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I-Wallis - Ishidi le-PLA
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WALLIS Okubalulekile kweshidi lekhadi le-PLA ngokwezifiso kuklanyelwe abakhiqizi bamakhadi, amaphrinta, RFID iziguquli ze-inlay, abahlinzeki bekhadi lesipho nezinhlelo zamakhadi ezigxile ekuzinzeni ezifuna enye indlela esekelwe ku-bio kunezinye izingxenye ezivamile ze PVC . Izinketho ezitholakalayo zihlanganisa amashidi amhlophe, abonisa ngale, amnyama kanye nombala wangokwezifiso kumageji amaningi amakhora aphrintiwe, Ifilimu ye-overlay s, amakhadi okuphromotha, amakhadi obulungu, amakhadi okhiye behhotela kanye nezakhiwo ezikhethiwe ze RFID .
Ukukhiqizwa kwekhadi le-PLA kusebenzisa iwindi lenqubo elihlukile ukusuka kokuthi PVC , PETG kanye ne-polycarbonate. Uyinki wokuphrinta, ukwelapha okungaphezulu, ukuma kweshidi, izinga lokushisa le-lamination, ingcindezi, ukupholisa, ukukhetha okunamathelayo, ukusika ukufa kanye nokuhlolwa kwekhadi eliphelile kufanele kuqinisekiswe njengohlelo olulodwa. Ukuhlolwa kwesampula kuyanconywa ngaphambi kokukhiqizwa kwenqwaba, ikakhulukazi kumaphrojekthi we-multilayer, RFID , umugqa kazibuthe kanye namaphrojekthi wamakhadi wempilo ende.
'I-bio-based,' 'biodegradable,' 'compostable industry' kanye 'recyclable' ichaza izici ezehlukene zemvelo. Noma isiphi isimangalo kufanele sifane nebanga eliqondile le-PLA kanye nokwakhiwa kwekhadi eliqediwe eliphelele. Amashiphu, izinti, oyinki, Ifilimu ye-overlay s, okunamathelayo, imigqa kazibuthe nama-coatings kungashintsha umzila wokuphela kwempilo futhi kungase kuvimbele ikhadi eliqediwe ukuthi lifanelekele isimangalo sokuvunda.
| Uhlobo Lomkhiqizo | Ishidi eliwumgogodla wekhadi le-PLA, ishidi eliphrintekayo kanye nezinto eziqondene nephrojekthi ethile Ifilimu ye-overlay |
| Ukuqina Okujwayelekile | 0.08mm, 0.15mm, 0.17mm, 0.20mm kanye 0.35mm; amanye amageji angaphansi kokubuyekezwa kokukhiqiza |
| Usayizi Weshidi Elijwayelekile | 300 × 480mm noma usayizi owenziwe ngokwezifiso ngokuya ngezidingo zokuphrinta nesakhiwo sekhadi |
| Izinketho Zombala | Umbala omhlophe, ocacile, oguquguqukayo, omnyama noma owenziwe ngezifiso ungaphansi kwe-MOQ nokwakheka |
| Izicelo Zekhadi | Isipho, ubulungu, ukwethembeka, umcimbi, ukhiye wehhotela, ibhizinisi, amakhadi RFID okukhangisa nakhethiwe |
| Izinsizakalo ze-B2B | Amashidi amasampula, amageji ngokwezifiso, izivivinyo zokuphrinta, ukuhlolwa kwe-lamination, ukubuyekezwa kwesakhiwo samakhadi, imininingwane ye-QC kanye nokunikezwa kokuthekelisa |
Cela amasampula eshidi lekhadi le-PLA kanye ne-Quote
I-Polylactic acid, evame ukubizwa ngokuthi i-PLA, iyi-polyester ye-thermoplastic engakhiqizwa kusuka ku-feedstocks etholakala esitshalweni evuselelekayo. Ekwenziweni kwamakhadi, i-PLA iguqulwa ibe amashidi ayisicaba angasebenza njengesendlalelo esiyinhloko esiphrintiwe, isendlalelo sokuhlobisa, isendlalelo esisobala noma isendlalelo esisekelayo esakhiweni sekhadi elaminethiwe.
Umsuka ovuselelekayo we-PLA awuqinisekisi ngokuzenzakalelayo ukuqina kwekhadi, ukunamathela kokuphrinta noma ukuvunda. Ibanga le-resin, crystallinity, additives, pigment, sheet orientation kanye nokwakhiwa kwekhadi kunquma izakhiwo zokugcina zomshini, ezishisayo nezemvelo.
