Wholesale HF / NFC ne UHF RFID nsu anaa dry inlays ne amanne chips, antennas, roll anaa krataa formats, encoding ne label nsakrae ma cards, retail, logistics, packaging ne agyapade tracking wiase nyinaa.
Inlay/ Prelam a wɔde hyɛ mu
Wallis na ɔkyerɛwee
| Mpɛn dodow a wɔhwehwɛ: | |
|---|---|
| Ne kɛse: | |
| Nea ɛwɔ hɔ: | |
| Dodow: | |
Wallis de RFID wet inlays, dry inlays ne converted label tags ma smart-card a ɛyɛ kɛse, aguadidan, nneɛma a wɔde kɔ, nneɛma a wɔde kyekyere nneɛma, nhomakorabea, adeyɛ, agyapade-di akyi ne nneɛma a wɔde hu adwuma. Mfiridwuma a ɛwɔ hɔ no bi ne 13.56MHz HF/NFC ne 860–960MHz UHF RAIN RFID.
Wet inlays no bi ne pressure-sensitive adhesive ne release liner a wɔde dannan label anaasɛ ɛne no hyia tẽẽ de di dwuma. Dry inlays kura chip-ne-antenna nhyiamu wɔ carrier a enni adhesive adansiɛ a ɛtwa toɔ na wɔayɛ sɛ wɔde bɛkɔ so adan, embedding, lamination anaa integration akɔ ade foforɔ mu.
Adetɔfo betumi ayɛ chip, protocol, antenna nsusuwii, inlay nsusuwii, adhesive, roll anaa krataa format, encoding, bad-tag agyiraehyɛde, winding akwankyerɛ ne packaging. Ɛsɛ sɛ wɔma RF adwumayɛ a etwa to no yɛ nokware wɔ application material ankasa ne akenkanfo nhyehyɛe no so.
Bisa RFID Inlay Quote a Wɔtɔn no Kɛse
| Nkyerɛkyerɛmu | Wet Inlay | Dry Inlay |
|---|---|---|
| Nhyehyɛeɛ | RFID chip + etched antenna + carrier + nhyɛso-te nka adhesive + gyae liner | RFID chip + etched antenna wɔ PET anaasɛ carrier foforo a wɔapene so, a enni adhesive a etwa to ne liner |
| Mpɛn dodow a Wɔpaw | 13.56MHz HF/NFC anaa 860–960MHz UHF na ɛyɛ adwuma | 13.56MHz HF/NFC anaa 860–960MHz UHF na ɛyɛ adwuma |
| Protocol a Wɔpaw | ISO/IEC 14443 Ɔkwan A, ISO/IEC 15693, NFC Nhyiam ahorow anaa EPC Adesuakuw 1 Gen 2 / ISO/IEC 18000-63 | Wɔapaw sɛnea chip ne nea etwa to a wɔde ahyɛ mu no te |
| HF/NFC Chip Nhwɛsode ahorow | NTAG213/215/216, MIFARE Ultralight, MIFARE Classic, DESFire, ICODE, F08 ne nneɛma afoforo a ɛne no hyia | Wobetumi aka chip mmusua koro no ara ho asɛm bere a ɛfata ma nkabom nhyehyɛe a etwa to no |
| UHF Chip Nhwɛsode ahorow | NXP UCODE, Impinj M730/M750 anaa Monza mmusua, Alien Higgs ne adwuma pɔtee bi a wobetumi apaw | Wɔapaw sɛnea EPC/TID nkae, nkate, akenkanfo tebea ne antenna nhyehyɛe a etwa to te |
| Antenna Nneɛma a Wɔde Yɛ Adwuma | Aluminium anaa kɔbere a wɔakyerɛw so | Aluminium anaa kɔbere a wɔakyerɛw so |
| Ɔsoafoɔ | PET anaasɛ adwumakuw foforo a wɔapene so sɛ wɔde fa nneɛma | PET anaasɛ carrier foforo a wɔapaw ama lamination anaa embedding |
| Ɔkwan a Wɔtaa De De Kɔma | Roll format ma label nsakrae ne automated application | Roll anaa sheet format sɛnea card, tag anaa product-embedding nhyehyɛe no te |
| Nneɛma a wɔyɛ no sɛnea wɔpɛ | Chip, antenna, adhesive, die-cut kɛse, roll specification, encoding ne label nsakrae | Chip, antenna, carrier, krataa anaa roll format, lamination gyinabea ne nkabom nhyehyɛe |
| Nnwuma a Wɔtaa De Di Dwuma | RFID nkyerɛwde, NFC sticker, retail tags, cartons, agyapade, tekiti ne smart packaging | PVC/PET/PC smart cards, wristbands, tekiti, nneɛma a wɔayɛ ne amanne kwan so embedded transponders |
Kratafa-level frequency options no bi ne 869–915MHz UHF, 13.56MHz ISO/IEC 14443 ne 13.56MHz ISO/IEC 15693. Ɛsɛ sɛ wɔsi chip pɔtee, ɔmantam UHF band, antenna ne adansi a wɔawie no so dua ansa na wɔafa asɛm aka.
