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Inlay / prelam
Wallis we nem Wallis
| Sayz: | |
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| Chip: | |
| Kwantiti: | |
Wallis dual-frequency RFID TK4100 + F08 inlay prelam sheet na wan sɛmi-finished funkshɔnal kɔr fɔ manifakta dɛn we de prodyuz haybrid akses, wokman ID, kampus, mɛmbaship, ɔtel ɛn malti-sistim smat kad. I intagret wan indipɛndɛnt LF 125kHz TK4100 kredibiliti ɛn wan indipɛndɛnt HF 13.56MHz F08 kredibiliti insay wan kad layout, we de alaw wan kad we dɔn fɔ intarakt wit tu kɔmpitabl rida infrastukchɔ.
Di LF ɛn HF sɔrkwit dɛn stil de separet: ɛni frikshɔn gɛt in yon chip, ɛntena ɔ kɔyl, protɔkɔl bihayvya ɛn rida kɔmpitibliti. Fɔ rili mas prodakshɔn, di chip rɛfrɛns, rida mɔdel, ɛntena pozishɔn, shit layout, finish kad strɔkchɔ ɛn target rid pefɔmɛns fɔ kɔnfɔm bifo tul ɛn bɔlk lamination.
| Paramita | Rifrɛns Spɛsifikeshɔn ɛn B2B Kɔnfɔmeshɔn Point |
|---|---|
| Tayp fɔ Prodakt | Dual-frikyuɛnsi RFID inlay prelam shit fɔ sɔbsɛkɛn Overlay film laminɛshɔn, printin, panch ɛn kad pɔsnalayzeshɔn. |
| Standart Kɔmbaynshɔn | LF 125kHz TK4100 + HF 13.56MHz F08. Kɔnfɛm di ɛksaktɔl chip manifakta, mɛmori kɔnfigyushɔn, UID fɔmat ɛn rida/sistim rikwaymɛnt dɛn pan di spɛsifikɛshɔn we yu bay. |
| Di Layout dɛn we De | 2×5 (A4), 3×7, 3×8 ɛn ɔda kɔstɔmayz shit matris dɛn. Faynal shit dimɛnshɔn, kad pitch, margin, rɛjista mak ɛn panch dairekshɔn fɔ fala di drɔin we dɛn dɔn gri fɔ. |
| Rifrɛns prelam Tiknɛs | aprכksimatli 0.55–0.60mm fכ di kכrant LF + HF strכkchכ. Aktual tiknes ɛn tolɛreshɔn dipen pan chip pakej, ɛntena kɔnstrɔkshɔn, sabstret ɛn fayn kad stak. |
| Base Material | PVC as di standad opshɔn; ɔda kɔmpitabl kad sabstret dɛn kin ebul fɔ evaluate akɔdin to di lamination strɔkchɔ ɛn di prɔjek rikwaymɛnt dɛn. |
| LF Antena we dɛn kɔl | Tipikli wan wund kɔpa kɔyl we dɛn mek fɔ di 125kHz chip ɛn rida ɛnvayrɔmɛnt we dɛn dɔn pik. |
| HF Antena we dɛn kɔl | Etched ɔ embedded antenna dizayn we dɛn tun fɔ di 13.56MHz chip we dɛn dɔn pik, kad stak ɛn rida ɛnvayrɔmɛnt. |
| Sho | Blank prelaminated funkshɔnal kɔr, we dɛn bin want fɔ kɔba wit printabl kɔr shit ɛn/ɔ transparent Overlay film s. |
| Kastamayzeshɔn | Chip kɔmbayn, ɛntena jɔyometri, layout, tik, shit saiz, rɛjista mak, matirial strɔkchɔ, pak ɛn lɛbl. |
| Sampul Aprɔval | Dɛn kin rikɔmɛnd fɔ tek injinɛri sɛmpul ɛn wan Golden Sampul bifo dɛn prodyuz bɔku bɔku wan. Dɛn kin kɔnfyus di avaylabl, kwantiti ɛn freyt fɔ ɛni prɔjek. |
LF 125kHz TK4100 Inlay Struktrɔ
HF 13.56MHz F08 Inlay Struktrɔ
Dual-frikyuɛnsi RFID prelam na laminated intamɛdiet shit we gɛt tu indipɛndɛnt kɔntaktlɛs sɔrkwit dɛn na ɛni kad pozishɔn. Di TK4100 sɔrkwit de yuz fɔ kɔmpitabl 125kHz proksimiti-rida aplikeshɔn, we di F08 sɔrkwit de yuz wit kɔmpitabl 13.56MHz rida sistem.
