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dray inlay
Wallis bin de tɔk bɔt am
| Frikyuɛnsi rikwaymɛnt: | |
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| Sayz: | |
| Kwantiti: | |
Wallis de saplae kɔstɔm RFID dray inlay shit fɔ smart kad, prodak ɔthɛntishɔn, anti-dayvɛnshɔn, invɛntari visibiliti, akses kredibiliti, laybri sistɛm, ivin tikɛt, ɛmbaded tag ɛn ɔda OEM RFID prɔjek dɛn. Di kɔnfigyushɔn dɛn we de inklud 13.56MHz HF/NFC ɛn 860–960MHz UHF teknɔlɔji dɛn wit kɔstɔmayz chips, ɛntena, dimɛnshɔn ɛn delivri fɔmat.
Wan RFID dray inlay gɛt wan chip we dɛn kɔnɛkt to wan ɛtch aluminiɔm ɔ kɔpa ɛntena pan wan PET ɔ ɔda aprɔv kyaria. I nɔ inklud di fayn prɛshɔn-sɛnsitiv adeziv, printabl fes stok ɔ finish protɛktiv haus, we de alaw kad manifakta dɛn, lɛbl kɔnvɔta ɛn prodak intagreta fɔ bil am insay dɛn yon kɔnstrɔkshɔn.
Di dray inlay nɔmɔ nɔ de mek di prɔdak bi anti-kɔntɛfɛt ɔ anti-tif ɔtomɛtik wan. Ɔthɛntishɔn nid fɔ gɛt fayn chip, data we dɛn protɛkt, ki dɛn we dɛn kin kɔntrol ɛn wan verifyeshɔn pletfɔm we pɔsin kin abop pan. Fɔ mek dɛn nɔ tif, dɛn nid fɔ intagret wit invɛntari, akses, EAS ɔ RFID rida infrastukchɔ ɛn ɔpreshɔnal softwe.
Rikwest wan Kastɔm Dray Inlay Kɔt
| Tayp fɔ Prodakt | RFID dray inlay shit, rol ɔ kɔstɔmayz matris | Ɛgzampul | Dray inlay we dɔn dray |
| Di Besik Struktrɔ | RFID chip + chip kɔnɛkshɔn + ɛtch ɛntena + PET ɔ aprɔv kyaria | Adhesive we dɛn kin yuz fɔ adhesive | No fainal prɛshɔn-sɛnsitiv adhesive bak |
| Frikyuɛnsi Opshɔn dɛn | 13.56MHz HF/NFC ɛn 860–960MHz UHF; LF opshɔn dɛn kin rivyu fɔ spɛshal prɔjek dɛn | Protokɔlɔ Opshɔn dɛn | ISO/IEC 14443 Tayp A, ISO/IEC 15693, NFC Fɔm tayp ɔ EPC Klas 1 Jɛn 2 / ISO/IEC 18000-63 |
| HF/NFC Chip Ɛgzampul dɛn | NTAG213/215/216, NTAG424 DNA, MIFARE Ultralight, MIFARE Klasik, DESFire, ICODE, F08 ɛn ɔda kɔmpatibl opshɔn dɛn | UHF Chip Ɛgzampul dɛn | NXP UCODE, Impinj M730/M750 ɔ Monza famili dɛn, Alien Higgs ɛn ɔda prɔjek-spɛsifi k opshɔn dɛn |
| Matirial fɔ Antena | Aluminium ɔ kɔpa we dɛn et | Dizayn fɔ Antena | Standart ɔ kɔstɔmayz dimɛnshɔn dɛn we de ɔnda impedans, frikshɔn, rida ɛn intagreshɔn rikwaymɛnt dɛn |
| Sayz ɛn Shep | Raun, skwea, rɛktangul, smɔl, kɔmpakt ɔ kɔstɔmayt | Fɔmat fɔ dilivri | Rol, shit ɔ kɔstɔma-spɛsifi k matris layout |
| Enkɔdin we dɛn de yuz | NDEF URL, EPC, paswɔd, yuz data ɛn ɔda chip-sɔpɔt data fɔmat dɛn | Di we aw dɛn de handle di aydentifaya | UID, TID, EPC ɔ siriɔs-nɔmba ridin, printin ɛn database maching akɔdin to di chip tayp |
