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Inlay / prelam
Wallis ye nye esia
| Agbɔsɔsɔ: | |
|---|---|
| Chip: | |
| Agbɔsɔsɔ: | |
Wallis dual-frequency RFID TK4100 + F08 inlay prelam sheet nye dɔwɔwɔ ƒe nu vevi si wowu afã kple afã na dɔwɔƒe siwo wɔa hybrid access, dɔwɔla ID, sukuxɔ, hamevinyenye, amedzrodzeƒe kple multi-system smart cards. Ewɔa LF 125kHz TK4100 ƒe ɖaseɖigbalẽ si le eɖokui si kple HF 13.56MHz F08 ɖaseɖigbalẽ si le eɖokui si nu ƒu ɖekae le kaɖi ƒe ɖoɖo ɖeka me, si na be kaɖi si wowɔ vɔ la te ŋu wɔa dɔ kple nuxlẽla ƒe xɔtuɖoɖo eve siwo sɔ.
LF kple HF nutome suewo gakpɔtɔ le vovo: frequency ɖesiaɖe kple eƒe chip, antenna alo coil, protocol ƒe nuwɔna kple nuxlẽla ƒe sɔsɔ. Le agbɔsɔsɔ gã wɔwɔ si ŋu kakaɖedzi le gome la, ele be woaɖo kpe chip ƒe nufiamewo, nuxlẽla ƒe kpɔɖeŋuwo, antenna ƒe nɔƒe, agbalẽ ƒe ɖoɖo, kaɖi ƒe wɔwɔme si wowu enu kple taɖodzinu xexlẽ ƒe dɔwɔwɔ dzi hafi woawɔ dɔwɔnuwo kple bulk lamination.
| Parameter | Reference Specification kple B2B Kpeɖodzi Teƒe |
|---|---|
| Adzɔnu Ƒomevi | Dual-frequency RFID inlay prelam sheet na emegbe Overlay film lamination, agbalẽtata, punching kple card personalization. |
| Standard Combination | LF 125kHz TK4100 + HF 13.56MHz F08 ƒe ʋuʋudedi. Kpe ɖe chip wɔla tututu, ŋkuɖodzinu ƒe ɖoɖowɔwɔ, UID ƒe nɔnɔme kple nuxlẽla/ɖoɖo ƒe nudidiwo dzi le nuƒle ƒe nɔnɔmetata dzi. |
| Ðoɖo Siwo Li | 2×5 (A4), 3×7, 3×8 kple agbalẽ matrix bubu siwo wowɔ ɖe ɖoɖo nu. Ele be agbalẽvi mamlɛawo ƒe didime, kaɖi ƒe kɔkɔme, axadzi, ŋkɔ ŋɔŋlɔ ƒe dzesiwo kple atamkaka ƒe mɔfiame nazɔ ɖe nɔnɔmetata si dzi woda asi ɖo dzi. |
| Nufiame prelam Titrime | Anɔ abe 0.55–0.60mm na fifi LF + HF xɔtuɖoɖo. Titrime ŋutɔŋutɔ kple mɔɖeɖe ɖe nu ŋu nɔ te ɖe chip package, antenna wɔwɔ, substrate kple mamlɛtɔ card stack dzi. |
| Nusiwo Wozãna le Gɔmeɖoanyi | PVC abe tiatia si woɖo ɖi ene; woate ŋu ada kaɖi ƒe substrate bubu siwo sɔ la kpɔ le lamination ƒe wɔwɔme kple dɔa ƒe nudidiwo nu. |
| LF Antenna si wotsɔna ƒoa ʋu | Zi geɖe la, akɔbli coil si wobla si wowɔ na 125kHz chip kple nuxlẽla ƒe nɔnɔme si wotia. |
| HF Antenna si wotsɔna ƒoa ʋu | Etched alo embedded antenna design tuned na tiatia 13.56MHz chip, card stack kple nuxlẽla nɔnɔme. |
