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kad we gɛt mɛtal
Wallis bin de tɔk bɔt am
| Kɔlɔ: | |
|---|---|
| Sayz: | |
| Matirial: | |
| Kwantiti: | |
Wallis kɔstɔm stenlɛs stiɛl mɛtal kad dɛn de mek fɔ B2B bayer dɛn we nid prɛmiɔm, durable ɛn ayli kɔstɔmayz ɔltɛrnativ to kɔvɛnshɔnal pepa ɔ plastic kad. Dɛn kin kɔnfigyut dɛn as ɛgzibit biznɛs kad, VIP mɛmbaship kad, lɔyalti kad, ɔtel kad, ivin inviteshɔn, brand prɛzɛnt kad ɛn NFC -ɛnibɛl dijital kɔntakt kad.
Di opshɔn dɛn we de inklud 304 ɔ 316 stenlɛs stiɛl, kɔstɔm tiknɛs, brɔsh ɔ miro finish, kemikal ɛtch, lɛsa engravin, prɛsishɔn kɔt-ɔut, kɔlɔ filin, UV printin, vɛriɔbul data, QR kɔd ɛn prɔjek-spɛsifi k NFC intagreshɔn. Matirial, finish, artwok ɛn funkshɔnal ficha dɛn fɔ apruv tru wan fizik sampul bifo bɔlk prodakshɔn.
| Paramita | Opshɔn dɛn we de |
|---|---|
| Tayp fɔ Prodakt | Mɛtal biznɛs kad, VIP mɛmbaship kad, lɔyalti kad, ɔtel kad, ivin kad, inviteshɔn kad, NFC dijital biznɛs kad ɔ kɔstɔm prɔmoshɔnal kad |
| Base Material | Stenlɛs stiɛl 304 ɔ 316; ɔltɛrnativ mɛtal ɔ kɔmpɔzit strɔkchɔ dɛn kin rivyu fɔ spɛshal prɔjek dɛn |
| Standart Sayz | Na lɛk 85,5 × 54 mm; kɔstɔm saiz ɛn shep dɛn we de afta dɛn dɔn rivyu di manufakchurabiliti |
| Tik we i tik | 0.30–1.00 mm opshɔn dɛn; fainal selekshɔn dipen pan kad wet, walet yus, etch dip, kɔt-ɔut ɛn ɛmbaded fɛnshɔn dɛn |
| Surface Finish na di wɔl | Brush, miro, mat, sandblast, frɔst ɔ ɔda tɛkstɔr dɛn we dɛn dɔn gri fɔ |
| Kɔlɔ Finish | Natural silva, blak, gold, ros gold, gɔnmɛtal ɔ kɔstɔm finish we de ɔnda pletin/kɔtin prɔses ɛn aprɔv kɔlɔ sampul |
| Di we aw dɛn de drɛs | Laser engraving, kemikal etch, etched kala fil, skrin printin, UV printin, embossing, debossing ɛn prɛsishɔn kɔt-ɔut |
| Pɔsin in yon | Nem, mɛmbaship nɔmba, siriɔs nɔmba, QR kɔd, barɔd ɛn ɔda vayriɔbul data |
| Opshɔn dɛn we yu go ebul fɔ du | NFC , projɛkt-spɛsifi k RFID , magnɛtik strɛp, sayn panɛl ɔ kɔmpɔzit mɛtal-plastik strɔkchɔ afta tɛknikal rivyu |
| Di we aw dɛn de pak di tin dɛn | Protektiv sliv, wan wan paus, gift bɔks, kad ɔlda, katon we gɛt lɛbl ɔ kɔstɔm rital pak |
| Fɔmat fɔ di Sapɔt | Finish kad dɛn we dɛn prodyuz to apruv artwok, sampul ɛn ɔda spɛsifikɛshɔn |
Kastom stenlɛs stiɛl biznɛs kad dɛn
Metal VIP Membaship Kad dɛn
Kastom mɛtal kad na wan branding ɔ mɛmbaship prodak we dɔn dɔn we dɛn mek wit mɛtal sabstret we dɛn kɔt kɔrɛkt wan pas kɔmɔn pepabɔd ɔ plastic. Di kad artwok kin bi tru surface engraving, kemikal etch, printin, pletin, kala filin ɛn opin kɔt-ɔut.
Fɔ biznɛs ɛn mɛmbaship program, di matirial we dɛn kin pik na wan pat nɔmɔ pan di spɛsifikɛshɔn. Di wan dɛn we de bay fɔ difayn bak di tik, edj tritmɛnt, finish dairekshɔn, engraving ɔ etch dip, variebul data, pak ɛn ɛni ilɛktronik ficha bifo dɛn apruv prodakshɔn.