| Ntotoho | Wet Inlay | Dry Inlay | a wɔadan no RFID Label |
|---|---|---|---|
| Ade a wɔde kyekyere nneɛma ho | Nea ɛka ho | Ɛnyɛ nea ɛka akwammisa nhyehyɛe a etwa to no ho | Adhesive a wɔde di dwuma pɔtee a wɔapaw ama nea wɔakyerɛw so no |
| Gyae Liner no | Nea ɛka ho | Mpɛn pii no wɔmfa mma sɛ ɔdansi a etwa to a ɛde ne ho bata ho | Wɔde ka ho sɛnea nsakrae ne nea wɔde ma no te |
| Anim Stock a Wotumi Print | Mpɛn pii no, ɛhwehwɛ sɛ wɔsakra no bio ma label a wɔawie a wotumi tintim | Wɔde ka ho bere a wɔde embedding anaa conversion sɛ ɛho hia a | Krataa, PET, PP anaa ade foforo a wɔapene so a wobetumi atintim |
| Adetɔfo a Wɔtaa Yɛ | Label converter, adwumakuw a wɔde nneɛma gu mu anaa RFID integrator | Kaad yɛfo, nea ɔde nneɛma bom anaasɛ nea ɔyɛ ahyɛnsode a wɔahyɛ da ayɛ | Adetɔnfo, brand, adekoradan, logistics operator anaa nhyehyɛe a wɔde di dwuma awiei |
| Nea Wɔde Di Dwuma Titiriw | Nsakrae foforo anaasɛ ɛne application tẽẽ a ɛne no hyia | Lamination, encapsulation anaa ade a wɔde hyɛ mu | Printing, encoding ne nea etwa to a wɔde bata ade bi ho |
| Nneɛma a Atwa Yɛn Ho Ahyia Ho Banbɔ | Egyina soafo, adhesive ne awiei koraa nsakrae adansi | Egyina encapsulating anaa laminating nneɛma so | Wɔkyerɛkyerɛ mu denam anim stock a edi mũ, adhesive, coating, lamination ne edge design |
Wet inlays fata bere a adetɔfo hia RFID fã a ɛde ne ho bata ho ma wɔde ka ho ne krataa anaa synthetic face stock, tintim, die cutting ne final roll conversion.
Dry inlays fata bere a wɔde RFID fã no bɛbɔ kaad mu, de ahyɛ ade a wɔayɛ mu, de ahyɛ nsateaa mu anaasɛ wɔde ahyɛ ɔdan foforo mu a enni standard label adhesive.
Wɔpɛ label a wɔasakra no bere a adetɔfo no hia ade a wɔasiesie sɛ wobetintim anaasɛ wɔadi kan atintim a wɔawie anim ade a etwa to, adhesive, die cut, encoding ne roll specification dedaw.
