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Wholesale HF / NFC ɛn UHF RFID wet ɔ dray inlay wit kɔstɔm chips, ɛntena, rol ɔ shit fɔmat, ɛnkɔdin ɛn lɛbl kɔnvɔshɔn fɔ kad, rital, lɔjistik, pak ɛn ɛset trakin ɔlsay na di wɔl.
Inlay / prelam
Wallis we nem Wallis
| Frɛkuɛns we dɛn nid: | |
|---|---|
| Sayz: | |
| Kwantiti: | |
Wallis de saplae RFID wet inlay, dray inlay ɛn kɔnvɔyt lɛbl tag fɔ ay-volyum smat-kad, rital, lɔjistik, pak, laybri, ivin, ɛtɛt-trakin ɛn prodak-identifikeshɔn prɔjek dɛn. Di teknɔlɔji dɛn we de na 13.56MHz HF / NFC ɛn 860–960MHz UHF RAIN RFID .
Wet inlays inklud prɛshɔn-sɛnsitiv adeziv ɛn wan rilis layna fɔ lɛbul kɔnvɔyt ɔ kɔmpitabl dairekt aplikeshɔn. Dray inlays gɛt di chip-ɛn-antena asɛmbli pan wan kyaria we nɔ gɛt di fayn adhesive kɔnstrɔkshɔn ɛn dɛn mek am fɔ kɔnvɔyt mɔ, ɛmbas, lamineshɔn ɔ intagreshɔn insay ɔda prɔdak.
Di wan dɛn we de bay kin kɔstɔmayz di chip, protɔkɔl, ɛntena dimɛnshɔn, inlay dimɛnshɔn, adeziv, rol ɔ shit fɔmat, ɛnkɔdin, bad-tɛg mak, wayndin dairekshɔn ɛn pak. Faynal RF pefɔmɛns fɔ validet pan di aktual aplikeshɔn matirial ɛn rida sistɛm.
Rikwest wan Ɔlsay RFID Inlay Kɔt
| Spesifikasi | Wet Inlay | Dray Inlay |
|---|---|---|
| Bildin | RFID chip + etched antena + karia + prɛshɔn-sɛnsitiv adhesive + rilis layna | RFID chip + etched antenna pan PET ɔ ɔda aprɔv kyaria, we nɔ gɛt di fayn adeziv ɛn layna |
| Frikyuɛnsi Opshɔn dɛn | 13.56MHz HF / NFC ɔ 860–960MHz UHF | 13.56MHz HF / NFC ɔ 860–960MHz UHF |
| Protokɔlɔ Opshɔn dɛn | ISO /IEC 14443 Tayp A, ISO /IEC 15693, NFC Fɔm tayp ɔ E PC Klas 1 Jɛn 2 / ISO /IEC 18000-63 | Selekt akɔdin to di chip ɛn fayn ɛmbaded prodak |
| HF / NFC Chip Ɛgzampul dɛn | NTAG213/215/216, MIFARE Ultralight, MIFARE Klasik, DESFire, ICODE, F08 ɛn ɔda kɔmpatibl opshɔn dɛn | Di sem chip famili dɛn kin tɔk bɔt we dɛn fit fɔ di fayn intagreshɔn strɔkchɔ |
| UHF Chip Ɛgzampul dɛn | NXP UCODE, Impinj M730/M750 ɔ Monza famili dɛn, Alien Higgs ɛn ɔda prɔjek-spɛsifi k opshɔn dɛn | Selekt akɔdin to E PC /TID mɛmori, sɛnsitiviti, rida ɛnvayrɔmɛnt ɛn fayn ɛntena dizayn |
| Matirial fɔ Antena | Aluminium ɔ kɔpa we dɛn et | Aluminium ɔ kɔpa we dɛn et |
| Di pɔsin we de kɛr di tin dɛn | PET ɔ ɔda pɔsin we dɛn dɔn gri fɔ kɛr | PET ɔ ɔda kyaria we dɛn pik fɔ lamination ɔ embedding |
| Tipik Dilivri Fɔmat | Rol fɔmat fɔ lɛbul kɔnvɔyt ɛn ɔtomatik aplikeshɔn | Rol ɔ shit fɔmat akɔdin to di kad, tag ɔ prodak-ɛmbadin prɔses |
| Kastamayzeshɔn | Chip, antena, adeziv, day-kat saiz, rol spɛsifikɛshɔn, ɛnkɔdin ɛn lɛbl kɔnvɔshɔn | Chip, antena, kyaria, shit ɔ rol fɔmat, lamineshɔn pozishɔn ɛn intagreshɔn strɔkchɔ |
| Tipik Aplikeshɔn dɛn | RFID lɛbl, NFC stika, rital tag, katɔn, ɛset, tikɛt ɛn smat pak | PVC / PET / PC smat kad, wristband, tikɛt, mold prodak ɛn kɔstɔm ɛmbaded transpɔnda |
Di pej-lɛvɛl frikshɔn opshɔn dɛn inklud 869–915MHz UHF , 13.56MHz ISO /IEC 14443 ɛn 13.56MHz ISO /IEC 15693. Di ɛksaktɔ chip, rijinal UHF band, ɛntena ɛn dɔn kɔnstrɔkshɔn fɔ kɔnfɔm bifo kot.
