Nhwɛsoɔ: 18 Ɔkyerɛwfoɔ: Site Editor Bere a wɔde tintimii: 2024-06-24 Mfiase: Beaeɛ
RFID card prelam inlay yɛ adwumayɛ mu ade titiriw a wɔde yɛ smart card a enni nkitahodi. Ɛwɔ RFID integrated circuit (IC), tuned antenna, ne supporting layers a wɔadi kan ayɛ laminated ayɛ no stable sheet. Sɛ kaad a wɔawie no hyɛn akenkanfo a ɛne no hyia no mu a, antena no nya radio-frequency ahoɔden, chip no nya ahoɔden, na kaad no ne akenkanfo no sesa nsɛm a ɛkyerɛ sɛ obi hu anaa nea wɔde di dwuma no a anyinam ahoɔden nka ho tẽẽ.
Mmuae ntɛmntɛm: Ɔkenkanfo no yɛ RF field, inlay antenna no ne saa field no bom, na passive RFID chip twa ahoɔden a ɛdɔɔso a ɛbɛma ayɛ adwuma. Afei chip no de ne data a wɔde asie no san fa antenna no so kɔ. Ɔkenkanfoɔ no decode mmuaeɛ no na ɔde kɔ access-control, payment, ticketing, identification, anaa backend system foforɔ so.
RFID card prelam inlay, a wɔsan frɛ no contactless card inlay anaa RFID prelam sheet , yɛ ade a wɔayɛ no fã bi a wɔde ma wɔn a wɔyɛ smart card. Wɔde ɛlɛtrɔnik amansin no asi plastic krataa bi mu dedaw na wɔabɔ ho ban, nanso ade no da so ara hia sɛ wɔde kaad-nipadua no kata so, wɔtintim, wɔbɔ no, wɔma ɛyɛ nea ɛfata, na wɔhwɛ mu nea etwa to ansa na abɛyɛ RFID kaad a wɔawie.
Prelam krataa betumi akura kaad gyinabea ahorow pii wɔ nhyehyɛe te sɛ 2 × 5, 3 × 7, 4 × 8, anaa 5 × 5, a egyina krataa no nsusuwii, kaad kɛse, antenna geometry, ne nnwinnade a ɛwɔ nsu no ase so. Mpɛn pii no, gyinabea biara wɔ chip-and-antenna circuit biako a ɛne beae a wɔpɛ sɛ wotwa kaad no hyia.
| Product Form | Typical Structure | Production Gyinabea | a Wɔtaa De Di Dwuma |
|---|---|---|---|
| Dry inlay a ɛyɛ dry | Chip ne antenna wɔ carrier a enni pressure-sensitive adhesive so | Mfitiaseɛ ɛlɛtrɔnik insert | Nsakraeɛ kɔ nkyerɛwdeɛ, tag, nneɛma a wɔde kyekyere, anaa kaad mu |
| Nsu a wɔde hyɛ mu | RFID inlay ne adhesive ne release liner | Wɔasiesie ama application anaa label nsakrae | RFID sticker ne smart labels |
| RFID prelam a wɔde hyɛ mu | Chip, antenna, carrier, ne plastic layers a ɛbɔ ho ban wɔ krataa kwan so | Semi-awie kaad fã bi | Smart card a wɔyɛ a wɔmfa wɔn ho nhyɛ mu |
| RFID kaad a wɔawie | Prelam core, printed layers, overlays, ne ahobammɔ ho nneɛma a wopɛ | Finished na wɔayɛ ama obiara | Ɔkwan a wɔfa so kɔ hɔ, sikatua, akwantu, nea wɔde hu obi, nokwaredi, ne tekiti a wɔde ma |
RFID adwumayɛ a wotumi de ho to so no gyina anyinam ahoɔden nhyehyɛe ne mfiri a wɔde yɛ adwuma a wɔbom yɛ so. Ɛsɛ sɛ antenna no ne chip a wɔapaw ne adwumayɛ frequency hyia, bere a ɛsɛ sɛ plastic layers no bɔ circuit no ho ban a ɛremma nhyɛso pii mma bere a wɔde lamination ne card redi dwuma no.
