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Inlay/ Prelam we dɛn kɔl
Wallis bin de tɔk bɔt am
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Wallis 13.56MHz HF RFID PVC prelam inlay sheet dɛn dɔn ɛnjinia as di fɛnshɔnal kɔr fɔ kɔntaktlɛs smat kad, ID kad, akses kad, ɔtel ki kad, mɛmbaship kad, transpɔt kad ɛn NFC-ɛnibɛl kad program. Ɛni shit de intagret wan sɛlɛkɛt HF chip ɛn ɛntena insay wan kɔntrol PVC strɔkchɔ, we rɛdi fɔ fayn kad-bɔdi laminɛshɔn, printin, panch ɛn pɔsnalayzeshɔn.
B2B projɛkt dɛn kin kɔstɔmayz bay chip mɔdel, protɔkɔl, mɛmori, ɛntena jɔyometri, shit saiz, kad layout, inlay tiknes, chip pozishɔn, matirial, fayn kad kɔnstrɔkshɔn ɛn pak. Standart layout rɛfrɛns dɛn inklud 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ɛn 4 × 10, wit kɔstɔm mɔlti-kad layout dɛn we de fɔ spɛshal lamineshɔn plet ɛn panch ikwipmɛnt.
Chip famili dɛn nɔ fɔ grup ɔnda wan yunivasal kɔmpatibiliti klem. MIFARE Classic, MIFARE Ultralight, NTAG ɛn MIFARE DESFire prodakt dɛn de wok na ISO/IEC 14443 Tayp A ɛnvayrɔmɛnt, we ICODE prodakt dɛn kin tipikul bays pan ISO/IEC 15693. Di ɛksaktɔl chip, rida, aplikeshɔn softwe ɛn sikyɔriti rikwaymɛnt fɔ kɔnfɔm bifo dɛn tyun ɛntena ɛn bɔku bɔku prodakshɔn.
| Tayp fɔ Prodakt | 13.56MHz HF RFID kɔntaktlɛs prelaminated inlay shit fɔ plastic-kad manufakchurin |
| Ɔmɔs tɛm | 13.56MHz HF we de na di bɔdi; protɔkɔl ɛn ɛya intafɛs dipen pan di chip we yu dɔn pik |
| Standart Layout dɛn | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 ɛn kɔstɔm layout dɛn |
| Kɔrɛnt Pej Tiknɛs Rifrɛns | aprכksimatli 0.45 ± 0.02mm fכ sεlekt HF strכkchכ dεm; kɔnfɔm bay chip, ɛntena, matirial ɛn fayn kad stak |
| Di Bays Matirial dɛn | Wait ɔ transparent PVC; PETG ɛn polycarbonate-kɔmpatibl projɛkt dɛn we de ɔnda sɛpret prɔses validɛshɔn |
| Di Opshɔn dɛn fɔ Ɛntena | Embedded kɔpa waya, etched aluminiɔm ɛn projɛkt-spɛsifi k ɛntena kɔnstrɔkshɔn dɛn |
| B2B Savis dɛn | Chip sos, antena dizayn, RF tuning, layout injinɛri, sampul, lamination trayal, ilɛktrik tɛst, QC ripɔt ɛn ɛkspɔt saplai |
Rikwest HF RFID Inlay Sampul ɛn Kot
Prelam inlay na intamɛdiet kad-manufakchurin shit we gɛt di RFID chip, chip-to-antena kɔnɛkshɔn ɛn tuned ɛntena strɔkchɔ insay plastic layers. Nɔmal wan nɔto di kad we dɛn dɔn print we dɛn kin print. Di wan dɛn we de mek kad kin jɔyn di prelam wit print kɔr sheet ɛn transparent ɔvlay, dɔn dɛn kin laminate, kol, panch ɛn pɔsnalayz di kad dɛn we dɔn dɔn.
Di ɛntena de gɛt ɛnaji frɔm di rida fil ɛn i de transfa data bitwin di rida ɛn di chip we dɛn ɛmbas. RF pefɔmɛns dipen pan ɛntena jɔyometri, kɔndɔkt rɛsistɛns, chip kapasiti, rɛsɔnans, kad matirial, mɛtal we de nia, fayn kad tiknɛs ɛn rida fil trɛnk.
PVC kor sheet dɛn we dɛn print, transparent ɔvlay, adeziv, magnɛtik strɛp, signɛshɔn panɛl ɛn protɛktiv finish ad tiknɛs rawnd di prelam. Di target finish kad tiknes fɔ plan frɔm di kɔmplit stak pas frɔm di prelam gej nɔmɔ.
We yu chenj di chip famili, di ɛntena saiz, kɔndɔkt, kad matirial ɔ kad ɛnvayrɔmɛnt kin shift rɛsɔnans ɛn chenj di rid pefɔmɛns. Dizayn we dɛn dɔn gri fɔ wan chip nɔ fɔ yuz bak fɔ ɔda chip ɔtomɛtik wan we dɛn nɔ gɛt RF mɛzhɔmɛnt.
