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Inlay/ Prelam a wɔde hyɛ mu
Wallis na ɔkyerɛwee
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Wallis 13.56MHz HF RFID PVC prelam inlay nkrataa no yɛ engineered sɛ adwumayɛ mu titiriw ma contactless smart cards, ID cards, access cards, ahɔhodan key cards, membership cards, transport cards ne NFC-enabled card nhyehyɛe ahorow. Krataa biara ka HF chip ne antenna a wɔapaw bom wɔ PVC nhyehyɛe a wɔahyɛ so mu, a wɔasiesie ama kaad-nipadua lamination a etwa to, tintim, punching ne personalization.
B2B nnwuma betumi ayɛ customized denam chip model, protocol, memory, antenna geometry, krataa kɛse, card nhyehyɛe, inlay thickness, chip gyinabea, ade, awiei kaad adansi ne packaging. Standard nhyehyeɛ nkyerɛkyerɛmu no bi ne 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ne 4 × 10, a amanne kwan so multi-card nhyehyeɛ a ɛwɔ hɔ ma lamination mprɛte pɔtee ne punching mfiri.
Ɛnsɛ sɛ wɔboaboa chip mmusua ano wɔ amansan nyinaa nhyiamu ho asɛm biako ase. MIFARE Classic, MIFARE Ultralight, NTAG ne MIFARE DESFire nneɛma yɛ adwuma wɔ ISO/IEC 14443 Type A mmeaeɛ, berɛ a ICODE nneɛma taa gyina ISO/IEC 15693. Ɛsɛ sɛ wɔsi chip, akenkanfoɔ, application software ne ahobanbɔ ahwehwɛdeɛ pɔtee no so dua ansa na wɔayɛ antenna tuning ne bulk production.
| Aguade a Wɔde Yɛ Adwuma | 13.56MHz HF RFID contactless prelaminated inlay krataa a wɔde yɛ plastic-kaad |
| Mpɛn dodoɔ | 13.56MHz HF na ɛyɛ adwuma; protocol ne mframa ntam nkitahodi gyina chip a wɔapaw no so |
| Nsiesiei a Wɔde Di Dwuma a Wɔde Di Dwuma | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 ne nhyehyɛe a wɔayɛ no sɛnea wɔpɛ |
| Mprempren Kratafa a Ɛyɛ Den Nkyerɛkyerɛmu | Bɛyɛ 0.45 ± 0.02mm ma HF nhyehyɛe a wɔapaw; si so dua denam chip, antenna, nneɛma ne nea etwa to card stack so |
| Nneɛma a Wɔde Yɛ Adwuma | PVC fitaa anaa nea ɛda adi pefee; PETG ne polycarbonate-compatible nnwuma a ɛhyɛ nhyehyɛe a ɛyɛ soronko mu validation |
| Antenna a Wobɛpaw | Kɔbere waya a wɔde ahyɛ mu, aluminium a wɔakyerɛw so ne antenna adansi a ɛfa adwuma pɔtee bi ho |
| B2B Nnwuma a Wɔyɛ | Chip sourcing, antenna design, RF tuning, layout engineering, samples, lamination sɔhwɛ, anyinam ahoɔden sɔhwɛ, QC amanneɛbɔ ne export supply |
Bisa HF RFID Inlay Nhwɛsode ne Quote
Prelam inlay yɛ mfinimfini kaad-yɛ krataa a RFID chip, chip-to-antenna nkitahodi ne tuned antenna nhyehyɛe wɔ plastic layers mu. Mpɛn pii no, ɛnyɛ kaad a wɔawie a wotumi tintim no. Wɔn a wɔyɛ kaad no de prelam no ne core sheets a wɔatintim ne transparent overlays bom, afei laminate, cool, punch na personalize cards a wɔawie no.
Antena no nya ahoɔden fi akenkanfo no mu na ɛde data kɔ akenkanfo no ne chip a wɔde ahyɛ mu no ntam. RF adwumayɛ gyina antenna geometry, conductor resistance, chip capacitance, resonance, card nneɛma, dade a ɛbɛn, awiei card thickness ne akenkanfo afuw ahoɔden.
PVC core nkrataa a wɔatintim, transparent overlays, adhesives, magnetic stripes, signature panels ne ahobammɔ awie de thickness ka prelam no ho. Ɛsɛ sɛ wɔyɛ kaad a wɔawie no kɛse ho nhyehyɛe fi stack a edi mũ no so sen sɛ wobefi prelam gauge no nkutoo mu.
Sɛ wosakra chip abusua, antenna kɛse, conductor, card material anaa card environment a, ebetumi asesa resonance na asakra akenkan adwumayɛ. Ɛnsɛ sɛ wɔsan de adwini a wɔapene so ama chip biako no di dwuma ara kwa ma chip foforo a wonni RF susuw.
