Kastom 125kHz & 13.56MHz RFID PVC Prelam inlay s

Kastom 125kHz ɛn 13.56MHz RFID PVC Prelam inlay Shit dɛn

Wallis de saplae 125kHz LF , 13.56MHz HF ɛn LF + HF dual-frikyuɛnsi RFID PVC prelam inlay shit fɔ akses-kɔntrol kad, wokman ID, ɔtel ki kad, mɛmbaship kad, kampus kad, transpɔt kredibiliti ɛn sistɛm-maygrɛshɔn prɔjɛkt dɛn. Ɛni shit de intagret di chip we dɛn dɔn pik, tuned ɛntena ɛn plastic sɔpɔt layers, we rɛdi fɔ fayn kad lamination, printin, panch ɛn pɔsnalayzeshɔn.

Standart layout rɛfrɛns dɛn inklud 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ɛn 4 × 10. Dɛn kin divɛlɔp kɔstɔm shit saiz, kad pitch, chip pozishɔn, ɛntena jɔyometri, matirial strɔkchɔ ɛn tiknes fɔ di pɔsin we bay in lamineshɔn plet, printin shit ɛn panch tul dɛn.

Frɛkuɛns nɔmɔ nɔ de pruv se i kɔmpitabl. TK4100, EM4200 ɛn ATA5577-tayp lɔw-frikyuɛnsi prodak dɛn gɛt difrɛn rid-onli ɔ rid/rayt bihayvya, kɔdin ɛn kɔnfigyushɔn opshɔn dɛn. HF chips kin yuz ISO /IEC 14443 Tayp A, ISO /IEC 14443 Tayp B, ISO /IEC 15693 ɔ NFC Fɔm spɛsifikɛshɔn dɛn. Di ɛksaktɔl rida, chip mɔdel, protɔkɔl, mɛmori, sikyɔriti ɛn aplikeshɔn softwe fɔ kɔnfɔm bifo ɛntena dizayn ɛn mas prodakshɔn.

Tayp fɔ Prodakt	LF , HF ɔ dual-frikyuɛnsi RFID prɛlaminɛt inlay shit fɔ mek plastic-kad
Frikyuɛnsi Opshɔn dɛn	125kHz LF , 13.56MHz HF , LF + HF haybrid ɛn projɛkt-spɛsifi k malti-tɛknɔlɔji strɔkchɔ dɛn
Standart Layout dɛn	2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 ɛn kɔstɔm kad layout dɛn
Orijinal LF Tiknɛs Rifrɛns	aprכksimatli 0.50–0.60mm fכ sεlekt LF strכkchכ dεm; di ekzak tiknes dipen pan chip, antena, matirial en fainal kad stak
Di Tin dɛn we Yu Go Yuz fɔ Du	Wait ɔ transparent PVC ; PETG εn polycarbonate-kompatibl strכkchכ dεm we de sכbjεkt to sεparat kwalifayshכn
Di Opshɔn dɛn fɔ Ɛntena	Embedded kɔpa-wayr LF / HF kɔyl dɛn, ɛch aluminiɔm HF ɛntena dɛn ɛn kɔstɔm dual-antena dizayn dɛn
B2B Sɔpɔt	Chip selekshɔn, ɛntena injinɛri, CAD layout, sampul, lamination trayal, RF tɛst, ɛnkɔdin, QC ripɔt ɛn ɛkspɔt saplai

Rikwest RFID prelam Sampul ɛn Kot

Wetin Na RFID PVC Prelam inlay Shit?

RFID prelam inlay na di intanεt fכnshכnal shit we dεn kin yuz fכ mek wan kכntaktlεs plastic kad. Di ɛntena, intagreted sɔrkwit ɛn ilɛktrik kɔnɛkshɔn dɛn de ɛmbas bitwin plastic layers bifo di pɔsin we bay ad print kɔr shit ɛn transparent Overlay film s. Di stak we dɔn kɔmplit na laminated, kol, panch ɛn pɔsnalayz insay kad dɛn we dɔn dɔn.

A prelam Nɔto Kad we Dɛn Dɔn Print

Di prelam nɔmal fɔ kɛr ɛni kɔstɔma artwok. Printin de aplay fɔ separet frɔnt ɛn bak kɔr shit, ɛp fɔ protɛkt di chip ɛn ɛntena we i de alaw kɔntrol kɔlɔ, Overlay film ɛn sikyɔriti-ficha prodakshɔn.

LF ɛn HF Yuz Sɛparet Ɛntena Sistɛm dɛn

Dual-frikyuɛnsi kad gɛt sɛpret LF ɛn HF sɛrkyut dɛn. Di tu chips nɔ kin bi wan protɔkɔl. Ɛni frikshɔn fɔ disayn, tyu, rid ɛn—we dɛn sɔpɔt am—rayt am tru di rayt rida intafɛs.

Di Kad we Dɛn Dɔn De Ditarmin di Rial Pɔfɔmɛnshɔn

Print layers, metalized grafik, magnɛtik strɛp, adeziv, kad tik, nia mɛtal ɛn rida jɔyometri kin chenj RF pefɔmɛns. So kwalifayeshɔn fɔ inklud di ful laminated ɛn panch kad, nɔto jɔs di bare prelam.