| Integreshɔn Opshɔn dɛn | PVC/PET/PC kad lamination, lebul kɔnvɔyt, tikɛt, wristband, mold prodak ɛn kɔstɔm haus | Sekyuriti Opshɔn dɛn | Paswɔd, lɔk, kriptografik ɔthɛntishɔn ɔ tamper-lɔp kapabiliti nɔmɔ wit fayn chips ɛn sistem dizayn |
| Di Praymari Baya dɛn | Kad manifakta, lebul kɔnvɔta, RFID intagreta, sikyɔriti sɔlvishɔn prɔvayda ɛn OEM prodak manifakta | Skɔp fɔ Kastamayzeshɔn | Chip, antena, kyaria, saiz, shit matris, rol fɔmat, ɛnkɔdin, inspekshɔn ɛn pak |
Di target pej list UHF 869–915MHz, 13.56MHz ISO/IEC 14443 ɛn 13.56MHz ISO/IEC 15693 as frikshɔn rikwaymɛnt. Faynal frikshɔn rɛnj, ɛksaktɔ chip, ɛntena dimɛnshɔn, mɛmori, rid rɛnj ɛn intagreshɔn tɛmpracha fɔ kɔnfɔm fɔ ɛni prɔjek.
| Kɔmpiashɔn | Dray Inlay | Wet Inlay | Finished RFID Lɛbul |
|---|---|---|---|
| Kor Kɔnstrɔkshɔn | Chip ɛn antena na wan kyaria | Dray inlay kɔnvɔyt wit adhesive ɛn rilis layna | Wet inlay plus printable fes stok, fainal adhesive ɛn day-kat kɔnstrɔkshɔn |
| Adhesive Baking we dɛn kin yuz fɔ mek tin dɛn | Nɔ inklud as di las sɛlf-adhesive prodak | Insay de | Inklud ɛn pik fɔ di target aplikeshɔn sɔfa |
| Fes we yu kin print | Nɔ de insay pas nɔmɔ dɛn ad am we dɛn de chenj ɔda tin | Bɔku tɛm, dɛn kin nid fɔ yuz fes matirial fɔ mek dɛn ebul fɔ print di las tɛm | Pepa, PET, PP ɔ ɔda apruv printable fes stok |
| Di Tipik Yuz | Kad lamination, prodak embedding, enkapsuleshɔn ɛn kɔstɔm kɔnvɔyt | Lebul kɔnvɔyt ɔ kɔmpitabl dairekt aplikeshɔn | Rɛdi fɔ print, ɛnkɔd ɛn ataya to di las tin |
| Di Lɛvul fɔ Protɛkshɔn | Dipen pan di matirial we dɛn put am insay | Dipen pan karia, adhesive ɛn ɔda kɔnvɔshɔn | Difain bay di komplit fes stok, kotin, adhesive, lamination en edj dizain |
| Tipik Baya we pɔsin kin bay | Kad mek, tag manifakta ɔ prodak intagreta | Lebul kɔnvɔta ɔ RFID intagreta | Brand, ritayla, lɔjistik ɔpreshɔn ɔ ɛnd-yuz program |
Dray inlays na di rayt we we di pɔsin we bay de kɔntrol di fayn lamination, haus, adhesive ɔ label-conversion process ɛn nid dairekt akses to di besik RFID kɔmpɔnɛnt.
Wet inlay dɛn fayn we dɛn nid prɛshɔn-sɛnsitiv RFID kɔmpɔnɛnt fɔ kɔba wit fes matirial, day kɔt, print ɔ ɔtomatik aplikeshɔn.
Wan RFID lɛbl we dɔn dɔn na di bɛtɛ chuk we di prɔjek nid wan say we dɛn kin print, aplikeshɔn-spɛsifi k adeziv, fayn day-kat dimɛnshɔn, ɛnkɔdin ɛn rol spɛsifikɛshɔn.
Yu kin kɔpi wan aydentifaya we pɔsin kin si ɔ we pɔsin kin rid insay ɔda tag ɔ kɔd we dɛn print. Strɔng ɔthɛntishɔn nid fɔ gɛt chip wit fayn kriptografik ficha dɛn, yunik ki dɛn, pɔsnalayzeshɔn we dɛn protɛkt ɛn bakɛnd verifyeshɔn.