Imikhiqizo eminingi ye-PLA yakhelwe ukufakwa komquba wezimboni olawulwayo ngokushisa okulawulwayo, umswakama kanye nokungenisa umoya. Ishidi le-PLA akufanele lichazwe njengelinyamalala ngokushesha endaweni yokulahla imfucumfucu, enhlabathini evamile, emifuleni noma olwandle. Ikhadi eliqediwe kufanele lihlolwe njengento ephelele ngaphambi kokuthi kusetshenziswe uphawu lokuhlanganisa noma isimangalo.
Ishidi le-PLA elivamile le-thermoforming lingase lingahlinzeki ngokugqama, ukuhwaqeka kwendawo, ukuphrinta noma ukuziphatha okucwebezelayo okudingekayo ekukhiqizweni kwekhadi. Abathengi kufanele bacele ukucaciswa kwebanga lekhadi futhi bahlole ishidi elinembile ngokucindezela kwabo, oyinki, Ifilimu ye-overlay s nama-laminator.
Ishidi le-PLA Yokukhiqiza Amakhadi Okuqhubekayo
| Nepharamitha Yezinketho Ngokwezifiso | Ukucaciswa Okujwayelekile / Isidingo Sephrojekthi |
|---|---|
| Okubalulekile | I-PLA noma ukwakhiwa kwekhadi le-PLA elilungisiwe; I-resin eqondile kanye nephakheji yokwengeza kufanele ikhiywe ngekhodi yomkhiqizo |
| Ubukhulu | 0.08, 0.15, 0.17, 0.20 kanye 0.35mm noma ngokwezifiso; ukubekezelelana kufanele kuvunyelwane ngegeji ngayinye |
| Usayizi Weshidi | 300 × 480mm noma ifomethi eyenziwe ngezifiso ngokusekelwe ekubekweni, umbhede wokucindezela kanye nepuleti le-lamination |
| Amandla Okuqina | Isiqondiso somshini ≥25MPa (inani eliyinkomba); qinisekisa indlela yokuhlola okuvunyelenwe ngayo, isimo kanye nemfuneko ye-transverse-direction ye-oda ngalinye |
| Ukuqina Kobuso | 0.8–3.0μm ububanzi bereferensi; khetha ngokuya ngokuphrinta, i-inki holdout kanye nezidingo ze-lamination |
| I-Surface Qeda | I-matte, i-semi-matte, ecwebezelayo, efakwe nge-corona noma ephrintiwe enamathiselwe ngaphansi kokucubungula izivivinyo |
| Umbala | Okumhlophe, okusobala, okumnyama, i-Pantone yangokwezifiso noma ibanga elilawulwa ngokungabonakali kuncike ekwakhiweni kanye ne-MOQ |
| Ukupakisha | Amashidi ayisicaba anefilimu evikelayo noma ahlanganayo, ukupakisha okuvimba umswakama, ukuvikela amakhathoni kanye nephalethi |
Ikhadi lokuhlonza eliqediwe livamise ukwakhiwa ngezingqimba eziningi kuneshidi elilodwa eliwugqinsi. ISO /IEC 7810 ikhomba ifomethi yekhadi le-ID-1 elivamile cishe ku-85.60 × 53.98mm enogqinsi lwegama elingu-0.76mm. Inhlanganisela eqondile yesendlalelo se-PLA kufanele ibhekele ukuphrinta, ukunamathela, Ifilimu ye-overlay , ukujiya kwe-chip noma kwezinti kanye nokuncipha kwangemuva kokulanyiswa.
| Isendlalelo | Esijwayelekile Somsebenzi | Wokucatshangelwa Kwephrojekthi ye-PLA |
|---|---|---|
| Ngaphambili Ifilimu ye-overlay | Ivikela ukuphrinta futhi inikeze ukuphela kwendawo | Qinisekisa ukubopha, ukucaca, ukumelana nokuklwebheka kanye nokuhambisana nezimangalo zemvelo |
| Kuphrintiwe Ishidi eliwumgogodla | Iphethe imidwebo, umbhalo, idizayini yokuvikeleka nombala wangemuva | Ukwelashwa kwendawo kanye nesistimu kayinki kufanele iqhubeke i-lamination ngaphandle kokushintsha umbala noma i-delamination |
| I-Center Core | Yakha ukujiya, ukungafihli kanye nokuqina kokugoba | Sebenzisa ukuma okulinganiselayo kanye nokwakha okulinganayo ukuze unciphise ama-curl |
| RFID Inlay Isendlalelo | Iqukethe i-chip kanye ne-antenna yokusebenza kokungathintwa | I-akhawunti yokuqina kwe-inlay, ukunamathela kwe-antenna, umgodi we-chip kanye nokucindezela kwe-lamination |
| Ishidi Eliphrintiwe Emuva / Ifilimu ye-overlay | Inikeza ihluzo ezihlehlayo nokuvikelwa kwendawo | Linganisa izendlalelo zangaphambili nangemuva ukuze ulawule ukushintsha kobukhulu |
Izendlalelo zangaphambili nangemuva ezingalingani zingakha ama-curl ngemva kokushisisa nokupholisa. Lapho kungenzeka khona, sebenzisa ama-gauge afanayo, ukumbozwa kokuphrinta okufanayo kanye nokulinganisa okungu Ifilimu ye-overlay kuzo zombili izinhlangothi. Amakhadi aqediwe kufanele ahlolwe ngemuva kokulungiswa, hhayi nje ngokushesha ngemva kokuqothula.
