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kad matirial
Wallis bin de tɔk bɔt am
inlay
| Sayz: | |
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| Material: | |
| advantej: | |
| Kwantiti: | |
Wallis transparent PVC RFID inlay prelam sheet dɛn na injinia fɔ kɔntaktlɛs smat kad manifakta dɛn we nid kɔstɔmayz ɛntena layout, kɔntrol chip pozishɔn ɛn rili lamineshɔn pefɔmɛns. Di prɔjek kɔnfigyushɔn dɛn we de inklud LF 125kHz, HF 13.56MHz, NFC ɛn UHF 860–960MHz tɛnkɔlɔji fɔ akses kad, aydentifikeshɔn kad, mɛmbaship kad, ɔtel kad, ɛset kad ɛn ɔda RFID aplikeshɔn dɛn.
Ɛni prelam shit de intagret di RFID chip ɛn ɛntena we dɛn dɔn pik insay transparent ɔ sɛmi-transparent PVC layers bifo di fayn kad kɔnvɔshɔn. Layout, sheet saiz, tiknes, antena jɔyometri, chip pozishɔn ɛn kad pitch kin divɛlɔp rawnd di bayer in panch tul, printin artwok, laminator ɛn rida sistem.
LF , HF ɛn UHF na difrɛn redio tɛnkɔlɔji dɛn pas fɔ bi intachɛnjabl vɛshɔn dɛn fɔ wan prɔdak. Fɔ gɛt kot we pɔsin kin abop pan, di wan dɛn we de bay fɔ no di frikshɔn we dɛn nid, di protɔkɔl, di chip mɔdel, di rida mɔdel, di target rid rɛnj ɛn di kad kɔnstrɔkshɔn we dɔn dɔn bifo dɛn mek di sampul.
| Paramita | Avaylabl Spɛsifikeshɔn ɔ Projɛkt Opshɔn |
|---|---|
| Base Material | Transparent PVC ɔ sɛmi-transparent PVC |
| Tayp fɔ Prodakt | Kontaktlɛs RFID inlay prelam sheet fɔ kad kɔnvɔshɔn |
| Frikyuɛnsi Opshɔn dɛn | LF 125kHz / HF 13.56MHz / NFC / UHF 860–960MHz |
| Di Opshɔn dɛn fɔ Layout | 3×8 / 3×7 / 4×5 / A4-rilayt layout / kɔstɔm kad matris |
| Sayz fɔ di Shit | A4 ɔ kɔstɔm dimɛnshɔn dɛn we dɛn bays pan panch ɛn laminɛshɔn ikwipmɛnt |
| prelam Tik we de tik | 0.30–0.76mm akɔdin to di kɔrɛnt prodakt data; fainal kɔnstrɔkshɔn we dɛn kɔnfyus bay sampul |
| Di Opshɔn dɛn fɔ Ɛntena | Kɔpa kɔyl, ɛmbaded waya ɔ etched ɛntena akɔdin to frikshɔn ɛn prɔjek dizayn |
| Chip Opshɔn dɛn | Dɛn pik am bay protɔkɔl ɛn rida sistɛm; LF , HF / NFC ɛn UHF chip famili dɛn we de bay prɔjek |
| Sho | Transparent / sɛmi-transparent / frɔst transparent; printable ɔ Overlay film -rɛdi gred bay rikwest |
| Daunstrim Prɔsesin | Overlay film lamination, sheet printin usay dɛn spɛsifa, panch, chip tɛst ɛn kad pɔsnalayzeshɔn |
| Kastamayzeshɔn | Layout, pitch, chip posishun, antena geometry, tiknes, sheet saiz, blak mak en pak |
| MOQ we gɛt fɔ du wit am | Dipen pan chip, antena, layout ɛn kɔstɔmayshɔn rikwaymɛnt dɛn |
RFID prelam na di fכnshכnal midul layt we dεn kin yuz fכ mek wan kכntaktlεs plastic kad. di chip, antena εn bonding strכkchכ dεn kכlכs bitwin plastic layεr dεm, we de mek wan stebul shit we dεn kin kכmbayn wit print shit dεm εn prכtektiv Overlay film s bifo dεn fכs panch.