Singl-Frikuɛns ɛn Dual-Frikuɛns Prodakt Opshɔn

Inlay Tayp	Kɔnstrɔkshɔn	Tipik B2B Yuz
125kHz LF prelam	Wan LF chip ɛn wan tuned lɔw-frikyuɛnsi kɔpa kɔyl	Lɛgsi proksimiti akses, pak, mɛmbaship ɛn aydentifikeshɔn sistɛm
13.56MHz HF prelam di 13.56MHz.	Wan HF chip ɛn wan ISO / NFC -kɔmpatibl ɛntena we dɛn pik fɔ di aplikeshɔn	Sikyu akses, transpɔt, kampus, ɔtel, NFC ɛn mɔlti-aplikeshɔn kad dɛn
LF + HF Dual-Frikuɛns prelam	Separet LF ɛn HF chips wit sɛpret kɔyl dɛn insay wan kad bɔdi	Maygrɛshɔn frɔm lɛgsi 125kHz rida dɛn to mɔdan HF smat-kad infrastukchɔ
LF + UHF ɔ HF + UHF	Bɔku chips ɛn frikshɔn-spɛsifi k ɛntena dɛn na wan strɔkchɔ	Akses plus long-range motoka, ɛtɛt ɔ pɔsin trakin
Kontakt + Kontaktlɛs Haybrid	RFID prelam plus wan mil kɔntakt-mɔdyul kaviti ɔ dual-intafɛs akitɛkɛt	Sikyuɔr aydentiti, tɛlikɔm, bank ɔ rigyuletɛd kredibiliti prɔjek afta kwalifayeshɔn

Dual-Frequency Kad dɛn we de sɔpɔt Maygrɛshɔn

Ɔganayzeshɔn dɛn kin gi wan kredɛns we de wok wit ol LF rida dɛn ɛn nyu HF rida dɛn we dɛn de ɔpgrɛd infrastukchɔ. Di akses-kɔntrol database fɔ stil map ɛn manej di aydentifaya ɔ aplikeshɔn dɛn frɔm ɔl tu di teknɔlɔji dɛn.

Hybrid Inlay s Rikwayr Sɛparet Ɛnjinia

If yu ad sɛkɔn chip i de mek di lokal tik, di ɛntena kɔnjɛshɔn, di matirial flɔ ɛn i de mek di tɛst kɔmplisiti go ɔp. Wan singl-frikyuɛnsi dizayn nɔ fɔ kɔnvɔyt to dual frikshɔn if dɛn nɔ gɛt nyu layout, lamination trial ɛn RF kwalifayeshɔn.

LF 125kHz Chip Selekshɔn

LF Chip Opshɔn	Rid / Rayt Pozishɔn	Tipik Yuz	B2B Bay Notis
TK4100-Tayp we yu kin yuz	Kɔmɔn lɛgsi rid-onli proksimiti kɔnfigyushɔn; di ekzak spɔlayt ɛn ɛnkɔdin fɔ kɔnfɔm	Besik akses-kɔntrol ɛn aydentifikeshɔn sistɛm dɛn	Gi wan rida sampul ɛn di ɔtput fɔmat we dɛn nid; nɔ tek am se ɔl di 'TK4100' prodak dɛn na di sem
EM4200 we yu de yuz	Factory-programmed low-frikyuɛnsi rid-onli aydentifikeshɔn IC	Akses kɔntrol, west mɛnejɛmɛnt ɛn sɔm aydentifikeshɔn fɔmat dɛn we dɛn dɔn pik	Kɔnfɛm kɔd lɔng, mɔdyuleshɔn, mask opshɔn ɛn rida kɔmpatibiliti bifo prodakshɔn
ATA5577 / T5577-Tayp we yu de yuz	Programmabl LF rid/rayt transpɔnda wit kɔnfigyurabl mɔdyuleshɔn ɛn kɔdin	Konfigyurebl aydentifikeshɔn, maykreshɔn, tɛst ɛn kɔmpitabl lɛgsi fɔmat dɛn	Difayn kɔnfigyushɔn blɔk, data fɔmat, paswɔd, lɔk bit ɛn programin verifyeshɔn
EM4305 / Ɔda R/W LF	Rid/rayt LF opshɔn dɛn we de fɔ aplikeshɔn-spɛsifi k fɔmat dɛn	Akses, industrial aydentifikeshɔn ɛn programmabl kredibiliti	Kɔnfɛm di rayt IC stetɔs, mɛmori, protɛkshɔn ɛn programma sɔpɔt

Rid-Onli ɛn Rid/Rayt LF Chips Na Difrɛn Prodak

EM4200-tayp kredibiliti nɔmal fɔ transmit wan faktri-program aydentifaya, we ATA5577-tayp divays dɛn kin kɔnfigyut ɛn rayt bay wan kɔmpatibl programma. Di kot fɔ sho if di pɔsin we bay nid fɔ gɛt fiks nɔmba, kɔstɔma ɛnkɔdin ɔ blank we dɛn kin program.

ISO 11784/11785 Kɔmpatibiliti Na Kɔnfigyushɔn-Spɛsifi k

Dɛn standad ya gɛt fɔ du wit animal-identifikeshɔn data strɔkchɔ ɛn ɛya-intafɛs fɔmat. Dɛn nɔ fɔ aplay dɛn as blanket klem to ɛvri TK4100, EM4200 ɔ T5577 akses kad. Kɔnfɛm di ɛksaktɔl chip, kɔnfigyushɔn ɛn rida sistɛm.