Uyinki, i-adhesive, RFID inlay, umugqa kazibuthe kanye nokunamathela okuvikelayo konke kunomthelela ekujimeni kokugcina. Isitaki seshidi esihlanganisa isamba esingu-0.76mm ngaphambi kokucwenga singase singakhiqizi ikhadi eliqediwe elithobelayo ngemva kokuminyanisa nokuncipha.
| Indlela Yokuphrinta | Okungase Kusetshenziswe Ukusetshenziswa | Okudingekayo Ukuqinisekisa |
|---|---|---|
| Ukuphrinta kwe-Offset | Amashidi anevolumu ephezulu anombala wenqubo, iPantone nesizinda sokuphepha | Ukunamathela kukayinki, ukomisa, ukuvinjwa, ukuminyana kombala kanye nokumelana ne-lamination |
| UV I-Inkjet | Ukugijima okufushane, ukwenza kube ngokwakho, ihluzo ze-serial kanye ne-prototyping | Amandla angaphezulu, ileveli yokwelapha, ukuguquguquka, iphunga kanye Ifilimu ye-overlay nokubopha |
| Ukuphrinta Isikrini | I-Opaque emhlophe, i-metallic, umbala wamabala nezingqimba ezisebenzayo | Ukujiya kwe-inki, ukuhambisana kwe-solvent, ukuphulukisa kanye nebhondi ye-lamination |
| Ukuphrinta kwe-Indigo / Digital | Idatha eguquguqukayo, ukugijima okufushane kanye nezinhlelo zamakhadi eziqondene nawe | Ukuhambisana kwe-Primer, izinga lokushisa lengubo, ukunamathela kwe-toner kanye ne-lamination engezansi |
| Ukwenza Okushisayo / Ukudlulisa Kabusha | Izinombolo zamakhadi aqediwe, izithombe, amabhakhodi kanye nemininingwane | Ukuchayeka kokushisa, ukudluliswa kweribhoni, ukucaba kanye nokuhlolwa kwezokuthutha kwephrinta |
Ukwelashwa kweCorona kungabola ngesikhathi sokugcinwa. Abathengi abasebenzisa UV inkjet, ukuphrinta kwesikrini noma ama-coatings akhethekile kufanele bavumelane ngeleveli ye-dyne eqondiwe, indlela yokuhlola kanye nesikhathi esiphezulu sokulondoloza ngaphambi kokuphrinta.
Ukunamathela okuhle kokuphrinta kokuqala akuqinisekisi ukumelana nokushisa, ingcindezi kanye nokuxhumana okunamathelayo. Amashidi aphrintiwe kufanele enziwe i-laminated, apholiswe futhi ahlolwe ngaphambi kokuba umsebenzi wobuciko kanye nezinhlelo zikayinki zigunyazwe.
Ishidi Lekhadi Le-PLA Eliphrintekayo
Lamination and Converting Trials
I-PLA ivamise ukuthamba ezingeni lokushisa eliphansi kune PVC , PETG noma izinto zekhadi le-polycarbonate. Iresiphi evamile PVC yokugcoba ingabangela ukuncipha okukhulu, ukumakwa kwendawo, ukuhlanekezela, ukuvinjwa noma ukulimala kwe-chip. Umjikelezo olungile kufanele uthuthukiswe ngesitaki sesendlalelo sangempela kanye nemishini.
Beka amashidi: Gcina futhi ulinganise amashidi e-PLA, izendlalelo eziphrintiwe kanye nezifakwa ngaphansi kwezinga lokushisa elilawulwayo kanye nomswakama.
Qinisekisa ukuma: Gcina umshini nezikhombisi-ndlela eziphambanayo zihambisana ngaphakathi kwesitaki ukuze ulawule ukushwabana.
Qala ngomjikelezo wokushisa olondolozayo: Sebenzisa isilingo sezinga lokushisa eliphansi kunomjikelezo ovamile we PVC futhi ukhuphuke kuphela ngemva kokubuyekeza amandla ebhondi nobukhulu.