| Ntotoho | HF / NFC Inlay | UHF Inlay |
|---|---|---|
| Mpɛn dodoɔ | 13.56MHz na ɛwɔ hɔ | 860–960MHz a ɔmantam tuning ho nsusuwii |
| Protocols a Wɔtaa De Di Dwuma | ISO/IEC 14443 Ɔkwan A, ISO/IEC 15693 ne NFC Nhyiamu ahodoɔ | EPC Adesuakuw 1 Gen 2 / ISO/IEC 18000-63 |
| Akenkan Suban a Wɔtaa Yɛ | Tap a ɛkɔ akyirikyiri anaa akenkan a ɛbɛn | Short range to mita pii sɛnea antenna, akenkanfo, nneɛma ne nneɛma a atwa yɛn ho ahyia te |
| Smartphone a Wɔde Di Dwuma | Ɛbɛyɛ yie ne NFC chips a ɛfata ne fon suban a wɔboa | Mpɛn pii no, ɛhwehwɛ sɛ wonya UHF akenkanfo a wɔatu wɔn ho ama |
| Nnwuma a Wɔtaa De Di Dwuma | NFC nkitahodi, nhomakorabea ahorow, nokwaredi, tekiti, kaad ne kwan tiaa so nkyerɛkyerɛmu | Ntade, nneɛma a wɔakora so, nneɛma a wɔde kɔ, nnaka, agyapade ne akenkan a wɔkenkan no pii |
| Nsɛmfua a Wɔde Kae | Chip UID, ɔdefoɔ memory, nkratafa, blocks, passwords ne ahobanbɔ nneɛma | EPC, TID, reserved memory ne nea ɔde di dwuma no nkae a wopɛ |
Inlays a ɛyɛ adwuma wɔ frequency koro mu no betumi de protocol ahorow, chip ahyɛde ahorow, memory nhyehyɛe ne ahobammɔ dwumadi ahorow adi dwuma. Fa akenkanfo, chip anaa protocol a wɔhwehwɛ no ma sen sɛ wobɛpaw denam frequency nkutoo so.
Ebia HF inlays akenkan wɔ sɛntimita kakraa bi mu, bere a UHF inlays a ɛfata betumi adu mita pii. Adwumayɛ a etwa to no gyina chip, antenna, akenkanfo tumi, ɔmantam band, tagged nneɛma, orientation ne integration so.
Ɛsɛ sɛ wɔpaw antena no ma baabi a wɔpɛ sɛ wɔkɔ ne akenkanfo tebea. Ebia ade a wɔayɛ no yiye ama UHF mantam biako no remma adwumayɛ koro no ara wɔ foforo mu.
Wɔtaa paw saa NFC Forum Type 2 chips yi ma URL, dijitaal profile, nneɛma ho nsɛm ne adetɔfo nkitahodi. Wɔma user-memory capacities soronko, enti ɛsɛ sɛ wɔsi encoded NDEF content no so dua ansa na wɔapaw chip.
Ebia wɔbɛhia MIFARE Classic, Ultralight anaa DESFire nneɛma ama kwan a wɔfa so kɔ, asɔremma, akwantuo, nhyiamu anaa smart-card nhyehyɛeɛ a ɛyɛ den. Ɛsɛ sɛ akenkanfo, application, keys ne software no hyia chip abusua no pɛpɛɛpɛ.
ICODE inlays betumi aboa nhomakorabea, agyapade ne mpɔtam-kaad dwumadie a ɛne no hyia. Ɛnsɛ sɛ wɔfa no sɛ wɔne ISO/IEC 14443 akenkanfo biara yɛ adwuma.
Ɛsɛ sɛ UHF chip paw susuw EPC memory, TID ahwehwɛde, ɔdefo memory a ɔpɛ, nkate, access anaa kill passwords ne compatability ne akenkanfo ne software platform.
HF/NFC nneɛma betumi ada chip UID adi, bere a UHF nneɛma taa kura adwumayɛbea TID ne EPC memory a wotumi yɛ ho nhyehyɛe. Kyerɛ identifier a ɛsɛ sɛ wɔkenkan, encode, tintim anaa ɛne adetɔfo database no hyia.
Nnwuma betumi ayɛ NDEF URL kyerɛw, EPC encoding, serial data, password ne chip-specific locking. Ɛsɛ sɛ wɔde apon a ɛtra hɔ daa di dwuma bere a wɔadi data ho adanse a etwa to akyi nkutoo efisɛ ebia wɔrentumi nsan.
Nneɛma a wɔde hyɛ mu a ɛyɛ nsu no bi ne ade a wɔde nkata so ne ade a wɔde gyae nneɛma, na ɛma ɛfata sɛ wɔsakra nkyerɛwde no bio. Ɛsɛ sɛ wɔde ade a wɔde nkata so no hyia krataa, ahwehwɛ, plastic, ntama, nneɛma a wɔayɛ ho adwini anaa nneɛma afoforo a wɔde di dwuma.
Wobetumi de krataa, PET, PP anaa anim ade foforo bi ayɛ laminated wɔ inlay no atifi de ayɛ label a wotumi tintim ama flexographic, digital, thermal-transfer, direct-thermal anaa UV tintim.
Wɔtaa de wet inlays kɔ rolls so de dannan, encoding, tintim anaasɛ automatic application. Ɛsɛ sɛ core size, web width, pitch ne winding direction ne nnwinnadeɛ a ɛwɔ aseɛ no hyia.