Top protɛktiv Overlay film ɔ layt we pɔsin kin print
Transparent PVC prelam layt
RFID chip ɛn mach ɛntena
Lɔwa PVC layt ɛn opshɔnal print sheet
Bak Overlay film ɔ fɛnshɔnal kad layt
Transparent PVC de alaw di ɛntena ɛn intanɛnt kɔnstrɔkshɔn fɔ bi pat pan di vijual kad dizayn. Bikɔs di ɛntena de kɔntinyu fɔ si, alaynɛshɔn, adhesive kɔntrol, surface klin ɛn chip pozishɔn impɔtant mɔ fɔ prɛmiɔm transparent kad dɛn.
Transparent RFID Inlay Struktrɔ
Kastomized Chip ɛn Antena Pozishɔn
Frikyuɛnsi sɛlɛkshɔn fɔ bi bay di rida infrastukchɔ ɛn aplikeshɔn protɔkɔl. Kad we dɛn mek fɔ LF akses kɔntrol nɔ go ɔtomɛtik wok wit HF / NFC rida, ɛn UHF trakin kad nid difrɛn ɛntena ɛn tɛst ɛnvayrɔmɛnt frɔm shɔt-rɛnj proksimiti kad.
| Teknɔlɔji | Frikyuɛnsi | Tipik Prɔtokɔlɔ ɔ Chip Famili | Kɔmɔn B2B Aplikeshɔn dɛn | Wetin di Baya fɔ Kɔnfɛm |
|---|---|---|---|---|
| LF | 125kHz we yu de yuz | EM, TK, T5577 ɛn ɔda LF famili dɛn, dipen pan rida protɔkɔl | Proksimiti akses, atɛndans, aydentifikeshɔn ɛn lɛgsi sistɛm dɛn | Eksakt chip, ɛnkɔdin fɔmat, UID rikwaymɛnt ɛn rida mɔdel |
| HF / NFC | 13.56MHz we yu de yuz | ISO /IEC 14443, ISO /IEC 15693, NFC -kompatibl ɛn aplikeshɔn-spɛsifi k chips | Akses, mɛmbaship, kampus, transit, NFC intarakshɔn ɛn sikyuɔr aydentifikeshɔn | Protokɔlɔ, mɛmori, sikyɔriti lɛvɛl, ki, rida ɛn ɛnkɔdin rispɔnsibiliti |
| UHF | 860–960MHz na di ɔda wan | E PC Klas 1 Jɛn 2 / ISO /IEC 18000-63 chip pletfɔm dɛn bay projɛkt | Asɛt aydentifikeshɔn, motoka kad, invɛntari ɛn lɔng-rɛnj trak | Rijinal band, antena oriɛnteshɔn, target rid rɛnj ɛn matirial dɛn we de rawnd |
| Haybrid | Tu ɔ mɔ frikshɔn dɛn | LF + HF , LF + UHF ɔ HF + UHF kɔnfigyushɔn dɛn we de ɔnda dizayn rivyu | Maygrɛshɔn projɛkt ɛn kad dɛn we de sav bɔku instɔl rida sistem dɛn | Avaylabl kad eria, antena intarakshɔn, chip pozishɔn ɛn finish tik |
RFID Inlay Shit fɔ Kɔnvɔshɔn fɔ Kad
Kastamized Kad Matriks ɛn Antena Layout
Di inlay matris fɔ alaynɛd wit di kɔstɔma in artwok impɔzishɔn, rɛjista mak, panch day ɛn kad ɔriɛnteshɔn. Yu kin gi standad arenjmɛnt dɛn lɛk 3×8, 3×7 ɛn 4×5, we kɔstɔm layout dɛn nid fɔ gɛt dimɛnshɔnal drɔin ɔ aprɔv kad-pɔzishɔn fayl.