Sikyu NFC chips lɛk NTAG424 DNA kin sɔpɔt AES-based ɔthɛntishɔn, dinamik sikyu mɛsej ɛn ɔrijinal chɛk we dɛn kɔnfigyut wit wan sava we dɛn kin trɔst ɛn ki dɛn we dɛn kin kɔntrol.
Wan standad dray inlay nɔ de detekt di paket opin. Fɔ no di tamper nid fɔ gɛt chip ɛn ɛntena dizayn wit aprɔv tamper loop, ɔ wan destructible label ɛn pak kɔnstrɔkshɔn we dɛn mek fɔ sho se dɛn dɔn pul am.
RFID kin sɔpɔt invɛntari visibiliti, unatɔrayz-rimɔv alɛt ɛn ɛkzit monitarin, bɔt di inlay fɔ intagret wit rida, ɛntena, ivin lɔ dɛn, database ɛn stoa ɔ fasiliti prosidyuz.
Bɔku UHF invɛntari chips dɛn de ɔptimayz fɔ mek dɛn no dɛn kwik kwik wan ɛn fɔ rid bɔku bɔku wan. Dɛn EPC ɛn TID fɛnshɔn dɛn nɔ fɔ diskrayb as ɛnkript prodak ɔthɛntishɔn pas di chip ɛn aplikeshɔn we dɛn pik gi da kapasiti de.
Wan kɔmplit ɔthɛntishɔn program kin inklud chip kredibiliti, wan sikrit database, prodak rɛkɔd, chanɛl monitarin, ret limit, anomaly ditekshɔn ɛn wan kɔshɔma ɔ inspɛkta verifyeshɔn intafɛs.
| Komparashɔn | HF/NFC Dray inlay | UHF Dray Inlay |
|---|---|---|
| Ɔmɔs tɛm | 13.56MHz na di 13.56MHz | 860–960MHz wit rijinol tuning rikwaymɛnt |
| Prɔtokɔlɔ dɛn | ISO/IEC 14443 Tayp A, ISO/IEC 15693 ɛn NFC Fɔm tayp dɛn | EPC Klas 1 Jɛn 2 / ISO/IEC 18000-63 |
| Tipik Rida Biɛvhɔ | Tap ɔ shɔt-rɛnj proksimiti ridin | Short rɛnj to sɔm mita wit fayn rida, ɛntena ɛn envayrɔmɛnt |
| Smartfon Kɔmpatibiliti | Posisibul wit kompitibul NFC chips en sopot fon bihayv | Nɔmal wan i nid fɔ gɛt wan dediket UHF rida |
| Di Kɔmɔn Yuz fɔ Sikyuriti | Mobayl prodak ɔthɛntishɔn, sikrit URL dɛn, akses kredibiliti ɛn aplikeshɔn dɛn we no bɔt di tamper | Invɛntari visibiliti, saplae-chen trakin, aytem aydentifikeshɔn ɛn ɛkzit-ivent monitarin |
| Tɛminɔlɔji fɔ Mɛmori | UID, yuz mɛmori, pej, blɔk, paswɔd, ki ɛn ɔthɛntishɔn ficha dɛn | EPC, TID, rizɔv mɛmori ɛn opshɔnal yuz mɛmori |
| Men Selekshɔn Input dɛn | Fɔn ɔ rida, protɔkɔl, data saiz, sikyɔriti lɛvɛl ɛn ɛntena eria | Rijinal band, rida, rid zon, aytem matirial, oriɛnteshɔn, density ɛn target rɛnj |
NFC fayn we kɔstɔma, inspɛkta ɔ wokman nid fɔ tap di ɛmbaded tag we de yuz kɔmpitabl fon ɔ HF rida fɔ opin wan prɔdak rɛkɔd ɔ fɔ du ɔthɛntishɔn.
UHF fayn we dɛn fɔ no bɔku tin dɛn kwik kwik wan, na pɔtal, na shelf, insay westɛm ɔ we dɛn de muv di sapɔt-chen.
