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Inlay / prelam
Wallis na ɔkyerɛwee
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| Dodow: | |
Wallis dual-frequency RFID TK4100 + F08 inlay prelam krataa yɛ semi-finished functional core ma manufacturers a wɔyɛ hybrid access, adwumayɛfo ID, sukuupɔn, asɔremma, ahɔhodan ne multi-system smart cards. Ɛka LF 125kHz TK4100 adansedi krataa a ɛde ne ho ne HF 13.56MHz F08 adansedi krataa a ɛde ne ho bom wɔ kaad nhyehyɛe biako mu, na ɛma kaad a wɔawie no tumi ne akenkanfo nhyehyɛe abien a ɛne no hyia di nkitaho.
LF ne HF amansin no da so ara tetew: frequency biara wɔ n’ankasa chip, antenna anaa coil, protocol suban ne akenkanfo a ɛne ne ho hyia. Sɛ wopɛ sɛ wotumi de ho to so sɛ wɔbɛyɛ nneɛma pii a, ɛsɛ sɛ wosi chip references, akenkanfo mfonini ahorow, antenna gyinabea, krataa nhyehyɛe, kaad nhyehyɛe a wɔawie ne botae akenkan adwumayɛ so dua ansa na wɔde nnwinnade ne bulk lamination ayɛ.
| Parameter | Nkyerɛkyerɛmu Nkyerɛkyerɛmu ne B2B Confirmation Point |
|---|---|
| Aguade a Wɔde Yɛ Adwuma | Dual-frequency RFID inlay prelam krataa ma akyiri yi Overlay film lamination, tintim, punching ne card personalization. |
| Standard Nneɛma a Wɔaka abom | LF 125kHz TK4100 + HF 13.56MHz F08. Ɔde ne nsa kyerɛɛ ne so, na ɔde ne nsa kyerɛɛ ne so bio. Si chip yɛfo pɔtee, memory nhyehyɛe, UID format ne akenkanfo/nhyehyɛe ahwehwɛde ahorow so dua wɔ adetɔ ho nkyerɛkyerɛmu no so. |
| Nsiesiei a Ɛwɔ Hɔ | 2×5 (A4), 3×7, 3×8 ne nkrataa matrices afoforo a wɔayɛ no sɛnea wɔpɛ. Ɛsɛ sɛ krataa no nsusuwii a etwa to, kaad no nnyigyei, margins, registration marks ne punching akwankyerɛ di mfonini a wɔapene so no akyi. |
| Nkyerɛkyerɛmu prelam Nneɛma a ɛyɛ den | Bɛyɛ 0.55–0.60mm ma mprempren LF + HF nhyehyɛe no. Ankasa thickness ne tolerance gyina chip package, antenna adansi, substrate ne awiei card stack. |
| Nneɛma a Wɔde Yɛ Adwuma | PVC sɛ gyinapɛn a wɔpaw; wobetumi asusuw kaad substrates afoforo a ɛne no hyia ho sɛnea lamination nhyehyɛe ne adwuma no ahwehwɛde ahorow te. |
| LF Antena a ɛwɔ hɔ | Mpɛn pii no ɛyɛ kuru kɔbere coil a wɔayɛ ama 125kHz chip ne akenkanfo a wɔapaw no. |
| HF Antena a ɛwɔ hɔ | Etched anaa embedded antenna nhyehyɛe tuned ma 13.56MHz chip a wɔapaw, card stack ne akenkanfo tebea. |
| Ani | Blank prelaminated functional core, a wɔayɛ sɛ wɔde bɛka abom ne core nkrataa a wotumi tintim ne/anaasɛ Overlay film s a ɛda adi. |
| Nneɛma a wɔyɛ no sɛnea wɔpɛ | Chip a wɔaka abom, antenna geometry, nhyehyɛe, ne kɛse, krataa kɛse, nkyerɛwde agyiraehyɛde, nneɛma nhyehyɛe, nneɛma a wɔde kyekyere ne nkyerɛwde. |
| Nhwɛsode a Wɔpene So | Wɔkamfo mfiridwuma mu nhwɛsode ne Sika Nhwɛsode kyerɛ ansa na wɔayɛ no pii. Wɔasi so dua sɛ ɛwɔ hɔ, dodow ne nneɛma a wɔde fa so wɔ adwuma biara mu. |
LF 125kHz TK4100 Inlay Nneɛma a wɔahyehyɛ
HF 13.56MHz F08 Inlay Nneɛma a wɔahyehyɛ
Dual-frequency RFID prelam yɛ laminated mfinimfini krataa a ɛwɔ ahofadi contactless circuits abien wɔ card gyinabea biara. Wɔde di TK4100 circuit no dwuma ma 125kHz proximity-reader dwumadie a ɛne no hyia, berɛ a wɔde F08 circuit no di dwuma ne 13.56MHz akenkanfoɔ nhyehyɛeɛ a ɛne no hyia.
