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Inlay/ Prelam we dɛn kɔl
Wallis we nem Wallis
| Frɛkuɛns we dɛn nid: | |
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| Sayz: | |
| Kwantiti: | |
Wallis de saplae kɔstɔm RFID wet inlay ɛn NFC stika fɔ smat pak, rital invɛntari, lɔjistik, ɛtɛt aydentifikeshɔn, laybri, ivintɛns, prodak intarakshɔn ɛn ɔthɛntishɔn prɔjek. Di kɔnfigyushɔn dɛn we de inklud 13.56MHz HF/NFC inlays ɛn 860–960MHz UHF RAIN RFID inlays wit kɔstɔmayz chip, ɛntena, adeziv, dimɛnshɔn ɛn rol fɔmat.
Wet inlay nɔmal wan kin gɛt RFID chip we dɛn bon to wan ɛch aluminiɔm ɔ kɔpa ɛntena pan wan kyaria, plus prɛshɔn-sɛnsitiv adeziv ɛn wan rilis layna. I kin saplae fɔ dairekt aplikeshɔn na fayn ɛnvayrɔmɛnt ɔ kɔnvɔyt wit pepa, PET, PP ɔ ɔda fes matirial to wan finish printable RFID lɛbl.
'Waterproof' pefɔmans dipen pan di kɔmplit lɛbl kɔnstrɔkshɔn—nɔto jɔs di chip ɛn ɛntena. Fes matirial, adeziv, layna, edj protɛkshɔn, printin, laminɛshɔn, aplikeshɔn sɔfa, tɛmpracha ɛn imɛshɔn kɔndishɔn dɛn fɔ kɔnfɔm bifo dɛn prodyuz.
| Spesifikɛshɔn | Di Opshɔn dɛn we De |
|---|---|
| Fɔmat fɔ Prodak | RFID wet inlay, sɛlf-adhesive inlay, kɔnvɔyt NFC stika ɔ dɔn RFID lɛbl |
| Tipik Strukchɔ | Chip + etched antenna + PET ɔ aprɔv kyaria + prɛshɔn-sɛnsitiv adeziv + rilis layna |
| Frikyuɛnsi Opshɔn dɛn | HF/NFC 13.56MHz ɔ UHF 860–960MHz; dual-frikyuɛnsi kɔnstrɔkshɔn dɛn we de nɔmɔ wit wan spɛshal sɛlɛkɛt dual-intafɛs chip ɛn ɛntena dizayn |
| Protokɔlɔ Opshɔn dɛn | ISO/IEC 14443 Tayp A, ISO/IEC 15693, NFC Fɔm tayp ɔ EPC Klas 1 Jɛn 2 / ISO/IEC 18000-63 akɔdin to di chip we yu dɔn pik |
| HF/NFC Chip Ɛgzampul dɛn | NTAG213, NTAG215, NTAG216, NTAG424 DNA, MIFARE Ultralight, MIFARE Klasik, DESFire, ICODE ɛn ɔda kɔmpatibl opshɔn dɛn |
| UHF Chip Ɛgzampul dɛn | NXP UCODE, Impinj M730/M750 ɔ Monza famili dɛn, Alien Higgs ɛn ɔda prɔjek-spɛsifi k opshɔn dɛn |
| Matirial fɔ Antena | Aluminium ɔ kɔpa we dɛn et; antena dimɛnshɔn ɛn tuning we dɛn pik fɔ di aplikeshɔn sɔfa ɛn rida ɛnvayrɔmɛnt |
| Carrier ɛn Fes Matirial | Transparent PET kyaria; pepa, PET, PP, PVC ɔ sintetik fes matirial we de afta dɛn dɔn chenj di lɛbl |
| Adhesive we dɛn kin yuz fɔ adhesive | Permanent, removable, high-tack, low-temperature ɔ ɔda prɛshɔn-sɛnsitiv adeziv we dɛn kin tɛst pan sɔfa ɛn envayrɔmɛnt |
| Metal Surface Aplikeshɔn | I nid fɔ gɛt wan kɔnstrɔkshɔn we dɛn mek fɔ di tin dɛn we dɛn mek wit mɛtal, fɛrayt ɔ fom spɛshal; wan standad wet inlay nɔ fɔ tek am se i de wok dairekt pan mɛtal |
| Dimenshɔn ɛn Shep | Raun, skwea, rɛktangul ɔ kɔstɔmayz ɛntena ɛn day-kat dimɛnshɔn dɛn |
| Enkɔdin ɛn Pɔsnalayzeshɔn | UID ɔ TID ridin, EPC ɛnkɔdin, NDEF URL dɛn, siriɔs nɔmba dɛn, QR kɔd dɛn, barɔd dɛn ɛn data we di kɔstɔma dɛn gi |
| Fɔmat fɔ dilivri | Rol fɔmat wit kɔstɔmayz pitch, wɛb wit, kɔr saiz, wayndin dairekshɔn, kwantiti fɔ ɛni rol ɛn splais rikwaymɛnt |
| Envayrɔmɛnt Pɔfɔmɛnshɔn | Mɔstɔ, wata, tɛmpracha, kemikal, UV ɛn abrashɔn rɛsistɛns dipen pan di kɔmplit aprɔv lɛbl kɔnstrɔkshɔn |
Mɛmori fɔ spɛsifa bay chip pas fɔ bi wan yunivasal rɛnj. Fɔ ɛgzampul, NTAG213, NTAG215 ɛn NTAG216 de gi difrɛn NFC yuza-mɛmori kapasiti, we UHF prodakt dɛn nɔmal fɔ spɛsifa EPC, TID ɛn opshɔnal yuz mɛmori insay bit.
