Nhwɛsoɔ: 0 Ɔkyerɛwfoɔ: Site Editor Bere a wɔde tintimii: 2025-08-11 Mfiase: Beaeɛ
Polycarbonate a wɔde kata so yɛ tweatibo ade wɔ nnɛyi adwumayɛ mu — ɛma ɛyɛ soronko a ɛtra hɔ kyɛ, emu da hɔ, na ɛko tia ɔsɛe ne tetew. Efi ID nkrataa a ahobammɔ wom so kosi adansi ho mfonini ne ɛlɛtrɔnik mfiri a ɛwɔ nkuku mu (IME) so no , polycarbonate sini ne nneɛma a wɔde kata so di dwuma titiriw wɔ nneɛma a wɔbɔ ho ban, siesie, na ɛtrɛw mu.
Polycarbonate (PC) yɛ mfiridwuma mu thermoplastic a ɛnyɛ nsɛso a wonim no sɛ:
High impact resistance — ɛkɔ mpɛn 250 a ɛyɛ den sen ahwehwɛ.
Optical clarity — hann a ɛkyɛn so ma ahobammɔ nkataso ne displays.
Ɔhyew a wotumi gyina ano — kɔ so som ɔhyew a ɛkɔ ~ 140°C.
Dimensional stability — ko tia warping wɔ ɔhyew ne nhyɛso ase.
Polycarbonate overlays yɛ PC nkratafa a ɛyɛ tratraa anaa sini a wɔde di dwuma sɛ ɔfasu ahobammɔ layers anaasɛ sɛ integral layers wɔ laminated products , titiriw wɔ ahobammɔ ID cards ne mfiridwuma mfonini ahorow mu.
Monolithic films : Sini ahorow a emu da hɔ anaasɛ wɔde tinted ayɛ a ɛwɔ ɔfa biako.
Coated overlays : Nneɛma a wɔde akata so denneennen anaasɛ ɛmma hann ntumi nkɔ so ma scratch/UV resistance.
Metallized films : PC films a ɛwɔ dade a wɔde asiesie anaasɛ ɛyɛ adwuma.
Security-grade overlays : Sini ahorow a ɛwɔ ntoatoaso pii a wɔde nneɛma te sɛ holograms ahyɛ mu.
Saa sini ahorow a ɛyɛ mmerɛw yi bɔ nneɛma a wɔatintim ho ban fi nsensanee, UV a ɛbɛsɛe, ne nnuru a ɛbɛda adi ho. Ɛtaa ba wɔ:
ID nkrataa a wɔde hyɛ nkurɔfo nsa
Nsɛnkyerɛnne a wɔde hyɛ mu
Ɛlektrɔnik mfiri a wɔde kyerɛ nneɛma
Nsɛmfua titiriw a wɔde asi wɔn ani so: polycarbonate a wɔde kata so, polycarbonate a wɔde kata so, polycarbonate ahobammɔ film.
Wɔde di dwuma wɔ multi-layer card adansi mu:
Nneɛma a wɔde laser yɛ agyiraehyɛde
Nneɛma a ɛda adi sɛ wɔyɛ nsakrae
Fusion-bonded to card cores ma ɛtra hɔ daa
Nsɛmfua titiriw a wɔde asi wɔn ani so: pc card film, pc lamination.
Polycarbonate 'krataa' yɛ PC sini a ɛyɛ mmerɛw, a wotumi tintim a wɔde di dwuma wɔ ahobammɔ nkrataa titiriw ne niche mfiridwuma mu dwumadie mu.
Asɛmfua titiriw a wɔde asi wɔn ani so: polycarbonate krataa.
Polycarbonate a wɔde kata so no na ɛyɛ akyi ahobammɔ a ɛwɔ ID ne akwantu tumi krataa pii a aban de ma mu.
Mfasoɔ:
High tamper resistance bere a fusion-laminated.
Laser engraving a ɛne ne ho hyia.
Ɔsom nkwa tenten (10+ mfe a enni peeling).
Nsɛmfua titiriw a wɔde di dwuma: pc lamination, pc kaad film, polycarbonate a wɔde kata so.
Polycarbonate overlays yɛ adwuma sen PVC ne PETG wɔ impact resistance — ɛho hia ma ahobammɔ nkataso ne ahobammɔ nkrataa.
Ɛma ne nsusuwii ne nea emu da hɔ kɔ so wɔ mmeae a ɛhɔ yɛ hyew kɛse (kar, abɔnten).
PC sini ahorow a wɔde kata so denneennen tumi gyina Taber abrasion cycle mpempem pii ano a ɛnsɛe a wotumi hu.
Wɔ ID akwammisa ho no:
Ɛsɛ sɛ mmɔden a wɔbɔ sɛ wɔbɛsakra nneɛma no da ɔsɛe a wotumi hu adi.
Ɛsɛ sɛ fusion bonds ko tia delamination.
30–250 μm ma nneɛma a wɔde kata so
Gloss ma emu da hɔ
Matte/anti-glare ma displays ne abɔnten akenkan.
Screen printing, offset, ne digital printing betumi aba denam ink nhyehyɛe a ɛteɛ so.
Wɔ IME fam no: hwɛ hu sɛ ɛne conductive inks hyia.
Pros : Higher impact resistance, ɔhyew a ɛyɛ papa a ɛyɛ den, lamination a ahobammɔ wom kɛse.
Cons : Ɛka a ɛkɔ soro, hwehwɛ sɛ ɔhyew a ɛkorɔn a wɔde yɛ adwuma.
Mfaso : Ɛyɛ den, ɛko tia ɔhyew.
Cons : Less formable, ɛyɛ den kakra sɛ wobedi ho dwuma.
Polycarbonate a wɔde kata so yɛ ano aduru a wotumi de di dwuma pii ma nnwuma a ɛhwehwɛ sɛ ɛtra hɔ kyɛ, ahobammɔ, na emu da hɔ. Sɛ́ ebia wuhia ahobammɔ films ma ID cards , metallized finishes for electronics , anaasɛ specialty PC laminates for signage , polycarbonate de ahoɔden, processability, ne nkwa tenten a wɔaka abom a plastic dodow no ara nsɛ ma.
Worehwehwɛ obi a wotumi de ho to no so sɛ ɔde nneɛma bɛma?
Wɔ Shanghai Wallis Technology Co., Ltd. , yɛyɛ yɛn ho titiriw wɔ polycarbonate a ɛyɛ papa a wɔde kata so, PC lamination sini, ne PC nneɛma a wɔayɛ no sɛnea wɔpɛ mu.
Di yɛn nkitaho nnɛ na bisa nhwɛsode ahorow a wontua hwee, mfiridwuma ho datasheets, anaasɛ amanne kwan so asɛm a wɔayɛ ama wo application no.