| Ŋkume | Blank prelaminated functional core, si woɖo be woatsɔ aƒo ƒu kple core sheets siwo woate ŋu ata kple/alo Overlay film s siwo me kɔ. |
| Trɔ asi le eŋu | Chip ƒe ƒuƒoƒo, antenna ƒe nɔnɔme, ɖoɖo, titrime, agbalẽ ƒe lolome, ŋkɔ ŋɔŋlɔ ƒe dzesiwo, nusiwo wotsɔ wɔe ƒe wɔwɔme, babla kple dzeside. |
| Kpɔɖeŋu Dadaɖeanyi | Wokafu mɔ̃ɖaŋununya ƒe kpɔɖeŋuwo kple Sika Kpɔɖeŋu hafi woawɔ wo le agbɔsɔsɔ gã me. Woɖo kpe eƒe anyinɔnɔ, agbɔsɔsɔme kple agbatsɔtsɔ dzi le dɔ ɖesiaɖe me. |
LF 125kHz TK4100 Inlay Dɔwɔɖoɖo
HF 13.56MHz F08 Inlay Dɔwɔɖoɖo
Dual-frequency RFID prelam nye laminated domedome agbalẽvi si me nutome eve siwo le wo ɖokui si siwo me kadodo mele o le le kaɖi ƒe nɔnɔme ɖesiaɖe me. wozãa F08 Wozãa TK4100 nutome suea na 125kHz proximity-reader dɔwɔwɔ siwo sɔ, gake . nutome kple 13.56MHz nuxlẽla ƒe ɖoɖo siwo sɔ
Nutome eveawo ƒoƒo ƒu ɖe kaɖi ƒe ŋutilã ɖeka me ɖea vi ne ele be habɔbɔ aɖe nalé domenyinu LF mɔɖeɖe ƒe ɖoɖo me ɖe asi esime wòle HF dɔwɔɖoɖo si le vovo kpem ɖe eŋu. Metsɔa ɖoɖowɔɖi alo nyatakakadzraɖoƒe eveawo ƒoa ƒui o. Ele be amesi na agbalẽvi la naŋlɔ ɖaseɖigbalẽ ɖesiaɖe ŋkɔ ahakpɔ edzi le ɖoɖo si sɔ me.
Zi geɖe la, wotiaa TK4100 abe nuxexlẽ ɖeɖeko ƒe dzesidegbalẽvi na 125kHz tete ɖe nuxlẽla siwo sɔ. Zi geɖe la, wozãnɛ ne ɖoɖoa xlẽ dzesidexexlẽdzesi si woɖo ɖi tsɔ wu be wòadzra dɔwɔɖoɖoa ƒe nyatakakawo ɖo. Ele be woaɖo kpe bit ƒe nɔnɔme tututu, facility-code handling kple reader ƒe ɖekawɔwɔ dzi kple access-control integrator.
Wozãa F08 zi geɖe abe 13.56MHz contactless memory credential ene le ɖoɖo siwo sɔ me. Ele be nuƒlela naɖo kpe F08 ƒe tɔtrɔ si tututu, ŋkuɖodzinu ƒe ɖoɖowɔwɔ, safuiwo, UID zazã, akpa ƒe nyatakakawo kple ame ŋutɔ ƒe tɔtrɔ ƒe mɔnu dzi. 13.56MHz ƒe dɔwɔwɔ ƒe tsɔtsɔme ɖeɖe meɖo kpe edzi be ewɔ ɖeka kple smartphones, NFC dɔwɔɖoɖowo, MIFARE-dzesiwo ƒe ɖoɖowo alo ISO /IEC 14443 xlẽla ɖesiaɖe o.
Le smart-card nyagbɔgblɔ me la, zi geɖe la, dual frequency fia radiodɔwɔƒe eve siwo me kadodo mele o abe LF + HF ene. Zi geɖe la, dual interface fia contact chip kpe ɖe contactless interface ŋu. Zã nya nyuitɔ le nɔnɔmetatawo, nyayɔyɔwo kple ɖoɖoa ƒe nuŋlɔɖiwo me be nàxe mɔ ɖe nuƒle ƒe vodadawo nu.