Sɔlid stenlɛs stiɛl kad dɛn de gi kɔntinyu mɛtal fil ɛn dɛn fayn fɔ engravin, ɛtch ɛn dɛkɔretiv kɔt-ɔut. Metal-kɔmpɔzit kad dɛn kin jɔyn wan mɛtal fes ɔ freym wit plastic, adeziv, print ɔ ilɛktronik layers. Kɔmpɔzit kɔnstrɔkshɔn kin nid we wan prɔjek gɛt ilɛktronik tin dɛn we nɔ gɛt kɔntakt, magnɛtik kɔmpɔnɛnt dɛn, foto dɛn we dɛn print ɔ ɔda tin dɛn we nɔ go ebul fɔ wok fayn fayn wan na mɛtal bɔdi we nɔ gɛt ɛnitin fɔ ambɔg am.
| Opshɔn | Tipik B2B Sɛlɛkshɔn Lɔjik | Aytem dɛn fɔ Kɔnfɔm |
|---|---|---|
| 304 Stenlɛs Stiɛl | Jɛnɛral-pɔpɔs mɛtal biznɛs kad, mɛmbaship kad ɛn prɔmoshɔnal kad | Finish, pletin sistem, korɛshɔn ɛkspɛkteshɔn ɛn indo/ɔda yus |
| 316 Stenlɛs Stiɛl | Projek dɛm we de aks fɔ difrɛn stenlɛs alɔy ɔ ay envayrɔmɛnt ɛksplɔshɔn spɛsifikɛshɔn | Aktual alɔy sɛtifiket rikwaymɛnt, finish kɔmpitibliti ɛn kɔst target |
| 0,30–0,40 mm | Slimmer han fil, laytwɛt distribyushɔn ɛn dizayn dɛn we nɔ gɛt dip strɔkchɔral ficha dɛn | Flatnɛs, shap kɔt-ɔut risk ɛn akseptabl rigiditi |
| 0,50 mm | Balans choice fɔ bɔku biznɛs-kad ɛn mɛmbaship-kad prɔjek dɛn | Wallet yus, edj finish, engraving ɛn etch rikwaymɛnt dɛn |
| 0,80–1,00 mm | Hevi prɛmiɔm prɛzɛntɛnshɔn, dip ficha ɔ spɛshal prɔdak kɔnsɛpt | Weyt, pak, kad-hɔlda kɔmpatibiliti ɛn mashin fisibiliti |
Tik fɔ pik agens di las dizayn pas fɔ pik di we aw i tan nɔmɔ. Big olo eria, smɔl brij, shap kɔna, dip etch ɛn ɛmbaded NFC kɔmpɔnɛnt dɛn kin chenj di tik ɛn strɔkchɔral sɔpɔt we dɛn nid.
| Prɔses | Visual ɔ Fɔnshɔnal Rizɔlt | Ɛnjinia Kɔnsidɛreshɔn |
|---|---|---|
| Laser Engraving we dɛn kin yuz fɔ mek tin dɛn | Pɔrmanent layn at, tɛks, siriɔs nɔmba, nem ɛn QR-kɔd mak | Kɔntrast kin difrɛn wit alɔy ɛn finish; kɔnfɔm di minim layn wit ɛn skan pefɔmɛns |
| Kεmikכl Etching | Logo dɛn we dɛn put insay, tɛkstɔr dɛn, taktil ditil dɛn ɛn etched-thru opin eria dɛn | Etching dip, brij width, edj kwaliti ɛn artwok jɔyometri nid prodakshɔn rivyu |
| Etched Kɔlɔ Fil | Kɔlɔ we dɛn put insay di say dɛn we dɛn dɔn put insay fɔ mek di logo kɔntrast strɔng | Kɔlɔ tolɛreshɔn, fil kɔvarej ɛn adheshon fɔ apruv pan wan fizik sampul |
| Fɔ Print na Skrin | Sɔlid spɔt kɔlɔ dɛn, aykɔn dɛn, tɛks ɛn eria dɛn we gɛt brand | Ink, surface treatment, curing ɛn abrasion resistance fɔ mach di finish we yu dɔn pik |
| UV Fɔ print | Imej dɛn we gɛt bɔku kɔlɔ, gradient ɛn ditayla grafik ɛlimɛnt dɛn | Surface pripia, wayt ink, adheshon ɛn skrach tɛst na prɔjek-spɛsifi k |
| Prɛsishɔn Kɔt-Aut | Opin logo, winda, pɔtn ɛn kɔstɔm silhouette | Minimum wɛb wit, kɔna rayus, difɔmeshɔn ɛn hanlin sef fɔ chɛk |
| Embossing / Debossing we yu de yuz | Raised or recessed tactile elements usay tul ɛn kad strɔkchɔ alaw | Tul, mɛtal tik, rivas-sayd apinɛns ɛn flatnɛs fɔ kɔnfɔm |
Brush finish dɛn de gi wan dairekshɔn mɛtal gren, we miro finish dɛn de mek wan ay riflɛktiv apinɛns. Mat ɛn sandblast sɔfays dɛn de ridyus di riflɛkshɔn ɛn prodyuz wan sɔft vishɔnal tɛkstɔr. Di artwok dairekshɔn fɔ kɔdinɛt wit di brush dairekshɔn ɛn ɛnitin we dɛn engrav ɔ print.