Sɛ wode amansin mmienu no bom wɔ kaad nipadua baako mu a, ɛho wɔ mfasoɔ berɛ a ɛsɛ sɛ ahyehyɛdeɛ bi hwɛ agyapadeɛ LF akwannya nhyehyɛeɛ so berɛ a ɛde HF aplikeshɔn a ɛyɛ soronko reka ho. Ɛnka protocol anaa database abien no bom. Ɛsɛ sɛ nea ɔde kaad ma no kyerɛw ne din na ɔhwɛ adansedi krataa biara so wɔ nhyehyɛe a ɛne no hyia no mu.
Wɔtaa paw TK4100 sɛ akenkan nkutoo ho adansedi krataa ma 125kHz bɛn akenkanfo a ɛne no hyia. Wɔtaa de di dwuma bere a nhyehyɛe no kenkan nɔma a wɔahyɛ da ayɛ sen sɛ ɛbɛkora application data so no. Ɛsɛ sɛ wɔde access-control integrator no si bit format pɔtee, facility-code handling ne akenkanfoɔ a ɛne ne ho hyia no so dua.
Wɔtaa de F08 di dwuma sɛ 13.56MHz contactless memory credential wɔ nhyehyɛe ahorow a ɛne no hyia mu. Ɛsɛ sɛ adetɔfoɔ no si F08 nkyerɛaseɛ pɔtee, memory nhyehyɛeɛ, nsafe, UID dwumadie, sector data ne personalization kwan no so dua. 13.56MHz dwumadie frequency nko ara nkyerɛ sɛ ɛne smartphones, NFC applications, MIFARE-branded systems anaa ISO /IEC 14443 akenkanfoɔ biara bɛhyia.
Wɔ smart-card nsɛmfua mu no, mpɛn pii no, dual frequency kyerɛ radio nhyehyɛe abien a enni nkitahodi te sɛ LF + HF . Dual interface taa kyerɛ contact chip a wɔde contactless interface ka ho. Fa asɛmfua a ɛfata di dwuma wɔ mfonini ahorow, nsɛm a wɔafa aka ne nhyehyɛe ho nkrataa mu de asiw mfomso a ɛba wɔ adetɔ mu ano.