Embedded HF Chip ɛn Antena Strukchɔ
Multi-Kad Shit Layout fɔ Laminashɔn
Di chip fɔ pik frɔm di rida protɔkɔl, mɛmori rikwaymɛnt, sikyɔriti lɛvɛl, transakshɔn spid, layfsaykl, sɛtifiket ɛn softwea ɛkosistim. Brand nem dɛm lɛk MIFARE, NTAG ɛn ICODE na prodak famili pas intachɛnjabl jenɛrik tɛm.
| Chip Famili / Opshɔn | Prɔtokɔlɔ Pozishɔn | Tipik Projɛkt Fit | Impɔtant B2B Notis |
|---|---|---|---|
| Fudan F08 / Kompatibl Legacy 1K Opshɔn | Dɛn kin aks fɔ ISO/IEC 14443 Tayp A kɔmpitabl sistɛm dɛn; di rayt pat nɔmba fɔ kɔnfɔm | Lɛgsi akses, mɛmbaship ɛn instɔl-rida riplesmɛnt prɔjek dɛn | Kɔnfɛm di manifakta, mɛmori, UID, ɔthɛntishɔn, rida kɔmpatibiliti ɛn ligal brand diskrɔpshɔn |
| MIFARE klassik EV1 1K / 4k | ISO/IEC 14443-3 Tayp A, 106kbit/s | Transpɔt, tikɛt, akses ɛn gem infrastukchɔ dɛn we dɔn de | Legacy prodak famili; yuz ɔl usay di sistɛm we dɛn dɔn instɔl nid am ɛn evalyu wan mɔdan sikrit ɔltɛrnativ fɔ nyu dizayn dɛn |
| MIFARE Ultralayt EV1 | ISO/IEC 14443 Tayp A ɛnvayrɔmɛnt | Limitɛd-yuz tikɛt, ivintɛns, lɔyalti ɛn simpul kɔntaktlɛs program dɛn | Match mɛmori, paswɔd ɛn ɔrijinal ficha dɛn to di aplikeshɔn trɛt mɔdel |
| NTAG 213 / 215 / 216. Di wan dɛn we de wok | NFC Fɔm Tayp 2 Tag ɛn ISO/IEC 14443 Tayp A | NFC biznɛs kad, ɔthɛntishɔn link, mobayl ɛnjɔymɛnt ɛn kɔnɛkt prodak | Yuz mɛmori difrɛn bay di mɔdel; kɔnfɔm NDEF saiz, paswɔd ɛn ɔrijinal rikwaymɛnt dɛn |
| MIFARE DƐSFƐR EV3 | ISO/IEC 14443 Tayp A pat 1–4 wit ay-layer sikyɔriti aplikeshɔn dɛn | Sikyu akses, transpɔt, kampus, aydentiti, lɔyalti ɛn mɔlti-aplikeshɔn kad | Rikways ki manejmɛnt, aplikeshɔn pɔsnalayzeshɔn ɛn rida/sɔftwɛ intagreshɔn |
| IKODE SLIX2 / ISO 15693 Famili | ISO/IEC 15693, NFC Fɔm Tayp 5 pozishɔn | Vicinity-kad, laybri, ɛtɛt, aydentifikeshɔn ɛn lɔng-kɔpl-distans projɛkt dɛn | Nɔto fɔ chenj wit ISO/IEC 14443 Tayp A rida dɛn; kɔnfɔm rida protɔkɔl ɛn ɛntena saiz |
Bɔku kɔntaktlɛs standad dɛn de wok na 13.56MHz. Di rida kin sɔpɔt ISO/IEC 14443 Tayp A, Tayp B, ISO/IEC 15693, NFC Fɔm tag tayp ɔ wan prɔpriet aplikeshɔn layt. Frikyuɛnsi nɔmɔ nɔ go du fɔ apruv kɔmpitishɔn.
Banking, pemɛnt, gɔvmɛnt aydentiti ɛn rigyuletɛd transit prɔjek dɛn kin nid sɛtifiket chips, sikyuɔr ki injɛkshɔn, ɔdit manufakchurin, skim aprɔval ɛn aplikeshɔn tɛst. Wan jenɛrik HF inlay nɔ fɔ makɛt as pemɛnt-rɛdi if yu nɔ gɛt di kwalifayeshɔn we dɛn nid.
