|
kaad ho nsɛm
Wallis na ɔkyerɛwee
inlay a wɔde hyɛ mu
| Size: | |
|---|---|
| Nneɛma: | |
| mfaso: | |
| Dodow: | |
Wallis transparent PVC RFID inlay prelam nkrataa no yɛ engineered ama contactless smart card manufacturers a ɛhia antenna nhyehyɛe a wɔayɛ no sɛnea wɔpɛ, chip gyinabea a wɔahyɛ so ne lamination adwumayɛ a wotumi de ho to so. Dwumadie nhyehyeɛ a ɛwɔ hɔ no bi ne LF 125kHz, HF 13.56MHz, NFC ne UHF 860–960MHz mfiridwuma a wɔde di dwuma ma akwan a wɔfa so kɔ hɔ, adansedie nkrataa, asɔremma kaad, ahɔhodan kaad, agyapadeɛ kaad ne RFID dwumadie foforɔ.
Prelam krataa biara ka RFID chip ne antenna a wɔapaw no bom wɔ PVC layers a ɛda adi anaasɛ ɛyɛ fã bi mu ansa na wɔadan kaad a etwa to. Wobetumi ayɛ nhyehyɛe, krataa kɛse, ne kɛse, antenna geometry, chip gyinabea ne card pitch atwa adetɔfo no punching adwinnade, tintim adwinni, laminator ne akenkanfo nhyehyɛe ho ahyia.
LF , HF ne UHF yɛ radio mfiridwuma ahorow sen sɛ ɛbɛyɛ ade biako nkyerɛase a wotumi sesa. Sɛ wopɛ quotation a wotumi de ho to so a, ɛsɛ sɛ adetɔfo hu frequency a wɔhwehwɛ, protocol, chip model, reader model, target read range ne card construction a wɔawie ansa na wɔayɛ sample.
| Parameter | a Ɛwɔ Hɔ Nkyerɛkyerɛmu anaa Project Option |
|---|---|
| Nneɛma a Wɔde Yɛ Adwuma | Ɛyɛ nea ɛda adi PVC anaasɛ ɛyɛ nea ɛda adi fã PVC |
| Aguade a Wɔde Yɛ Adwuma | Contactless RFID inlay prelam krataa a wɔde dannan kaad |
| Mpɛn dodow a Wɔpaw | LF 125kHz / HF 13.56MHz / NFC / UHF 860–960MHz |
| Nsiesiei a Wɔpaw | 3×8 / 3×7 / 4×5 / A4-fam nhyehyɛe / amanne kaad matrix |
| Krataa no Kɛse | A4 anaa amanne nsusuwii a egyina punching ne lamination mfiri so |
| prelam Nneɛma a ɛyɛ den | 0.30–0.76mm sɛnea mprempren nneɛma ho nsɛm kyerɛ; adansi a etwa to a wɔde nhwɛsode sii so dua |
| Antenna a Wobɛpaw | Kɔbere coil, embedded waya anaa etched antenna sɛnea frequency ne project nhyehyɛe |
| Chip a Wobɛpaw | Wɔapaw no denam protocol ne akenkanfo nhyehyɛe so; LF , HF / NFC ne UHF chip mmusua a ɛwɔ hɔ denam adwuma so |
| Ani | Transparent / semi-transparent / frosted a ɛda adi pefee; printable anaa Overlay film -ayɛ krado grade denam abisade so |
| Downstream Processing a Wɔde Di Dwuma | Overlay film lamination, krataa tintim wɔ baabi a wɔakyerɛ, punching, chip sɔhwɛ ne card personalization |
| Nneɛma a wɔyɛ no sɛnea wɔpɛ | Nsiesiei, ɛnne nnyigyei, chip gyinabea, antenna geometry, ne kɛse, krataa kɛse, agyiraehyɛde tuntum ne nneɛma a wɔde kyekyere |
| MOQ | Egyina chip, antenna, nhyehyɛe ne customization ahwehwɛde ahorow so |
RFID prelam yɛ mfinimfini fã a ɛyɛ adwuma a wɔde yɛ plastic kaad a enni nkitahodi. Wɔde chip, antenna ne bonding nhyehyɛe no ato plastic layers ntam, na ɛyɛ krataa a ɛyɛ den a wobetumi de afrafra nkratafa a wɔatintim ne ahobammɔ Overlay film s ansa na wɔabɔ punch a etwa to.