| Adeɛ | TK4100 Ɔfã | F08 Ɔfã |
|---|---|---|
| Mpɛn dodoɔ | 125kHz LF | 13.56MHz HF |
| Dwuma a Wɔtaa Di | Fixed-ID bɛn ho adansedi krataa ma akenkanfo a wɔfa so kɔ hɔ anaasɛ wɔba a ɛne no hyia. | Kenkan/kyerɛw memory credential ma HF kaad dwumadie a ɛne no hyia. |
| Akenkanfo Ho Nsɛm a Wɔhwehwɛ | Akenkanfoɔ brand/model, data format a wɔboa, kaad nɔma a wɔhwɛ kwan ne akenkan kwan a wɔde asi wɔn ani so. | Akenkanfoɔ brand/model, protocol, memory/key ahwehwɛdeɛ, UID nhyehyeɛ ne ayɔnkofa adwumayɛ a wɔhwɛ kwan. |
| Nnipa a wɔyɛ wɔn ankasa de | Mpɛn pii no, egyina factory-programmed identifier no so; si so dua sɛ ebia nhyehyɛe no hwehwɛ sɛ wɔde nɔma pɔtee bi di dwuma anaa. | Ebia ɛbɛhwehwɛ sɛ wɔyɛ sector programming, keys, data files anaasɛ issuer-side enrollment. |
| Ahobammɔ a Wɔde Sisi Hɔ | Ɛfata ma nnwuma a ɛgye mfitiaseɛ akenkan nko ara LF adansedie krataa. | Sɛnea ɛfata no gyina chip ne ahobammɔ ho nhyehyɛe pɔtee no so. Ɛsɛ sɛ nnwuma foforo anaa ahobammɔ kɛse kyerɛ chip platform a ahobammɔ wom a wɔapene so. |
| Telefon a Wɔde Di Dwuma | Standard smartphones ntaa nkenkan 125kHz proximity credentials. | Mfa no sɛ smartphone ne smartphone hyia; hwɛ sɛ chip, protocol ne target phone operating system no pɛpɛɛpɛ. |
Antenna abien a wɔde ahyɛ kaad a ɛyɛ tratraa biako mu no betumi anya resonance, akenkan kwan, lamination suban ne punching clearance so nkɛntɛnso. Enti ɛsɛ sɛ wɔyɛ antenna geometry sɛ kaad nhyehyɛe biako a wɔaka abom sen sɛ wɔbɛka inlays abien a ɛde ne ho abom a wonni ho adanse.
Ɛsɛ sɛ wɔde LF coil ne HF antenna no si hɔ sɛnea ɛbɛyɛ a ɛbɛtew coupling a wɔmpɛ so na ama mmeae a ɛda adi pefee ama card anoano, contact modules, magnetic stripes, signature panels, holes anaa die-cut features soronko. Ɛsɛ sɛ wɔde ankasa finished-card stack no sɔ nhyehyɛɛ no hwɛ efisɛ layers a wɔatintim, Overlay film s ne conductive elements a ɛbɛn no betumi aka RF adwumayɛ.
Chip package mmeae betumi ahwehwɛ sɛ mpɔtam hɔ abura, cushioning layers anaasɛ controlled material build-up. Chip-area design a enye betumi ama bumps, mframa a ɛkyere, print distortion, delamination anaasɛ punching asɛe. Ɛsɛ sɛ mfonini a wɔapene so no kyerɛ chip coordinates ne mpɔtam hɔ thickness a wɔama ho kwan.
Kaad a ɛkenkan yiye wɔ desktop reader biako so no betumi ayɛ adwuma wɔ ɔkwan soronko so wɔ access reader a wɔde asisi ɔfasu so, ahɔhodan mu lock, turnstile anaa nsa so terminal so. Ɛsɛ sɛ wɔsɔ nhwɛsoɔ kaad hwɛ wɔ akenkanfoɔ nhwɛsoɔ biara a ɛka ho wɔ dwumadie no mu, firi akwankyerɛ ahodoɔ pii ne lamination a ɛtwa toɔ akyi.
HF Akenkanfoɔ Dwumadie
RFID Dwumadie Nhwɛsoɔ
Ɛsɛ sɛ prelam nhyehyɛe no ne adetɔfo no tintim mprɛte, laminator, collation kwan, punching adwinnade ne finished-card orientation hyia. Nsiesiei din te sɛ 3×8 nnɔɔso sɛ wobeyi nneɛma a wɔyɛ no adi; ɛho hia sɛ wɔyɛ mfonini a wɔasusuw ho.
