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Iphepha lokwenziwa le-Wallis elimhlophe le-Teslin lisekela i-ID elayiniwe, ubulungu kanye nokukhiqizwa kwekhadi le-RFID kumageji angu-0.178mm no-0.254mm, ngezivivinyo zokuphrinta, ukusikwa ngokwezifiso, amasampula nokunikezwa kwenqwaba ye-B2B.
impahla yekhadi
WALLIS
| Impahla: | |
|---|---|
| Ubukhulu: | |
| Uhlobo Lokuphrinta: | |
| Ubuningi: | |
-Wallis elingu-0.178mm kanye ne-0.254mm elimhlophe le-Teslin Iphepha lokwenziwa le lihlinzekwa amakhadi omazisi alamiwe, amakhadi obulungu, imininingwane yokufinyelela, amakhadi okhiye behhotela, amakhadi e-RFID, amabheji omcimbi nezinye izinhlelo zamakhadi eziphrintiwe. I-substrate ye-microporous yamukela uyinki, i-toner, i-adhesive kanye ne-laminate esakhiweni sayo, isiza abakhiqizi bamakhadi ukuba bathole ukuphrinta okuqinile kanye nokubopha okuqinile kwezingqimba.
Amageji amabili ahambisana nefomethi evamile ye-substrate engu-7 mil kanye ne-10 mil. Ubukhulu kufanele bukhethwe njengengxenye yokwakhiwa kwekhadi eliphelele esikhundleni sohlobo lwekhadi lodwa. Ukuphrinta ohlangothini olulodwa noma zombili, ukujiya kwembondela, inlay ye-RFID, umugqa kazibuthe, okunamathelayo, ukucindezela kwe-lamination kanye nogqinsi lwekhadi eliqediwe kufanele konke kufakwe ekucacisweni.
I-Wallis isekela abathengi be-B2B ngamashidi esampula, ukusikwa ngokwezifiso, izivivinyo zokuphrinta, ukuhlolwa kwe-lamination, ukubuyekezwa kwesakhiwo samakhadi kanye nokupakishwa kwamanye amazwe. Abathengi kufanele baqinisekise izinga eliqondile le-Teslin, umkhiqizi, ukubekezelela ukujiya, isimo esingaphezulu kanye nemibhalo yokuthobela imithetho ngaphambi kokugunyaza ukukhiqizwa ngobuningi.
| Uhlobo Lomkhiqizo | I-substrate emhlophe ye-microporous synthetic-paper yamakhadi aphrintiwe nalaminethiwe |
| Izinketho zokuqina | 0.178mm / 178μm / 7 mil kanye 0.254mm / 254μm / 10 mil |
| Izindlela Zokuphrinta | I-offset, isikrini sikasilika kanye nokuphrinta kwedijithali; izinqubo ezengeziwe zidinga izinga kanye nokuhlolwa kwemishini |
| Izicelo Zamakhadi | I-ID, ubulungu, ukwethembeka, ukhiye wehhotela, ukufinyelela, umcimbi, ukunakekelwa kwezempilo namakhadi e-RFID akhethiwe |
| Izinketho Zokuhlinzeka | Amashidi ajwayelekile noma asikwe ngokwezifiso, ukupakishwa kwangaphakathi okuvikelwe, amabhokisi namaphalethi okuthekelisa |
| Izinsizakalo ze-B2B | Amasampula, iziqu zokuphrinta, izivivinyo ze-lamination, ukubuyekezwa kwesakhiwo se-RFID, ukuhlelwa kwe-QC kanye nokunikezwa kwenqwaba |
Cela amasampula e-Teslin Card Substrate
I-Teslin substrate iyi-microporous, i-polyolefin-based synthetic material equkethe ingxenye ephezulu yesigcwalisi esingaphili kanye nevolumu yomoya yangaphakathi. Ngokungafani neshidi lepulasitiki eliminyene, ukwakheka kwayo okunezimbotshana kudonsa oyinki, amathoni, okunamathelisa kanye ne-laminate encibilikisiwe, okwenza izibopho zemishini ezixhumene ngaphakathi kwe-substrate.
Uyinki ne-toner kungangena endaweni engaphezulu kunokuba kuhlale kuphela njengongqimba olungaphezulu olukhiphekayo. Ngesikhathi sokucwala, i-laminate ehambisanayo noma okunamathelayo kugelezela ezimbotsheni, kusize ukuvikela umbhalo ophrintiwe, izithombe, amakhodi e-QR namabhakhodi ekuhutsheni noma ukuzama ukuhlukaniswa ungqimba.