Fɔ jɔyn di tu sɛrkyut dɛn na wan kad bɔdi kin fayn we ɔganayzeshɔn fɔ mentɛn wan lɛgsi LF akses sistɛm we i de ad wan sɛpret HF aplikeshɔn. I nɔ de jɔyn di tu protɔkɔl ɔ di database dɛn. Di pɔsin we gi di kad fɔ inrɔl ɛn manej ɛni kredibiliti na di kɔrɛspɔndɛns sistɛm.
TK4100 na wan we dɛn kin pik as rid-onli aydentifikeshɔn kredibiliti fɔ kɔmpitabl 125kHz proksimiti rida dɛn. Dɛn kin yuz am jɔs we di sistɛm de rid wan fiks aydentifikeshɔn nɔmba pas fɔ kip di aplikeshɔn data. Di ekzak bit fɔmat, fasiliti-kɔd hanlin ɛn rida kɔmpatibiliti fɔ kɔnfɔm wit di akses-kɔntrol intagreta.
F08 na kɔmɔn fɔ yuz as 13.56MHz kɔntaktlɛs mɛmori kredibiliti insay kɔmpatibl sistɛm dɛn. Di pɔsin we bay fɔ kɔnfɔm di ɛksaktɔ F08 vɛshɔn, mɛmori ɔganayzeshɔn, ki dɛn, UID hanlin, sɛktɔ data ɛn pɔsnalayzeshɔn we. Wan 13.56MHz ɔpreshɔn frikshɔn nɔmɔ nɔ de gi garanti fɔ kɔmpitibliti wit smart fon, NFC aplikeshɔn, MIFARE-branded sistem ɔ ɛvri ISO /IEC 14443 rida.
Insay smat-kad tɛminɔlɔji, dual frikshɔn nɔmal wan min tu kɔntaktlɛs redio sistɛm dɛn lɛk LF + HF . Dual intafeys kin rifer to kɔntakt chip plus wan kɔntaktlɛs intafɛs. Yuz di kɔrɛkt wɔd na drɔin, kot ɛn sistɛm dɔkyumentri fɔ mek yu nɔ mek mistek pan di prokyumɛnt.
| Item | TK4100 Sid | F08 Sid |
|---|---|---|
| Ɔmɔs tɛm | 125kHz LF 125kHz. | 13,56MHz HF 13.56MHz. |
| Tipik Rol we pɔsin kin du | Fiks-ID proksimiti kredɛns fɔ kɔmpitabl akses ɔ atɛndans rida dɛn. | Rid/rayt mɛmori kredɛns fɔ kɔmpitabl HF kad aplikeshɔn dɛn. |
| Infɔmeshɔn fɔ Rida fɔ Rid | Rida brand/model, sɔpɔt data fɔmat, ɛkspɛkt kad nɔmba ɛn target rid distans. | Rida brand/mɔdel, protɔkɔl, mɛmori/ki rikwaymɛnt, UID polisi ɛn ɛkspɛkt transakshɔn wokflɔ. |
| Pɔsin in yon | Bɔku tɛm, dɛn kin yuz di aydentifaya we dɛn dɔn program na di faktri; kɔnfɔm if di sistɛm nid wan patikyula nɔmba fɔmat. | I kin nid sɛktɔ programin, ki, data fayl ɔ ishua-sayd inrɔlmɛnt. |
| Sekyuriti Pozishɔn | I fayn fɔ prɔjek dɛn we de aksept wan besik rid-onli LF kredibiliti. | Di fit fɔ fit dipen pan di ɛksaktɔl chip ɛn di sikyɔriti polisi. Nyu ɔ ay-sikyɔriti prɔjek dɛn fɔ spɛsifa wan aprɔv sikyɔriti chip pletfɔm. |
| Fɔn Kɔmpatibiliti | Standart smartfon dɛn nɔ kin rid 125kHz proksimiti kredibiliti nɔmal wan. | Nɔ tink se smart fon kɔmpitishɔn; verify di ekzak chip, protɔkɔl ɛn target fon ɔpreshɔn sistɛm. |
Tu ɛntena dɛn we dɛn put insay wan tin kad kin inflɔws rɛsɔnans, rid distans, laminɛshɔn bihayvya ɛn panch kliarens. So dɛn fɔ disayn di antena jɔyometri as wan intagreted kad strɔkchɔ pas fɔ kɔba tu indipɛndɛnt inlay dɛn we nɔ gɛt validɛshɔn.