| Kɔmpiashɔn | Wet Inlay | Dray Inlay | Kɔnvɔyt RFID Lɛbul |
|---|---|---|---|
| Adhesive we dɛn kin yuz fɔ adhesive | Insay de | Nɔ de insay di las aplikeshɔn strɔkchɔ | Aplikeshɔn-spɛsifi k adhesive we dɛn pik fɔ di say we dɛn rayt di lɛbl |
| Rilis Layna | Insay de | Nɔmal wan nɔ de saplae as di las sɛlf-adhesive kɔnstrɔkshɔn | Inklud akɔdin to di kɔnvɔyt ɛn dispɛns prɔses |
| Fes Stok we yu kin print | Nɔmal wan i nid fɔ chenj mɔ fɔ wan lɛbl we dɛn kin print we dɔn dɔn | Ad we dɛn de ɛmbas ɔ kɔnvɔyt if nid de | Pepa, PET , PP ɔ ɔda tin we dɛn dɔn gri fɔ print |
| Tipik Baya we pɔsin kin bay | Lebul kɔnvɔta, pak kɔmni ɔ RFID intagreta | Kad manifakta, prodak intagreta ɔ kɔstɔm tag prodyusɔ | Ritayla, brand, westɛm, lɔjistik ɔpreshɔn ɔ ɛnd-yuz program |
| Di Praymari Yuz | Fɔ kɔnvɔyt mɔ ɔ kɔmpitabl dairekt aplikeshɔn | Lamineshɔn, ɛnkapsuleshɔn ɔ prodak ɛmbadin | Print, ɛnkɔd ɛn fayn atakshɔn to wan tin |
| Envayrɔmɛnt Protɛkshɔn | Dipen pan di karia, adhesive ɛn fayn kɔnvɔyt kɔnstrɔkshɔn | Dipen pan di enkapsul ɔ laminɛt matirial | Difain bay di komplit fes stok, adhesive, kotin, lamination en edj dizain |
Wet inlays fayn we di pɔsin we de bay nid sɛlf-adhesive RFID kɔmpɔnɛnt fɔ kɔmbayn wit pepa ɔ sintetik fes stok, printin, day kɔt ɛn fayn rol kɔnvɔshɔn.
Dray inlay dεm fayn we di RFID kכmכpכnt go lamin insay kad, εmbas insay wan mכld aytem, kapsul insay wristband כ intagret insay כda kכnstrכkshכn we nכ gεt standad lεbul adeziv.
Dɛn kin lɛk fɔ yuz kɔnvɔyt lɛbl we di kɔstɔma nid fɔ gɛt prɔdak we rɛdi fɔ print ɔ we dɛn dɔn print bifo tɛm wit di fayn fayn fes matirial, adeziv, day kɔt, ɛnkɔdin ɛn rol spɛsifikɛshɔn we dɛn dɔn ɔlrɛdi dɔn.