| Paramita | Avaylabl Dairekshɔn | Prodakshɔn Kɔntrol |
|---|---|---|
| 2 × 5 Layout we yu go yuz | A4-tayp protɔtayp ɛn smɔl-volyum kad prodakshɔn | Kɔnfɛm di rayt dimɛnshɔn fɔ di shit, di kad pitch ɛn di rɛjista mak dɛn |
| 3 × 7 / 3 × 8. Di wan dɛn we de wok | Kɔmɔn industrial smat-kad sheet layout dɛn | Match lamination plet, panch tul, print kor ɛn kolɛshɔn dairekshɔn |
| 4 × 8 / 4 × 10 / 5 × 5. Di wan dɛn we de du di wok | Higher-output layouts ɛn di kɔstɔma-spɛsifi k ikwipmɛnt dɛn | Kontrol RF intarakshכn bitwin adjasent antena dεm εn shit difכmeshכn |
| Kastom Layout | Kastom kad dimɛnshɔn, ki fob, mini kad ɔ spɛshal panch fɔmat | Gi CAD drɔin, finish-prɔdakt autlayn, chip pozishɔn, ɛntena zon ɛn kɔt kliarens |
| Prelam Tiknɛs we de na di wɔl | Krεnt pej rεfrεns aprכksimatli 0.45 ± 0.02mm; kɔstɔm strɔkchɔ dɛn we de | Kɔnfɛm avɛrej, pɔynt vɛryushɔn, chip-bamp zon ɛn fayn-kad stak kɔlkyulɛshɔn |
| Tin dɛn | Wait PVC, transparent PVC ɛn projɛkt-spɛsifi k PETG ɔ PC-kɔmpatibl strɔkchɔ dɛn | Validate shrinkage, bonding, ɔt, RF tuning ɛn finish-kad durabiliti |
Wan kɔmɔn CR80/ID-1 kad nɔmal fɔ dizayn nia 0.76mm, bɔt di ɛksaktɔ tolɛreshɔn dipen pan di kad ɛn ikwipmɛnt spɛsifikɛshɔn. Print kɔr, frɔnt ɛn bak ɔvlay, adeziv ɛn lokal chip tik fɔ de insay di kɔlkyulɛshɔn.
di shit kin de insay avrej gej tolerans we di chip zon de lokal tik. Dizayn di kaviti, kusɛn, prɛs prɛshɔn ɛn layt sɛlɛkshɔn fɔ mek yu nɔ gɛt bamp we yu kin si, wik bonding ɛn chip damej.
| Antena Faktɔ | Ifɛkt pan di Kad | Rikwayd Validɛshɔn |
|---|---|---|
| Kɔyl Jɔyometri | Kontrol induktans, kɔpl eria ɛn avaylabl kɔt kliarens | Match chip kapasiti, kad dimɛnshɔn, rida ɛn target ɛnvayrɔmɛnt |
| Antena we gɛt kɔpa waya | Sɔpɔt ɛmbaded kɔyl dizayn ɛn fleksibul jɔyometri | Waya dayamita, embedding dip, kros ova, bond joyn ɛn kɔntinyuiti |
| Antena Aluminium we dɛn dɔn et | Sɔpɔt ay-volyum patɛn ɛntena prodakshɔn | Trace width, resistans, korכshכn protεkshכn, chip atachmεnt εn lamination bihayv |
| Chip Kapasitɛns | Chenj di rezonans na di antena/chip sirkit | Ritune we yu de chenj chip famili ɔ pakej |
| Kad Stak we dɛn kin yuz | Plastik, ink, fɔyl, mɛtalayz grafik ɛn ɔvlay kin chenj kɔpl ɛn detyun di ɛntena | Test di komplit kad, nɔto jɔs di bare prelam |
| Yuz Envayrɔmɛnt | Mɛtal sɔfays, fon, walet, kad we de nia ɛn likwid kin afɛkt di wok we dɛn de du | Evaluate di intended rida, mounting kondishɔn ɛn yuz handling |
Rid distans dipen pan di chip, ɛntena eria, kwaliti faktɔ, rida pawa, rida ɛntena, protɔkɔl, kad ɔriɛnteshɔn, fayn kad stak ɛn envayrɔmɛnt. Di kot fɔ sho wan tɛst rida ɛn pas/fail distans pas fɔ yuz wan yunivasal nɔmba.
Antena dɛn we de na wan mɔlti-kad sheet nid fɔ gɛt inof spays frɔm di layn dɛn we dɛn de kɔt, di ol dɛn we dɛn de rɛjista ɛn di pozishɔn dɛn we de nia dɛn. Shit-lɛvɛl RF tɛst dɛn fɔ akɔn fɔ kɔpl bitwin ɛntena dɛn bifo dɛn panch di kad dɛn.
| Layer | Fɔnkshɔn | Ki Kɔntrol |
|---|---|---|
| Frɔnt Ɔvlay | Protɛkt grafik dɛn we dɛn print ɛn gi glos, mat, frɔst ɔ sikyɔriti finish | Tiknɛs, bonding, abrashɔn ɛn pɔsnalayzeshɔn kɔmpatibiliti |
| Frɔnt Print Kɔr | I de kɛr fiks grafik, tɛks, logo ɛn sikyɔriti printin | Print rɛjista, ink kia, shrinkage ɛn RF-sef mɛtal ifɛkt |
| H. F. Prelam Inlay we de na di wɔl | I gɛt di chip, ɛntena, ilɛktrik jɔyn dɛn ɛn sɔpɔtin plastic layers | RF tuning, chip pozishɔn, tiknɛs, alaynɛshɔn, bond ɛn ilɛktrik yield |
| Bak Print Kɔr | Balans di frɔnt layt ɛn kɛr rivas-sayd artwok | Gej balans, magnɛtik-strayp pozishɔn ɛn print kɔvarej |
| Bak Ɔvlay | Protɛkt artwok ɛn i kin inklud strɛp, sayn panɛl ɔ sikyɔriti ficha | Bonding, flatnɛs, ɛnkɔdin ɛn fayn sɔfa |
Big mɛtaliz fɔyl, kɔnduktiv ink ɔ mɛtal layers nia di ɛntena kin ridyus kɔpl ɔ shift tiuni. Inklud fayn fayn dɛkɔretiv matirial dɛn na RF tɛst ɛn mentɛn klia zon usay nid de.