Ɛsɛ sɛ wɔsɔ adhesive ahoɔden ne RF adwumayɛ hwɛ wɔ ade ankasa no so. Dade, nsu, plastic a carbon ahyɛ mu ma, dense stacking ne curved surfaces betumi asesa inlay adwumayɛ.
Dry inlays betumi ayɛ biako wɔ PVC, PET anaa polycarbonate smart-card nhyehyɛe mu bere a antenna nsusuwii, chip gyinabea, ne nyinaa kɛse ne lamination ɔhyew ne card nhyehyɛe no hyia.
Wobetumi de dry inlays ahyɛ mu anaasɛ wɔde abɔ nsateaa, key fobs, tekiti, badge ne nneɛma a wɔanwene mu denam adansi a ɛbɔ chip no ho ban na ɛkura antenna tuning mu.
Nneɛma a wɔde kata so, nneɛma a wɔde nkata so, plastic, ink a wɔde tintim nhoma, dade afã horow ne nneɛma a wɔde yɛ nneɛma no betumi ayɛ antenna no detune. Sɔ ade a wɔawie no hwɛ sen sɛ wode wo ho bɛto nea efi free-air inlay mu aba no nkutoo so.
Dry inlays betumi asusuw ho wɔ roll anaa krataa kwan so sɛnea lamination, twa, punching anaa product-assembly nhyehyɛe.
Antenna nsusuiɛ na ɛkyerɛ RF su, berɛ a inlay anaa die-cut nsusuiɛ kyerɛ carrier area a ɛhia wɔ converting anaa embedding nhyehyɛeɛ no mu. Ɛsɛ sɛ abien no nyinaa pue wɔ mfonini a wɔapene so no so.
Kyerɛ core mu diameter, maximum roll outer diameter, web width ne inlays dodow wɔ roll biara mu sɛnea ɛbɛyɛ a nneɛma no bɛfata customer no afiri.
Ɛsɛ sɛ ɛnne nnyigyei, wɛb akwankyerɛ, chip kwankyerɛ, cross-web gyinabea ne mu- anaa akyi-winding ne nsakrae, encoding anaa application nhyehyɛe no hyia.
Dry inlay sheets hwehwɛ matrix a wɔapene so a ɛkyerɛ antenna gyinabea, chip orientation, krataa no nsusuwii, registration marks ne nea ɛne card punching nhyehyɛe a etwa to no hyia.
Kyerɛkyerɛ sɛ ebia woyi inlays a asɛe no, wɔhyɛ no agyirae anaasɛ wɔkora so na fa splices dodow a ɛsen biara wɔ roll biara mu si hɔ. Ebia nhama a wɔde yɛ nneɛma a wɔde wɔn ankasa yɛ no behia sɛ wɔhwɛ roll-continuity so katee.
UHF wet inlays ne converted labels betumi aboa item-level identification, stock counting, receiving, replenishment ne supply-chain visibility bere a wɔde di dwuma ne akenkanfo ne softwea a ɛfata.
RFID nkyerɛwde tumi kyerɛ nnaka, totes, parcels, nsukorade a wotumi de di dwuma bio ne adekoradan mu agyapade. Ɛsɛ sɛ antena no ne nea wɔde besi hɔ no fata wɔ package ankasa ne emu nsɛm no so.
Wobetumi adan NFC wet inlays ayɛ no sticker a ɛde smartphones a ɛne no hyia bata nneɛma ho nsɛm, warranty, akwankyerɛ, nsɛm a wɔde hyɛ nkurɔfo nkuran anaa nokwaredi nnwuma ho.
HF dry inlays betumi ayɛ laminated mu access, membership, campus, hotel anaa transport cards bere a chip, antenna ne card nhyehyɛe no hyia akenkanfo nhyehyɛe a wɔahyɛ da ayɛ no.
ISO/IEC 15693 HF labels tumi boa nwomakorabea, nwoma ne archive adwumayɛ nhyehyɛeɛ a ɛne no hyia sɛdeɛ akenkanfoɔ, data-format ne placement ahwehwɛdeɛ teɛ.
Wobetumi de inlays ahyɛ tekiti, badge ne wristbands mu de ahu, akɔ mu na wɔde wɔn ho ahyɛ mu. Ɛsɛ sɛ wɔpaw chip memory, security ne read cycles ma event platform no.