Dɛn kin mek mɛtal kɔlɔ tru pletin, PVD-tayp kɔtin ɔ ɔda aprɔv sɔfays prɔses dipen pan di prɔjek. Di we aw di kɔlɔ de luk kin difrɛn wit di bays mɛtal, tɛkstɔr, di kɔtin batch ɛn di kɔndishɔn fɔ si, so di fizik sampul we dɛn dɔn gri fɔ yuz as di kɔlɔ rɛfrɛns fɔ bɔku inspekshɔn.
Ɔl di dizayn dɛn fɔ gɛt ed ɛn kɔna spɛsifikɛshɔn. Deburring, polishing, kona radius ɛn cut-out finishing de ɛp fɔ ridyus shap pɔynt dɛn ɛn impruv hanlin. Shep dɛn we nɔ kɔmɔn ɛn we dɛn kɔt smɔl, nid fɔ mek dɛn rivyu di we aw dɛn kin mek dɛn bifo dɛn mek dɛn tul ɔ prodyuz.
Wan nɔmal NFC ɛntena we dɛn put dairekt agens wan sɔlid mɛtal kad kin dɔn rili ridyus ɔ nɔ de rid pefɔmɛns. So wan NFC mɛtal kad nid fɔ gɛt dizayn ɛntena ples, aysolɛshɔn ɔ fɛrayt layt, fayn rɛs/windo ɔ kɔmpɔzit strɔkchɔ. Di aktif tap eria kin bi lokaliz pas fɔ kɔba di wan ol kad.
Di wan dɛn we de bay fɔ spɛsifa di chip mɔdel, 13.56MHz protɔkɔl, ɛnkɔd kɔntinyu, rayt-lɔk stetɔs, target smartfon ɔ rida ɛn di tap pozishɔn we dɛn nid. NFC dijital biznɛs-kad projɛkt dɛn kin yuz URL ɔ profayl link, we akses-kɔntrol projɛkt dɛn nid fɔ rivyu sɛpret sistɛm kɔmpitibliti.
Yu kin rayt ɔ print QR kɔd, mɛmbaship ID, siriɔs nɔmba ɛn nem dɛn wan bay wan. Bifo dɛn prodyuz bɔku bɔku wan, di pɔsin we bay fɔ gri fɔ di data fayl fɔmat, rikodɔ sikyud, dupliket-data lɔ dɛn, kɔd saiz, kɔntrast, skan distans ɛn verifyeshɔn we.
| Fɔnkshɔn Ficha | Infɔmeshɔn we dɛn nid frɔm di Baya | Rikɔmɛnd Valideshɔn |
|---|---|---|
| NFC Dijital Kad | Chip, URL/data, fon mɔdel, tap pozishɔn ɛn lɔk rikwaymɛnt | Rid ɛn rayt tɛst pan di divays dɛn we yu want fɔ yuz bifo ɛn afta yu dɔn |
| Akses-Kɔntrol RFID | Rida mɔdel, frikshɔn, protɔkɔl, UID/data ɛn sistɛm intagreta rikwaymɛnt dɛn | Fizik sampul tɛst na di aktual akses sistɛm |
| QR Kɔd | Destineshɔn, kɔd fɔmat, variebul-data fayl ɛn minim saiz | Skan verifyeshɔn wit bɔku fon ɛn layt kɔndishɔn |
| Magnɛtik Strayp we dɛn kɔl | Kos, trak fɔmat, ɛnkɔdin ɛn kad kɔnstrɔkshɔn | Rida tɛst ɛn adheshon/flatnɛs rivyu; kɔmpɔzit kɔnstrɔkshɔn kin nid fɔ de |
| Di Mɛmbaship Nɔmba | Nɔmba sikyud, font, pozishɔn ɛn dupliket-kɔntrol lɔ dɛn | 100% data kɔmpiashɔn agens di aprɔv sɔs fayl |
Kastom mɛtal biznɛs kad dɛn fayn fɔ prɛmiɔm savis provayda dɛn, ɛgzibitɔ dɛn, kɔnsultɛnt dɛn, disayna dɛn, rial-ɛstate tim dɛn, ɔspitul grup dɛn ɛn ɔda biznɛs dɛn we want fɔ yuz bak, tɔch brand prɛzɛntɛnshɔn.