Frɔnt ɛn bak layt gej, matirial dairekshɔn ɛn print kɔvarej fɔ balans usay i pɔsibul. Asimetrik stak kin prodyuz kad kɔl afta dɛn dɔn ɔt ɛn kol.
Kɔnfɛm di stak we dɛn dɔn gri fɔ: Rikɔd ɛvri ɔvlay, print kɔr, inlay, adeziv, strɛp ɛn sikyɔriti layt.
Kɔndishɔn ɔl di sheet dɛn: Stebul di matirial dɛn na di prodakshɔn ɛnvayrɔmɛnt ɛn kip dɛn klin, flat ɛn dray.
Verifay oriɛnteshɔn: Match di shit dairekshɔn, kad pitch, chip pozishɔn, ɛntena pozishɔn, artwok ɛn panch mak dɛn.
Divεlכp di laminεshכn saykl: Establish hεt, prεshכn, dwεl, plet finish, rilis shit εn kol fכ di εksakεt mεtirial stak.
Protekt di chip zon: Kɔntrol lokal prɛshɔn ɛn avɔyd had patikyula, plet dɛfɛkt ɔ pasmak matirial flɔ rawnd di IC.
Kul ɔnda kɔntrol prɛshɔn: Kul de inflɔws flatnɛs, layt adheshon, chip strɛs ɛn dimɛnshɔnal stebiliti.
Test bifo yu panch: Chɛk di shit-lɛvel ilɛktrik funkshɔn, di apinɛns, tik, bond ɛn rɛjista.
Test finish kad: Panch, pɔsnalayz ɛn verify RF pefɔmɛns, dimɛnshɔn, bɛnd ɛn aplikeshɔn kɔmpitibliti.
| Lamination Risk | Posisibul Kɔz | Kɔrɛkt Dairekshɔn |
|---|---|---|
| Chip we nɔ de wok fayn | Ɔt pasmak, lokal prɛshɔn, ilɛktrɔstatik damej ɔ wik chip kɔnɛkshɔn | Rivyu chip pakej limit, prɔses prɛshɔn, ESD kɔntrol ɛn kɔnɛkshɔn kwaliti |
| Opin Antena Sakit | Brok kɔndɔkta, po jɔyn, kɔt damej ɔ strɛch pasmak | Inspek kɔntinyuiti, kɔndɔkt pat, panch kliarens ɛn mɛkanikal strɛs |
| Wik Rid Rɛnj | Detuning, kɔndɔkta lɔs, rida mismatch, metalized artwok ɔ kad-stak chenj | Mekɔp rɛsɔnans ɛn rityun yuz di kad we dɔn kɔmplit ɛn di target rida |
| Chip Bump we pɔsin kin si | Insufishɛnt kɔmpɛnshɔn, pasmak mɔdyul tik ɔ nɔ ivin prɛshɔn | Optimayz lokal kaviti, layt gej, kusɛn ɛn prɛs kɔndishɔn |
| Delaminɛshɔn | Kɔntaminɛshɔn, matirial we nɔ kɔmpitabl, lɔw ɔt ɔ pwɛl kol | Rivyu matirial kɔmpatibiliti, klin, saykl ɛn peel pefɔmɛns |
| Shit ɔ Kad Wɔpej | Stak we nɔ balans, we de ɔt pasmak, prɛshɔn we nɔ ivin ɔ kol we nɔ de kɔntrol kwik kwik wan | Balans layers ɛn optimize di ɔt, plet flatnɛs ɛn kol |
| Inspekshɔn Aytem | Rikɔmɛnd B2B Kɔntrol |
|---|---|
| Chip Aydentiti fɔ di pɔsin | Verifay manifakta, ɛksaktɔ pat nɔmba, mɛmori, UID opshɔn, protɔkɔl ɛn lɔt traysabiliti |
| Ilɛktrik Fɔnkshɔn | Rid chip UID, mɛmori ɔ difayn kɔmand we dɛn sɛt na ɛvri kad pozishɔn akɔdin to di inspekshɔn plan |
| Antena Kɔntinyu | Ditekt opin sɔrkwit, shɔt, wik jɔyn, kɔndɔkta dɛfɛkt ɛn krɔs-ɔva we dɔn pwɛl |
| Rezonans / RF Pɔfɔmɛnshɔn | Mekɔp gri RF paramita ɔ fɛnshɔnal rid distans yuz difayn tɛst ikwipmɛnt ɛn fiks |
| Chip ɛn Antena Pozishɔn | Chek pozishɔn agens CAD, kad autlayn, panch kliarens ɛn neba ɛntena dɛn |
| Dimenshɔn dɛn fɔ di Sheet | Lɛngth, wit, skwea, kad pitch, rɛjista ol ɛn edj kwaliti |
| Tik ɛn Flatnɛs | Avrej tiknes, lokal chip-zon tiknes, kכl, bow εn pכynt-to-pכynt vεryushכn |
