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Wholesale bambu NFC wud kad fɔ dijital biznɛs, mɛmbaship, ɔtel, akses ɛn ivintɛns. Kastom chip, engraving, UV printin, QR kod, data enkodin, kad saiz ɛn OEM pak wit sampul tɛst
Smart card
WALLIS
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Wallis NFC bambu wud kad dɛn jɔyn wan natura bambu ɛkstirian wit wan ɛmbaded 13.56MHz NFC chip ɛn ɛntena. Dɛn mek dɛn fɔ B2B bayer dɛn we nid dijital biznɛs kad dɛn we dɛn kin yuz bak, mɛmbaship kredibiliti, branded ivent kad, ɔtel ki kad ɔ akses kad wit kɔstɔm artwok ɛn data ɛnkɔdin.
Di kɔrɛkt kad spɛsifikɛshɔn dipen pan di aplikeshɔn. NTAG213, NTAG215 ɛn NTAG216 na tin dɛn we dɛn kin pik fɔ smart fon intarakshɔn ɛn NDEF link, we ɔtel lɔk ɛn akses-kɔntrol sistem kin nid difrɛn, sistem-apruv chip. Kɔnfɛm di rida, sɔftwɛl, mɛmori, sikyɔriti ɛn ɛnkɔdin rikwaymɛnt dɛn bifo yu apruv mas prodakshɔn.
Baya sɔmari: pik di bambu finish, kad dimɛnshɔn, chip, ɛntena, printin ɔ engraving, ɛnkɔd data, pak ɛn akseptans tɛst as wan kɔdinɛt spɛsifikɛshɔn. Dɛn fɔ tɛst wan sampul we de wok wit di rial fon dɛn, rida dɛn ɔ ɔtel lɔk dɛn we di prɔjek de yuz.
| Spesifikɛshɔn | we De Opshɔn / Kɔnfɔmeshɔn Rikwaymɛnt |
|---|---|
| Kad bɔdi | Natural bambu we de na do; ɔda wud spɛshal ɔ kɔmpɔzit strɔkchɔ dɛn kin ebul fɔ evalyu fɔ sɔm prɔjek dɛn we dɛn dɔn pik. |
| Standart saiz | 85.5 × 54mm CR80 rɛfrɛns saiz; kɔstɔm dimɛnshɔn ɛn shep dɛn nid fɔ drɔ rivyu. |
| Tik we i tik | Dɛn pik am akɔdin to wud kɔnstrɔkshɔn, chip mɔdyul, ɛntena ɛn ɛnd-yuz ikwipmɛnt. Kɔnfɛm pan di sampul we dɛn dɔn gri fɔ. |
| Ɔmɔs tɛm | 13.56MHz HF RFID / NFC fɔ di NTAG21x opshɔn dɛn we de na dis pej. |
| Kɔmɔn NFC chips dɛn | NTAG213, NTAG215 ɛn NTAG216. Ɔda chip dɛn fɔ pik agens di target rida, lɔk ɔ softwea pletfɔm. |
| Yuz mɛmori | NTAG213: 144 bayt dɛn; NTAG215: 504 bayt; NTAG216: 888 bayt fɔ yuz mɛmori. |
| Kad kɔnstrɔkshɔn | Bambu layers wit wan embedded chip, antena ɛn bonding strɔkchɔ. Di kɔnstrɔkshɔn kin difrɛn bay di tik ɛn aw dɛn de yuz am. |
| Di we aw dɛn de drɛs | Laser engraving, UV kala printin, logo, QR kod, barkod, UID, siriɔs nɔmba ɛn vɛriɔbul pɔsnalayzeshɔn. |
| Enkɔdin we dɛn de yuz | NDEF URL, tɛks, aydentifaya ɔ projɛkt-difayn data; paswɔd, rid-onli lɔk ɛn data verifyeshɔn dipen pan chip ɛn wokflɔ. |
| Ridin pefɔmɛns | I fɔ validet wit di fayn kad kɔnstrɔkshɔn ɛn target smartfon ɔ rida. Nɔ apruv wan prɔjek frɔm wan jenɛrik distans klem nɔmɔ. |