HF 13.56MHz Chip Selekshɔn

HF Chip Famili	Prɔtokɔlɔ Dairekshɔn	Tipik Aplikeshɔn	Sɛlɛkshɔn Notis
MIFARE Klasik / Kompatibl Legacy 1K	ISO /IEC 14443 Tayp A lɛgsi ɛkosistim	Instɔl akses, tikɛt ɛn ol klos-lɔp sistem dɛn	Yuz usay di infrastukchɔ we de naw nid am; evaluate modɛn sikyuɔr ɔltɛrnativ fɔ nyu sistɛm dɛn
MIFARE Ultralayt we de na di wɔl	ISO /IEC 14443 Tayp A ɛnvayrɔmɛnt	Limitɛd-yuz tikɛt, ivintɛns ɛn simpul kɔntaktlɛs program dɛn	Kɔnfɛm mɛmori, ɔrijinaliti, paswɔd ɛn layfsaykl rikwaymɛnt dɛn
NTAG 213 / 215 / 216. Di wan dɛn we de wok	NFC Fɔm Tayp 2 Tag ɛn ISO /IEC 14443 Tayp A	NFC biznɛs kad, mobayl link, ɔthɛntishɔn ɛn dijital ɛnjɔymɛnt	Pik bay NDEF mɛmori, URL lɔng, paswɔd ɛn ɔrijinal rikwaymɛnt dɛn
MIFARE DƐSFƐR EV3	ISO /IEC 14443 Tayp A wit sikyuɔr ay-layer aplikeshɔn dɛn	Sikyu akses, kampus, transpɔt, aydentiti ɛn mɔlti-aplikeshɔn kad	Rikways aplikeshɔn dizayn, ki manejmɛnt, pɔsnalayzeshɔn ɛn rida/sɔftwɛ intagreshɔn
ICODE / ISO 15693 Famili	ISO /IEC 15693 ɛn NFC Fɔm Tayp 5 pozishɔn	Laybri, ɛset, vicinity-kad ɛn lɔng-kɔpl-distans aplikeshɔn dɛn	Rida protɔkɔl ɛn ɛntena saiz difrɛn frɔm ISO /IEC 14443 Tayp A sistem dɛn

'13.56MHz Kɔmpatibl' Nɔto Kɔmplit Spɛsifikeshɔn

Wan rida kin wok na 13.56MHz ɛn stil sɔpɔt ɔl di standad ɔ kɔmand dɛn we dɛn dɔn pik. Spɛsifik Tayp A, Tayp B, ISO 15693 ɔ NFC Fɔm sɔpɔt plus di ɛksaktɔ chip mɔdel ɛn aplikeshɔn softwe.

Sikyu Chips Nid fɔ Sikyu Pɔsnalayzeshɔn

If yu gi wan DESFire-klas chip, dat nɔ de mek yu gɛt sikyɔriti kredɛns ɔtomɛtik wan. Ki, aplikeshɔn, akses rayt, divaysifikeshɔn, ishua prosidyuz ɛn bakɛnd ɔthɛntishɔn fɔ ɛnjɛnɛri sɛpret.

Dual-Frikuɛns Antena ɛn Kad Ɛnjinia

Ɛnjinia Faktɔ	Dual-Frikuɛns Rikwaymɛnt
Antena Separeshɔn	Pozishɔn LF ɛn HF kɔyl fɔ ridyus fizik ɔvalap, prɛshɔn kɔnsɛntreshɔn ɛn kɔpl we yu nɔ bin want
Chip Pozishɔn	Kip ɔl tu di chips klia frɔm panch layn, slot, kɔntakt-mɔdyul kaviti ɛn ay-prɛshɔn zon
Lokal Tiknɛs	Kɔmpɛns fɔ tu IC, kɔyl kros-ɔva ɛn kɔnɛkshɔn pɔynt dɛn we yu nɔ mek bamp dɛn we pɔsin kin si
LF Tyuning	Match di LF koyl ɛn chip kapasiti to di rida frikshɔn, kɔdin ɛn target rid pefɔmɛns
HF Tyuning	Tune di HF antena wit di fainal chip, kad stak, print layers ɛn intended rida
Sistem Mapin we dɛn de mek	Difayn aw di LF aydentifaya ɛn HF UID/aplikeshɔn gɛt fɔ du wit wan kad ɔlda rɛkɔd
Ɛnd-Yuz Vɛrifikɛshɔn	Test di sem finish kad pan ɛvri rikwayd lɛgsi ɛn nyu rida mɔdel

Rida Sɔpɔt fɔ Verifay fɔ Ɔl tu di Frikyuɛnsi dɛn

Dual-frikyuɛnsi rida kin sɔpɔt ɔl di LF fɔmat dɛn we dɛn dɔn pik ɛn HF protɔkɔl dɛn we dɛn dɔn pik. Supply di rida brand, model, firmware ɛn expected output so di kad kin test agens di aktual sistem.

Rid Rɛnj fɔ Spɛsifiket bay Test Mɛtɔd

LF ɛn HF rid distans difrɛn ɛn dipen pan rida pawa, ɛntena jɔyometri, kad ɔriɛnteshɔn, kɔdin, fayn kad stak ɛn envayrɔmɛnt. Yuz separet pas/fail distans ɛn tɛst fiks fɔ ɛni intafeys.

Shit Layout, Sayz ɛn Tiknɛs Plɛnin

Paramita	Ɔrijinal / Avaylabl Opshɔn	B2B Kɔntrol Point
2 × 5. Di wan dɛn we de wok	A4 rɛfrɛns 210 × 297mm	Kɔnfɛm kad pitch, edj margin, ɛntena ɔriɛnteshɔn ɛn rɛjista ol dɛn
3 × 7. Di wan dɛn we de wok	Na lɛk 295 × 460mm	Match print kor, lamination plet ɛn panch tul
3 × 8. Di wan dɛn we de wok	Na lɛk 295 × 485mm	Difayn artwok rɛjista ɛn kad nɔmba dairekshɔn
4 × 8 / 5 × 5 / 4 × 10. Di wan dɛn we de du di wok	Ay-ɔtput industrial layout dɛn	Kontrol shit flatnɛs, ɛntena spɛshal ɛn ilɛktrik tɛst akses
Kastom Layout	Kastom kad, ki fob, mini kad ɛn prɔpriet tul dɛn	Gi CAD, dɔn ɔtlayn, kɔt kliarens ɛn chip/antena kɔdinɛt
LF Tiknɛs Rifrɛns	Na lɛk 0.50–0.60mm frɔm di ɔrijinal pej	Kɔnfɛm avrej, lokal chip-zon gej ɛn finish-kad kɔlkyulɛshɔn
Dual-Frikuɛns Tiknɛs	Projek-spɛsifi k ɛn nɔmal wan inflɔws bay tu chip ɛn tu ɛntena sistem	Apruv tiknes map, kad flatnɛs ɛn lokal prɛshɔn kɔmpɛnshɔn