Top ahobammɔ Overlay film anaasɛ layer a wotumi tintim
PVC prelam layer a ɛda adi pefee
RFID chip ne antenna a ɛne no hyia
Lower PVC layer ne krataa a wɔatintim a wopɛ
Back Overlay film anaa dwumadie kaad layer
Transparent PVC ma kwan ma antenna ne emu adansi no bɛyɛ aniwa kaad nhyehyɛɛ no fã. Esiane sɛ antenna no kɔ so da adi nti, sɛnea ɛne ne ho hyia, nea wɔde di dwuma wɔ adhesive so, sɛnea ɛho tew wɔ soro ne chip gyinabea ho hia titiriw ma kaad a ɛyɛ fɛ a ɛyɛ mmerɛw.
Transparent RFID Inlay Nhyehyɛe
Chip ne Antenna Gyinabea a wɔayɛ no sɛnea wɔpɛ
Ɛsɛ sɛ mpɛn dodow a wɔpaw no gyina akenkanfo nhyehyɛe ne application protocol so. Kaad a wɔayɛ ama LF kwan a wɔfa so kɔ hɔ no rennyɛ adwuma wɔ HF / NFC akenkanfoɔ, na UHF akyidi kaad hwehwɛ sɛ wonya antena ne sɔhwɛ tebea soronko bi firi kaad a ɛbɛn baabi tiawa.
| Technology | Frequency | Typical Protocol anaa Chip Family | Common B2B Applications | Nea Ɛsɛ sɛ Ɔdetɔfo no Si so dua |
|---|---|---|---|---|
| LF | 125kHz na ɛwɔ hɔ | EM, TK, T5577 ne LF mmusua afoforo, a egyina akenkanfo protocol so | Bɛn kwan a wɔfa so kɔ hɔ, kɔ a wɔbɛkɔ, wɔbɛhunu wɔn ne agyapadeɛ nhyehyɛeɛ | Chip pɛpɛɛpɛ, encoding format, UID ahwehwɛde ne akenkanfo nhwɛso |
| HF / NFC | 13.56MHz na ɛwɔ hɔ | ISO /IEC 14443, ISO /IEC 15693, NFC -a ɛne no hyia ne nea ɛfa dwumadie pɔtee bi ho | Nkɔsoɔ, asɔremma, sukuupɔn, akwantuo, NFC nkitahodiɛ ne ahobanbɔ a wɔde bɛhunu | Protocol, memory, ahobammɔ level, keys, akenkanfo ne encoding asɛyɛde |
| UHF | 860–960MHz na ɛwɔ hɔ | E PC Adesuakuw 1 Gen 2 / ISO /IEC 18000-63 chip platforms sɛnea adwuma | Agyapadeɛ ho adansedie, kar nkrataa, nneɛma a wɔakora so ne akyirikyiri a wɔde di akyi | Regional band, antenna orientation, botae akenkan kwan ne nneɛma a atwa ho ahyia |
| Hybrid a wɔde afrafra | Mpɛn dodow abien anaa nea ɛboro saa | LF + HF , LF + UHF anaa HF + UHF nhyehyeɛ a ɛhyɛ nhyehyɛɛ mu nhwehwɛmu ase | Migration projects ne cards a ɛsom akenkanfo nhyehyɛe ahorow pii a wɔde ahyɛ mu | Kaad beae a ɛwɔ hɔ, antenna nkitahodi, chip gyinabea ne awie thickness |
RFID Inlay Krataa a wɔde sesa Kaad
Kaad Matrix ne Antenna Nhyehyɛe a Wɔayɛ no sɛnea wɔpɛ
Ɛsɛ sɛ inlay matrix no ne adetɔfo no adwinni a wɔde hyɛ mu, nkyerɛwde agyiraehyɛde, punching die ne card orientation hyia. Wobetumi de nhyehyɛe a wɔahyɛ da ayɛ te sɛ 3×8, 3×7 ne 4×5 ama, bere a nhyehyɛe a wɔahyɛ da ayɛ no hwehwɛ sɛ wonya mfonini a ɛwɔ afã horow anaasɛ fael a wɔapene so wɔ kaad-gyinabea.