Di LF kɔyl ɛn HF ɛntena fɔ de fɔ mek dɛn nɔ gɛt bɔku kɔpl we dɛn nɔ want ɛn fɔ lɛf klia zon fɔ kad ed, kɔntakt mɔdyul, magnɛtik strɛp, sayn panɛl, ol ɔ spɛshal day-kat ficha dɛn. Di dizayn fɔ tɛst wit di aktual finish-kad stak bikɔs print layers, Overlay film s ɛn nia kɔnduktiv ɛlimɛnt dɛn kin afɛkt RF pefɔmɛns.
Chip pakej lokeshɔn kin nid lokal kaviti, kusɛn layers ɔ kɔntrol matirial bild-ap. Po chip-eria dizayn kin mek bamp, trɔp ɛya, print distɔrshɔn, delamination ɔ panch damej. Di drɔin we dɛn dɔn gri fɔ sho di chip kɔdinɛt ɛn di lokal tik we dɛn alaw.
Kad we de rid fayn pan wan dɛsktɔp rida kin wok difrɛn we pan akses rida we dɛn kin put na di wɔl, ɔtel lɔk, tɔnstayl ɔ tɛminal we dɛn kin ol wit an. Sampul kad dɛn fɔ tɛst pan ɛvri rida mɔdel we de insay di diploymɛnt, frɔm bɔku ɔriɛnteshɔn ɛn afta fayn laminɛshɔn.
HF Rida Aplikeshɔn
RFID Aplikeshɔn Ɛgzampul
Di prelam layout fɔ alaynɛd wit di kɔstɔma in printin plet, laminator, kolashɔn we, panch tul ɛn finish-kad ɔriɛnteshɔn. Wan layout nem lɛk 3×8 nɔ inof fɔ rilis prodakshɔn; wan dimɛnshɔnal drɔin nid fɔ de.
| Drawing Item | Infɔmeshɔn fɔ Kɔnfɔm |
|---|---|
| Fɔmat fɔ di Sheet | Ɔl di shit wit ɛn lɔng, matris, kad pitch, edj margin ɛn fid dairekshɔn. |
| Di Pozishɔn fɔ di Kad | Finish kad autlayn, kɔna rayus, panch sɛntalayn ɛn frɔnt/bak ɔriɛnteshɔn. |
| LF Sakit | Koyl dimɛnshɔn, tɔn, chip pozishɔn, lid routin ɛn protɛkt nɔ-kɔt eria. |
| HF Sakit | Antena autlayn, brij/chip pozishɔn, tuning target ɛn protɛkt nɔ-kɔt eria. |
| Fɔ rɛjista | Optik mak, panch mak, print rɛjista mak ɛn alawable X/Y displeysmɛnt. |
| Ɔda Tin dɛn we Yu Go Du | Kontakt-modul kaviti, magnɛtik strɛp zon, signɛshɔn panɛl, foto eria, slot ol ɔ kɔstɔm shep. |
| Kad Stak we dɛn kin yuz | Printable kor, prelam, Overlay film s, adhesives, tot ɔl target tiknɛs ɛn layt sikyud. |
Finished Hybrid RFID Kad Struktrɔ
Dual-Frikuɛns Inlay Layout
Gi di LF ɛn HF chip rɛfrɛns dɛn we dɛn nid, rida mɔdel, kad-nɔmba fɔmat, programin rikwaymɛnt ɛn akseptɛns distans. Nɔ apruv chip bay di frɛkuɛns nɔmɔ.
Kɔnfɛm di shit saiz, matris, kad pitch, ɛntena autlayn, chip kɔdinɛt, rɛjista mak, panch dairekshɔn ɛn di ful layt stak.
Test bare prelam sheet ɛn kad dɛn we dɔn dɔn. Chek chip fכnshכn, antena rεspכns, surface flatness, lamination kompitibiliti, vijual apinεns εn rida pεrformεns.
Tεmprachכ, prεshכn, dwεl tεm, hεt rεt εn kol kכndishכn dεm fכ divεlכp yuz di sabstεrayt we dεn sεlekt εn Overlay film . Di ɔt ɔ prɛshɔn we pasmak kin muv di ɛntena, difɔm di chip eria ɔ chenj RF tuning.
Wan Golden Sample we dɛn sayn fɔ difayn di akseptabl kad apinans, dimɛnshɔn, ilɛktronik bihayvya ɛn rida pefɔmɛns fɔ batch inspekshɔn we go kam afta dat.