prelam Tiknɛs Nɔ dɔn Kad Tiknɛs

Wan kɔmɔn CR80/ID-1 kad dɛn disayn am rawnd wan nominal tiknɛs nia 0.76mm, bɔt di fayn rizɔlt dipen pan print kɔr, Overlay film s, adeziv flɔ, chip zon ɛn laminɛshɔn kɔmpreshɔn. Mekɔp di kad we dɔn kondishɔn.

Layout Must Match di Baya in Tul

'3 × 8' nɔ de difayn ɛvri shit dimɛnshɔn, rɛjista mak ɔ kad pitch. Di las drɔin fɔ sayn bifo dɛn prodyuz ɛntena bikɔs panch ɛn chip pozishɔn mistek kin pwɛl ilɛktrik yield.

Finished Smart card Layer Strukchɔ

Layer	Fɔnkshɔn	Ki Kɔntrol
Frɔnt Overlay film	Protɛkt print ɛn gi glos, mat, frɔst ɔ sikyɔriti finish	Gej, bonding, abrashɔn ɛn pɔsnalayzeshɔn kɔmpatibiliti
Frɔnt Print Kɔr	I de kɛr grafik, tɛks, logo ɛn sikyɔriti print	Rejista, ink kur, shrinkage ɛn mɛtal-print klia zon
RFID Prelam Inlay	I gɛt wan ɔ mɔ chip, ɛntena ɛn ilɛktrik kɔnɛkshɔn	RF tuning, chip pozishɔn, tiknɛs, ilɛktrik yield ɛn alaynɛshɔn
Bak Print Kɔr	Balans di frɔnt ɛn kɛr rivas-sayd artwok	Lay balans, strɛp pozishɔn ɛn print kɔvarej
Bak Overlay film bak.	I de protɛkt di kad ɛn i kin gɛt magnɛtik strɛp ɔ sayn panɛl	Bonding, flatnɛs, ɛnkɔdin ɛn fayn sɔfa

Metallic Foil ɛn Kɔnduktiv Ink Kin Chenj RF Pɔfɔmɛnshɔn

Big mɛtal eria dɛn nia di HF ɛntena kin ridyus kɔpl ɔ shift rɛsɔnans. Inklud ɔl di mɛtalayz print, ɔlografik fɔyl ɛn magnɛtik kɔmpɔnɛnt dɛn na di fayn kad RF tɛst.

Balans Layers Ridyus Warpage

Di sem kayn frɔnt ɛn bak gej, kɔntrol matirial dairekshɔn ɛn balans print kɔvarej kin ridyus kɔl. Dual-frikyuɛnsi strɔkchɔ dɛn nid fɔ pe atɛnshɔn mɔ bikɔs di say dɛn we di chip ɛn ɛntena de kin bi asimɛtɛrik.

Lamineshɔn Prɔses fɔ LF , HF ɛn Haybrid Inlay s

1. Apruv di stak drɔin: Rikɔd ɛvri Overlay film , print kɔr, inlay, adeziv, strɛp ɛn sikyɔriti layt.

2. Kɔndishɔn di matirial dɛn: Stebul di sheet dɛn na klin prodakshɔn ɛnvayrɔmɛnt ɛn protɛkt dɛn frɔm dɔst ɛn mɔstɔ.

3. Verifay oriɛnteshɔn: Match kad pitch, chip pozishɔn, ɛntena zon, artwok ɛn panch mak.

4. Divεlכp di hεt saykl: Establish tεmprachכ, prεshכn, dwεl, rilis mεtirial εn kol fכ di εksakεt kכnstrכkshכn.

5. Protekt chip zon: Avɔyd had patikyula, pasmak lokal prɛshɔn ɛn plet dɛfɛkt oba ɛni wan pan di chip dɛm.

6. Kul ɔnda kɔntrol prɛshɔn: Kul de afɛkt flatnɛs, chip strɛs, bondin ɛn RF kɔnsistɛns.

7. Test di laminated sheet: Inspek tik, pozishɔn, apinans ɛn ɔl tu di RF intafɛs bifo yu panch.

8. Verifay kad dɛn we dɔn: Panch, pɔsnalayz, ɛnkɔd ɛn tɛst LF ɛn HF pefɔmɛns pan di sistɛm dɛn we dɛn bin want.

Kɔmɔn Risk	Posisibul Kɔz	Kɔrɛkt Dayrɛkshɔn
Chip we nɔ de wok fayn	Ɔt pasmak, prɛshɔn, ESD ɔ wik chip kɔnɛkshɔn	Rivyu chip limit, prɔses prɛshɔn, ESD kɔntrol ɛn kɔnɛkshɔn kwaliti
Opin Kɔyl	Brok kɔndɔkta, po jɔyn, kɔt damej ɔ matirial muvmɛnt pasmak	Inspek kɔntinyuiti, kɔndɔkta pat, jɔyn trɛnk ɛn panch kliarens
Wik LF ɔ HF Rɛnj	Detuning, rida mismatch, kad-stak chenj ɔ mɛtal intafɛreshɔn	Rityun ɛn tɛst ɛni intafɛs wit di kad we dɔn kɔmplit ɛn di target rida
Chip Bump we pɔsin kin si	Insufishɛnt gej kɔmpɛnshɔn ɔ pasmak lokal tik	Optimayz kaviti, layt gej, kusɛn ɛn prɛshɔn distribyushɔn
Delaminɛshɔn	Kɔntaminɛshɔn, tin dɛn we nɔ kɔmpitabl, ɔt we nɔ de ɔ we nɔ de mek i kol fayn	Rivyu matirial kɔmpatibiliti, klin, ɔt saykl ɛn peel trɛnk
Kad Wɔpaj	Stak we nɔ balans, we de ɔt pasmak, prɛshɔn we nɔ ivin ɔ we de kol kwik kwik wan	Balans layers ɛn optimize di ɔt, plet flatnɛs ɛn kol

