Views: 18 Author: Sayt Ɛditɔ Pɔblish Taym: 2024-06-24 Ɔrijin: Ples
Wan RFID kad prelam inlay na di funkshɔnal kɔr we dɛn kin yuz fɔ mek wan kɔntaktlɛs smat kad. I gɛt wan RFID intagreted sɔrkwit (IC), wan tuned ɛntena, ɛn sɔpɔtin layers we dɛn dɔn pre-laminated insay wan stebul shit. We di kad we dɔn dɔn go insay di fil fɔ wan kɔmpatib rida, di ɛntena kin gɛt redio-frikyuɛnsi ɛnaji, di chip kin pawa, ɛn di kad kin chenj aydentifikeshɔn ɔ aplikeshɔn data wit di rida we nɔ gɛt dairekt ilɛktrik kɔntakt.
Kwik ansa: Di rida de mek wan RF fil, di inlay ɛntena de kɔpl wit da fil de, ɛn wan pasiv RFID chip de avɛst inof ɛnaji fɔ wok. Dɔn di chip kin sɛn in data we i dɔn kip bak tru di ɛntena. Di rida de dikɔd di ansa ɛn pas am to akses-kɔntrol, pemɛnt, tikɛt, aydentifikeshɔn, ɔ ɔda bakɛnd sistem.
Wan RFID kad prelam inlay, we dɛn kin kɔl bak kɔntaktlɛs kad inlay ɔ RFID prelam shit , na wan sɛmi-finish kɔmpɔnɛnt we dɛn kin gi to di wan dɛn we de mek smat kad. Di ilɛktronik sɔrkwit dɔn ɔlrɛdi de ɛn protɛkt am insay wan plastic sheet, bɔt di prɔdak stil nid fɔ lamination kad-bɔdi, print, panch, pɔsnalayz, ɛn las inspekshɔn bifo i bi RFID kad we dɔn dɔn.
Wan prelam shit kin gɛt bɔku kad pozishɔn dɛn na layout dɛn lɛk 2 × 5, 3 × 7, 4 × 8, ɔ 5 × 5, i dipen pan di shit dimɛnshɔn, kad saiz, di ɛntena jɔyometri, ɛn di ikwipmɛnt we de dɔŋ di wata. Nɔmal wan, ɛni pozishɔn kin gɛt wan chip-ɛn-antena sɛrkyut we alaynɛd to di say we dɛn want fɔ kɔt kad.
| Prodakt Fɔm | Tipik Strukchɔ | Prodakshɔn Status | Kɔmɔn Yuz |
|---|---|---|---|
| Dray inlay we dɔn dray | Chip ɛn ɛntena pan wan kyaria we nɔ gɛt prɛshɔn-sɛnsitiv adeziv | Besik ilɛktronik insɛt | Kɔnvɔshɔn to lɛbl, tag, pak, ɔ kad |
| Wet inlay we dɛn mek | RFID inlay wit adhesive ɛn rilis layna | Rɛdi fɔ aplikeshɔn ɔ fɔ chenj di lɛbl | RFID stika ɛn smat lɛbl dɛn |
| RFID prelam inlay we yu kin yuz | Chip, antena, kyaria, ɛn protɛktiv plastic layers insay sheet fɔm | Semi-finished kad komponent | Kontaktlɛs smart kad manufakchurin |
| RFID kad we dɔn dɔn | Prelam kor, print layers, ovalay, ɛn opshɔnal sikyɔriti ficha dɛn | Finish ɛn pɔsnalayz prodak | Akses, pe, transit, aydentifikeshɔn, loyalti, ɛn tikɛt |
Rilibul RFID pefɔmɛns dipen pan di ilɛktrik dizayn ɛn di mɛkanikal kɔnstrɔkshɔn we de wok togɛda. Di ɛntena fɔ mach wit di chip we yu dɔn pik ɛn di opareshɔn frikshɔn, we di plastic layers fɔ protɛkt di sɔrkwit we nɔ go mek strɛs pasmak we dɛn de yuz lamination ɛn kad.