Linganisa izinga lokushisa, ingcindezi nokuhlala: Ukucindezela okwedlulele kungamaka indawo engaphezulu noma umonakalo RFID izingxenye; amandla anganele angabangela i-delamination.
Ukupholisa ngaphansi kwengcindezi elawulwayo: Ukupholisa kuthinta ukucaba, ukushwabana nokuvinjwa.
Isimo ngaphambi kokulinganisa: Hlola ubukhulu, ukugoqa, ukunamathela nokuqina kwekhadi ngemva kwesikhathi okuvunyelwene ngaso sokululama.
Khiya iresiphi egunyaziwe: Qopha uhlobo lwepuleti, ukuma kwesitaki, iphrofayili yezinga lokushisa, ingcindezi, isikhathi nezimo zokupholisa.
Ezinye izingqimba ze-PLA ezihambisanayo zingase zibophe ngokushisa, kuyilapho ezinye izakhiwo zidinga ungqimba olunamathelayo noma lokubopha. Isistimu yokubopha ekhethiwe kufanele ihlolwe amandla e-peel, ukuguga, ukuhambisana nokuphrinta kanye nomthelela wako kusimangalo semvelo.
Amapuleti acwebezelayo, ama-matte kanye nama-textured akhiqiza ukubukeka okuhlukile kwendawo nokuziphatha okukhululayo. Amafilimu okukhishwa kokuhlola kanye nokuqedwa kwepuleti lokunamathela, inkungu, ukuhluka kwegloss nokudlulisa ukuthungwa okungafunwa.
| Converting Step | Key Control |
|---|---|
| Ishidi Guillotine Cutting | I-blade ebukhali, isitaki esisekelwe, ukwakheka kokushisa okuphansi nokunemba kobukhulu |
| Ikhadi Punching | Ukususwa kwethuluzi, izinga lokushisa, ukuma kwekhadi kanye nokungabikho kokuqhekeka ekhoneni |
| Slot kanye Hole Punching | Ukwenziwa mhlophe komphetho, ukuzwela kwenotshi, ukuma kwembobo nokumelana nomthwalo olengayo |
| I-Chip Cavity Milling | Ijubane lokusika, ukushisa, ukususwa kothuli, ukujula komgodi nokubopha okunamathelayo |
| Ukuhlolwa komphetho | Burrs, delamination, cracks, whitening, sharpness and layer registration |
Ishidi lekhadi le-PLA lingahlolwa ukuze kutholwe amakhadi angathintwa, kodwa ishidi liyingxenye eyodwa kuphela yesistimu. I-antenna, i-chip, i-inlay substrate, umjikelezo wokunamathisela kanye nowokucwenga kufanele uhlale uzinzile ngogesi nangokomshini kukho konke ukukhiqizwa kwamakhadi kanye nesevisi.
| Ikhadi elihlakaniphile Into | Yokuqinisekisa Imfuneko |
|---|---|
| RFID Imvamisa ne-Chip | Qinisekisa isistimu yokufunda, umndeni we-chip, inkumbulo, iphrothokholi kanye nezimfuneko zombhalo wekhodi ngaphambi kokwakha amasampula |
| Ijometri ye-Antenna | Qinisekisa ukuthi unqenqema lwekhadi, indawo ye-chip kanye nesakhiwo sokusika akulimazi uthi |
| Inlay Ukuhlanganisa | Hlola ukuhambisana kwe-adhesive, ukumelana nokushisa, i-voids kanye ne-delamination yesikhathi eside |
| Funda Ukusebenza | Hlola ibanga lokufunda, umumo, ukuphazamiseka kwesitaki sekhadi nokuhambisana nokukhiya/kokufunda |
| Isimangalo sezemvelo | Ungachazi ikhadi le-elekthronikhi njengecompostable ngokugcwele ngaphandle uma into ephelele isiqinisekisiwe |
| Komkhiqizo | Wokugxila | Zokuhlolwa Okubalulekile Kwamashidi Ekhadi Le-PLA |
|---|---|---|
| Amakhadi Esipho Nobuqotho | Ukuphrinta kwekhwalithi ephezulu, ibhakhodi, umugqa kazibuthe noma izinketho ze RFID | Ukuhambisana kwephrinta, ukusetshenziswa kwesikhwama semali, ukugoba nempilo yohlelo elindelekile |
| Amakhadi Abalulekile Ehhotela | Amakhadi e- RFID asebenzisa isikhathi esifushane anezithombe ezinophawu nokuhambisana kwesistimu yokukhiya | Ukufanisa i-chip, ukubhala ngekhodi, ukusebenza komfundi, umswakama nokuphatha okuphindaphindiwe |