| Inspekshɔn we pɔsin kin si | Kɔntaminɛshɔn, bɔbul, wrinkles, blak spat, kɔndɔkt ɛksplɔshɔn, skrat ɛn layt dɛfɛkt |
| Kad Tɛst we dɛn dɔn dɔn | RF fכnshכn, dimεnshכn, tiknes, bεnd, torshכn, hεt, humiditi, pil εn rida kompitibiliti |
| Traceability we pɔsin kin tray fɔ no | Chip lot, antena lot, PVC lot, prodakshɔn de, layout, tɛst program, shit nɔmba ɛn pak rɛkɔd |
Ful inspekshɔn kin rifer to ilɛktrik rid tɛst na ɛvri pozishɔn, we dimɛnshɔnal, pil ɛn distrɔktiv tɛst dɛn kin kɔmɔn fɔ sampul. Di spɛsifikɛshɔn fɔ bay fɔ difayn di tɛst aytem dɛn, fiks, akseptans krayteria, sampling plan ɛn ripɔt.
Prelam kin pas ilɛktrik tɛst ɛn stil fel afta i dɔn ɔt pasmak, prɛshɔn, panch ɔ pɔsnalayz. B2B kwalifayeshɔn fɔ inklud ɔl tu di inkam-inlay ɛn finish-kad pefɔmɛns.
| Aplikeshɔn | Chip / Prɔtokɔlɔ Dairekshɔn | Kritikal Validɛshɔn |
|---|---|---|
| Wokman ɛn Akses Kad | Legacy Type A, MIFARE Plus ɔ DESFire akɔdin to di akses sistɛm we dɛn dɔn instɔl | Rida kɔmpatibiliti, ki manejmɛnt, inrɔlmɛnt ɛn ɛvride bɛnd |
| Hotel Ki Kad dɛn | Chip we di ɔtel-lɔk pletfɔm nid | Lɔk ɛnkɔda, gɔst-mɛnejmɛnt sistem, kad tik ɛn humiditi ɛksplɔshɔn |
| Transpɔt ɛn Kampus Kad dɛn | Sikyuɔr malti-aplikeshɔn chip lɛk DESFire usay sistɛm akitɛkɛt nid am | Transakshɔn spid, sikyɔriti, rida ɛstate, pɔsnalayzeshɔn ɛn layfsaykl |
| Membaship ɛn Loyalti Kad dɛn | Tayp Wan mɛmori chip, NTAG ɔ sikyuɔr aplikeshɔn chip akɔdin to di program dizayn | Rida ɔ fon kɔmpatibiliti, database, prayvet pat ɛn ripit yuz |
| NFC Biznɛs ɛn Maketin Kad dɛn | NTAG ɔ ɔda NFC Fɔm kɔmpitabl chip | NDEF kapasiti, fon kɔmpatibiliti, URL sikyɔriti ɛn skan pozishɔn |
| Laybri, Asɛt ɛn Vicinity Kad dɛn | ISO/IEC 15693 / ICODE-tayp sɔlvishɔn | Rida protɔkɔl, ɛntena saiz, target rɛnj, anti-kɔlishɔn ɛn EAS rikwaymɛnt |
| Sikyu Aydentiti ɛn Peymɛnt Projɛkt dɛn | Sɛtifiket sikyuɔr chip ɛn aprɔv aplikeshɔn akitɛkɛt | Sɛtifiket, ki injɛkshɔn, ɔdit sapɔt chen ɛn skim-spɛsifi k aprɔval |
HF RFID Inlay Aplikeshɔn fɔ Smat Kad Program dɛn
| Data / Sikyuriti Aytem | B2B Rikwaymɛnt |
|---|---|
| UID we dɛn kɔl | Kɔnfɛm UID lɔng, fiks ɔ random ID bihayvya, database fɔmat ɛn rida sɔpɔt |
| Memori Ɛnkɔdin | Difayn data strɔkchɔ, sɛktɔ/fayl/pej, NDEF rɛkɔd, lɔk bit ɛn verifyeshɔn |
| Ki dɛn fɔ Ɔtɛnɛshɔn | Difayn ki ɔnaship, injɛkshɔn prɔses, transpɔt protɛkshɔn, divaysifikeshɔn ɛn ɔdit trel |
| Paswɔd / Akses Kɔnfigyushɔn | Spɛsifik paswɔd, akses bit, kɔnta, ɔrijinal chɛk ɛn lɔk-stet tɛst usay dɛn sɔpɔt |
| Data we dɛn dɔn print | Link print nɔmba, barɔd ɔ QR kɔd to chip data tru kɔntrol rikɔnsilieshɔn |
| Kad dɛn we dɛn nɔ gri fɔ tek | Segreget, kɔnt ɛn pwɛl kad dɛn we gɛt layv ki, aydentifaya ɔ ɛnkɔd data we sikrit wan |
Wan sistɛm we de gi akses nɔmɔ frɔm wan aydentifaya we pɔblik rid kin bi vulnerable fɔ kɔpi ɔ ɛmulayt. Sekyuriti-sɛnsitiv projɛkt dɛn fɔ yuz chip ɛn bakɛnd akitɛkɛt we de sɔpɔt di rayt kriptografik ɔthɛntishɔn.
