I-Wholesale HF/NFC kanye ne-UHF RFID inlay emanzi noma eyomile enama-chips enziwe ngokwezifiso, izinti, amafomethi e-roll noma amashidi, umbhalo wekhodi nokuguqulwa kwelebula lamakhadi, ukuthengisa, okokusebenza, ukupakisha nokulandelela impahla emhlabeni wonke.
Inlay/ Prelam
Wallis
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I-Wallis ihlinzeka ngokufakwa okumanzi kwe-RFID, okufakwe ngaphakathi okomile namathegi amalebula aguquliwe ekhadi elihlakaniphile levolumu ephezulu, ukuthengisa, ukuhlelwa kwezinto, ukupakisha, umtapo wolwazi, umcimbi, ukulandelela impahla kanye namaphrojekthi okuhlonza umkhiqizo. Ubuchwepheshe obutholakalayo buhlanganisa 13.56MHz HF/NFC kanye no-860–960MHz UHF RAIN RFID.
Ama-inlay amanzi ahlanganisa okunamathelayo okuzwela ukucindezela kanye nomugqa okhululayo wokuguqula ilebula noma ukusetshenziswa okuqondile okuhambisanayo. Ama-inlay omile aqukethe ukuhlanganiswa kwe-chip-ne-antenna kusithwali ngaphandle kokwakhiwa kokunamathela kokugcina futhi kuhloselwe ukuguqula, ukushumeka, ukufakwa kwe-lamination noma ukuhlanganiswa komunye umkhiqizo.
Abathengi bangakwazi ukwenza ngokwezifiso i-chip, iphrothokholi, ubukhulu be-antenna, ubukhulu be-inlay, i-adhesive, ifomethi ye-roll noma yeshidi, ukubhala ngekhodi, ukumaka umaka omubi, isiqondiso esisongayo kanye nokupakishwa. Ukusebenza kokugcina kwe-RF kufanele kuqinisekiswe ezintweni ezisetshenziswayo zangempela kanye nohlelo lokufunda.
Cela i-Wholesale RFID Inlay Quote
| Specification | Wet Inlay | Dry Inlay |
|---|---|---|
| Isakhiwo | I-RFID chip + i-antenna eqoshiwe + inkampani yenethiwekhi + enamathelayo ezwela ukucindezela + umugqa wokukhipha | I-RFID chip + i-antenna enamathiselwe ku-PET noma enye inkampani yenethiwekhi egunyaziwe, ngaphandle kwe-adhesive yokugcina kanye nomugqa |
| Izinketho Zemvamisa | 13.56MHz HF/NFC noma 860–960MHz UHF | 13.56MHz HF/NFC noma 860–960MHz UHF |
| Izinketho zeProtocol | I-ISO/IEC 14443 Uhlobo A, ISO/IEC 15693, izinhlobo ze-NFC Forum noma i-EPC Class 1 Gen 2 / ISO/IEC 18000-63 | Kukhethwe ngokuya nge-chip kanye nomkhiqizo wokugcina oshumekiwe |
| Izibonelo ze-HF/NFC Chip | I-NTAG213/215/216, MIFARE Ultralight, MIFARE Classic, DESFire, ICODE, F08 nezinye izinketho ezihambisanayo | Imindeni ye-chip efanayo ingaxoxwa ngayo uma ifanele isakhiwo sokugcina sokuhlanganisa |
| Izibonelo ze-UHF Chip | I-NXP UCODE, i-Impinj M730/M750 noma imindeni yakwaMonza, i-Alien Higgs nezinye izinketho eziqondene nephrojekthi | Kukhethwe ngokwenkumbulo ye-EPC/TID, ukuzwela, indawo yokufunda kanye nomklamo wokugcina we-antenna |
| I-Antenna Material | I-aluminium eqoshiwe noma ithusi | I-aluminium eqoshiwe noma ithusi |
| Inkampani yenethiwekhi | I-PET noma enye inkampani yenethiwekhi egunyaziwe | I-PET noma esinye isithwali esikhethelwe ukulanyiswa noma ukushumeka |