Isakhiwo esicindezelayo singanciphisa imithende kazibuthe, izimpondo, ama-chips nezinye izinto ezishumekiwe. Lokhu akusiqedi isidingo sobunjiniyela be-inlay: ukujiya kwengxenye, ukwakheka kwe-cavity, ukusatshalaliswa kwengcindezi nokuhlola okuphindaphindwayo okuguquguqukayo kuhlala kubalulekile.
Ukuvikeleka kwekhadi kuncike ekwakhiweni okuphelele, okuhlanganisa umsebenzi wobuciko olawulwayo, idatha eguquguqukayo, izici ze-holographic, oyinki be-UV, imbondela, ama-chips, imigqa kazibuthe nezinqubo zokukhishwa. I-substrate emhlophe evamile akufanele ichazwe ngokuthi iqukethe ama-watermark noma izici ezifihliwe ngaphandle uma izinga eliqondile linalezo zici ezakhelwe ngaphakathi.
I-White Microporous Card Substrate
Ishidi Eliphrintekayo nelinobungane
Kokubili ukuqina kungaphrintwa ohlangothini olulodwa noma zombili. Ukukhetha okulungile kuncike ekunikeleni kwe-substrate edingekayo ekujikeni kwengqikithi yamakhadi, ukuqina, ukugoba, isitaki se-lamination namafilimu ayimbondela atholakalayo—hhayi nje ukuthi umsebenzi wobuciko unohlangothi olulodwa noma olukabili.
| Isici Sokukhetha | 0.178mm / 7 mil | 0.254mm / 10 mil |
|---|---|---|
| Umnikelo we-substrate | Umnikelo ophansi kubukhulu bekhadi eliphelele; ishiya isikhala esengeziwe sembondela noma izendlalelo ezengeziwe | Umnikelo ophakeme ekugqineni okuphelele kanye ne-cushioning |
| Ukuvumelana nezimo | Izimo More ngaphambi lamination | Ukuzizwa okuningi okunamandla ngaphambi kwe-lamination |
| Ukusetshenziswa Okujwayelekile Kwephrojekthi | Amakhadi ane-laminated emincane emincane, amabheji, amathegi nezakhiwo ezisebenzisa ukumbondelana okukhulu | Ama-cores asindayo, ama-cushion athuthukisiwe kanye nezakhiwo kusetshenziswa ukumbondelana okuzacile |
| Isakhiwo se-RFID / Chip | Iwusizo lapho inlay nezimbondela sezivele zisebenzisa ukujiya okukhulu | Ingase inikeze ukulondeka okwengeziwe, kodwa isitaki esiphelele nokucindezela kufanele kubalwe kabusha |
| Indlela Yokugunyaza | Phrinta, laminate, isimo futhi ulinganise amasampula aqediwe | Phrinta, laminate, isimo futhi ulinganise amasampula aqediwe |
Izinketho ze-7 Mil kanye ne-10 Mil Ukuqina
Ikhadi likamazisi elinomhlwenga liwuhlelo lwe-substrate, ukuphrinta, ukumbondela, okunamathelayo kanye nezingxenye ze-electronic ozikhethela zona. Ugqinsi oluqediwe kufanele lubalwe kusukela kuso sonke isitaki futhi luqinisekiswe ngemva kokuba ikhadi selipholile futhi lifakwe isimo. Ukuqina
| Kwengxenye Yekhadi | Nokucatshangelwa Kwenqubo |
|---|---|
| I-Teslin Print Core | Sebenzisa 0.178mm noma 0.254mm ngokuya isitaki esigunyaziwe kanye cushioning edingekayo |
| Imbondela yangaphambili nangemuva | Igeji yembondela, okunamathelayo nokuqedwa kwangaphezulu kunquma ukuvikela kanye nomuzwa wokugcina wekhadi |
| I-Ink / Toner ephrintiwe | Ukumbozwa okuqinile okuqinile kungathinta umswakama, ukuvinjwa, i-lamination kanye nebhalansi ye-dimensional |
| I-RFID Inlay noma i-Chip | Faka i-antenna, i-chip bump, i-adhesive nanoma yisiphi isikhala noma izendlalelo ze-spacer |
| I-Magnetic Stripe / Hologram | Qinisekisa ikhefu lomugqa, ukuhambisana kwembondela kanye nombhalo wekhodi wangemuva kokucwebezela noma ukuhlolwa |
| Ikhadi eliphelile | Kala ukushuba, ukucaba, ubukhulu kanye nokusebenza ngemva kokupholisa nokubeka isimo |
I-ID, Amakhadi Okufinyelela kanye Nobulungu
Iqedile Izinhlelo Zekhadi Le-Laminated
Amabanga ahlukene e-Teslin enzelwe amasistimu wokuphrinta ahlukene. Abathengi akufanele bacabange ukuthi ishidi elilodwa elimhlophe lizokhiqiza umphumela ofanayo ku-offset, i-inkjet kadayi, i-inkjet ye-pigment, i-laser, i-Indigo, isikrini noma imishini yokudlulisa i-thermal. Ukufaneleka kwebanga eliqondile, iphrinta nesistimu kayinki kuyadingeka.