ISO/IEC 15693 inlays kin fit kɔmpitabl laybri, dɔkyumɛnt, ɛtɛt ɛn industrial aplikeshɔn dɛn. Dɛn nɔ fɔ tek am se dɛn de wok wit ɛvri ISO/IEC 14443 rida ɔ smart fon wokflɔ.
Aktual rid rɛnj dipen pan chip sɛnsitiviti, ɛntena dimɛnshɔn, rida pawa, rida ɛntena, rijinal lɔ dɛn, tag matirial, ɔriɛnteshɔn ɛn fayn ɛmbaded kɔnstrɔkshɔn.
Dɛn NFC Fɔm Tayp 2 chips ya de yuz bɔku bɔku wan fɔ URL, prodak infɔmeshɔn ɛn mobayl intarakshɔn. Dɛn yuz-mɛmori kapasiti difrɛn, so di NDEF data we dɛn nid fɔ dɔn bifo dɛn pik di chip.
Sikyu chips kin sɔpɔt AES ɔthɛntishɔn, sikyu mɛsej, ɔrijinal chɛk ɛn protɛkt data. Dɛn nid sikyɔriti ki provayd, pɔsnalayzeshɔn ɛn bakɛnd validɛshɔn.
MIFARE Ultralight, Classic ɔ DESFire prodak dɛn kin nid fɔ kɔmpitabl akses, tikɛt, mɛmbaship ɔ mɔlti-aplikeshɔn sistem dɛn. Rida famwɔya, softwe, ki ɛn data strɔkchɔ fɔ mach.
ICODE prodakt kin sɔpɔt ISO/IEC 15693 laybri, ɛtɛt ɛn vicinity-rida projɛkt dɛn. Eksakt chip jenereshɔn, mɛmori ɛn ɔrijinal ɔ paswɔd ficha dɛn fɔ kɔnfɔm.
UHF chip sɛlɛkshɔn fɔ tink bɔt EPC kapasiti, faktri TID, opshɔnal yuz mɛmori, sɛnsitiviti, akses ɔ kil paswɔd, ɛnkɔdin spid ɛn rida kɔmpatibiliti.
Di ɔrijinal pej in 144–888-bayt rɛnj kɔrɛkt to sɔm NFC chip famili dɛn we dɛn dɔn pik, nɔto ɛvri HF, LF ɔ UHF inlay. UHF mɛmori na tin we dɛn kin spɛsifa insay EPC, TID ɛn yuz-mɛmori bit.
UID, TID ɛn EPC de du difrɛn tin dɛn. Spɛsifik us valyu fɔ rid, program, print, kɔnvɔyt to dɛsimal ɔ heksadesimal, ɛn mach wit QR kɔd, barɔd ɔ prodak rɛkɔd.
Antena dimɛnshɔn dɛn de inflɔws RF pefɔmɛns, we di totɛl inlay dimɛnshɔn dɛn de ditɛm di kyaria eria ɛn spɛs we di prɔdak dizayn nid. Dɛn fɔ sho ɔl tu di dimɛnshɔn dɛn na di drɔin we dɛn dɔn gri fɔ.
Wan sheet layout fɔ spɛsifa sheet dimɛnshɔn, ɛntena pozishɔn, chip ɔriɛnteshɔn, rɛjista mak, kad panch layout ɛn spays bitwin inlays.
Rol saplai nid fɔ gɛt aprɔv kɔr saiz, wɛb wit, pitch, chip ɔriɛnteshɔn, krɔs-wɛb pozishɔn, wayndin dairekshɔn, maksimal rol dayamita ɛn inlays fɔ ɛni rol.
Kad ɔ prodak laminɛshɔn fɔ de insay di limit we dɛn dɔn gri fɔ di chip kɔnɛkshɔn, kyaria ɛn ɛntena. Test di komplit hεt, prεshכn εn kol saykl bifo bכlk prodakshכn.
Smat-kad layout fɔ mek dɛn nɔ ambɔg magnɛtik strɛp, kɔntakt mɔdyul, ɛmbos, ol, sayn panɛl ɛn kad-kɔt eria.
Standard inlays kin detune nia mɛtal, likwid, kabɔn-ful plastic ɔ ilɛktronik kɔmpɔnɛnt dɛn. Wan spɛshal ɛntena, fɛrayt, spɛshal ɔ ɔda ples kin nid fɔ put am.