| Ifomethi Yokulethwa Okujwayelekile | Roll ifomethi yokuguqula ilebula kanye nohlelo lokusebenza oluzenzakalelayo | Roll noma ifomethi yeshidi ngokuya ngekhadi, ithegi noma inqubo yokushumeka umkhiqizo |
| Ukwenza ngokwezifiso | I-chip, i-antenna, i-adhesive, usayizi we-die-cut, ukucaciswa komqulu, umbhalo wekhodi nokuguqulwa kwelebula | I-Chip, i-antenna, inkampani yenethiwekhi, ifomethi yeshidi noma i-roll, indawo yokulala kanye nesakhiwo sokuhlanganisa |
| Izicelo Ezijwayelekile | Amalebula e-RFID, izitika ze-NFC, omaka bezitolo, amabhokisi, izimpahla, amathikithi nokupakishwa okuhlakaniphile | Amakhadi ahlakaniphile e-PVC/PET/PC, amabhande asehlakaleni, amathikithi, imikhiqizo ebunjiwe nama-transponder ashumekiwe ngokwezifiso |
Izinketho zefrikhwensi yezinga lekhasi zifaka 869–915MHz UHF, 13.56MHz ISO/IEC 14443 kanye no-13.56MHz ISO/IEC 15693. I-chip ngqo, ibhande lesifunda le-UHF, uthi nokwakhiwa okuqediwe kufanele kuqinisekiswe ngaphambi kwekhotheshini.
| Ukuqhathanisa | I-Inlay Emanzi | Eyomile | Iguqule Ilebula le-RFID |
|---|---|---|---|
| Okunamathelayo | Kufakiwe | Akufakiwe esakhiweni sokugcina sohlelo lokusebenza | Okunamathelayo okuqondene nohlelo lokusebenza kukhethelwe indawo enelebula |
| Khipha u-Liner | Kufakiwe | Imvamisa ayihlinzekwa njengokwakhiwa kokuzinamathelisa kokugcina | Kufakwe ngokuya ngenqubo yokuguqula nokusabalalisa |
| Okuphrintekayo Face Stock | Ngokuvamile kudinga ukuguqulwa okwengeziwe kwelebula eliphelele eliphrintekayo | Kwengezwe ngesikhathi sokushumeka noma ukuguqulwa uma kudingeka | Iphepha, i-PET, i-PP noma enye impahla ephrintekayo egunyaziwe |
| Umthengi Ojwayelekile | Isiguquli selebula, inkampani yokupakisha noma isihlanganisi se-RFID | Umkhiqizi wekhadi, isihlanganisi somkhiqizo noma umkhiqizi womaka wangokwezifiso | Umthengisi, umkhiqizo, indawo yokugcina impahla, u-opharetha wezokuthutha noma uhlelo lokusebenzisa ekugcineni |
| Ukusetshenziswa Okuyinhloko | Ukuguqula okwengeziwe noma uhlelo oluqondile oluhambisanayo | Lamination, encapsulation noma umkhiqizo ukushumeka | Ukuphrinta, ukubhala ngekhodi nokunamathiselwe kokugcina entweni |
| Ukuvikelwa Kwemvelo | Kuncike kusithwali, i-adhesive kanye nokwakhiwa kokugcina okuguquliwe | Kuncike ekutheni i-encapsulating noma i-laminating material | Kuchazwa isitokwe sobuso esiphelele, i-adhesive, coating, lamination kanye nomklamo onqenqemeni |
Ama-inlay amanzi afaneleka lapho umthengi edinga ingxenye ye-RFID ezinamathelayo ukuze ihlanganiswe nephepha noma isitokwe sobuso bokwenziwa, ukuphrinta, ukusika ukufa kanye nokuguqulwa kokugcina komqulu.
Ama-inlay omile afaneleka lapho ingxenye ye-RFID izokwenziwa i-laminated ekhadini, ishunyekwe entweni ebunjiwe, ifakwe ngaphakathi kwebhande esihlakaleni noma ihlanganiswe kokunye ukwakhiwa ngaphandle kokunamathelisa ilebula evamile.