| Yenqubo Yokuphrinta B2B | Imfuneko Yokuqinisekisa |
|---|---|
| Ukuphrinta kwe-Offset | Ukusethwa kwe-inki, ukuminyana, ukucupha, ukomisa, izinga lempushana, ukuvinjwa nokumelana nokufakwa kwe-lamination |
| Ukuphrinta kwesikrini sikasilika | Ukujiya kwe-inki, ukuhambisana kwe-solvent, ukwelashwa, ukuguquguquka nokubopha kwesendlalelo |
| I-Digital Laser Printing | Izinga lokushisa le-Fuser, ukunamathela kwe-toner, ukuthuthwa kweshidi, ukulawula okumile kanye nokufaneleka kwemishini |
| Ukuphrinta kwe-Inkjet | Sebenzisa ibanga elihambisana ne-inkjet; udayi wokuhlola noma uyinki wombala, isikhathi esomile, ukumelana namanzi kanye nephrofayili yombala |
| HP Indigo / Digital Press | Qinisekisa izinga elifanelekile, imfuneko yokuqala, izinga lokushisa lengubo kanye nokucwangciswa kwangemuva kokuphrinta |
| Iphrinta eqonde ekhadini | Imvamisa iphrinta ikhadi elingenalutho eliqediwe kuneshidi le-Teslin elixegayo; ukuhlolwa kuphela emva lamination ikhadi futhi isibhakela |
Ukuphrinta okunezinhlangothi ezimbili kulawulwa inqubo yokuphrinta, ibanga, ibhalansi yomswakama, ukumbozwa komsebenzi wobuciko nokubhaliswa—hhayi nje ngokusebenzisa impahla engu-0.254mm. Umklamo olinganiselayo wangaphambili nangemuva ungasiza futhi ekunciphiseni ama-curl ngemva kokuphrinta kanye ne-lamination.
Ihluzo ezilungisiwe zivame ukuphrintwa kumashidi angaphansi kwe-substrate ngaphambi kwe-lamination. Amagama aguquguqukayo, izithombe, izinombolo noma amabhakhodi angase engezwe ngesikhathi sokuphrinta amaphepha noma kamuva ekhadini eliqediwe, kuye ngokuqhutshwa komsebenzi okukhishwayo.
I-Offset, Isikrini kanye Nezilingo Zokuphrinta Kwedijithali
I-Teslin substrate ingaba i-platen-laminated noma i-roll-laminated namafilimu ahambisanayo. Ukubopha okuqinile kwenzeka lapho i-laminate noma i-adhesive igeleza esakhiweni se-microporous. Amasethingi okugcina kufanele asungulwe ngebanga langempela le-substrate, imbondela, uyinki, ukucindezela nesitaki sekhadi.