Embedded HF Chip ne Antenna Nhyehyɛe
Multi-Card Krataa Nsiesiei a Wɔde Yɛ Lamination
Ɛsɛ sɛ wɔpaw chip no fi akenkanfo protocol, memory ahwehwɛde, ahobammɔ level, asɛm no ahoɔhare, asetra mu kyinhyia, adansedi ne software ecosystem. Brand din te sɛ MIFARE, NTAG ne ICODE yɛ nneɛma mmusua sen sɛ ɛbɛyɛ nsɛmfua a wɔde sesa nneɛma nyinaa.
| Chip Abusua / Option | Protocol Positioning | Typical Project Fit | Nea ɛho hia B2B Hyɛ no nsow |
|---|---|---|---|
| Fudan F08 / Nea ɛne no hyia Legacy 1K Option | Wɔtaa bisa sɛ wɔmfa nhyehyɛe ahorow a ɛne ISO/IEC 14443 Type A hyia; ɛsɛ sɛ wosi ɔfã no nɔma pɔtee so dua | Legacy access, membership ne installed-reader a wɔde besi ananmu nnwuma | Si so dua sɛ nea ɔyɛe, nkae, UID, nokwaredi, akenkanfo a ɛne ne ho hyia ne mmara kwan so ahyɛnsode nkyerɛkyerɛmu |
| MIFARE Classic EV1 1K / 4K na ɛyɛ nea ɛwɔ hɔ nnɛ | ISO/IEC 14443-3 Ɔkwan a wɔfa so yɛ A, 106kbit/s | Transport, tekiti, akwan a wɔfa so kɔ hɔ ne agodie ho nhyehyɛe a ɛwɔ hɔ dedaw | Agyapade nneɛma abusua; fa di dwuma wɔ baabi a nhyehyɛe a wɔde ahyɛ mu no hwehwɛ nkutoo na hwehwɛ nnɛyi ahobammɔ a wɔde besi ananmu a wɔde besi adwini foforo mu |
| MIFARE Ultralight EV1 na ɛwɔ hɔ | ISO/IEC 14443 Type A atwa yɛn ho ahyia | Tekete a wɔde di dwuma kakraa bi, nsɛm a esisi, nokwaredi ne nhyehyɛe ahorow a ɛnyɛ den a wɔmfa nkitahodi nni dwuma | Fa memory, password ne originality features no hyia application threat model no |
| NTAG 213 / 215 / 216. Nsɛm a wɔka kyerɛ | NFC Forum Ɔkwan 2 Tag ne ISO/IEC 14443 Ɔkwan A | NFC adwuma kaad, nokwaredi nkitahodi, mobile nkitahodi ne nneɛma a ɛka ho | Ɛsono nea ɔde di dwuma no nkae wɔ ɔkwan a wɔfa so yɛ no mu; si NDEF kɛseɛ, asɛmfua ne mfitiaseɛ ahwehwɛdeɛ so dua |
| MIFARE AKWANKYERƐ EV3 | ISO/IEC 14443 Type A afã horow 1–4 a ɛwɔ ahobammɔ dwumadie a ɛkorɔn | Ahobanbɔ a wɔde kɔ hɔ, akwantuo, sukuupɔn, identity, nokwaredi ne multi-application cards | Ɛhwehwɛ sɛ wɔhwɛ safoa so, application personalization ne akenkanfo/software nkabom |
| ICODE SLIX2 / ISO 15693 Abusua | ISO/IEC 15693, NFC Forum Type 5 gyinabea | Vicinity-card, nhomakorabea, agyapade, identification ne longer-coupling-distance nnwuma | Ɛnsɛ sɛ wɔde ISO/IEC 14443 Type A akenkanfoɔ sesa; si akenkanfoɔ protocol ne antenna kɛseɛ so dua |
Gyinapɛn ahorow pii a enni nkitahodi yɛ adwuma wɔ 13.56MHz. Ɔkenkanfoɔ no bɛtumi aboa ISO/IEC 14443 Type A, Type B, ISO/IEC 15693, NFC Forum tag ahodoɔ anaa application layer a ɛyɛ ne dea. Mpɛn dodow a wɔyɛ no nkutoo nnɔɔso sɛ wɔbɛpene nea ɛne ne ho hyia so.
Sikakorabea, sikatua, aban nkyerɛkyerɛmu ne akwantuo adwuma a wɔahyɛ ho mmara no betumi ahwehwɛ sɛ wɔde chips a wɔagye atom, safe a wɔde hyɛ mu a ahobanbɔ wom, adwumayɛ a wɔahwɛ so, nhyehyɛeɛ a wɔpene so ne application sɔhwɛ. Ɛnsɛ sɛ wɔtɔn generic HF inlay sɛ ɛyɛ krado sɛ wobetua a wonni ahwehwɛde a wɔhwehwɛ.