| Kɔmpia | HF/NFC Wet Inlay | UHF RFID Wet Inlay |
|---|---|---|
| Ɔmɔs tɛm | 13.56MHz na di 13.56MHz | Tipikli 860–960MHz wit rijinol tuning rikwaymɛnt |
| Tipik Prɔtokɔlɔ dɛn | ISO/IEC 14443 Tayp A, ISO/IEC 15693 ɛn NFC Fɔm tayp dɛn | EPC Klas 1 Jɛn 2 / ISO/IEC 18000-63 |
| Tipik Rid Rɛnj | Fɔs sɛntimita, dipen pan chip, ɛntena, rida ɛn aplikeshɔn sɔfa | Frɔm shɔt rɛnj to sɔm mita, i dipen pan ɛntena, rida pawa, rijyɔn, ɔriɛnteshɔn, matirial ɛn envayrɔmɛnt |
| Smartfon Intarakshɔn | Posisibul wit kompitibul NFC chips en sopot fon bihayv | Nɔmal wan i nid fɔ gɛt dediket UHF rida pas nɔmɔ yu yuz spɛshal dual-frikyuɛnsi prodak |
| Kɔmɔn Aplikeshɔn dɛn | NFC makɛt, prodak infɔmeshɔn, ɔthɛntishɔn, ivintɛns, laybri ɛn shɔt-rɛnj aydentifikeshɔn | Ritayl invɛntari, westɛm lɔjistik, klos, katon, ɛset ɛn bɔlk ridin |
| Diskripshɔn fɔ Mɛmori | Chip-spɛsifi k yuz mɛmori, pej dɛn, blɔk dɛn, sikyɔriti ɛn lɔk fɛnshɔn dɛn | EPC, TID, rizɔv ɛn opshɔnal yuz-mɛmori bank dɛn |
| Ki Selekshɔn Input dɛn | Fɔn ɔ rida mɔdel, protɔkɔl, data saiz, sikyɔriti ɛn ɛntena dimɛnshɔn | Rijinal band, rida, rid zon, tag matirial, oriɛnteshɔn, density ɛn target rɛnj |
NFC wet inlays na tin we dɛn kin pik fɔ URL, dijital prodak infɔmeshɔn, prɔmoshɔn, ɔthɛntishɔn wokflɔ, dijital warranty ɛn ɔda intarakshɔn dɛn we kɔmpitabl smartfon ɔ HF rida bigin.
UHF inlays dɛn kin jɔs pik we bɔku prɔdak dɛn we dɛn dɔn tag fɔ rid kwik kwik wan ɔ frɔm fa, lɛk apɛl invɛntari, katon, westɛm ɛset ɛn lɔjistik prɔses.
Wan stetmɛnt lɛk 'rid rɛnj ova tri mita' kin bi rial fɔ wan fayn UHF inlay insay wan kɔntrol sɛtup, bɔt i nɔto wan aprɔpriet yunivasal klem fɔ NFC ɔ HF lɛbl dɛn.
UHF rida rigyuleshɔn ɛn prɛferɛd tuning difrɛn bay makit. Saplae di kɔntri we yu want fɔ go ɛn di rida ɛnvayrɔmɛnt so dat dɛn go ebul fɔ pik di ɛntena fɔ di ɔpreshɔn band we dɛn want.