Ɛsɛ sɛ chip gyinabea kwati embossing zones, magnetic stripes, signature panels, contact modules, punch lines ne nneɛma a wɔatintim a ɛho hia. Wɔ nsusuwii ahorow a ɛda adi pefee ho no, ɛsɛ sɛ wɔsan hwɛ antena kwan a wotumi hu no nso mu de toto adwinni no ho.
prelam thickness yɛ kaad a wɔawie no fã baako pɛ. Ɛsɛ sɛ wɔde nkrataa a wɔatintim, Overlay film s, adhesive layers, chip cavities ne optional security layers ka ho bere a wɔrebu laminated thickness a etwa to no.
| Layout Input | Nsɛm a Ɛho Hia | Nteaseɛ |
|---|---|---|
| Krataa a Wɔde Yɛ Mfonini | Krataa no nyinaa tenten, ne tɛtrɛtɛ, ne nkyɛnkyɛn ne ne kaad matrix | Matches laminator, adwinni ne punch nnwinnade |
| Kaad a Wɔde Kyerɛkyerɛ | Mfonini anaa asase, anim/akyi nkyerɛkyerɛmu ne aduan akwankyerɛ | Siw antena a wɔde ahwehwɛ anaasɛ ɛkyinkyini no kwan |
| Chip Beae a Ɛwɔ | X/Y coordinate ne mmeae a wɔayi afi mu | Kwati embossing, module, stripe ne punching ntawntawdi |
| RF Ahwehwɛde | Frequency, chip, protocol, akenkanfo ne botaeɛ kwan | Boa antenna tuning ne dwumadi sɔhwɛ |
| Kaad a Wɔyɛ | Layer nneɛma, ne kɛse, Overlay film s ne tintim nhyehyɛe | Si lamination suban ne card gauge a etwa to no so dua |
Controlled antenna ne chip placement boa customer no ma ɔde ne din kɔ so denam printing, lamination ne punching so. Ɛsɛ sɛ wɔkyerɛkyerɛ nsusuwii mu ahwehwɛde ahorow mu wɔ nhyehyɛe mfonini a wɔapene so no so na wɔhwɛ sɛ ɛyɛ nokware bere a wɔreyɛ nhwɛsode no.
Prelam a ɛda adi anaasɛ ɛyɛ nea ɛda adi fã bi ma wotumi yɛ mfiri a wotumi hu kaad ho nhyehyɛe. Clean PVC layers, controlled adhesive appearance ne antenna routing a ɛkɔ so daa boa ma wɔyɛ kaad a wɔawie a ɛyɛ adwumayɛfoɔ kɛseɛ.
Wobetumi de prelam no ayɛ biako ne PVC tintim nkrataa a ɛne no hyia ne Overlay film s. Ɛsɛ sɛ wɔde sɔhwɛ ahorow si lamination hyew, nhyɛso, bere a wɔde tra hɔ ne ɔkwan a wɔfa so yɛ onwini no so dua efisɛ nhyehyɛe a ɛteɛ no gyina kaad adansi ne nnwinnade so.
Wobetumi ayɛ nhyehyɛe ahorow a wɔde frequency biako ne nea wɔapaw a wɔde afrafra. Hybrid cards hwehwɛ engineering foforo efisɛ antenna abien betumi adi nkitaho, asi akan wɔ card area ho anaasɛ ɛka akenkan adwumayɛ wɔ lamination akyi.
Adetɔfo betumi akyerɛ nkrataa so nkyerɛwde, kaad-gyinabea nɔma, tuntum dinkyerɛw agyiraehyɛde, packing dodow ne pallet nkyerɛwde. Ɛsɛ sɛ wɔkyerɛkyerɛ encoding anaa UID data dwumadie mu wɔ ɔkwan soronko so, a data format, ahobanbɔ ahwehwɛdeɛ ne asɛdeɛ a ɛfa safoa ho ka ho.