Chip pozishɔn fɔ avɔyd ɛmbos zon, magnɛtik strɛp, signɛshɔn panɛl, kɔntakt mɔdyul, panch layn ɛn krichɔl print ɛlimɛnt dɛn. Fɔ transparent dizayn, di visible antena path fɔ rivyu bak agens di artwok.
prelam tiknes na wan pat nɔmɔ pan di kad kɔnstrɔkshɔn we dɔn dɔn. Print sheet, Overlay film s, adhesive layers, chip cavities ɛn opshɔnal sikyɔriti layers fɔ de insay we dɛn de kɔl di fayn laminated tiknes.
| Layout Input Infɔmeshɔn | dɛn nid | Rizin we |
|---|---|---|
| Sheet Drawing we dɛn de drɔ | Ɔl di shit lɔng, di wit, di margin ɛn di kad matris | Match laminator, artwok ɛn panch tul |
| Kad Ɔriɛnteshɔn | Portret ɔ land skay, frɔnt/bak rɛfrɛns ɛn fid dairekshɔn | I de mek dɛn nɔ put di ɛntena we gɛt miro ɔ we de rɔta |
| Di say we di Chip dɛn de | X/Y kɔdinɛt ɛn ɛksklɔzhɔn zon dɛn | Avɔyd ɛmbos, mɔdyul, strɛp ɛn panch kɔnflikt |
| RF Rikwaymɛnt | Frikyuɛnsi, chip, protɔkɔl, rida ɛn target rɛnj | Sɔpɔt antena tuning ɛn fɛnshɔnal tɛst |
| Kad Kɔnstrɔkshɔn | Lay matirial, tiknes, Overlay film s ɛn printin prɔses | Konfam lamination bihayv en fainal kad gej |
Kontrol antena ɛn chip plesmɛnt de ɛp di kɔstɔma fɔ mek dɛn kɔntinyu fɔ rɛjista tru printin, lamination ɛn panch. Dimenshɔnal rikwaymɛnt dɛn fɔ difayn pan di apruv layout drɔin ɛn verify di tɛm we dɛn de prodyuz sampul.
Transparent ɔ sɛmi-transparent prelam de mek pɔsin ebul fɔ mek visible-teknɔlɔji kad dizayn. Klin PVC layers, kɔntrol adhesive apinans ɛn kɔnsistɛns ɛntena routin ɛp fɔ mek wan mɔ profeshɔnal finish kad.
Di prelam kin intagret wit kɔmpitabl PVC printin shit ɛn Overlay film s. Lamineshɔn tɛmpracha, prɛshɔn, tɛm fɔ de ɛn di we aw dɛn de kol, dɛn fɔ kɔnfyus tru trayal bikɔs di kɔrɛkt sɛtin dɛn de dipen pan kad kɔnstrɔkshɔn ɛn ikwipmɛnt.
Singl-frikyuɛnsi ɛn sɛlɛkɛt haybrid kɔnfigyushɔn dɛn kin divɛlɔp. Haybrid kad dɛn nid ɔda injinɛri bikɔs tu ɛntena dɛn kin intarakt, kɔmpit fɔ kad eria ɔ afɛkt rid pefɔmɛns afta laminɛshɔn.
Di wan dɛn we de bay kin sho di sheet lɛbl dɛn, di kad-pɔzishɔn nɔmba dɛn, blak rɛjista mak dɛn, di kwantiti dɛn we dɛn pak ɛn di palet lɛbl dɛn. Enkɔdin ɔ UID data handlin fɔ difayn sɛpret, inklud data fɔmat, sikyɔriti rikwaymɛnt ɛn rispɔnsibiliti fɔ ki.