| Di opshɔn dɛn fɔ di surface | Natural bambu gren, layt ɔ dak tɔyn, laser-mak finish, print finish ɛn projɛkt-spɛsifi k protɛktiv tritmɛnt. |
| Di we aw dɛn de pak di tin dɛn | Bɔlk protɛktiv pak, wan wan sliv, prɛzɛnt pak, vɛriɔbul lɛbl ɔ OEM pak akɔdin to di ɔda. |
| Sampul ɛn MOQ | Sampul avaylabl, MOQ ɛn prodakshɔn schedule dipen pan chip stok, artwok, ɛnkɔdin, kɔnstrɔkshɔn ɛn pak. |
NFC bambu kad na kad we nɔ gɛt kɔntakt we dɛn put RFID / NFC chip ɛn ɛntena insay wan kad bɔdi we dɛn mek wit bambu. We di kad go insay di fil fɔ wan kɔmpitabl NFC fon ɔ rida, di ɛntena de gi pawa to di pasiv chip ɛn chenj di data we dɛn dɔn kip we nɔ gɛt bateri.
Di bambu ɛkstirian de saplae di natura apinans ɛn taktil valyu. Di ilɛktronik pefɔmɛns kɔmɔt frɔm di chip, ɛntena dizayn, bonding prɔses ɛn fayn kad tiknɛs. Dɛn ɛlimɛnt ya fɔ ɛnjɛnɛri togɛda bikɔs di wud dɛnsiti, mɔstɔ, kɔtin ɛn kad kɔnstrɔkshɔn kin inflɔws RF pefɔmɛns.
Front bambu layt: de kɛr engraving ɔ print branding.
RFID / NFC inlay: gɛt di chip ɛn ɛntena we dɛn pik fɔ di aplikeshɔn.
Bonding ɔ sɔpɔt layt: de kip di inlay flat ɛn protɛkt di ilɛktroniks.
Bak bambu layt: de kɛr sɛkɔndari artwok, instrɔkshɔn, QR kɔd ɔ vayriɔbul data.
Opshɔnal finish: dɛn pik fɔ impɔtant handlin resistans witout mask di natura gren.
| Chip Route | Rikɔmɛnd fɔ Yuz ɛn Limiteshɔn |
|---|---|
| NTAG213 we dɛn kɔl | 144 bayt yuz mɛmori. I fayn fɔ shɔt NDEF URL dɛn, rivyu link dɛn, soshal link dɛn, tap-to-open landin pej dɛn ɛn bɔku dijital biznɛs kad wokflɔ dɛn. |
| NTAG215 we dɛn kɔl | 504 bayt yuz mɛmori. Yusful we di NDEF peylɔd we dɛn dɔn gri fɔ big ɔ di prɔjek nid mɔ data kapasiti. |
| NTAG216 we dɛn kɔl | 888 bayt yuz mɛmori. Dɛn pik am fɔ big NDEF rɛkɔd dɛn, we di divays ɛn aplikeshɔn kɔmpitibliti. |
| Sistem-spɛsifi k HF chip | Rikwayd we di kad fɔ wok wit ɔtel lɔk, akses kɔntrol, mɛmbaship tɛminal ɔ ɔda klos sistɛm. Gɛt rayt chip aprɔval frɔm di sistɛm prɔvayda. |
| Chip we de pe atɛnshɔn pan sikyɔriti | Tink bɔt wan sikyɔriti chip we di prɔjek dɔn gri fɔ we dɛn nid fɔ ɔthɛntishɔn, kredibiliti we dɛn protɛkt ɔ kriptografik ficha dɛn. Chip choice must folo di sistem akitekchur. |
Fɔ dijital biznɛs kad, wan shɔt HTTPS URL we dɛn kɔd as NDEF rɛkɔd kin izi fɔ mentenɛt pas fɔ kip wan kɔmplit kɔntakt fayl dairekt na di chip. Yu kin ɔpdet di landin pej we yu nɔ chenj di fizik kad, ɛn di peylɔd we shɔt kin mek di mɛmori prɛshɔn nɔ bɔku. Faynal bihayvya fɔ stil tɛst pan ripɔt Ayfon ɛn Andrɔyd divays dɛn.