| Component | Function | Key B2B Nneɛma a Wosusuw Ho |
|---|---|---|
| RFID chip anaa IC | Sie identifiers ne application data, ɛhwɛ nkitahodi so, na ebetumi aboa nokwaredi anaa encryption | Chip model, memory, protocol, security level, UID format, akyerɛw boasetɔ, ne akenkanfo a ɛne ne ho hyia |
| Antena a wɔde yɛ adwuma | Egye ahoɔden fi ɔkenkanfo no hɔ na ɛde sanba ho sɛnkyerɛnne no kɔ | Kɔbere waya, kɔbere a wɔakyerɛw so, aluminium a wɔakyerɛw so, anaasɛ conductor a wɔatintim; ɛsɛ sɛ geometry ne frequency ne chip impedance hyia |
| Chip nkitahodi | Ɔbɔ anyinam ahoɔden ne mfiri nkitahodi a ɛda IC ne antenna ntam | Bond ahoɔden, contact resistance, ɔhyew a ɛgyina pintinn, ne resistance to bending |
| Carrier anaa substrate a wɔde fa nneɛma | Ɛboa antenna no na ɛhwɛ ɔmansin no gyinabea so | Dimensional stability, ɔhyew a ɛko tia, flatness, ne compatability ne card nipadua |
| Prelam layers a wɔde yɛ nneɛma | Fa ɛlɛtrɔnik amansin no hyɛ mu na bɔ ho ban | PVC, PETG, PET, PC, anaa ABS; thickness tolerance, lamination mfɛnsere, ne adhesion |
| Agyiraehyɛde ahorow a wɔde kyerɛw wɔn din | Boa ma tintim, lamination, ne card punching nhyia | Reference-edge pɛpɛɛpɛyɛ ne nea ɛne adetɔfo no nneɛma a wɔyɛ no hyia |
RFID akenkanfo no de nsɛmbisa sɛnkyerɛnne bi fa ne antenna so kɔ frequency a card no boa no so. Wɔ smart card a wɔtaa de di nkitaho a enni nkitahodi ho no, eyi taa yɛ 13.56 MHz, bere a access card ahorow bi yɛ adwuma wɔ bɛyɛ 125 kHz. Ebia kaad a wɔde di dwuma titiriw a wɔde di dwuma wɔ akyirikyiri no de UHF frequency ahorow bedi dwuma.
Sɛ kaad no hyɛn akenkan beae a wotumi de di dwuma no a, ne antena no ne akenkanfo no di nkitaho. LF ne HF nkrataa taa de near-field inductive coupling di dwuma. UHF nhyehyɛe ahorow no de anyinam ahoɔden asorɔkye a ɛtrɛw ne nkitahodi a ɛkɔ akyi di dwuma titiriw. Enti wontumi ntetew antena nhyehyɛe no mfi frequency, akenkanfo, kaad no nsusuwii, ne baabi a wɔpɛ sɛ wɔyɛ adwuma no ho.
RFID card prelam inlays dodow no ara yɛ passive na battery biara nni mu. Antena no kyere ahoɔden fi akenkanfo no mu, na chip no mu circuitry no dan saa ahoɔden no fã bi ma ɛbɛyɛ ahoɔden a ɛho hia na ama wɔafi IC no ase. Ahoɔden a ɛwɔ hɔ no gyina akenkanfo no ahoɔden, antena a wɔde siesie, akyirikyiri, ɔkwan a wɔfa so kɔ, nneɛma a ɛbɛn, ne kaad a wɔyɛ no nyinaa so.
Sɛ wɔyɛ adwuma wie a, ɔkenkanfo ne chip no di protocol a ɛfa ho no akyi. Ɛdenam IC no so no, eyi betumi ayɛ kaad a wohu, nea ɛko tia nhyiam, paw, nokwaredi, akenkan, akyerɛw, anaa ahyɛde ahorow a ɛfa application pɔtee bi ho. Akwan a wɔfa so ko tia nhyiam no boa ɔkenkanfo no ma ohu kaad biako bere a kaad bɛboro biako a ɛne no hyia wɔ afuw no mu no.
Chip no sesa anyinam ahoɔden adesoa a antenna no hu no anaasɛ ɛbɔ sɛnkyerɛnne a ɛba no akyi, a egyina RFID nhyehyɛe no so. Saa modulation yi de kaad no mmuae san kɔ ɔkenkanfo no nkyɛn. Mmuae no betumi ayɛ nea ɛkyerɛ biribi soronko, memory data, nokwaredi aba, anaa application ahyɛde mmuae.