| Nu | TK4100 Axa | F08 Axa |
|---|---|---|
| Xexlẽme | 125kHz LF ƒe didime. | 13.56MHz HF |
| Akpa si Wowɔna Tsoe | Fixed-ID proximity credential na mɔɖeɖe alo vava xlẽla siwo sɔ. | Xlẽ/ŋlɔ ŋkuɖodzinu ƒe ɖaseɖigbalẽ na HF kaɖi dɔwɔɖoɖo siwo sɔ. |
| Nuxlẽla Ŋuti Nyatakaka Siwo Hiã | Nuxlẽla ƒe dzesi/kpɔɖeŋu, nyatakaka ƒe nɔnɔme si wodo alɔe, kaɖi ƒe xexlẽdzesi si wokpɔ mɔ na kple taɖodzinu nuxexlẽ ƒe didime. | Nuxlẽla ƒe dzesi/kpɔɖeŋu, ɖoɖowɔɖi, ŋkuɖodzinu/safui ƒe nudidiwo, UID ƒe ɖoɖo kple asitsatsa ƒe dɔwɔwɔ ƒe ɖoɖo si wokpɔ mɔ na. |
| Ame ŋutɔ ƒe nɔnɔme | Zi geɖe la, wotua wo ɖe dzesidenu si ŋu wowɔ ɖoɖo ɖo le dɔwɔƒea dzi; ɖo kpe edzi nenye be ɖoɖoa bia xexlẽdzesi ƒe ɖoɖo aɖe koŋ. | Ate ŋu abia be woawɔ sector programming, keys, data files alo issuer-side enrollment. |
| Dedienɔnɔ ƒe Ðoƒe | Esɔ na dɔ siwo xɔa gɔmedzenuxexlẽ ɖeɖeko ƒe LF ɖaseɖigbalẽ. | Alesi wòsɔ la nɔ te ɖe chip kple dedienɔnɔ ŋuti ɖoɖo si tututu wowɔ dzi. Ele be dɔ yeye alo dɔ siwo me dedienɔnɔ le ŋutɔ nagblɔ chip-mɔ̃ si dzi woda asi ɖo si le dedie. |
| Telefon ƒe Ðekawɔwɔ | Zi geɖe la, smartphone siwo wozãna ɖaa mexlẽa 125kHz ƒe tete ɖe ame ŋu ƒe ɖaseɖigbalẽwo o. | Mègasusu be smartphone sɔ kple wo nɔewo o; ɖo kpe chip, protocol kple taɖodzinu telefon dɔwɔɖoɖoa dzi pɛpɛpɛ. |
Antenna eve siwo woda ɖe kaɖi tsɛ ɖeka me ate ŋu akpɔ ŋusẽ ɖe resonance, nuxexlẽ ƒe didime, lamination ƒe nuwɔna kple punching clearance dzi. Eyata ele be woawɔ antenna ƒe geometry abe kaɖi ƒe wɔwɔme ɖeka si wotsɔ wɔ ɖekae ene tsɔ wu be woatsɔ inlay eve siwo le wo ɖokui si aƒo ƒui gake womeɖo kpe edzi o.
Ele be woaɖo LF coil kple HF antenna ɖe teƒe si woaɖe kadodo si womedi o dzi akpɔtɔ eye wòagblẽ teƒe siwo me kɔ na kaɖi ƒe gowo, kadodo modules, magnetic stripes, signature panels, dowo alo die-cut features tɔxɛwo. Ele be woado aɖaŋua kpɔ kple finished-card stack ŋutɔŋutɔ elabena layers siwo wota, Overlay film s kple conductive elements siwo te ɖe eŋu ateŋu akpɔ ŋusẽ ɖe RF ƒe dɔwɔwɔ dzi.
Chip package teƒewo ate ŋu abia be nutoa me dowo, cushioning layers alo controlled material build-up. Chip-area ƒe wɔwɔme gbegblẽ ate ŋu ahe bumps, ya si xaxa, agbalẽtata ƒe tɔtɔ, delamination alo punching ƒe nugbegblẽ vɛ. Ele be nɔnɔmetata si dzi woda asi ɖo la nade dzesi chip ƒe nɔnɔmetatawo kple teƒea ƒe titrime si ŋu woɖe mɔ ɖo.
Kpekpeɖeŋugbalẽvi si xlẽa nu nyuie le kplɔ̃dzinuxlẽmɔ̃ ɖeka dzi ate ŋu awɔ dɔ le mɔ bubu nu le mɔɖeɖenuxlẽmɔ̃ si wotu ɖe gli ŋu, amedzrodzeƒe ƒe gaƒoɖokui, turnstile alo asitelefon dzi. Ele be woado kpɔɖeŋugbalẽviwo kpɔ le nuxlẽla ƒe kpɔɖeŋu ɖesiaɖe si le dɔwɔwɔ me, tso mɔfiame geɖewo dzi kple le lamination mamlɛtɔ megbe.