| Parameter | Available Akwankyerɛ | Production Control |
|---|---|---|
| 2 × 5 Nsiesiei a Wɔde Yɛ Adwuma | A4-type prototype ne nketewa-volume kaad a wɔyɛ | Si krataa no nsusuwii pɔtee, kaad no nne ne dinkyerɛw agyiraehyɛde ahorow so dua |
| 3 × 7 / 3 × 8 na ɛwɔ hɔ | Mfiridwuma mu smart-card krataa nhyehyɛe a wɔtaa yɛ | Match lamination mprɛte, punching adwinnade, tintim cores ne collation akwankyerɛ |
| 4 × 8 / 4 × 10 / 5 × 5 na ɛwɔ hɔ | Higher-output nhyehyɛe ne adetɔfo pɔtee nnwinnade | Di RF nkitahodi a ɛda antenna a ɛbɛn ne krataa deformation ntam no so |
| Amanneɛbɔ Nhyehyɛe | Amanneɛbɔ kaad nsusuwii, safe fobs, mini kaad anaa soronko punching formats | Fa CAD mfonini, nneɛma a wɔawie ho nkyerɛkyerɛmu, chip gyinabea, antenna beae ne twa kwan ma |
| Prelam Nneɛma a Ɛyɛ Den | Mprempren kratafa no nkyerɛkyerɛmu bɛyɛ 0.45 ± 0.02mm; amanne kwan so nhyehyɛe ahorow a ɛwɔ hɔ | Si so dua sɛ wɔkyekyem pɛpɛɛpɛ, nsɛntitiriw nsakrae, chip-bump zone ne final-card stack akontaabu |
| Atadeɛ | White PVC, PVC a ɛda adi pefee ne project-specific PETG anaa PC-compatible structures | Validate shrinkage, bonding, ɔhyew, RF tuning ne wie-kaad durability |
Wɔtaa yɛ CR80/ID-1 kaad a wɔtaa yɛ no bɛn 0.76mm, nanso abodwokyɛre pɔtee no gyina kaad no ne nnwinnade no ho nkyerɛkyerɛmu so. Ɛsɛ sɛ wɔde cores a wɔatintim, anim ne akyi overlays, adhesives ne local chip thickness ka akontaabu no ho.
Ebia krataa no wɔ average gauge tolerance mu bere a chip zone no yɛ locally thicker. Ɛsɛ sɛ cavity design, cushioning, press pressure ne layer selection siw bumps a wotumi hu, bonding a ɛyɛ mmerɛw ne chip a ɛsɛe no ano.
| Antenna Factor | Nsunsuansoɔ wɔ Kaad no so | a ɛhia sɛ wɔdi ho adanseɛ |
|---|---|---|
| Coil Geometry a Wɔde Di Dwuma | Controls inductance, coupling beae ne ɛwɔ hɔ twa clearance | Match chip capacitance, card nsusuwii, akenkanfo ne botae a atwa yɛn ho ahyia |
| Kɔbere Nhama Antena | Boa embedded coil designs ne geometry a ɛyɛ mmerɛw | Wire diameter, embedding bun, crossover, bond nkwaa ne nkɔso |
| Aluminium Antenna a Wɔakyerɛw no | Boa antenna a wɔayɛ no sɛnea wɔayɛ no kɛse a ɛyɛ den | Trace trɛw, ɛko tia, corrosion ahobammɔ, chip attachment ne lamination suban |
| Chip a Ɛwɔ Hɔ | Sesa resonance a ɛwɔ antenna/chip circuit no mu | Retune bere a woresakra chip abusua anaa package |
| Kaad a Wɔaboaboa Ano | Plastic, ink, foil, metalized graphics ne overlays betumi asesa coupling na detune antenna no | Sɔ kaad a wɔawie no hwɛ, ɛnyɛ prelam a ɛda hɔ kwa no nkutoo |
| Fa Nneɛma a Atwa Yɛn Ho Ahyia Di Dwuma | Dade a ɛwɔ soro, telefon, sika kotoku, kaad a ɛbɛn ne nsu betumi aka adwumayɛ | Hwɛ akenkanfo a wɔahyɛ da ayɛ, mounting tebea ne user handling |
Akenkan kwan no gyina chip, antenna beae, quality factor, akenkanfo tumi, akenkanfo antenna, protocol, kaad kwankyerɛ, kaad stack a etwa to ne nneɛma a atwa yɛn ho ahyia so. Ɛsɛ sɛ asɛm a wɔafa aka no kyerɛ sɔhwɛ akenkanfo ne pass/fail distance sen sɛ wɔde amansan nɔma biako bedi dwuma.
Antennas a ɛwɔ multi-card sheet so no hwehwɛ sɛ ɛda ntam a ɛfata fi nhama a wɔde twa, ntokuru a wɔde kyerɛw wɔn din ne mmeae a ɛbɛn hɔ. Ɛsɛ sɛ sheet-level RF sɔhwɛ ahorow bu akontaa fa coupling a ɛda antenna ahorow ntam ansa na wɔabɔ cards no.
| Layer | Dwumadi Safoa | Nkonimdi |
|---|---|---|
| Anim a Wɔde Kata So | Ɛbɔ mfonini a wɔatintim ho ban na ɛma gloss, matte, frosted anaa ahobammɔ wie | Thickness, bonding, abrasion ne personalization a ɛne ne ho hyia |
| Anim a Wɔatintim Core | Ɔde mfonini ahorow a wɔahyɛ da ayɛ, nsɛm, ahyɛnsode ne ahobammɔ tintim | Print registration, ink cure, shrinkage ne RF-ahobammɔ dade nsunsuanso |
| H. F. Prelam Inlay a wɔde kyerɛw nsɛm | Ɛwɔ chip, antenna, anyinam ahoɔden nkwaa ne plastic layers a ɛboa | RF tuning, chip gyinabea, thickness, alignment, bond ne anyinam ahoɔden aba |
| Back Printed Core a Wɔatintim no | Ɛkari pɛ wɔ anim layer no mu na ɛde reverse-side artwork kɔ | Gauge kari pɛ, magnetic-stripe gyinabea ne print coverage |
| Akyi Nkataso | Ɛbɔ adwinni ho ban na ebetumi ayɛ stripe, signature panel anaa ahobammɔ feature | Bonding, flatness, encoding ne nea etwa to no soro |
Ntama akɛse a wɔde dade ayɛ, ink a ɛma nsu fa mu anaa dade a ɛbɛn antenna no betumi atew coupling anaa shift tuning so. Fa nneɛma a etwa to a wɔde siesie fie ka RF sɔhwɛ ahorow ho na hwɛ mmeae a emu da hɔ wɔ baabi a ɛho hia.