Yuz lɔt aydentifikeshɔn ɛn agreed sampling plan fɔ mentɛn traceability frɔm chips ɛn antena tru prelam prodakshɔn, kad lamination ɛn fainal delivri.
| Inspekshɔn | Wetin fɔ Chɛk | Stej we Dɛn Rikɔmɛnd |
|---|---|---|
| Chip Aydentiti fɔ di pɔsin | Eksakt LF / HF chip rɛfrɛns, UID ɔ siriɔs data, lɔt traysabiliti ɛn visible chip damej. | Inkam komponent ɛn dɔn prelam. |
| Integriti we di Antena gɛt | Kɔntinyuiti, bonding poɛnt, kɔyl lid kɔndishɔn ɛn ɛntena difrɛns. | Bifo ɛn afta di prɛlaminɛshɔn. |
| RF Rispɔns we dɛn gi | LF ɛn HF de wok indipɛndɛnt wan, target rida kɔmpatibiliti, ɔriɛnteshɔn ɛn rid-distans winda. | Bare prelam ɛn dɔn kad. |
| Krɔs-Intarakshɔn | Kɔnfɛm se fɔ aktiv wan rida nɔ de mek pɔsin biev we nɔ akseptabl na di sɛkɔn sɛrkyut. | Enjinia sampul ɛn Golden Sampul. |
| Layout Rɛjista | Chip ɛn antena pozishɔn agens X/Y kɔdinɛt, panch layn ɛn nɔ-kɔt zon. | Ɛvri prodakshɔn lɔt. |
| Mekanikal Kwaliti | Shit dimɛnshɔn, tik, flat, bɔbul, kɔntaminɛshɔn, lokal chip bamp ɛn sɔfays damej. | prelam rilis inspekshɔn. |
| Lamineshɔn Rizɔlt | Peel resistance, warpage, kad tiknes, edj kwaliti ɛn chip-eria apinans. | Finish-kad validɛshɔn. |
| Pɔsin in yon | Kɔrɛkt LF nɔmba kapchɔ, HF mɛmori/ki ɔpreshɔn ɛn database inrɔlmɛnt. | Isyuɔ ɔ sistɛm-intɛgreta validɛshɔn. |
Di TK4100 + F08 kɔmbayn na di wan we fit pas ɔl usay tu rida ɛnvayrɔmɛnt dɛn we dɔn de fɔ sɔpɔt insay wan fizik kredibiliti ɛn dɛn dɔn verify ɔl tu di sistɛm dɛn agens di chips dɛn we dɛn dɔn pik.
Di wokman ɛn kɔntrakta kad dɛn we dɛn yuz akɔdin to lɛgsi LF akses poɛnt ɛn wan sɛpret HF aplikeshɔn.
Kampus, klab ɔ prɔpati-mɛnejmɛnt kad dɛn we de intagret tu kɔmpitabl kredibiliti sistɛm dɛn.
Taym-atɛndans ɛn bildin-akses projɛkt dɛn we nid sɛpret LF ɛn HF aydentifaya.
Maygrɛshɔn projɛkt dɛn we wan ɔganayzeshɔn de chenj frɔm 125kHz rida to 13.56MHz infrastukchɔ.
OEM smart-kad prodakshɔn usay di kad faktri de kɔntrol di kɔmplit print, lamination ɛn panch prɔses.
Fɔ ɔtel lɔk, transpɔt, pe, gɔvmɛnt kredibiliti ɔ ɔda kɔntrol sistɛm dɛn, kɔmpitibliti ɛn sikyɔriti aprɔval fɔ kɔmɔt frɔm di pɔsin we gɛt di sistɛm. Wan frikshɔn mats nɔmɔ nɔ go du fɔ am.
