Wholesale HF / NFC kple UHF RFID tsi alo ƒuƒu inlays kple custom chips, antennas, agbalẽ xatsaxatsa alo agbalẽ ƒe nɔnɔmewo, encoding kple dzeside tɔtrɔ na kaɖiwo, asitsatsa, ɖoɖowɔwɔ, bablawo kple nunɔamesiwo yometiti le xexeame katã.
Inlay/ Prelam ƒe dɔwɔwɔ
Wallis ye nye esia
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Wallis naa RFID tsi inlays, dry inlays kple converted label tags na high-volume smart-card, asitsaƒewo, nuzazãwo, nubablawo, agbalẽdzraɖoƒe, nudzɔdzɔ, nunɔamesiwo yometiti kple adzɔnuwo-de dzesi dɔwo. Mɔ̃ɖaŋununya siwo li dometɔ aɖewoe nye 13.56MHz HF/NFC kple 860–960MHz UHF RAIN RFID.
Nusiwo wotsɔ ƒoa tsii dometɔ aɖewoe nye nusi wotsɔna léa nu ɖe nu ŋu si te ŋu sea nyaƒoɖeamenu kple nusi ɖea asi le eŋu hena dzesidenu tɔtrɔ alo esi sɔ tẽe. Dry inlays me chip-and-antenna assembly le carrier dzi si me adhesive mamlɛtɔ ƒe wɔwɔme mele o eye woɖoe be woagatrɔ, embedding, lamination alo integration ɖe nu bubu me.
Nuƒlelawo ate ŋu atrɔ asi le chip, ɖoɖowɔɖi, antenna ƒe didime, inlay didime, adhesive, agbalẽ xatsaxatsa alo agbalẽ ƒe nɔnɔme, encoding, bad-tag dzesi, winding mɔfiame kple packaging. Ele be woaɖo kpe RF ƒe dɔwɔwɔ mamlɛtɔ dzi le dɔbiagbalẽvi ŋutɔŋutɔ kple nuxlẽla ƒe ɖoɖoa dzi.
Bia be woawɔ Wholesale RFID Inlay Quote
| Nusiwo woɖe fia | Wet Inlay | Dry Inlay |
|---|---|---|
| Nɔnɔme | RFID chip + etched antenna + carrier + nyaƒoɖeamenu-sesẽ adhesive + asiɖeɖe le liner | RFID chip + etched antenna le PET alo carrier bubu si dzi woda asi ɖo, si me adhesive mamlɛtɔ kple liner manɔmee |
| Tiatia Siwo Woawɔ Zi Edzi | 13.56MHz HF/NFC alo 860–960MHz UHF ƒe ŋusẽ | 13.56MHz HF/NFC alo 860–960MHz UHF ƒe ŋusẽ |
| Protocol ƒe Tiatiawɔblɔɖe | ISO/IEC 14443 Ƒomevi A, ISO/IEC 15693, NFC Nyamedzroƒe ƒomeviwo alo EPC Klass 1 Gen 2 / ISO/IEC 18000-63 | Wotiae le chip kple final embedded product nu |
| HF/NFC Chip ƒe Kpɔɖeŋuwo | NTAG213/215/216, MIFARE Ultralight, MIFARE Classic, DESFire, ICODE, F08 kple tiatia bubu siwo sɔ | Woateŋu aƒo nu tso chip ƒome mawo ke ŋu ne wosɔ na ƒoƒo ɖekae ƒe ɖoɖo mamlɛtɔ |
| UHF Chip ƒe Kpɔɖeŋuwo | NXP UCODE, Impinj M730/M750 alo Monza ƒomewo, Alien Higgs kple dɔa koŋ ƒe tiatia bubuwo | Wotiae le EPC/TID ŋkuɖodzinu, seselelãme, nuxlẽla ƒe nɔnɔme kple antenna mamlɛtɔ ƒe nɔnɔme nu |
| Antenna Nusiwo Wotsɔ Wɔe | Aluminium alo akɔbli si woŋlɔ ɖe edzi | Aluminium alo akɔbli si woŋlɔ ɖe edzi |