| Kɔmpiashɔn | HF / NFC Inlay | UHF Inlay |
|---|---|---|
| Ɔmɔs tɛm | 13.56MHz we yu de yuz | 860–960MHz wit rijinol tuning kɔnsidareshɔn |
| Kɔmɔn Prɔtokɔlɔ dɛn | ISO /IEC 14443 Tayp A, ISO /IEC 15693 ɛn NFC Fɔm tayp dɛn | E PC Klas 1 Jɛn 2 / ISO /IEC 18000-63 |
| Tipik Ridin Biɛvhɔ | Short-rɛnj tap ɔ proksimiti ridin | Short rεnj to sɔm mita akɔdin to antena, rida, matirial ɛn envayrɔmɛnt |
| Yuz Smatfon | Posisibul wit fayn NFC chips ɛn sɔpɔt fon bihayvya | Nɔmal wan i nid fɔ gɛt wan dediket UHF rida |
| Tipik Aplikeshɔn dɛn | NFC intarakshɔn, laybri, ɔthɛntishɔn, tikɛt, kad ɛn shɔt-rɛnj aydentifikeshɔn | Aparɛl, invɛntari, lɔjistik, katon, ɛset ɛn bɔlk ridin |
| Tɛm dɛn fɔ Mɛmori | Chip UID, yuz mɛmori, pej, blɔk, paswɔd ɛn sikyɔriti ficha dɛn | E PC , TID, rizɔv mɛmori ɛn opshɔnal yuz mɛmori |
Inlay s we de wok na di sem frikshɔn kin yuz difrɛn protɔkɔl, chip kɔmand, mɛmori strɔkchɔ ɛn sikyɔriti fɛnshɔn. Saplae di rida, chip ɔ protɔkɔl we yu nid pas fɔ pik ɔl bay frikyuɛnsi.
HF inlays kin rid insay sɔm sɛntimita, we fayn UHF inlay kin rich sɔm mita. Faynal pefɔmɛns dipen pan di chip, ɛntena, rida pawa, rijinal band, tag matirial, ɔriɛnteshɔn ɛn intagreshɔn.
Di ɛntena fɔ pik fɔ di say we dɛn want fɔ go ɛn di say we di rida de. Wan prodak we dɛn ɔptimayz fɔ wan UHF rijyɔn nɔ kin gi di sem pefɔmɛns na ɔda wan.
Dɛn NFC Fɔm Tayp 2 chips ya na dɛn kin kɔmɔn fɔ pik fɔ URL, dijital profayl, prodak infɔmeshɔn ɛn kɔnsuma intarakshɔn. Dɛn de gi difrɛn yuz-mɛmori kapasiti, so di ɛnkɔd NDEF kɔntinyu fɔ kɔnfyus bifo chip sɛlɛkshɔn.
MIFARE Klasik, Ultralight ɔ DESFire prodak dɛn kin nid fɔ kɔmpitabl akses, mɛmbaship, transpɔt, ivin ɔ sikyuɔr smat-kad sistem. Di rida, aplikeshɔn, ki ɛn softwe fɔ mach di ɛksaktɔl chip famili.
ICODE inlays kin sɔpɔt kɔmpitabl laybri, ɛset ɛn vicinity-kad aplikeshɔn dɛn. Dɛn nɔ fɔ tek am se dɛn de wok wit ɛvri ISO /IEC 14443 rida.
UHF chip sɛlɛkshɔn fɔ tink bɔt E PC mɛmori, TID rikwaymɛnt, opshɔnal yuz mɛmori, sɛnsitiviti, akses ɔ kil paswɔd ɛn kɔmpitibliti wit di rida ɛn softwea pletfɔm.
HF / NFC prodakt kin ɛksplɔz wan chip UID, we UHF prodakt nɔmal fɔ gɛt faktri TID ɛn programmabl E PC mɛmori. Spɛsifik us aydentifaya fɔ rid, ɛnkɔd, print ɔ mach wit di kɔstɔma database.
Savis dɛn kin inklud NDEF URL raytin, E PC ɛnkɔdin, siriɔs data, paswɔd ɛn chip-spɛsifi k lɔk. Dɛn fɔ yuz pɔrmanent lɔk dɛn nɔmɔ afta dɛn dɔn chɛk di fayn fayn data bikɔs dɛn nɔ go ebul fɔ chenj dɛn.
Wet inlay dɛn gɛt adeziv ɛn rilis layna, we de mek dɛn fayn fɔ mek dɛn chenj di lɛbl mɔ. Di adeziv fɔ mach wit pepabɔd, glas, plastic, tɛkstayl, say dɛn we dɛn dɔn pent ɔ ɔda tin dɛn fɔ yuz.