Ilebula eliguquliwe liyakhethwa uma ikhasimende lidinga umkhiqizo osulungele ukuphrintwa noma ophrintiwe ngaphambili onomsebenzi wokugcina wobuso, okunamathelayo, ukusikwa kwefa, umbhalo wekhodi kanye nokucaciswa komqulu osekuqediwe.
| Ukuqhathanisa | i-HF/NFC Inlay | UHF Inlay |
|---|---|---|
| Imvamisa | 13.56MHz | 860–960MHz ngokucatshangelwa kokushuna kwesifunda |
| Amaphrothokholi Ajwayelekile | I-ISO/IEC 14443 Uhlobo A, ISO/IEC 15693 kanye nezinhlobo zeForamu ye-NFC | I-EPC Class 1 Gen 2 / ISO/IEC 18000-63 |
| Ukuziphatha Okujwayelekile Kokufunda | Ukuthepha kwebanga elifushane noma ukufunda okuseduze | Ibanga elifushane ukuya kumamitha ambalwa ngokuya ngothi, umfundi, izinto ezibonakalayo nendawo ezungezile |
| Ukusetshenziswa kwe-Smartphone | Kungenzeka ngama-chips e-NFC afanelekile nokuziphatha okusekelwa kwefoni | Imvamisa idinga umfundi ozinikele we-UHF |
| Izicelo Ezijwayelekile | Ukusebenzisana kwe-NFC, imitapo yolwazi, ukufakazela ubuqiniso, amathikithi, amakhadi kanye nokuhlonza ibanga elifushane | Izingubo, i-inventory, logistics, amabhokisi, izimpahla nokufunda ngobuningi |
| Imigomo Yenkumbulo | I-Chip UID, inkumbulo yomsebenzisi, amakhasi, amabhlogo, amaphasiwedi nezici zokuphepha | I-EPC, i-TID, inkumbulo egodliwe kanye nenkumbulo yomsebenzisi ozikhethela yona |
Ama-inlay asebenza ngefrikhwensi efanayo angase asebenzise amaphrothokholi ahlukene, imiyalo ye-chip, izakhiwo zememori nemisebenzi yezokuphepha. Nikeza isifundi esidingekayo, i-chip noma iphrothokholi esikhundleni sokukhetha ngobuningi.
Ama-inlay e-HF angase afundeke ngamasentimitha ambalwa, kuyilapho okufakwe ngaphakathi kwe-UHF okufanelekile kungase kufinyelele kumamitha ambalwa. Ukusebenza kokugcina kuncike ku-chip, uthi, amandla omfundi, ibhendi yesifunda, izinto ezimakiwe, umumo nokuhlanganiswa.
I-antenna kufanele ikhethelwe indawo ehlosiwe kanye nendawo yokufunda. Umkhiqizo olungiselelwe isifunda esisodwa se-UHF ungase unganikezi ukusebenza okufanayo kwesinye.
Lawa ma-chips we-NFC Forum Type 2 ngokuvamile akhethelwa ama-URL, amaphrofayela edijithali, ulwazi lomkhiqizo kanye nokusebenzisana kwabathengi. Bahlinzeka ngamakhono ahlukene enkumbulo yomsebenzisi, ngakho okuqukethwe okufakwe ikhodi kwe-NDEF kufanele kuqinisekiswe ngaphambi kokukhetha i-chip.
Imikhiqizo ye-MIFARE Classic, i-Ultralight noma ye-DESFire ingase idingeke ukuze uthole ukufinyelela okuhambisanayo, ubulungu, ezokuthutha, umcimbi noma izinhlelo ezivikelekile zamakhadi ahlakaniphile. Isifundi, uhlelo lokusebenza, okhiye nesofthiwe kumele kufane ngqo nomndeni we-chip.