Ilektrikal, RF ɛn Mɛkanikal Kwaliti Kɔntrol

Inspekshɔn Aytem	Rikɔmɛnd B2B Kɔntrol
Chip Aydentiti fɔ di pɔsin	Verifay manifakta, ɛksaktɔ pat nɔmba, frikshɔn, protɔkɔl, mɛmori ɛn lɔt traysabiliti
LF Fɔnkshɔn Tɛst	Rid di difayn ID ɔ program blɔk wit di gri LF rida ɛn ɔtput fɔmat
HF Fɔnkshɔn Tɛst	Rid UID ɛn kɔmand dɛn we yu dɔn pik, mɛmori ɔ aplikeshɔn akɔdin to di ɛksaktɔl HF chip
Antena Kɔntinyu	Detekt opin sirkit, shɔt, wik jɔyn ɛn kɔndɔkta dɛfɛkt fɔ ɔl tu di kɔyl dɛn
RF Pɔfɔmɛnshɔn	Yuz separet LF ɛn HF tɛst fiks, rida mɔdel, ɔriɛnteshɔn ɛn pas distans
Chip ɛn Antena Pozishɔn	Chek agens CAD, kad autlayn, panch kliarens, slot ɛn modul kaviti
Dimenshɔn dɛn fɔ di Sheet	Lɛngth, wit, skwea, kad pitch, rɛjista ol ɛn edj kwaliti
Tik ɛn Flatnɛs	Avrej tiknes, lokal chip zon, bo, kכl εn pכynt-to-pכynt vεryushכn
Kad Tɛst we dɛn dɔn dɔn	LF / HF opareshɔn, dimɛnshɔn, bɛnd, tɔshɔn, ɔt, humiditi, pil ɛn rida kɔmpatibiliti
Traceability we pɔsin kin tray fɔ no	Chip lɔt, ɛntena dizayn, PVC lɔt, shit nɔmba, tɛst program, inspekshɔn rizɔlt ɛn pak rɛkɔd

Difayn di Skɔp fɔ '100% Inspekshɔn'.

Ful ilɛktrik ridin na ɛvri kad pozishɔn kin spɛsifa, we distroktiv pil, bɛnd ɛn krɔs-sɛkshɔn tɛst dɛn nɔmal fɔ yuz sampling. Di spɛsifikɛshɔn fɔ bay fɔ difayn kɔmand, rida, fiks, limit ɛn ripɔt.

Dual-Frequency Yield Fɔ Kɔba Ɔl tu di Intafɛs dɛn

Kad we pas LF bɔt nɔ wok HF —ɔ pas HF bɔt nɔ wok LF —nɔto kɔnfɔm dual-frikyuɛnsi kad. Di krayteria fɔ aksept fɔ mek ɔl tu di teknɔlɔji dɛn pas di sem kad pozishɔn we dɛn dɔn dɔn.

Aplikeshɔn fɔ LF , HF ɛn Dual-Frikuɛns Kad

Aplikeshɔn	Rikɔmɛnd Tɛknɔlɔji Dairekshɔn	Kritikal Validɛshɔn
Legacy Akses Kɔntrol	125kHz rid-onli ɔ programmabl LF chip we di rida we dɛn dɔn instɔl nid	Rida fɔmat, ID autput, kad ɔriɛnteshɔn ɛn akses database
Akses-Sistem Maygrɛshɔn	LF + sikyuɔr HF dual-frikyuɛnsi kredibiliti	Ɔl tu di rida pipul dɛn, aydentiti map, ki manejmɛnt ɛn rollout plan
Hotel Ki Kad dɛn	Chip we di ɔtel-lɔk pletfɔm spɛsifa; dual teknɔlɔji we miks lɔk dɛn de	Enkoda, lɔk famwɔya, kad tik, humiditi ɛn yuz am bak
Di ID fɔ di wokman ɛn di Kampus	HF sikyuɔr aplikeshɔn ɔ LF + HF we yu de mayk	Doa akses, atɛndans, pe, printin ɛn layfsaykl
NFC Membaship ɛn Maketin	NTAG ɔ ɔda NFC Fɔm kɔmpitabl HF chip	Fɔn kɔmpitibliti, NDEF data, URL sikyɔriti ɛn ɛntena pozishɔn
Transpɔt ɛn Sikyu Mɔlti-Aplikeshɔn	Sikyu HF chip ɛn sɛtifiket sistɛm akitɛkɛt	Transakshɔn pefɔmɛns, kriptografi, ki injɛkshɔn ɛn skim aprɔval

Enkodin, UID ɛn Sikyuriti Manejmɛnt

Data Aytem	Rikwayd Difinishɔn
LF Identifya fɔ di pɔsin	Fiks faktri kɔd, program fɔmat, fasiliti kɔd, kad nɔmba ɛn ɔtput ɔda
HF UID / CSN	UID lɔng, fiks ɔ random bihayvya, database fɔmat ɛn rida intapriteshɔn
HF Mɛmori / Aplikeshɔn	NDEF, sɛktɔ, pej, fayl, akses rayt, kɔnta ɛn lɔk stet
Ki ɛn Paswɔd dɛn	Ɔna, jɛnɛreshɔn, injɛkshɔn, divaysifikeshɔn, transpɔt ɛn ɔdit trel
Dual-ID we dɛn de mek map	Rilayshɔn bitwin LF nɔmba, HF UID/aplikeshɔn ɛn print kad nɔmba
Rikɔnsilieshɔn	Duplikɛt, mis, rijɛkt ɛn pwɛl kad rɛkɔd dɛn akɔdin to ɔl tu di intafɛs dɛn