Wan pepa, PET , PP ɔ ɔda fes matirial kin lamin ɔp di inlay fɔ mek wan printabl lɛbl fɔ fleksografik, dijital, tɛmal-transfa, dairekt-tɛmal ɔ UV printin.
Wet inlays dɛn kin kɔmɔn fɔ deliv pan rol fɔ kɔnvɔyt, ɛnkɔd, print ɔ ɔtomɛtik aplikeshɔn. Kor saiz, wɛb wit, pitch ɛn wayndin dairekshɔn fɔ mach di dawtstrim ikwipmɛnt.
Adhesive strength ɛn RF pefɔmɛns fɔ evaluate pan di aktual prodak. Mɛtal, likwid, plastic we ful-ɔp wit kabɔn, dense stak ɛn kɔba sɔfays kin chenj inlay pefɔmɛns.
Dray inlays kin intagret insay PVC , PET ɔ polycarbonate smart-kad strɔkchɔ dɛn we di antena dimɛnshɔn, chip pozishɔn, tɔtal tiknɛs ɛn lamineshɔn tɛmpracha kɔmpitabl wit di kad dizayn.
Dray inlays kin kapsul ɔ lamin insay wristband, ki fob, tikɛt, badge ɛn mold prodak yuz wan kɔnstrɔkshɔn we de protɛkt di chip ɛn mentɛn di antena tuning.
Kɔva layers, adeziv, plastic, printin ink, mɛtal kɔmpɔnɛnt ɛn prɔdak kɔntinyu kin detune di ɛntena. Test di prodak we dɔn kɔmplit pas fɔ abop pan di fri-ɛya inlay rizɔlt nɔmɔ.
Dɛn kin tɔk bɔt dray inlays insay rol ɔ shit fɔm akɔdin to di lamination, kɔt, panch ɔ prodak-assembly prɔses.
Antena dimɛnshɔn dɛn de ditɛm di RF kwaliti dɛn, we inlay ɔ day-kat dimɛnshɔn dɛn de ditɛm di kyaria eria we di kɔnvɔyt ɔ ɛmbadin prɔses nid. Dɛn ɔl tu fɔ de na di drɔ we dɛn dɔn gri fɔ.
Spɛsifik di kɔr insay dayamita, maksimal rol ɔta dayamita, wɛb wit ɛn nɔmba fɔ inlays pan wan rol so di matirial fit di kɔstɔma in mashin.
Pitch, wɛb dairekshɔn, chip ɔriɛnteshɔn, krɔs-wɛb pozishɔn ɛn insay- ɔ ausayd-waynd fɔ mach di kɔnvɔyt, ɛnkɔdin ɔ aplikeshɔn prɔses.
Dray inlay shit dɛn nid fɔ gɛt aprɔv matris we de sho di ɛntena pozishɔn, chip ɔriɛnteshɔn, shit dimɛnshɔn, rɛjista mak ɛn kɔmpitibliti wit di fayn kad panch layout.
Difayn if dɛn pul, mak ɔ kip di inlay dɛn we nɔ fayn ɛn establish di maksimal nɔmba fɔ di splays dɛn fɔ wan rol. Otomatik prodakshɔn layn dɛn kin nid strikt rol-kɔntinyuiti kɔntrol.
UHF wet inlay ɛn kɔnvɔyt lɛbl kin sɔpɔt aytem-lɛvɛl aydentifikeshɔn, stok kɔnt, risiv, riplenishmɛnt ɛn saplae-chen visibiliti we dɛn yuz am wit fayn rida ɛn softwe.
RFID lɛbl dɛn kin no katɔn, tot, pasɛl, kɔntena dɛn we dɛn kin yuz bak ɛn westɛm prɔpati dɛn. Di ɛntena ɛn ples fɔ kwalifay pan di rial paket ɛn wetin de insay.
NFC wet inlays kin chenj to stika we de kɔnɛkt kɔmpitabl smartfon to prodak infɔmeshɔn, warranty, instrɔkshɔn, prɔmoshɔn ɔ ɔthɛntishɔn savis.
HF dray inlays kin lamin insay akses, mɛmbaship, kampus, ɔtel ɔ transpɔt kad we di chip, ɛntena ɛn kad strɔkchɔ mach di rida sistɛm we dɛn want.