| Ame si tsɔa nu | PET alo ʋu bubu si dzi woda asi ɖo be woatsɔe ayi teƒe bubuwo | PET alo agbatsɔla bubu si wotia na lamination alo embedding |
| Mɔnu Siwo Wotsɔna Ðea Nuwoe | Roll format na label tɔtrɔ kple automated dɔwɔwɔ | Roll alo sheet ƒe nɔnɔme le kaɖi, tag alo product-embedding ƒe ɖoɖoa nu |
| Trɔ asi le eŋu | Chip, antenna, adhesive, die-tso lolome, agbalẽ xatsaxatsa ƒe nɔnɔme, encoding kple label tɔtrɔ | Chip, antenna, carrier, agbalẽ alo agbalẽ xatsaxatsa ƒe nɔnɔme, lamination nɔƒe kple ƒoƒo ɖekae ƒe wɔwɔme |
| Dɔwɔwɔ Siwo Wozãna Zi geɖe | RFID ƒe dzesiwo, NFC ƒe nuŋɔŋlɔwo, asitsaƒe ƒe dzesiwo, kakɛwo, nunɔamesiwo, tikitiwo kple nubablɛ siwo me nunya le | PVC/PET/PC smart cards, asibidɛwo, tikitiwo, nusiwo wotsɔ aŋe wɔe kple transponders siwo wotsɔ de eme siwo wowɔ ɖe ɖoɖo nu |
Axa-dzidzenu ƒe ɣeyiɣi ƒe didime tiatiaawo dometɔ aɖewoe nye 869–915MHz UHF, 13.56MHz ISO/IEC 14443 kple 13.56MHz ISO/IEC 15693. Ele be woaɖo kpe chip tututu, nutome UHF band, antenna kple xɔtutu si wowu dzi hafi ayɔ nya tso eme.
| Tsɔtsɔ sɔ kple wo nɔewo | Wet Inlay | Dry Inlay | Trɔ RFID Ŋkɔ |
|---|---|---|---|
| Nusi wotsɔna léa nu ɖe nu ŋu | Wotsɔe kpe ɖe eŋu | Wometsɔe de dɔbiagbalẽvi ƒe ɖoɖo mamlɛtɔ me o | Atike si wotsɔ léa nu ɖe eŋu koŋ si wotia na anyigba si dzi woŋlɔ nu ɖo |
| Ðe asi le Liner ŋu | Wotsɔe kpe ɖe eŋu | Zi geɖe la, wometsɔa wo naa abe xɔtuɖoɖo mamlɛtɔ si léna ɖe eɖokui ŋu ene o | Wotsɔe kpe ɖe eŋu le alesi wowɔa tɔtrɔ kple enanae nu |
| Mo ƒe Nudzraɖoƒe si Woate Ŋu Ata | Zi geɖe la, ebia be woagatrɔ asi le eŋu na ŋkɔ si woate ŋu ata si wowu enu | Wotsɔe kpe ɖe eŋu le embedding alo conversion me ne ehiã | Pepa, PET, PP alo nu bubu si dzi woda asi ɖo si woate ŋu ata |
| Nuƒlela si bɔ | Label converter, nubabla dɔwɔƒe alo RFID integrator | Kpekpeɖeŋugbalẽvi wɔla, adzɔnuwo ƒe ƒuƒoƒo alo custom tag wɔla | Nudzrala, adzɔnu ƒe dzeside, nudzraɖoƒe, nudɔdɔwo dzikpɔla alo nuwuwu zazã ƒe ɖoɖo |
| Zãzã Gbãtɔ | Trɔtrɔ bubuwo alo dɔwɔwɔ tẽ si sɔ | Lamination, encapsulation alo nusi wowɔ ƒe embedding | Agbalẽtata, encoding kple eƒe kpeɖeŋutɔ mamlɛtɔ ɖe nu aɖe ŋu |
| Nutome Takpɔkpɔ | Enɔ te ɖe agbatsɔla, adhesive kple mamlɛtɔ si wogbugbɔ trɔ xɔtutu dzi | Enɔ te ɖe nusi wotsɔ blaa nu alo laminating dzi | Woɖee fia to mo ƒe ƒuƒoƒo bliboa, adhesive, coating, lamination kple edge design |
Wet inlays sɔ ne nuƒlela hiã RFID akpa si léna ɖe eɖokui ŋu hena ƒoƒo ƒu kple pepa alo mo ƒe nudzraɖoƒe si wowɔ, agbalẽtata, ku lãɖeɖe kple agbalẽ xatsaxatsa mamlɛtɔ ƒe tɔtrɔ.