Difayn if dɛn pul, mak ɔ kip di inlay dɛn we nɔ fayn ɛn spɛsifa di maksimal nɔmba fɔ di splays dɛn. Otomatik prodakshɔn ikwipmɛnt kin nid strikt kɔntinyuiti lɔ dɛn.
HF dray inlays kin lamin insay akses, mɛmbaship, kampus, ɔtel ɔ transpɔt kad we di ɛntena, chip ɛn kad strɔkchɔ mach di rida ɛn manufakchurin prɔses.
Yu kin put sikyɔriti NFC inlay dɛn insay pak, sɛtifiket, lɔjishɔn guds ɔ ilɛktroniks fɔ kɔnɛkt ɛni tin to wan kɔntrol dijital aydentiti ɛn ɔthɛntishɔn savis.
UHF inlays kin sɔpɔt aytem-lɛvɛl invɛntari, ɛksɛpshɔn alɛt ɛn ɛkzit monitarin we dɛn intagret wit RFID rida, stoa sistɛm ɛn difayn ɔpreshɔn prosidyuz.
Dray inlays kin lamin ɔ ɛnkapsul insay tikɛt, badge ɛn wristband fɔ aydentifikeshɔn, akses ɛn ɛnjɔymɛnt aplikeshɔn.
Kompatibl HF inlays kin sɔpɔt sirkuleshɔn, dɔkyumɛnt trakin ɛn arkiv manejmɛnt akɔdin to di rida protɔkɔl, data mɔdel ɛn plesmɛnt rikwaymɛnt.
Dray inlays kin intagret insay mold ɔ laminated prodak, bɔt harsh tɛmpracha, kemikal, vaybreshɔn, mɛtal ɛn mɛkanikal strɛs kin nid spɛshal ɛnkapsul tag.
UHF dray inlays kin chenj to katon, palet, ritɔnable-kɔntena ɔ aytem lɛbl afta dɛn dɔn pik di ɛntena fɔ di aktual pak matirial ɛn wetin de insay.
| Kɔmpiashɔn | RFID Dray Inlay afta Integreshɔn | Print Bakɔd |
|---|---|---|
| Di We Aw Yu De Rid | Redio kɔmyunikeshɔn; layn fɔ si kin nɔ nid fɔ de | Optik skan nɔmal wan nid fɔ gɛt kɔd we pɔsin kin si |
| Bɔku Ridin | I pɔsibul wit fayn UHF tag dɛn, rida dɛn ɛn aytem spɛshal | Nɔmal wan dɛn kin skan am wan wan pas dɛn yuz advans imej sistɛm |
| Data | Chip-spɛsifi k ID ɛn programmabl mɛmori kin de | Kɔd we dɛn print kin link to wan aydentifaya ɔ data rɛkɔd |
| Natin nɔ de fɔ fred | I de frɔm besik aydentifaya to kriptografik ɔthɛntishɔn, i dipen pan chip ɛn sistɛm | Yu kin yuz siriɔs, ɛnkript ɔ dijital sayn data, bɔt di simbul we yu kin si kin kɔpi |
| I kin te fɔ lɔng tɛm | Dipen pan di matirial we de kapsul di dray inlay | Dipen pan print kwaliti, fes matirial, kɔtin ɛn abrashɔn ɛksplɔshɔn |
| Kɔst ɛn Infrastrakchɔ | Ay tag ɛn rida-sistim kɔst, wit ɔtomɛshɔn ɛn nɔ-layn-ɔf-sayt bɛnifit dɛn | Lɔwa yunit kɔst ɛn optik skan dɛn we de ɔlsay |
| Di Bɛst Yuz | Ɔtomatik aydentifikeshɔn, ɛmbaded kredibiliti, invɛntari ɛn ɔtɛnɛtik dijital intarakshɔn | Lɔw-kɔst vijual aydentifikeshɔn, kɔshɔma skan ɛn brayt kɔmpatibiliti |
Bɔku tɛm, dɛn kin yuz RFID ɛn barɔd togɛda. Wan print QR kɔd kin gi yunivasal vijual akses, we di RFID kɔmpɔnɛnt we dɛn ɛmbas de sɔpɔt ɔtomatik ridin, kɔntrol kredibiliti ɔ chip-bɛs ɔthɛntishɔn.