HF Nuxlẽla ƒe Dɔwɔwɔ
RFID Dɔwɔwɔ ƒe Kpɔɖeŋu
Ele be prelam ƒe ɖoɖoa nawɔ ɖeka kple asisi la ƒe agbalẽtata ƒe agbalẽviwo, laminator, collation mɔnu, punching tool kple finished-card orientation. Ðoɖowɔɖi ŋkɔ abe 3×8 mesɔ gbɔ be woaɖe asi le ewɔwɔ ŋu o; wobia be woawɔ nɔnɔmetata si ƒe lolome le vovovo.
| Nuwo Ŋuti Nyatakakawo Tata | Be Woaɖo Kpe Ðe Eŋu |
|---|---|
| Agbalẽvi ƒe Nɔnɔme | Agbalẽa ƒe kekeme kple didime bliboa, matriki, kaɖi ƒe kɔkɔme, nugbɔ ƒe axawo kple nuɖuɖu ƒe mɔfiame. |
| Kpekpeɖeŋugbalẽvi ƒe Nɔnɔme | Wowu kaɖi ƒe nɔnɔmetata, dzogoe ƒe didime, punching centerline kple ŋgɔgbe/megbe ƒe nɔnɔme. |
| LF Nutome sue ƒe nutome | Coil ƒe didime, tɔtrɔ, chip ƒe nɔƒe, lead routing kple ametakpɔkpɔ no-cut teƒe. |
| HF Nutome sue ƒe nutome | Antenna ƒe nɔnɔmetata, tɔdzisasrã/chip ƒe nɔnɔme, tuning taɖodzinu kple teƒe si wometso o si wokpɔ ta na. |
| Ŋkɔŋlɔɖi | Optical dzesiwo, punching dzesiwo, tata ƒe ŋkɔ ŋɔŋlɔ ƒe dzesiwo kple X/Y ƒe ʋuʋu si ŋu woɖe mɔ ɖo. |
| Nɔnɔme Bubuwo | Kadodo-module do, magnet- fli nuto, asidede agbalẽ te, foto teƒe, slot do alo nɔnɔme tɔxɛ. |
| Kpekpeɖeŋugbalẽviwo ƒe Ƒuƒoƒo | Printable core, prelam, Overlay film s, adhesives, taɖodzinu bliboa ƒe titrime kple ƒuƒoƒo ƒe ɖoɖo. |
Finished Hybrid RFID Kpekpeɖeŋugbalẽvi ƒe Dɔwɔɖoɖo
Dual-Frequency Inlay Ðoɖowɔwɔ
Na LF kple HF chip ƒe nufiame siwo hiã, nuxlẽla ƒe kpɔɖeŋuwo, kaɖi-xexlẽdzesi ƒe nɔnɔme, ɖoɖowɔɖi ƒe nudidiwo kple lɔlɔ̃ ɖe edzi ƒe didime. Mègada asi ɖe chip dzi le frequency ɖeɖeko dzi o.
Ðo kpe agbalẽ ƒe lolome, matriki, kaɖi ƒe gbeɖiɖi, antenna ƒe nɔnɔmetata, chip ƒe nɔnɔmetatawo, ŋkɔ ŋɔŋlɔ ƒe dzesiwo, punching mɔfiame kple blibo layer stack dzi.
Do prelam gbalẽvi ƒuƒluwo kple agbalẽvi siwo wowu enu la kpɔ. Kpɔ chip ƒe dɔwɔwɔ, antenna ƒe ŋuɖoɖo, anyigba ƒe gbadzaƒe, lamination ƒe ɖekawɔwɔ, nukpɔkpɔ ƒe dzedzeme kple nuxlẽla ƒe dɔwɔwɔ ɖa.
Ele be woato dzoxɔxɔ, nyaƒoɖeamenu, ɣeyiɣi si woanɔ anyi, dzoxɔxɔ ƒe agbɔsɔsɔme kple fafa ƒe nɔnɔmewo vɛ to anyigba si wotia kple Overlay film zazã me. Dzoxɔxɔ alo nyaƒoɖeamenu si gbɔ eme ate ŋu aʋuʋu antenna la, agblẽ chip ƒe teƒea alo atrɔ RF tuning.
Ele be Sika Kpɔɖeŋu si wode asi na la naɖe kaɖia ƒe dzedzeme, eƒe didime, elektrɔnik nuwɔna kple nuxlẽla ƒe dɔwɔwɔ si dzi woda asi ɖo la me hena batch ƒe ŋkuléle ɖe eŋu emegbe.