Ɛsɛ sɛ anim ne akyi layer gauges, material direction ne print coverage kari pɛ wɔ baabi a ɛbɛyɛ yiye. Asymmetrical stacks betumi ama card curl aba bere a wɔayɛ no hyew na wɔayɛ no nwini akyi.
Si stack a wɔapene so no so dua: Kyerɛw overlay, printed core, inlay, adhesive, stripe ne security layer biara.
Hyehyɛ nkratafa nyinaa: Ma nneɛma no gyina baabi a wɔyɛ no na ma ɛho tew, ɛnyɛ petee na ɛnyɛ nwunu.
Hwɛ sɛnea wobɛfa so: Fa krataa no akwankyerɛ, kaad no nnyigyei, chip gyinabea, antena gyinabea, adwinni ne punching agyiraehyɛde ahorow hyia.
Develop lamination cycle: Fa ɔhyew, nhyɛso, tra, mprɛte wie, gyae krataa ne onwini ma pɛpɛɛpɛ nneɛma stack.
Bɔ chip beae no ho ban: Di mpɔtam hɔ nhyɛso so na kwati nneɛma nketenkete a ɛyɛ den, mprɛte sintɔ anaa nneɛma a ɛsen dodo wɔ IC no ho.
Onwini wɔ nhyɛso a wɔahyɛ so: Onwini nya flatness, layer adhesion, chip stress ne dimensional stability so nkɛntɛnso.
Sɔhwɛ ansa na woabɔ akuturuku: Hwɛ anyinam ahoɔden dwumadi a ɛwɔ krataa so, sɛnea ɛte, ne kɛse, ne bonding ne ne dinkyerɛw.
Sɔ kaad a wɔawie hwɛ: Punch, personalize na hwɛ RF adwumayɛ, nsusuwii, bending ne application compatibility.
| Lamination Asiane | a ebetumi de aba | Nsiesiei Akwankyerɛ |
|---|---|---|
| Chip a Ɛnyɛ Adwuma | Ɔhyew a ɛboro so, mpɔtam hɔ nhyɛso, anyinam ahoɔden a ɛsɛe anaasɛ chip nkitahodi a ɛyɛ mmerɛw | Hwɛ chip package anohyeto, nhyehyɛe nhyɛso, ESD controls ne nkitahodi su |
| Bue Antenna Kwansin no | Conductor a abubu, nkwaa a enye, twa a asɛe anaasɛ ɛtrɛw dodo | Hwɛ sɛnea ɛkɔ so, conductor kwan, punching clearance ne mfiridwuma mu nhyɛso |
| Akenkan a Ɛyɛ Mmerewa | Detuning, conductor a ɛyera, akenkanfoɔ a ɛnhyia, metalized artwork anaa card-stack nsakraeɛ | Sua resonance na retune denam card a woawie ne target reader no so |
| Chip Bump a Wotumi Hu | Akatua a ɛnnɔɔso, module no mu duru a ɛboro so anaasɛ nhyɛso a ɛnteɛ | Optimize mpɔtam hɔ cavities, layer gauges, cushioning ne pressing tebea horow |
| Delamination a wɔde di dwuma | Efĩ, nneɛma a ɛne ne ho nhyia, ɔhyew a ɛba fam anaasɛ onwini a enye | Hwɛ nneɛma a ɛne ne ho hyia, ahotew, kyinhyia ne peel adwumayɛ mu |
| Krataa anaa Kaad Warpage | Stack a ɛnkari pɛ, ɔhyew a ɛboro so, nhyɛso a ɛnteɛ anaasɛ onwini a enni so ntɛmntɛm a wontumi nni so | Kari pɛ layers na optimize ɔhyew, mprɛte flatness ne onwini |
| Nhwehwɛmu Ade | a Wɔkamfo kyerɛ B2B Control |
|---|---|
| Chip Identity a Wɔde Di Dwuma | Hwɛ nea ɔyɛe, ɔfã nɔma pɔtee, memory, UID option, protocol ne lot traceability |
| Electrical Dwumadie | Kenkan chip UID, memory anaa defined command a wɔahyehyɛ wɔ card gyinabea biara sɛnea nhwehwɛmu nhyehyɛe no te |
| Antenna a Ɛkɔ So | Hu circuits a ɛbue, shorts, joints a ɛyɛ mmerɛw, conductor sintɔ ne crossovers a asɛe |
| Resonance / RF Adwumayɛ | Sua RF parameter anaa dwumadie akenkan kwan a wɔapene so denam sɔhwɛ mfiri a wɔakyerɛkyerɛ mu ne fixture so |
| Chip ne Antenna Gyinabea | Hwɛ gyinabea a ɛne CAD, card outline, punch clearance ne antennas a ɛbemmɛn no |
| Krataa no Nsusuwii | Ne tenten, ne tɛtrɛtɛ, ne squareness, card pitch, registration tokuru ne edge quality |
| Nneɛma a Ɛyɛ Den ne Nea Ɛyɛ Petee | Sɛ wɔkyekyem pɛpɛɛpɛ a, ne kɛse, mpɔtam hɔ chip-zone kɛse, curl, bow ne point-to-point nsakrae |