Wɔayɛ sɛ prelam nkrataa bi bɛkɔ so atra kaad no mu na wɔde PVC nkrataa a wɔatintim no soronko akata so. Ɛsɛ sɛ wɔkyerɛ direct offset, UV anaa dijitaal tintim bere a wɔasɔ ɔfasuo aduruyɛ ne ink nhyehyɛeɛ a wɔapaw no ahwɛ sɛ ɛbata ho nko ara.
Antenna resonance ne read range betumi asesa bere a wɔde prelam no ne Overlay film s, dade inks, foil, magnetic nneɛma anaa ɛlɛtrɔnik nneɛma a ɛbɛn abom akyi. Ɛsɛ sɛ sɔhwɛ a wɔde pene so no de kaad a etwa to a wɔde si ne adetɔfo no nneɛma a wɔkenkan no di dwuma.
Ansa na wɔbɛyɛ no kɛse no, ɛsɛ sɛ adetɔfo no hwɛ adwinni a wɔakyerɛw din, card pitch, antenna clearance ne chip beae wɔ punching adwinnade ankasa no so. Dimensional drawing nkutoo ntumi nsi production sɔhwɛ a edi mũ ananmu.
Wɔ B2B ahyɛde ahorow ho no, ɛsɛ sɛ nhwɛsode a wɔapene so no bɛyɛ nea wɔde gyina hɔ ma nhyehyɛe, sɛnea ɛte, ne kɛse ne RF adwumayɛ. Ɛsɛ sɛ wɔpene nhwehwɛmu gyinapɛn so ansa na wɔayɛ, titiriw wɔ antena nhyehyɛe a wɔahyɛ da ayɛ ne nhyehyɛe a ɛwɔ frequency pii ho.
| Nhwehwɛmu Adeɛ | Nea Wɔahwɛ mu | Recommended Approval Stage |
|---|---|---|
| Nneɛma a Wɔde Ani Hu | Transparency, efĩ, scratches, bubbles ne adhesive hwɛbea | Raw sample ne wie card nhwɛsode |
| Nsusuwii ahorow | Krataa kɛseɛ, kaad no nne, margins, chip coordinates ne antenna clearance | Layout mfonini ne asɛm a edi kan |
| Nneɛma a Ɛyɛ Den ne Nea Ɛyɛ Petee | Sheet gauge, mpɔtam hɔ chip beae ne warpage | prelam krataa ne laminated kaad |
| Electrical a Ɛkɔ So | Antenna a ɛkɔ so ne chip nkitahodi | Ansa na wobɛhyehyɛ nneɛma |
| Akenkanfo Adwumayɛ | UID mmuae, protocol, memory kwan ne project-specific akenkan kwan | Ansa na wɔbɛyɛ lamination a etwa to ne akyi |
| Lamination no mudi mu kura | Bonding, bubbles, delamination, soro agyiraehyɛde ne chip-beae deformation | Sikakɔkɔɔ Nhwɛso krataa |
Si frequency, protocol, chip, akenkanfo ne encoding ahwehwɛde ahorow so dua.
Pene krataa mfonini, kaad matrix, antenna kwan ne chip coordinates so.
Yɛ nhwɛsoɔ prelam nkrataa na hwɛ sɛ anyinam ahoɔden adwumayɛ yɛ adwuma.
Laminate ne adetɔfo no kaad nhyehyɛe a edi mũ.
Punch kaad a wɔawie no na sɔ hwɛ wɔ akenkanfo nhyehyɛe a wopɛ sɛ wokenkan no so.
Pene Sika Nhwɛsode ne batch agyede gyinapɛn a wɔakyerɛw so.
LF anaa HF prelam nkrataa betumi asiesie ama adwumayɛfoɔ kwan a wɔfa so kɔ, sukuupɔn no mu nkyerɛkyerɛmu, kɔ ne agyapadeɛ a ɛbɛn nhyehyɛeɛ. Ɛsɛ sɛ wɔsi akenkanfoɔ protocol a wɔde ahyɛ mu no so dua ansa na wɔapaw chip.