UID ɔ Serial Nɔmba Nɔto Strɔng Ɔthɛntishɔn

Dɛn kin kɔpi ɔ falamakata pɔblik aydentifaya dɛn. Sikyuriti-sɛnsitiv sistem dɛn fɔ yuz di rayt kriptografik ɔthɛntishɔn, bakɛnd kɔntrol ɛn di isyu prosidyuz instead fɔ abop pan wan nɔmba we pɔsin kin si ɔ we pɔsin kin rid nɔmɔ.

Ki Injɛkshɔn Na Separet Sikyu Prɔses

Wan sikyuɔr HF chip nid fɔ kɔntrol aplikeshɔn krieshɔn ɛn ki lod. Difayn di sikyɔriti ɛnvayrɔmɛnt, data ɛkshɛnj, verifyeshɔn, rijɛkt-kad hanlin ɛn ɔdit rikwaymɛnt bifo prodakshɔn.

Prototype, OEM ɛn Chenj-Kɔntrol Prɔses

1. Rikwaymɛnt rivyu: Kɔnfɔm rida, chips, protɔkɔl, kad layout, kad stak ɛn tɛst limit.

2. Ɛnjinia drɔin: Apruv sheet saiz, kad pitch, chip pozishɔn, ɛntena pat ɛn kɔt kliarens.

3. Prototype inlay: Prodyuz wan smɔl injinɛri batch fɔ ilɛktrik, RF, tiknɛs ɛn lamineshɔn trayal.

4. Finished-card test: Print, laminate, punch, encode ɛn test kad dɛn pan ɔl di sistem dɛn we dɛn nid.

5. Golden sampul aprɔval: Sayn di apruv kad, data strɔkchɔ, rida tɛst ɛn vijual standad.

6. Bulk prodakshɔn: Kɔntrol chip lɔt, ɛntena prɔses, dimɛnshɔn, ilɛktrik tɛst ɛn traysabiliti.

7. Chenj kɔntrol: Gɛt aprɔval bifo yu chenj di chip sɔs, paket, ɛntena, PVC , adeziv, layout ɔ tɛst ikwipmɛnt.

Stock Samples ɛn Kastɔm ​​Prototypes De Sav Difrɛn Pɔpɔshɔn dɛn

Wan stok sampul de sho di jenɛral wokmanship. Wan kɔstɔm protɔtayp de chɛk di rayt chip, ɛntena, layout, kad stak, rida ɛn lamination ikwipmɛnt we di pɔsin we bay nid.

MOQ Dipen pan Chip ɛn Antena Kastamayzeshɔn

In-stɔk standad dizayn dɛn kin sɔpɔt smɔl sampul ɔda dɛn. Kastom chips, dual-frikyuɛnsi layout, antena tul, sikyuɔr ɛnkɔdin ɛn nɔ-standad shit dimɛnshɔn nɔmal wan nid fɔ gɛt prodakshɔn MOQ.

Tim ɛn RFID prelam Prodakshɔn Sɔpɔt

Stebul RFID prelam prodakshɔn nid fɔ kɔntrol chip sɔs, ɛntena fɔm, chip-to-kɔyl kɔnɛkshɔn, plastic kolashɔn, lamineshɔn, ilɛktrik tɛst, dimɛnshɔnal inspekshɔn ɛn lɔt traysabiliti. Ripit ɔda fɔ yuz di chip we dɛn dɔn gri fɔ, ɛntena drɔ, matirial stak ɛn tɛst we pas dɛn aksept chenj we dɛn dɔn rayt.

Pakɛj, Stɔrej ɛn Ɛkspɔt Sapɔt

• Stɔr sheet dɛn flat insay pak we dɛn sial, klin ɛn dray fa frɔm ɔt ɛn dairekt san layt.

• Yuz rigid bod, intaliv ɛn riinfɔs katon fɔ protɛkt ɛntena ɛn chip zon.

• Nɔ lod di palet we nɔ ivin, bɛnd, shap impak ɛn prɛshɔn we pasmak pan di stak.

• Yuz di rayt ESD hanlin kɔntrol fɔ ɛksplɔz prodakshɔn prɔses ɛn tɛst.

• Kondishɔn shit dɛn na di lamination rum we di westɛm ɛn prodakshɔn kɔndishɔn dɛn difrɛn.

• Lebul ɛvri pak wit chip kɔmbayn, ɛntena dizayn, layout, tik, kwantiti ɛn batch.

• Aplay fɔs-in, fɔs-ɔut invɛntari ɛn ritest matirial afta yu dɔn kip fɔ lɔng tɛm ɔ abnɔmal transpɔt ɛksplɔshɔn.

Protekted Flat Packing fɔ Intanɛshɔnal B2B Ɔda dɛn

Wetin mek yu fɔ pik Wallis fɔ RFID PVC Prelam inlay s?

• LF , HF ɛn haybrid kapabiliti: Dɛn kin divɛlɔp singl-frikyuɛnsi ɛn dual-frikyuɛnsi prɔjek frɔm di aktual rida ɛkosistim.

• Chip-spɛsifi k injinɛri: Rid-onli, programmabl, NFC ɛn sikyuɔr HF opshɔn dɛn de separet bay protɔkɔl ɛn aplikeshɔn.

