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Inlay / prelam
Wallis ye nye esia
| 2 * 5: | |
|---|---|
| 3 * 8: | |
| 3 * 7: | |
| Woate ŋu atrɔ asi le eŋu: | |
| Chip: | |
| Agbɔsɔsɔ: | |
125kHz kple 13.56MHz RFID PVC Prelam inlay Agbalẽvi siwo wowɔ ɖe ɖoɖo nu
Wallis naa 125kHz LF , 13.56MHz HF kple LF + HF dual-frequency RFID PVC prelam inlay sheets na access-control cards, dɔwɔlawo ƒe IDs, amedzrodzeƒe safui cards, hamevinyenye gbalẽviwo, sukuxɔ me cards, ʋuɖoɖo ƒe ɖaseɖigbalẽwo kple system-migration dɔwo wɔwɔ. Agbalẽvi ɖesiaɖe ƒoa chip tiatia, tuned antenna kple plastic support layers nu ƒu, si le klalo na kaɖi mamlɛtɔ lamination, tata, punching kple ame ŋutɔ ƒe tɔtrɔ.
Standard layout references include 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 and 4 × 10. Woate ŋu atrɔ asi le agbalẽ ƒe lolome siwo wowɔ ɖe ɖoɖo nu, kaɖi ƒe kɔkɔme, chip ƒe nɔƒewo, antenna ƒe nɔnɔmewo, nusiwo ƒe wɔwɔme kple eƒe titrime ŋu na nuƒlela ƒe lamination plates, agbalẽtata ƒe agbalẽwo kple punching dɔwɔnuwo.
Frequency ɖeɖe meɖoa kpe edzi be esɔ o. TK4100, EM4200 kple ATA5577-ƒomevi ƒe nusiwo mebɔ o ƒe nuwɔna to vovo na nuxexlẽ ɖeɖeko alo nuxexlẽ/ŋɔŋlɔ ƒe nuwɔna, kɔda kple ɖoɖowɔwɔ ƒe tiatia. HF chips ateŋu azã ISO /IEC 14443 Ƒomevi A, ISO /IEC 14443 Ƒomevi B, ISO /IEC 15693 alo NFC Nyamedzroƒe ƒe nɔnɔmewo. Ele be woaɖo kpe nuxlẽla, chip ƒe kpɔɖeŋu, ɖoɖowɔɖi, ŋkuɖodzinu, dedienɔnɔ kple dɔwɔwɔ ƒe kɔmpiuta dɔwɔɖoɖo si tututu dzi hafi woawɔ antenna ƒe wɔwɔme kple ewɔwɔ le agbɔsɔsɔ gã me.
| Adzɔnu Ƒomevi | LF , HF alo dual-frequency RFID prelaminated inlay sheet na plastic-kaɖi wɔwɔ |
| Tiatia Siwo Woawɔ Zi Edzi | 125kHz LF , 13.56MHz HF , LF + HF mɔ̃ɖaŋununya vovovowo ƒe xɔtuɖoɖo siwo wotsɔ tsaka kple esiwo ku ɖe dɔa koŋ ŋu |
| Ðoɖo Siwo Woɖo Ðe Ðoɖo Nu | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 kple kaɖi ƒe ɖoɖo siwo wowɔ ɖe ɖoɖo nu |
| LF prelam Titrime ƒe Nufiame | Anɔ abe 0.50–0.60mm ene na LF xɔtuɖoɖo tiatia; titrime tututu nɔ te ɖe chip, antenna, nu kple kaɖi mamlɛtɔ ƒe ƒuƒoƒo dzi |
| Nusiwo Woatsɔ Awɔ Tiatia | Yevu alo nusi me kɔ PVC ; PETG kple xɔtunu siwo sɔ kple polycarbonate siwo ƒe dzeside le vovo |
| Antenna ƒe Tiatiawɔblɔɖe | Akɔbli-ka LF / HF coils siwo wotsɔ de eme, aluminum HF antenna siwo woŋlɔ kple antenna eve ƒe nɔnɔme siwo wowɔ ɖe ɖoɖo nu |
| B2B Kpekpeɖeŋunana | Chip tiatia, antenna mɔ̃ɖaŋu, CAD ɖoɖo, kpɔɖeŋuwo, lamination dodokpɔwo, RF dodokpɔ, encoding, QC nyatakakawo kple export supply |
Bia RFID prelam Kpɔɖeŋuwo kple Nyayɔyɔ
RFID prelam inlay nye ememe dɔwɔwɔ ƒe agbalẽ si wozãna tsɔ wɔa plastic card si me kadodo mele o. Wotsɔa antenna, nutome sue si wotsɔ wɔ ɖekae kple elektrik kadodowo dea plastik ƒuƒoƒo dome hafi nuƒlela tsɔa nu vevi siwo wota kple Overlay film s siwo me kɔ kpena ɖe eŋu. Wotsɔa laminated ƒoa stack si wowu enu la, fanɛ, ƒoa punch eye wòtrɔa asi le eŋu wòzua agbalẽvi siwo wowɔ vɔ.
Zi geɖe la, asisiwo ƒe nutata aɖeke metsɔa prelam la ɖe asi o. Wozãa agbalẽtata tsɔ ɖea ŋgɔgbe kple megbe core sheets ɖe vovo, si kpena ɖe ame ŋu be woakpɔ chip kple antenna ta esime woɖea mɔ ɖe amadede si dzi wokpɔna, Overlay film kple dedienɔnɔ-nɔnɔmewo wɔwɔ ŋu.
Dual-frequency card me LF kple HF nutome vovovowo le. Chip eveawo mezua protocol ɖeka o. Ele be woatrɔ asi le frequency ɖesiaɖe ŋu, atrɔ asi le eŋu, axlẽe eye—afisi wodo alɔe le—aŋlɔe to nuxlẽla ƒe mɔnu si sɔ dzi.
Wota ƒuƒoƒo, ga nɔnɔmetatawo, magnet fliwo, adhesives, kaɖi ƒe titrime, ga si te ɖe eŋu kple nuxlẽla ƒe geometry ate ŋu atrɔ RF ƒe dɔwɔwɔ. Eyata ele be dzedze nalɔ kaɖi si wotsɔ laminated kple punched bliboe ɖe eme, ke menye bare prelam ɖeɖeko o.
125kHz LF Chip kple Coil ƒe wɔwɔme
Multi-Card Sheet na Dɔwɔƒewo ƒe Lamination
| Inlay | Ƒomevi | Xɔtuɖaŋu B2B Zazã si bɔ |
|---|---|---|
| 125kHz LF prelam ƒe didime. | LF chip ɖeka kple akɔbli coil si ƒe frequency bɔbɔ ɖeka si wotu ɖo | Domenyinu si te ɖe ame ŋu ƒe mɔɖeɖe, ʋutɔɖoƒe, hamevinyenye kple dzesidede ame ƒe ɖoɖowo |
| 13.56MHz HF prelam | HF chip ɖeka kple ISO / NFC -si sɔ kple antenna ɖeka si wotia na dɔwɔwɔ | Mɔɖeɖe dedie, ʋuɖoɖo, sukuxɔ, amedzrodzeƒe, NFC kple dɔbiagbalẽvi geɖe |
| LF + HF Eve-Afɔɖeɖe prelam | Ma LF kple HF chips ɖe vovo kple coil vovovowo le kaɖi ƒe ŋutilã ɖeka me | Ʋuʋu tso 125kHz xlẽla xoxowo gbɔ yi egbegbe HF smart-card xɔtuɖoɖowo gbɔ |
| LF + UHF alo HF + UHF | Chip geɖe kple antenna siwo wozãna le frequency-specific me le xɔ ɖeka me | Mɔɖeɖe kpe ɖe ʋu si didi wu, nunɔamesi alo dɔwɔlawo yometiti ŋu |
| Kadodo + Kadodomanɔsitɔ ƒe Hybrid | RFID prelam kpe ɖe milled contact-module cavity alo eve-interface xɔtuɖaŋu ŋu | Dzesidede dzesideŋkɔ, telefonkadodo, gadzraɖoƒe alo ɖaseɖigbalẽdɔ siwo ŋu wowɔ ɖoɖo ɖo le dzedze vɔ megbe |
Habɔbɔwo ateŋu ana ɖaseɖigbalẽ ɖeka si wɔa dɔ kple LF nuxlẽla xoxowo kple HF nuxlẽla yeyewo esime wole xɔtuɖoɖowo dom ɖe ŋgɔ. Ele kokoko be nyatakakadzraɖoƒe si kpɔa mɔɖeɖe dzi la nawɔ nɔnɔmetata na dzesidenu alo dɔwɔɖoɖo siwo tso mɔ̃ɖaŋununya eveawo siaa me ahakpɔ wo dzi.