| Ukulawula Lamination | Kunconyiwe Practice |
|---|---|
| Isimo Somswakama | I-substrate yesimo kanye namashidi aphrintiwe ngaphambi kwe-lamination; impahla eyome kakhulu noma emanzi kakhulu inganciphisa ikhwalithi |
| Izinga lokushisa | Setha ngokusho komphakeli we-laminate kanye nezinga lokushisa eliqinisekisiwe le-substrate; unganciki kuphela ekuboniseni izinga lokushisa lomshini |
| Ingcindezi Nesikhathi | Nikeza ukugeleza okwanele kuzimbotshana ngaphandle kokuchoboza ama-chips, ukuhlanekezela umsebenzi wobuciko noma ukudala ukuminyanisa ngokweqile |
| Ukupholisa | Phola ngaphansi kwengcindezi elawulwayo ukuze kuthuthukiswe ukucaba nokuzinza kwe-dimensional |
| Amandla e-Peel | Hlola i-laminate eqediwe ngemuva kokubeka isimo kanye nokuchayeka kwemvelo |
| Ukuvala uphawu | Izakhiwo ezihambisanayo ze-Teslin laminate ngokuvamile zingasikwa ngemva kokucwenga ngaphandle komngcele ovaliwe ohlukile; qinisekisa ngefilimu ekhethiwe |
Amapharamitha okuqalisa ashicilelwe angasiza ezivivinyweni, kodwa ukudluliswa kokushisa kwangempela kuyahlukahluka ngepuleti, ukucindezela, ubude besitaki, ikhemistri embondelayo kanye nokufaka okuphrintiwe. Rekhoda izinga lokushisa elivunyiwe le-substrate, ingcindezi, indawo yokuhlala, ukupholisa kanye nokulungiselelwa kokukhipha ifilimu ukuze kuphinde kukhiqizwe.
Umswakama obanjiwe, ukushisa okunganele, i-laminate engahambelani, uyinki osindayo noma ukupholisa okungekuhle kungadala amabhamuza, isiliva, inkungu noma ukugoqa. Hlola kokubili ishidi namakhadi apuntshiwe ngemva kokulungiswa.
I-Teslin substrate ingasekela idizayini yokuqinisekisa enezingqimba, kodwa izici zokuphepha zidalwe uhlelo oluphelele lwamadokhumenti. Izinto ezijwayelekile zokuthengisa aziqukethe ngokuzenzakalelayo izinto ezifihlekile zezinga likahulumeni noma izici ze-forensic.
| Isici Sokuphepha | Isidingo Sokuhlanganisa |
|---|---|
| I-Microtext ne-Fine-Line Printing | Umsebenzi wobuciko onokucaca okuphezulu, ipuleti elilawulwayo noma imaging yedijithali kanye nokufundeka kwangemuva kokucwebezela |
| I-UV-Fluorescent Ink | Ukufaneleka komphakeli kayinki, isilawuli se-fluorescence sangemuva kanye nokuhlolwa ngemva kokucwenga |
| I-Holographic Overlay | Imbondela ebhalisiwe, ukuhambisana kwe-laminate, ukukhanya okubonakalayo kanye nokuziphatha kokuphazamisa |
| Ikhodi ye-QR nebhakhodi | Ukugqama kokuphrinta, ukunemba kwe-dimensional, ukufundeka kwesithwebuli nokuvikela ukuhuzuka |
| I-Substrate Yebanga Lokuphepha Ngokwezifiso | Omaka abashumekiwe bohlelo oluthize badinga iketango elivikelekile elivikelekile futhi alilingani neshidi elimhlophe elijwayelekile. |
Ukuvikeleka Kwezingqimba kanye Nokuvikelwa Kwe-Laminate
I-Teslin substrate ingakwazi ukugoba futhi ivikele i-RFID inlay, kodwa ukukhetha u-0.254mm esikhundleni sika-0.178mm akwenzi ngokuzenzakalelayo ikhadi lifanele izinto zikagesi ezithuthukisiwe. I-inlay, i-chip, i-antenna, i-adhesives, i-overlay kanye nomjikelezo wokugcoba kufanele kuklanywe njengesakhiwo esisodwa.