Zã lot ƒe dzeside kple kpɔɖeŋuɖoɖo siwo dzi wolɔ̃ ɖo be woalé traceability tso chips kple antennas me to prelam ewɔwɔ, card lamination kple final delivery me.
| Dzodzro | Nusi Woalé ŋku ɖe | Afɔɖeɖe si Wokafu |
|---|---|---|
| Chip ƒe Dzesidede Ame | LF / HF chip ƒe nufiame si sɔ pɛpɛpɛ, UID alo serial data, lot traceability kple chip ƒe gbegblẽ si wokpɔna. | Incoming components kple prelam si wowu enu. |
| Antenna ƒe Fɔmaɖimaɖi | Yi edzi, kadodo teƒewo, coil lead nɔnɔme kple antenna ƒe gbagbãƒewo. | Do ŋgɔ na ŋgɔdonya kple emegbe. |
| RF ƒe Ŋuɖoɖo | LF kple HF wɔa dɔ le wo ɖokui si, taɖodzinu nuxlẽla ƒe sɔsɔ, mɔfiame kple nuxexlẽ-didime fesre. | Bare prelam kple nuwuwu kaɖi. |
| Atitsoga ƒe Nuwɔwɔ aduadu | Ðo kpe edzi be nuxlẽla ɖeka ƒe dɔwɔwɔ mehea nuwɔna si dzi womate ŋu alɔ̃ ɖo o vɛ le nutome evelia me o. | Mɔ̃ɖaŋununya ƒe kpɔɖeŋu kple Sika Kpɔɖeŋu. |
| Ðoɖowɔwɔ ƒe Ŋkɔ ŋɔŋlɔ | Chip kple antenna ƒe nɔnɔme ɖe X/Y ƒe nɔnɔmetatawo, punching line kple no-cut zones ŋu. | Nuwɔwɔ ƒe akpa ɖesiaɖe. |
| Mɔ̃ɖaŋununya ƒe Nyonyome | Sheet ƒe didime, eƒe titrime, eƒe gbadzaƒe, bubbles, ɖiƒoƒo, local chip bump kple eƒe anyigba ƒe gbegblẽ. | prelam ɖe asi le ŋkuléle ɖe nu ŋu. |
| Lamination ƒe Emetsonu | Peel tsitretsitsi, warpage, kaɖi ƒe titrime, nugbɔ ƒe nyonyome kple chip-nutome dzedzeme. | Finished-card ƒe kpeɖodzinana. |
| Ame ŋutɔ ƒe nɔnɔme | Dzɔdzɔe LF xexlẽdzesi léle, HF ŋkuɖodzinu/safui ƒe dɔwɔwɔ kple nyatakakadzraɖoƒe ƒe ŋkɔ ŋɔŋlɔ. | Issuer alo system-integrator ƒe kpeɖodzinana. |
TK4100 + F08 ƒe ƒuƒoƒoa sɔ wu le afisi wòle be woado alɔ nuxlẽla ƒe nɔnɔme eve siwo li xoxo le ɖaseɖigbalẽ ŋutɔŋutɔ ɖeka me eye woɖo kpe ɖoɖo eveawo siaa dzi le chip tiatiaawo nu.
Dɔwɔla kple kontraktɔ ƒe kaɖi siwo wozãna le domenyinu LF ƒe mɔɖeɖe teƒewo kple HF dɔwɔɖoɖo si le vovo.
Sukuxɔ, klabu alo nunɔamesiwo dzikpɔkpɔ ƒe agbalẽvi siwo tsɔ ɖaseɖigbalẽ ƒe ɖoɖo eve siwo sɔ ɖekae.
Ɣeyiɣi-vava kple xɔ-mɔɖeɖedɔ siwo hiã LF kple HF dzesidenu vovovowo.
Ʋuʋu ƒe dɔwɔna siwo me habɔbɔ aɖe le tɔtrɔm tso 125kHz nuxlẽlawo dzi yi 13.56MHz ƒe xɔtuɖoɖowo dzi.
OEM smart-card wɔwɔ afisi kaɖidɔwɔƒea kpɔa agbalẽtata, lamination kple punching ƒe ɖoɖo bliboa dzi.