| Komponent | Fɔnkshɔn | Ki B2B Kɔnsidɛreshɔn dɛn |
|---|---|---|
| RFID chip ɔ IC | I de kip aydentifaya ɛn aplikeshɔn data, i de manej kɔmyunikeshɔn, ɛn i kin sɔpɔt ɔthɛntishɔn ɔ ɛnkripshɔn | Chip mɔdel, mɛmori, protɔkɔl, sikyɔriti lɛvɛl, UID fɔmat, rayt ɛnjɔymɛnt, ɛn rida kɔmpitibliti |
| Antena we dɛn kɔl | Risiv enaji frɔm di rida ɛn kɛr di ritɔn signal | Kɔpa waya, kɔpa we dɛn et, aluminiɔm we dɛn et, ɔ kɔndɔkta we dɛn print; jɔyometri fɔ mach frikshɔn ɛn chip impedans |
| Chip kɔnɛkshɔn | Krio di ilɛktrik ɛn mɛkanikal bond bitwin di IC ɛn di ɛntena | Bond trɛnk, kɔntakt rɛsistɛns, tɛmal stebiliti, ɛn rɛsistɛns to bɛnd |
| Kɛriɔ ɔ sabstret | Sɔpɔt di ɛntena ɛn mentɛn di sɔrkwit pozishɔn | Dimenshɔnal stebiliti, ɔt rɛsistɛns, flatnɛs, ɛn kɔmpitibliti wit di kad bɔdi |
| Prelam layers we dɛn kin yuz | Enkapsul ɛn protɛkt di ilɛktronik sɔrkwit | PVC, PETG, PET, PC, ɔ ABS; tiknɛs tolɛreshɔn, laminɛshɔn winda, ɛn adheshon |
| Mak dɛn fɔ rɛjista | Ɛp fɔ alaynɛs printin, lamination, ɛn kad panch | Rifrɛns-ɛj akkuracy ɛn kɔmpatibiliti wit di bayer in prodakshɔn ikwipmɛnt |
Di RFID rida de sɛn wan intarogeshɔn signal tru in ɛntena na di frikshɔn we di kad de sɔpɔt. Fɔ kɔmɔn kɔntaktlɛs smat kad dɛn, dis kin bi 13.56 MHz, we sɔm akses kad dɛn kin wok na lɛk 125 kHz. Spɛshal lɔng-rɛnj kad aplikeshɔn dɛn kin yuz UHF frikyuɛnsi.
We di kad go insay di say we yu kin yuz fɔ rid, in ɛntena kin intarakt wit di rida fil. LF ɛn HF kad dɛn jɔs de yuz nia-fild induktiv kɔpl. UHF sistem dɛn kin yuz mɔ ilɛktromagnetik wev prɔpageshɔn ɛn bakskata kɔmyunikeshɔn. So dɛn nɔ go ebul fɔ separet di ɛntena frɔm di frikshɔn we dɛn want, di rida, di kad dimɛnshɔn, ɛn di say we dɛn de wok.
Mɔs pan di RFID kad prelam inlay dɛn na pasiv ɛn dɛn nɔ gɛt bateri. Di ɛntena de kech di ɛnaji frɔm di rida fil, ɛn di chip in intanɛnt sɔrkwit kin chenj pat pan da ɛnaji de to di pawa we dɛn nid fɔ stat di IC. Di enaji we de dipen pan di rida autput, antena tuning, distans, oriɛnteshɔn, matirial dɛn we de nia, ɛn di kɔmplit kad kɔnstrɔkshɔn.
Afta aktiv, di rida ɛn di chip de fala di rilevɛns protɔkɔl. Dipen pan di IC, dis kin inklud fɔ no di kad, fɔ mek yu nɔ go rɔsh, fɔ pik, fɔ ɔthɛntishɔn, fɔ rid, rayt, ɔ fɔ kɔmand fɔ di aplikeshɔn. Di we aw dɛn kin du tin fɔ mek dɛn nɔ kɔlishin kin ɛp di pɔsin we de rid fɔ no wan kad we pas wan kad we kɔmpitabl de na di fil.