Chip evelia tsɔtsɔ kpe ɖe eŋu dzia teƒea ƒe titrime, antenna ƒe ʋuʋu, nusiwo ƒe sisi kple dodokpɔ ƒe sesẽ ɖe edzi. Mele be woatrɔ frequency ɖeka ƒe wɔwɔme wòazu dual frequency ne womewɔ ɖoɖo yeye, lamination dodokpɔ kple RF ƒe dzeside o.
Tia nusi wotsɔ de eme la tso kaɖi siwo wòle be wòawɔ dɔ le wò nuxlẽla siwo nèda ɖe wò kɔmpiuta dzi la me. Zi geɖe la, enyo wu be woatsɔ frequency ɖeka awɔ inlay ne interface ɖeka koe hiã; dual-frequency design ɖea vi vevietɔ ne ele be LF nuxlẽla siwo li xoxo kple HF xɔtuɖoɖo yeyewo nade dzesi kpeɖodzi ŋutɔŋutɔ ɖeka ma ke.
| Dɔa ƒe Nɔnɔme | si Wodo ɖa Inlay | Ele be Nuƒlela Naɖo kpe edzi |
|---|---|---|
| 125kHz ƒe mɔɖeɖe ƒe ɖoɖo si li fifia | LF -prelam koe kple chip kple code ƒe nɔnɔme si sɔ pɛpɛpɛ | Nuxlẽla ƒe dodo, modulation, bit ƒe didime, facility code kple card numbering |
| Mɔnu yeye si me woate ŋu age ɖo dedie alo sukuxɔa me ɖoɖo | HF -prelam koe zãa IC dedie si dzi woda asi ɖo | Nuxlẽla ƒe ɖoɖowɔɖi, nya ɣaɣlawo ƒe dɔwɔwɔ, safuiwo dzikpɔkpɔ kple agbenɔnɔ |
| Ʋuʋu vivivi tso LF yi HF | LF + HF eve-ɣeyiɣiwo ƒe prelam | Nuxlẽlawo ƒe xexlẽme siaa, antenna ƒe nɔnɔme vovovowo kple dzesidenu ƒe nɔnɔmetatawo |
| NFC nyatakakadzraɖoƒe alo dijitaal dɔwɔgbalẽvi | HF / NFC prelam kple NDEF-ŋutete ƒe chip si sɔ | Telefon ƒe dɔwɔwɔ ɖekae, payload ƒe ŋutete, URL ƒe dedienɔnɔ kple scan ƒe nɔƒe |
| Domenyinu LF ƒo ƒu kple HF dzesidenu dedie | Dual-frequency prelam kple LF tiatia kple dedie HF chips | Chip dzɔtsoƒe, firmware, zãla ƒe ŋkɔ ŋɔŋlɔ, antenna ƒe ʋuʋu kple dodokpɔ le ŋgɔdonya ɖesiaɖe ŋu |
Zi geɖe la, nɔa prelam si me frequency eve le chip eve siwo le wo ɖokui si kple antenna circuit eve siwo woɖɔ ɖo le wo ɖokui si . Woate ŋu atsɔ dzesideŋkɔ eveawo asɔ kple amea ƒe nyatakakadzraɖoƒe si kpɔa mɔɖeɖe dzi, gake zi evelia medoa domenyinu dɔwɔnu si mele dedie o ɖe ŋgɔ le eɖokui si o.
| LF Chip Tiatia | Xlẽ / Ŋlɔ Teƒeɖoɖo | Zãzã si bɔ | B2B Ƒle De dzesii |
|---|---|---|---|
| TK4100-Ƒomevi | Domenyinu si bɔ ƒe nuxexlẽ ɖeɖeko ƒe tete ɖe wo nɔewo ŋu ƒe ɖoɖowɔwɔ; ele be woaɖo kpe nudzrala tututu kple encoding dzi | Mɔɖeɖewo dzi kpɔkpɔ kple dzesidede ame ƒe ɖoɖo veviwo | Na nuxlẽla ƒe kpɔɖeŋu kple emetsonu ƒe ɖoɖo si hiã; megatsɔe be 'TK4100' ƒe nuwɔnawo katã sɔ o |
| EM4200 ye nye esi | Factory-programmed low-frequency nuxexlẽ ɖeɖeko dzeside IC | Mɔɖeɖe ɖe nu ŋu dzi kpɔkpɔ, gbeɖuɖɔwo dzi kpɔkpɔ kple dzesidemɔnu tiatia aɖewo | Kpe ɖe kɔda ƒe didime, tɔtrɔ, mask tiatia kple nuxlẽla ƒe sɔsɔ dzi hafi ewɔwɔ |
| ATA5577 / T5577-Ƒomevi | Programmable LF nuxexlẽ / nuŋɔŋlɔ transponder kple ɖoɖowɔɖi modulation kple coding | De dzesi, ʋuʋu, dodokpɔ kple domenyinu ƒe nɔnɔme siwo sɔ si woate ŋu atrɔ asi le | Ðe ɖoɖowɔɖi ƒe mɔxenu, nyatakakawo ƒe nɔnɔme, nyagbegbɔgblɔ, ʋɔtru ƒe bits kple ɖoɖowɔɖi ƒe kpeɖodzi gɔme |
| EM4305 / R/W Bubuwo LF | Xlẽ/ŋlɔ LF tiatia siwo li na dɔwɔwɔ-koŋ ƒe nɔnɔmewo | Mɔɖeɖe, dɔwɔƒewo ƒe dzesidede kple ɖaseɖigbalẽ siwo woate ŋu awɔ ɖoɖo ɖe wo ŋu | Ðo kpe IC ƒe nɔnɔme, ŋkuɖodzinu, ametakpɔkpɔ kple ɖoɖowɔla ƒe kpekpeɖeŋu dzi pɛpɛpɛ |
Zi geɖe la, EM4200-ƒomevi ƒe ɖaseɖigbalẽwo ɖoa dzesidenu si ŋu wowɔ ɖoɖo ɖo le dɔwɔƒe, gake ATA5577-ƒomevi ƒe mɔ̃wo ya ate ŋu aɖoe eye ɖoɖowɔla si sɔ ate ŋu aŋlɔ wo. Ele be woagblɔ le nyayɔyɔa me nenye be nuƒlela hiã xexlẽdzesi si woɖo ɖi, asisiwo ƒe nuŋɔŋlɔ alo ƒuƒlu si woate ŋu awɔ ɖoɖo ɖe eŋu.