Ɔtel, klab, rɛstɔrant, fitnɛs brand, rital program ɛn ivent ɔpreshɔn kin ad mɛmba nem, taya infɔmeshɔn, QR kɔd, siriɔs nɔmba ɔ wan kɔmpitabl ilɛktronik fɛnshɔn. Di kad spɛsifikɛshɔn fɔ sho aw di mɛmba dɛn go kɛr, skan ɛn yuz di kad.
Dɛn kin mek mɛtal kad dɛn bak as lanch inviteshɔn, prɛmiɔm vayrɔs, mɛmorial kad, sɛtifiket, kɔlektif pis ɔ branded gift wit wan wan pak.
Lagz Biznɛs Kad Dizayn dɛn
VIP ɛn Mɛmbaship Kad Dizayn dɛn
Dɛn kin pik wan ful-mɛtal kad fɔ mek i tan lɛk stenlɛs stiɛl we nɔ gɛt ɛnitin fɔ ambɔg am ɛn fɔ mek i gɛt wet we pɔsin kin tɔch. Wan kɔmpɔzit kad we gɛt mɛtal fes kin jɔyn mɛtal wit PVC , PETG , adeziv, layers we dɛn print ɔ ilɛktronik inlay. Kɔmpɔzit kɔnstrɔkshɔn kin gi mɔ fleksibiliti fɔ ful-kɔlɔ artwok, kɔntaktlɛs pɔfɔmɛnshɔn, sayn panɛl, magnɛtik strɛp ɔ kɔvɛnshɔnal kad pɔsnalayzeshɔn.
Di kɔrɛkt strɔkchɔ dipen pan di las kad wok. Di wan dɛn we de bay nɔ fɔ tink se ɔl di tin dɛn we dɛn rayt fɔ wan plastic smart kad, dɛn kin ad am dairekt to wan sɔlid stenlɛs stiɛl kad we dɛn nɔ ridizayn.
| Dizayn Aytem | Rikɔmɛnd B2B Sɔbmishɔn | Faktɔri Rivyu |
|---|---|---|
| Fayl we dɛn kɔl Atwok | Vektor AI, PDF, EPS ɔ SVG wit ɔtlayn font ɛn separet prodakshɔn layers | Sayz, blɔd, engraving, etch, kɔt-ɔut ɛn print layt chɛk |
| Ɛria dɛn we dɛn Etch | Fɔ no klia wan di rijyɔn dɛn we dɔn rɛs, we dɛn dɔn ɛch tru ɛn we ful-ɔp wit kɔlɔ | Minimum layn, dip, opin eria ɛn ed-distans rivyu |
| Di tin dɛn we dɛn kin kɔt | Gi klos vektɔ pat ɛn intended fayn shep | Brij wit, difɔmeshɔn risk, bur rimɔv ɛn strɔkchɔral stebiliti |
| Print Kɔlɔ dɛn | Pantone rɛfrɛns ɔ CMYK artwok plus wan fizik target usay kɔlɔ impɔtant | Wait ɔndaprint, adheshon, curing ɛn ɛkspɛkt kɔlɔ tolɛreshɔn |
| Data we kin chenj chenj | Struktrɔ sprɛdshit wit yunik rɛkɔd ID ɛn aprɔv data sikyud | Rikɔd kɔnt, dupliket, fil dɛn we nɔ de ɛn kɔd ridabiliti |
| NFC / RFID | Chip, protɔkɔl, ɛnkɔd data, rida/fon, target rid zon ɛn lɔk stet | Anti-mɛtal kɔnstrɔkshɔn ɛn aktual-divays pefɔmɛns tɛst |
Fɔ wan B2B ɔda, di kɔntrol rɛfrɛns we pɔsin kin abop pan pas ɔl na wan aprɔv fizik Golden Sampul togɛda wit wan spɛsifikɛshɔn we dɛn rayt. Dijital rɛnd nɔ kin fulɔp fɔ ripresent mɛtal riflɛktiviti, engravin dip, sɔfayz tɛkstɔr, pletin kɔlɔ, kad wet ɔ ed fil.
