n’okukakasa kaadi ewedde bikendeeza ku bulabe bwa pulojekiti.
Factory-direct B2B supply: Esaanira amakolero ga smart-card, printers, converters, system integrators, abafulumya, abayingiza n’abasaasaanya.
Enkola, ekika ky’omusomi/ekyokulabirako, enkola n’omukutu gwa pulogulaamu ogwateekebwamu.
Omukozi wa chip omutuufu n’ennamba y’ekitundu, memory, UID n’ebyetaago by’obukuumi.
Ensengeka y’empapula, ebipimo byonna awamu, eddoboozi lya kaadi, obubonero bw’okwewandiisa n’obungi.
Sayizi ya kaadi, antenna clear zone, chip position n’okukuba ebikonde.
Prelam material, langi, obuwanvu obw’erinnya n’okugumiikiriza.
Tekinologiya wa antenna, target resonance oba functional read-range test.
Final card stack, printed cores, overlays, okukuba ebyuma, stripe oba signature panel.
Lamination press, ebbugumu, puleesa, okubeera, okunyogoza ne plate ebipimo.
Okugezesa amasannyalaze, okugezesebwa kwa RF, okukebera ebipimo n’emisingi gy’okukkiriza.
Enkodi, okukuba ebisumuluzo, olukalala lwa UID, data ekyukakyuka oba okutabaganya database.
Omuwendo gwa prototype, okuteebereza buli mwaka, enteekateeka y’okuddamu okulagira n’ebyetaago by’okufuga enkyukakyuka.
Okupakinga, ebiwandiiko by’okukebera, omwalo gw’ogenda n’olunaku lwe basabye okubituusa.
Teesa ku Pulojekiti Yo eya HF RFID Inlay
Ye core sheet ekola card-manufacturing nga erimu chip ya 13.56MHz ne antenna munda mu layers za pulasitiika. Ekolebwako laminated ne printed cores ne overlays okufulumya kaadi eziwedde ezitaliiko contactless.
Nedda.Prelam ye layeri ekola ey’omu makkati. Kaadi eziwedde zeetaaga okukuba ebitabo ebirala, okubibikka, okuzisiiga, okunyogoza, okukuba ebikonde n’okulongoosa oba okuwandiika mu ngeri ey’okwesalirawo.
Pulojekiti ziyinza okukozesa chips ezikwatagana ne ISO/IEC 14443 Type A, Type B, ISO/IEC 15693 oba NFC Forum. Protocol entuufu esinziira ku IC n'enkola y'omusomi erongooseddwa.
Nedda.Zi famire z’ebintu ez’enjawulo nga zirina protocols ez’enjawulo, memory, commands, security ne applications. Kakasa chip entuufu n'omusomi nga tonnalagira.
Enkola ng’ezo ezikwatagana ne 1K ez’edda zisobola okuteesebwako. Waayo ekyetaagisa ekituufu ekya chip ne sampuli y’omusomi, kubanga omukozi, UID, okukwatagana kw’ekijjukizo n’okukakasa kulina okukakasibwa.
Kisigala nga kikwatagana ku nkola ez’edda eziteekeddwawo, naye pulojekiti ez’omulembe ezirina obukuumi zirina okwekenneenya enkola endala eziriwo kati nga MIFARE DESFire oba MIFARE Plus okusinziira ku nsengeka y’enkola.
NTAG 213, 215 oba 216 ne chips endala ezikwatagana ne NFC Forum ze zitera okukozesebwa. Londa model okuva mu DEF memory eyeetaagisa, okukwatagana kw’essimu n’ebintu eby’obukuumi.
Chip ey’obukuumi ey’enkola nnyingi nga MIFARE DESFire eyinza okuba entuufu, naye obuyambi bw’omusomi, okuddukanya ebisumuluzo, okukakasa, fayiro z’enkola ne pulogulaamu birina okukakasibwa.
ISO/IEC 15693 ekozesebwa ku nkola za kaadi eziriraanyewo nga omusomi, obunene bwa antenna n’obuwanvu bw’okuyunga ekigendererwa byawukana ku nkola za kaadi eziriraanyewo nga zeesigamiziddwa ku ISO/IEC 14443.
Ebintu ebitera okukozesebwa mulimu 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ne 4 × 10. Ensengeka ez’enjawulo zisobola okukolebwa okuva mu kifaananyi ky’omuguzi eky’okusiiga n’okukuba ebikonde.