Wan wet inlay inklud prɛshɔn-sɛnsitiv adeziv ɛn wan rilis layna. Dɛn kin yuz am fɔ kɔmpitabl dairekt-aplikeshɔn prɔjek dɛn ɔ dɛn kin chenj am to lɛbl we dɔn dɔn wit ɔda fes matirial we dɛn kin print.
Wan dray inlay na di chip ɛn ɛntena asɛmbli we nɔ gɛt di fayn prɛshɔn-sɛnsitiv adhesive kɔnstrɔkshɔn. I jɔs de pik fɔ ɛmbas, laminashɔn ɔ fɔ kɔnvɔyt mɔ.
Wan lɛbl we dɔn dɔn de jɔyn di inlay wit wan fes stok we dɛn dɔn pik, adeziv ɛn layna. Dis kɔnstrɔkshɔn de disayd fɔ print, kɔlɔ, opasiti, wata rɛsistɛns, UV durabiliti, lɛbl stiffnɛs ɛn fayn day-kat shep.
Wan besik transparent wet inlay nɔto ɔtomɛtik wan dɔn dɔn print lɛbl. Fɔ tɛmal transfa, dairekt tɛmal, fleksografik, dijital ɔ UV printin, spɛsifa di fes matirial, printa teknɔlɔji, ribin ɔ ink ɛn print durabiliti.
PET kyaria ɛn sɔm sintetik fes stok dɛn we dɛn dɔn pik kin ebul fɔ tinap tranga wan, bɔt wata kin stil afɛkt di adhesive ed dɛn, print grafik dɛn, layna dɛn ɛn kɔnstrɔkshɔn dɛn we nɔ sial. Difayn splash, humidity, washdown, outdoor exposure ɔ ful-immersion rikwaymɛnt dɛn sɛpret wan.
Pepabɔd, glas, PET bɔtul, HDPE kɔntena, plastic we gɛt tɛkstɔr, say we dɛn dɔn pent ɛn plastic we nɔ gɛt bɔku ɛnaji kin nid difrɛn adhesive sistem. di klin we di surface klin, di tεmprachכ εn di tεm we yu de de de afekt bak di bond strכng.
Metal detunes wan standad RFID antena ɛn i kin ridyus di pefɔmɛns bad bad wan. Yuz kwalifay on-mɛtal lɛbl wit spɛshal, fɛrayt ɔ ɔda aysolɛshɔn layt we di tag fɔ aplay pan mɛtal.
Wata-based likwid ɛn prodakt kɔntinyu kin chenj antena tuning ɔ absɔb RF ɛnaji. Bɔtul, kɔsmɛtik, drink ɛn famasi kɔntena dɛn fɔ tɛst insay di las kɔndishɔn we dɛn ful-ɔp.
Adhesive aplikeshɔn tɛmpracha, savis tɛmpracha ɛn stɔrɔj tɛmpracha na difrɛn spɛsifikɛshɔn dɛn. Kol-chen, friza, ay-ɔt ɔ ɔda prɔjek dɛn nid fɔ gɛt validet matirial ɛn adeziv kɔmbayn.
Dɛn NFC Fɔm Tayp 2 chips ya na dɛn kin yuz fɔ URL, dijital profayl ɛn kɔnsuma intarakshɔn. Dɛn de gi difrɛn yuz-mɛmori kapasiti, so dɛn fɔ dɔn di tin dɛn we dɛn dɔn kɔd bifo dɛn pik di chip.
Sikyu NFC prodakt kin sɔpɔt kriptografik ɔthɛntishɔn ɛn dinamik verifyeshɔn wokflɔ we dɛn intagret wit di kɔrɛkt ki, softwe ɛn bakɛnd. Di lɛbl nɔmɔ nɔ de mek wan kɔmplit anti-kɔntɛfɛt sistɛm.
ICODE prodakt kin fit laybri, ɛtɛt ɛn vicinity-rida aplikeshɔn dɛn we nid ISO/IEC 15693 kɔmpitibliti. Dɛn nɔ kin chenj dɛn ɔtomɛtik wan wit ISO/IEC 14443 rida dɛn.
UHF chip sɛlɛkshɔn fɔ tink bɔt EPC kapasiti, TID rikwaymɛnt, opshɔnal yuz mɛmori, sɛnsitiviti, akses ɔ kil paswɔd ɛn kɔmpatibiliti wit di rida ɛn softwe.
HF/NFC prodakt kin mek yu gɛt chip UID, we UHF prodakt kin yuz faktri TID ɛn EPC we dɛn kin program. Spɛsifik us valyu fɔ rid, print, ɛnkɔd ɔ mach wit di kɔstɔma database.