| Nhwehwɛmu a Wɔde Aniwa Hu | Efĩ, ahurututu, nwi, nsensanee tuntum, conductor a ɛda adi, nsensanee ne layer sintɔ |
| Kaad Sɔhwɛ a Wɔawie | RF dwumadie, nsusuiɛ, ne kɛseɛ, ne bending, torsion, ɔhyew, nsuo, peel ne akenkanfoɔ a ɛne ne ho hyia |
| Traceability a wotumi hwehwɛ mu | Chip lot, antenna lot, PVC lot, da a wɔyɛe, nhyehyɛe, sɔhwɛ nhyehyɛe, krataa nɔma ne packing kyerɛwtohɔ |
Nhwehwɛmu a edi mũ betumi akyerɛ anyinam ahoɔden akenkan sɔhwɛ wɔ gyinabea biara, bere a wɔtaa fa dimensional, peel ne destructive sɔhwɛ ahorow ho nhwɛso. Ɛsɛ sɛ adetɔ ho nkyerɛkyerɛmu no kyerɛkyerɛ sɔhwɛ nneɛma, fixture, gye a wobegye atom, sampling nhyehyɛe ne amanneɛbɔ.
Prelam betumi atwam anyinam ahoɔden sɔhwɛ na ɛda so ara di nkogu wɔ ɔhyew a ɛboro so, nhyɛso, punching anaa personalization akyi. Ɛsɛ sɛ B2B ahwehwɛde no ka incoming-inlay ne finished-card adwumayɛ nyinaa ho.
| Dwumadi | Chip / Protocol Akwankyerɛ | Critical Validation |
|---|---|---|
| Adwumayɛfo ne Access Cards | Legacy Type A, MIFARE Plus anaa DESFire sɛnea access system a wɔde ahyɛ mu no te | Akenkanfo a ɛne ne ho hyia, safoa sohwɛ, dinkyerɛw ne da biara da kotow |
| Ahɔhodan mu Safoa Kaad | Chip a wɔhwehwɛ wɔ ahɔhodan-lock platform no mu | Lock encoder, ahɔho-hwɛ nhyehyɛe, card thickness ne humidity exposure |
| Transport ne Campus Kaad a Wɔde Di Dwuma | Secure multi-application chip te sɛ DESFire baabi a system architecture hwehwɛ | Aguadi ahoɔhare, ahobammɔ, akenkanfo agyapade, ankorankoro ne asetra mu kyinhyia |
| Asɔremma ne Nokwaredi Krataa | Type A memory chip, NTAG anaa secure application chip sɛnea program nhyehyɛe te | Akenkanfo anaa telefon a ɛne ne ho hyia, database, kokoamsɛm ne nea wɔde di dwuma mpɛn pii |
| NFC Adwumayɛ ne Adwumayɛ ho Kaad | NTAG anaa chip foforo a ɛne NFC Forum hyia | NDEF tumi, fon a ɛne ne ho hyia, URL ahobanbɔ ne scan gyinabea |
| Nhomakorabea, Agyapade ne Mpɔtam Hɔ Kaad | ISO/IEC 15693 / ICODE-su ano aduru | Akenkanfoɔ protocol, antenna kɛseɛ, botaeɛ kwan, anti-collision ne EAS ahwehwɛdeɛ |
| Secure Identity ne Katua Nnwuma | Certified secure chip ne application architecture a wɔapene so | Adansedie, key injection, audited supply chain ne nhyehyɛeɛ pɔtee bi a wɔpene so |
HF RFID Inlay Dwumadie a Wɔde Yɛ Smart Card Dwumadie
| Data / Ahobanbɔ Ade | B2B Ahwehwɛde |
|---|---|
| UID | Si UID tenten, ID suban a wɔahyɛ da ayɛ anaa random, database format ne akenkanfo mmoa so dua |
| Memory Encoding a Wɔde Di Dwuma | Kyerɛkyerɛ data nhyehyɛe, sectors/fael/kratafa, NDEF kyerɛwtohɔ, lock bits ne verification |
| Nneɛma a Wɔde Di Dwuma | Kyerɛkyerɛ owura titiriw, injection nhyehyɛe, akwantuo ho banbɔ, diversification ne audit trail |
| Password / Access Nsiesiei a Wɔde Di Dwuma | Kyerɛ password, access bits, counters, originality checks ne lock-state sɔhwɛ wɔ baabi a wɔboa |
| Data a Ɛsakra a Wɔatintim | Fa nɔma a wɔatintim, barcode anaa QR code bata chip data ho denam mpata a wɔahyɛ so |
| Kaad a Wɔapow | Tetew, kan na sɛe kaad a ɛwɔ live keys, identifiers anaa encoded data mu no yiye |
Nhyehyɛe a ɛma kwan ma wonya kwan fi adekyerɛfo a ɔmanfo betumi akenkan nkutoo so no betumi ayɛ nea ɛyɛ mmerɛw sɛ wɔbɛyɛ ho mfonini anaasɛ wɔayɛ ho mfonini. Ɛsɛ sɛ nnwuma a ɛfa ahobanbɔ ho de chip ne backend architecture a ɛboa cryptographic authentication a ɛfata di dwuma.