Omuko gw’ebintu ebiriwo kati gujuliza nga 0.45 ± 0.02mm ku nsengekera za HF ezirondeddwa. Obugumu obusembayo businziira ku chip, antenna, material, card stack ne local chip-zone requirements.
Yee. Waayo target finished-card thickness, overlay ne printed-core gauges, chip package n’enkola ya lamination olwo stack enzijuvu esobole okubalirirwa.
Yee. Geometry ya antenna esobola okukolebwa okwetoloola capacitance ya chip, size ya card, reader, target performance, chip position ne cutting clearances.
Embedded copper-wire ne etched-aluminum options zisobola okuteesebwako. Enzimba esinga obulungi esinziira ku bunene, obuziyiza, obuwanvu, okukwatagana, dizayini ya kaadi ne RF target.
Tewali bbanga lya bonna. Kisinziira ku chip, antenna, reader, card stack, orientation n’obutonde. Lambulula ekisoma ekigezo n’ebanga erisinga obutono erikola.
Kiyinza okukozesebwa oluvannyuma lw’okukebera RF. Ekipande ekinene eky’ekyuma oba yinki etambuza okumpi ne antenna eyinza okulongoosa oba okukuuma ensengekera etaliiko kukwatagana.
Ensengekera z’ebintu ebirala zisobola okwekenneenya, naye okukendeera, okusiba, ebbugumu ly’okusiba, RF tuning n’obuwangaazi bwa kaadi ewedde birina okukakasibwa okwawukana.
Prelam mu budde obutuufu eweebwa nga blank functional core. Okukuba ebitabo kutera okukozesebwa ku mpapula z’omusingi ez’enjawulo, wadde ng’okuzimba okukwata ku pulojekiti kuyinza okuteesebwako.
Tewali mbeera ya bonna esaana kufulumizibwa ku buli nsengeka. Okukulaakulanya ebbugumu, puleesa, okubeera n’okunyogoga okwetoloola okuzimba kwa PVC entuufu, okubikka, yinki, chip ne antenna.
Kozesa okupakinga kwa chip okukwatagana, obuwanvu bw’ekitundu obufugibwa, obubaawo obuyonjo, puleesa ekwatagana, enzirukanya y’ebbugumu ekkiriziddwa n’okugezesa amasannyalaze nga tonnaba kukola lamination n’oluvannyuma lw’okukola lamination.
Okugezesebwa kw’amasannyalaze mu bujjuvu kuyinza okulambikibwa. Endagaano y’okugula erina okunnyonnyola ebiragiro ki ebikeberebwa ku buli kifo n’ebigezo ki ebizikiriza oba eby’ebipimo ebikozesebwa okutwala sampuli.
Okusoma UID, okuwandiika enkodi mu jjukira, okuwandiika NDEF oba okulongoosa enkola bisobola okuteesebwako. Empeereza ezirina ebisumuluzo ebikuumibwa zeetaaga ensengeka efugibwa ey’enjawulo.
Dizayini za hybrid zisobola okukolebwa nga ebintu eby’enjawulo. Zeetaaga ensengeka za antenna ezeetongodde, okuteekateeka obuwanvu, okugezesa abasomi n’emiwendo.
Yee. Enkola esinga okwettanirwa kwe kugezesa prelam, okukola laminate ku card stack enzijuvu, punch cards n’okukakasa RF, mechanical ne personalization performance.
MOQ esinziira ku chip okubeerawo, custom antenna tooling, layout, material, obuwanvu, test program, encoding n’okumanya oba design standard ekkiriziddwa esobola okukozesebwa.
Waayo chip entuufu, omusomi, protocol, layout, sheet size, card drawing, obuwanvu, antenna target, final card stack, ebigezo, obungi, okupakinga n'ekifo w'ogenda.
Tuukirira Wallis Plastic okufuna empapula z’okuyingiza 13.56MHz HF RFID PVC prelam ezikoleddwa ku mutindo okusobola okutuuka, ID, wooteeri, obwammemba, entambula, NFC n’okukola smart-card. Ttiimu yaffe ewagira okulonda chip, okukola antenna, ensengeka ya sheet, RF tuning, okugezesa lamination, okugezesa amasannyalaze, encoding, omutindo specifications n'ekkolero-direct B2B supply.