Wallis kin tɔk bɔt NDEF URL raytin, EPC ɛnkɔdin, paswɔd, siriɔs data ɛn rid-onli lɔk. Pɛrmanɛnt lɔk ɔpreshɔn fɔ du ɔl afta di las verifyeshɔn bikɔs dɛn nɔ kin rivεrsibl.
Antena dimɛnshɔn dɛn kin afɛkt RF pefɔmɛns, we di lɛbl dimɛnshɔn dɛn we dɔn dɔn de disayd di fes stok we de ɛn di say we dɛn de print. Dɛn tu dimɛnshɔn ya fɔ de na di drɔin we dɛn dɔn gri fɔ.
Spɛsifik di kɔr insay dayamita, maksimal rol ɔta dayamita, wɛb wit ɛn lɛbl dɛn fɔ ɛni rol so di prɔdak go rɔn tru di kɔstɔma in kɔnvɔtin, printin ɔ dispɛns ikwipmɛnt.
Lebul pitch, gap, kros-wɛb pozishɔn ɛn wayndin dairekshɔn fɔ mach di dawɔnstrim mashin. Dɛn fɔ gri fɔ mek wan rol-dayrɛkshɔn dayagram bifo dɛn mek am bɔku bɔku wan.
Difayn if dɛn pul di inlay dɛn we nɔ fayn, mak dɛn ɔ kip dɛn, ɛn spɛsifa di maksimal nɔmba fɔ di splays dɛn fɔ wan rol. Otomatik kɔnvɔtin layn dɛn kin nid strikt rɔl-kɔntinyu standad.
Di lɛbl dɛn we dɔn dɔn kin gɛt logo, tɛks, QR kɔd, barɔd, siriɔs nɔmba, UID/TID/EPC valyu ɔ ɔda vayriɔbul data we dɛn pik wan fayn fes matirial we dɛn kin print.
NFC stika dɛn kin kɔnɛkt pakej to prɔdak pej dɛn, ɔthɛntiti chɛk, instrɔkshɔn, dijital warranty, prɔmoshɔn ɛn afta-sɛl kɔntinyu yuz kɔmpatibl smartfon dɛn.
UHF wet inlays kin sɔpɔt aytem-lɛvɛl tag, saykl kɔnt, stok visibiliti, risiv, riplenishmɛnt ɛn lɔs-prɛvenshɔn wokflɔ we dɛn intagret wit fayn rida ɛn softwe.
RFID lɛbl dɛn kin no di katɔn, tot, pasɛl ɛn transpɔt tin dɛn we dɛn kin yuz bak. Antena ɛn adeziv sɛlɛkshɔn fɔ validet pan di aktual pak matirial ɛn wetin de insay.
HF ɔ UHF lɛbl dɛn kin sɔpɔt fiks-ɛset aydentifikeshɔn, dɔkyumɛnt trakin, arkiv ɛn tul manejmɛnt akɔdin to di rid zon ɛn aplikeshɔn sɔfa we dɛn nid.
ISO/IEC 15693 HF lɛbl dɛn na tin we dɛn kin tink bɔt fɔ laybri ɛn midia wokflɔ, we de ɔnda di rida, data mɔdel ɛn lɛbl-plesmɛnt rikwaymɛnt dɛn.
Dɛn kin put lɛbl dɛn we nɔ gɛt kɔntakt insay tikɛt, badge, wristband ɔ pas. Chip tayp, sikyɔriti, ɛnkɔdin ɛn rid-saykl rikwaymɛnt fɔ mach di ivin pletfɔm.
NFC kin sɔpɔt ɔthɛntishɔn ɛn traysabiliti, bɔt sikrit implimɛnt nid fɔ gɛt di rayt chip, ki dɛn we dɛn protɛkt, bakɛnd we dɛn kin trɔst, ridayrɛkt dɛn we dɛn kin kɔntrol ɛn wan we fɔ no di data we dɛn dɔn kɔpi.