| Projek Nid | Posisibul Dairekshɔn | Impɔtant Kwalifayeshɔn |
|---|---|---|
| Besik LF Identifikeshɔn | TK4100 ɔ ɔda aprɔv rid-onli LF kredibiliti. | Kɔnfɛm di rida data fɔmat ɛn di kad-nɔmba we dɛn nid. |
| Rayt LF Kredibiliti | Wan kɔmpitabl raytabl LF chip kin bi evalyu. | Kɔnfɛm programin tul dɛn, mɛmori, paswɔd/sikyɔriti ɛn ligal sistɛm ɔtorizeshɔn. |
| Legacy HF Mɛmori Kad | F08 ɔ ɔda 13.56MHz mɛmori chip we di sistɛm dɔn gri fɔ. | Kɔnfɛm ki, UID bihayvya, mɛmori map ɛn rida famwɔya. |
| Nyu Sikyuriti-Sɛnsitiv HF Projɛkt | Spɛsifik wan mɔdan sikrit chip pletfɔm we di pɔsin we gɛt di sistɛm dɔn gri fɔ. | Difayn kriptografi, ki manejmɛnt, layfsaykl ɛn sɛtifikeshɔn rikwaymɛnt bifo ɛntena dizayn. |
| Fɔn-Tap Maketin | Selekt wan NFC Fɔm-kɔmpatibl chip we dɛn mek fɔ smart fon intarakshɔn. | Test pan target iOS ɛn Andrɔyd divays dɛn; nɔ tek am se F08 kɔmpitibliti. |
| Trak we dɛn kin yuz fɔ trak fɔ lɔng tɛm | Wan UHF kכmbaynshכn kin εnjinia as difrεnt haybrid strכkchכ. | Rijyɔn, rida, ɛntena ɔriɛnteshɔn ɛn finish-kad RF tɛst nid fɔ de. |
RFID prelam sheet dεm fכ protεkt frכm bεnd, ilektrostatik dischaj, prεshכn pכynt, hεy humiditi, kכntaminεshכn εn hεt we dεn nכ kכntrol. Pakɛj spɛsifikɛshɔn fɔ mach di shit saiz, chip profayl, shipmɛnt we ɛn rikwayd lɔt traysabiliti.
Yuz klin intaliv ɔ protɛktiv film fɔ ridyus sɔfays skrach ɛn patikyula transfa.
Kip di sheet dɛn flat ɛn sɔpɔt di ful eria we yu de handle.
Separet prodakshɔn lɔt dɛn ɛn no di chip kɔmbaynshɔn, layout, kwantiti ɛn inspekshɔn stetɔs.
Alaw matirial fɔ ikwal na di prodakshɔn ɛnvayrɔmɛnt bifo lamination we di stɔrɔj ɛn wokshɔp kɔndishɔn difrɛn bad bad wan.
Wallis de sɔpɔt kad faktri, RFID sɔlvishɔn prɔvayda ɛn matirial distribyushɔn wit prɔjek-bɛs chip maching, kɔstɔm ɛntena injinɛri, shit-layout divɛlɔpmɛnt ɛn kad-matirial intagreshɔn. Di objektif na fɔ saplae wan prelam strɔkchɔ we dɛn kin validet insay di bayer in aktual rida ɛn lamination envayrɔmɛnt.
Enjinia-oriɛnted spɛsifikɛshɔn: dɛn de rivyu chip, ɛntena, rida, layout ɛn kad stak togɛda.
Kastom layout sɔpɔt: matris, dimɛnshɔn, rɛjista mak ɛn chip kɔdinɛt kin fala di bayer in tul.
Matirial intagreshɔn: maching printable sheet ɛn Overlay film s kin tɔk bɔt fɔ di kɔmplit kad strɔkchɔ.
Sampl-lid kwalifayeshɔn: injinɛri sɛmpul ɛn Golden Sampul aprɔval de ridyus mas-prɔdakshɔn risk.
B2B dɔkyumentri: drɔin, prodak spɛsifikɛshɔn, lɔt aydentifikeshɔn ɛn inspekshɔn rikwaymɛnt dɛn kin alaynɛd wit di ɔda ɔda we yu bay.
| Infɔmeshɔn we dɛn nid | Ɛgzampul ɔ Ɛksplen |
|---|---|
| LF Chip ɛn Rida | TK4100 ɔ ɔda we; rida brand/mɔdel; di ɔtput/kad-nɔmba fɔmat we dɛn nid. |
| HF Chip ɛn Rida | Eksakt F08 vɛshɔn ɔ ɔda we; rida brand/mɔdel; protɔkɔl, ki, mɛmori ɛn UID rikwaymɛnt dɛn. |
| Target Pɔfɔmɛnshɔn | Minimum/maksimal rid distans, oriɛnteshɔn ɛn tɛst sɛtup fɔ ɛni frikshɔn. |
| Sheet Drawing we dɛn de drɔ | Ɔl di sayz, layout, kad pitch, panch mak, fid dairekshɔn ɛn kad ɔriɛnteshɔn. |
| Kad Stak we dɔn dɔn | Kor shit, Overlay film s, adeziv, print layers ɛn target totɛl tiknɛs. |
| Ɔda Tin dɛn we De Na di Kad | Magnɛtik strɛp, kɔntakt chip, sayn panɛl, slot, transparent eria ɔ spɛshal shep. |
| Ɔda Infɔmeshɔn | Sampul kwantiti, fɔkɔs volyum, pak, ples fɔ go ɛn di dɔkyumentri we dɛn nid. |
Na wan sɛmi-finish kad kɔr we gɛt 125kHz TK4100 sɔrkwit ɛn wan sɛpret 13.56MHz F08 sɔrkwit na ɛni kad pozishɔn. Leta dɛn kin jɔyn di sheet wit layers we dɛn kin print ɛn Overlay film s, dɛn kin lamin am ɛn panch am insay kad dɛn we dɔn dɔn.