Ɛnkɔd wan shɔt URL we de opin dijital prɔfayl, pɔtfolio, prɔdak pej, bukin pej, rivyu pej ɔ lida fɔm. Ad wan print QR kod as fallback fɔ fon dɛn we NFC disable ɔ posishun difrɛn.
Yuz wan yunik URL, mɛmba aydentifaya, siriɔs nɔmba ɔ apruv sistɛm kredibiliti. Kɔnfɛm if na fɔ opin wɛb pej nɔmɔ dɛn de yuz di kad ɔ i fɔ ɔthɛntikayt agens wan dediket mɛmbaship rida.
Wan standad NTAG dijital-biznɛs-kad chip nɔ kin wok ɔtomɛtik wan wit ɔtel lɔk. Di ɔtel projɛkt dɛn fɔ kɔnfɔm di lɔk brand, ɛnkɔda, rida mɔdel, apruv chip famili, protɔkɔl, mɛmori strɔkchɔ ɛn ki-mɛnejmɛnt prɔses. Prodyuz wan ɛnkɔd wok sampul ɛn tɛst am pan di aktual prɔpati sistɛm bifo bɔlk prodakshɔn.
Akses-kɔntrol aplikeshɔn dɛn nid di ɛksaktɔl chip ɛn kredibiliti fɔmat we di kɔntrolɔ de sɔpɔt. UID-onli yus, sɛktɔ data, ɛnkript kredɛnshal ɛn mobayl NFC yuz na difrɛn rikwaymɛnt ɛn dɛn nɔ fɔ tek am se dɛn kin chenj am.
Bambu NFC kad dɛn kin sɔpɔt atɛndant link, VIP pas, chɛk-in aydentifaya, prodak ɔthɛntishɔn pej ɔ intaraktiv kampen kɔntinyu. Di pɔsin we gɛt di prɔjek fɔ difayn if di kad kin yuz bak, rayt bak, lɔk ɔ mach wit siriɔs nɔmba we dɛn print.
| Kastom Aytem | B2B Spɛsifikeshɔn fɔ Kɔnfɔm |
|---|---|
| Bambu ɛn di we aw i tan | Natural gren, sɛlɛkɛt tɔyn, gren ɔryenteshɔn, sɔfayz tritmɛnt ɛn aprɔv matirial sampul. |
| Sayz ɛn shep | CR80 ɔ kɔstɔm daylayn; difayn kɔna rayus, ol, slot ɛn edj finish. |
| Laser engraving we dɛn kin kɔt | Logo, nem, tɛks, QR kod, siriɔs nɔmba ɛn layn artwok. Fayn ditel dɛn nid fɔ mek art wok ɛn sampul rivyu. |
| UV printin we gɛt kɔlɔ | CMYK artwok, wayt ɔndaprint usay nid de, spɔt kɔlɔ ɛn vayriɔbul printin we dɛn de tɛst fɔ sɔfa. |
| NFC ɛnkɔdin | URL, tɛks, ID, NEF rɛkɔd ɔ prɔjek data. Saplae wan validet data tɛmplat ɛn ɛnkɔdin lɔ dɛn. |
| Data we kin chenj chenj | UID maching, siriɔs nɔmba, QR kɔd, barɔd, nem ɛn database fil wit wan pruf ɛn rikɔnsilieshɔn prɔses. |
| Chip ɛn antena | Selekt togɛda akɔdin to mɛmori, rida, sikyɔriti, kad tik ɛn target tap pozishɔn. |
| Di we aw dɛn de pak di tin dɛn | Bɔlk pak, wan wan sliv, gift bɔks, sikwins lɛbl ɛn OEM katɔn. |
Dɛn fɔ trit ɛnkɔdin lɛk wan kɔntrol prodakshɔn prɔses pas fɔ trit am lɛk simpul tɛks-ɛntri stɛp. Di pɔsin we bay fɔ gi wan las data fayl, difayn di rikodɔ fɔmat, tɔk if di kad stil fɔ rayt bak, ɛn sho aw di UID ɔ siriɔs nɔmba de mach wit di infɔmeshɔn we dɛn print.