Aplikeshɔn ɛn biznɛs funkshɔn we dɛn nid
HF/NFC 13.56MHz ɔ UHF 860–960MHz
Rikwayd protɔkɔl ɛn prɛferɛd chip
Rida, smart fon ɔ ɛnkɔdin ikwipmɛnt mɔdel
Tagged matirial, prodakt kɔntinyu ɛn mawntin sɔfays
Target rid rεnj, rid dεyshכn εn tag dεnsiti
Antena saiz, fainal lebul saiz ɛn ples fɔ ples we de
Fes matirial, adeziv, layna ɛn watapruf rikwaymɛnt
Aplikeshɔn, savis ɛn stɔrɔj tɛmpracha
Printin, UID/TID/EPC maching ɛn ɛnkɔdin rikwaymɛnt dɛn
Rol kor, wɛb wit, pitch, wayndin dairekshɔn ɛn rol kwantiti
Ɔda kwantiti, sampul kwantiti, ples fɔ go ɛn di delivri schedule
Send Yu RFID Projek Rikwaymɛnt dɛn
Inlays fɔ gɛt ilɛktrik tɛst fɔ chip rispɔns ɛn ɛntena kɔnɛkshɔn akɔdin to di kwaliti plan we dɛn dɔn gri fɔ. Di inspekshɔn we ɛn akseptabl bad-tag ret fɔ de na di ɔda spɛsifikɛshɔn.
Test di tag wit di rida we yu want, pawa sɛtin, ɛntena, tin we dɛn tag, ɔriɛnteshɔn ɛn envayrɔmɛnt. Labɔrɔtɔri fri-ɛya pefɔmɛns kin difrɛn frɔm di pefɔmɛns pan rial prɔdak.
Evaluate initial tak, dwell time, peel strength, temperechur, humidity ɛn rimobul bihayvya pan di aktual aplikeshɔn sɔfays.
Difayn di wata we dɛn nid fɔ ɛksplɔz, di tɛm we dɛn fɔ tek, di tɛmpracha ɛn di krayteria fɔ aksept. Splash resistans, kondensashɔn, wasdɔwn ɛn imɛshɔn na difrɛn tɛst kɔndishɔn dɛn.
UID, TID, EPC, NDEF, paswɔd ɛn kɔstɔma data we dɛn kɔd fɔ rid bak ɛn kɔmpia am wit di fayl we dɛn dɔn gri fɔ. Di vayriɔbul data we dɛn print fɔ kɔntinyu fɔ mach wit di ilɛktronik rɛkɔd.
Verifay di lɛbl kɔnt, pitch, wɛb alaynɛshɔn, wayndin dairekshɔn, rol kɔr, splais, layna kɔndishɔn ɛn difɛktiv-tɛg mak bifo dɛn ship am.
Wallis kin rivyu shɔt-rɛnj NFC aplikeshɔn ɛn lɔng-rɛnj UHF invɛntari prɔjek dɛn we de yuz chip ɛn ɛntena kɔnfigyushɔn dɛn we dɛn pik fɔ di rida ɛnvayrɔmɛnt we dɛn want.
Baya dɛn kin tɔk bɔt dimɛnshɔn, ɛntena kɔnstrɔkshɔn, fes matirial, adeziv, layna, day kɔt, rol spɛsifikɛshɔn ɛn finish-lɛbul kɔnvɔshɔn.
UID/TID ridin, EPC ɔ NDEF ɛnkɔdin, siriɔs printin, barɔd, QR kɔd ɛn database maching kin de insay wan aprɔv pɔsnalayzeshɔn wokflɔ.
Sampul dɛn de alaw di pɔsin we bay fɔ validet RF pefɔmɛns, adeziv, wata rɛsistɛns, printa kɔmpatibiliti ɛn rol-kɔnvɔyt bihayvya pan di aktual prodak.
Wallis de sɔpɔt lɛbl kɔnvɔta, pak kɔmni, RFID intagreta, distribyushɔn, ritayla, lɔjistik kɔmni ɛn ɔda ay-volyum prɔjek bayer dɛn.
RFID wet inlays na kɔmɔn fɔ saplae insay rol. Di pak kin inklud protɛktiv bag, mɔstɔ kɔntrol, rol lɛbl, chip ɛn lɔt aydentifikeshɔn, kwantiti rɛkɔd ɛn ɛkspɔt katɔn. Di kɔr saiz, maksimal rol dayamita, lɛbl dɛn fɔ ɛni rol ɛn di wayndin dairekshɔn fɔ kɔnfɔm bifo dɛn prodyuz.
Dɛn fɔ kip di lɛbl ɛn inlay dɛn we dɔn dɔn fa frɔm di ɔt we dɛn nɔ kɔntrol, wet, dɔst, ilɛktrɔstatik dischaj ɛn mɛkanikal prɛshɔn. Di kɔndishɔn fɔ stɔrɔj dipen pan di chip we yu dɔn pik, adhesive, fes matirial ɛn layna.