| Amakhadi Omcimbi kanye Nezivakashi | Ukufinyelela kwesikhashana, ukufaka uphawu, ukushaywa kwe-slot kanye nedatha eguquguqukayo | Ukulayisha kwe-Lanyard, ukuqina kokuphrinta kanye nomzila wokulahla umcimbi |
| Amakhadi Obulungu | Amakhadi aphrintiwe naqondene nawe amakilabhu, izindawo zokuzivocavoca nezinhlelo zokudayisa | Ukulindela impilo yesevisi, ukuhuzuka, ukugoba kanye nezokuthutha zamaphrinta wekhadi |
| Amakhadi Ebhizinisi Namaphromoshini | Ukuphela kokubonwayo kwe-Premium, obala, umbala okhethekile kanye nokwenza kube ngokwakho isikhathi esifushane | Ukunamathela kokuphrinta, ukumelana nokuklwebheka, ikhwalithi yonqenqema nokuqina kwesitoreji |
| RFID Amakhadi Okufinyelela | Ukwakhiwa kwekhadi ngaphandle kokuthinta eline-inlay efanisiwe kanye ne-lamination yezinga lokushisa eliphansi | Ukusebenza kukagesi, ukuguquguquka, i-delamination kanye nokuhambisana komfundi |
Amakhadi Esipho, Ubulungu Namaphromoshini
Iqedile Izinhlelo Zekhadi Le-PLA
| Wezinto | Amandla | Imikhawulo Ebalulekile |
|---|---|---|
| I-PLA | Amandla asekelwe ku-bio, indaba yokusimama ehlukile kanye namandla okuvundisa kwezimboni ezinhlakeni eziqinisekisiwe | Ukumelana nokushisa okuphansi, ukuzwela kwenqubo, ubungozi bokonakala kanye nengqalasizinda yokuqoqwa okulinganiselwe |
| PVC | Kusungulwe inqubo yamakhadi ashibhile, ukuphrinta okubanzi nolwazi lokufakwa kwe-lamination | I-fossil-based, equkethe i-chlorine kanye nokugaywa kabusha okulinganiselwe ezinhlelweni eziningi zamakhadi |
| PETG | I-lamination enhle, ukuqina, obala kanye nokujwayela kokukhiqiza amakhadi | Akuvundisi futhi ukulahlwa kuncike kumasistimu okugaya kabusha endawo |
| I-Polycarbonate | Ukuqina okuphezulu, ukumelana nokushisa nokufaneleka kokuqoshwa kwe-laser | Izindleko eziphakeme kanye nokusimama okuhlukile/iphrofayili yokuphela kwempilo |
| Kugaywe kabusha PVC / RPET G | Yehlisa ukufunwa kwepulasitiki emsulwa ngenkathi igcina ukucubungula amakhadi ajwayelekile | Okuqukethwe okugaywe kabusha, umbala, ukuvumelana kanye nokusetshenziswa kabusha kudinga ubufakazi |
I-PLA akuyona ngokuzenzakalela into ehamba phambili yazo zonke izifakazelo. Ihhotela lempilo emfishane, isivakashi, umcimbi, izipho namakhadi okukhangisa angase abe amakhandidethi aqinile. Omazisi kahulumeni bempilo ende, amakhadi okukhokha, izifakazelo zezinga eliphezulu lokushisa namakhadi adinga umbhalo we-laser angase adinge PETG , i-polycarbonate noma okunye ukwakhiwa okuqinisekisiwe.
| Incazelo | Elungile ye-B2B |
|---|---|
| Isekelwe ku-Bio | Isho okuqukethwe kwekhabhoni evuselelekayo futhi kufanele kusekelwe imibhalo ebalulekile noma ukuhlolwa |
| I-Industrial Compostable | Idinga isitifiketi sezimo ezilawulwayo zikamasipala noma zezimboni ze-aerobic composting |
| Ikhaya Compostable | Idinga isitifiketi esihlukile somquba wasekhaya; izitifiketi zezimboni azanele |
| I-Biodegradable | Akuphelele ngaphandle kwendawo yokuhlola, indlela nesikhathi |
| Iyasebenziseka kabusha | Ngobuchwepheshe kungenzeka ekusakazeni okuzinikele kwe-PLA, kodwa amakhadi awamukelwa kabanzi ku PET evamile noma ekusetshenzisweni kabusha kwepulasitiki okuxubile. |
| Gcwalisa Isimangalo Sekhadi | I-chip, i-antenna, uyinki, i-coating, i-adhesive kanye nomugqa kazibuthe kufanele kufakwe ekuhlolweni. |
Isitifiketi seshidi le-PLA asikwazi ukusekela ngokuzenzakalelayo isimangalo sekhadi le RFID , ikhadi elinomugqa kazibuthe noma ikhadi eliphrintiwe. Izingxenye zikagesi nezensimbi zingadinga ukususwa, ukugaywa kabusha okukhethekile noma umzila wokulahlwa ohlukile.