| Kontrol Step | we Dɛn Rikɔmɛnd Chɛk |
|---|---|
| Data tɛmplat aprɔval | Kɔnfɛm fil nem dɛn, karakta ɛnkɔdin, sɛparatɔ dɛn, URL fɔmat ɛn sampul rɛkɔd dɛn. |
| Paylɔt ɛnkɔdin | Ɛnkɔd wan smɔl tɛst grup ɛn chɛk wit di target fon dɛn, ap dɛn, rida dɛn ɔ lɔk dɛn. |
| Variable-data we de mach | Rikɔnsilayt chip UID, print siriɔs nɔmba, QR kɔd, mɛmba ID ɔ rum kredibiliti as nid de. |
| Lɔk polisi | Pik sɛtin dɛn we yu kin rayt bak, we yu go protɛkt wit paswɔd ɔ we yu go rid fɔ ɔltɛm jɔs afta yu dɔn gri fɔ yuz di aplikeshɔn. |
| Faynal verifyeshɔn | Rid ɛvri fil we yu nid afta yu dɔn pɔsnalayz ɛn kip di prodakshɔn ripɔt we yu gri fɔ. |
Bambu na tin we dɛn kin yuz fɔ mek tin dɛn we dɛn kin yuz fɔ mek tin dɛn we dɛn kin yuz fɔ mek tin dɛn na do ɛn i kin mek di kɔmɔn plastic we pɔsin kin si na kad nɔ bɔku. Bɔt wan funkshɔnal NFC kad stil gɛt silikon chip, kɔnduktiv ɛntena, bɔndin matirial ɛn sɔntɛm kɔtin ɔ print ink. So di envayrɔmɛnt klem fɔ diskrayb di verified kad kɔnstrɔkshɔn pas fɔ kɔl ɔtomɛtik wan ɛvri kad we dɔn dɔn plastic-fri, biodegradable ɔ risaykul.
Natural gren, tone ɛn smɔl surface variations na nɔmal kwaliti dɛn fɔ bambu. Apruv wan fizik matirial sampul ɛn difayn akseptabl vɛryushɔn, mɔstɔ kɔndishɔn, flatnɛs ɛn apinans bifo prodakshɔn.
| Inspekshɔn Ɛria | Rikɔmɛnd Akseptans Rikwaymɛnt |
|---|---|
| Di tin dɛn we dɛn yuz ɛn di we aw i tan | Chek bambu spɛshal ɔ gred, tɔyn rɛnj, gren, sɔfays dɛfɛkt, finish ɛn aprɔv vɛryushɔn. |
| Dimenshɔn dɛn | Mekɔp lɔng, waid, tik, kɔna rayus, flat ɛn ɛni kɔstɔm kɔt. |
| Print ɛn engraving | Verifay kɔlɔ, rɛjista, engraving pozishɔn, legibiliti, QR ridabiliti ɛn adheshon. |
| Chip ɛn antena | Kɔnfɛm chip mɔdel, UID rispɔns, ɛntena kɔntinyuiti ɛn tap pozishɔn. |
| Enkɔdin we dɛn de yuz | Rid di NDEF ɔ projɛkt data, kɔmpia di vayriɔbul fil dɛm ɛn chɛk di lɔk ɔ paswɔd sɛtin dɛm. |
| Fכnshכnal RF tεst | Test ripɔt kad wit di target fon mɔdel, rida, ɔtel lɔk ɔ akses kɔntrol. |
| Durability sampul | Evaluate bending, edge integrity, moisture exposure ɛn surface wear akɔdin to di we aw dɛn gri fɔ du di prɔjek. |
| Golden Sampul we dɛn kɔl | Sial wan sayn sampul we de difayn matirial, artwok, chip, enkodin, apinans ɛn funkshɔnal akseptans fɔ mas prodakshɔn. |
Aplikeshɔn-lid chip sɛlɛkshɔn: sɛpret smart fon NFC yuz frɔm ɔtel, akses ɛn klos-sistim rikwaymɛnt.