Le amedzrodzeƒe ƒe gaƒoɖokuiwo, ʋuɖoɖo, fexexe, dziɖuɖu ƒe ɖaseɖigbalẽwo alo ɖoɖo bubu siwo dzi wokpɔna gome la, ele be ɖoɖoa tɔ nada asi ɖe alesi woawɔ ɖeka kple dedienɔnɔ dzi. Frequency match ɖeɖe mesɔ gbɔ o.
| Dɔa Hia Mɔfiame | Si Ate Ŋu Akpɔ Dzeside | Vevietɔ |
|---|---|---|
| Gɔmedzedze LF Dzesidede | TK4100 alo LF ɖaseɖigbalẽ bubu si dzi woda asi ɖo be woaxlẽ ko. | Kpɔ nuxlẽla ƒe nyatakakawo ƒe nɔnɔme kple kaɖi-xexlẽdzesi ƒe nudidiwo dzi. |
| Woate ŋu aŋlɔ LF Ðaseɖigbalẽ | Woateŋu ada LF chip si sɔ si woateŋu aŋlɔ la akpɔ. | Ðo kpe ɖoɖowɔɖi dɔwɔnuwo, ŋkuɖodzinu, nyagbe ɣaɣla/dedienɔnɔ kple se ƒe ɖoɖo ƒe mɔɖeɖe dzi. |
| Domenyinu HF Ŋkuɖodzigbalẽvi | F08 alo 13.56MHz ŋkuɖodzinu bubu si dzi ɖoɖoa da asi ɖo. | Ðo kpe safuiwo, UID ƒe nuwɔna, ŋkuɖodzinu ƒe nɔnɔmetata kple nuxlẽla ƒe firmware dzi. |
| Dedienɔnɔ-ŋutiɖoɖo HF Dɔwɔna Yeye | Tsɔ egbegbe chip platform si le dedie si dzi ɖoɖoa tɔ da asi ɖo la gblɔ. | Ðe nya ɣaɣlawo, safuiwo dzikpɔkpɔ, agbenɔƒe kple ɖaseɖigbalẽ ƒe nudidiwo gɔme hafi woawɔ antenna. |
| Telefon-Tap Asitsatsa | Tia NFC Forum-compatible chip si wowɔ na smartphone ƒe kadodo. | Doe kpɔ le iOS kple Android dɔwɔnu siwo woɖo taɖodzinu na dzi; mègatsɔe be F08 sɔ kple wo nɔewo o. |
| Afisi Didi Wu ƒe Mɔzɔzɔ | Woateŋu atrɔ asi le UHF ƒokpli ŋu abe ƒuƒoƒo ƒe wɔwɔme vovovo ene. | Nuto, nuxlẽla, antenna ƒe mɔfiame kple RF dodokpɔ si wowɔ le kaɖi si wowu enu la hiã. |
Ele be woakpɔ RFID prelam agbalẽwo ta tso be woabɔbɔ, elektrikŋusẽ ƒe dodo, nyaƒoɖeamenu teƒewo, fafa gã, ɖiƒoƒo kple dzoxɔxɔ si dzi womeɖu o me. Ele be nubabla ƒe nɔnɔmewo nasɔ kple agbalẽa ƒe lolome, chip profile, shipment mɔnu kple lot traceability si hiã.
Zã nusiwo wotsɔ ƒoa ƒui dzadzɛ alo ametakpɔnu be nàɖe anyigba ƒe ʋuʋu kple nusuewo ƒe ʋuʋu dzi akpɔtɔ.
Na agbalẽawo nanɔ gbadzaa eye nàlé teƒe bliboa ɖe te ne wole wo ŋu dɔ wɔm.
Ma ewɔwɔ ƒe akpawo ɖe vovo eye nàde dzesi chip ƒe ƒuƒoƒo, ɖoɖo, agbɔsɔsɔme kple ŋkuléleɖenuŋu ƒe nɔnɔme.
Na nuwo nada asɔ le nuwɔwɔ ƒe nɔnɔme me hafi lamination ne nudzraɖoƒe kple dɔwɔƒe ƒe nɔnɔmewo to vovo ŋutɔ.
Wallis doa alɔ kaɖi dɔwɔƒewo, RFID egbɔkpɔnu nana kple nuwo mamalawo kple dɔwɔɖoɖo si wotu ɖe chip ƒe sɔsɔ, antenna ƒe mɔ̃ɖaŋununya si wowɔ ɖe ɖoɖo nu, agbalẽ-ɖoɖo ƒe ŋgɔyiyi kple kaɖi-nu ƒe ƒoƒo ɖekae. Taɖodzinuae nye be woana prelam structure si woate ŋu aɖo kpee le nuƒlela ƒe nuxlẽla ŋutɔŋutɔ kple lamination nɔnɔme me.