Wotsɔ dzidzenu siawo do ƒome kple lãwo ƒe dzesidede ŋuti nyatakakawo ƒe wɔwɔme kple ya ƒe kadodo ƒe ɖoɖowo. Mele be woatsɔ wo ade TK4100, EM4200 alo T5577 ƒe mɔɖeɖegbalẽvi ɖesiaɖe dzi abe blanket claim ene o. Kpe ɖe chip, ɖoɖowɔɖi kple nuxlẽla ƒe ɖoɖo si sɔ pɛpɛpɛ dzi.
| HF Chip Ƒomea ƒe | Ðoɖowɔɖi Mɔfiame | Dɔwɔwɔ ƒe | Tiatia si bɔ De dzesii |
|---|---|---|---|
| MIFARE Classic / Domenyinu si sɔ 1K | ISO /IEC 14443 Ƒomevi A ƒe domenyinu ƒe lãwo ƒe agbenɔnɔ | Wode mɔɖeɖe, tikitiwo xɔxɔ kple ɖoɖo xoxo siwo me wotu nu ɖo | Zãe le afisi xɔtuɖaŋu siwo li fifia bia le; da egbegbe mɔnu siwo le dedie ɖe ɖoɖo yeyewo teƒe kpɔ |
| MIFARE Ultralight ƒe keklẽ | ISO /IEC 14443 Ƒomevi A ƒe nɔnɔme | Tiketi siwo wozãna seɖoƒe li na, wɔnawo kple ɖoɖo bɔbɔe siwo me kadodo mele o | Ðo kpe ŋkuɖodzinu, gbãtɔ, nyagbe ɣaɣla kple agbenɔƒe ƒe nudidiwo dzi |
| NTAG 213 / 215 / 216. Ƒe 1999 me | NFC Nyamedzroƒe Ƒomevi 2 Tag kple ISO /IEC 14443 Ƒomevi A | NFC dɔwɔgbalẽviwo, asitelefon dzi kadodowo, ɖaseɖiɖi kple dijitaal nuwɔwɔ | Tia to NDEF ŋkuɖodzinu, URL ƒe didime, nyagbegbɔgblɔ kple gbãtɔ ƒe nudidiwo nu |
| MIFARE DZIDZƆDZƆDZƆ EV3 | ISO /IEC 14443 Ƒomevi A kple dedienɔnɔ ƒe dɔwɔwɔ siwo le dedie wu | Mɔɖeɖe dedie, sukuxɔ, ʋuɖoɖo, dzesidegbalẽvi kple dɔbiagbalẽvi geɖe | Ebia dɔwɔwɔ ƒe ɖoɖowɔwɔ, safuiwo dzikpɔkpɔ, ame ŋutɔ ƒe tɔtrɔ kple nuxlẽla/kɔmpiutadziɖoɖowo ƒe ƒoƒo ɖekae |
| ICODE / ISO 15693 Ƒome | ISO /IEC 15693 kple NFC Nyamedzroƒe Ƒomevi 5 ƒe nɔƒe | Agbalẽdzraɖoƒe, nunɔamesi, nuto-kaɖi kple didi-kadodo-didime dɔwɔwɔwo | Nuxlẽla ƒe ɖoɖowɔɖi kple antenna ƒe lolome to vovo tso ISO /IEC 14443 Type A ɖoɖowo gbɔ |
Nuxlẽla ateŋu awɔ dɔ le 13.56MHz eye wògakpɔtɔ doa alɔ dzidzenu alo sedede tiatia aɖewo ko. Tsɔ Ƒomevi A, Ƒomevi B, ISO 15693 alo NFC Forum ƒe kpekpeɖeŋu kpe ɖe chip ƒe kpɔɖeŋu tututu kple dɔwɔwɔ ƒe kɔmpiuta dɔwɔɖoɖo ŋu.
DESFire-class chip nana mewɔa ɖaseɖigbalẽ si le dedie le eɖokui si o. Ele be woawɔ safuiwo, dɔwɔɖoɖowo, mɔɖeɖe ƒe gomenɔamesiwo, vovototodedeameme, nudzɔla ƒe ɖoɖowo kple megbenyawo ƒe kpeɖodzinana ɖe vovo.
LF Teteɖeanyi Inlay Tiatia
Chip kple Antenna ƒe Ðekawɔwɔ si wowɔ ɖe ɖoɖo nu
| Mɔ̃ɖaŋununya | Dual-Frequency Nudidi |
|---|---|
| Antenna ƒe Mamã | Ðo LF kple HF coilwo ɖe teƒe be woaɖe ŋutilã ƒe ƒoƒo ɖe wo nɔewo dzi, nyaƒoɖeamenu ƒe ƒuƒoƒo kple kadodo si womeɖo be woawɔ o dzi akpɔtɔ |
| Chip ƒe Nɔnɔme | Na chip eveawo siaa nato vovo tso punching lines, slots, contact-module cavities kple high-pressure zones gbɔ |
| Nutoa me ƒe Titrime | Fexexe ɖe IC eve, coil crossovers kple connection points ta evɔ màwɔ bumps siwo woate ŋu akpɔ o |
| LF Trɔ asi le eŋu | Tsɔ LF coil kple chip capacitance sɔ kple nuxlẽla ƒe frequency, coding kple target read performance |
| HF Trɔ asi le eŋu | Trɔ HF antenna la kple chip mamlɛtɔ, kaɖi ƒe ƒuƒoƒo, ƒuƒoƒo siwo wota kple nuxlẽla si woɖo |
| System Mapping | Ðe alesi LF dzesidenu kple HF UID/dɔwɔwɔ do ƒome kple kaɖixɔla ƒe nuŋlɔɖi ɖeka me |
| Zãla Mlɔetɔ ƒe Kpeɖodzi | Do kaɖi ma ke si wowɔ vɔ la kpɔ le domenyinu ɖesiaɖe si hiã kple nuxlẽla yeye ƒe kpɔɖeŋu dzi |
Dual-frequency reader ateŋu ado alɔ LF nɔnɔme tiatia kple HF ɖoɖowɔɖi tiatia ko. Na nuxlẽla ƒe dzesi, eƒe nɔnɔme, firmware kple emetsonu si wokpɔ mɔ na ale be woate ŋu ado kaɖia kpɔ ɖe ɖoɖo ŋutɔŋutɔa ŋu.
LF kple HF ƒe nuxexlẽ ƒe didimewo to vovo eye wònɔ te ɖe nuxlẽla ƒe ŋusẽ, antenna ƒe nɔnɔme, kaɖi ƒe nɔnɔme, kɔda, kaɖi mamlɛtɔ ƒe ƒuƒoƒo kple nuto dzi. Zã pass/fail didime vovovowo kple dodokpɔ fixtures na interface ɖesiaɖe.
Le LF -to- HF ʋuʋu gome la, inlay nye rollout ƒe akpa ɖeka ko. Ele be nuƒlelawo nada asi ɖe nuxlẽlawo ƒe sɔsɔ ƒe matriki kple dzesidenu ƒe ʋuʋu ƒe ɖoɖo dzi hafi awɔ dɔwɔnu, awɔ kɔpi alo awɔ nudɔdɔ gbogbo siwo gbugbɔna.
| Validation Stage | Required Nuƒlela ƒe nyawo tsɔtsɔ yi | eme ƒe Dzesiwo |
|---|---|---|
| LF nuxlẽla ƒe agbalẽdzikpɔkpɔ | Nuxlẽla ƒe kpɔɖeŋu, firmware, modulation kple card-xexlẽdzesi ƒe dodo | Wode dzesi LF chip si wotia eye wòtrɔa dzesidenu si woɖo be wòatrɔ |
| HF nuxlẽla ƒe agbalẽdzikpɔkpɔ | Protocol, nuxlẽla software, ɖaseɖiɖi mɔnu kple IC tiatia | HF ƒe ŋgɔdonya wu dɔwɔwɔ ƒe asitsatsa si woɖo la nu |
| Dual-ID habɔbɔ | LF ID, HF UID/dɔwɔwɔ ƒe akɔnta, ŋkɔ ŋɔŋlɔ ƒe nuŋlɔɖi | Interface eveawo siaa kpɔa egbɔ na kaɖitɔ si ŋu woɖe mɔ ɖo la ƒoƒo manɔmee |
| Kpɔɖeŋu kaɖi dodokpɔ | Agbalẽtata ŋutɔŋutɔ, Overlay film s, foil kple lamination ƒe tsatsam | Interface eveawo siaa wɔa dɔ le kpɔɖeŋu ɖeka si wowu enu kple esi woƒo la dzi |
| Gbedzi yameʋukula si dzi wokpɔna | Nuxlẽla ƒe nyatakakadzraɖoƒe xoxowo kple yeyewo, zãlawo ƒe ƒuƒoƒo kple kpekpeɖeŋunaƒe ƒe ɖoɖo | Mɔɖeɖe si ŋu womewɔ ɖoɖo ɖo o ƒe kpododonu aɖeke meli o; woate ŋu ate fli ɖe agbalẽvi siwo gblẽ kple esiwo bu la me |
| Mass-production ƒe asidede agbalẽ te | Sika kpɔɖeŋu, chip lots, ɖoɖowɔɖi faɛl kple RF ŋkuléleɖenuŋu fixture | Woda asi ɖe eve-interface kutsetse, traceability kple tɔtrɔ-dzikpɔkpɔ nuŋlɔɖi |
Le afisi dedienɔnɔ le vevie le la, mègaɖo ŋu ɖe LF xexlẽdzesi alo HF UID si woate ŋu axlẽ le dutoƒo ko ŋu o. Ele be HF dɔwɔɖoɖoa nazã mɔɖeɖe kple nya ɣaɣlawo ƒe mɔnu siwo mɔɖeɖe ƒe ɖoɖo ŋutɔŋutɔ bia.