Sɔm prelam sheet dɛn kin de insay di kad ɛn dɛn kin kɔba dɛn wit PVC sheet dɛn we dɛn print sɛpret wan. Dairekt ɔfset, UV ɔ dijital printin fɔ jɔs spɛsifa we dɛn dɔn tɛst di sɔfa tritmɛnt ɛn ink sistɛm we dɛn dɔn pik fɔ adheshon.
Antena rεsכnans εn rid rεnj kin chenj afta dεn kכmbayn di prelam wit Overlay film s, mεtal ink, fכyl, magnεtik mεtirial כ ilektronik kכmכpכnt dεm we de nia. Aprɔval tɛst fɔ yuz di las kad kɔnstrɔkshɔn ɛn di pɔsin we bay in prodakshɔn rida.
Bifo di mas prodakshɔn, di kɔstɔma fɔ chɛk di artwok rɛjista, kad pitch, ɛntena kliarens ɛn chip ples na di aktual panch tul. Wan dimɛnshɔnal drɔin nɔmɔ nɔ go ebul fɔ tek ples fɔ wan kɔmplit prodakshɔn trayal.
Fɔ B2B ɔda, di aprɔv sampul fɔ bi di rɛfrɛns fɔ layout, apinans, tiknes ɛn RF pefɔmɛns. Inspekshɔn krayteria fɔ gri bifo dɛn prodyuz, mɔ fɔ kɔstɔm ɛntena dizayn ɛn mɔlti-frikyuɛnsi strɔkchɔ.
| Inspekshɔn Aytem | Wetin Dɛn Chɛk | Rikɔmɛnd Aprɔval Stej |
|---|---|---|
| Di we aw pɔsin kin si | Transparency, contamination, skrat, bɔbul ɛn adhesive apinans | Raw sample ɛn finish kad sampul |
| Dimenshɔn dɛn | Shit saiz, kad pitch, margin, chip kɔdinɛt ɛn ɛntena kliarens | Layout drɔin ɛn fɔs atikul |
| Tik ɛn Flatnɛs | Shit gej, lokal chip eria ɛn wɔpej | prelam sheet ɛn laminated kad |
| Ilektrikal Kɔntinyuiti | Antena kontinyuiti ɛn chip kɔnɛkshɔn | Bifo yu pak |
| Di we aw di wan dɛn we de rid kin du | UID rispɔns, protɔkɔl, mɛmori akses ɛn prɔjek-spɛsifi k rid rɛnj | Bifo ɛn afta di las lamination |
| Laminashɔn Intɛgriti | Bonding, bubbles, delamination, surface maks ɛn chip-eria difɔmeshɔn | Golden Sample kad we dɛn kin yuz |
Kɔnfɛm frikshɔn, protɔkɔl, chip, rida ɛn ɛnkɔdin rikwaymɛnt dɛn.
Apruv di sheet drɔin, kad matris, ɛntena rout ɛn chip kɔdinɛt.
Prodyuz sampul prelam shit ɛn verify ilɛktrik pefɔmɛns.
Laminate wit di bayer in komplit kad strɔkchɔ.
Panch kad dɛn we dɔn dɔn ɛn tɛst dɛn pan di rida sistɛm we yu want.
Apruv di Golden Sample ɛn rayt batch akseptans krayteria.
LF ɔ HF prelam shit kin kɔnfigyut fɔ di wokman akses, kampus aydentifikeshɔn, atɛndans ɛn lɛgsi proksimiti sistɛm. Di rida protɔkɔl we dɛn dɔn instɔl fɔ kɔnfyus bifo dɛn pik di chip.
HF / NFC inlays kin sɔpɔt dijital intarakshɔn, mɛmbaship aydentifikeshɔn ɛn sɛlɛkɛt smat makɛt aplikeshɔn dɛn we dɛn dɔn difayn di chip mɛmori, NDEF rikwaymɛnt ɛn smartfon ɔ rida kɔmpatibiliti.
