|
Wait PVC, PETG ɛn PC kɔr shit dɛn insay 0.15–0.3mm fɔ ID, bank, akses, SIM ɛn smat kad prodakshɔn. Kastom tiknes, saiz, surface ɛn kɔt plus sampul fɔ print, lamination ɛn OEM tɛst.
kor sheet we de na di kɔr
WALLIS
| Sayz: | |
|---|---|
| Kɔlɔ: | |
| Tiknɛs: | |
| Kwantiti: | |
Wallis 0.15mm ɛn 0.3mm wayt PVC, PETG ɛn PC kɔr shit dɛn na injinia fɔ pɔshɔnal plastic kad manufakchurin. Dipen pan di matirial gred we yu dɔn pik ɛn kad kɔnstrɔkshɔn, dɛn shit ya kin bi layers we dɛn kin print, strɔkchɔral midul layers ɔ sɔpɔt layers insay ID kad, bank kad, SIM kad, akses kad, mɛmbaship kad, gift kad ɛn RFID smat kad.
Fɔ B2B kad manifakta dɛn, di kɔrɛkt wayt kɔr shit fɔ mach di printin sistem, lamineshɔn tɛmpracha, ɔvlay matirial, chip ɔ ɛntena strɔkchɔ ɛn target finish-kad tik. Wallis de sɔpɔt kɔstɔm tik, shit saiz, waytnɛs, mat ɔ glos sɔfays, kɔt ɛn sampul tɛst bifo volyum prodakshɔn.
| Paramita | Avaylabl Spɛsifikeshɔn |
|---|---|
| Di Tin dɛn we Yu Go Yuz fɔ Du | PVC / PETG / Polikarbonɛt (PC) . |
| Praymari Tiknɛs Rɛnj | 0.15mm ɛn 0.30mm; ɔda tiknes dɛn we dɛn dɔn kɔstɔmayt kin tɔk bɔt |
| Standart Shit Sayz dɛn | A4 / A3 / 295×485mm / 310×485mm / 500×600mm / kɔstɔm sheet saiz |
| Kɔlɔ | Wait kɔr; kɔstɔm waytnɛs ɔ kɔlɔ maching de ɔnda di sampul aprɔval |
| Di Opshɔn dɛn fɔ di Surface | Mat / glossy / printin-grɛd sɔfa akɔdin to matirial ɛn aplikeshɔn |
| Di Kɔmpatibiliti fɔ Print | Ɔfset / UV / silk skrin; dijital ɔ inkjet yuz nid fɔ gɛt di kɔrɛkt kɔt gred ɛn tɛst |
| Di we aw dɛn de du di wok | Printin, laminashɔn, day-kɔtin, panch, chip ɛmbadin ɛn RFID/NFC inlay asɛmbli |
| Fɔm fɔ di Sapɔt | Shit ɔ kɔstɔmayz kɔt fɔmat dɛn akɔdin to di prodakshɔn rikwaymɛnt dɛn |
| Aplikeshɔn dɛn | ID kad, pemɛnt kad, SIM kad, akses kad, mɛmbaship kad, gift kad ɛn smart kad |
| Sampul Validɛshɔn | Rikɔmɛnd bifo bɔku bɔku prodakshɔn fɔ kɔnfɔm printin, lamineshɔn, kɔlɔ ɛn kad-strɔkchɔ kɔmpitibliti |
PVC, PETG ɛn polycarbonate nɔto gred dɛn we dɛn kin chenj. Ɛni matirial gɛt difrɛn prɔsesin winda, rigiditi, ɔt rispɔns ɛn target aplikeshɔn. Di kɔrɛkt sɛlɛkshɔn fɔ bi bay di kɔmplit kad strɔkchɔ pas di prayz ɔ tiknes nɔmɔ.