Inlays ƒuƒuwo sɔ ne woatsɔ RFID ƒe akpaa abla ɖe kaɖi me, atsɔe ade nusi wotsɔ aŋe wɔe me, atsɔe ade asibidɛ me alo atsɔe ade xɔtuɖoɖo bubu me evɔ wometsɔ aŋenu si wozãna tsɔ léa nu ɖe nu ŋu si wozãna ɖaa o.
Wolɔ̃a dzesidenu si wogbugbɔ trɔ ne asisi la hiã nusi woate ŋu ata alo si wota do ŋgɔ si ƒe mo ƒe nu mamlɛtɔ, nusi wotsɔna léa nu, die cut, encoding kple roll specification wu enu xoxo.
| Tsɔtsɔ sɔ kple wo nɔewo | HF/NFC Inlay | UHF Inlay |
|---|---|---|
| Xexlẽme | 13.56MHz ƒe ʋuʋudedi | 860–960MHz kple nutome ƒe tuning ŋu bubu |
| Ðoɖowɔɖi Siwo Bɔ | ISO/IEC 14443 Ƒomevi A, ISO/IEC 15693 kple NFC Nyamedzroƒe ƒomeviwo | EPC Klass 1 Gen 2 / ISO / IEC 18000-63 |
| Nuxexlẽ ƒe Nuwɔna Si Bɔbɔe | Nuxexlẽ le teƒe kpui aɖe si woate ŋu atsɔ asi aƒoe alo le teƒe si te ɖe wo ŋu | Kpuie didi va ɖo meta geɖe le antenna, nuxlẽla, nu kple nutoa me nu |
| Smartphone Zazã | Ate ŋu adzɔ kple NFC chips siwo sɔ kple telefon ƒe nuwɔna si wodo alɔe | Zi geɖe la, ebiana be UHF xlẽla si tsɔ eɖokui na |
| Dɔwɔwɔ Siwo Wozãna Zi geɖe | NFC ƒe kadodo, agbalẽdzraɖoƒewo, ɖaseɖiɖi, tikitiwo, kaɖiwo kple dzesidede ame le didiƒe kpui aɖe | Awudodo, nudzraɖoƒewo, nuwo ɖoɖoɖa, kakɛwo, nunɔamesiwo kple nuxexlẽ le agbɔsɔsɔ gã me |
| Ŋkuɖodzinyawo | Chip UID, zãla ƒe ŋkuɖodzinu, axawo, mɔxenuwo, nyagbewo kple dedienɔnɔ ƒe nɔnɔmewo | EPC, TID, ŋkuɖodzinu si wodzra ɖo ɖi kple ŋkuɖodzinu si woate ŋu atia |
Inlay siwo le dɔ wɔm le frequency ɖeka dzi ateŋu azã protocol vovovowo, chip commands, memory structures kple security functions. Na nuxlẽla, chip alo protocol si hiã tsɔ wu be nàtiae to frequency ko dzi.
HF ƒe nutrenu ate ŋu axlẽ le sentimeta ʋɛ aɖewo me, gake UHF ƒe nutrenu siwo sɔ ate ŋu aɖo meta geɖe. Dɔwɔwɔ mamlɛtɔ nɔ te ɖe chip, antenna, nuxlẽla ƒe ŋusẽ, nutome band, tagged material, orientation kple integration dzi.