Ɔkenkanfo no decode mmuae no mu na ɔde data a wotumi de di dwuma kɔ softwea a wɔde abɔ mu no so. Afei nhyehyɛe no betumi abue ɔpon bi, agye tekiti bi atom, akyerɛw nnipa a wɔbaa ase, akyerɛ obi a ɔwɔ kaad, ayɛ nokwaredi akontaabu foforo, anaasɛ ayɛ adeyɛ foforo a wɔama ho kwan. Inlay no ma contactless hardware interface no ma; adwumayɛ dwumadi a etwa to no gyina chip, application software, ahobammɔ nhyehyɛe, ne akenkanfo nhyehyɛe so.
Frequency yɛ nsɛm a edi kan a ɛsɛ sɛ adetɔfo si so dua no mu biako. Kaad ntumi ne akenkanfo a wɔayɛ ama frequency soronko anaa protocol a ɛne ne ho nhyia nni nkitaho yiye. Ɛsɛ sɛ wɔfa akenkan kwansin akontaabu bere nyinaa sɛ nhyehyɛe-gyinabea aba sen sɛ ɛbɛyɛ prelam krataa no nkutoo su ahorow a wɔahyɛ ho bɔ.
| RFID Band | Typical Frequency | Common Protocols anaa Standards | Kaad dwumadie a wɔtaa de di dwuma | Design Notes |
|---|---|---|---|---|
| LF | Bɛyɛ 125 kHz anaa 134.2 kHz | Protocol gyina chip ne nhyehyɛe so; agyapadeɛ kwan a wɔfa so kɔ hɔ no pii yɛ wɔn dea | Proximity access cards, adansedi krataa, ne agyapade nhyehyɛe ahorow | Inductive coupling a ɛkɔ akyiri tiaa; si so dua sɛ akenkanfo ne chip no hyia pɛpɛɛpɛ |
| HF / NFC na ɛwɔ hɔ | 13.56 MHz na ɛwɔ hɔ | ISO/IEC 14443, ISO/IEC 15693, ne NFC-fam nkyerɛkyerɛmu a egyina IC so | Akwan a wɔfa so kɔ hɔ, akwantuo, sukuupɔn no mu nkrataa, nokwaredi, nkyerɛkyerɛmu, tekiti, ne NFC nkitahodi | Nea ɛtaa ba ma nkrataa a wɔmfa nkitahodi nni dwuma; ɛsɛ sɛ antenna inductance ne chip capacitance hyia yiye |
| UHF | Bɛyɛ 860–960 MHz, a ɛhyɛ ɔmantam mmara ase | EPC Class 1 Gen 2 / ISO/IEC 18000-63 ma UHF nhyehyɛe pii a ɛnyɛ adwuma | Nneɛma a wɔde hu obi a ɛkɔ akyiri, baabi a wɔde kar sisi, baabi a wobetumi akɔ kar, agyapade, ne badge soronko | Adwumayɛ yɛ nea ɛfa antenna kwankyerɛ, nipadua a ɛbɛn, dade, nsu, ne ɔmantam frequency nhyehyɛe ho |
Ɔyɛfo no si so dua mpɛn dodow a wɔde yɛ adwuma, chip model, memory, ahobammɔ ahwehwɛde, akenkan/kyerɛw dwumadi, kaad nsusuwii, krataa no kwan, nhyehyɛe, kaad-nipadua nneɛma, ne botae a wɔde di dwuma. Saa ahwehwɛde ahorow yi na ɛkyerɛ sɛnea wɔbɛyɛ antenna ne sɛnea wɔbɛyɛ prelam.
Wɔayɛ antenna geometry no ama frequency ne IC a wɔapaw no. Wobetumi de kɔbere hama a wɔde ahyɛ mu, kɔbere a wɔakyerɛw so, aluminium a wɔakyerɛw so, anaa ade a wɔatintim a ɛma nsu fa mu na ayɛ antena no. Coil dannan, track trɛw, ntam kwan, resistance, inductance, ne card-edge clearance nya adwumayɛ a etwa to so nkɛntɛnso.
Wɔde IC anaa chip module no si hɔ pɛpɛɛpɛ na wɔde anyinam ahoɔden abɔ antenna no ho. Ɛsɛ sɛ nkwaa no kura anyinam ahoɔden a ɛba fam bere a ɛtra ase wɔ ɔhyew, nhyɛso, kotow, ne nea wɔde di dwuma mpɛn pii bere a wɔreyɛ kaad a ɛwɔ nsu no ase no.