Di ɔtel kad dɛn fɔ mach di lɔk sistem we de naw in frikshɔn, chip, mɛmori strɔkchɔ ɛn sikyɔriti kɔnfigyushɔn. Wan jenɛral HF ɔ NFC chip nɔ kin wok ɔtomɛtik wan wit ɛvri ɔtel lɔk pletfɔm.
UHF kad inlays kin disayn fɔ lɔng-rɛnj aydentifikeshɔn, motoka akses ɛn ɛset wokflɔ. Pɔfɔmɛnshɔn dipen pan di rijinal frikshɔn band, rida pawa, ɛntena ɔriɛnteshɔn ɛn matirial dɛn we de rawnd di kad we dɔn dɔn.
Kastam layout sɔpɔt: kad matris, ɛntena rout, chip pozishɔn ɛn shit saiz kin rivyu fɔ OEM prɔjek dɛm.
Bɔku RFID teknɔlɔji dɛn: LF , HF / NFC , UHF ɛn sɔm haybrid kɔnfigyushɔn dɛn we dɛn dɔn pik kin tɔk bɔt.
Transparent kad matirial kapabiliti: klia ɛn sɛmi-transparent PVC kɔnstrɔkshɔn dɛn de fɔ visible-teknɔlɔji dizayn dɛn.
Kad matirial intagreshɔn: maching PVC shit, Overlay film s ɛn finish kad kɔnvɔshɔn sɔpɔt kin kɔdinɛt.
Sampul-bɛs aprɔval: dɛn kin ebul fɔ evaluate tɛknikal sampul fɔ lamination, panch ɛn rida kɔmpatibiliti bifo mas prodakshɔn.
Ekspɔt pak: shit protɛkshɔn, katon pak, lɛbl ɛn palet opshɔn dɛn kin spɛsifa fɔ intanashɔnal ɔda.
LF , HF / NFC , UHF ɔ aprɔv haybrid frikshɔn strɔkchɔ
Chip model we dɛn pik fɔ di bayer in protɔkɔl ɛn rida
Kɔpa waya, ɛmbaded waya ɔ etched ɛntena dizayn
3×8, 3×7, 4×5 ɔ ful kɔstɔmayt sheet layout
Kastom sheet dimɛnshɔn, tik ɛn kad pitch
Transparent, sɛmi-transparent ɔ frɔst transparent apinans
Rejista mak, kad-pɔzishɔn nɔmba ɛn OEM lɛbl
Shit, katon ɛn ɛkspɔt palet pak
RFID prelam sheet dεm fכ protεkt fכ bεnd, kכntaminεshכn, mכsichכ εn mεkanikal prεshכn we dεn de transpכt. Pak kwantiti, separatɔ, anti-statik rikwaymɛnt, katon lɛbl ɛn palet kɔnfigyushɔn kin kɔnfɔm akɔdin to di shit saiz ɛn di bayer in risiv prɔses.
Protektiv Shit Pakɛj
Katon ɛn Ɛkspɔt Pakɛj
| Infɔmeshɔn we dɛn nid | Ɛgzampul ɔ Ɛksplen |
|---|---|
| Frikyuɛnsi ɛn Prɔtokɔlɔ | LF 125kHz, ISO /IEC 14443, ISO /IEC 15693, NFC ɔ UHF E PC Gen2 |
| Chip Model we yu go yuz | Eksakt pat nɔmba, mɛmori ɛn sikyɔriti rikwaymɛnt |
| Infɔmeshɔn bɔt di wan dɛn we de rid | Rida brand/model, antena ɛn target rid distans |
| Di Layout fɔ di Sheet | 3×8, 3×7, 4×5 ɔ dimɛnshɔnal kɔstɔm drɔin |
| Kad Kɔnstrɔkshɔn | prelam , print sheet, Overlay film s ɛn fayn kad tik |
| Fɔ Print ɛn Fɔ dɔn | Dairekt printin ɔ intanɛnt prelam, klia/frɔst finish, spɛshal fɔyl ɔ magnɛtik strɛp |
| Di Rikwaymɛnt fɔ Ɛnkɔd | Blank chip, UID list, data fɔmat, ki ɛn lɔk rikwaymɛnt |
| Ɔda Kwantiti | Sampul kwantiti, payɔt ɔda ɛn ɛni ia fɔkɔs |
Na di midul layt we de wok fɔ wan plastic kad we nɔ gɛt kɔntakt. Di shit gɛt di chip ɛn ɛntena ɛn dɛn lamin am wit printin shit ɛn Overlay film s bifo dɛn panch am insay kad dɛn we dɔn dɔn.