ISO /IEC 15693 HF lɛbl dɛn kin sɔpɔt kɔmpitabl laybri, dɔkyumɛnt ɛn arkiv wokflɔ akɔdin to di rida, data-fɔmat ɛn plesmɛnt rikwaymɛnt dɛn.
Inlay s kin intagret insay tikɛt, badge ɛn wristband fɔ aydentifikeshɔn, akses ɛn ɛnjɔymɛnt. Chip mɛmori, sikyɔriti ɛn rid saykl dɛn fɔ pik fɔ di ivent pletfɔm.
RFID kin sɔpɔt tul, ikwipmɛnt ɛn fiks ɛset, bɔt harsh ɛnvayrɔmɛnt, mɛtal sɔfays, kemikal ɛn ay tɛmpracha kin nid spɛshal finish tɛg pas standad inlay.
Wet inlay, dray inlay ɔ dɔn RFID lɛbl rikwaymɛnt
Aplikeshɔn ɛn di biznɛs we dɛn want fɔ du
HF / NFC 13.56MHz ɔ UHF 860–960MHz
Rikwayd protɔkɔl ɛn prɛferɛd chip
Rida, ɛnkɔda, smart fon ɔ kad-sistim mɔdel
Tagged matirial, prodakt kɔntinyu ɛn mawntin ɛnvayrɔmɛnt
Target rid rεnj, כryenteshכn εn rid-zon kכndishכn
Antena dimɛnshɔn, inlay dimɛnshɔn ɛn fayn lɛbl ɔ kad layout
Adhesive, fes matirial, layna ɛn envayrɔmɛnt rikwaymɛnt dɛn
Enkodin, paswɔd, UID/TID/E PC maching ɛn printin rikwaymɛnt dɛn
Rol kor, wɛb wit, pitch, wayndin dairekshɔn ɔ shit matris
Ɔda kwantiti, sampul, ples fɔ go ɛn di schedule we dɛn nid
Di sɔs pej se inlays dɛn kin du ful ilɛktrik ɛn vijual inspekshɔn. Di ɔda spɛsifikɛshɔn fɔ difayn di tɛst we, akseptans standad, difɛktiv-inlay hanlin ɛn inspekshɔn rɛkɔd dɛn we di bayer nid.
Test di inlay wit di rida we yu want, pawa, ɛntena, tin we dɛn tag, ɔriɛnteshɔn ɛn envayrɔmɛnt. Fri-ɛya rid distans nɔ de garanti di sem pefɔmɛns afta lɛbl kɔnvɔshɔn ɔ kad laminɛshɔn.
Wet inlay sɛmpul dɛn fɔ tɛst fɔ rilis, tak, pul, day kɔt, matris strip, rol fidin ɛn kɔmpitibiliti wit di fes matirial ɛn aplikeshɔn sɔfays.
Dray inlays fɔ tɛst tru di kɔmplit lamination ɔ molding prɔses fɔ chip sɔvayv, ɛntena kɔnɛkshɔn, rɛjista, flatnɛs ɛn post-prɔses ridin pefɔmɛns.
Encoded UID, TID, E PC , NDEF, paswɔd ɛn kɔstɔma data fɔ rid bak ɛn kɔmpia wit di apruv data fayl. Di vayriɔbul infɔmeshɔn we dɛn print fɔ kɔntinyu fɔ mach wit ilɛktronik rɛkɔd dɛn.
Verifay kɔnt, pitch, wɛb alaynɛshɔn, wayndin dairekshɔn, kɔr, splays, bad-tag mak, shit layout ɛn protɛktiv pak bifo yu ship.
Baya dɛn kin sɔs adeziv wet inlay, dray inlay fɔ ɛmbas ɛn kɔnvɔyt lɛbl fɔ fayn printin ɔ aplikeshɔn tru wan prɔjek wokflɔ.
Wallis kin tɔk bɔt ISO /IEC 14443, ISO /IEC 15693 ɛn E PC Gen2 prodak fɔ difrɛn rid rɛnj, rida, mɛmori ɛn aplikeshɔn rikwaymɛnt.
Antena dimɛnshɔn, inlay saiz, rol spɛsifikɛshɔn, shit matris, adeziv ɛn fayn intagreshɔn strɔkchɔ kin rivyu akɔdin to di kɔstɔma in ikwipmɛnt.