Dwumadi mu sɔhwɛ betumi ahwɛ sɛ chip mmuae, identifier, memory access, resonance anaa tuning, antenna kɔ so, ne nkitahodi a ɛyɛ den. Sɛ wohu nkitahodi a ɛyɛ mmerɛw ansa na wɔayɛ lamination a, ɛboa ma kaad gyinabea a asɛe no ntumi nkɔ adetɔfo no nneɛma a wɔyɛ no mu.
Wɔde inlay circuits no si hɔ sɛnea multi-card nhyehyɛe no te. Ɛho hia sɛ wɔkyerɛw wɔn din pɛpɛɛpɛ efisɛ ɛsɛ sɛ krataa a wɔawie no ne nkrataa a wɔatintim, sini a wɔde kata so, mprɛte a wɔde laminating, ne nnwinnade a wɔde bɔ kaad no hyia. Sɛ ɛnyɛ baabi a ɛnyɛ papa a, ebetumi asɛe antenna no anaasɛ ɛde chip no bɛbɛn kaad no ano dodo.
Wɔboaboa plastic a wɔde ayɛ nneɛma ano twa ɛlɛtrɔnik amansin no ho hyia na wɔkyekyere no wɔ ɔhyew, nhyɛso, ne bere a wɔahyɛ so. Ɛsɛ sɛ adeyɛ no bɔ chip ne antenna no ho ban bere a ɛma krataa no yɛ petee, ne kɛse yɛ pɛpɛɛpɛ, ne nsusuwii gyina pintinn, na ɛne adetɔfo no kaad lamination kyinhyia a etwa to no hyia.
Wɔhwɛ prelam nkrataa a wɔawie no mu hwɛ sɛ anyinam ahoɔden yɛ adwuma, aniwa mu sintɔ ahorow, efĩ, nsensanee, ahurututu, warpage, ne kɛse, ne nsusuwii, nhyehyɛe a ɛyɛ pɛpɛɛpɛ, ne reference-edge quality. Nneɛma a wɔde kyekyere ntama a ɛfata bɔ nkratafa no ho ban fi nsu, mfutuma, kotow, ne mfiri a ɛsɛe bere a wɔde rekɔ aman horow so no ho.
Prelam krataa betumi ayɛ te sɛ nea wogye tom wɔ aniwa so nanso ɛda so ara di nkogu bere a wɔreyɛ kaad anaasɛ wɔde redi dwuma wɔ afuw mu no. Enti ɛsɛ sɛ B2B adetɔfoɔ hwehwɛ anyinam ahoɔden adwumayɛ ne dwumadie a ɛne ne ho hyia nyinaa mu.
| Sɔhwɛ Beae | Nea Ɛhwehwɛ | Nea Enti a Ɛho Hia |
|---|---|---|
| 100% adwumayɛ sɔhwɛ | Chip mmuae, UID, akenkan/kyerɛw adwumayɛ, ne nkitahodi | Kyerɛ chips a awu, circuits a ɛbue, ne nkitahodi a entumi nnyina |
| Antenna ne tuning sɔhwɛ | Nkɔso, ɔsɔretia, inductance, resonance, anaa mmuae margin | Boa akenkanfo adwumayɛ a ɛkɔ so daa wɔ lamination a etwa to akyi |
| Nhwehwɛmu a wɔyɛ no afã horow | Krataa kɛse, ne kɛse, ne kaad no nne, chip gyinabea, ne reference anoano | Siw misalignment bere a wɔretintim, lamination, ne punching |
| Lamination sɔhwɛ | Adhesion, bubbles, deformation, shrinkage, ne anyinam ahoɔden nkwa | Si so dua sɛ ɛne adetɔfo no card-body nneɛma ne process window no hyia |
| Bending ne mfiridwuma mu sɔhwɛ | Antena ne chip nkitahodi no a ɛko tia flexing ne handling | Ɛtew afuw mu huammɔdi a ɛnam conductors a apaapae anaasɛ nhama a ɛyɛ mmerɛw so ba no so |
| Nhwehwɛmu a wɔde aniwa hu ne ahotew | Mfutuma, nsensanee, delamination, ahurututu, nkekae, ne sintɔ ahorow a ɛwɔ soro | Ɛbɔ print quality ne card a etwa to a ɛbɛda adi ho ban |
Kaad a wɔmfa wɔn ho nhyɛ mu no betumi ahu adwumayɛfo, wɔn a wɔte hɔ, sukuufo, ahɔho, anaa adwumayɛfo a wɔyɛ adwuma wɔ apon a wɔhwɛ so no so. Nhyehyɛe no hwɛ kaad ho adansedi nkrataa ansa na ama kwan anaasɛ wɔapow kwan sɛ wɔbɛkɔ hɔ. Ahobammɔ gyina chip a wɔapaw, credential architecture, key management, reader configuration, ne backend controls so —ɛnyɛ RFID inlay a ɛwɔ hɔ ara kwa.