| Drawing Item | Nsɛm a Ɛsɛ sɛ Wosi So dua |
|---|---|
| Krataa a Wɔde Di Dwuma | Krataa no nyinaa trɛw ne ne tenten, matrix, card pitch, edge margins ne feed direction. |
| Kaad Gyinabea | Finished card outline, corner radius, punching mfinimfini kwan ne anim / akyi kwankyerɛ. |
| LF Ɔmansin | Coil nsusuwii, dannan, chip gyinabea, kɔbere routing ne ahobammɔ no-twit beae. |
| HF Ɔmansin | Antenna outline, bridge/chip gyinabea, tuning botae ne beae a wɔabɔ ho ban a wɔmfa ntwa. |
| Wɔn a wɔbɛkyerɛw wɔn din | Optical agyiraehyɛde, punching agyiraehyɛde, print registration agyiraehyɛde ne X/Y displacement a wɔma ho kwan. |
| Nneɛma Afoforo a Ɛwɔ Hɔ | Contact-module cavity, magnetic stripe zone, signature panel, mfonini beae, slot tokuru anaa amanne kwan so nsusuwii. |
| Kaad a Wɔaboaboa Ano | Printable core, prelam, Overlay film s, adhesives, botaeɛ nyinaa mu duru ne layer nnidiso nnidiso. |
Hybrid RFID Kaad Nhyehyɛe a Wɔawie
Dual-Frequency Inlay Nsiesiei a Wɔde Yɛ Adwuma
Fa LF ne HF chip nkyerɛkyerɛmu a wɔhwehwɛ, akenkanfo nhwɛso, kaad-nɔma format, nhyehyɛe a wɔhwehwɛ ne gye a wogye tom no ma. Mma chip bi nnye ntom a egyina frequency nkutoo so.
Si krataa kɛseɛ, matrix, card pitch, antenna outline, chip coordinates, registration marks, punching akwankyerɛ ne full layer stack no so dua.
Sɔ prelam nkrataa a ɛda hɔ kwa ne nkrataa a wɔawie hwɛ. Hwɛ chip dwumadie, antenna mmuaeɛ, soro flatness, lamination compatibility, aniwa hwɛbea ne akenkanfoɔ adwumayɛ.
Ɛsɛ sɛ wɔde substrate a wɔapaw ne Overlay film na ɛyɛ ɔhyew, nhyɛso, bere a wɔde tra hɔ, ɔhyew dodow ne onwini tebea horow. Ɔhyew anaa nhyɛso a ɛboro so betumi ama antenna no akɔ, asɛe chip beae no anaasɛ asesa RF tuning.
Ɛsɛ sɛ Sika Nhwɛsode a wɔde wɔn nsa ahyɛ ase no kyerɛkyerɛ kaad no hwɛbea a wogye tom, ne nsusuwii, ɛlɛtrɔnik nneyɛe ne akenkanfo adwumayɛ ma batch nhwehwɛmu a edi hɔ.
Fa lot identification ne sampling nhyehyɛe a wɔapene so di dwuma de hwɛ traceability fi chips ne antennas denam prelam production, card lamination ne final delivery so.
| Inspection | Nea Ɛsɛ sɛ Hwɛ | Commended Stage |
|---|---|---|
| Chip Identity a Wɔde Di Dwuma | LF / HF chip nkyerɛkyerɛmu pɛpɛɛpɛ, UID anaa serial data, lot traceability ne chip a wɔsɛe no a wotumi hu. | Incoming components ne prelam a wɔawie. |
| Antenna no mudi mu kura | Nkɔso, bonding points, coil lead tebea ne antenna sintɔ ahorow. | Ansa na wɔreyɛ prelamination ne akyi. |
| RF Mmuae a Wɔde Ma | LF ne HF yɛ adwuma wɔ ahofadi mu, botae akenkanfo nhyiam, kwankyerɛ ne akenkan-kwansin mfɛnsere. | Bare prelam na wɔawie kaad. |
| Nkitahodi a Wɔde Di Dwuma | Si so dua sɛ sɛ wode akenkanfo biako yɛ adwuma a, ɛmma nneyɛe a wonnye ntom mma wɔ ɔmansin a ɛto so abien no mu. | Engineering nhwɛsode ne Sikakɔkɔɔ Nhwɛsode. |
| Layout Kyerɛwtohɔ | Chip ne antenna gyinabea tia X / Y coordinates, punching line ne no-cut zones. | Nneɛma biara a wɔyɛ. |
| Mfiridwuma mu Nneɛma a Ɛyɛ Pa | Krataa no nsusuwii, ne kɛse, ne petee, ahurututu, efĩ, mpɔtam hɔ chip bump ne ɔfasu a asɛe. | prelam gyae nhwehwɛmu. |
| Lamination Nea Efi Mu Ba | Peel resistance, warpage, card thickness, ano su ne chip-beae hwɛbea. | Finished-kaad a wɔde gye tom. |
| Nnipa a wɔyɛ wɔn ankasa de | Teɛ LF nɔma a wɔkyere, HF memory/key dwumadie ne database dinkyerɛw. | Issuer anaa system-integrator validation. |
TK4100 + F08 nkabom no fata paa wɔ baabi a ɛsɛ sɛ wɔboa akenkanfoɔ mpɔtam mmienu a ɛwɔ hɔ dada wɔ honam fam adansedie krataa baako mu na wɔagye nhyehyɛeɛ mmienu no nyinaa atom wɔ chips a wɔapaw no ho.