Mɔ̃ɖaŋudɔwɔwɔ ƒe nɔnɔme tɔxɛ: woto chip, antenna, nuxlẽla, ɖoɖo kple kaɖi ƒe ƒuƒoƒo me ɖekae.
Custom layout support: matrices, dimensions, registration marks kple chip coordinates ateŋu akplɔ nuƒlela ƒe dɔwɔnuwo ɖo.
Nusiwo wotsɔ wɔ ɖekae: woateŋu adzro agbalẽ siwo woateŋu ata kple Overlay film s ƒe sɔsɔ me hena kaɖi ƒe wɔwɔme bliboa.
Dzeside si wotsɔa kpɔɖeŋu kplɔna: mɔ̃ɖaŋudɔwo ƒe kpɔɖeŋuwo kple Sika Kpɔɖeŋu ƒe mɔɖeɖe ɖea afɔku si le ewɔwɔ le agbɔsɔsɔ gã me dzi kpɔtɔna.
B2B nuŋlɔɖiwo: woate ŋu awɔ nutatawo, adzɔnuwo ƒe nɔnɔmewo, lot ƒe dzesidede kple ŋkuléle ɖe nudidiwo ŋu wòasɔ kple nuƒle ƒe sedede.
| Nyatakaka Siwo Hiã | Kpɔɖeŋu alo Numeɖeɖe |
|---|---|
| LF Chip kple Nuxlẽla | TK4100 alo mɔnu bubu; nuxlẽla ƒe dzesi/kpɔɖeŋu; hiã be woaɖee afia/kaɖi-xexlẽdzesi ƒe nɔnɔme. |
| HF Chip kple Nuxlẽla | F08 ƒe tɔtrɔ pɛpɛpɛ alo esi woate ŋu azã ɖe eteƒe; nuxlẽla ƒe dzesi/kpɔɖeŋu; protocol, safuiwo, ŋkuɖodzinu kple UID ƒe nudidiwo. |
| Taɖodzinu ƒe Dɔwɔwɔ | Nuxexlẽ ƒe didime suetɔ/si sɔ gbɔ wu, mɔfiame kple dodokpɔ ƒe ɖoɖo na ɣeyiɣi ɖesiaɖe. |
| Agbalẽvi ƒe Nɔnɔmetata | Agbɔsɔsɔ bliboa, ɖoɖo, kaɖi ƒe gbeɖiɖi, atamkaka ƒe dzesiwo, nuɖuɖu ƒe mɔfiame kple kaɖi ƒe ɖoɖo. |
| Kpekpeɖeŋugbalẽvi si Wowu Nu | Core sheets, Overlay film s, adhesives, agbalẽtata ƒe ƒuƒoƒo kple taɖodzinu ƒe titrime bliboa. |
| Kpekpeɖeŋugbalẽvi ƒe Nɔnɔme Bubuwo | Magnetic stripe, contact chip, signature panel, slot, teƒe si me kɔ alo nɔnɔme tɔxɛ aɖe. |
| Nudɔdɔ Ŋuti Nyatakakawo | Kpɔɖeŋu agbɔsɔsɔme, nyagblɔɖi ƒe agbɔsɔsɔme, babla, teƒe si woayi kple nuŋlɔɖi siwo hiã. |
Enye kaɖi ƒe nuto si wowu afã kple afã si me 125kHz TK4100 nutome kple 13.56MHz F08 nutome sue si le vovo le kaɖi ƒe nɔnɔme ɖesiaɖe me. Emegbe wotsɔa agbalẽvia ƒoa ƒu kple ƒuƒoƒo siwo woate ŋu ata kple Overlay film s, wotsɔa lãgbalẽ wɔe eye woƒonɛ ɖe agbalẽvi siwo wowɔ vɔ me.
Ao, wonye chip siwo le wo ɖokui si siwo ƒe antenna ƒe wɔwɔme, frequency kple data ƒe nuwɔna to vovo. Woŋlɔ LF kple HF ɖaseɖigbalẽwo ŋkɔ eye wokpɔa wo dzi ɖe vovo.