Fɔ saplae wan sikrit chip nɔ kin inklud fɔ sɛtup aplikeshɔn ɔ ki manejmɛnt ɔtomɛtik wan. Difayn udat de mek, kip, lod ɛn verify ki, ɛn if dɛn nid fɔ gɛt ɔdit sikyɔriti-pɔsinalayzeshɔn ɛnvayrɔmɛnt.
Haybrid smart kad kin jɔyn HF wit LF, UHF, kɔntakt chip ɔ ɔda HF aplikeshɔn. Dɛn strɔkchɔ ya nid mɔ ples, tek tɛm separet di ɛntena, ɔda lokal tiknɛs kɔntrol ɛn wan dediket lamination ɛn tɛst program.
| Haybrid Strukchɔ | Yuz Kes | Ɛnjinia Risk |
|---|---|---|
| LF + HF we de na di wɔl | Maygrɛshɔn frɔm lɛgsi proksimiti akses to HF smat-kad sistɛm dɛn | Antena spɛs, mutual intarakshɔn, kad tik ɛn dual-rida tɛst |
| HF + UHF we de na di wɔl | Shot-rɛnj aydentiti plus lɔng-rɛnj trakin | Difrɛn ɛntena sistɛm, matirial ifɛkt ɛn UHF sɛnsitiviti nia di bɔdi ɔ mɛtal |
| Tu HF Chips we dɛn kɔl | Separet aplikeshɔn ɔ indipɛndɛnt ishua domɛyn dɛn | Rida sɛlɛkshɔn, ɛntena kɔpl, data ɔnaship ɛn kad-layout kɔnstrakshɔn |
| Kontakt + Kɔntaktlɛs | Dual-intafɛs sikyɔriti aydentiti, tɛlikɔm ɔ pemɛnt akitɛkɛt | Modul kaviti, antena kɔnɛkshɔn, laminɛshɔn, sɛtifikeshɔn ɛn pɔsnalayzeshɔn |
wan standad singl-frikyuεns HF prelam nכ fכ dεskrεb as i de sכpכt LF כ UHF כtomatik wan. Malti-frikyuɛnsi strɔkchɔ dɛn nid dɛn yon drɔin, chip list, RF tɛst, tiknɛs spɛsifikɛshɔn ɛn prayz.
Stɔr prelam sheet dɛn flat insay sial, klin ɛn dray pak we de fa frɔm dairekt san layt ɛn ɔt.
Yuz rigid bod, intaliv ɛn protɛkt katon fɔ mek i nɔ bɛn, skrach ɛn chip-zon prɛshɔn.
Avɔyd strɔng ilɛktrɔstatik dischaj ɛn yuz di rayt ESD hanlin kɔntrol usay nid de.
Nɔ put ebi ebi lod dɛn we nɔ ivin na di shit stak ɔ alaw di palet fɔ ɔp.
Kondishɔn matirial na di lamination rum bifo dɛn prosɛs we di westɛm ɛn prodakshɔn kɔndishɔn difrɛn.
Identify ɛvri pak bay chip mɔdel, ɛntena dizayn, layout, tiknes, batch ɛn inspekshɔn stetɔs.
Yuz fɔs-in, fɔs-ɔut invɛntari ɛn ritest matirial afta yu dɔn kip ɔ transpɔt fɔ lɔng tɛm.
Protekt Flat Paking fɔ HF RFID Prelam Shit dɛn
Rilibul prelam prodakshɔn nid fɔ kɔntrol ɛntena ɛmbadin ɔ ɛtch, chip atɛshɔn, shit rɛjista, plastic laminɛshɔn, ilɛktrik tɛst, dimɛnshɔnal inspekshɔn, klin hanlin ɛn batch traysabiliti. Di chip we dɛn dɔn gri fɔ drɔ, ɛntena drɔ ɛn RF tɛst we fɔ de fiks fɔ ripit ɔda pas dɛn gri fɔ chenj we dɛn kɔntrol.
RFID Inlay Projek ɛn Tɛknikal Tim
Prelam Inlay Prodakshɔn Wokshɔp
Antena ɛn Inlay Prɔses Kɔntrol
Ilɛktrik ɛn Dimɛnshɔnal Inspekshɔn
Aplikeshɔn-bɛs chip sɛlɛkshɔn: Lɛgsi akses, NFC, sikyuɔr malti-aplikeshɔn ɛn ISO 15693 prɔjek dɛn kin separet bay protɔkɔl ɛn sikyɔriti nid.