• Kastom ɛntena ɛn layout: Yu kin kɔstɔmayz di sheet saiz, kad pitch, chip ples, kɔyl jɔyometri ɛn panch kliarens.

• Finished-card qualification: Dɛn kin print sampul dɛn, lamin, panch, ɛnkɔd ɛn tɛst pan target rida dɛn.

• Dokumɛnt kwaliti kɔntrol: Ilɛktrik, RF, dimɛnshɔnal, vijual ɛn traysabiliti rikwaymɛnt dɛn kin rayt insay di spɛsifikɛshɔn.

• Faktɔri-dayrɛkt B2B saplai: I fayn fɔ kad faktri, akses intagreta, ɔtel-sistim saplay, ishua, impɔt ɛn distribyushɔn.

Infɔmeshɔn we Nid fɔ Fast B2B Kɔteshɔn

• Aplikeshɔn ɛn kɔnfigyushɔn we dɛn nid: LF , HF ɔ LF + HF dual frikshɔn.

• Rida brand, mɔdel, famwɔya, protɔkɔl ɛn ɔtput fɔmat we dɛn nid.

• Eksakt LF ɛn HF chip manifakta, pat nɔmba, mɛmori ɛn sikyɔriti rikwaymɛnt.

• Sheet layout, dimɛnshɔn, kad pitch, rɛjista mak ɛn kwantiti.

• Kad saiz, finish tiknes, chip lokeshɔn, slot, ol ɛn panch drɔin.

• prelam matirial, kɔlɔ, tik ɛn tolɛreshɔn.

• LF ɛn HF rid-rɛnj tɛst rikwaymɛnt ɛn target ɔryenteshɔn.

• Faynal kad stak, Overlay film s, print kɔr, mɛtal ink, magnɛtik strɛp ɛn sikyɔriti ficha dɛn.

• Lamineshɔn prɛs, tɛmpracha, prɛshɔn, dwɛl, kol ɛn plet dimɛnshɔn.

• Ɛnkɔdin, UID/ID list, ki injɛkshɔn, data map ɛn rikɔnsilieshɔn rikwaymɛnt dɛn.

• Prototype kwantiti, anual fɔkɔs, MOQ target ɛn delivri schedule.

• Pak, inspekshɔn dɔkyumɛnt, dɛstineshɔn pɔt ɛn di kɔmplians dɔkyumɛnt dɛn we dɛn nid.

Diskus Yu LF ɛn HF Inlay Projɛkt

Kwɛstyɔn dɛn we Dɛn kin Aks Bɔku tɛm

Wetin na RFID PVC prelam inlay shit?

Na intamɛdiet kad shit we gɛt RFID chip ɛn ɛntena insay PVC layers. Di wan dɛn we de mek kad kin ad print kɔr ɛn Overlay film s bifo fainal lamination ɛn panch.

Wan prelam kin gɛt ɔl tu 125kHz ɛn 13.56MHz?

Yɛs. Wan dual-frikyuɛnsi prelam gɛt sɛpret LF ɛn HF chips ɛn ɛntena dɛn na wan kad bɔdi. Ɔl tu di intafays dɛn nid fɔ gɛt indipɛndɛnt tyuning ɛn tɛst.

Wetin mek yu fɔ yuz dual-frikyuɛnsi RFID kad?

I de alaw wan kredibiliti fɔ wok wit lɛgsi 125kHz rida ɛn nyu 13.56MHz smat-kad rida dɛn di tɛm we infrastukchɔ maykreshɔn de.

Di LF ɛn HF chips dɛn gɛt link togɛda?

Nɔmal wan dɛn na difrɛn sɛktri dɛn. Dɛn kin link dɛn aydentifaya dɛn na di kɔstɔma in database, bɔt dɛn kin tɔk to difrɛn rida dɛn fɔ dɛnsɛf.

Us 125kHz chips de?

TK4100-tayp, EM4200, ATA5577/T5577-tayp ɛn ɔda LF opshɔn dɛn kin tɔk bɔt. Kɔnfɛm rid-onli ɔ rid/rayt bihayvya, ɛnkɔdin ɛn rida fɔmat.

Na EM4200 na rid-onli?

EM4200 de posishun as wan faktri-program lo-frikyuɛnsi rid-onli aydentifikeshɔn IC. Di kɔd opshɔn we dɛn nid ɛn di rida kɔmpitibliti fɔ spɛsifa.

Yu tink se T5577 kin program?

ATA5577/T5577-tayp divays dɛn na kɔnfigyut rid/rayt LF transpɔnda dɛn. Progrɛm fɔmat, paswɔd, lɔk bit ɛn verifyeshɔn fɔ difayn.

Ɔl di 125kHz kad dɛn ISO 11784/11785 kɔmpitabl?

Nɔ. Kɔmpatibiliti dipen pan di ɛksaktɔl chip ɛn kɔnfigyushɔn. Dɛn standad ya nɔ fɔ aplay as blanket klem to ɛvri akses-kɔntrol LF chip.

Us 13.56MHz chips de?

Di opshɔn dɛn inklud lɛgsi Tayp A chips, MIFARE Ultralight, NTAG, MIFARE DESFire ɛn ISO 15693/ICODE famili dɛn, we go bi di we aw dɛn de ɛn di tin dɛn we dɛn nid fɔ yuz.

Ɔl di 13.56MHz chips dɛn kɔmpitabl wit di sem rida?

Nɔ, di wan dɛn we de rid kin sɔpɔt sɔm patikyula standad dɛn, kɔmand dɛn ɛn aplikeshɔn dɛn. Kɔnfɛm Tayp A, Tayp B, ISO 15693 ɔ NFC Fɔm sɔpɔt ɛn di ɛksaktɔ IC.

Us HF chip fayn fɔ NFC biznɛs kad dɛn?