Di opshɔn dɛn fɔ di prɔjek inklud LF 125kHz, HF 13.56MHz, NFC ɛn UHF 860–960MHz. Dɛn kin ebul fɔ evaluate di dual-frikyuɛnsi ɔ haybrid strɔkchɔ dɛn bak we dɛn dɔn pik.
Nɔ, dɛn de yuz difrɛn frikshɔn, protɔkɔl, ɛntena ɛn rida sistem. Di chip ɛn ɛntena fɔ pik fɔ di infrastukchɔ we dɛn want.
Yɛs. Layout, sheet saiz, kad pitch, antena geometry ɛn chip kɔdinɛt dɛn kin divɛlɔp frɔm wan dimɛnshɔnal drɔin ɛn aprɔv prodakshɔn sampul.
I dipen pan di sɔfa gred we yu dɔn pik ɛn di ink sistɛm. Bɔku kad strɔkchɔ dɛn kin yuz sɛpret print PVC sheet dɛn oba di prelam. Dairekt printin fɔ kɔnfɔm bay wan ink-adhesion tɛst.
Di kɔrɛnt prodak infɔmeshɔn list 0.30–0.76mm. Di korekt prelam tiknes dipen pan di chip cavity, antena, Overlay film s en rikwayd finish kad tiknes.
Dɛn kin rivyu LF + HF , LF + UHF ɔ HF + UHF strɔkchɔ dɛn we dɛn dɔn pik. Fisibiliti dipen pan antena intarakshɔn, kad eria we de, chip pozishɔn ɛn target kad tik.
Test kin inklud antena kɔntinyuiti, chip rispɔns ɛn prɔjek-spɛsifi k rida chɛk. Faynal aprɔval fɔ tɛst panch kad dɛn bak afta dɛn dɔn lamin wit di pɔsin we bay in rida sistɛm.
Rid distans dipen pan chip sɛnsitiviti, ɛntena dizayn, rijinal band, rida pawa, ɔriɛnteshɔn ɛn matirial dɛn we de rawnd. Wan target rɛnj fɔ validet yuz di fayn kad kɔnstrɔkshɔn.
Yes, we di chip ɛn protɔkɔl mach di ɔtel lɔk sistem. Di lɔk brand, ɛnkɔda ɛn di kad spɛsifikɛshɔn we de naw fɔ de fɔ mek dɛn rivyu di kɔmpatibiliti.
Yu kin tɔk bɔt ɛnkɔdin akɔdin to di chip ɛn di prɔjek. Di kɔstɔma fɔ difayn di data fɔmat, di ki dɛn, di we aw dɛn de handle di UID, di lɔk stetɔs ɛn di sikyɔriti rispɔnsibiliti dɛn.
Di wan dɛn we de bay fɔ tɛst di shit dimɛnshɔn, di printin ɔ Overlay film kɔmpatibiliti, lamineshɔn, panch rɛjista, kad flatnɛs ɛn RF pefɔmɛns pan di rida we dɛn want fɔ rid. Di Golden Sample we dɛn dɔn gri fɔ bi di batch rɛfrɛns.