Na pasiv RFID chip-ɛn-antena asɛmbli we dɛn de gi wit prɛshɔn-sɛnsitiv adeziv ɛn wan rilis layna. Dɛn kin yuz am dairekt wan pan fayn fayn prɔjek dɛn ɔ dɛn kin chenj am to RFID lɛbl we dɔn dɔn.
Wan wet inlay na di ɔndalayn adhesive RFID asɛmbli. NFC stika na nɔmal wan lɛbl we dɔn dɔn we de ad wan fes matirial we dɛn kin print ɔ we de protɛkt, fayn fayn day-kat shep ɛn aplikeshɔn-spɛsifi k adeziv.
Yɛs. Wallis kin tɔk bɔt 13.56MHz HF/NFC ɛn 860–960MHz UHF opshɔn dɛn. Di kɔrɛkt teknɔlɔji dipen pan di kayn rida, di target rɛnj, di matirial we dɛn tag ɛn di aplikeshɔn.
Na wan spɛshal dual-frikyuɛnsi prodak nɔmɔ we dɛn mek kin sɔpɔt ɔl tu di intafɛs dɛn. Wan nɔmal NFC inlay ɛn wan nɔmal UHF inlay na difrɛn prɔdak dɛn.
NFC ɛn HF tag dɛn kin jɔs rid na shɔt rɛnj, we UHF tag dɛn kin rich sɔm mita dɛn insay fayn kɔndishɔn. Faynal rεnj dipכnt pan chip, antena, rida, mεtirial, כryenteshכn εn envayroment.
Nɔ yunivasal watapruf raytin nɔ fɔ tek am. Wata rɛsistɛns dipen pan di kyaria, fes matirial, adhesive, edj protɛkshɔn, printin, mawntin sɔfa ɛn ɛksplɔshɔn kɔndishɔn.
Standard inlays kin du fayn pan mɛtal. Rikwest wan on-metal konstrakshɔn wit wan fayn spɛshal spɛshal ɔ fɛrayt layt ɛn tɛst am pan di aktual mɛtal aytem.
Yes, bɔt likwid kɔntinyu kin chenj RF pefɔmɛns. Test di antena we yu want ɛn pozishɔn pan di las bɔtul ɔ kɔntena we dɛn ful-ɔp.
Wan besik transparent wet inlay na nɔmal fɔ kɔnvɔyt wit wan printabl fes stok. Spɛsifik di we aw dɛn de print, ink ɔ ribin, di lɛbl matirial ɛn di we aw yu want fɔ de fɔ lɔng tɛm.
Pik akɔdin to di mɛmori, fon kɔmpatibiliti, paswɔd, ɔthɛntishɔn ɛn data-ritɛnshɔn rikwaymɛnt dɛn. NTAG213, NTAG215, NTAG216, sikyuɔr NFC ɛn ICODE prodakt dɛn de sav difrɛn aplikeshɔn dɛn.
Tink bɔt EPC ɛn yuz mɛmori, sɛnsitiviti, TID rikwaymɛnt, rida ɛnvayrɔmɛnt, rijinal band, tag matirial ɛn rikwayd rid pefɔmɛns.
Dɛn kin tɔk bɔt NDEF URL dɛn, EPC valyu dɛn, paswɔd dɛn, siriɔs nɔmba dɛn ɛn ɔda data we dɛn dɔn gri fɔ. Saplae wan klia data fayl, fɔmat, sikyud ɛn verifyeshɔn lɔ.
Yɛs, afta yu dɔn pik wan fayn fayn fes matirial we yu kin print ɛn kɔnvɔyt di we aw yu de du am. Variable data kin mach to UID, TID ɔ EPC valyu dɛn we nid de.
Gi kɔr saiz, lɛbl fɔ ɛni rol, maksimal ɔta dayamita, wɛb wit, lɛbl pitch, gap, wayndin dairekshɔn, splais lɔ ɛn difɛktiv-tɛg mak rikwaymɛnt.
Yɛs. Test rid pefɔmans, plesmɛnt, adhesive bonding, wata ɛksplɔshɔn, printin, ɛnkɔdin ɛn rol fidin pan di aktual prodak ɛn ikwipmɛnt.
Send di aplikeshɔn, frikshɔn, protɔkɔl, chip, rida, tag matirial, rid rɛnj, lɛbl dimɛnshɔn, adeziv, watapruf rikwaymɛnt, ɛnkɔdin, rol spɛsifikɛshɔn, kwantiti ɛn ples fɔ go.