| Kwesici Sekhadi Elihlakaniphile | Kudingeka Ukuqinisekiswa |
|---|---|
| I-chip kanye nemvamisa | Qinisekisa imodeli ye-chip, imvamisa, iphrothokholi, inkumbulo nohlelo lokufunda |
| Ijometri ye-Antenna | Vikela imikhondo ye-antenna ngesikhathi sokucwenga, ukubhoboza kanye nokuqedwa konqenqema lwekhadi |
| Ubukhulu be-Inlay | Bala i-chip bump, i-antenna, inkampani yenethiwekhi kanye ne-adhesive ngaphakathi kwengqikithi yesitaki samakhadi |
| Ukusabalalisa Kwengcindezi | Sebenzisa ama-cushioning afanelekile kanye nezimbotshana ukuze ugweme ukulimala kwe-chip noma uthi |
| Ukuhlola Okusebenzayo | Hlola ukusebenza kokufunda/ukubhala ngaphambi kokucwenga, ngemva kokucwenga, ngemva kokushaya nangemva kokuguquguquka |
| Nezicelo Zokuqinisekisa Izicelo | Ezinconyiwe Ukugxila Kwephrojekthi |
|---|---|
| Amakhadi Omazisi Benkampani | Ikhwalithi yesithombe, idatha eguquguqukayo, ibhakhodi, ukuqina kwembondela kanye nokusetshenziswa kwebheji kwansuku zonke |
| Student and Faculty Cards | Ukuphrinta kwevolumu ephezulu, ukwenza kube ngokwakho, umsebenzi kazibuthe noma we-RFID kanye nokuguquguquka kwesikhathi eside |
| Amakhadi Obulungu Nobuqotho | Umbala webhrendi, ibhakhodi noma ukufundeka kwe-QR, ukuqina kwesikhwama semali kanye nokukhiqizwa kweshidi ngendlela eyongayo |
| Amakhadi Abalulekile Ehhotela | Ukuhambisana komugqa we-Magnetic noma i-RFID, ukuhlolwa kokukhiya nempilo yesevisi emfushane kuya kokumaphakathi |
| Omazisi bokunakekelwa kwezempilo kanye neziguli | Ukufaneleka, ukuchayeka kokuhlanza, ukuskena ibhakhodi nokukhishwa okulawulwayo |
| Amabheji omcimbi kanye nezivakashi | Ukuphrinta kwedijithali kwesikhashana, izikhala, amalanyard, amakhodi e-QR nokwenza kube ngokwakho okusheshayo |
| Nenqubo Yokwenza Okuthandwa Nguwe | Iphuzu Lokulawula Ikhwalithi |
|---|---|
| I-Guillotine Cutting | I-Squareness, ukubhaliswa okuphrintiwe, isimo se-blade nokucindezelwa kwesitaki |
| Ikhadi Punching / Die Cutting | Ubukhulu bekhadi, irediyasi yekhona, imiphetho ehlanzekile futhi akukho ukuhlukaniswa kwe-laminate |
| Slot kanye Hole Punching | Ukuma, ibanga eliwunqenqema, ukulayishwa kwelanyard nokumelana nokuqhekeka |
| I-Embossing noma i-Foil Stamping | Isakhiwo sekhadi eliqediwe, ukushisa, ingcindezi, ukunamathela kwe-foil nokufundeka |
| Ukwenza Okushisayo / Ukudlulisa Kabusha | Ukuthuthwa kwephrinta, ukudluliswa kweribhoni, amandla angaphezulu, ukuhlanekezela ukushisa nokuqina kwesithombe |
| Umbhalo Wekhodi Wamagnetic / Umbhalo Wekhodi we-RFID | Isivuno sombhalo wekhodi, ukusebenzisana komfundi nomsebenzi wangemva kokucindezeleka |
| Amandla | Okubalulekile | Ukucatshangelwa Okubalulekile |
|---|---|---|
| I-Teslin Substrate | Ukumuncwa kokuphrinta okuphezulu, ukubopha okuqinile kwe-laminate, ukuguquguquka nokuguquguquka kwe-electronics | Ngokuvamile isetshenziswa njengengqikithi ephrintiwe ngaphakathi kwesakhiwo se-laminate esikhundleni sekhadi eliphelile eliveziwe |
| I-PVC | Inqubo yekhadi emisiwe, ukunikezwa okubanzi nezindlela ezijwayelekile zokwenza kube ngokwakho | Iphrofayili yezemvelo ehlukile, ukumelana nokushisa okuphansi kanye nokugaywa kabusha okulinganiselwe ezimakethe eziningi |
| I-PETG | Ukuqina, ukucaca kanye nezicelo eziqinile zekhadi lezendlalelo eziningi | Iresiphi yokunamathela kukayinki kanye ne-lamination yehlukile kune-Teslin substrate enezimbotshana |