I-ICODE inlays ingasekela umtapo wezincwadi ohambisanayo, impahla kanye nezinhlelo zokusebenza zamakhadi wendawo. Akufanele kucatshangwe ukuthi asebenza nawo wonke umfundi we-ISO/IEC 14443.
Ukukhethwa kwe-chip ye-UHF kufanele kucabangele inkumbulo ye-EPC, izidingo ze-TID, inkumbulo yomsebenzisi ozikhethela yona, ukuzwela, ukufinyelela noma ukubulala amaphasiwedi kanye nokuhambisana nesifundi nengxenyekazi yesofthiwe.
Imikhiqizo ye-HF/NFC ingase idalule i-UID ye-chip, kuyilapho imikhiqizo ye-UHF ngokuvamile iqukethe i-TID yemboni kanye nememori ye-EPC ehlelekayo. Cacisa ukuthi iyiphi inkomba okufanele ifundwe, ibhalwe ngekhodi, iphrintwe noma ifaniswe kusizindalwazi sekhasimende.
Izinsizakalo zingabandakanya ukubhala kwe-URL ye-NDEF, ukubhala ngekhodi kwe-EPC, idatha ye-serial, amaphasiwedi kanye nokukhiya okuqondene ne-chip. Izikhiya ezihlala njalo kufanele zisetshenziswe kuphela ngemva kokuqinisekiswa kokugcina kwedatha ngoba ngeke zikwazi ukuhlehliswa.
Ama-inlay amanzi ahlanganisa okunamathelayo kanye nomugqa wokukhulula, okuwenza afanelekele ukuguqulwa kwelebula okwengeziwe. I-adhesive kufanele ihambisane ne-paperboard, ingilazi, ipulasitiki, indwangu, indawo ependiwe noma ezinye izinto zokusebenza.
Iphepha, i-PET, i-PP noma enye into yobuso ingenziwa i-laminated ngaphezu kwe-inlay ukuze idale ilebula ephrintiwe ye-flexographic, digital, thermal-transfer, direct-thermal noma ukuphrinta kwe-UV.
Izingqimba ezimanzi zivame ukulethwa kumaroli ukuze aguqulelwe, abhalwe ngekhodi, aphrinte noma asetshenziswe ngokuzenzakalelayo. Usayizi oyinhloko, ububanzi bewebhu, iphimbo kanye nesiqondiso esimazombezombe kufanele kufane nezinto zokusebenza ezansi nomfula.
Amandla okunamathela nokusebenza kwe-RF kufanele kuhlolwe emkhiqizweni wangempela. Insimbi, uketshezi, ipulasitiki egcwele ikhabhoni, ukupakisha okuminyene kanye nezindawo ezigobile kungashintsha ukusebenza kwe-inlay.
Ama-inlay omile angahlanganiswa nezakhiwo ze-PVC, i-PET noma i-polycarbonate-smart-card lapho ubukhulu be-antenna, indawo ye-chip, ukujiya okuphelele kanye nezinga lokushisa lokukhanya kuhambisana nomklamo wekhadi.
Ama-inlays okomile angagqunywa noma afakwe amabhande ezihlakala, ama-key fobs, amathikithi, amabheji nemikhiqizo ebunjiwe kusetshenziswa ukwakhiwa okuvikela i-chip futhi kugcine ukulungiswa kwe-antenna.
Izendlalelo zekhava, izinto ezinamathelayo, amapulasitiki, oyinki bokuphrinta, izingxenye zensimbi nokuqukethwe komkhiqizo kungase kukhiphe uthi. Hlola umkhiqizo oqediwe kunokuthembela kuphela kumphumela we-inlay womoya wamahhala.
Ama-inlays omile angaxoxwa ngefomu le-roll noma leshidi ngokuya nge-lamination, cutting, punching noma inqubo yokuhlanganisa umkhiqizo.
Ubukhulu be-antenna bunquma izici ze-RF, kuyilapho ubukhulu be-inlay noma i-die-cut bunquma indawo yenkampani yenethiwekhi edingwa yinqubo yokuguqula noma yokushumeka. Kokubili kufanele kuvele emdwebeni ogunyaziwe.