| Parameter | Nufiame Agbɔsɔsɔ / Nana Tiatia | B2B Dziɖuɖu Teƒe |
|---|---|---|
| 2 × 5 ƒe lolome | A4 ƒe lolome ƒe nufiame: 210 × 297mm | Ðo kpe kaɖi ƒe gbeɖiɖi, nugbɔ ƒe axadzi, antenna ƒe nɔnɔme kple ŋkɔ ŋɔŋlɔ ƒe dowo dzi |
| 3 × 7 ƒe lolome | Anɔ abe 295 × 460mm ene | Match tata nu vevi, lamination agbalẽvi kple punching dɔwɔnu |
| 3 × 8 ƒe lolome | Anɔ abe 295 × 485mm ene | Ðe nutatawo ƒe ŋkɔ dede agbalẽ me kple mɔfiame si woatsɔ ana xexlẽdzesiwo na agbalẽvi la gɔme |
| 4 × 8 / 5 × 5 / 4 × 10 ƒe lolome | Dɔwɔƒewo ƒe ɖoɖo siwo me woɖea nu geɖe le wu | Control sheet flatness, antenna dometsotso kple elektrik dodokpɔ ƒe mɔɖeɖe |
| Ðoɖo si Wowɔ Ðe Ðoɖo Nu | Kpekpeɖeŋugbalẽvi siwo wowɔ ɖe ɖoɖo nu, safuiwo, kaɖi suewo kple dɔwɔnu siwo nye ame ŋutɔ tɔ | Na CAD, ɖoɖowɔɖi si wowu enu, lãɖeɖe ƒe ʋuʋu kple chip/antenna ƒe nɔnɔmetatawo |
| LF Titrime ƒe Nufiame | Anɔ abe 0.50–0.60mm ene na LF xɔtuɖoɖo tiatia; ɖo kpe edzi kple nɔnɔmetata si dzi woda asi ɖo | Ðo kpe mamã dedie, nutoa me chip-zone gauge kple finished-card akɔntabubu dzi |
| Dual-Frequency ƒe Titrime | Dɔa koŋ eye zi geɖe la, chip eve kple antenna eve kpɔa ŋusẽ ɖe edzi | Da asi ɖe titrime ƒe anyigbatata, kaɖi ƒe gbadzaƒe kple teƒea ƒe nyaƒoɖeamenu ƒe fexexe dzi |
Wowɔ CR80/ID-1 kaɖi si bɔ la ƒo xlã eƒe titrime si woyɔna be titrime si gogo 0.76mm, gake emetsonu mamlɛtɔ nɔ te ɖe nu vevi siwo wota, Overlay film s, adhesive flow, chip zones kple lamination compression dzi. Dzidze agbalẽvi si wowu enu si wowɔ ɖoɖo ɖe eŋu.
'3 × 8' meɖea agbalẽ ƒe didime, ŋkɔ ŋɔŋlɔ ƒe dzesi alo kaɖi ƒe gbeɖiɖi ɖesiaɖe gɔme o. Ele be woade asi nutata mamlɛtɔ te hafi woawɔ antenna elabena vodada siwo wowɔna le punching kple chip position ate ŋu agblẽ elektrikŋusẽ ƒe ŋusẽ dome.
Agbalẽvi ƒe Ðoɖowɔwɔ Kple Ŋkɔ ŋɔŋlɔ Ðe Ðoɖo Nu
HF Chip kple Antenna ƒe Ðoɖowɔwɔ ƒe Tiatia
| Layer | Dɔwɔwɔ | Safui Dziɖuɖu |
|---|---|---|
| Ŋgɔgbe Overlay film | Ekpɔa agbalẽtata ta eye wònaa gloss, matte, frosted alo dedienɔnɔ ƒe nuwuwu | Gauge, bonding, abrasion kple ame ŋutɔ ƒe nɔnɔme ƒe sɔsɔ |
| Ŋgɔgbe si Wota Nu vevi | Etsɔa nɔnɔmetatawo, nuŋɔŋlɔwo, dzesiwo kple dedienɔnɔ ƒe agbalẽtata ɖe asi | Ŋkɔ ŋɔŋlɔ, ink dɔyɔyɔ, shrinkage kple metallic-print clear zones |
| RFID Prelam Inlay | Chip ɖeka alo esi wu nenema, antenna kple elektrik-kadodowo le eme | RF tuning, chip ƒe nɔƒe, titrime, elektrik ƒe kutsetse kple alignment |
| Back Printed Core | Edaa asɔ le ŋgɔgbe eye wòtsɔa nutata siwo le megbe | Layer balance, stripe position kple agbalẽtata ƒe nutsyɔnu |
| Trɔ yi megbe Overlay film | Ekpɔa kaɖia ta eye ate ŋu anye magnet-ka alo asidede agbalẽ te | Bonding, flatness, encoding kple anyigba mamlɛtɔ |
Ga teƒe gã siwo te ɖe HF antenna ŋu ateŋu aɖe coupling alo shift resonance dzi akpɔtɔ. De metalized print, holographic foil kple magnetic components katã ɖe card RF dodokpɔ mamlɛtɔ me.
Ŋgɔgbe kple megbedzidzenu mawo tɔgbe, nuawo ƒe mɔfiame si dzi wokpɔna kple agbalẽtata ƒe nutsyɔtsyɔ si da sɔ ate ŋu aɖe ʋuʋudedi dzi akpɔtɔ. Dual-frequency structures hiã be woalé ŋku ɖe wo ŋu geɖe wu elabena chip kple antenna ƒe teƒewo ate ŋu anye asymmetrical.
Da asi ɖe stack ƒe nɔnɔmetata dzi: Ŋlɔ Overlay film , nu vevi ɖesiaɖe si wota, inlay, adhesive, stripe kple security layer.
Dzra nuawo ɖo: Na agbalẽwo nali ke le teƒe si le dzadzɛ eye nàkpɔ wo ta tso ke kple tsi me.
Kpɔ alesi woɖoe ɖa: Tsɔ kaɖi ƒe gbeɖiɖi, chip ƒe nɔƒe, antenna ƒe teƒewo, nutatawo kple punching marks sɔ kple wo nɔewo.
Tu dzoxɔxɔ ƒe tsatsam ɖo: Ðo dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe, asiɖeɖe le nu ŋu kple fafa na xɔtutua tututu.
Takpɔ chip zones: Ƒo asa na nu sesẽwo, teƒea ƒe nyaƒoɖeamenu si gbɔ eme kple plate ƒe gbagbã le chip eveawo dometɔ ɖesiaɖe dzi.
Fafa le nyaƒoɖeamenu si dzi wokpɔ ŋusẽ ɖo me: Fafa kpɔa ŋusẽ ɖe gbadzaƒe, chip ƒe nuteɖeamedzi, kadodo kple RF ƒe ɖekawɔwɔ dzi.
Do laminated sheet la kpɔ: Lé ŋku ɖe eƒe titrime, eƒe nɔƒe, eƒe dzedzeme kple RF ƒe ƒomedodo eveawo siaa ŋu hafi nàƒoe.