Kastom antena injinɛri: Dɛn kin rivyu kɔyl jɔyometri, kɔndɔkta, chip kapasiti, kad autlayn ɛn target rida togɛda.
Fleksibul sheet layout: Standad mɔlti-kad arenjmɛnt ɛn kɔstɔma-spɛsifi k kad pitch dɛn de.
Kad-matirial intagreshɔn: PVC prelam kin kɔdinɛt wit print kɔr, ɔvlay, magnɛtik strɛp ɛn finish-kad strɔkchɔ.
Kwalifayeshɔn sɔpɔt: Sampul, lamineshɔn trayal, RF tɛst, tiknɛs chɛk ɛn finish-kad verifyeshɔn de ridyus di prɔjek risk.
Faktɔri-dayrɛkt B2B saplai: I fayn fɔ smat-kad faktri, printa, kɔnvɔta, sistɛm intagreta, isyu, impɔt ɛn distribyushɔn.
Aplikeshɔn, rida brand/mɔdel, protɔkɔl ɛn instɔl sɔftwɛl pletfɔm.
Eksakt chip manifakta ɛn pat nɔmba, mɛmori, UID ɛn sikyɔriti rikwaymɛnt.
Shit layout, totɛl dimɛnshɔn, kad pitch, rɛjista mak ɛn kwantiti.
Kad saiz, antena klia zon, chip pozishɔn ɛn panch drɔin.
Prelam matirial, kɔlɔ, nominal tik ɛn tolɛreshɔn.
Antena teknɔlɔji, target rɛsɔnans ɔ fɛnshɔnal rid-rɛnj tɛst.
Faynal kad stak, print kɔr, ɔvlay, mɛtal printin, strɛp ɔ signɛshɔn panɛl.
Lamination pres, ɔt, prɛshɔn, dwɛl, kɔl ɛn plet dimɛnshɔn.
Ilektrikal tɛst, RF tɛst, dimɛnshɔnal inspekshɔn ɛn akseptɛns krayteria.
Ɛnkɔdin, ki injɛkshɔn, UID list, vɛriɔbul data ɔ database rikɔnsilieshɔn.
Prototype kwantiti, anual fɔkɔs, ripit-ɔda schedule ɛn chenj-kɔntrol rikwaymɛnt.
Pak, inspekshɔn dɔkyumɛnt, dɛstineshɔn pɔt ɛn di de we dɛn aks fɔ dilivri.
Diskus Yu HF RFID Inlay Projek
Na kad-manufakchurin kɔr shit we gɛt 13.56MHz chip ɛn ɛntena insay plastic layers. I laminated wit print kor ɛn ɔvlay fɔ prodyuz finish kɔntaktlɛs kad.
Nɔ. Prelam na intamɛdiet fɛnshɔnal layt. Kad dɛn we dɔn dɔn nid fɔ print, ɔvlay, lamin, kol, panch ɛn opshɔnal pɔsnalayzeshɔn ɔ ɛnkɔdin.
Projek dɛn kin yuz ISO/IEC 14443 Tayp A, Tayp B, ISO/IEC 15693 ɔ NFC Fɔm kɔmpitabl chips. Di ekzak protɔkɔl dipen pan di IC ɛn rida sistɛm we yu dɔn pik.
Nɔ, dɛn na difrɛn prɔdak famili dɛn we gɛt difrɛn protɔkɔl, mɛmori, kɔmand, sikyɔriti ɛn aplikeshɔn. Kɔnfɛm di rayt chip ɛn rida bifo yu ɔda.
Wi kin tɔk bɔt dɛn kayn lɛgsi 1K-kɔmpatibl opshɔn dɛn ya. Gi di ɛksaktɔl chip rikwaymɛnt ɛn rida sampul, bikɔs di manifakta, UID, mɛmori ɛn ɔthɛntishɔn kɔmpatibiliti fɔ verify.
I stil rili impɔtant fɔ di lɛgsi sistem dɛn we dɛn dɔn instɔl, bɔt di mɔdan sikyɔriti prɔjek dɛn fɔ evalyu di ɔda we dɛn we de naw lɛk MIFARE DESFire ɔ MIFARE Plus akɔdin to di sistɛm akitɛkɛt.
NTAG 213, 215 ɔ 216 ɛn ɔda NFC Fɔm kɔmpitabl chips na kɔmɔn opshɔn dɛn. Pik di mɔdel frɔm di NDEF mɛmori we yu nid, fon kɔmpitibliti ɛn sikyɔriti ficha dɛn.
Wan sikyuɔr mɔlti-aplikeshɔn chip lɛk MIFARE DESFire kin fayn, bɔt rida sɔpɔt, ki manejmɛnt, sɛtifikeshɔn, aplikeshɔn fayl dɛn ɛn sɔftwɛl fɔ kɔnfɔm.