Cacisa ububanzi bangaphakathi obuwumongo, ubukhulu bobukhulu bedayamitha yangaphandle, ububanzi bewebhu kanye nenani lama-inlay ngomqulu ngamunye ukuze okokusebenza kulingane nomshini wekhasimende.
Iphimbo, isiqondiso sewebhu, umumo we-chip, ukuma kwe-web enqamulayo kanye nokujika kwangaphakathi noma ngaphandle kufanele kufane nokuguqula, ukubhala ngekhodi noma inqubo yohlelo lokusebenza.
Amashidi okufakwayo okomile adinga i-matrix egunyaziwe ebonisa ukuma kwe-antenna, ukuma kwe-chip, ubukhulu beshidi, izimpawu zokubhalisa nokuhambisana nesakhiwo sokugcina sokubhoboza ikhadi.
Chaza ukuthi ama-inlay anesici asusiwe, amakwa noma ayagcinwa futhi uthole inani eliphakeme leziqephu ngomqulu ngamunye. Imigqa yokukhiqiza ezenzakalelayo ingase idinge izilawuli eziqinile zokuqhubeka.
Ukufakwa okumanzi kwe-UHF namalebula aguquliwe angakwazi ukusekela ukuhlonza izinga lezinto, ukubalwa kwesitoko, ukwamukela, ukugcwaliswa kabusha kanye nokubonakala kwe-supply-chain lapho kusetshenziswa abafundi abafanelekile nesofthiwe.
Amalebula e-RFID angakwazi ukuhlonza amabhokisi, ama-tote, amaphasela, iziqukathi ezisebenziseka kabusha kanye nezimpahla ze-warehouse. I-antenna nokubekwa kufanele kufane nephakheji langempela nokuqukethwe.
Ama-inlay amanzi e-NFC angaguqulwa abe izitika ezixhuma ama-smartphone ahambisanayo nolwazi lomkhiqizo, iziqinisekiso, iziqondiso, izinyuso noma izinsiza zokuqinisekisa.
Ama-inlays omile we-HF angafakwa ku-laminated ukufinyelela, ubulungu, ikhempasi, amakhadi ehhotela noma ezokuthutha lapho chip, uthi lwe-antenna kanye nesakhiwo sekhadi kufana nohlelo lokufunda oluhlosiwe.
Amalebula e-ISO/IEC 15693 HF angasekela umtapo wezincwadi ohambisanayo, amadokhumenti kanye nokuhamba komsebenzi kungobo yomlando ngokuya ngomfundi, ifomethi yedatha kanye nezidingo zokubekwa.
Ama-inlay angahlanganiswa abe amathikithi, amabheji namabhande asehlakaleni ukuze akhonjwe, afinyeleleke futhi azibandakanye. Inkumbulo ye-chip, ukuphepha nemijikelezo yokufunda kufanele kukhethwe ingxenyekazi yomcimbi.
I-RFID ingakwazi ukusekela amathuluzi, okokusebenza kanye nempahla engashintshi, kodwa izindawo ezinokhahlo, izindawo zensimbi, amakhemikhali nezinga lokushisa eliphakeme kungase kudinge umaka oqediwe okhethekile kunokufakwa okujwayelekile.
I-inlay emanzi, inlay eyomile noma imfuneko yelebula eqediwe ye-RFID
Isicelo kanye nomsebenzi webhizinisi ohlosiwe
HF/NFC 13.56MHz noma UHF 860–960MHz
Iphrothokholi edingekayo kanye ne-chip ekhethwayo
Isifundi, isifaki khodi, i-smartphone noma imodeli yesistimu yekhadi
Izinto ezimakiwe, okuqukethwe komkhiqizo nendawo yokukhweza
Ibanga lokufunda okuqondisiwe, umumo nezimo zendawo yokufunda
Ubukhulu be-antenna, ubukhulu be-inlay kanye nelebula lokugcina noma isakhiwo sekhadi
I-Adhesive, i-face material, i-liner kanye nezidingo zemvelo
Umbhalo wekhodi, amaphasiwedi, ukufanisa i-UID/TID/EPC nezidingo zokuphrinta
I-Roll core, ububanzi bewebhu, ukuphakama, isiqondiso esijikajikayo noma i-matrix yeshidi
Oda inani, amasampula, indawo kanye nohlelo oludingekayo
Thumela imininingwane yakho ye-Inlay
Ikhasi lomthombo lithi ama-inlay ahlolwa ngokugcwele ngogesi nokubonwayo. Ukucaciswa kwe-oda kufanele kuchaze indlela yokuhlola, izinga lokwamukela, ukuphathwa kwe-inlay okunephutha kanye namarekhodi okuhlola adingwa umthengi.