Ele be woatia antenna la na teƒe si woɖo be yeayi kple nuxlẽla ƒe nɔnɔme. Ðewohĩ adzɔnu si wowɔ nyuie na UHF nuto ɖeka mawɔ dɔ ma ke le bubu me o.
Wotiaa NFC Forum Type 2 chip siawo zi geɖe na URLwo, dijitaal nɔnɔmetatawo, adzɔnuwo ŋuti nyatakakawo kple nuƒlelawo ƒe kadodo. Wonaa zãla-ŋkuɖodzi ŋutete vovovowo, eyata ele be woaɖo kpe NDEF me nyawo si woŋlɔ ɖe kɔpi dzi hafi woatia chip.
MIFARE Classic, Ultralight alo DESFire ƒe nutovɛwo ate ŋu abia hena mɔɖeɖe si sɔ, hamevinyenye, ʋuɖoɖo, wɔna alo smart-card ɖoɖo siwo le dedie. Ele be nuxlẽla, dɔwɔnu, safuiwo kple kɔmpiutadziɖoɖoa nasɔ kple chip ƒomea tututu.
ICODE inlays ateŋu ado alɔ agbalẽdzraɖoƒe, nunɔamesiwo kple nuto-kaɖi ƒe dɔwɔwɔ siwo sɔ. Mele be woatsɔe be wowɔa dɔ kple ISO/IEC 14443 xlẽla ɖesiaɖe o.
Ele be UHF chip tiatia nabu EPC ŋkuɖodzinu, TID ƒe nudidiwo, zãla ƒe ŋkuɖodzinu si woate ŋu atia, seselelãme, nyagbe ɣaɣlawo yiyi alo wo wuwu kple woƒe ɖekawɔwɔ kple nuxlẽla kple kɔmpiutadziɖoɖo ƒe mɔ̃ dzi.
HF/NFC nuwɔna ate ŋu aɖe chip UID ɖe go, gake zi geɖe la, dɔwɔƒe ƒe TID kple EPC ŋkuɖodzinu si woate ŋu awɔ ɖoɖo ɖe eŋu nɔa UHF nuwɔna me. Tsɔ dzesidenu si wòle be woaxlẽ, aŋlɔe, ata alo atsɔe asɔ kple asisiwo ƒe nyatakakadzraɖoƒea.
Dɔwɔwɔwo ateŋu anye NDEF URL ŋɔŋlɔ, EPC encoding, serial data, passwords kple chip-specific locking. Ele be woatsɔ gaƒoɖokui siwo nɔa anyi ɖaa ade nyatakakawo ƒe kpeɖodzi mamlɛtɔ megbe ko elabena ɖewohĩ womate ŋu atrɔ wo o.
Nusiwo wotsɔ blaa nu siwo me tsi le dometɔ aɖewoe nye nusi wotsɔna léa nu ɖe nu ŋu kple nusi wotsɔna ɖea nu le eme, si wɔe be wosɔ na ŋkɔa ƒe tɔtrɔ yi ŋgɔe. Ele be woatsɔ nusi wotsɔna léa nu ɖe nu ŋu la asɔ kple pepa, ahuhɔ̃e, plastik, avɔ, nusiwo wota alo nu bubu siwo woatsɔ awɔe.
Woate ŋu atsɔ pepa, PET, PP alo mo ƒe nu bubu aɖe awɔ laminated ɖe inlay la tame be woawɔ label si woate ŋu ata na flexographic, digital, thermal-transfer, direct-thermal alo UV tata.
Zi geɖe la, wotsɔa tsi inlays ɖona ɖe agbalẽ xatsaxatsawo dzi hena tɔtrɔ, encoding, tata alo automatic dɔwɔwɔ. Ele be nu vevi ƒe lolome, web ƒe kekeme, gbeɖiɖi ƒe kɔkɔme kple eƒe ʋuʋu ƒe mɔfiame nasɔ kple dɔwɔnu siwo le anyime.
Ele be woada adhesive ƒe ŋusẽ kple RF ƒe dɔwɔwɔ kpɔ le nusi wowɔ ŋutɔŋutɔ dzi. Ga, tsi, plastic si yɔ fũ kple carbon, dense stacking kple curved surfaces ate ŋu atrɔ inlay ƒe dɔwɔwɔ.