Izikhungo eziningi zokwenza umquba wezimboni aziwamukeli amakhadi e-bioplastic aqinile. Amagama alahlwayo kufanele abonise uhlelo lwangempela lokuqoqwa emakethe eqondiwe esikhundleni sempahla yezinto ezibonakalayo.
| Indawo Yokuhlola | Ukuhlola |
|---|---|
| Ubukhulu nobukhulu | Ubude, ububanzi, irediyasi yekhona, ukujiya kanye nokubekezelelana ngemva kokumiswa kwesimo |
| I-Warpage kanye ne-Flatness | I-curl esheshayo nekhulile kumazinga okushisa alawulwayo kanye nomswakama |
| Ukunamathela Kwesendlalelo | Ikhasi, unqenqema delamination, ukushisa ukuguga, umswakama ukuguga nokuguquguquka |
| Ukugoba kanye ne-Torsion | Ukuguquguquka okuphindaphindiwe, ukukhwehlela, ukwakheka kokuqhekeka kanye nokuguqulwa okuhlala njalo |
| Ukushisa Nokuzinza Kwe-Dimensional | Isitoreji ezindaweni ezifudumele, ukuchayeka kokushisa kwephrinta kanye nokuncipha kwe-post-lamination |
| Phrinta Ukuqina | Hlikihla, ukuklwebha, ukuthinta amakhemikhali, UV ukuchayeka kanye Ifilimu ye-overlay nokunamathela |
| Ukwenza kube ngokwakho Ikhadi | Okuqondile ekhadini, ukudluliswa kabusha, ukudluliswa okushisayo, ukugqamisa kanye nesivivinyo sombhalo wekhodi njengoba kusebenza |
| RFID / Umsebenzi Wezibuthe | Funda/ubhale, ukuhambisana kokukhiya, ubuqotho be-antenna kanye nombhalo wekhodi womugqa ngemva kokukhiqiza |
| Yento Yokuhlola Ama -oda | Ukulawulwa Kwekhwalithi |
|---|---|
| Iphrofayili yokuqina | I-gauge emaphakathi, ukuhluka kokukhomba-kuya-iphuzu kanye nokubekezelela okuningi |
| Ubukhulu beshidi | Ubude, ububanzi, isikwele, ikhwalithi yomphetho kanye nokubekezelelana kokusika |
| Isicaba kanye Curl | Umnsalo weshidi, ukuphakama komphetho kanye nesiqondiso se-curl ngemva kokumiswa |
| Umbala kanye ne-Opacity | L*, a*, b*, ubumhlophe, ukungafihli, ukucwebezela kanye nezinga elibonakalayo eligunyaziwe |
| Ikhwalithi Yobuso | Ukuqina, izinga lokwelapha, imihuzuko, amabala amnyama, amajeli, ukungcola kanye nekhwalithi yefilimu evikelayo |
| Izakhiwo Zemishini | Ukuqina, ubude, ukuqina, umthelela kanye nokuqina ngokwezindlela okuvunyelwene ngazo |
| Isilingo se-Lamination | Ukubopha, ukushwabana, inkungu, ukuvimba, ukuzinza kokuphrinta nokukhishwa kwamapuleti |
| Ukulandeleka | Ibanga, iqoqo, idethi yokukhishwa, umumo, usuku lokwelashwa, umbiko wokuhlolwa kanye nereferensi yesitifiketi |
Ishidi le-PLA lingazwela ukushisa, umswakama kanye nesitoreji eside. Isitoreji esingesihle singashintsha ukucaba, ukuphathwa kwendawo, ukuphrinta nokuziphatha kokucwebezela. Izidingo zesitoreji kufanele kuvunyelwane ngazo ngebanga eliqondile kanye nendlela yokupakisha.
Gcina amashidi avaliwe endaweni yokugcina impahla epholile, eyomile futhi ehlanzekile kude nelanga eliqondile nezifudumezi.
Gcina amashidi flat kuma-pallet asekelwe futhi ugweme ukucindezela kwezitaki ngokweqile.
Vikela indawo othulini, uwoyela, izigxivizo zeminwe, imihuzuko kanye nomswakama.
Impahla yesimo endaweni yokuphrinta noma ye-lamination ngaphambi kokucubungula.
Sebenzisa ukugoqa okuvimba umswakama, ukuvikela amakhona kanye namabhokisi okuthekelisa aqinisiwe.
Faka i-inventory yokuqala, ephuma kuqala bese uhlola kabusha ukwelashwa kwendawo ngemva kokugcinwa isikhathi eside.