RFID betumi aboa nnwinnade, nnwinnade ne agyapade a enni hɔ, nanso mmeae a ɛyɛ den, dade a ɛwɔ soro, nnuru ne ɔhyew a ɛkɔ soro betumi ahwehwɛ sɛ wɔde tag soronko bi a wɔawie sen sɛ wɔde inlay a ɛyɛ gyinapɛn bedi dwuma.
Wet inlay, dry inlay anaa awie RFID label ahwehwɛde
Application ne adwumayɛ dwumadi a wɔahyɛ da ayɛ
HF/NFC 13.56MHz anaa UHF 860–960MHz na ɛyɛ adwuma
Protocol a wɔhwehwɛ ne chip a wɔpɛ
Ɔkenkanfo, encoder, smartphone anaa kaad-nhyehyɛe nhwɛsode
Tagged nneɛma, nneɛma a ɛwɔ mu ne mounting tebea
Target akenkan kwan, kwankyerɛ ne akenkan-beae tebea
Antenna nsusuwii, inlay nsusuwii ne label anaa card nhyehyɛe a etwa to
Adhesive, anim nneɛma, liner ne nneɛma a atwa yɛn ho ahyia ahwehwɛde
Encoding, passwords, UID/TID/EPC a ɛne ne ho hyia ne tintim ahwehwɛde
Roll core, web trɛw, pitch, winding akwankyerɛ anaa krataa matrix
Order dodow, nhwɛsode, baabi a wɔrekɔ ne nhyehyɛe a wɔhwehwɛ
Fa Wo Inlay Specification no mena
Fibea kratafa no ka sɛ inlays fa anyinam ahoɔden ne aniwa nhwehwɛmu a edi mũ. Ɛsɛ sɛ ahyɛde ho nkyerɛkyerɛmu no kyerɛkyerɛ sɔhwɛ kwan, gye a wogye tom gyinapɛn, defective-inlay handling ne nhwehwɛmu kyerɛwtohɔ a adetɔfo no hwehwɛ.
Sɔ inlay no hwɛ ne akenkanfo a wɔahyɛ da ayɛ, tumi, antenna, ade a wɔahyɛ no agyirae, orientation ne nneɛma a atwa yɛn ho ahyia. Free-air read distance nkyerɛ sɛ adwumayɛ yɛ pɛ wɔ label nsakrae anaa card lamination akyi.
Ɛsɛ sɛ wɔsɔ wet inlay samples hwɛ sɛ wɔayiyi, tack, peel, die cutting, matrix stripping, roll feeding na ɛne anim nneɛma ne application surface hyia.
Ɛsɛ sɛ wɔsɔ dry inlays hwɛ denam lamination anaa molding nhyehyɛe a edi mũ no so ma chip nkwa, antenna nkitahodi, dinkyerɛw, flatness ne post-process akenkan adwumayɛ.
Ɛsɛ sɛ wɔkenkan UID, TID, EPC, NDEF, passwords ne customer data a wɔakyerɛw no bio na wɔde toto data fael a wɔapene so no ho. Ɛsɛ sɛ nsɛm a ɛsakra a wɔatintim kɔ so ne ɛlɛtrɔnik kyerɛwtohɔ ahorow hyia.
Hwɛ sɛnea dodow, ɛnne nnyigyei, wɛb a ɛne ne ho hyia, winding akwankyerɛ, core, splices, bad-tag agyiraehyɛde, krataa nhyehyɛe ne ahobammɔ packaging ansa na wode amena.
Adetɔfoɔ bɛtumi anya adhesive wet inlays, dry inlays a wɔde bɛhyɛ mu ne labels a wɔadan no ama tintim anaa dwumadie a ɛtwa toɔ denam adwuma no adwumayɛ kwan baako so.
Wallis betumi aka ISO/IEC 14443, ISO/IEC 15693 ne EPC Gen2 nneɛma ho asɛm ama akenkan ahodoɔ, akenkanfoɔ, nkaeɛ ne dwumadie ahwehwɛdeɛ.
Antenna nsusuwii, inlay kɛse, roll specifications, krataa matrices, adhesive ne awiei nkabom nhyehyɛe betumi ahwɛ sɛnea adetɔfo no nnwinnade.
Wobetumi aka NDEF, EPC, serial data, passwords, UID/TID akenkan, QR codes, barcodes ne record matching ho asɛm sɛnea chip a wɔapaw no kyerɛ.