Hlola i-inlay ngomfundi ohlosiwe, amandla, uthi, into emakiwe, umumo nendawo. Ibanga lokufunda elingenamoya aliqinisekisi ukusebenza okufanayo ngemva kokuguqulwa kwelebula noma ukukhishwa kwekhadi.
Amasampula okufakwe emanzini okumanzi kufanele ahlolelwe ukukhishwa, ukuthakwa, ukucwecwa, ukusikwa kwefa, ukuhlubula i-matrix, ukuphakelwa kwamaroli kanye nokuhambisana nempahla yobuso nendawo esetshenziswayo.
Ama-inlay omile kufanele ahlolwe ngenqubo egcwele yokucwenga noma yokubumba ukuze kuphile i-chip, ukuxhunywa kwezinti, ukubhaliswa, ukucaba kanye nokusebenza kokufunda ngemva kwenqubo.
I-UID efakwe ikhodi, i-TID, i-EPC, i-NDEF, amaphasiwedi nedatha yekhasimende kufanele ifundwe futhi iqhathaniswe nefayela ledatha eligunyaziwe. Ulwazi oluhlukile oluphrintiwe kufanele luhlale lufana namarekhodi e-elekthronikhi.
Qinisekisa ukubala, ukuphakama, ukuqondanisa kwewebhu, indawo ejikajikayo, umongo, izingxenye, ukumaka umaka omubi, ukwakheka kweshidi nokupakishwa kokuvikela ngaphambi kokuthunyelwa.
Abathengi bangathola ama-inlay anamathelayo amanzi, amalebula okomile ukuze ashumekwe namalebula aguquliwe ukuze aphrintwe okokugcina noma afakwe ngokugeleza komsebenzi wephrojekthi eyodwa.
U-Wallis angaxoxa nge-ISO/IEC 14443, ISO/IEC 15693 kanye nemikhiqizo ye-EPC Gen2 kumabanga ahlukene okufunda, abafundi, inkumbulo nezidingo zohlelo lokusebenza.
Ubukhulu be-antenna, usayizi we-inlay, imininingwane yomqulu, omatikuletsheni beshidi, okunamathelayo kanye nesakhiwo sokugcina sokuhlanganisa kungabuyekezwa ngokuya ngemishini yekhasimende.
I-NDEF, i-EPC, idatha ye-serial, amaphasiwedi, ukufundwa kwe-UID/TID, amakhodi e-QR, amabhakhodi nokufanisa amarekhodi kungaxoxwa ngokuvumelana ne-chip ekhethiwe.
Ukuhlolwa kwesampula kunciphisa ubungozi bokungahambelani komfundi, ukunamathela okubuthakathaka, ukwakheka kweroli okungafanelekile, ukukhipha izinti noma ukwehluleka ngesikhathi sokukhishwa kwekhadi.

Cela amasampula kanye nentengo ye-Wholesale
I-inlay emanzi ihlanganisa okunamathelayo okuzwela ukucindezela kanye nomugqa wokukhulula. I-inlay eyomile inikezwa ngaphandle kokwakhiwa kwelebula yokugcina yokuzinamathisela futhi ihloselwe ukushumeka, ukucwiliswa noma ukuguqulwa okuqhubekayo.