Ukugxila kwemboni yekhadi: Ubukhulu beshidi, indawo engaphezulu, ukuphrinta nesakhiwo sesendlalelo kungabuyekezwa mayelana nezidingo zangempela zokukhiqiza ikhadi.
Amageji angokwezifiso nosayizi: Izinketho ezijwayelekile ezingu-0.08–0.35mm namafomethi eshidi enziwe ngokwezifiso kungaxoxwa ngawo.
Izivivinyo zokuphrinta ne-lamination: Amasampuli angahlolwa ukuze athole i-offset, UV inkjet, isikrini, ukuphrinta kwedijithali kanye ne-lamination yezinga lokushisa eliphansi.
RFID Usekelo lwephrojekthi: Izakhiwo zeshidi zingabuyekezwa ngogqinsi lwe-inlay, indawo ye-chip, i-antenna nokuhambisana komfundi.
Izimangalo zezemvelo ezinomthwalo wemfanelo: Amadokhumenti abalulekile angafaniswa nokwakhiwa kwekhadi eliqediwe kanye nemakethe.
Ukunikezwa kwe-B2B eqondile kwasefekthri: Ifanele abakhiqizi bamakhadi, iziguquli, amaphrinta, RFID izinkampani, abangenisi nabasabalalisi.
Isicelo sekhadi esiqedile, impilo yesevisi elindelwe kanye nemakethe yendawo.
Isendlalelo se-PLA esidingekayo: umgogodla ophrintekayo, umgogodla omaphakathi, isendlalelo esikhanyelayo noma Ifilimu ye-overlay .
Ukujiya, ukubekezelelana, usayizi weshidi, okusanhlamvu/umumo nobuningi.
Umbala omhlophe, osobala, omnyama noma wangokwezifiso kanye nethagethi yokungafihli.
I-Offset, UV inkjet, isikrini, i-Indigo noma enye inqubo yokuphrinta nesistimu kayinki.
Umshini wokulambisa, izinto zamanje, iphrofayili yezinga lokushisa, ingcindezi nohlobo lwepuleti.
Usayizi wekhadi eliqediwe, ukujiya nokudingekile ISO noma ukucaciswa kwekhasimende.
RFID i-chip, i-antenna, ukujiya kwe-inlay, umugqa kazibuthe noma imfuneko ye-contact-chip.
Ukuvundela, okuqukethwe okusekelwe ku-bio, REACH , RoHS noma ezinye izimfuneko zedokhumenti.
Ubuningi besampula, isibikezelo sonyaka, indawo yokufikela kanye nesheduli yokulethwa eceliwe.
Xoxa ngephrojekthi yakho ye-PLA Izinto zamakhadi
Akunjalo. Ukwenziwa kwekhadi kudinga ukucaba okulawulwayo, ukuhwalala kwendawo, umbala, ukunamathela kokuphrinta, ukubekezelela ukushuba kanye nokuziphatha kokucwenga. Cela ibanga elihlolelwe ukukhiqizwa kwekhadi.
Ugqinsi olujwayelekile olutholakalayo luhlanganisa u-0.08, 0.15, 0.17, 0.20 kanye no-0.35mm. Amageji enziwe ngokwezifiso angabuyekezwa ngokuya nge-extrusion yeshidi, ukwakheka kongqimba kanye ne-MOQ.
Yebo. Usayizi weshidi ojwayelekile ungu-300 × 480mm, futhi amafomethi enziwe ngokwezifiso angaxoxwa ngokuya ngesakhiwo somshini wokunyathelisa, ukufakwa kwekhadi kanye nemishini yokubeka.
Amashidi e-PLA angahlolwa ukuze athole amakhadi e-ID-1, kodwa ikhadi eliqediwe elingu-85.60 × 53.98mm nogqinsi lwegama elingu-0.76mm kufanele lifinyelelwe ngemva kokuphrinta, ukucwiliswa, ukupholisa nokubhoboza.
Ukuphrinta kwe-offset kungahlolwa ngokuphathwa kwendawo efanele kanye noyinki. Abathengi kufanele bahlole ukunamathela kukayinki, ukomisa, ukuvimba, ukuminyana kombala kanye nokumelana nomjikelezo we-lamination.
Amamaki aphathwayo afanelekile noma ahlanganisiwe angase ahambisane. Amandla angaphezulu, ukwelapha uyinki, ukuguquguquka, iphunga kanye Ifilimu ye-overlay nokubopha kufanele kuhlolwe kuphrinta ehlosiwe.
Okokusebenza kungase kusetshenziswe, kodwa iresiphi evamile ye PVC akufanele icatshangwe. I-PLA ngokuvamile idinga umjikelezo wokushisa ophansi futhi olawulwa ngokucophelela onokucindezela okuqinisekisiwe, indawo yokuhlala kanye nokupholisa.