NTAG 213, 215 ɔ 216 ɛn ɔda NFC Fɔm kɔmpitabl chips na kɔmɔn opshɔn dɛn. Pik bay NDEF mɛmori, fon kɔmpatibiliti ɛn sikyɔriti rikwaymɛnt dɛn.

Us HF chip we fayn fɔ sikyuɔr akses?

Wan sikrit pletfɔm lɛk MIFARE DESFire kin fayn, bɔt di rida, ki, aplikeshɔn, bakɛnd ɛn pɔsnalayzeshɔn prɔses fɔ injinia togɛda.

Us layout dɛn de?

Di kɔmɔn layout dɛn na 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ɛn 4 × 10. Yu kin mek kɔstɔm layout dɛn frɔm di pɔsin we bay in CAD drɔin.

Wetin na di tipik LF prelam tik?

Di ɔrijinal pej rɛfrɛns lɛk 0.50–0.60mm fɔ sɔm sɛlɛkɛt LF kɔnstrɔkshɔn dɛn. Di ekzak gej dipen pan chip, kɔyl, PVC ɛn fayn kad dizayn.

Yu tink se dual-frikyuɛnsi prelam tik?

I kin nid mɔ tik ɔ lokal kɔmpɛnshɔn bikɔs i gɛt tu chip ɛn tu ɛntena sistem. Di kɔmplit tik map fɔ gɛt aprɔval.

Yu tink se dɛn kin chenj di we aw dɛn mek di ɛntena?

Yɛs. Kɔyl jɔyometri kin divɛlɔp rawnd di chip, kad saiz, rida, target rɛnj, chip pozishɔn ɛn kɔt kliarens.

Us rid rɛnj di kad we dɔn dɔn kin ajɔst?

Rɛnj dipen pan frikshɔn, chip, ɛntena, rida, kad stak, ɔriɛnteshɔn ɛn envayrɔmɛnt. Difayn separet LF ɛn HF tɛst rida ɛn pas distans.

Yu tink se dɛn kin print mɛtal fɔyl pan kad we gɛt tu frikshɔn?

Dɛn kin tink bɔt am afta dɛn dɔn tɛst am. Big mɛtalayz eria kin afɛkt di HF ɛntena ɛn dɛn fɔ inklud insay finish-kad RF kwalifayeshɔn.

Yu tink se dɛn kin yuz PETG ɔ polikabɔnɛt instead ɔf PVC ?

כda strכkchכ dεm kin divεlכp, bכt bכnd, hεt, shrinkεj, RF tכning, chip strεs εn fainal-kad durabiliti mכs validet sεparat wan.

Dɛn kin print di prelam sheet dɛn?

Nɔmal wan na blank fɛnshɔnal sheet dɛn. Dɛn kin print di kɔstɔma dɛn grafik dɛn pan difrɛn kɔr sheet dɛn bifo dɛn lamin di kɔmplit kad.

Us laminɛshɔn tɛmpracha fɔ yuz?

No say nɔ de we de ɔlsay na di wɔl. Hɛt, prɛshɔn, dwɛl ɛn kol fɔ divɛlɔp fɔ di ɛksaktɔ PVC , chip pakej, ɛntena, print kɔr ɛn Overlay film s.

Aw dɛn kin mek di chip nɔ pwɛl we dɛn de lamin?

Yuz kɔntrol lokal tik, klin plet, balans prɛshɔn, kɔmpitabl chip pakej, aprɔv ɔt saykl ɛn ilɛktrik tɛst bifo ɛn afta laminɛshɔn.

Yu tink se dɛn kin tɛst ɛni kad pozishɔn wit ilɛktrik?

Yɛs, dɛn kin spɛsifa ful ilɛktrik tɛst. Fɔ dual-frikyuɛnsi prodak, ɔl tu LF ɛn HF intafɛs fɔ pas na ɛvri aksepted pozishɔn.

Yu tink se dɛn kin ɛnkɔd di chips bifo dɛn sɛn dɛn?

LF programin, HF mɛmori raytin, NDEF data ɛn aplikeshɔn pɔsnalayzeshɔn kin tɔk bɔt. Sikyu ki dɛn nid fɔ gɛt wan sɛpret kɔntrol prɔses.

Yu tink se dɛn kin tɛst di sampul dɛn bifo dɛn prodyuz bɔku bɔku wan?

Yɛs. Di bɛst kwalifayeshɔn de yuz di ɛksaktɔ chips, ɛntena, kad stak, laminɛshɔn prɛs, panch tul ɛn target rida dɛn.

Wetin de sho di minimum ɔda kwantiti?

MOQ dipen pan chip we de, singl ɔ tu frikshɔn, ɛntena tul, layout, matirial, ɛnkɔdin, tɛst rikwaymɛnt ɛn if standad dizayn de.

Us infɔmeshɔn dɛn nid fɔ gɛt kɔrɛkt kot?

Gi di ɛksaktɔl LF ɛn HF chips, rida, protɔkɔl, layout, kad drɔ, tik, kad stak, tɛst limit, ɛnkɔdin, kwantiti, pak ɛn ples fɔ go.

Rikwest Kastɔm LF , HF ɔ Dual-Frikuɛns prelam Sampul dɛn

Kontakt Wallis Plastic fɔ kɔstɔmayz 125kHz LF , 13.56MHz HF ɛn LF + HF dual-frikyuɛnsi RFID PVC prɛlam inlay shit dɛn. Wi tim de sɔpɔt chip sɛlɛkshɔn, ɛntena ɛn layout dizayn, kad-stak planin, lamination trayal, LF / HF tɛst, ɛnkɔdin, kwaliti spɛsifikɛshɔn ɛn faktri-dayrɛkt B2B saplai.

Rikwest Sampl ɛn Faktɔri Kɔt