Sɛ wode chip a ahobammɔ wom ma a, ɛnyɛ nea ɛka application nhyehyɛe anaa safoa a wɔhwɛ so ho ara kwa. Kyerɛkyerɛ nea ɔbɔ, sie, de gu mu na ɔhwɛ sɛ safe yɛ nokware, ne sɛ ebia ɛho hia sɛ wɔyɛ ahobammɔ-personalization tebea a wɔayɛ ho nhwehwɛmu anaa.
Hybrid smart card betumi de HF ne LF, UHF, contact chip anaa HF application foforo abom. Saa adan yi hwehwɛ sɛ wonya baabi pii, antenna a wɔde ahwɛyiye tetew mu, mpɔtam hɔ thickness control foforo ne lamination ne sɔhwɛ nhyehyɛe a wɔatu ho ama.
| Hybrid Structure | Use Case | Engineering Asiane |
|---|---|---|
| LF + HF na ɛwɔ hɔ | Tu a wotu fi agyapade a ɛbɛn kwan a wɔfa so kɔ HF smart-card nhyehyɛe ahorow so | Antenna space, wɔn ho wɔn ho nkitahodi, card thickness ne dual-reader sɔhwɛ |
| HF + UHF na ɛwɔ hɔ | Short-range identity ne akyirikyiri akyi tracking | Antenna nhyehyɛe ahorow, nneɛma a ɛde ba ne UHF nkate a ɛbɛn nipadua anaa dade |
| HF Chips abien | Application ahorow a wɔatew wɔn ho anaasɛ independent issuer domains | Akenkanfoɔ a wɔpaw, antenna a wɔde ka bom, data wurayɛ ne kaad-nhyehyɛeɛ anohyetoɔ |
| Nkitahodi + Nkitahodi a wonni | Dual-interface ahobammɔ identity, telecom anaa sikatua nhyehyɛe | Module cavity, antenna nkitahodi, lamination, adansedi ne ankorankoro |
Ɛnsɛ sɛ wɔka HF prelam a ɛyɛ frequency biako a wɔahyɛ da ayɛ ho asɛm sɛ ɛboa LF anaa UHF ankasa. Multi-frequency structures hia wɔn ankasa mfonini, chip list, RF sɔhwɛ, thickness specification ne bo.
Fa prelam nkratafa sie petee wɔ nneɛma a wɔatoto mu, ɛho tew na ɛyɛ nwunu mu wɔ baabi a owia hann ne ɔhyew nni hɔ tẽẽ.
Fa boards a ɛyɛ den, interleaving ne cartons a wɔabɔ ho ban di dwuma na amma bending, scratches ne chip-zone pressure.
Kwati electrostatic discharge a ano yɛ den na fa ESD handling controls a ɛfata di dwuma wɔ baabi a ɛho hia.
Mfa nnesoa a emu yɛ duru a ɛnteɛ nhyɛ krataa a wɔaboaboa ano no so anaasɛ mma pallet no nkɔ soro.
Tebea nneɛma wɔ lamination dan no mu ansa na wɔayɛ ho adwuma bere a adekoradan ne nneɛma a wɔyɛ no tebea yɛ soronko.
Kyerɛ pack biara denam chip model, antenna design, layout, thickness, batch ne inspection tebea so.
Fa nneɛma a wɔakora so a edi kan, nea wodi kan fi adi di dwuma na san sɔ nneɛma hwɛ bere a wode asie anaasɛ wode akɔ baabiara akyɛ.
Wɔabɔ ho ban Flat Packing ma HF RFID Prelam Nkratafa
Prelam a wotumi de ho to so a wɔyɛ no hwehwɛ sɛ wɔde antenna a wɔahyɛ so a wɔde hyɛ mu anaasɛ wɔde etching, chip a wɔde bata ho, krataa a wɔde kyerɛw wɔn din, plastic lamination, anyinam ahoɔden sɔhwɛ, dimensional inspection, clean handling ne batch traceability. Ɛsɛ sɛ chip, antenna twetwe ne RF sɔhwɛ kwan a wɔapene so no kɔ so yɛ nea ɛyɛ pintinn ma ahyɛde a wɔsan yɛ gye sɛ wɔapene nsakrae a wɔahyɛ so.
RFID Inlay Dwumadie ne Mfiridwuma Kuo
Prelam Inlay Nneɛma a Wɔyɛ Ho Nhyiam
Antenna ne Inlay Adeyɛ a Wɔde Di Dwuma
Electrical ne Dimensional Nhwehwɛmu
Chip a egyina application so paw: Legacy access, NFC, secure multi-application ne ISO 15693 projects betumi atew mu denam protocol ne ahobammɔ ahiade so.