Adwumayɛfoɔ ne adwumayɛfoɔ kaad a wɔde di dwuma wɔ agyapadeɛ LF akwan a wɔfa so kɔ hɔ ne HF aplikeshɔn a ɛyɛ soronko.
Campus, club anaa agyapadeɛ sohwɛ nkrataa a ɛka adansedie nhyehyɛeɛ mmienu a ɛne ne ho hyia bom.
Bere-kɔ ne ɔdan-kwan ho nnwuma a ɛhwehwɛ sɛ wɔde LF ne HF nkyerɛkyerɛmu ahorow a ɛtetew wɔn ho.
Migration projects a ahyehyɛdeɛ bi reyɛ nsakraeɛ afiri 125kHz akenkanfoɔ so akɔ 13.56MHz infrastructure.
OEM smart-card production a card adwumayɛbea no hwɛ print, lamination ne punching nhyehyɛe a edi mũ so.
Wɔ ahɔhodan mu apon, akwantuo, sikatua, aban adansedie nkrataa anaa nhyehyɛeɛ foforɔ a wɔahyɛ so ho no, ɛsɛ sɛ nhyehyɛeɛ wura no hɔ ma ɛne ne ho hyia na ɛbɔ ho kwan. Frequency match nkutoo nnɔɔso.
| Dwumadie no Hia Akwankyerɛ | a Ɛbɛtumi Afata | a Ɛho Hia |
|---|---|---|
| Mfitiaseɛ LF Nkyerɛkyerɛmu | TK4100 anaa LF adansedi krataa foforo a wɔapene so a wɔkenkan nkutoo. | Si akenkanfo data format ne card-number ahwehwɛde ahorow so dua. |
| Akyerɛw LF Adansedi krataa | Wobetumi asusuw LF chip a wotumi kyerɛw a ɛne no hyia ho. | Si nhyehyɛe nnwinnade, memory, password/security ne mmara nhyehyɛe tumi krataa so dua. |
| Legacy HF Nkaeɛ Kaad | F08 anaasɛ 13.56MHz memory chip foforo a nhyehyɛe no apene so. | Si safoa, UID suban, memory map ne akenkanfo firmware so dua. |
| Ahobanbɔ-Nsɛm HF Dwumadi Foforo | Kyerɛ nnɛyi chip platform a ahobammɔ wom a system wura no apene so. | Kyerɛkyerɛ cryptography, key management, lifecycle ne adansedi ahwehwɛde ahorow mu ansa na wɔayɛ antenna. |
| Telefon-Tap Marketing a Wɔde Di Dwuma | Paw NFC Forum-compatible chip a wɔayɛ ama smartphone nkitahodi. | Sɔ hwɛ wɔ iOS ne Android mfiri a wɔde asi wɔn ani so so; nsusuw sɛ F08 no hyia. |
| Tracking a Ɛkɔ Akyirikyiri | UHF nkabom betumi ayɛ engineering sɛ hybrid nhyehyɛe soronko. | Ɔmantam, akenkanfo, antenna kwankyerɛ ne RF sɔhwɛ a wɔawie-kaad ho hia. |
RFID ɛsɛ sɛ wɔbɔ prelam nkratafa ho ban fi benkum, electrostatic discharge, pressure points, nsuo a ɛkɔ soro, efĩ ne ɔhyew a wontumi nni so. Ɛsɛ sɛ packaging specifications ne sheet size, chip profile, shipment kwan ne lot traceability a wɔhwehwɛ no hyia.