RFID ne contactless smart cards boa tap a wɔde di dwuma ntɛmntɛm ma bɔs, metro nhyehyɛe, keteke ntam nkitahodi, baabi a wɔde kar sisi, ne tekiti a wɔatoto mu. Ahoɔhare a ɛkorɔn a wɔde di gua, akenkanfo a wɔde di dwuma bom, kaad a ɛtra hɔ kyɛ, ne application nhyehyɛe a ahobammɔ wom yɛ adetɔ ho gyinapɛn a ɛho hia.
Kaad biako a enni nkitahodi betumi aboa ma wɔahu, dan mu kɔ, kɔ, nnwinnade a wɔde kɔ, nokwaredi, anaa dwumadi ahorow a sika nnim, a egyina chip ne nhyehyɛe no so. Multi-application projects hwehwɛ sɛ wɔyɛ memory nhyehyɛe a wɔde ahwɛyiye yɛ, access permissions, ne personalization procedures.
RFID kaad betumi akyerɛ asɔremma, akyerɛw nsrahwɛ, agye mfaso, anaasɛ aboa nnwuma a wɔhwɛ so a wɔmfa sika nni dwuma. Ɛsɛ sɛ adetɔfo paw ahobammɔ ne memory level sɛnea asɛm no bo ne nsisi ho asiane te sen sɛ wɔbɛpaw chip denam bo nkutoo so.
Wobetumi de nkrataa a wɔmfa wɔn ho nhyɛ mu adi dwuma de akyerɛ adwumayɛfo, ayarefo adwumayɛ, nnwinnade a wɔde di dwuma, anaasɛ adwumayɛbea a ahobammɔ wom a wɔbɛkɔ mu. Ɛsɛ sɛ nnwuma a ɛfa ankorankoro anaa aduruyɛ ho nsɛm ho nso di kokoam nsɛm, kɔmputa so ahobammɔ, ne mmara ahwehwɛde ahorow a ɛwɔ hɔ wɔ gua a wɔde di dwuma no akyi.
Inlay a ɛteɛ ne nea ɛyɛ adwuma a wotumi de ho to so wɔ adetɔfo no kaad adansi a edi mũ ne akenkanfo a wɔde ahyɛ mu no mu. Ɛsɛ sɛ wogyina akwammisa krataa no so na wɔde nsɛm pɔtee bi kyerɛ sen sɛ wɔbɛkyerɛw afi kaad adwuma bi a ɛne no nni abusuabɔ mu.
Si akenkanfoɔ nhyehyɛeɛ no so dua: frequency, protocol, chip abusua, ahobanbɔ ahwehwɛdeɛ, ne akenkan kwan a wɔhwɛ kwan.
Kyerɛkyerɛ kaad a etwa to no mu: CR80 anaa ne kɛse a wɔahyɛ da ayɛ, ne kɛse a wɔawie, layers a wɔatintim, nkataso, magnetic stripe, signature panel, anaa contact module.
Paw nneɛma a wode bɛyɛ kaad no: PVC, PETG, PET, PC, ABS, anaasɛ adansi a wɔde afrafra a egyina lamination, ahoɔden a ɛtra hɔ kyɛ, ne nneɛma a atwa yɛn ho ahyia ahwehwɛde so.
Kyerɛ krataa no kwan: nsusuwii, nhyehyɛe, kaad no nne, nsɛm a wɔde gyina so, nkyerɛwde a wɔde kyerɛw wɔn din, ne punching tolerance.