Kpɔ kaɖi siwo wowɔ vɔ dzi: Punch, personalize, encode eye do LF kple HF ƒe dɔwɔwɔ kpɔ le ɖoɖo siwo woɖo be woawɔ la dzi.
| Afɔku si bɔ | si ate ŋu anye nusi gbɔ wòtso | Ðɔɖɔɖo Mɔfiame |
|---|---|---|
| Chip ƒe Dodokpɔ | Dzoxɔxɔ si gbɔ eme, nyaƒoɖeamenu, ESD alo chip ƒe kadodo si gbɔdzɔ | To chip ƒe seɖoƒewo, dɔwɔwɔ ƒe nyaƒoɖeamenu, ESD dziɖuɖu kple kadodo ƒe nyonyome me |
| Ʋu Coil | Conductor gbagbã, ƒunukpeƒe madeamedzi, lãɖeɖe ƒe gbegblẽ alo nusiwo ƒe ʋuʋu fũ akpa | Kpɔ ŋgɔyiyi, conductor mɔ, ƒunukpeƒe ƒe ŋusẽ kple punch clearance |
| Gbɔdzɔgbɔdzɔ LF alo HF Range | Detuning, nuxlẽla ƒe masɔmasɔ, card-stack ƒe tɔtrɔ alo ga ƒe nudede | Gbugbɔ trɔ asi le ŋgɔdonya ɖesiaɖe ŋu eye nàdoe kpɔ kple kaɖi si wowu enu kple nuxlẽla si woɖo taɖodzinu na |
| Chip Bump si Wokpɔna | Gauge compensation si mesɔ gbɔ o alo teƒea ƒe titrime si gbɔ eme | Optimize cavities, layer gauges, cushioning kple nyaƒoɖeamenu mama |
| Delamination (Dzidzedzekpɔkpɔ). | Ðiƒoƒo, nusiwo mewɔ ɖeka o, dzoxɔxɔ sue alo fafa si mesɔ o | To nusiwo wotsɔ wɔe ƒe ɖekawɔwɔ, dzadzɛnyenye, dzoxɔxɔ ƒe tsatsam kple lãgbalẽ ƒe ŋusẽ me |
| Kpekpeɖeŋugbalẽvi ƒe Warpage | Stack si meda sɔ o, dzoxɔxɔ si gbɔ eme, nyaƒoɖeamenu si mesɔ o alo fafa kabakaba | Da sɔ le ƒuƒoƒoawo me eye nàna dzoxɔxɔ, agbalẽvi ƒe gbadzaƒe kple fafa nanyo ɖe edzi |
| Dzroƒe Nu | Kafukafu B2B Dzikpɔkpɔ |
|---|---|
| Chip ƒe Dzesidede Ame | Kpɔ egbɔ be ewɔla, akpa ƒe xexlẽdzesi tututu, zi gbɔ zi geɖe, ɖoɖowɔɖi, ŋkuɖodzinu kple lot traceability |
| LF Dɔwɔwɔ ƒe Dodokpɔ | Xlẽ ID si woɖe alo ɖoɖowɔɖi ƒe blɔkawo kple LF xlẽla kple emetsonu ƒe nɔnɔme si dzi wolɔ̃ ɖo |
| HF Dɔwɔwɔ ƒe Dodokpɔ | Xlẽ UID kple sedede tiatia, ŋkuɖodzinu alo dɔwɔwɔ le HF chip tututu nu |
| Antenna ƒe Yiyi | De dzesi nutomeʋuʋu siwo le ʋuʋu ɖi, ʋuƒo kpuiwo, ƒunukpeƒe siwo gbɔdzɔ kple elektrikŋusẽnamɔ̃ ƒe gbɔdzɔgbɔdzɔwo na coil eveawo siaa |
| RF ƒe Dɔwɔwɔ | Zã LF kple HF dodokpɔ ƒe xɔtunu vovovowo, nuxlẽla ƒe kpɔɖeŋuwo, mɔfiamewo kple mɔzɔzɔ ƒe didimewo |
| Chip kple Antenna ƒe Nɔnɔme | Kpɔe ɖa be CAD, kaɖi ƒe nɔnɔmetata, punching clearance, slots kple module cavities |
| Agbalẽvi ƒe Dzidzemewo | Didime, kekeme, dzogoe ene me, kaɖi ƒe kɔkɔme, do siwo me woŋlɔ ŋkɔ ɖo kple nugbɔ ƒe nyonyome |
| Eƒe Titrime Kple Eƒe Gãnyenye | Mamã dedie ƒe titrime, nutoa me ƒe chip zones, bow, curl kple point-to-point ƒe tɔtrɔ |
| Kpekpeɖeŋugbalẽvi ƒe Dodokpɔ si Wu enu | LF / HF dɔwɔwɔ, didime, ƒoƒo, torsion, dzoxɔxɔ, fafa, peel kple nuxlẽla ƒe sɔsɔ |
| Nusiwo woate ŋu akpɔ | Chip lots, antenna design, PVC lot, sheet number, dodokpɔ ƒe ɖoɖowɔɖi, dodokpɔ me tsonu kple packing record |
Woate ŋu agblɔ elektrik-nuxexlẽ blibo le kaɖi ƒe nɔƒe ɖesiaɖe, esime tsɔtsrɔ̃ ƒe lãgbalẽ, bending kple cross-section dodokpɔwo zãa kpɔɖeŋuwo zi geɖe. Ele be nuƒle ƒe nɔnɔmetata la naɖe sededewo, nuxlẽlawo, nusiwo woatsɔ aɖoe, seɖoƒewo kple nyatakakawo gɔme.
Kpekpeɖeŋugbalẽvi si to LF gake wòdo kpo nu HF —alo to HF gake wòdo kpo nu LF —menye kaɖi si sɔ ɖe enu si ƒe tsɔtsɔme eve o. Ele be lɔlɔ̃ ɖe edzi ƒe dzidzenuwo nabia tso mɔ̃ɖaŋununya eveawo siaa si be woatsɔ agbalẽvi ƒe ɖoƒe ɖeka si wowu enu la ayi.
Ne prelam to incoming inspection me gake card si wowu enu la do kpo nu la, ɖe chip/protocol kuxiwo ɖa tso antenna tuning, mechanical damage kple reader configuration gbɔ. Do LF kple HF kpɔ le wo ɖokui si kple nuxlẽla nyui siwo wonya kple nufiamegbalẽvi si dzi woda asi ɖo.
| Dzesi | Anɔ eme Nuto | Gbãtɔ Mɔ̃ɖaŋudɔwo Dodokpɔ |
|---|---|---|
| 125kHz xlẽla mekpɔa kaɖia dzea sii o | LF nyatakakawo ƒe ɖoɖo, tɔtrɔ alo ɖoɖowɔɖi si mesɔ o | Tsɔ chip tiatia, raw output kple reader decoding sɔ kple nufiame si dzi woda asi ɖo |
| 13.56MHz xlẽla mekpɔa kaɖia dzea sii o | HF ɖoɖowɔɖi alo dɔwɔwɔ ƒe masɔmasɔ | Kpɔ ISO /IEC 14443 / 15693 kpekpeɖeŋu, sededewo kple dedienɔnɔ-safui ƒe ɖoɖowɔwɔ ɖa |
| LF to gake HF do kpo nu le lamination megbe | HF antenna ƒe detuning alo chip ƒe nuteɖeamedzi | Kpɔ HF resonance, chip bond, foil ƒe nɔnɔme kple laminated card stack ɖa |
| HF to gake LF do kpo nu le lamination megbe | LF coil ƒe gbegblẽ alo LF tuning si mesɔ o | Kpɔ coil ƒe yiyi, chip kadodo, frequency ɖoɖo kple nutoa me nyadzɔdzɔŋlɔlawo ƒe nuteɖeamedzi |
| Frequency eveawo siaa ƒe nuxexlẽ ƒe didime menyo o | Nuxlẽla ƒe ɖoɖowɔwɔ, geometry, ganuwo alo dɔwɔwɔ ƒe gbegblẽ | Gbugbɔ lé ŋku ɖe nuxlẽla ƒe nuzazãwo, kaɖi ƒe nɔnɔme kple agbalẽtata/ga ƒe ƒuƒoƒo siaa ŋu |
| Card bulges alo curls ƒo xlã chips la | Nutoa me ƒe titrime si mesɔ o alo xɔtutu si meda sɔ o | Dzidze chip-nutome dzidzenu, do ƒe fexexe, fafa kple layer symmetry |
| Nuxexlẽ ɣeaɖewoɣi le atamkaka vɔ megbe | Antenna si te ɖe liƒo si wotso ku ŋu akpa | Kpɔ kaɖi ƒe gbeɖiɖi, punch ƒe ŋkɔ ŋɔŋlɔ, ka ƒe ʋuʋu kple mɔ̃wo ƒe ɖeɖiteameŋu ɖa |
| Dzesidedenuwo mewɔ ɖeka kple dɔwɔlawo ƒe akɔntabubuwo o | Vodada le ŋkɔ ŋɔŋlɔ alo nyatakakawo ƒe sɔsɔ me | Kpɔ LF -to- HF nɔnɔmetata kple xexlẽdzesi si wota ɖe nyatakakadzraɖoƒe si dzi woda asi ɖo la ŋu |
Le nudɔdɔ siwo wowɔna zi gbɔ zi eve gome la, ele be kaɖi ƒe nɔƒe ɖeka naɖo seɖoƒe siwo woɖo na ɣeyiɣi evea siaa ƒe lɔlɔ̃ ɖe edzi ; pass result le interface ɖeka ko dzi menye pass blibo o.