| Inspekshɔn Aytem | Wetin fɔ Chɛk | Aprɔval Rifrɛns |
|---|---|---|
| Matirial ɛn Tiknɛs | Spesifi k alɔy, gej, flatnɛs ɛn kad dimɛnshɔn dɛn | Ɔda spesifikeshɔn ɛn apruv sampul |
| Surface Finish na di wɔl | Brush dairekshɔn, glos, tɛkstɔr, skrat, finga prɛnt ɛn kɔtin yunifɔmiti | Golden Sample ɔnda gri fɔ layt |
| Engraving / Etchin we dɛn de kɔt | Pozishɔn, layn kwaliti, dip, legibiliti ɛn kɔva-ful kɔla | Approved prodakshɔn artwok ɛn sampul |
| Cut-Out ɛn Ɛj | Bur, shap poɛnt, kɔna rayus, difɔmeshɔn ɛn wik brij | Approved handling ɛn visual standad |
| Fɔ print | Rejista, kɔlɔ, adheshon, curing, skrat ɛn print we nɔ de | Aprɔv print sampul ɛn difayn tolɛreshɔn |
| Data we kin chenj chenj | Nem, siriɔs nɔmba, QR/barkɔd, dupliket ɛn rikodɔ sikyud | Kastamɔ data fayl ɛn verifyeshɔn ripɔt |
| NFC / RFID | Chip aydentiti, ɛnkɔd data, tap pozishɔn, rid distans ɛn lɔk stetɔs | Aprɔv rida ɔ smartfon tɛst prosidur |
| Di we aw dɛn de pak di tin dɛn | Protektiv film, sliv, bɔks, lɛbl, kwantiti ɛn abrashɔn protɛkshɔn | Approved pak spesifikeshɔn |
Kɔnfɛm if di prɔdak na biznɛs kad, mɛmbaship kad, lɔyalti kad, ivin inviteshɔn, NFC dijital kad ɔ ɔda kɔstɔm tin. Ɛksplen aw di pɔsin we gɛt am go kɛr ɛn yuz am.
Selekt di alɔy, tiknɛs, saiz, sɔfays tɛkstɔr, kɔlɔ finish, kɔna stayl ɛn pak kɔnsɛpt. Rifrɛns sɛmpul dɛn kin yusful we dɛn nid wan patikyula brush dairekshɔn ɔ mɛtal kɔlɔ.
Gi vektɔ artwok wit sɛpret layers fɔ engraving, etch, kɔt-thru eria, printin ɛn variebul data. NFC projɛkt dɛn fɔ inklud di chip ɛn divays rikwaymɛnt dɛn.
Rivyu di prodakshɔn pruf fɔ layout akkuracy, dɔn apruv wan fizik sampul fɔ finish, wet, ed tritmɛnt, kɔlɔ, ridabiliti ɛn funkshɔn pefɔmɛns.
Bɔlk prodakshɔn fɔ fala di Golden Sample we dɛn dɔn gri fɔ ɛn di spɛsifikɛshɔn we dɛn rayt, wit inspekshɔn we de pe atɛnshɔn pan di impɔtant vijual, dimɛnshɔnal, data ɛn fɛnshɔnal rikwaymɛnt dɛn.
Wallis de sɔpɔt B2B bayer dɛn wit matirial ɛn prɔses sɛlɛkshɔn, artwok rivyu, kɔstɔm finish, vɛriɔbul data, prɔjek-spɛsifi k smat ficha dɛn, sampul aprɔval ɛn ɛkspɔt pak. Di ɔbjɛktiv na fɔ kɔnvɔyt wan vijual kɔnsɛpt to wan spɛsifikɛshɔn we dɛn kin mek pas fɔ abop pan dijital mɔk-ap nɔmɔ.
Fɔ gɛt kɔrɛkt kot, gi di kad kwantiti, matirial, tik, dimɛnshɔn, finish, artwok prɔses, kɔlɔ, pɔsnalayzeshɔn, NFC / RFID rikwaymɛnt ɛn pak.