Nɔ. Dɛn na indipɛndɛnt chip dɛn wit sɛpret ɛntena strɔkchɔ, frikshɔn ɛn data bihayvya. Di LF ɛn HF kredibiliti dɛn inrɔl ɛn manej dɛn sɛpret.
TK4100 na jɔs wan we dɛn kin pik as rid-onli LF aydentifikeshɔn kredɛns. We dɛn nid fɔ rayt LF fɛnshɔn, spɛsifa di rida, programin ikwipmɛnt ɛn ɔda chip we dɛn dɔn gri fɔ bifo yu kot.
F08 ɛn MIFARE Klasik kin yuz insay di sem kayn lɛgsi 13.56MHz aplikeshɔn ɛnvayrɔmɛnt, bɔt dɛn nɔ fɔ prɛzɛnt dɛn as di sem branded chip. Kɔnfɛm di ɛksaktɔl chip manifakta, protɔkɔl bihayvya, mɛmori, ki, UID rikwaymɛnt ɛn rida kɔmpitibliti.
Nɔ, we yu de wok na 13.56MHz, i nɔ de mek chip ɔtomɛtik wan ebul fɔ wok wit ɔl di NFC fon dɛn. Smartfon kɔmpitibliti dipen pan di ɛksaktɔ chip ɛn protɔkɔl, fon hadwae, ɔpreshɔn sistɛm ɛn aplikeshɔn.
Dɛn kin jɔs tink bɔt am afta di ɔtel lɔk manifakta ɔ di sistɛm intagreta kɔnfɔm di chip, protɔkɔl, UID/ki bihayvya ɛn di rida kɔmpitibliti we dɛn nid. Di ɔtel sistɛm dɛn nɔ kin chenj bay di frɛkuɛns nɔmɔ.
Nɔ tink se na so i bi. Peyment ɛn ay-sikyɔriti kredibiliti projɛkt dɛn nid fɔ gɛt chips we di sistɛm dɔn gri fɔ, kriptografi, sɛtifiket, pɔsnalayzeshɔn kɔntrol ɛn kɔmplit-kad tɛst. Sɔntɛm dɛn nid fɔ gɛt mɔ sikrit chip pletfɔm.
Yɛs. Shit dimɛnshɔn, kad matris, ɛntena jɔyometri, chip kɔdinɛt, rɛjista mak, tik ɛn kad ɔriɛnteshɔn kin divɛlɔp frɔm wan tɛknikal drɔin we dɛn dɔn gri fɔ.
di kכrant rεfrεns rεnj fכ dis LF + HF prelam na aprכksimatli 0.55–0.60mm. Aktual tiknes ɛn tolɛreshɔn dipen pan di ilɛktronik kɔmpɔnɛnt dɛn, ɛntena kɔnstrɔkshɔn, sabstret ɛn rikwayd fayn kad stak.
Test ɔl tu di frikshɔn dɛn indipɛndɛnt wan pan ɛvri target rida, dɔn ripit afta yu print, lamin, panch ɛn pɔsnalayz. Inspɛkt bak di tik we di kad tik, di wɔp, di chip-eria flat, di we aw i de pul ɛn di pozishɔn we di ɛntena de.
Di projɛkt kin tɔk bɔt as prelam-onli saplai ɔ as kɔdinɛt kad-matirial strɔkchɔ inklud printabl kɔr shit ɛn Overlay film s. Ɔl di layers fɔ kwalifay togɛda bifo dɛn prodyuz bɔku bɔku wan.
Inklud di ɛksaktɔl chip rɛfrɛns, rida mɔdel, protɔkɔl ɛn data rikwaymɛnt, layout drɔin, ɛntena/chip kɔdinɛt, tik ɛn dimɛnshɔnal tolɛreshɔn, RF akseptɛns krayteria, pak, inspekshɔn plan ɛn aprɔv Golden Sampul.