Aplikeshɔn ɛn ɔthɛntishɔn, trakin ɔ akses fɛnshɔn we dɛn nid
HF/NFC, UHF ɔ ɔda frikshɔn we dɛn nid
Protokɔlɔ ɛn prɛferɛd chip mɔdel
Rida, smartfon, ɛnkɔda ɔ akses-sistim mɔdel
Sekyuriti fɛnshɔn dɛn, ki dɛn, bakɛnd ɛn tamper rikwaymɛnt dɛn
Target rid rɛnj ɛn ridin ɛnvayrɔmɛnt
Faynal prodakt matirial, mɛtal ɔ likwid proksimiti ɛn instɔleshɔn pozishɔn
Antena dimɛnshɔn, totɛl inlay dimɛnshɔn ɛn avaylabl intagreshɔn eria
Rol kor, pitch, winding dairekshɔn ɔ shit matris
Lamineshɔn tɛmpracha, prɛshɔn, kad tik ɔ haus prɔses
Enkodin, UID/TID/EPC maching ɛn print-data rikwaymɛnt
Kwantiti, sampul rikwaymɛnt, pak, ples fɔ go ɛn schedule
Send Yu Dray Inlay Spɛsifikeshɔn
Dray inlays fɔ tɛst fɔ chip rispɔns, ɛntena kɔnɛkshɔn, karia kɔndishɔn ɛn visible difrɛns akɔdin to di apruv inspekshɔn plan.
Test di inlay we dɛn dɔn pruv wit di rida we dɛn want, ɛntena, pawa, prodak matirial, ɔriɛnteshɔn ɛn fayn ɛmbaded pozishɔn. Fri-ɛya pefɔmɛns kin difrɛn bad bad wan frɔm di prɔdak we dɛn dɔn dɔn.
Rɔn di aktual ɔt, prɛshɔn, moldin, kɔring ɔ ɛnkapsuleshɔn saykl ɛn kɔnfɔm chip sɔvayv, ɛntena kɔntinyuiti, rɛjista ɛn fayn ridin pefɔmɛns.
Fɔ anti-kɔntɛfɛt aplikeshɔn, verify ki provayd, dinamik mɛsej, sava rispɔns, riplay handlin, mistek stet ɛn kɔshɔma ɔ inspɛkta wokflɔ.
Fɔ ɛkzit monitarin, tɛst rid zon, tag ɔriɛnteshɔn, shild, aytem dɛnsiti, lay lay alam, ivin lɔ ɛn intagreshɔn wit invɛntari ɔ stoa sistɛm.
Rid bak ɛnkɔd data ɛn kɔnfɔm se UID, TID, EPC, QR kɔd, siriɔs nɔmba ɛn prodak rɛkɔd dɛn stil de mach kɔrɛkt wan.
Verifay inlay kɔnt, pozishɔn, pitch, shit rɛjista, rol dairekshɔn, splays, dɛfɛkt-inlay mak ɛn protɛktiv pak.
Wallis kin rivyu HF/NFC, ISO/IEC 15693 ɛn UHF prɔjek dɛn akɔdin to di rida, rɛnj, mɛmori ɛn sikyɔriti lɛvɛl we dɛn nid.
Antena dimɛnshɔn, kyaria saiz, rol spɛsifikɛshɔn ɛn shit matris kin divɛlɔp rawnd kad, lɛbl ɔ prodak-intagreshɔn ikwipmɛnt.
Di wan dɛn we de bay kin tɔk bɔt sikyɔriti NFC chips, NDEF, EPC, paswɔd, UID/TID ridin, vɛriɔbul rɛkɔd ɛn bakɛnd-link ɔthɛntishɔn rikwaymɛnt dɛn.
Dɛn kin divɛlɔp dray inlays nia PVC, PET ɛn polycarbonate kad kɔnstrɔkshɔn dɛn, we dɛn kin du kɔmpatibiliti tɛst ɛn aprɔv prɔsesin kɔndishɔn dɛn.
Fizik sɛmpul dɛn de ɛp fɔ validet RF pefɔmɛns, sikyɔriti wokflɔ, shit rɛjista ɛn rɛsistɛns to di fayn lamineshɔn ɔ ɛmbadin prɔses.