Di chip de chenj di ilɛktrik lod we di ɛntena de si ɔ bakskata di signal we de kam, i dipen pan di RFID sistem. Dis moduleshɔn de kɛr di kad in ansa bak to di pɔsin we de rid. Di ansa kin gɛt wan yunik aydentifaya, mɛmori data, ɔthɛntishɔn rizɔlt, ɔ aplikeshɔn kɔmand ansa.
Di rida de dikɔd di ansa ɛn sɛn data we pɔsin kin yuz to di softwe we dɛn dɔn kɔnɛkt. Dɔn di sistɛm kin ɔplɔk wan domɔt, validet wan tikɛt, rayt di atɛndans, no udat gɛt di kad, ɔpdet wan lɔyalti akɔn, ɔ du ɔda akshɔn we dɛn alaw. Di inlay de gi di kɔntaktlɛs hadwae intafɛs; di las biznɛs fɛnshɔn dipen pan di chip, aplikeshɔn softwe, sikyɔriti kɔnfigyushɔn, ɛn rida infrastukchɔ.
Frikyuɛnsi na wan pan di fɔs spɛsifikɛshɔn dɛn we pɔsin we de bay fɔ kɔnfɔm. Kad nɔ kin ebul fɔ tɔk kɔrɛkt wan wit rida we dɛn mek fɔ difrɛn frikyuɛnsi ɔ protɔkɔl we nɔ kɔmpitabl. Rid distans figa dɛn fɔ ɔltɛm trit as sistɛm-lɛvel rizɔlt pas fɔ trit garanti prɔpati dɛn fɔ di prelam shit nɔmɔ.
| RFID Band | Tipik Frikyuɛnsi Kɔmɔn | Prɔtokɔlɔ ɔ Stɛndad | Tipik Kad Aplikeshɔn | Dizayn Notis |
|---|---|---|---|---|
| LF | Arawnd 125 kHz ɔ 134.2 kHz | Protokɔlɔ dipen pan chip ɛn sistɛm; bɔku lɛgsi akses sistɛm dɛn na dɛn yon | Proksimiti akses kad, aydentifikeshɔn, ɛn lɛgsi sistem | Short-rεnj induktiv kכplεshכn; kɔnfɔm ɛksaktɔ rida ɛn chip kɔmpitibliti |
| HF / NFC we de na di wɔl | 13,56 MHz we yu de yuz | ISO/IEC 14443, ISO/IEC 15693, ɛn NFC-rilayt spɛsifikɛshɔn dɛn dipen pan di IC | Akses kɔntrol, transit, kampus kad, lɔyalti, aydentifikeshɔn, tikɛt, ɛn NFC intarakshɔn | Kɔmɔn fɔ kad dɛn we nɔ gɛt kɔntakt; antena induktans ɛn chip kapasiti fɔ mach kɔrɛkt wan |
| UHF we de na di wɔl | Na lɛk 860–960 MHz, we de ɔnda di rijinal rigyuleshɔn dɛn | EPC Klas 1 Gen 2 / ISO/IEC 18000-63 fɔ bɔku pasiv UHF sistem dɛn | Fɔ no pɔsin fɔ lɔng tɛm, fɔ pak motoka, fɔ ebul fɔ yuz motoka, prɔpati dɛn, ɛn spɛshal badge dɛn | Pɔfɔmɛnshɔn na sɛnsitiv to antena ɔriɛnteshɔn, bɔdi proksimiti, mɛtal, likwid, ɛn rijinal frikshɔn plan |
Di wan we mek am kɔnfɔm di ɔpreshɔn frikshɔn, di chip mɔdel, mɛmori, di sikyɔriti rikwaymɛnt, rid/rayt fɛnshɔn, kad dimɛnshɔn, shit fɔmat, layout, kad-bɔdi matirial, ɛn target aplikeshɔn. Dɛn rikwaymɛnt ya de sho di ɛntena dizayn ɛn prelam kɔnstrɔkshɔn.
Di antena jɔyometri na injinia fɔ di frikshɔn ɛn IC we dɛn dɔn pik. Dipen pan di prɔdak, dɛn kin mek di ɛntena frɔm kɔpa waya we dɛn dɔn ɛmbas, kɔpa we dɛn et, aluminiɔm we dɛn et, ɔ wan tin we dɛn print wit kɔnduktiv. Kɔyl tɔn, trak wit, spɛshal, rɛsistɛns, induktans, ɛn kad-ɛj kliarens de inflɔws fayn pefɔmɛns.