Si chip data so dua: model, memory, UID ahwehwɛde, encoding, keys, password ahobammɔ, ne personalization asɛyɛde.
Hwɛ sɛnea nneɛma a wɔyɛ no hyia: lamination temperature, pressure, cycle time, shrinkage, krataa a ɛyɛ tratraa, ne nea ɛbata nneɛma a wɔatintim ho.
Bisa nhwɛsode: laminate na punch nhwɛsode nkrataa denam ankasa adeyɛ kwan no so, afei sɔ nkrataa a wɔawie no hwɛ ne akenkanfo a wɔpɛ sɛ wɔyɛ.
Kyerɛkyerɛ su pa a wogye tom mu: adwumayɛ mu aba, dimensional abodwokyɛre, cosmetic gyinapɛn, sɔhwɛ kwan, packaging, traceability, ne sintɔ ahorow a wodi ho dwuma.
Wohia RFID prelam krataa a wɔahyɛ da ayɛ ama wo card production line?
Fa wo chip model, frequency, sheet size, layout, material, thickness, afe afe dodow, ne akenkanfo ahwehwɛde ahorow mena ma wɔmfa nyɛ mfiridwuma mu nhwehwɛmu.
Wo ne RFID Prelam Ɔbenfo bi nkasaContactless identification a enni optical line of sight.
Nkitahodi a ɛkɔ ntɛmntɛm, a wotumi san yɛ bio ne akenkanfo a wɔfata.
Chip-ne-antenna nhyehyɛe a wɔabɔ ho ban ma downstream card lamination.
Custom chip, antenna, nneɛma, thickness, ne multi-card krataa nhyehyɛe.
Mmoa a wɔde ma wɔ kwan a wɔfa so kɔ hɔ, akwantuo, nipasu, nokwaredi, NFC, ne UHF dwumadie titire.
Wobetumi atew akenkan adwumayɛ so denam akenkanfo nhyehyɛe a ɛne ne ho nhyia, antenna a ɛnteɛ, akyirikyiri dodo, kaad no kwan a ɛnyɛ papa, dade anaa nsu a ɛbɛn kaad no, anyinam ahoɔden a ɛtwetwe, mfiri a ɛsɛe, lamination nhyehyɛe a etwa to a ɛmfata, anaasɛ chip-to-antenna nkitahodi a ɛyɛ mmerɛw. Esiane eyi nti, sɔhwɛ a wɔawie-kaad wɔ application tebea ankasa mu no yɛ nea ntease wom sen sɛ wɔde wɔn ho bɛto nsusuwii mu akenkan-akwan a wɔka so.
RFID prelam sourcing fa ɛlɛtrɔnik mfiri, antenna mfiridwuma, plastic lamination, dimensional control, ne smart card a wɔyɛ ho. Ɛsɛ sɛ obi a otumi de nneɛma ma boa ma wɔhwɛ sɛ chip ne akenkanfo no hyia, ɔma antenna ne nhyehyɛe no yɛ papa, ɔhwɛ krataa no so pɛpɛɛpɛ, ɔde nhwɛsode sɔhwɛ ma, na ɔboa ɔhaw ahorow ano aduru bere a adetɔfo no reyɛ lamination ne punching nhyehyɛe a etwa to no.
Wallis de RFID kaad prelam inlays a wɔahyɛ da ayɛ a wɔde nneɛma te sɛ PVC, PETG, PET, PC, ne ABS ma kaad yɛfo ne ano aduru a wɔde ma. Nneɛma a wobetumi apaw no gyina chip, frequency, antenna design, sheet dimensions, layout, target thickness, ne production volume so.
Bisa nhwɛsode anaa mfiridwuma mu nsɛm a wɔafa aka
Ka Wo RFID Kaad Dwumadie no ho asɛmRFID prelam inlay yɛ krataa a wɔayɛ no fã bi a chip, antenna, ne ahobammɔ layers wom. RFID kaad a wɔawie no de kaad-nipadua a wɔatintim, nkataso, mfonini a ɛwɔ soro, ankorankoro, punching, ne nhwehwɛmu a etwa to a ɛyɛ papa ka ho.