Integreted customization: kɔdinɛt bambu kɔnstrɔkshɔn, chip, ɛntena, printin, engraving, variebul data ɛn pak.
Fכnshכnal sεmpl rout: apruv apinεns εn RF pεrformεns bifo bכlk prodakshכn.
Kad-matirial ɛkspiriɛns: sɔpɔt maching wit PVC , PETG , PC , Overlay film ɛn RFID kad strɔkchɔ usay dɛn nid fɔ mek haybrid dizayn.
B2B data kɔntrol: difayn UID, siriɔs-nɔmba ɛn ɛnkɔdin rikɔnsilieshɔn fɔ ripit prodakshɔn.
Stet if di kad na fɔ dijital prɔfayl, rivyu link, mɛmbaship program, ɔtel lɔk, akses sistɛm, ivin chɛk-in ɔ ɔda wokflɔ.
Gi di chip we yu lɛk ɔ di rayt fon, rida, ɛnkɔda, lɔk ɛn softwea ditil dɛn. Nɔ gri fɔ ɔtel ɔ akses kad bay frɛkuɛns nɔmɔ.
Send vektɔ artwok, kad dimɛnshɔn, engraving ɛn print layers, QR ɔ barkɔd lɔ, data fayl ɛn pak instrɔkshɔn.
Test di sampul fɔ di apinɛns, tap pozishɔn, ridin pefɔmɛns, ɛnkɔdin ɛn sistɛm kɔmpatibiliti. Sayn di Golden Sample afta ɔl di kɔrɛkshɔn dɛn.
Difayn di sampling plan, RF tɛst lɛvɛl, variebul-data ripɔt, sikwins lɔ, pak ɛn shipmɛnt lɛbl bifo prodakshɔn.
| RFQ Fil | Infɔmeshɔn fɔ Gi |
|---|---|
| Aplay fɔm | Dijital biznɛs kad, ɔtel ki, akses kad, mɛmbaship, ivin, rivyu kad ɔ ɔda yus. |
| Ɔmɔs | Sampul kwantiti, fɔs prodakshɔn kwantiti ɛn fɔkɔs ripit dimand. |
| Chip ɛn sistɛm | NTAG mɔdel ɔ rida/lɔk/sistim ditil fɔ injinɛri sɛlɛkshɔn. |
| Kad kɔnstrɔkshɔn | Bambu tayp, dimɛnshɔn, tik, shep, kɔna rayus ɛn finish. |
| At wok | Laser engraving, UV printin, wayt ink, QR kod, siriɔs nɔmba ɛn vayriɔbul fil dɛm. |
| Enkɔdin we dɛn de yuz | NDEF rεkɔd, URL, ID, paswɔd, lɔk, UID maching ɛn data-ripɔt rikwaymɛnt. |
| Testing | Target fon, rida ɔ lɔk mɔdel ɛn rikwayd funkshɔnal akseptɛns krayteria. |
| Di we aw dɛn de pak di tin dɛn | Bɔlk, sliv, gift bɔks, sikwins lɛbl, rital pak ɔ OEM katon. |
| Di infɔmeshɔn bɔt aw fɔ sɛn di tin dɛn | Destination, di dokumɛnt dɛn we dɛn nid ɛn di tɛm dɛn we dɛn kin lɛk fɔ ship. |
Na bambu-based kad we gɛt pasiv 13.56MHz NFC / RFID chip ɛn ɛntena. Wan kɔmpatib fon ɔ rida de gi pawa to di chip ɛn rid di data we dɛn kɔd we dɛn tap am.