Di IC ɔ chip modul de kɔrɛkt wan ɛn i kɔnɛkt am wit ilɛktrik to di ɛntena. Di jɔyn fɔ kɔntinyu fɔ gɛt lɔw ilɛktrik rɛsistɛns we i de sev frɔm ɔt, prɛshɔn, bɛnd, ɛn ripit hanlin we dɛn de mek kad dɔŋstrim.
Fɔnshɔnal tɛst kin chɛk di chip rispɔns, aydentifaya, mɛmori akses, rɛsɔnans ɔ tiun, ɛntena kɔntinyuiti, ɛn kɔmyunikeshɔn stebiliti. We yu no di kɔnɛkshɔn dɛn we wik bifo dɛn laminate, dat kin ɛp fɔ mek di kad pozishɔn dɛn we nɔ fayn nɔ rich di pɔsin we bay in prodakshɔn layn.
Di inlay sɛrkyut dɛn de posishun akɔdin to di mɔlti-kad layout. I impɔtant fɔ rɛjista kɔrɛkt wan bikɔs di sheet we dɛn dɔn dɔn fɔ alaynɛd wit di sheet dɛn we dɛn print, ɔvalayz fim dɛn, laminating plet dɛn, ɛn kad panch tul dɛn. If yu nɔ put di chip fayn, dat kin pwɛl di ɛntena ɔ put di chip tumɔs nia di kad ed.
Dɛn kin gɛda plastic layers rawnd di ilɛktronik sɔrkwit ɛn bon dɛn ɔnda kɔntrol tɛmpracha, prɛshɔn, ɛn tɛm. Di prɔses fɔ protɛkt di chip ɛn ɛntena we i de mentɛn di shit flatnɛs, tiknɛs kɔnsistɛns, dimɛnshɔnal stebiliti, ɛn kɔmpitibliti wit di kɔstɔma in fayn kad lamineshɔn saykl.
Dɛn kin chɛk di prɛlam shit dɛn we dɔn dɔn fɔ ilɛktrik pefɔmɛns, fɔ si if dɛn nɔ si fayn, fɔ kɔntaminɛshɔn, skrach, bɔbul, wɔpej, tik, dimɛnshɔn, layout akkuracy, ɛn rɛfrɛns-ɛj kwaliti. Di rayt we fɔ pak di sheet dɛn de protɛkt di sheet dɛn frɔm mɔs, dɔst, bɛnd, ɛn mashin dɛn we de pwɛl we dɛn de kɛr dɛn go na ɔda kɔntri.
Wan prelam sheet kin tan lɛk se i fayn fɔ si bɔt i stil de fel we dɛn de mek kad ɔ we dɛn de yuz am na fil. So di wan dɛn we de bay B2B fɔ ebul fɔ evaluate ɔl tu di ilɛktrik pefɔmɛns ɛn di prɔses kɔmpatibiliti.