Woate ŋu atsɔ inlays ƒuƒuwo awɔ ɖeka kple PVC, PET alo polycarbonate smart-card structures ne antenna ƒe didime, chip ƒe nɔƒe, titrime bliboa kple lamination ƒe dzoxɔxɔ sɔ kple card ƒe nɔnɔme.
Woate ŋu atsɔ xɔtunu ƒuƒuwo abla alo abla wo ɖe asibidɛwo, safuiwo, tikitiwo, akɔtagbalẽviwo kple nusiwo wotsɔ aŋe wɔe me to xɔtuɖoɖo si kpɔa chip la ta eye wòléa antenna ƒe ɖɔɖɔɖo me ɖe asi zazã me.
Nutsyɔnu ƒe ƒuƒoƒo, nusiwo wotsɔna léa nu ɖe nu ŋu, plastikwo, agbalẽtata ƒe nuŋlɔtsiwo, ga ƒe akpa aɖewo kple nusiwo wowɔ ate ŋu ana antenna la naɖe ɖɔɖɔɖo ɖa. Do atike si nèwu enu la kpɔ tsɔ wu be nàɖo ŋu ɖe ya si me woɖea nu le faa ƒe emetsonua ko ŋu.
Woate ŋu aƒo nu tso inlays ƒuƒuwo ŋu le agbalẽ xatsaxatsa alo agbalẽ ƒe nɔnɔme me le lamination, lãɖeɖe, punching alo product-assembly ƒe ɖoɖoa nu.
Antenna ƒe didimewoe ɖoa RF ƒe nɔnɔmewo, gake inlay alo die-cut ƒe didimewoe ɖoa teƒe si wotsɔa nu tsɔna si hiã na tɔtrɔ alo embedding ƒe ɖoɖoa. Ele be wo ame evea siaa nadze le nɔnɔmetata si dzi woda asi ɖo la dzi.
Tsɔ nu vevi ememe didime, agbalẽ xatsaxatsa ƒe gota didime si sɔ gbɔ wu, web ƒe kekeme kple inlays ƒe xexlẽme le agbalẽ xatsaxatsa ɖeka me ale be nuawo nasɔ ɖe asisi la ƒe mɔ̃a nu.
Ele be gbeɖiɖi ƒe kɔkɔme, web ƒe mɔfiame, chip ƒe nɔnɔme, cross-web position kple inside- alo outside-winding nasɔ kple tɔtrɔ, encoding alo application ƒe ɖoɖoa.
Dry inlay sheets hiã matrix si dzi woda asi ɖo si afia antenna ƒe nɔƒe, chip ƒe nɔnɔme, agbalẽ ƒe didime, ŋkɔ ŋɔŋlɔ ƒe dzesiwo kple ɖekawɔwɔ kple card punching ƒe ɖoɖo mamlɛtɔ.
Ðe eme nenye be woɖe inlays siwo gblẽ ɖa, de dzesi wo alo lé wo ɖe te eye nàɖo splices xexlẽme si sɔ gbɔ wu le agbalẽ xatsaxatsa ɖeka me. Ðewohĩ mɔ̃ siwo wowɔna le wo ɖokui si ate ŋu abia be woakpɔ agbalẽ xatsaxatsa ƒe yiyi dzi vevie.
UHF wet inlays kple converted labels ateŋu ado alɔ nusiwo ƒe ɖoƒe ƒe dzesidede, stock xlẽxlẽ, xɔxɔ, replenishment kple supply-chain visibility ne wozãe kple nuxlẽla kple kɔmpiuta dɔwɔɖoɖo siwo sɔ.
RFID ƒe dzesiwo ate ŋu ade dzesi kakɛwo, totewo, agbalẽviwo, nugoe siwo woate ŋu azã ake kple nudzraɖoƒe ƒe nunɔamesiwo. Ele be antenna kple eɖoɖo nadze le agbalẽvi ŋutɔŋutɔ kple emenyawo dzi.