| Dɔwɔwɔ si | Wokafu Mɔ̃ɖaŋununya Mɔfiame | Vevietɔ Validation |
|---|---|---|
| Domenyinu ƒe Mɔɖeɖe Dzi Kpɔkpɔ | 125kHz nuxexlẽ ɖeɖeko alo ɖoɖowɔɖi LF chip si nuxlẽla si woda ɖe eme hiã | Nuxlẽla ƒe nɔnɔme, ID ƒe dodo, kaɖi ƒe mɔfiame kple nyatakakadzraɖoƒe si woakpɔ |
| Access-System ƒe Ʋuʋu | LF + dedie HF eve-frequency ɖaseɖigbalẽ | Nuxlẽlawo ƒe xexlẽme siaa, dzesideŋkɔwo ƒe nɔnɔmetatawo, safuiwo dzikpɔkpɔ kple wo zazã ƒe ɖoɖo |
| Amedzrodzeƒea ƒe Safuigbalẽviwo | Chip si hotel-lock platform la gblɔ; mɔ̃ɖaŋununya eve ne gaƒoɖokui siwo wotsaka li | Encoder, lock firmware, card ƒe titrime, fafa kple eŋudɔwɔwɔ enuenu |
| Dɔwɔlawo kple Sukuxɔ me ID-wo | HF dedienɔnɔ ƒe dɔwɔwɔ alo LF + HF le ʋuʋu me | Ʋɔtrua me yiyi, vava, fexexe, agbalẽtata kple agbenɔnɔ |
| NFC Hamea me nɔnɔ kple Asitsatsa | NTAG alo NFC Forum si sɔ kple HF chip bubu | Telefon ƒe sɔsɔ, NDEF nyatakakawo, URL ƒe dedienɔnɔ kple antenna ƒe nɔƒe |
| Ʋuɖoɖo Kple Dedienɔnɔ Multi-Application | Dedienɔnɔ HF chip kple ɖaseɖigbalẽ ɖoɖo ƒe xɔtuɖaŋu | Asitsatsa ƒe dɔwɔwɔ, nya ɣaɣlawo, safui dodo kple ɖoɖo ƒe mɔɖeɖe |
| Nyatakakawo ƒe Nu | si Hiã Gɔmesese |
|---|---|
| LF Dzesidenu | Woɖɔ dɔwɔƒe ƒe kɔpi, ɖoɖowɔɖi ƒe nɔnɔme, dɔwɔƒe ƒe kɔpi, kaɖi ƒe xexlẽdzesi kple emetsonu ƒe ɖoɖo |
| HF UID / CSN | UID ƒe didime, nuwɔna si woɖo ɖi alo esi wowɔ le vome, nyatakakadzraɖoƒe ƒe nɔnɔme kple nuxlẽla ƒe gɔmeɖeɖe |
| HF Ŋkuɖodzi / Dɔwɔwɔ | NDEF, akpawo, axawo, faɛlwo, mɔɖeɖe ƒe gomenɔamesiwo, xexlẽdzesiwo kple ʋɔtru ƒe nɔnɔme |
| Safuiwo Kple Nyagbewo | Nutɔnyenye, dzidzime, atike dodo, vovototodedeameme, ʋuɖoɖo kple agbalẽdzikpɔkpɔ ƒe mɔ |
| Dual-ID ƒe Nɔnɔmetatawɔwɔ | Ƒomedodo si le LF xexlẽdzesi, HF UID/dɔdamɔnu kple kaɖi ƒe xexlẽdzesi si wota dome |
| Dzadzraɖo | Kaɖi ƒe nuŋlɔɖi siwo wogbugbɔ wɔ, siwo bu, wogbe kple esiwo wogblẽ le ŋgɔdonya eveawo siaa dzi |
Woate ŋu awɔ dutoƒo dzesidenuwo ƒe kɔpi alo asrɔ̃ wo. Ele be ɖoɖo siwo bua dedienɔnɔ ŋu nazã nya ɣaɣlawo ƒe kpeɖodzi si sɔ, megbenyawo dzi kpɔkpɔ kple nudzɔla ƒe ɖoɖowo tsɔ wu be woaɖo ŋu ɖe xexlẽdzesi si woate ŋu akpɔ alo si woate ŋu axlẽ ko ŋu.
HF chip si le dedie hiã be woawɔ dɔwɔwɔ si dzi wokpɔ ŋusẽ ɖo kple safuiwo ƒe agbatsɔtsɔ. Ðe nɔnɔme si le dedie, nyatakakawo ɖɔliɖɔli, kpeɖodzinana, gbegbe-kaɖiwo gbɔ kpɔkpɔ kple agbalẽdzikpɔkpɔ ƒe nudidiwo gɔme hafi woawɔe.
Nudidiwo me toto: Ðo kpe nuxlẽlawo, chips, protocols, card ƒe ɖoɖo, card stack kple dodokpɔ ƒe seɖoƒewo dzi.
Mɔ̃ɖaŋununya ƒe nɔnɔmetata: Da asi ɖe agbalẽa ƒe lolome, kaɖi ƒe kɔkɔme, chip ƒe nɔƒewo, antenna ƒe mɔwo kple lãɖeɖe ƒe mɔwo dzi.
Prototype inlay: Wɔ mɔ̃ɖaŋununya ƒe hatsotso sue aɖe na elektrik, RF, titrime kple lamination dodokpɔwo.
Finished-card test: Ta, laminate, punch, encode kple dodokpɔ kaɖiwo ɖe ɖoɖo siwo katã hiã la dzi.
Sika kpɔɖeŋu ƒe mɔɖeɖe: De asi agbalẽvi si dzi woda asi ɖo, nyatakakawo ƒe ɖoɖo, nuxlẽla ƒe dodokpɔ kple nukpɔkpɔ ƒe dzidzenu te.
Bulk wɔwɔ: Dziɖuɖu chip lot, antenna dɔwɔwɔ, didime, elektrik dodokpɔ kple traceability.
Trɔ dziɖuɖu: Xɔ mɔɖeɖe hafi nàtrɔ chip dzɔtsoƒe, package, antenna, PVC , adhesive, layout alo dodokpɔ dɔwɔnuwo.
Stock ƒe kpɔɖeŋu aɖe ɖe alesi wowɔa dɔe le goawo katã me fiana. Kpɔɖeŋu si wowɔ ɖe ɖoɖo nu ɖoa kpe chip, antenna, ɖoɖo, kaɖi ƒe ƒuƒoƒo, nuxlẽlawo kple lamination dɔwɔnu siwo tututu nuƒlela hiã la dzi.
In-stock standard designs ate ŋu ado alɔ kpɔɖeŋu nudɔdɔ suewo. Chips siwo wowɔ ɖe ɖoɖo nu, dual-frequency layouts, antenna tooling, dedie encoding kple nonstandard sheet dimensions zi geɖe la, ebia be woawɔ MOQ.
RFID prelam wɔwɔ si li ke bia be woakpɔ chip tsoƒe si dzi wokpɔna, antenna wɔwɔ, chip-to-coil kadodo, plastic collation, lamination, elektrik dodokpɔ, didime me dzodzro kple lot traceability. Ele be woazã chip, antenna drawing, material stack kple dodokpɔ mɔnu si dzi woda asi ɖo negbe ɖe woda asi ɖe tɔtrɔ si woŋlɔ ɖi dzi hafi.