| Test Area | Wetin I De Chɛk | Wetin Mek I Impɔtant |
|---|---|---|
| 100% fכnshכnal tεst | Chip rispɔns, UID, rid/rayt ɔpreshɔn, ɛn kɔmyunikeshɔn | I de no di chip dɛn we dɔn day, di opin sɔrkwit dɛn, ɛn di kɔnɛkshɔn dɛn we nɔ stebul |
| Antena ɛn tyuning tɛst | Kɔntinyuiti, rɛsistɛns, induktans, rɛsɔnans, ɔ rispɔns margin | Sɔpɔt kɔnsistɛns rida pefɔmɛns afta fayn lamination |
| Dimɛnshɔnal inspekshɔn | Shit saiz, tik, kad pitch, chip pozishɔn, ɛn rɛfrɛns edj dɛn | I de mek dɛn nɔ alaynɛd we dɛn de print, lamin, ɛn panch |
| Lamination trial we dɛn kin du | Adheshon, bכbul, difכmeshכn, shrinkage, εn ilektrikal sכvayvεns | Kɔnfɔm kɔmpitibliti wit di bayer in kad-bɔdi matirial ɛn prɔses winda |
| Bɛnd ɛn mɛkanikal tɛst | Resistans fɔ di ɛntena ɛn chip kɔnɛkshɔn fɔ fleks ɛn handel | Ridyus fil fayl we krak krak kɔndɔkt ɔ wik bɔnd kin mek |
| Inspekshɔn we pɔsin kin si ɛn we i klin | Dɔst, skrat, delamination, bɔbul, stɛyn, ɛn sɔfays dɛfɛkt | I de protɛkt di kwaliti fɔ print ɛn di las we aw di kad de luk |
Kad dɛn we nɔ gɛt kɔntakt kin sho di wokman dɛn, di wan dɛn we de de, di studɛnt dɛn, di wan dɛn we kin kam fɛn dɛn, ɔ di kɔntrakta dɛn na di say dɛn we dɛn kin kɔntrol fɔ go insay. Di sistem de chɛk di kad kredibiliti bifo i gi ɔ dinay akses. Sekyuriti dipen pan di chip we yu dɔn pik, kredibiliti akitekchɔ, ki manejmɛnt, rida kɔnfigyushɔn, ɛn bakɛnd kɔntrol—nɔto jɔs pan di prɛzɛns fɔ RFID inlay.
RFID ɛn kɔntaktlɛs smat kad dɛn de sɔpɔt fast tap transakshɔn fɔ bɔs, mɛtro sistem, rel nɛtwɔk, pak, ɛn klos-lɔp tikɛt. Ay transakshɔn spid, rida inta-ɔparabiliti, kad durabiliti, ɛn sikyɔriti aplikeshɔn dizayn na impɔtant krayteria fɔ bay.
Wan kad we nɔ gɛt kɔntakt kin sɔpɔt aydentifikeshɔn, akses to rum, atɛndans, ikwipmɛnt chɛk-ɔut, lɔyalti, ɔ kɔshlɛs fɛnshɔn dɛn, i dipen pan di chip ɛn sistɛm. Multi-application projɛkt dɛn nid fɔ tek tɛm plan fɔ mɛmba mɛmori, akses permishɔn, ɛn pɔsnalayzeshɔn prosidyuz.
RFID kad kin no di mɛmba dɛn, rikodɔ visit, ridim bɛnifit, ɔ sɔpɔt kɔntrol keslɛs transakshɔn. Di wan dɛn we de bay fɔ pik di sikyɔriti ɛn mɛmori lɛvɛl akɔdin to di transakshɔn valyu ɛn frod risk pas fɔ pik wan chip jɔs bay prayz.
Dɛn kin yuz kad dɛn we nɔ gɛt kɔntakt fɔ no di wokman dɛn, fɔ di wok we di pɔsin de du, fɔ akses di ikwipmɛnt, ɔ fɔ mek dɛn go insay di fasiliti sikrit wan. Projɛkt dɛn we gɛt fɔ du wit pɔsin ɔ mɛdikal data fɔ fala bak di prayvesi, sayba sikyɔriti, ɛn rigyuletɔri rikwaymɛnt dɛn we di diploymɛnt makit gɛt.
Di kɔrɛkt inlay na di wan we de wok rili fayn na di pɔsin we bay in kɔmplit kad kɔnstrɔkshɔn ɛn instɔl rida ɛnvayrɔmɛnt. Wan spɛsifikɛshɔn fɔ bi bay di aplikeshɔn pas fɔ kɔpi am frɔm wan kad prɔjek we nɔ gɛt natin fɔ du wit am.
Kɔnfɛm di rida sistɛm: frikshɔn, protɔkɔl, chip famili, sikyɔriti rikwaymɛnt, ɛn di distans we dɛn de ɛkspɛkt fɔ rid.
Difayn di las kad: CR80 ɔ kɔstɔm saiz, tik we dɔn dɔn, layers we dɛn print, ɔvlay, magnɛtik strɛp, sayn panɛl, ɔ kɔntakt mɔdyul.
Pik di kad matirial: PVC, PETG, PET, PC, ABS, ɔ wan haybrid kɔnstrɔkshɔn bays pan lamination, durability, ɛn envayrɔmɛnt rikwaymɛnt.