NTAG213 na kɔmɔn fɔ inof fɔ wan shɔt NDEF URL. NTAG215 ɔ NTAG216 de gi mɔ yuz mɛmori. Kɔnfɛm di las ɛnkɔd rɛkɔd bifo yu pik di chip.
NTAG21x kad dɛn de yuz NFC Fɔm Tayp 2 / ISO /IEC 14443 Tayp A teknɔlɔji ɛn dɛn de yuz dɛn bɔku bɔku wan wit NFC -ɛnabled fon dɛn. Aktual bihayvya stil dipen pan di fon mɔdel, ɔpreshɔn sistɛm, NFC sɛtin, ɛntena pozishɔn ɛn ɛnkɔd rɛkɔd.
I kin bi teknik wan pɔsibul insay di mɛmori we de, bɔt wan shɔt URL to dijital prɔfayl kin izi fɔ ɔpdet bɔku tɛm ɛn i kin kɔnsistɛns akɔdin to divays dɛn. Test di we we yu dɔn pik pan ripɔt fon dɛn.
Yɛs, we dɛn lɛf di chip fɔ rayt bak ɛn di aplikeshɔn alaw fɔ ɛdit. Paswɔd protɛkshɔn ɔ fɔ lɔk fɔ ɔltɛm kin mek dɛn nɔ chenj, so dɛn fɔ gri fɔ di lɔk polisi bifo dɛn mek am.
Na we dɛn gri fɔ di chip ɛn kredibiliti fɔmat fɔ di patikyula ɔtel lɔk ɛn ɛnkɔda nɔmɔ. Wan standad NTAG biznɛs-kad chip nɔ fɔ tek am se i kɔmpitabl.
Yes, wit chip ɛn data fɔmat we di akses kɔntrol de sɔpɔt. Gi di rida mɔdel, protɔkɔl ɛn kredibiliti rikwaymɛnt fɔ sampul tɛst.
Ridin distans kin difrɛn wit di chip, ɛntena, bambu tik, rida fil, fon ɛntena pozishɔn ɛn di tin dɛn we de rawnd am. Apruv di kad yuz di aktual target divays pas wan jenɛrik distans prɔmis.
Dɛn kin kɔstɔmayz ɔl tu di sayd dɛn bay di artwok, gren, finish, usay di ɛntena de ɛn di we aw dɛn de mek am. Fayn tɛks, dense ink ɛn ed-to-ɛj dizayn fɔ verify bay sampul.
Natural bambu kad nɔ fɔ promot as ful watapruf pas wan kɔnstrɔkshɔn we dɛn dɔn tɛst sɔpɔt dat klem. Nɔ sok, humidity pasmak, ay ɔt ɛn bɛnd bad bad wan.
Di bambu ɛkstirian na plant-based, bɔt di finish NFC kad gɛt ilɛktroniks, ɛntena, bonding matirial ɛn sɔntɛm kɔtin bak. Di ɛnd-ɔf-layf klem dɛn dipen pan di strɔkchɔ we dɛn dɔn chɛk ɛn di lokal rikavari sistɛm.
Variable encoding ɛn printing kin arenj we di pɔsin we bay de saplae wan apruv data fayl, maching rules, lɔk polisi ɛn verifyeshɔn rikwaymɛn.
Sampul ɛn payɔl prodakshɔn kin arenj akɔdin to di chip we de, artwok ɛn ɛnkɔdin rikwaymɛnt. Test di sampul wit di fainal fon, rida ɔ lɔk bifo yu apruv mas prodakshɔn.
Send di target aplikeshɔn, kwantiti, chip ɔ rida ditel, artwok, ɛnkɔd data, kad dimɛnshɔn ɛn pakej rikwaymɛnt. Wallis go rivyu kompitibiliti ɛn pripia di aprɔpriet sampul rod.