ISO/IEC 15693 de yuz fɔ vicinity-kad aplikeshɔn usay di rida, ɛntena saiz ɛn target kɔpl distans difrɛn frɔm proksimiti-kad sistem dɛn we dɛn bayz pan ISO/IEC 14443.
Di kɔmɔn opshɔn dɛn na 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ɛn 4 × 10. Dɛn kin mek kɔstɔm layout dɛn frɔm di pɔsin we bay in lamination ɛn panch drɔin.
di kכrant prodakt pej rεfrεns aprכksimatli 0.45 ± 0.02mm fכ sεlekt HF strכkchכ dεm. Faynal tiknes dipen pan chip, antena, matirial, kad stak ɛn lokal chip-zon rikwaymɛnt.
Yɛs. Gi di target finish-kad tiknes, ovalay ɛn print-kɔr gej, chip pakej ɛn lamination prɔses so di kɔmplit stak kin kɔlkul.
Yɛs. Antena jɔyometri kin divɛlɔp rawnd di chip kapasiti, kad saiz, rida, target pefɔmɛns, chip pozishɔn ɛn kɔt kliarens.
Wi kin tɔk bɔt di opshɔn dɛn we dɛn kin yuz fɔ mek kɔpa-waya we dɛn dɔn ɛmbas ɛn di wan dɛn we dɛn dɔn ɛch-aluminiɔm. Di bɛst kɔnstrɔkshɔn dipen pan volyum, rɛsistɛns, tiknɛs, bonding, kad dizayn ɛn RF target.
No yunivasal rɛnj nɔ de. I dipen pan chip, ɛntena, rida, kad stak, ɔriɛnteshɔn ɛn envayrɔmɛnt. Difayn wan tɛst rida ɛn minim funkshɔn distans.
I kin yuz afta RF tɛst. Big mɛtal fɔyl ɔ kɔnduktiv ink nia di ɛntena kin detune ɔ shild di kɔntaktlɛs intafɛs.
Dɛn kin rivyu ɔda matirial strɔkchɔ dɛn, bɔt shrinkage, bonding, lamination temperature, RF tuning ɛn finished-card durability fɔ validet separet wan.
di prelam na nכmal wan dεn de sכpכt am as blank fכnshכnal kכr. Bɔku tɛm, dɛn kin yuz printin fɔ difrɛn kɔr sheet dɛn, pan ɔl we dɛn kin tɔk bɔt di kɔnstrɔkshɔn dɛn we gɛt fɔ du wit di prɔjek.
Nɔ yunivasal sɛtin nɔ fɔ pablish fɔ ɛvri strɔkchɔ. Divεlכp tεmprachכ, prεshכn, dwεl εn kol arawnd di εksakεt PVC, כvlay, ink, chip εn antena kכnstrכkshכn.
Yuz kɔmpitabl chip pak, kɔntrol lokal tik, klin plet, balans prɛshɔn, wan aprɔv ɔt saykl ɛn ilɛktrik tɛst bifo ɛn afta laminɛshɔn.
Yu kin spɛsifa ful ilɛktrik tɛst. Di agrimɛnt fɔ bay fɔ difayn us kɔmand dɛn de chɛk na ɛvri pozishɔn ɛn us distrɔktiv ɔ dimɛnshɔnal tɛst dɛn de yuz sampling.
Yu kin tɔk bɔt UID ridin, mɛmori ɛnkɔdin, NDEF raytin ɔ aplikeshɔn pɔsnalayzeshɔn. Sikyu-ki savis dɛn nid fɔ gɛt sɛpret kɔntrol spɛsifikɛshɔn.
Dɛn kin mek haybrid dizayn dɛn as difrɛn prɔdak dɛn. Dɛn nid dediket ɛntena layout, tiknɛs planin, rida tɛst ɛn prayz.
Yɛs. Di prɔses we dɛn kin lɛk na fɔ tɛst di prelam, laminate di kɔmplit kad stak, panch kad dɛn ɛn verify RF, mɛkanikal ɛn pɔsnalayzeshɔn pefɔmɛns.
MOQ dipen pan chip we de, kɔstɔm ɛntena tul, layout, matirial, tik, tɛst program, ɛnkɔdin ɛn if dɛn kin yuz wan aprɔv standad dizayn.
Gi di ɛksaktɔl chip, rida, protɔkɔl, layout, shit saiz, kad drɔ, tik, ɛntena target, fayn kad stak, tɛst, kwantiti, pak ɛn ples fɔ go.
Kɔntakt Wallis Plastik fɔ kɔstɔmayz 13.56MHz HF RFID PVC prelam inlay shit fɔ akses, ID, ɔtel, mɛmbaship, transpɔt, NFC ɛn smat-kad manufakchurin. Wi tim de sɔpɔt chip sɛlɛkshɔn, ɛntena dizayn, shit layout, RF tuning, lamination trayal, ilɛktrik tɛst, ɛnkɔdin, kwaliti spɛsifikɛshɔn ɛn faktri-dayrɛkt B2B saplai.