RFID Dɔwɔna kple Mɔ̃ɖaŋununya ƒe Kpekpeɖeŋu
LF , HF kple Hybrid Inlay Dɔwɔƒe
Dzra agbalẽawo ɖo gbadzaa le nubablɛ siwo wotu nu ɖo, siwo le dzadzɛ eye wole ƒuƒuie me le afisi dzoxɔxɔ kple ɣe ƒe keklẽ tẽ nagage ɖo o.
Zã ʋuƒo sesẽwo, nusiwo wotsɔ ƒoa ƒui kple kakɛ siwo ŋu wodo ŋusẽe tsɔ kpɔ antennawo kple chip zonewo ta.
Ƒo asa na pallet ƒe agba siwo mesɔ o, ƒoƒo, ƒoƒo ɖaɖɛwo kple stack ƒe nyaƒoɖeamenu si gbɔ eme.
Zã ESD ƒe dɔwɔwɔ ƒe mɔ̃ siwo sɔ na nuwɔwɔ ƒe ɖoɖo siwo woɖe ɖe go kple dodokpɔ.
Nɔnɔme ƒe agbalẽ siwo le lamination xɔa me ne nudzraɖoƒe kple ewɔwɔ ƒe nɔnɔmewo to vovo.
De dzesi pack ɖesiaɖe kple chip ƒokpli, antenna ƒe nɔnɔme, ɖoɖo, titrime, agbɔsɔsɔme kple batch.
Zã nudzraɖoƒe gbãtɔ, gbãtɔ si dona le eme eye nàgbugbɔ ado nuawo kpɔ le wo dzadzraɖo ɣeyiɣi didi alo wo tsɔtsɔ yi teƒe bubu si mesɔ o megbe.
Takpɔkpɔ Flat Packing na Dukɔwo Dome B2B Nudɔdɔwo
LF , HF kple hybrid ŋutete: Woateŋu awɔ dɔ siwo wowɔna zi ɖeka kple zi eve tso nuxlẽla ƒe lãwo ƒe agbenɔnɔ ƒe ɖoɖo ŋutɔŋutɔ me.
Chip-koŋ ƒe mɔ̃ɖaŋudɔwɔwɔ: Woma tiatia siwo woate ŋu axlẽ ko, siwo woate ŋu awɔ ɖoɖo ɖe wo ŋu, NFC kple esiwo le dedie HF to ɖoɖowɔɖi kple dɔwɔwɔ me.
Antenna kple ɖoɖo si wowɔ ɖe ɖoɖo nu: Woate ŋu atrɔ asi le agbalẽa ƒe lolome, kaɖi ƒe gbeɖiɖi, chip teƒe, coil geometry kple punching clearances ŋu.
Finished-card qualification: Woate ŋu ata kpɔɖeŋuwo, awɔ laminated, punched, encoded eye woado wo kpɔ le target readers dzi.
Dzɔdzɔmeŋusẽdzikpɔkpɔ si woŋlɔ ɖi: Woate ŋu aŋlɔ elektrik, RF, didime, nukpɔkpɔ kple traceability ƒe nudidiwo ɖe nɔnɔmeawo me.
Factory-direct B2B supply: Esɔ na kaɖi dɔwɔƒewo, mɔɖeɖe integrators, amedzrodzeƒe-ɖoɖo dzralawo, issuers, importers kple mamalawo.
Dɔwɔwɔ kple ɖoɖowɔwɔ si hiã: LF , HF alo LF + HF eve ƒe ɣeyiɣi.
Nuxlẽla ƒe adzɔnuwo, kpɔɖeŋuwo, firmware, ɖoɖowɔɖiwo kple emetsonu ƒe ɖoɖo si hiã.
LF kple HF chip wɔla pɛpɛpɛ, akpa ƒe xexlẽdzesi, ŋkuɖodzinu kple dedienɔnɔ ƒe nudidi.
Agbalẽvi ƒe ɖoɖo, didime, kaɖi ƒe gbeɖiɖi, ŋkɔ ŋɔŋlɔ ƒe dzesiwo kple agbɔsɔsɔme.
Kpekpeɖeŋugbalẽvi ƒe lolome, eƒe titrime si wowu enu, teƒe siwo chip le, slots, dowo kple punching drawing.
prelam nusi wotsɔ wɔe, amadede, titrime kple mɔɖeɖe ɖe nu ŋu.
LF kple HF nuxexlẽ ƒe didime dodokpɔ ƒe nudidiwo kple taɖodzinu ƒe mɔfiamewo.
Kpekpeɖeŋugbalẽvi mamlɛtɔ, Overlay film s, nu vevi siwo wota, ga ƒe nuŋlɔtsi, magnet-ka kple dedienɔnɔ ƒe nɔnɔmewo.
Lamination press, dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe, fafa kple agbalẽvi didimewo.
Encoding, UID/ID list, key injection, nyatakakawo ƒe nɔnɔmetata kple nuwo ƒe sɔsɔ ƒe nudidiwo.
Prototype agbɔsɔsɔme, ƒe sia ƒe ƒe nyagblɔɖi, MOQ taɖodzinu kple ɖoɖo si woatsɔ aɖoe.
Nubabla, ŋkuléle ɖe nu ŋu ƒe nuŋlɔɖiwo, melidzeƒe si woɖo tae kple sedziwɔwɔ ŋuti nuŋlɔɖi siwo hiã.
Dzro Wò LF kple HF Inlay Dɔwɔwɔ me
Enye domedome kaɖi ƒe agbalẽvi si me RFID chip kple antenna le le PVC ƒuƒoƒoawo me. Kpekpeɖeŋugbalẽvi wɔlawo tsɔa nu vevi siwo wota kple Overlay film s kpena ɖe eŋu hafi lamination mamlɛtɔ kple punching.
Ɛ̃. Dual-frequency prelam me LF kple HF chips kple antenna vovovowo le kaɖi ƒe ŋutilã ɖeka me. Interface eveawo siaa hiã be woatrɔ asi le wo ŋu ahado wo kpɔ le wo ɖokui si.
Eɖe mɔ na ɖaseɖigbalẽ ɖeka be wòawɔ dɔ kple 125kHz xlẽla xoxowo kple 13.56MHz smart-card xlẽla yeyewo le xɔtuɖaŋuwo ƒe ʋuʋu me.
Zi geɖe la, wonyea nutome sue siwo to vovo. Woate ŋu atsɔ woƒe dzesidenuwo aɖo kadodo me le asisi la ƒe nyatakakadzraɖoƒea, gake woɖoa dze kple nuxlẽla vovovowo le wo ɖokui si.
Woateŋu adzro TK4100-ƒomevi, EM4200, ATA5577/T5577-ƒomevi kple LF tiatia bubuwo me. Kpe ɖe nuxexlẽ ɖeɖeko alo nuxexlẽ/ŋɔŋlɔ ƒe nuwɔna, encoding kple nuxlẽla ƒe nɔnɔme dzi.
EM4200 le ɖoƒe si nye dɔwɔƒe-si wowɔ ɖoɖo ɖe low-frequency read-only identification IC. Ele be woagblɔ kɔda ƒe tiatia si hiã kple nuxlẽla ƒe sɔsɔ.
ATA5577/T5577-ƒomevi ƒe mɔ̃wo nye nuxexlẽ/ŋɔŋlɔ LF transponder siwo woateŋu aɖo. Ele be woaɖe ɖoɖowɔɖi ƒe ɖoɖo, nyagbegbɔgblɔ, lock bits kple kpeɖodzinana gɔme.
Ao, alesi woawɔ ɖeka la nɔ te ɖe chip kple ɖoɖo si tututu wowɔ dzi. Mele be woawɔ dzidzenu siawo ŋudɔ abe blanket claim ene na access-control LF chip ɖesiaɖe o.
Tiatiaawo dometɔ aɖewoe nye domenyinu Type A chips, MIFARE Ultralight, NTAG, MIFARE DESFire kple ISO 15693/ICODE ƒomewo, le woƒe anyinɔnɔ kple dɔwɔwɔ ƒe nudidiwo nu.