Custom antenna engineering: Wobetumi abom ahwɛ coil geometry, conductor, chip capacitance, card outline ne target reader.
Nkratafa nhyehyɛe a ɛyɛ mmerɛw: Kaad pii nhyehyɛe a wɔahyɛ da ayɛ ne kaad a wɔde ma adetɔfo pɔtee bi wɔ hɔ.
Card-material integration: PVC prelam betumi ayɛ biako ne printed cores, overlays, magnetic stripes ne finished-card structures.
Mmoa a ɛfa ahwehwɛdeɛ ho: Nhwɛsoɔ, lamination sɔhwɛ, RF sɔhwɛ, thickness checks ne finished-card verification brɛ adwuma no mu asiane ase.
Factory-direct B2B supply: Ɛfata ma smart-card adwumayɛbea ahorow, printers, converters, system integrators, issuers, importers ne distributors.
Application, akenkanfo brand/model, protocol ne software platform a wɔde ahyɛ mu.
Chip yɛfo ne ɔfã nɔma, memory, UID ne ahobammɔ ahwehwɛde ahorow pɛpɛɛpɛ.
Krataa nhyehyeɛ, ne nyinaa nsusuiɛ, kaad no nne, nkyerɛwdeɛ agyiraeɛhyɛdeɛ ne dodoɔ.
Kaad kɛse, antenna pefee beae, chip gyinabea ne punching mfonini.
Prelam nneɛma, kɔla, din mu duru ne abodwokyɛre.
Antenna mfiridwuma, botae resonance anaa dwumadi akenkan-akwan sɔhwɛ.
Kaad stack a etwa to, cores a wɔatintim, overlays, dade tintim, stripe anaa signature panel.
Lamination press, ɔhyew, nhyɛso, tra, onwini ne mprɛte nsusuwii.
Electrical sɔhwɛ, RF sɔhwɛ, dimensional nhwehwɛmu ne gye a wogye tom gyinapɛn.
Encoding, key injection, UID list, data a ɛsakra anaa database mpata.
Prototype dodow, afe afe nkɔmhyɛ, nhyehyɛe a wɔsan kra ne nsakrae-hwɛ ahwehwɛde ahorow.
Packing, inspection nkrataa, destination port ne da a wɔsrɛɛ sɛ wɔde bɛkɔ.
Ka Wo HF RFID Inlay Dwumadi no ho asɛm
Ɛyɛ card-manufacturing core sheet a 13.56MHz chip ne antenna wɔ plastic layers mu. Wɔde cores a wɔatintim ne overlays ayɛ laminated na ama wɔayɛ cards a wɔawie a contactless.
Dabi, prelam yɛ mfinimfini dwumadi fã. Kaad a wɔawie no hwehwɛ sɛ wɔtintim foforo, wɔde kata so, wɔde lamination, onwini, punching ne personalization anaa encoding a wopɛ.
Nnwuma betumi de ISO/IEC 14443 Type A, Type B, ISO/IEC 15693 anaa NFC Forum a ɛne no hyia chips adi dwuma. Protocol pɔtee no gyina IC ne akenkanfo nhyehyɛe a wɔapaw no so.
Dabi Wɔyɛ nneɛma mmusua ahorow a ɛsono wɔn protocol, memory, commands, security ne applications. Si chip ne akenkanfo no so dua ansa na woakra.
Wobetumi aka akwan horow a ɛte saa a ɛne agyapade a ɛne 1K hyia ho asɛm. Fa chip ahwehwɛdeɛ ne akenkanfoɔ nhwɛsoɔ pɔtee ma, ɛfiri sɛ ɛsɛ sɛ wɔhwɛ sɛ nea ɔyɛɛ no, UID, memory ne authentication hyia.
Ɛda so ara fata ma agyapadeɛ nhyehyɛeɛ a wɔde ahyɛ mu, nanso ɛsɛ sɛ nnɛyi ahobanbɔ nnwuma hwehwɛ mprempren akwan foforɔ te sɛ MIFARE DESFire anaa MIFARE Plus sɛdeɛ nhyehyɛeɛ no nhyehyɛɛ teɛ.
NTAG 213, 215 anaa 216 ne chips afoforo a ɛne NFC Forum hyia no yɛ nea wɔtaa paw. Paw model no fi NDEF memory a wɔhwehwɛ, fon a ɛne ne ho hyia ne ahobammɔ nneɛma mu.
Ebia chip a ahobammɔ wom a ɛwɔ application ahorow pii te sɛ MIFARE DESFire bɛfata, nanso ɛsɛ sɛ wosi akenkanfo mmoa, safoa sohwɛ, adansedi, aplikeshɔn fael ne softwea so dua.
Wɔde ISO/IEC 15693 di dwuma ma mpɔtam-kaad dwumadie a akenkanfoɔ, antenna kɛseɛ ne botaeɛ nkitahodiɛ kwan no yɛ soronko wɔ proximity-kaad nhyehyɛeɛ a egyina ISO/IEC 14443 so.
Nneɛma a wɔtaa paw no bi ne 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ne 4 × 10. Wobetumi ayɛ nhyehyɛe ahorow a wɔahyɛ da ayɛ afi adetɔfo no lamination ne punching mfonini mu.