| I-Polycarbonate | Ukuqina okuphezulu, ukumelana nokushisa kanye nekhono lokwenza i-laser-personalization emabangeni azinikele | Izindleko eziphezulu zempahla nokukhiqiza; esetshenziselwa ukufuna iziqinisekiso zempilo ende |
| Zokuhlola Ama- | Ezinconyiwe |
|---|---|
| I-Material Identity | Umkhiqizi, ibanga, ikhodi yogqinsi, inqwaba nereferensi yesitifiketi |
| Ubukhulu kanye Nobukhulu | I-average gauge, ukubekezelelana, ubude beshidi, ububanzi, isikwele nokunemba kokusika |
| Ukubukeka | Ubumhlophe, umthunzi, amachashaza amnyama, ukungcola, imibimbi, amazinyo kanye nomonakalo onqenqemeni |
| Ukucaba kanye Nomswakama | I-Curl, umnsalo, isimo sokugcina kanye nebhalansi yomswakama ngaphambi kokuphrinta kanye ne-lamination |
| Phrinta Ukufaneleka | Ukuminyana, ukunamathela, ukomisa, umbala, imininingwane yesithombe, ukufundeka kwebhakhodi nokuvinjwa |
| Isilingo se-Lamination | Amandla we-peel, amabhamuza, inkungu, ukuhlukaniswa konqenqema, ukugoqa nokuqina okuqediwe |
| Ukuhlolwa Kwekhadi Eliqedile | Ubukhulu, ukuguquguquka, ukuhuzuka, ukwenza kube ngokwakho, amandla wesikhala, umbhalo wekhodi nomsebenzi wokufunda |
| Ukupakisha kanye nokulandeleka | Isitaki esivikelekile, isibalo, ilebula yebhokisi, ukucushwa kwephalethi, inombolo yenkatho kanye nombiko wokuhlola |
I-Teslin substrate iyacindezelwa futhi kufanele ivikelwe ekushiseni, ekukhanyeni kwe-UV, ekungcoleni, ukungalingani komswakama kanye nokucindezela kwezitaki ngokweqile. Isitoreji esilungile sisiza ukugcina umbala, ukucaba, ukusebenza kokuphrinta namandla okukhanya.
Gcina impahla emboziwe endaweni ehlanzekile kude nentuthu evuthayo kanye nezinto ezingcolisayo zasendlini.
Vikela amashidi ekukhanyeni okuqondile kwe-UV namazinga okushisa angaphezu komkhawulo wesitoreji ogunyaziwe.
Gcina amashidi asikiwe flat endaweni eqinile, esekelwe.
Ungabeki imithwalo esindayo noma amaphalethi apakishwe kabili emakhathoni amashidi asikiwe.
Gwema ukubopha okuqinile okungaminyanisa emaphethelweni noma kumake isitaki seshidi.
Gcina amaphakethe asongwe kabusha ukuvikela uthuli, ukushintsha kombala nokushintsha komswakama.
Amashidi wesimo egumbini lokukhiqiza ngaphambi kokuphrinta noma ukucwiliswa lapho izimo ze-warehouse zihluka.
I-Wallis isekela abakhiqizi bamakhadi nabasabalalisi bezinto ezibonakalayo ngokutholakala kwe-substrate, ukusika amashidi ngokwezifiso, ukupakishwa okuvikelekile kanye nokuhlinzekwa kwekhadi lezinto ezibonakalayo. I-oda ngalinye kufanele lixhunywe nesampula elivunyiwe kanye nokucaciswa okubhaliwe okumboza ibanga, ukujiya, inqubo yokuphrinta, ukwakheka kwe-lamination kanye nezidingo zekhadi eliqediwe.
Ukucutshungulwa Kokubalulekile Kwekhadi Nokunikezwa Kokuthekelisa
Amageji wamakhadi amabili ajwayelekile: 0.178mm kanye nezinketho ezingu-0.254mm zezakhiwo zamakhadi anemibala ehlukene.
Usekelo lwenqubo yokuphrinta: I-Offset, isikrini sikasilika kanye nesivivinyo sokuphrinta sedijithali singahlanganiswa ngaphambi kokugunyazwa kwenqwaba.
Ukuthuthukiswa okugxile ku-Lamination: I-Substrate, imbondela, ingcina, izinga lokushisa nokuqina kwekhadi kungabuyekezwa njengohlelo olulodwa.
Umuzwa wekhadi le-RFID: Ubukhulu be-inlay, i-cushioning, ukuvikelwa kwe-chip nokuhlolwa komfundi kungafakwa ekuqinisekiseni isampula.