Fa interleaving a ɛho tew anaasɛ ahobammɔ film di dwuma na ama ɔfasu no so nsensanee ne nneɛma nketenkete a ɛkɔ baabi foforo no so tew.
Ma nkratafa no nyɛ petee na gyina baabi a ɛyɛ pɛ no so bere a woredi ho dwuma no.
Tete nneɛma a wɔyɛ no mu na kyerɛ chip nkabom, nhyehyɛe, dodow ne nhwehwɛmu tebea.
Ma nneɛma no nkari pɛ wɔ beae a wɔyɛ nneɛma no ansa na wɔayɛ lamination bere a ɛsono sɛnea wɔkora nneɛma ne adwumayɛbea tebea horow kɛse no.
Wallis boa kaad adwumayɛbea ahorow, RFID ano aduru a wɔde ma ne nneɛma a wɔkyekyɛ denam adwuma a egyina chip a ɛne ne ho hyia, amanne kwan so antenna mfiridwuma, krataa-nhyehyɛe nkɔso ne kaad-nneɛma a wɔde ka bom. Botae no ne sɛ wɔde prelam nhyehyɛe a wobetumi agye atom wɔ adetɔfo no akenkanfo ankasa ne lamination tebea mu bɛma.
Engineering-oriented specification: chip, antenna, akenkanfo, nhyehyɛe ne card stack no bom hwɛ mu.
Amanneɛ nhyehyɛe mmoa: matrices, dimensions, registration marks ne chip coordinates betumi adi adetɔfo no nnwinnade akyi.
Nneɛma a wɔde bom: wobetumi aka nkrataa a wotumi tintim ne Overlay film s a ɛne ne ho hyia ho asɛm ama kaad nhyehyɛe a edi mũ no.
Ahwehwɛdeɛ a wɔde nhwɛsoɔ di anim: mfiridwuma mu nhwɛsoɔ ne Sika Nhwɛsoɔ a wɔpene so tew asiane a ɛwɔ hɔ sɛ wɔbɛyɛ nneɛma pii so.
B2B nkrataa: wobetumi de mfonini ahorow, nneɛma a wɔde yɛ adwuma no ho nsɛm, lot a wɔde kyerɛ ne nhwehwɛmu ahwehwɛde ahorow ahyia ne adetɔ ahyɛde no.
| Nsɛm a Wɔhwehwɛ | Nhwɛso anaa Nkyerɛkyerɛmu |
|---|---|
| LF Chip ne Ɔkenkanfo | TK4100 anaasɛ ɔkwan foforo a wɔfa so yɛ adwuma; akenkanfo ahyɛnsode/nhwɛsode; a wɔhwehwɛ sɛ wɔyɛ output/card-number format. |
| HF Chip ne Ɔkenkanfo | F08 nkyerɛase pɔtee anaa ɔkwan foforo; akenkanfo ahyɛnsode/nhwɛsode; protocol, safoa, memory ne UID ahwehwɛde ahorow. |
| Adwumayɛ a Wɔde Botae | Minimum/maximum akenkan kwan, orientation ne sɔhwɛ nhyehyɛe ma frequency biara. |
| Krataa a Wɔde Yɛ Mfonini | Ne nyinaa kɛse, nhyehyɛe, kaad no nnyigyei, punching marks, feed akwankyerɛ ne card orientation. |
| Kaad Stack a Wɔawie | Core nkratafa, Overlay film s, adhesives, tintim layers ne botae nyinaa thickness. |
| Kaad no mu Nneɛma Afoforo | Magnetic stripe, contact chip, signature panel, slot, beae a ɛda adi anaasɛ nsusuwii soronko. |
| Order ho Nsɛm | Nhwɛsoɔ dodoɔ, nkɔmhyɛ dodoɔ, nneɛma a wɔde ahyɛ mu, baabi a wɔrekɔ ne nkrataa a wɔhwehwɛ. |
Ɛyɛ semi-finished card core a ɛwɔ 125kHz TK4100 circuit ne 13.56MHz F08 circuit a ɛyɛ soronko wɔ card gyinabea biara mu. Akyiri yi wɔde krataa no ka layers a wotumi tintim ne Overlay film s, laminated na punched ma ɛyɛ cards a wɔawie.