Mprempren ade krataafa no kyerɛ bɛyɛ 0.45 ± 0.02mm ma HF nhyehyɛe ahorow a wɔapaw. Nea etwa to no mu duru gyina chip, antenna, nneɛma, card stack ne mpɔtam hɔ chip-zone ahwehwɛde ahorow so.
Aane. Fa botae a wɔawie-kaad no kɛse, overlay ne printed-core gauges, chip package ne lamination nhyehyɛe ma sɛnea ɛbɛyɛ a wobetumi abu stack a edi mũ no ho akontaa.
Aane. Antenna geometry betumi ayɛ nea atwa chip capacitance, card kɛse, akenkanfo, botae adwumayɛ, chip gyinabea ne cutting clearances ho ahyia.
Wobetumi aka kɔbere-haya a wɔde ahyɛ mu ne etched-aluminum a wobetumi apaw ho asɛm. Adansi a eye sen biara no gyina volume, resistance, thickness, bonding, card design ne RF botae so.
Amansan nyinaa mu baabiara nni hɔ. Ɛgyina chip, antenna, akenkanfoɔ, card stack, orientation ne nneɛma a atwa yɛn ho ahyia so. Kyerɛkyerɛ sɔhwɛ akenkanfo ne dwumadie kwan a ɛsua koraa.
Wobetumi de adi dwuma wɔ RF sɔhwɛ akyi. Dade krataa akɛse anaa ink a ɛma nsu fa mu a ɛbɛn antenna no betumi ayɛ detune anaasɛ abɔ ho ban contactless interface no.
Wobetumi asan ahwɛ nneɛma nhyehyɛe foforo mu, nanso ɛsɛ sɛ wogye shrinkage, bonding, lamination temperature, RF tuning ne finished-card durability di dwuma wɔ ɔkwan soronko so.
Wɔtaa de prelam no ma sɛ blank functional core. Wɔtaa de tintim di dwuma wɔ nkratafa titiriw a ɛsono emu biara so, ɛwom sɛ wobetumi aka adansi a ɛfa adwuma pɔtee bi ho ho asɛm de.
Ɛnsɛ sɛ wotintim amansan tebea biara ma nhyehyɛe biara. Nya ɔhyew, nhyɛso, tra ne onwini twa PVC, overlay, ink, chip ne antenna adansi no ho hyia pɛpɛɛpɛ.
Fa chip packaging a ɛne no hyia, mpɔtam hɔ thickness a wɔahyɛ so, mprɛte a ɛho tew, nhyɛso a ɛkari pɛ, ɔhyew kyinhyia a wɔapene so ne anyinam ahoɔden sɔhwɛ ansa na wɔayɛ lamination ne bere a woawie no di dwuma.
Wobetumi akyerɛ anyinam ahoɔden sɔhwɛ a edi mũ. Ɛsɛ sɛ adetɔ apam no kyerɛ ahyɛde ahorow a wɔhwɛ wɔ gyinabea biara ne sɔhwɛ ahorow a ɛsɛe ade anaa nsusuwii a wɔde nhwɛsode di dwuma.
Wobetumi aka UID akenkan, memory encoding, NDEF akyerɛw anaa application personalization ho asɛm. Secure-key services hwehwɛ sɛ wonya nkyerɛkyerɛmu a ɛyɛ soronko a wɔahyɛ so.
Wobetumi ayɛ nneɛma a wɔde afrafra ho nhyehyɛe sɛ nneɛma a ɛsono emu biara. Wɔhwehwɛ antenna nhyehyɛe a wɔatu ho ama, nhyehyɛe a ɛfa ne kɛse ho, akenkanfo sɔhwɛ ne bo a wɔbɔ.
Aane. Adeyɛ a wɔpɛ ne sɛ wɔbɛsɔ prelam no ahwɛ, ayɛ laminate card stack a edi mũ no, punch cards na wɔahwɛ sɛ RF, mfiridwuma ne personalization adwumayɛ.
MOQ gyina chip a ɛwɔ hɔ, antenna nnwinnade a wɔahyɛ da ayɛ, nhyehyɛe, nneɛma, ne kɛse, sɔhwɛ nhyehyɛe, encoding ne sɛ ebia wobetumi de gyinapɛn nhyehyɛe a wɔapene so adi dwuma anaa.
Fa chip pɔtee, akenkanfo, protocol, nhyehyɛe, krataa kɛse, kaad mfonini, ne kɛse, antenna botae, kaad stack a etwa to, sɔhwɛ ahorow, dodow, packing ne baabi a wɔrekɔ ma.
Di Wallis Plastic ho nkɔmmɔ na woanya 13.56MHz HF RFID PVC prelam inlay nkrataa a wɔayɛ no sɛnea wopɛ a wode bɛkɔ, ID, ahɔhodan, asɔremma, akwantu, NFC ne smart-card a wɔyɛ. Yɛn kuw no boa chip paw, antenna nhyehyɛe, krataa nhyehyɛe, RF tuning, lamination sɔhwɛ, anyinam ahoɔden sɔhwɛ, encoding, quality specifications ne factory-direct B2B supply.