Zi geɖe la, wotiaa TK4100 abe nuxexlẽ ɖeɖeko ƒe LF dzesidegbalẽvi ene. Ne ehiã be woawɔ LF dɔwɔwɔ si woateŋu aŋlɔ la, gblɔ nuxlẽla, ɖoɖowɔɖi ƒe dɔwɔnuwo kple chip bubu si dzi woda asi ɖo hafi nàyɔ nya.
Woateŋu azã F08 kple MIFARE Classic le domenyinu 13.56MHz dɔwɔwɔ ƒe nɔnɔme mawo tɔgbe me, gake mele be woaɖe wo afia abe chip si ƒe ŋkɔ le ɖeka ene o. Kpe ɖe chip wɔla tututu, ɖoɖowɔɖi ƒe nuwɔna, ŋkuɖodzinu, safuiwo, UID ƒe nudidiwo kple nuxlẽla ƒe ɖekawɔwɔ dzi.
Ao, dɔwɔwɔ le 13.56MHz mena chip nate ŋu awɔ dɔ aduadu kple NFC telefonwo katã le eɖokui si o. Smartphone ƒe wɔwɔ ɖekae nɔ te ɖe chip kple protocol si tututu, telefon ƒe hardware, operating system kple application dzi.
Ne amedzrodzeƒea ƒe gaƒoɖokuiwɔla alo ɖoɖowɔha ƒe ƒuƒoƒo ɖo kpe chip, ɖoɖowɔɖi, UID/safui ƒe nuwɔna kple nuxlẽla ƒe ɖekawɔwɔ si hiã dzi ko hafi woate ŋu abu eŋu. Amedzrodzeƒewo ƒe ɖoɖowo menɔa te ɖe zi gbɔ zi geɖe dzi ɖɔlia wo nɔewo o.
Mègasusui nenema o. Fexexe kple ɖaseɖigbalẽ ƒe dɔwɔna siwo me dedienɔnɔ le ŋutɔ bia chips siwo dzi ɖoɖoa da asi ɖo, nya ɣaɣlawo, ɖaseɖigbalẽwo, ame ŋutɔ ƒe tɔtrɔ dzi kpɔkpɔ kple dodokpɔ blibo le kaɖi dzi. Ðewohĩ ahiã be woawɔ chip-mɔ̃ si le dedie wu.
Ɛ̃. Woateŋu awɔ agbalẽ ƒe didime, kaɖi ƒe matriki, antenna ƒe nɔnɔme, chip ƒe nɔnɔmetatawo, ŋkɔ ŋɔŋlɔ ƒe dzesiwo, titrime kple kaɖi ƒe nɔnɔme tso mɔ̃ɖaŋununya ƒe nɔnɔmetata si dzi woda asi ɖo me.
Fifia ƒe nufiame didime na LF + HF prelam sia anɔ abe 0.55–0.60mm. Titrime ŋutɔŋutɔ kple mɔɖeɖe ɖe nu ŋu nɔ te ɖe elektrɔnik akpawo, antenna wɔwɔ, substrate kple card stack mamlɛtɔ si hiã dzi.
Do frequency eveawo siaa kpɔ le wo ɖokui si le taɖodzinu nuxlẽla ɖesiaɖe dzi, emegbe nàgbugbɔe awɔ le agbalẽtata, lamination, punching kple personalization megbe. Azɔ hã lé ŋku ɖe kaɖi ƒe titrime, warpage, chip-area flatness, peeling kple antenna ƒe nɔnɔme ŋu.
Woateŋu aƒo nu tso dɔa ŋu abe prelam-only supply alo abe card-material structure si wowɔ ɖekae si me core sheets siwo woateŋu ata kple Overlay film s hã le. Ele be woadze na ƒuƒoƒoawo katã ɖekae hafi woawɔ wo le agbɔsɔsɔ gã me.
De chip ƒe nufiame siwo sɔ pɛpɛpɛ, nuxlẽla ƒe kpɔɖeŋuwo, ɖoɖowɔɖi kple nyatakakawo ƒe nudidiwo, ɖoɖo ƒe nɔnɔmetata, antenna/chip ƒe nɔnɔmetatawo, titrime kple didime ƒe mɔɖeɖewo, RF ƒe lɔlɔ̃ ɖe edzi ƒe dzidzenuwo, nubablɛwo, ŋkuléleɖenuŋu ƒe ɖoɖo kple Sika Kpɔɖeŋu si dzi woda asi ɖo.