Ukusika nokupakisha ngokwezifiso: Ifomethi yeshidi, ukuvikelwa kwezitaki, amabhokisi namaphalethi kungavunyelaniswa nezidingo zokukhiqiza nokuthekelisa.
Isevisi ye-B2B eqondile efekthri: Ifanele izimboni zamakhadi, amaphrinta, iziguquli, izinkampani ze-RFID, abangenisi nabasabalalisi.
Isicelo sekhadi, impilo yesevisi elindelwe kanye nemakethe yendawo.
Ubukhulu obudingekayo: 0.178mm / 7 mil noma 0.254mm / 10 mill.
Ubude beshidi, ububanzi, ukubekezelelana, ubude beshidi kanye nobuningi.
Inqubo yokuphrinta, imodeli yephrinta, uyinki noma i-toner kanye nomsebenzi wobuciko onezinhlangothi ezimbili noma ezimbili.
Izinto zokumbondelana, ukujiya, ukuqeda, okokunamathelisa kanye nemishini yokulambisa.
Khomba ubukhulu bekhadi eliqediwe, ukujiya kanye nerediyasi yekhona.
I-RFID chip, i-antenna, inlay, umugqa kazibuthe, ihologram noma enye ingxenye.
Ukuphrinta kokuphepha, ibhakhodi, ikhodi ye-QR kanye nezidingo zokwenza kube ngokwakho.
Izitifiketi ezidingekayo, ukulandeleka kwezinto ezibonakalayo kanye nombiko wokuhlola.
Inani lesivivinyo, isibikezelo sonyaka, ichweba lendawo kanye nohlelo lokulethwa.
Xoxa ngephrojekthi yakho yekhadi le-Teslin
I-substrate engu-0.178mm ingu-7 mil, kuyilapho i-substrate engu-0.254mm ingu-10 mil. Ibanga eliwugqinsi lifaka isandla kakhulu ekujimeni kwekhadi eliphelele kanye nokugoba, kodwa kokubili kudinga ukuhlolwa esakhiweni esiphelele se-laminate.
Yebo. Ukuphrinta okunohlangothi olulodwa noma olukabili kuncike ebangeni le-substrate, inqubo yokuphrinta, isistimu kayinki, ibhalansi yomsebenzi wobuciko nokubhaliswa—hhayi nje ekugqimeni kweshidi.
Akukho ukukhetha kwendawo yonke. Bala i-substrate, izimbondela zangaphambili nangemuva, okunamathelayo, ukuphrinta nokufaka ozikhethela, bese u-laminate bese ukala ikhadi eliqediwe elinesimo.
I-substrate esekwe ku-polyolefin imelana namanzi, kodwa ukuqina kokuphrinta kuncike kuyinki eqondile, ibanga kanye ne-lamination. Ikhadi eliqediwe kufanele lihlolwe amanzi, umswakama kanye nokuchayeka kokuhlanza.
Sebenzisa ibanga le-Teslin elihambisana ne-inkjet futhi uhlole udayi othile noma uyinki we-pigment. Amamaki ajwayelekile kanye namamaki e-inkjet ahlanganisiwe angaziphatha ngendlela ehlukile ngesikhathi esomile, umbala nokumelana namanzi.
Amamaki afanelekile angaphrintwa nge-laser, kodwa izinga lokushisa le-fuser, ukuthuthwa kweshidi, ukunamathela kwe-toner kanye nokufaneleka kwephrinta kufanele kuhlolwe. Ungasebenzisi impahla engagunyazwanga okokusebenza.
Amaphrinta amaningi aqonde ekhadini aklanyelwe amakhadi angenalutho aphelile, hhayi amashidi e-substrate axegayo. Phrinta futhi laminate ishidi kuqala, shaya amakhadi, bese uhlola ukwenza kube ngokwakho ezikhaleni eziqediwe.
Ama-laminates amaningi ashisayo namafilimu anamathelayo angase asebenze, kodwa ukuhambisana kuncike ekushiseni kokuvula, ukugeleza, ukujiya kanye nezidingo zekhadi eliphelile. Gunyaza inhlanganisela eqondile ye-substrate nefilimu ngokuhlolwa kwekhasi.
Izakhiwo ze-Teslin ezakhiwe ngendlela efanele zingasikwa zibe yisimo esiqediwe ngaphandle komngcele ovaliwe ohlukile ngenxa yokuthi izibopho ze-laminate zingena ku-matrix enezimbotshana. Qinisekisa lokhu nge-laminate ekhethiwe kanye nenqubo.