Duya gi di kwantiti, di kad dimɛnshɔn, matirial, tik, sɔfayz finish, mɛtal kɔlɔ, artwok prɔses, vayriɔbul data, ilɛktronik ficha ɛn pak. Wan vektɔ atwok fayl ɔ rɛfrɛns imej de ɛp di injinɛri tim fɔ asɛs di fisibiliti.
Di bɛst tik de dipen pan di wet we yu want, aw fɔ yuz di walet, dizayn ɛn di we aw dɛn mek am. Kad we tinap kin fayn fɔ distribyushɔn we gɛt bɔku bɔku vɔlyum, bɔt kad we tik kin mek pɔsin fil ebi. Kɔt-ɔut, dip ɛtch ɛn ɛmbaded kɔmpɔnɛnt dɛn kin nid difrɛn strɔkchɔ.
Laser engraving de mek kɔntrol sɔfa mak ɛn i fayn fɔ tɛks, siriɔs nɔmba ɛn ditayl layn art. Kεmikכl εtch kin mek brayt rεsεs εria, taktil tεkschur εn tru-kכt patεn. Di bɛst we fɔ du am dipen pan dip, artwok ɛn finish.
Yɛs. Ɔl tu di say dɛn kin inklud engraving, etch, printin, kala filin ɔ variebul data, we de ɔnda di finish we yu dɔn pik ɛn di prɔses kɔmpatibiliti. Dip ficha dɛn kin mek wan ifɛkt we pɔsin kin si na di rivays sayd ɛn dɛn fɔ rivyu dɛn we dɛn de du artwok injinɛri.
Yes, bɔt i nid wan pɔpɔshɔn-disayn anti-mɛtal NFC strɔkchɔ. Dɛn nɔ kin jɔs put di ɛntena agens mɛtal we nɔ gɛt ɛnitin fɔ ambɔg am. Di projɛkt fɔ difayn di chip, ayzolayshɔn layt, aktif tap eria, ɛnkɔd data ɛn target fon ɔ rida dɛn.
Kɔmpatibiliti dipen pan di NFC chip, data fɔmat, fon hadwae, ɔpreshɔn-sistim bihayvya, ɛntena strɔkchɔ ɛn tap pozishɔn. Samplε dεm fכ tεst pan di tכgεt divays rεnj bifo bכlk prodakshכn.
Wan mɛtal mɛmbaship kad kin ɛnjɛnɛri fɔ wan spɛsifikɛd RFID sistɛm, bɔt kɔmpitibliti fɔ bi bays pan di ɛksaktɔ frikshɔn, protɔkɔl, chip ɛn rida. Dijital-biznɛs-kad NFC kɔnfigyushɔn nɔ fɔ tek am se i de wok wit akses-kɔntrol sistɛm.
Yɛs. Dɛn kin engrav ɔ print difrɛn data dɛn. Di kɔstɔma fɔ gi wan strɔkchɔ data fayl ɛn gri fɔ di font, pozishɔn, kɔd saiz ɛn dupliket-kɔntrol lɔ dɛn. Prodakshɔn data fɔ verify agens di sɔs fayl.
Dɛn opshɔn ya kin nid fɔ gɛt kɔmpɔzit strɔkchɔ ɔ dediket sɔfays pripiamɛnt. Kɔnfɛm di magnɛtik kɔs, ɛnkɔdin trak, sayn-panɛl matirial ɛn rida rikwaymɛnt bifo yu tek sampul.
di mεtal apinεns de difrεn wit di sabstεrayt, tεkschur, kכt prכsεs, batch εn laytin. Wan fizik apruv sampul na wan kɔntrol rɛfrɛns we pɔsin kin abop pan pas wan kɔlɔ we de na di skrin. Krio projɛkt dɛn fɔ difayn wan gri fɔ si ɔ mɛzhɔ tolɛreshɔn.
Wan sampul de alaw di pɔsin we bay fɔ evalyu wet, riflɛkɛshɔn, tɛkstɔr, ed fil, engraving dip, print kɔlɔ, QR ridabiliti ɛn NFC pefɔmɛns. Dɛn nɔ go ebul fɔ jɔj dɛn kwaliti dɛn ya kɔrɛkt wan frɔm dijital pruf nɔmɔ.
Dɛn fɔ separet ɔ protɛkt di kad dɛn fɔ mek dɛn nɔ rɔtin di say we dɛn de. Di pak kin inklud protɛktiv fim, wan wan sliv, paus, gift bɔks, divayda ɛn ɛkspɔt katɔn. Di we aw dɛn pak am fɔ mach di surface finish ɛn di rital prɛzɛnteshɔn.