Dabi Wɔyɛ chips a ɛde ne ho a ɛwɔ antenna nhyehyɛe, frequency ne data suban a ɛsono emu biara. Wɔakyerɛw LF ne HF adansedi nkrataa no din na wɔahwɛ so wɔ ɔkwan soronko so.
Wɔtaa paw TK4100 sɛ akenkan nkutoo LF nkyerɛkyerɛmu adansedi krataa. Sɛ ɛho hia sɛ wɔyɛ LF dwumadie a wɔtumi kyerɛw a, kyerɛ ɔkenkanfoɔ, nhyehyɛeɛ mfiri ne chip foforɔ a wɔapene so ansa na woafa asɛm aka.
Wobetumi de F08 ne MIFARE Classic adi dwuma wɔ agyapade 13.56MHz application tebea horow a ɛte saa ara mu, nanso ɛnsɛ sɛ wɔde kyerɛ sɛ chip a wɔakyerɛw din koro no ara. Si chip yɛfo pɔtee, protocol suban, memory, keys, UID ahwehwɛde ne akenkanfo a ɛne ne ho hyia no so dua.
Dabi, sɛ woyɛ adwuma wɔ 13.56MHz a, ɛmma chip bi ne NFC fon nyinaa ntumi nyɛ adwuma. Smartphone a ɛne ne ho hyia no gyina chip ne protocol pɛpɛɛpɛ, fon hardware, operating system ne application so.
Wobetumi asusuw ho bere a hotel lock yɛfo anaa system integrator no asi chip, protocol, UID/key suban ne akenkanfo a ɛne ne ho hyia a wɔhwehwɛ no so dua akyi nkutoo. Ɛnyɛ mpɛn dodow a wɔyɛ no nkutoo so na wotumi sesa ahɔhodan nhyehyɛe ahorow.
Mfa no sɛ ɛte saa. Katua ne adansedie adwuma a ahobanbɔ kɛseɛ wom hwehwɛ sɛ wɔde chips a system apene so, cryptography, adansedie, personalization controls ne complete-card testing. Ebia ɛho behia sɛ wonya chip platform a ahobammɔ wom kɛse.
Aane. Wobetumi ayɛ krataa no nsusuwii, kaad matrix, antenna geometry, chip coordinates, registration marks, thickness ne card orientation afi mfiridwuma mu mfonini a wɔapene so mu.
Mprempren nkyerɛkyerɛmu a ɛwɔ saa LF + HF prelam yi bɛyɛ 0.55–0.60mm. Ankasa thickness ne tolerance gyina electronic components, antenna adansi, substrate ne ahwehwɛde a etwa to card stack.
Sɔ frequency abien no nyinaa hwɛ wɔ ahofadi mu wɔ target reader biara so, afei san yɛ bio bere a woatintim, lamination, punching ne personalization akyi. Afei nso hwɛ card thickness, warpage, chip-area flatness, peeling ne antenna gyinabea.
Wobetumi aka adwuma no ho asɛm sɛ prelam-only supply anaasɛ sɛ coordinated card-material structure a core sheets a wotumi tintim ne Overlay film s ka ho. Ɛsɛ sɛ wɔbom fata layers nyinaa ansa na wɔayɛ no kɛse.
Fa chip references pɛpɛɛpɛ, akenkanfoɔ nhwɛsoɔ, protocol ne data ahwehwɛdeɛ, nhyehyeɛ mfonini, antenna/chip coordinates, thickness ne dimensional tolerances, RF gye a wɔgye tom gyinapɛn, packaging, nhwehwɛmu nhyehyɛeɛ ne Golden Sample a wɔapene so ka ho.