Ao, nuxlẽlawo doa alɔ dzidzenu, sedede kple dɔwɔwɔ tɔxɛ aɖewo. Ðo kpe Ƒomevi A, Ƒomevi B, ISO 15693 alo NFC Forum ƒe kpekpeɖeŋu kple IC tututu dzi.
NTAG 213, 215 alo 216 kple NFC Forum ƒe chip bubu siwo sɔ nye tiatia siwo bɔ. Tia to NDEF ŋkuɖodzinu, telefon ƒe ɖekawɔwɔ kple dedienɔnɔ ƒe nudidiwo dzi.
Mɔ̃ si le dedie abe MIFARE DESFire ene ateŋu asɔ, gake ele be woawɔ nuxlẽla, safuiwo, dɔwɔwɔwo, megbenyawo kple ame ŋutɔ ƒe tɔtrɔ ƒe ɖoɖoa ɖekae.
Ðoɖo siwo bɔ dometɔ aɖewoe nye 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kple 4 × 10. Woate ŋu awɔ ɖoɖo siwo wowɔ ɖe ɖoɖo nu tso nuƒlela ƒe CAD nɔnɔmetata me.
LF prelam xɔtuɖoɖo tiatia ate ŋu adidi abe 0.50–0.60mm ene. Kpe ɖe titrime ŋutɔŋutɔ kple mɔɖeɖe ɖe nu ŋu na chip, coil, PVC xɔtuɖoɖo si wobia kple kaɖi si wowu enu.
Ate ŋu abia be wòanye titrime geɖe wu alo teƒea ƒe fexexe elabena chip eve kple antenna system eve le eme. Ele be woada asi ɖe titrime ƒe anyigbatata bliboa dzi.
Ɛ̃. Woateŋu ato coil geometry vɛ ƒo xlã chip, card ƒe lolome, nuxlẽla, taɖodzinu ƒe didime, chip ƒe nɔƒe kple lãɖeɖe ƒe ʋuʋu.
Range nɔ te ɖe frequency, chip, antenna, reader, card stack, orientation kple nuto dzi. Ðe LF kple HF dodokpɔ nuxlẽla vovovowo gɔme eye nàto didimewo.
Woate ŋu abu eŋu le dodokpɔ vɔ megbe. Teƒe gã siwo wotsɔ ga wɔe ate ŋu akpɔ ŋusẽ ɖe HF antenna dzi eye ele be woatsɔ wo ade RF ƒe dzeside si wowɔ kple kaɖi si wowu enu me.
Woateŋu ato xɔtuɖoɖo bubuwo vɛ, gake ele be woaɖo kpe kadodo, dzoxɔxɔ, shrinkage, RF tuning, chip stress kple final-card durability dzi ɖe vovo.
Zi geɖe la, wonyea dɔwɔwɔ ƒe agbalẽ ƒuƒluwo. Zi geɖe la, wotaa asisiwo ƒe nɔnɔmetatawo ɖe agbalẽvi vevi vovovowo dzi hafi wotsɔa lãgbalẽ wɔ agbalẽvi bliboa.
Xexeame katã ƒe nɔnɔme aɖeke meli o. Ele be woato dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe kple fafa vɛ na PVC , chip packages, antennas, printed cores kple Overlay film s pɛpɛpɛ.
Zã teƒea ƒe titrime si dzi wokpɔna, agbalẽ siwo le dzadzɛ, nyaƒoɖeamenu si da sɔ, chip packages siwo sɔ, dzoxɔxɔ ƒe tsatsam siwo dzi woda asi ɖo kple elektrik dodokpɔ do ŋgɔ na lamination kple emegbe.
Ẽ, woate ŋu agblɔ elektrikŋusẽ dodokpɔ bliboe. Le dual-frequency products gome la, ele be LF kple HF ƒe ŋgɔdonyawo siaa nato le teƒe ɖesiaɖe si woxɔ.
LF ɖoɖowɔɖi, HF ŋkuɖodzinu ŋɔŋlɔ, NDEF nyatakakawo kple dɔwɔwɔ ƒe ame ŋutɔ ƒe tɔtrɔ ateŋu aƒo nu tso eŋu. Safui siwo le dedie hiã na ɖoɖo si dzi wokpɔna le vovo.
Ɛ̃. Dzeside nyuitɔ kekeake zãa chips, antennas, card stack, lamination press, punching tool kple target readers siwo sɔ pɛpɛpɛ.
MOQ nɔ te ɖe chip ƒe anyinɔnɔ, frequency ɖeka alo eve, antenna tooling, ɖoɖowɔwɔ, nusiwo wotsɔ wɔe, encoding, dodokpɔ ƒe nudidiwo kple nenye be standard design li dzi.
Na LF kple HF chips, nuxlẽlawo, ɖoɖowɔɖiwo, ɖoɖo, kaɖi ƒe nɔnɔmetata, titrime, kaɖi ƒe ƒuƒoƒo, dodokpɔ ƒe seɖoƒewo, nuŋɔŋlɔ, agbɔsɔsɔme, babla kple teƒe si woayi la pɛpɛpɛ.
Ao, 125kHz-ko ƒe nuxlẽla mateŋu aɖo dze kple HF -ko ƒe kaɖi o. Dual-frequency inlay na be nuxlẽla vovovo eve ɖoa dze kple woƒe LF kple HF chips, le nuxlẽla ɖesiaɖe ƒe ɖoɖowɔɖi nu.
Standard LF + HF smart-card inlays zãa antenna circuits siwo to vovo, siwo woɖɔ ɖo le wo ɖokui si na frequency eveawo. Ele be xɔtunu si wowu enu la nakpɔ antenna ƒe ʋuʋu ta eye wòato RF dodokpɔ vovovowo me.
Ao, esiawo nye ŋkɔ ƒe ɣeyiɣi vovovowo, eye lãwo ƒe dzesidede ƒe nɔnɔmewo abe ISO 11784/11785 meku ɖe 125kHz access-card chips ŋu le wo ɖokui si o. Kpe ɖe nuxlẽla kple transponder ƒe ɖoɖo ŋutɔŋutɔ dzi.
Amesi nae la tsɔa LF kaɖi ƒe xexlẽdzesi ɖoa HF chip alo dɔwɔwɔ ƒe akɔnta si le dedie le eƒe mɔɖeɖe-dzikpɔɖoɖoa me. Esia nye ŋkɔ ŋɔŋlɔ kple nyatakakadzraɖoƒe ƒe dɔ si le vovo; RFID nutome eveawo me ma nuŋlɔɖiwo le wo ɖokui si o.
Prelam naa wotsɔa chip kple antenna dea plastic-gbadzɛwo me hena kaɖiwo wɔwɔ. Dry inlay nye chip-and-antenna ƒe ƒuƒoƒo si wometrɔ haɖe wòzu prelaminated card core ma ke si wowɔ vɔ o.
Tsɔ dodokpɔ xlẽlawo, nuŋɔŋlɔ ƒe nɔnɔmewo, dɔwɔwɔ ƒe nuxexlẽ ƒe didimewo, nusiwo gblẽ ƒe agbɔsɔsɔ si ŋu woɖe mɔ ɖo, ŋkuléleɖenuŋu ƒe kpɔɖeŋuwo kple nyatakakawo na LF kple HF ɖe vovo. Ele be interface eveawo siaa nato dual-frequency card ƒe nɔƒe ɖesiaɖe si dzi woda asi ɖo la dzi.
Te ɖe Wallis Plastic ŋu hena 125kHz LF , 13.56MHz HF kple LF + HF eve-frequency RFID PVC prelam inlay agbalẽ siwo wowɔ ɖe ɖoɖo nu. Míaƒe ƒuƒoƒoa doa alɔ chip tiatia, antenna kple ɖoɖo ƒe ɖoɖowɔwɔ, card-stack ɖoɖowɔwɔ, lamination dodokpɔwo, LF / HF dodokpɔ, encoding, nyonyome ƒe nɔnɔmewo kple dɔwɔƒe- tẽ B2B nana.
Bia Kpɔɖeŋuwo Kple Dɔwɔƒe ƒe Nyayɔyɔ