Spɛsifik di sheet fɔmat: dimɛnshɔn, layout, kad pitch, rɛfrɛns edj, rɛjista mak, ɛn panch tolɛreshɔn.
Kɔnfɛm chip data: mɔdel, mɛmori, UID rikwaymɛnt, ɛnkɔdin, ki, paswɔd protɛkshɔn, ɛn pɔsnalayzeshɔn rispɔnsibiliti.
Evaluate prodakshɔn kɔmpatibiliti: lamination tɛmpracha, prɛshɔn, saykl tɛm, shrinkage, sheet flatnɛs, ɛn adheshon to print matirial.
Rikwest sampul: laminate ɛn panch sampul sheet dɛn yuz di aktual prodakshɔn prɔses, dɔn tɛst kad dɛn we dɔn wit di rida dɛn we dɛn want fɔ rid.
Difayn kwaliti akseptans: funkshɔnal yield, dimɛnshɔnal tolɛreshɔn, kɔsmɛtik standad, tɛst we, pak, traysabiliti, ɛn difrɛns handlin.
Nid wan kɔstɔm RFID prelam shit fɔ yu kad prodakshɔn layn?
Send yu chip model, frikshɔn, sheet saiz, layout, matirial, tiknes, anual kwantiti, ɛn rida rikwaymɛnt fɔ tɛknikal ɛvalueshɔn.
Kɔntakt wan RFID Prelam Spɛshal pɔsinKontaktlɛs idɛntifikeshɔn we nɔ gɛt optik layn fɔ si.
Fast, ripit intarakshɔn wit kɔmpitabl rida dɛn.
Protekt chip-ɛn-antena strɔkchɔ fɔ dawɔnstrim kad laminɛshɔn.
Kastom chip, antena, matirial, tik, ɛn mɔlti-kad shit layout.
Sɔpɔt fɔ akses, transit, aydentiti, lɔyalti, NFC, ɛn spɛshal UHF aplikeshɔn dɛn.
Rid pefɔmɛns kin ridyus bay wan rida protɔkɔl we nɔ kɔmpitabl, di ɛntena tyun we nɔ kɔrɛkt, distans pasmak, di kad ɔriɛnteshɔn we nɔ fayn, mɛtal ɔ likwid nia di kad, ilɛktromagnetik intafɛreshɔn, mɛkanikal damej, wan fayn fayn lamineshɔn prɔses we nɔ fayn, ɔ wik chip-to-antena kɔnɛkshɔn. Fɔ dis rizin, finish-kad tɛst na di rial aplikeshɔn ɛnvayrɔmɛnt gɛt mɔ minin pas fɔ abop pan tiori rid-rɛnj klem.
RFID prelam sosing involv ilɛktroniks, ɛntena injinɛri, plastic lamination, dimɛnshɔnal kɔntrol, ɛn smat kad prodakshɔn. Wan kapable saplay fɔ ɛp fɔ chɛk di chip ɛn rida kɔmpatibiliti, optimize di antena ɛn layout, kɔntrol shit kɔnsistɛns, gi sampul tɛst, ɛn sɔpɔt trɔbulshut di tɛm we di bayer in las lamination ɛn panch prɔses.
Wallis de saplae kɔstɔm RFID kad prelam inlays we de yuz matirial dɛn lɛk PVC, PETG, PET, PC, ɛn ABS fɔ kad manifakta ɛn sɔlvishɔn prɔvayda dɛn. Di opshɔn dɛn we de dipen pan di chip, frikshɔn, di ɛntena dizayn, di dimɛnshɔn fɔ di shit, di layout, di tik we di target tik, ɛn di prodakshɔn volyum.
Rikwest sampul ɔ tɛknikal kot
Tɔk bɔt Yu RFID Kad ProjɛktRFID prelam inlay na wan sɛmi-finish sheet we gɛt di chip, ɛntena, ɛn protɛktiv layers. Wan RFID kad we dɔn dɔn ad print kad-bɔdi layers, ɔvlay, sɔfayz grafik, pɔsnalayzeshɔn, panch, ɛn fayn kwaliti inspekshɔn.