Woate ŋu atrɔ NFC wet inlays woazu stickers siwo doa ka kple smartphone siwo sɔ kple adzɔnuwo ŋuti nyatakakawo, mɔɖegbalẽwo, mɔfiamewo, dodoɖeŋgɔ alo kpeɖodzinana dɔwɔƒewo.
Woateŋu abla HF dry inlays ɖe mɔɖeɖe, hamevinyenye, sukuxɔ, amedzrodzeƒe alo ʋuɖoɖo ƒe kaɖiwo me ne chip, antenna kple kaɖi ƒe wɔwɔme sɔ kple nuxlẽla ƒe ɖoɖo si woɖo.
ISO/IEC 15693 HF dzesiwo ateŋu ado alɔ agbalẽdzraɖoƒe, nuŋlɔɖi kple nudzraɖoƒe ƒe dɔwɔwɔ ƒe ɖoɖo siwo sɔ le nuxlẽla, nyatakaka-nɔnɔme kple ɖoɖo ƒe nudidiwo nu.
Woateŋu atsɔ inlays ade tikitiwo, akɔtagbalẽviwo kple asibidɛwo me hena dzesidede, gege ɖe eme kple ŋugbedodo. Ele be woatia chip memory, dedienɔnɔ kple nuxexlẽ ƒe tsatsamwo na wɔnaa ƒe nuƒolanɔƒea.
RFID ateŋu ado alɔ dɔwɔnuwo, dɔwɔnuwo kple nunɔamesi siwo nɔa anyi ɖaa, gake nuto sesẽwo, ga ƒe anyigba, atikewo kple dzoxɔxɔ gã ateŋu abia be woatsɔ dzesi tɔxɛ si wowɔ vɔ tsɔ wu be woatsɔ nusi wotsɔ dea nu me si sɔ.
Wet inlay, dry inlay alo RFID ƒe dzesidenu si wowu enu ƒe nudidi
Dɔwɔwɔ kple asitsatsa ƒe dɔwɔwɔ si woɖo be woawɔ
HF/NFC 13.56MHz alo UHF 860–960MHz ƒe ŋusẽ
Protocol si hiã kple chip si wodi wu
Nuxlẽla, encoder, smartphone alo kaɖi-ɖoɖo ƒe kpɔɖeŋu
Tagged nu, adzɔnuwo me nyawo kple toɖoɖo nɔnɔme
Taɖodzinu nuxexlẽ ƒe didime, mɔfiame kple nuxexlẽ-nutome ƒe nɔnɔmewo
Antenna ƒe didime, inlay ƒe didime kple label alo card ƒe ɖoɖo mamlɛtɔ
Adhesive, mo nu, liner kple nutome ƒe nudidiwo
Encoding, passwords, UID/TID/EPC ƒe sɔsɔ kple agbalẽtata ƒe nudidiwo
Roll core, web width, pitch, winding mɔfiame alo agbalẽ matrix
Nudɔdɔ ƒe agbɔsɔsɔ, kpɔɖeŋuwo, teƒe si woayi kple ɖoɖowɔɖi si wobia
Axa si dzi wokpɔe tsoe gblɔ be wodoa elektrik kple nukpɔkpɔ ƒe ŋkuléle ɖe inlays ŋu bliboe. Ele be nudɔdɔa ƒe nɔnɔmetata naɖe dodokpɔmɔnu, lɔlɔ̃ ɖe edzi ƒe dzidzenu, nusiwo gblẽ le nusiwo wotsɔ de eme ŋudɔwɔwɔ kple ŋkuléleɖenuŋu ŋuti nuŋlɔɖi siwo nuƒlela bia la me.
Do inlay la kpɔ kple nuxlẽla si woɖo, ŋusẽ, antenna, nusi wode dzesii, mɔfiame kple nuto. Free-air read distance meka ɖe edzi be dɔwɔwɔ ɖekae le label ƒe tɔtrɔ alo card lamination megbe o.