HF / NFC inlays betumi aboa digyital nkitahodi, asɔremma a wɔkyerɛ ne smart marketing applications a wɔapaw bere a wɔakyerɛkyerɛ chip memory, NDEF ahwehwɛde ne smartphone anaa akenkanfo nhyiam ase.
Ɛsɛ sɛ ahɔhodan kaad ne lock system a ɛwɔ hɔ dedaw no frequency, chip, memory nhyehyɛe ne ahobammɔ nhyehyɛe hyia. HF anaa NFC chip a ɛwɔ hɔ nyinaa no ntumi ne hotel lock platform biara nhyia.
UHF wobetumi ayɛ kaad inlays ama kwan a ɛkɔ akyiri, kar kwan a wɔfa so kɔ ne agyapadeɛ adwumayɛ. Adwumayɛ gyina ɔmantam frequency band, akenkanfo ahoɔden, antenna kwankyerɛ ne nneɛma a atwa kaad a wɔawie no ho ahyia so.
Nsiesiei mmoa a wɔahyɛ da ayɛ: wobetumi ahwɛ kaad matrix, antenna kwan, chip gyinabea ne krataa kɛse ama OEM nnwuma.
RFID mfiridwuma ahodoɔ: LF , HF / NFC , UHF ne hybrid nhyehyeɛ a wɔapaw no bɛtumi aka ho asɛm.
Kaad nneɛma a ɛda adi pefee tumi: adansi a emu da hɔ na ɛyɛ fã bi a ɛda adi PVC wɔ hɔ ma mfiri a wotumi hu-mfiridwuma nhyehyɛe.
Kaad nneɛma a wɔde bom: wobetumi ayɛ PVC nkrataa a ɛne ne ho hyia, Overlay film s ne kaad nsakrae mmoa a wɔawie no ho nhyehyɛe.
Nhwɛsoɔ a egyina pene so: wobetumi asɔ mfiridwuma nhwɛsoɔ ahwɛ sɛ ɛyɛ lamination, punching ne akenkanfoɔ a ɛne ne ho hyia ansa na wɔayɛ no kɛseɛ.
Export packaging: krataa ahobammɔ, carton packing, labelling ne pallet options betumi akyerɛ ama amanaman ntam ahyɛde.
LF , HF / NFC , UHF anaasɛ afrafra frequency nhyehyɛe a wɔapene so
Chip model a wɔpaw maa adetɔfo no protocol ne ɔkenkanfo
Kɔbere waya, waya a wɔde ahyɛ mu anaasɛ etched antenna nhyehyɛe
3 × 8, 3 × 7, 4 × 5 anaasɛ krataa nhyehyɛe a wɔayɛ no sɛnea wɔpɛ koraa
Amanne krataa dimensions, thickness ne card pitch
Transparent, semi-transparent anaa frosted transparent anim
Nkyerɛwde agyiraehyɛde, kaad-gyinabea nɔma ne OEM nkyerɛwde
Krataa, kartɔn ne export pallet packaging
RFID ɛsɛ sɛ wɔbɔ prelam nkrataa ho ban fi benkum, efĩ, nsuo ne mfiri nhyɛsoɔ ho berɛ a wɔde rekɔ. Packing dodow, separators, anti-static ahwehwɛde, carton labels ne pallet nhyehyɛe betumi asi so dua sɛnea krataa kɛse ne adetɔfo no gye nhyehyɛe.