Nɔ. Mɔs pan di kad prelam inlay dɛn na pasiv. Dɛn kin avɛst ɔpreshɔn ɛnaji frɔm di kɔmpitabl rida in RF fil. Aktiv RFID prodakt dɛn de yuz bateri, bɔt dɛn gɛt difrɛn kɔnstrɔkshɔn ɛn nɔto di standad chuk fɔ kɔvɛnshɔnal tin kɔntaktlɛs kad dɛn.
Rid distans dipen pan frikshɔn, chip sɛnsitiviti, ɛntena dizayn ɛn tiun, rida pawa, rida ɛntena, kad ɔriɛnteshɔn, fayn kad matirial, mɛtal ɔ likwid we de nia, intafɛreshɔn, ɛn di aplikebul rigyuletɔri limit dɛn. I fɔ validet wit di sampul dɛn we dɔn dɔn ɛn di pɔsin we dɛn want fɔ rid.
Nɔ, di rida ɛn di kad fɔ sɔpɔt kɔmpitabl frikshɔn, protɔkɔl, chip fɛnshɔn, ɛn sikyɔriti kɔnfigyushɔn. 13.56 MHz kad nɔ go wok wit rida we dɛn mek fɔ 125 kHz kredibiliti nɔmɔ, ɛn tu prɔdak dɛn we de yuz di sem frikshɔn kin stil yuz protɔkɔl dɛn we nɔ kɔmpitabl.
Di bɛst matirial dipen pan di kad strɔkchɔ we dɛn dɔn dɔn, di we aw dɛn de print am, di tɛmpracha we dɛn de lamin, di tarɛkt we i go de fɔ lɔng tɛm, di tin dɛn we dɛn nid fɔ du fɔ di envayrɔmɛnt, ɛn di badjɛt. PVC na kɔmɔn tin fɔ standad kad, we dɛn kin pik PETG, PET, PC, ABS, ɔ haybrid strɔkchɔ fɔ spɛshal prɔsesin ɔ pefɔmɛns nid dɛn.
Yɛs. Bɔku tɛm, di wan dɛn we de mek di chip kin kɔstɔmayz di chip mɔdel, di ɛntena jɔyometri, di dimɛnshɔn fɔ di shit, di layout we gɛt bɔku kad dɛn, di matirial, tik, kad pitch, rɛjista mak, ɛn di tin dɛn we dɛn nid fɔ du fɔ tɛst ilɛktrik. Fisibiliti dipen pan tul, ɔda kwantiti, ɛn tɛknikal spɛsifikɛshɔn.
Di wan dɛn we de bay fɔ fɔs tɛst di prelam wit ilɛktrik, dɔn dɛn fɔ laminate am wit di aktual print sheet ɛn ɔvlay, panch kad dɛn we dɔn dɔn, ɛn ripit funkshɔn tɛst dɛn. Rid distans, stebiliti, bɛnd rɛsistɛns, apinɛns, layt adheshon, chip pozishɔn, ɛn kɔmpitibiliti wit ɔl di rida dɛn we dɛn want fɔ rid fɔ evalyu.
Sekyuriti kin difrɛn bad bad wan bay di we aw dɛn mek di chip ɛn di sistem. Sɔm prɔdak dɛn de gi jɔs wan aydentifaya we pɔsin kin rid, we sikrit smat kad IC dɛn kin sɔpɔt mitɔl ɔthɛntishɔn, ɛnkript kɔmyunikeshɔn, protɛkt mɛmori, ɛn aplikeshɔn-lɛvel kɔntrol. Di wan dɛn we de bay fɔ mach di sikyɔriti akitɛkɛt to di risk fɔ di yuz we dɛn want fɔ yuz.
Gi di chip mɔdel ɔ di fɛnshɔn we dɛn nid, frikshɔn ɛn protɔkɔl, shit dimɛnshɔn, kad layout, matirial, prelam tik, finish kad tik, ɛntena ɔ rid-rɛnj rikwaymɛnt, ɛnkɔdin nid, tɛst standad, kwantiti, pak, ɛn target aplikeshɔn. Rida ditel ɔ sampul kad dɛn kin fayn bak fɔ evaluet di kɔmpitibliti.