Ele be woado wet inlay samples kpɔ be woɖe asi le wo ŋu, tack, peel, die cutting, matrix stripping, roll feeding kple woƒe ɖekawɔwɔ kple mo ƒe nu kple application surface hã.
Ele be woado inlays ƒuƒuwo kpɔ to lamination alo molding ƒe ɖoɖo bliboa me hena chip ƒe agbetsitsi, antenna ƒe kadodo, ŋkɔ ŋɔŋlɔ, flatness kple post-process nuxexlẽ ƒe dɔwɔwɔ.
Ele be woaxlẽ UID, TID, EPC, NDEF, nyagbe ɣaɣlawo kple asisiwo ƒe nyatakaka siwo woŋlɔ ɖe kɔpi me la ake eye woatsɔ wo asɔ kple nyatakakawo ƒe faɛl si dzi woda asi ɖo. Ele be nyatakaka siwo wota siwo trɔna la nanɔ ɖeka kple elektrɔnik nuŋlɔɖiwo.
Kpɔ xexlẽme, gbeɖiɖi ƒe kɔkɔme, web ƒe ɖoɖowɔwɔ, mɔfiame si wotsɔ ƒo xlãe, nuto, splices, bad-tag dzesi, agbalẽ ƒe ɖoɖo kple ametakpɔnu bablawo ɖa hafi nàɖoe ɖa.
Nuƒlelawo ateŋu akpɔ adhesive wet inlays, dry inlays hena embedding kple converted labels hena tata mamlɛtɔ alo dɔwɔwɔ to dɔa ƒe dɔwɔwɔ ƒe ɖoɖo ɖeka dzi.
Wallis ateŋu adzro ISO/IEC 14443, ISO/IEC 15693 kple EPC Gen2 ƒe nuwɔna me na nuxexlẽ ƒe didime vovovowo, nuxlẽlawo, ŋkuɖodzinu kple dɔwɔwɔ ƒe nudidiwo.
Woate ŋu alé ŋku ɖe antenna ƒe didime, inlay ƒe lolome, agbalẽ xatsaxatsa ƒe nɔnɔmewo, agbalẽ matrices, adhesive kple mamlɛtɔ ƒe ƒoƒo ɖekae ƒe wɔwɔme ŋu le asisi la ƒe dɔwɔnuwo nu.
Woateŋu adzro NDEF, EPC, serial data, passwords, UID/TID xexlẽ, QR codes, barcodes kple record matching me le chip si wotia nu.
Kpɔɖeŋu dodokpɔ ɖea afɔku si le nuxlẽla ƒe masɔmasɔ, adhesive si gbɔdzɔ, roll layout si mesɔ o, antenna detuning alo kpododonu le card lamination me dzi kpɔtɔna.

Bia Kpɔɖeŋuwo Kple Asixɔxɔ le Agbɔsɔsɔme Ŋu
Nusiwo wotsɔ blaa nu si me tsi le dometɔ aɖewoe nye nusi wotsɔna léa nu ɖe nu ŋu si te ŋu sea nyaƒoɖeamenu kple nusi wotsɔna ɖea nu le eme. Wotsɔa nu ƒuƒu si wotsɔa nu ƒua gbe ɖe eme la naa ame si metsɔa dzesidenu mamlɛtɔ si léna ɖe eɖokui ŋu la tutuna o eye woɖoe be woatsɔ ade eme, ablae alo atrɔe ayi ŋgɔe.
Menye nenema kokoko o. Zi geɖe la, dzesidenu si wowu enu tsɔa modzakaɖenu si woate ŋu ata, nusi wotsɔna léa nu ɖe eŋu koŋ, ku mamlɛtɔ ƒe lãɖeɖe, agbalẽtata kple agbalẽ xatsaxatsa ƒe nɔnɔme si le RFID ƒe nutrenu la tame kpena ɖe eŋu.
Ẽ, ne wowɔ antenna, carrier, chip ƒe nɔƒe, lamination ƒe dzoxɔxɔ, total titrime kple card ƒe ɖoɖo na inlay si wotia. Wokafui be woawɔ kpɔɖeŋu lamination dodokpɔ.