| Matirial | Tipik Strɔng | Kɔmɔn B2B Aplikeshɔn dɛn | Valideshɔn Fokus |
|---|---|---|---|
| PVC Kor Sheet we yu kin yuz | Kɔst-ɛfishin prɔsesin, brayt printin kɔmpatibiliti ɛn establish kad-prɔdakshɔn wokflɔ | Membaship kad, gift kad, ɔtel kad, standad ID kad ɛn jenɛral smat kad | Vicat gred, surface dyne, roughness, tiknes stebiliti ɛn ɔvlay bonding |
| PETG Kor Sheet we de na di wɔl | Gud tafnɛs, fleksibiliti ɛn lamination kɔmpatibiliti fɔ PETG ɔ kɔmpɔzit kad strɔkchɔ dɛn | Prɛmiɔm kad dɛn, ID kad dɛn we dɛn dɔn pik, smat kad dɛn we go de te ɛn PVC/PETG kɔmpɔzit strɔkchɔ dɛn | Lamination temperechur, shrinkage, surface tension, peel trɛnk ɛn ink sistɛm |
| PC Kor Sheet we yu go yuz | Ay ɔt rɛsistɛns, strɔng mɛkanikal durabiliti ɛn kɔmpatibiliti wit sikyɔriti-kad strɔkchɔ dɛn | Gɔvmɛnt ID, drayva laysens, sikyɔriti akses kad ɛn laser-pɔsɔnal kad | Laserable gred, layt kompitibiliti, lamination program ɛn finish-kad tɛst |
Di tik we di shit tik fɔ bi pat pan di ful kad stak. Wan ISO-fɔmat plastic kad we dɔn dɔn, nɔmal wan kin jɔyn bɔku bɔku print, kɔr, inlay ɛn ɔvlay layers. So, 0.15mm ɔ 0.30mm de diskrayb wan wan layt, nɔto fɔ se na di las kad tik.
| Tiknes | Tipik Rol | Selekshɔn Kɔnsidɛreshɔn |
|---|---|---|
| 0,15mm na di wan | Tin print layt, sɔpɔt layt, split-kɔr kɔnstrɔkshɔn ɔ mɔlti-layer smat kad strɔkchɔ | Yuzful we sɔm fɛnshɔnal layers fɔ fit insay di target kad tik; verify flatness ɛn handel we yu de print |
| 0,30mm na di wan | Strukchɔral midul layt, tik print kɔr ɔ sɔpɔt rawnd chip ɛn ɛntena asɛmbli | I de gi big layt tik bɔt i fɔ balans wit ɔvlay, inlay ɛn fayn panch rikwaymɛnt |
| Tiknɛs we dɛn mek fɔ di kɔstɔm | Speshal kad stak, dual-intafeys kad, SIM kad ɔ prɔpriet kad kɔnstrɔkshɔn | Gi layt dayagram, target fainal tiknes ɛn lamination prɔses we yu de aks fɔ kot |
Insay laminated kad, di wayt kɔr shit de mek di opaque bays biɛn grafik ɛn pɔsnalayzeshɔn data we i de kɔntribyut to kad flatnɛs ɛn rigiditi. Fɔ RFID ɔ NFC kad, wan ɔ mɔ kɔr layt kin rawnd di ɛntena ɛn chip inlay. Di las kɔnstrɔkshɔn kin inklud bak print sheet, klia ɔvlay, magnɛtik strɛp layers, ɔlografik sikyɔriti fim ɛn sayn panɛl.
Wan wayt kɔr sheet we gɛt printin gred de gi brayt bakgrɔn fɔ tɛks, foto, barɔd ɛn brand grafik. Dɛn fɔ pik di tritmɛnt fɔ di ink ɛn di tin dɛn we dɛn want fɔ print.
Di midul layt de ɛp fɔ kɔntrol di rigiditi, flatnɛs ɛn di tɔtal kad tik. I matirial fɔ kɔmpitabl wit layers we de nia fɔ ridyus di wɔp, bɔbul ɔ delamination.
Fɔ kɔntaktlɛs ɔ dual-intafɛs kad, di layt dizayn fɔ lɛf fayn ples fɔ di ɛntena, mɔdyul ɛn kɔnɛkshɔn eria. Sample lamination ɛn ilɛktrik tɛst na in dɛn kin rikɔmɛnd bifo mas prodakshɔn.
Wan matirial we dɛn tɔk bɔt as 'printable' nɔ kin fayn fɔ ɛvri printin teknɔlɔji ɔtomɛtik wan. Ɔfset ɛn silk-skrin kad shit dɛn kin jɔs abop pan kɔntrol sɔfa tɛnsiɔn ɛn rɔf, we inkjɛt ɛn sɔm dijital sistem dɛn kin nid fɔ gɛt wan dediket riseptiv kɔtin. Di wan dɛn we de bay fɔ no di printa, ink brand, di we aw dɛn de mɛn am ɛn di lamination prɔses we dɛn nid bifo dɛn pik di gred.