Na RFID chip-ɛn-antena asɛmbli pan wan kyaria we nɔ gɛt di fayn prɛshɔn-sɛnsitiv adeziv, fes matirial we dɛn kin print ɔ protɛktiv haus.
Nɔ, dɛn kin yuz wet inlay ɔ RFID lɛbl we dɔn dɔn we dɛn nid fɔ yuz sɛlf-adhesive. Wan dray inlay na fɔ mek dɛn chenj am mɔ, lamin ɔ ɛmbas.
Nɔ. Besik chips dɛn kin men wan fɔ mek pɔsin no udat i bi. Strɔng ɔthɛntishɔn nid fɔ gɛt sikyɔriti chip, kɔntrol ki dɛn, protɛkt pɔsnalayzeshɔn ɛn wan bakɛnd verifyeshɔn we dɛn kin trɔst.
Nɔ, fɔ mek pɔsin nɔ tif, i nid fɔ gɛt rida, ɛntena, sɔftwɛl, alert lɔ ɛn aw fɔ yuz am. Di inlay na wan pat pan di kɔmplit sistɛm.
Sikyu NFC prodak dɛm lɛk NTAG424 DNA kin fayn fɔ kriptografik ɔthɛntishɔn. Di chus dipen pan fon kɔmpatibiliti, ki, bakɛnd dizayn, tamper rikwaymɛnt ɛn risk lɛvɛl.
Na we dɛn yuz kɔmpitabl tamper-ditekshɔn chip ɛn ɛntena lɔp ɔ wan fayn kɔnstrɔkshɔn we pɔsin kin pwɛl. Wan standad dray inlay nɔ de detekt opin.
Yes, we dɛn kɔnfyus ɛntena saiz, chip pozishɔn, kad tik, lamineshɔn tɛmpracha, prɛshɔn ɛn rida kɔmpatibiliti tru sampul tɛst.
Yɛs. Di target pej de list 13.56MHz ISO/IEC 14443, 13.56MHz ISO/IEC 15693 ɛn UHF frikshɔn opshɔn dɛn. Dɛn fɔ kɔnfɔm di rayt chips ɛn ɛntena dɛn.
Na wan spɛshal dual-frikyuɛnsi prodak nɔmɔ we dɛn mek kin sɔpɔt ɔl tu di intafɛs dɛn. Standard NFC ɛn UHF inlays na difrɛn prɔdak dɛn.
HF ɛn NFC nɔmal fɔ shɔt-rɛnj, we UHF kin rich sɔm mita dɛn insay fayn kɔndishɔn. Faynal rεnj dipכnt pan chip, antena, rida, mεtirial, כryenteshכn εn fayn intagreshɔn.
Bɔku tɛm, standad ɛntena dɛn kin detune nia mɛtal. Dɛn kin nid spɛshal ɛntena, fɛrayt, spɛshal ɔ ɔda ples fɔ put am ɛn dɛn fɔ tɛst am pan di prɔdak we dɔn dɔn.
Yɛs. Kastom dimɛnshɔn dɛn kin rivyu akɔdin to frikshɔn, chip impedans, ples we de, matirial, target rɛnj ɛn ɔda volyum.
Yu kin tɔk bɔt ɛnkɔdin akɔdin to di chip we yu dɔn pik. Gi di mɛmori map, fɔmat, sikyud, paswɔd ɔ ki rikwaymɛnt ɛn rid-bak verify lɔ dɛn.
Yɛs. Dɛn kin kɔstɔmayz di rol ɛn shit fɔmat dɛn akɔdin to di lɛbl kɔnvɔshɔn, kad lamineshɔn, panch ɔ prodak-asembli ikwipmɛnt.
Yɛs. Test RF pefomans, lamination, enkapsuleshɔn, sikyɔriti wokflɔ, rida kɔmpatibiliti, shit rɛjista ɛn fayn prodak durabiliti.
Send di aplikeshɔn, frikshɔn, protɔkɔl, chip, rida, sikyɔriti rikwaymɛnt, intagreshɔn matirial, ɛntena saiz, shit ɔ rol fɔmat, ɛnkɔdin, kwantiti, pak ɛn ples fɔ go.