Akunjalo. Ilebula eqediwe ngokuvamile yengeza okokusebenza kobuso obuphrintekayo, okunamathelayo okuqondene nohlelo lokusebenza, ukusika kwefa kokugcina, ukucaciswa kokuphrinta kanye nomqulu ngenhla kwe-RFID inlay.
Yebo, lapho uthi, umthwali, indawo ye-chip, izinga lokushisa lokukhanya, ukujiya okuphelele kanye nokwakheka kwekhadi kudizayinelwe inlay ekhethiwe. Kunconywa ukuhlolwa kwesampula ye-lamination.
Yebo. Izinketho ezitholakalayo zeleveli yekhasi zifaka i-13.56MHz ISO/IEC 14443, 13.56MHz ISO/IEC 15693 kanye nemikhiqizo ye-UHF. I-chip ngqo kanye nothi kufanele kuqinisekiswe.
Ama-inlay e-HF ngokuvamile afundwa ebangeni elifushane, kuyilapho okufakwe ngaphakathi kwe-UHF kungase kufundeke ukusuka ebangeni elifushane ukuya kumamitha ambalwa. Umphumela wokugcina uncike ku-chip, uthi, umfundi, isifunda, impahla, umumo nokuhlanganiswa.
Umkhiqizo oklanywe ngokukhethekile we-dual-frequency kuphela osekela kokubili ukuxhumana. Ukufakwa kwe-NFC okujwayelekile kanye nokufaka kwe-UHF okujwayelekile kuyimikhiqizo ehlukene.
Zingaguqulwa ngephepha elifanele noma izinto zokwenziwa zobuso zokuphrinta. Cacisa ubuchwepheshe bephrinta, uyinki noma iribhoni, indawo yelebula kanye nemfuneko yokuqina.
I-antenna yangokwezifiso nobukhulu be-inlay bungabuyekezwa ngokuya nge-chip impedance, ukusebenza okudingekayo kokufunda, indawo etholakalayo, izinto ezimakiwe kanye nevolumu ye-oda.
Izinketho zingabandakanya i-NTAG, MIFARE, DESFire, ICODE, F08, NXP UCODE, Impinj noma imindeni yama-alien. Ukutholakala nokufaneleka kufanele kuqinisekiswe kuphrojekthi ethile.
Izinsizakalo zombhalo wekhodi nezokubhala idatha zingaxoxwa ngokuya nge-chip. I-UID ingase isethwe njengasekuqaleni, kuyilapho i-EPC, i-NDEF, amaphasiwedi nedatha yomsebenzisi ingase ihleleke kuye ngomkhiqizo.
Yebo. Ama-inlay amanzi avame ukunikezwa ngama-roll, kanti ama-inlays omile anganikezwa ngama-roll noma amashidi ngokuya ngenqubo yokuguqula noma yokukhishwa kwekhadi.
Ikhasi lomthombo lithi amasampuli ayatholakala futhi ukuthunyelwa kukhokhwa yikhasimende. Qinisekisa i-chip, uthi, kanye nemibandela yesampula nge-Wallis ngaphambi kokuthunyelwa.
Ikhasi lomthombo libala cishe izinsuku ezi-3–7 zamasampula kanye nezinsuku eziyi-10–20 zokukhiqiza ngobuningi, kuye ngokwenza ngokwezifiso. Qinisekisa ishejuli yamanje uma ucela ikhotheshini.
Ikhasi lomthombo lithi ukuhlolwa kukagesi nokuhlolwa okubukwayo kuyenziwa. Abathengi kufanele bachaze noma iyiphi i-RF eyengeziwe, i-encoding, roll, lamination noma izimfuneko zokulandeleka ekucacisweni kokuthenga.
Thumela uhlobo lwe-inlay, imvamisa, iphrothokholi, i-chip, umfundi, impahla yohlelo lokusebenza, ibanga eliqondiwe, uthi lwezimpondo kanye nosayizi we-inlay, ifomethi yomqulu noma weshidi, umbhalo wekhodi, ubuningi, ukupakishwa nendawo oya kuyo.
Qala Iphrojekthi Yakho nathi