| Print Prɔses | Rikwayd Shit Kɔnsidɛreshɔn | Rikɔmɛnd Pri-Prodakshɔn Tɛst |
|---|---|---|
| Ɔfset Printin we yu de print | Kontrol dain levul, suitable roughness, stebul waytnes en ink kompitibiliti | Ink adheshon, drying, kala density en post-lamination bond |
| UV Printing we dɛn de print | Surface kompitibul wit UV ink ɛn curing ɛnaji we nɔ gɛt pasmak distɔrshɔn | Krɔs-hatch adheshon, cure kwaliti, bɛnd ɛn lamination tɛst |
| Silk Skrin we dɛn de print | Ink sistem we dɛn mach to PVC, PETG ɔ PC ɛn kɔntrol sɔfayz tritmɛnt | Adhesion, opacity, drying ɛn resistans afta laminɛshɔn |
| Inkjet ɔ Dijital Printin | Dɛn kin nid fɔ gɛt dediket kɔt gred; ɔdinari kɔr shit we nɔ gɛt kɔt nɔ fɔ tek am se i kɔmpitabl | Dot difinishɔn, ink absɔpshɔn, rɔb rɛsistɛns ɛn kɔtin-to-ɔvlay bond |
Tiknes kɔnsistɛns: sɔpɔt prɛdiktibɛl kad-stak kɔlkyulɛshɔn ɛn yunifom laminɛshɔn.
Flatnɛs: i de mek di shit fid, rɛjista, stak ɛn day-kat bɛtɛ.
Wait ɛn kɔlɔ kɔnsistɛns: ɛp fɔ mek dɛn kɔntinyu fɔ ripit print kɔlɔ akɔdin to prodakshɔn lɔt dɛn.
Surface dyne ɛn roughness: inflɔws ink adheshon ɛn print difinishɔn.
Vikat ɛn tɛmal rispɔns: fɔ mach di lamineshɔn saykl we dɛn dɔn pik ɛn di matirial dɛn we de nia am.
Lamination bond: fɔ evaluate wit di aktual ɔvlay, ink ɛn prodakshɔn ikwipmɛnt.
Finished-kad pefɔmɛns: verify bɛnd, panch, chip funkshɔn, antena ridin ɛn sɔfays apinɛns.
Wait PVC, PETG ɛn PC kɔr shit dɛn de saplae to kad faktri, pɔsnalayzeshɔn biyɔ, inlay manifakta, sikyɔriti-dɔkyumɛnt prodyusɔ ɛn kad-matirial distribyushɔn. Dɛn fɔ pik di las matirial gred akɔdin to di kayn kad ɛn di kɔndishɔn dɛn we dɛn de op fɔ gɛt di savis.
Bank, pemɛnt ɛn pripeid kad dɛn
Di wokman, studɛnt ɛn institiushɔnal ID kad
Akses-kɔntrol ɛn ɔtel ki kad dɛn
SIM ɛn tɛlikɔm kad dɛn
Membaship, loyalti ɛn gift kad
RFID, NFC ɛn dual-intafɛs smat kad dɛn
Drayva laysens ɛn sɔm sikrit aydentifikeshɔn kad dɛn we dɛn dɔn pik
| Step | Baya Infɔmeshɔn | Rikɔmɛnd Vɛrifikɛshɔn |
|---|---|---|
| 1. Di we aw dɛn de pik di tin dɛn we dɛn nid | PVC, PETG ɔ PC; target kad tayp ɛn savis rikwaymɛnt dɛn | Konfam matirial kompitibiliti wit di komplit kad stak |
| 2. Spɛsifikeshɔn Kɔnfɔmeshɔn | Tik, saiz, wayt, sɔfa, kwantiti ɛn pak | Rivyu TDS, tolɛreshɔn ɛn prodakshɔn kapasiti |
| 3. Sampul Tɛst | Printa, ink, ɔvlay, laminatɔ ɛn kad-layer drɔin | Printin, lamination, panch ɛn finish-kad tɛst dɛn |
| 4. Golden Sampul Aprɔval | Aprɔv kɔlɔ, sɔfa, tik ɛn finish-kad rizɔlt | Ritain apruv rɛfrɛns fɔ prodakshɔn ɛn inkam inspekshɔn |
| 5. Bɔlk Prodakshɔn | Faynal ɔda kwantiti, pak mak ɛn shiping tɛm | Batch inspekshɔn agens di spɛsifikɛshɔn we dɛn dɔn gri fɔ |
Wait kad kɔr sheet dɛn fɔ protɛkt frɔm mɔs, dɔst, bɛnd, kɔntaminɛshɔn na di say we dɛn de ɛn ɔt pasmak we dɛn de kip ɛn transpɔt. Wallis kin gi PE-film protɛkshɔn, mɔstɔ-rɛsistant wrap, katon, palet ɛn kɔstɔmayz shiping lɛbl akɔdin to di shit fɔmat ɛn ɔda kwantiti.
Wallis de sɔpɔt di global kad manifakta dɛn wit PVC, PETG ɛn PC kɔr shit, ɔvlay film ɛn rilat kad matirial dɛn. Di saplai prɔses kin inklud matirial sɛlɛkshɔn, kɔstɔmayz shit dimɛnshɔn, sɔfa opshɔn, sampul pripia, kad-strɔkchɔ rivyu ɛn ɛkspɔt pak.