Izimbangela ezingenzeka zihlanganisa umswakama owedlulele, ukushisa okunganele, umoya ovaleleke, uyinki osindayo, i-laminate engahambelani noma ukucindezela okunganele. Hlanganisa amashidi futhi uqinisekise izinga lokushisa langempela le-substrate.
Yebo. I-cushioning yayo ingasiza ekuvikeleni izinto zikagesi, kodwa i-chip, i-antenna, ukujiya kwe-inlay, okunamathelayo, ukucindezela nokusebenza kokufunda okuqediwe kufanele kuqinisekiswe.
Hhayi ngokuzenzakalelayo. I-substrate ewugqinsi ingase inikeze ukugoba okwengeziwe, kodwa futhi ishintsha ubukhulu bekhadi eliphelele nokusabalalisa kwengcindezi. Isakhiwo se-inlay esiphelele sinquma ukusebenza.
I-substrate emhlophe evamile ihlinzeka ngezinzuzo zokuphrinta kanye ne-lamination kodwa akufanele ichazwe njengequkethe izimpawu zokuphepha eziyimfihlo. Impahla yebanga lokuvikela eqondene nohlelo iwumkhiqizo olawulwa ohlukile.
Yebo. Ukumbondelana kwe-Holographic, oyinki be-UV, i-microtext nezinye izici zingahlanganiswa ngezinqubo ezihlukene zokuphrinta kanye ne-lamination. Ukubonakala kwawo nokuqina kwawo kufanele kuhlolwe ngemva kokukhiqizwa.
Ukusebenza kwemvelo kuncike ezintweni ezingavuthiwe, ukwakhiwa kwamakhadi, impilo yesevisi, ukukhiqiza, ezokuthutha kanye nemizila etholakalayo yokulahla. Gwema isimangalo esibanzi sokuphakama ngaphandle kokuhlolwa komjikelezo wokuphila okuchaziwe.
Ukugaywa kabusha kuncike eqoqweni lendawo kanye nesakhiwo sekhadi eliphelele. Ama-laminates, oyinki, imigqa kazibuthe, ama-chips kanye nezimpondo kungadinga ukuhlukaniswa okukhethekile noma ukulahlwa.
Gcina amashidi emboziwe, ayisicaba, omile futhi evikelekile ekukhanyeni kwe-UV, ukushisa, intuthu, uthuli kanye nokucindezela kwezitaki ngokweqile. Zibeke esimweni ngaphambi kokunyathelisa noma i-lamination.
Ukusika ngokwezifiso kungaxoxwa ngokusho kwesakhiwo sokuphrinta, ipuleti le-lamination, ukubekwa kwekhadi, ukubekezelelana, ubuningi kanye nezidingo zokupakisha.
Yebo. Phrinta, laminate, uphole, ubeke isimo, shaya futhi wenze amasampula amakhadi aqondene nawe usebenzisa okokusebenza okuhlosiwe ngaphambi kokugunyaza okokusebenza.
I-MOQ incike ebangeni, ukujiya, usayizi weshidi, ukusikwa ngokwezifiso, iziqu zokuphrinta, ukupakisha kanye nesibikezelo sonyaka.
Nikeza ukushuba, usayizi weshidi, inqubo yokuphrinta, imbondela, okokusebenza kokucwenga, ukujiya kwekhadi eliphelile, izidingo ze-RFID noma umugqa, inani, indawo kanye nesheduli yokulethwa.
Xhumana ne-Wallis Plastic ukuze uthole u-0.178mm kanye nephepha lokwenziwa le-Teslin elimhlophe elingu-0.254mm ukuze uthole i-ID ene-laminated, ubulungu, ukhiye wehhotela, umcimbi kanye namaphrojekthi wekhadi le-RFID. Ithimba lethu lisekela ukukhethwa kokuqina, ukusika ngokwezifiso, ukuphrinta nokufaka i-lamination, ukubuyekezwa kwesakhiwo samakhadi, ukucaciswa kwekhwalithi kanye nokunikezwa kwe-B2B eqondile efekthri.
I-Teslin inguphawu lokuthengisa olubhalisiwe lwe-PPG Industries Ohio, Inc. Qinisekisa izinga eliqondile elinikeziwe, umthombo kanye nemibhalo ye-oda ngalinye.