Ɛ̃. Tiatia siwo li siwo le axa dzi la dometɔ aɖewoe nye 13.56MHz ISO/IEC 14443, 13.56MHz ISO/IEC 15693 kple UHF ƒe nuwɔna. Ele be woaɖo kpe chip kple antenna la tututu dzi.
Zi geɖe la, woxlẽa HF inlays le didiƒe kpui aɖe, gake UHF inlays ate ŋu axlẽ tso didiƒe kpui va ɖo meta geɖe. Nusi do tso eme mamlɛtɔ nɔ te ɖe chip, antenna, nuxlẽla, nuto, nu, mɔfiame kple ƒoƒo ɖekae dzi.
Dual-frequency product si wowɔ koŋ koe doa alɔ interface eveawo siaa. NFC inlay si wozãna ɖaa kple UHF inlay si wozãna ɖaa nye nu vovovowo.
Woate ŋu atsɔ pepa alo modzakaɖenu si wotsɔ lãgbalẽ wɔe si sɔ atrɔ wo hena agbalẽtata. Tsɔ agbalẽtamɔ̃ ƒe mɔ̃ɖaŋununya, ink alo ribbon, label ƒe anyigba kple eƒe anyinɔnɔ ƒe nudidi.
Woate ŋu alé ŋku ɖe antenna kple inlay ƒe didime siwo wowɔ ɖe ɖoɖo nu ŋu le chip impedance, nuxexlẽ ƒe dɔwɔwɔ si hiã, teƒe si li, nusiwo ŋu wode dzesii kple nudɔdɔ ƒe agbɔsɔsɔme nu.
Tiatia ateŋu anye NTAG, MIFARE, DESFire, ICODE, F08, NXP UCODE, Impinj alo Amedzro ƒomewo. Ele be woaɖo kpe edzi be dɔa li eye wòsɔ na dɔa koŋ.
Woate ŋu adzro encoding kple data-writing services me le chip la nu. UID ateŋu anye esi woɖo le dɔwɔƒe, gake EPC, NDEF, nyagbewo kple zãla ƒe nyatakakawo ateŋu anye ɖoɖowɔɖi le nusi wowɔ nu.
Ɛ̃. Zi geɖe la, wotsɔa nu siwo wotsɔ ƒo tsii la naa le agbalẽ xatsaxatsawo me, gake woate ŋu atsɔ nusiwo wotsɔa nu ƒuƒuwo ana le agbalẽ xatsaxatsa alo agbalẽ xatsaxatsawo me le tɔtrɔ alo kaɖi-lamination ƒe mɔnu nu.
Axa si dzi wokpɔe tsoe gblɔ be kpɔɖeŋuwo li eye asisi lae xea fe ɖe wo ɖoɖoɖa ta. Kpɔ chip, antenna kple sample terms dzi kple Wallis hafi nàɖoe ɖa.
Dzɔtsoƒe ƒe axaa yɔ ŋkeke 3–7 lɔƒo na kpɔɖeŋuwo kple ŋkeke 10–20 na nuwɔwɔ le agbɔsɔsɔ gã me, le alesi wowɔe ɖe ɖoɖo nu nu. Ðo kpe ɖoɖowɔɖi si li fifia dzi ne èle ga home biam.
Axa si dzi wokpɔe tsoe gblɔ be wowɔa elektrikŋusẽ dodokpɔ kple ŋkuléle ɖe nu ŋu. Ele be nuƒlelawo naɖe RF, encoding, roll, lamination alo traceability ƒe nudidi bubu ɖesiaɖe me le nuƒle ƒe nɔnɔmetata me.
Ðo inlay ƒomevi, frequency, protocol, chip, nuxlẽla, dɔwɔwɔ ƒe nu, taɖodzinu ƒe didime, antenna kple inlay ƒe lolome, agbalẽ xatsaxatsa alo agbalẽvi ƒe nɔnɔme, encoding, agbɔsɔsɔme, packaging kple destination ɖa.
Dze Wò Dɔa Gɔme Kple Mía