Bɔku kad-matirial opshɔn dɛn frɔm wan spɔlayt
Kastom tik, saiz, sɔfa ɛn kɔlɔ divɛlɔpmɛnt
Sampul fɔ print ɛn lamineshɔn validɛshɔn
Sɔpɔt fɔ kad kɔr, ɔvlay ɛn smart-kad layt maching
Batch spesifikeshɔn ɛn Golden Sample aprɔval wokflɔ
Profeshonal ekspot pakej fo B2B oda
Wan kor sheet de mek di print ɔ strɔkchɔral bɔdi fɔ di kad. Ɔvlay na nɔmal wan tin we tan lɛk tin we de protɛkt di ɔda layt we dɛn kin put ɔp di layt we dɛn print. Di rayt wok dipen pan di kad dizayn ɛn di matirial gred.
Usually, 0.15mm na wan layt insay wan multi-layer kad pas di komplit finish kad. Di fainal kɔnstrɔkshɔn kin jɔyn tu ɔ mɔ kɔr shit, wan RFID inlay ɛn protɛktiv ɔvlay.
Yu kin pik 0.30mm sheet we di kad strɔkchɔ nid tik midul layt ɔ ɔda sɔpɔt rawnd chip ɔ ɛntena inlay. Di las choice must bi calculated wit ɔl di ɔda layers.
PVC na tin we dɛn kin pik fɔ mek dɛn prodyuz kad we nɔ de tek bɔku mɔni, ɛn we gɛt bɔku bɔku kad. Di wan dɛn we de bay fɔ stil kɔnfɔm di sɔfayz gred, di we aw dɛn de print, di lamineshɔn tɛmpracha ɛn di kad layfspan we dɛn nid.
PETG kin bi kɔnsidɛrɛd fɔ kad strɔkchɔ dɛn we nid gud tafnɛs ɛn PETG ɔ kɔmpɔzit laminɛshɔn. Sampul tɛst nid fɔ bi bikɔs PETG gɛt difrɛn tɛmal prɔsesin winda frɔm PVC ɛn PC.
PC na tin we dɛn kin tink bɔt fɔ ay-sikyɔriti ɛn lɔng-layf kad strɔkchɔ, patikyula we laser pɔsnalayzeshɔn ɔ ay laminɛshɔn tɛmpracha involv. Di pɔsin we bay fɔ sho if dɛn nid fɔ gɛt gred we dɛn kin yuz lɛsa.
Nɔto ɔtomɛtik wan. Ɔfset ɛn silk-skrin sheet dɛn nɔ kin gɛt ɛnitin fɔ kɔt, bɔt bɔku tɛm fɔ print inkjɛt kin nid fɔ gɛt wan kɔtin we dɛn kin yuz fɔ print. Gi di printa ɛn ink infɔmeshɔn bifo yu ɔda.
Yɛs. Yu kin tɔk bɔt di kɔstɔm tik ɛn shit fɔmat dɛn akɔdin to di kad-layer drɔin, printa fɔmat, laminatɔ saiz ɛn volyum we dɛn nid.
Yes, yu kin yuz fayn gred dɛn rawnd RFID ɔ NFC inlays. Di kɔmplit kɔnstrɔkshɔn fɔ tɛst fɔ lamination bonding, antena pefɔmɛns, chip kɔnɛkshɔn ɛn finish-kad flatnɛs.
Duya gi di matirial, tik, sheet saiz, surface finish, wayt ɔ kala, printin we, ɔvlay matirial, kwantiti, pak we yu nid ɛn target kad aplikeshɔn.
Yɛs. Sampul dɛn de alaw di pɔsin we bay fɔ tɛst ink adheshon, kɔlɔ, lamineshɔn, day-kat, chip ɔ ɛntena fɛnshɔn ɛn di fayn kad strɔkchɔ bifo i gri fɔ mek di volyum prodakshɔn.
Kip di matirial sial insay in ɔrijinal pak, protɛkt frɔm mɔstɔ, dɔst, dairekt san layt, ebi prɛshɔn ɛn big big tɛmpracha chenj. Stɔr di sheet dɛn flat pas di pak we dɛn gri fɔ sho ɔda tin.
Send Wallis yu kad-layer drɔin, matirial we yu nid, tik, sheet saiz, printin prɔses ɛn ɔda kwantiti. Wi tim go ɛp fɔ no wan fayn wayt PVC, PETG ɔ PC kɔr-shit gred fɔ sampul tɛst ɛn B2B prodakshɔn.