NDEF, E PC , siriɔs data, paswɔd, UID/TID ridin, QR kɔd, barɔd ɛn rɛkɔd maching kin tɔk bɔt akɔdin to di chip we yu dɔn pik.
Sampul tɛst de ridyus di risk fɔ rida inkɔmpatibiliti, wik adhesive, nɔ fayn rol layout, ɛntena detuning ɔ fayl we kad lamination.
Wan wet inlay inklud prɛshɔn-sɛnsitiv adeziv ɛn wan rilis layna. Wan dray inlay de saplae witout di fainal self-adhesive label konstrakshon en i intend fo embedding, lamination or further conversion.
Nɔto fɔ se na so i bi. Wan lɛbl we dɔn dɔn nɔmal fɔ ad wan fes matirial we dɛn kin print, aplikeshɔn-spɛsifi k adeziv, fayn day kɔt, printin ɛn rol spɛsifikɛshɔn ɔp di RFID inlay.
Yes, we dɛn mek di ɛntena, kyaria, chip pozishɔn, lamineshɔn tɛmpracha, tɔtal tiknɛs ɛn kad layout fɔ di inlay we yu dɔn pik. I rεkomεnd fכ wan sεmpl laminεshכn tεst.
Yɛs. Di pej-lɛvɛl opshɔn dɛn we de inklud 13.56MHz ISO /IEC 14443, 13.56MHz ISO /IEC 15693 ɛn UHF prodak. Di rayt chip ɛn di ɛntena fɔ kɔnfɔm.
HF inlay dεm nכmal fכ rid na sכt rεnj, we UHF inlay dεm kin rid frכm sכt rεnj to sεvεra mita. Di fainal risal dipen pan di chip, antena, rida, rijyɔn, matirial, ɔryenteshɔn ɛn intagreshɔn.
Na wan spɛshal dual-frikyuɛnsi prodak nɔmɔ we dɛn mek fɔ sɔpɔt ɔl tu di intafɛs dɛn. Wan standad NFC inlay ɛn wan standad UHF inlay na difrɛn prɔdak dɛn.
Dɛn kin chenj dɛn wit fayn pepa ɔ sintetik fes matirial fɔ print. Spɛsifik di printa teknɔlɔji, ink ɔ ribin, lɛbl sɔfa ɛn di durabiliti rikwaymɛnt.
Kastom antena ɛn inlay dimɛnshɔn dɛn kin rivyu akɔdin to chip impedans, rikwayd rid pefɔmɛns, eria we de, tag matirial ɛn ɔda volyum.
Opshɔn dɛn kin inklud NTAG, MIFARE, DESFire, ICODE, F08, NXP UCODE, Impinj ɔ Alien famili dɛn. Dɛn fɔ kɔnfyus if i de ɛn if i fit fɔ di patikyula prɔjek.
Yu kin tɔk bɔt ɛnkɔdin ɛn data-raytin savis dɛn akɔdin to di chip. UID kin bi faktri-set, we E PC , NDEF, paswɔd ɛn yuz data kin program dipen pan di prɔdak.
Yɛs. Dɛn kin gi wet inlay insay rol, we dɛn kin gi dray inlay insay rol ɔ shit akɔdin to di kɔnvɔyt ɔ kad-laminɛshɔn prɔses.
Di sɔs pej se di sampul dɛn de ɛn na di kɔstɔma de pe fɔ di shiping. Konfam di chip, antena ɛn sampul tɛm wit Wallis bifo dɛn sɛn am.
Di sɔs pej de list lɛk 3–7 dez fɔ sampul ɛn 10–20 dez fɔ mas prodakshɔn, dipen pan kɔstɔmayshɔn. Kɔnfɛm di schedule we yu de du naw we yu de aks fɔ kot.
Di sɔs pej se dɛn kin du ilɛktrik tɛst ɛn vijual inspekshɔn. Di wan dɛn we de bay fɔ difayn ɛni ɔda RF, ɛnkɔdin, rol, lamineshɔn ɔ traysabiliti rikwaymɛnt dɛn na di bay spɛsifikɛshɔn.
Send di inlay tayp, frikshɔn, protɔkɔl, chip, rida, aplikeshɔn matirial, target rɛnj, ɛntena ɛn inlay saiz, rol ɔ shit fɔmat, ɛnkɔdin, kwantiti, pak ɛn ples fɔ go.