Dabi, card prelam inlays dodow no ara yɛ passive. Wɔtwa ahoɔden a wɔde yɛ adwuma fi akenkanfo a ɛne no hyia no RF afuw mu. RFID nneɛma a ɛyɛ adwuma de batere di dwuma, nanso ɛsono sɛnea wɔyɛe na ɛnyɛ nea wɔpaw a wɔtaa paw ma kaad a ɛyɛ tratraa a enni nkitahodi a wɔtaa de di dwuma.
Akenkan kwan no gyina frequency, chip sensitivity, antenna design ne tuning, akenkanfoɔ ahoɔden, akenkanfoɔ antenna, card orientation, card nneɛma a ɛtwa toɔ, dadeɛ anaa nsuo a ɛbɛn, interference, ne mmara anohyetoɔ a ɛwɔ hɔ. Ɛsɛ sɛ wɔde nhwɛsode ahorow a wɔawie ne ɔkenkanfo a wɔpɛ sɛ wɔkenkan no di ho adanse.
Dabi Ɛsɛ sɛ akenkanfo ne kaad no boa frequency, protocols, chip functions, ne security configurations a ɛne no hyia. 13.56 MHz kaad rennyɛ adwuma wɔ akenkanfo a wɔayɛ ama 125 kHz adansedi krataa nkutoo mu, na nneɛma abien a wɔde frequency koro di dwuma no da so ara de protocol ahorow a ɛne ne ho nhyia bedi dwuma.
Nneɛma a eye sen biara no gyina kaad nhyehyɛe a wɔawie, ɔkwan a wɔfa so tintim, ɔhyew a wɔde lamination yɛ, botae a ɛne sɛ ɛbɛkyɛ, nneɛma a atwa yɛn ho ahyia a wɔhwehwɛ, ne sikasɛm nhyehyɛe so. PVC abu so ma standard cards, bere a wobetumi apaw PETG, PET, PC, ABS, anaa hybrid structures ama dwumadie anaa adwumayɛ ahiadeɛ pɔtee bi.
Aane. Mpɛn pii no, wɔn a wɔyɛ no betumi ayɛ chip no mfonini, antenna geometry, krataa no nsusuwii, sɛnea wɔahyehyɛ kaad pii, nneɛma a wɔde yɛ, ne kɛse, ne kɛse, kaad no nne, agyiraehyɛde ahorow a wɔde kyerɛw wɔn din, ne anyinam ahoɔden sɔhwɛ ahwehwɛde ahorow. Sɛnea ɛbɛyɛ yiye no gyina nnwinnade, dodow a wɔkra, ne mfiridwuma ho nsɛm so.
Ɛsɛ sɛ adetɔfo di kan de anyinam ahoɔden sɔ prelam no hwɛ, afei wɔde nkrataa a wɔatintim ne nea wɔde akata so ankasa no kata so, wɔbɔ nkrataa a wɔawie no, na wɔsan yɛ dwumadi ho sɔhwɛ ahorow. Ɛsɛ sɛ wɔsɔ akenkan no kwan tenten, sɛnea ɛgyina pintinn, sɛnea ɛko tia kotow, sɛnea ɛte, sɛnea layer no bata ho, chip gyinabea, ne sɛnea ɛne akenkanfo a wɔpɛ sɛ wɔkenkan nyinaa hyia no hwɛ.
Ahobammɔ gu ahorow kɛse wɔ chip ne system nhyehyɛe mu. Nneɛma bi ma wonya ade a wɔde kyerɛ ade a wotumi kenkan nkutoo, bere a smart card IC ahorow a ahobammɔ wom betumi aboa wɔn ho wɔn ho nokwaredi, nkitahodi a wɔabɔ no kokoam, memory a wɔabɔ ho ban, ne application-level controls. Ɛsɛ sɛ adetɔfo de ahobammɔ nhyehyɛe no hyia asiane a ɛwɔ nea wɔpɛ sɛ wɔde bedi dwuma no mu.
Fa chip model anaa dwumadie a wɔhwehwɛ, mpɛn dodoɔ ne protocol, krataa nsusuiɛ, kaad nhyehyɛɛ, nneɛma, prelam duru, kaad a wɔawie, antenna anaa akenkan-kwan a wɔhwehwɛ, encoding ahiadeɛ, sɔhwɛ gyinapɛn, dodoɔ, packaging, ne botaeɛ dwumadie ma. Akenkanfoɔ nsɛm anaa nhwɛsoɔ nkrataa nso ho wɔ mfasoɔ ma nhyiamu nhwehwɛmu.