Nhwɛsoɔ sɔhwɛ brɛ asiane a ɛwɔ hɔ sɛ akenkanfoɔ no nhyia, adhesive a ɛyɛ mmerɛ, roll layout a ɛmfata, antenna detuning anaa huammɔdi berɛ a card lamination no so tew.

Nea ɛka ade a wɔde hyɛ mu a ɛyɛ nsu ho ne ade a wɔde nkata so a ɛyɛ nhyɛso ne ade a wɔde gyae nneɛma. Wɔde dry inlay ma a enni awieɛ self-adhesive label construction na wɔayɛ ama embedding, lamination anaa foforɔ nsakraeɛ.
Ɛnyɛ nea ɛho hia ankasa. Label a wɔawie no taa de anim ade a wotumi tintim, application-specific adhesive, die cut a etwa to, printing ne roll specification ka ho wɔ RFID inlay no atifi.
Yiw, bere a wɔayɛ antenna, carrier, chip gyinabea, lamination temperature, total thickness ne card nhyehyɛe ama inlay a wɔapaw no. Wɔkamfo kyerɛ sɛ wɔnyɛ nhwɛsode lamination sɔhwɛ.
Aane. Kratafa-gyinabea akwan a ɛwɔ hɔ no bi ne 13.56MHz ISO/IEC 14443, 13.56MHz ISO/IEC 15693 ne UHF nneɛma. Ɛsɛ sɛ wosi chip ne antenna no pɔtee so dua.
Wɔtaa kenkan HF inlays wɔ akyirikyiri, bere a UHF inlays betumi akenkan afi akyirikyiri akosi mita pii. Nea etwa to a ebefi mu aba no gyina chip, antenna, akenkanfo, ɔmantam, nneɛma, kwankyerɛ ne nkabom so.
Dual-frequency product a wɔayɛ no pɔtee nkutoo na ɛboa interface abien no nyinaa. NFC inlay a ɛyɛ gyinapɛn ne UHF inlay a ɛyɛ gyinapɛn yɛ nneɛma ahorow.
Wobetumi de krataa anaa anim ade a ɛfata a wɔde tintim nhoma adannan. Kyerɛ printa mfiridwuma, ink anaa ribbon, label surface ne durability ahwehwɛde.
Custom antenna ne inlay dimensions betumi ahwɛ sɛnea chip impedance, ahwehwɛde akenkan adwumayɛ, beae a ɛwɔ hɔ, tagged nneɛma ne order volume.
Nneɛma a wobɛpaw no betumi ayɛ NTAG, MIFARE, DESFire, ICODE, F08, NXP UCODE, Impinj anaa Alien mmusua. Ɛsɛ sɛ wosi so dua sɛ ɛwɔ hɔ na ɛfata ma adwuma pɔtee no.
Wobetumi aka encoding ne data-writing services ho asɛm sɛnea chip no kyerɛ. UID betumi ayɛ factory-set, bere a EPC, NDEF, passwords ne user data betumi ayɛ nhyehyɛe a egyina ade no so.
Aane. Wɔtaa de inlays a ɛyɛ nsu ma wɔ nhoma mmobɔwee mu, bere a wobetumi de inlays a ɛyɛ dry ama wɔ nhoma mmobɔwee anaa nkratafa mu sɛnea nsakrae anaa kaad-lamination nhyehyɛe no te.
Fibea krataafa no ka sɛ nhwɛsode ahorow wɔ hɔ na adetɔfo no na otua nneɛma a wɔde mena no ho ka. Si chip, antenna ne sample terms no so dua ne Wallis ansa na woasoma.
Fibea krataafa no kyerɛw bɛyɛ nnafua 3–7 ma nhwɛsode ne nnafua 10–20 ma nneɛma a wɔyɛ no pii, a egyina sɛnea wɔayɛ no sɛnea wɔpɛ so. Si nhyehyɛe a ɛwɔ hɔ mprempren no so dua bere a worebisa sɛ wɔmfa sika bi mma no.
Fibea krataafa no ka sɛ wɔyɛ anyinam ahoɔden sɔhwɛ ne aniwa nhwehwɛmu. Ɛsɛ sɛ adetɔfo kyerɛkyerɛ RF, encoding, roll, lamination anaa traceability ahwehwɛde foforo biara mu wɔ adetɔ ho nkyerɛkyerɛmu no mu.
Send inlay type, frequency, protocol, chip, reader, application material, botaeɛ kwan, antenna ne inlay kɛseɛ, roll anaa krataa format, encoding, dodoɔ, packaging ne destination.
Fi Yɛn Dwumadi no ase