Ahobammɔ Krataa a Wɔde Gu Nneɛma Mu
Carton ne Nneɛma a Wɔde Kɔ Amannɔne
| Nsɛm a Wɔhwehwɛ | Nhwɛso anaa Nkyerɛkyerɛmu |
|---|---|
| Mpɛn dodow ne Protocol | LF 125kHz, ISO /IEC 14443, ISO /IEC 15693, NFC anaa UHF E PC Gen2 |
| Chip Nhwɛsode | Ɔfã nɔma pɔtee, memory ne ahobammɔ ahwehwɛde |
| Akenkanfo Ho Nsɛm | Akenkanfoɔ brand/model, antenna ne botaeɛ akenkan kwan |
| Krataa Nhyehyɛe | 3×8, 3×7, 4×5 anaa dimensioned amanne kwan so mfonini |
| Kaad a Wɔyɛ | prelam , nkrataa a wɔatintim, Overlay film s ne kaad a etwa to no mu duru |
| Ntintim ne Nea Wowie | Tẽẽ tintim anaa mu prelam, pefee / frosted wie, soronko foil anaa magnetic stripe |
| Encoding Ahwehwɛde a Ɛwɔ Hɔ | Blank chip, UID list, data format, nsafe ne locking ahwehwɛde |
| Nneɛma a Wɔkra | Nhwɛso dodow, pilot order ne afe afe nkɔmhyɛ |
Ɛyɛ mfinimfini fã a ɛyɛ adwuma wɔ plastic kaad a enni nkitahodi mu. Krataa no kura chip ne antenna na wɔde nkratafa a wɔde tintim ne Overlay film s abɔ mu ansa na wɔabɔ no akɔ kaad a wɔawie mu.
Dwumadie no akwan a wobɛfa so ayɛ adwuma no bi ne LF 125kHz, HF 13.56MHz, NFC ne UHF 860–960MHz. Wobetumi nso asusuw dual-frequency anaa hybrid structures a wɔapaw no ho.
Dabi Wɔde frequency ahorow, protocols, antennas ne reader system ahorow di dwuma. Ɛsɛ sɛ wɔpaw chip ne antenna no ma infrastructure a wɔahyɛ da ayɛ no.
Aane. Wobetumi ayɛ nhyehyeɛ, krataa kɛseɛ, kaad no nne, antenna geometry ne chip coordinates afiri dimensioned drawing ne production sample a wɔapene so.
Egyina ɔfasu grade ne ink nhyehyɛe a wɔapaw so. Kaad nhyehyeɛ pii de PVC nkrataa a wɔatintim no soronko di dwuma wɔ prelam no so. Ɛsɛ sɛ wɔde ink-adhesion sɔhwɛ si so dua sɛ wɔatintim tẽẽ.
Mprempren nneɛma ho nsɛm kyerɛ 0.30–0.76mm. Prelam no mu duru a ɛteɛ no gyina chip cavity, antenna, Overlay film s ne card a wɔawie no duru a wɔhwehwɛ so.
LF + HF , LF + UHF anaa HF + UHF nhyehyeɛ a wɔapaw no betumi ahwɛ mu. Feasibility gyina antenna nkitahodi, card beae a ɛwɔ hɔ, chip gyinabea ne target card thickness.
Sɔhwɛ betumi ayɛ antenna a ɛkɔ so, chip mmuae ne adwuma pɔtee bi akenkanfo nhwehwɛmu. Ɛsɛ sɛ pene a etwa to nso sɔ punched cards hwɛ bere a wɔde adetɔfo no akenkanfo nhyehyɛe no ayɛ lamination akyi.
Akenkan kwan no gyina chip sensitivity, antenna design, regional band, akenkanfo tumi, orientation ne nneɛma a atwa ho ahyia so. Ɛsɛ sɛ wɔde kaad adansi a etwa to no di dwuma de di botae bi ho adanse.
Yiw, bere a chip ne protocol no ne ahɔhodan mu lock nhyehyɛe no hyia no. Ɛsɛ sɛ wɔde lock brand, encoder ne card specification a ɛwɔ hɔ dedaw no ma ma wɔahwɛ sɛnea ɛne no hyia.
Wobetumi aka encoding ho asɛm sɛnea chip ne project no te. Ɛsɛ sɛ adetɔfoɔ no kyerɛkyerɛ data kwan, safoa, UID dwumadie, locking tebea ne ahobanbɔ asɛdeɛ mu.
Ɛsɛ sɛ adetɔfo sɔ krataa no nsusuwii, tintim anaa Overlay film a ɛne ne ho hyia, lamination, punching registration, card flatness ne RF adwumayɛ hwɛ wɔ akenkanfo a wɔpɛ sɛ wɔyɛ no so. Ɛsɛ sɛ Golden Sample a wɔapene so no bɛyɛ batch reference.