Izimbangela ezivamile zihlanganisa izinga lokushisa elidlulele, izendlalelo ezingalingani, ukuma kweshidi okungahambisani, ukumbozwa kokuphrinta okungalingani, ukupholisa okungekuhle kanye nokulinganisa ikhadi ngaphambi kokuba libe nesimo esigcwele.
Yebo, ngaphansi kwezilingo. Inlay ukujiya, idizayini ye-antenna, into enamathelayo, indawo ye-chip, ingcindezi ye-lamination kanye nokuhambisana komfundi kufanele kufakwe esakhiweni sekhadi.
I-PLA ingacatshangelwa amakhadi okhiye wehhotela asetshenziswa isikhathi esifushane lapho i-chip, isistimu yokukhiya, ukuphrinta, ukuchayeka komswakama kanye nokuphatha okuphindaphindiwe kuqinisekiswa ngaphambi kokukhiqizwa.
Ukusebenza kuncike ebangeni nokwakhiwa. I-PLA ingase ifanelekele amakhadi akhethiwe wempilo emfishane naphakathi, kodwa akufanele kucatshangwe ukuthi ifana PVC , PETG noma i- PC ekumelana nokushisa, umthelela noma ukuguquguquka kwesikhathi eside.
Ishidi lekhadi le-PLA elijwayelekile alifaneleki ngokuzenzakalelayo ukuqoshwa kwe-laser okuvikelekile. Ukwakheka okuphawulekayo kwelaser, ukuqhathanisa, ukuphendula kokushisa nokuqina kwekhadi kudinga ukuthuthukiswa nokuhlolwa okuzinikele.
Leso simangalo sincike endaweni eqinisekisiwe kanye nokwakhiwa okuphelele. Ishidi le-PLA elingenalutho lingase livundise ngokwezimboni, kuyilapho oyinki, izinto ezinamathelayo, ama-chips, izimpondo, imithende noma okokunamathela kungashintsha isimo sekhadi eliqediwe.
Kuphela uma ikhadi eliqediwe ncamashi linesitifiketi esihlukile somquba wasekhaya. Isitifiketi se-Industrial-compost asisekeli ngokuzenzakalelayo isimangalo somquba wasekhaya.
I-PLA kanye ne PET ama-polymer ahlukene futhi akufanele ngokuvamile axutshwe. Ukugaywa kabusha kwe-PLA kudinga ukusakazwa kweqoqo okuzinikele, okungatholakali kabanzi kumakhadi.
Kungaxoxwa ngemibala emhlophe, ecacile, emnyama, eguquguqukayo kanye neyangokwezifiso. I-masterbatch yombala ingase ithinte ukuphrinta, i-lamination, ukusebenza komshini kanye nobubanzi bokunikeza isitifiketi.
Gcina kuvaliwe, kuyisicaba futhi komile endaweni yokugcina impahla elawulwayo kude nokukhanya kwelanga nokushisa. Vikela ingaphezulu othulini, uwoyela, imihuzuko kanye nomswakama, namashidi wesimo ngaphambi kokuphrinta.
Yebo. Amashidi amasampula kufanele aphrintwe, alamiwe, apholiswe, agxotshwe futhi enziwe abe ngokwakho kusetshenziswa inqubo yokukhiqiza ehlosiwe ngaphambi kokuba kugunyazwe ukucaciswa kwezinto ezibonakalayo.
I-MOQ incike ekushubeni, usayizi weshidi, umbala, ukuphathwa kwendawo, ukumbozwa, ukupakishwa kanye nokuthi iphrojekthi isebenzisa ukwakheka okukhona kwebanga lekhadi.
Nikeza uhlelo lwekhadi, uhlobo lwesendlalelo, ukujiya, usayizi, umbala, indlela yokuphrinta, inqubo yokulambisa, RFID noma izimfuneko zomugqa, isitifiketi, ubuningi nendawo okuyiwa kuyo.
Xhumana WALLIS Ipulasitiki ukuze uthole amashidi ayisisekelo ekhadi le-PLA ngokwezifiso, amashidi aphrintekayo nezinto zongqimba lwekhadi zesipho, ukwethembeka, ukhiye wehhotela, umcimbi, ukuphromotha kanye nezinhlelo zamakhadi RFID ezikhethiwe. Ithimba lethu lisekela ukukhethwa kwegeji, ukuhlolwa kokuphrinta nokufakwa kwe-lamination, ukubuyekezwa kwesakhiwo samakhadi, imibhalo yezemvelo, ukucaciswa kwekhwalithi kanye nokunikezwa kwe-B2B eqondile efekthri.
