13.56MHz si wowɔ ɖe ɖoɖo nu HF RFID PVC Prelam inlay Agbalẽviwo

13.56MHz si wowɔ ɖe ɖoɖo nu HF RFID PVC Prelam inlay Agbalẽviwo

Wallis 13.56MHz HF RFID PVC wowɔ prelam inlay sheets abe dɔwɔwɔ ƒe nu vevitɔ na kadodomanɔmee smart cards, ID cards, access cards, amedzrodzeƒe key cards, hamevinyenye ƒe cards, transport cards kple NFC -enabled card programs. Agbalẽvi ɖesiaɖe ƒoa HF chip kple antenna tiatia aɖe nu ƒu ɖekae le PVC xɔtuɖoɖo si dzi wokpɔna me, si le klalo na kaɖi-ŋutilã ƒe lamination mamlɛtɔ, tata, punching kple ame ŋutɔ ƒe tɔtrɔ.

B2B dɔwo ate ŋu atrɔ asi le to chip ƒe kpɔɖeŋu, ɖoɖowɔɖi, ŋkuɖodzinu, antenna geometry, agbalẽ ƒe lolome, kaɖi ƒe ɖoɖo, inlay ƒe titrime, chip ƒe nɔƒe, nu, kaɖi mamlɛtɔ tutu kple babla. Nufiameɖoɖo siwo wozãna ɖaa dometɔ aɖewoe nye 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kple 4 × 10, kple ɖoɖo siwo wowɔ ɖe ɖoɖo nu siwo me kaɖi geɖe le siwo li na lamination plate tɔxɛwo kple punching dɔwɔnuwo.

Mele be woaƒo chip ƒomewo nu ƒu ɖe xexeame katã ƒe ɖekawɔwɔ ƒe nya ɖeka te o. MIFARE Classic, MIFARE Ultralight, NTAG kple MIFARE DESFire ƒe nuwɔna wɔa dɔ le ISO /IEC 14443 Type A nɔnɔmewo me, esime ICODE ƒe nuwɔna nɔa te ɖe ISO /IEC 15693 dzi zi geɖe.

Adzɔnu Ƒomevi	13.56MHz HF RFID contactless prelaminated inlay agbalẽ na plastic-kaɖi wɔwɔ
Xexlẽme	13.56MHz HF ʋuʋudedi ; protocol kple ya ƒe ƒomedodo nɔ te ɖe chip si wotia dzi
Ðoɖo Siwo Woɖo Ðe Ðoɖo Nu	2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 kple ɖoɖo siwo wowɔ ɖe ɖoɖo nu
Fifia ƒe Axa ƒe Titrime ƒe Nufiame	Anɔ abe 0.45 ± 0.02mm ene na HF xɔtuɖoɖo tiatia; ɖo kpe edzi to chip, antenna, nu kple kaɖi mamlɛtɔ ƒe ƒuƒoƒo dzi
Nusiwo Wozãna le Gɔmeɖoanyi	Yevu alo nusi me kɔ PVC ; PETG kple dɔ siwo sɔ kple polycarbonate siwo le ɖoɖo ƒe kpeɖodzi vovovowo te
Antenna ƒe Tiatiawɔblɔɖe	Akɔbli ka si wotsɔ de eme, aluminum si woŋlɔ kple dɔa koŋ ƒe antenna tutuwo
B2B Dɔwɔƒewo	Chip dzɔtsoƒe, antenna ƒe wɔwɔme, RF tuning, ɖoɖowɔwɔ ƒe mɔ̃ɖaŋu, kpɔɖeŋuwo, lamination dodokpɔwo, elektrik dodokpɔ, QC nyatakakawo kple dɔdɔ ɖa

Bia HF RFID Inlay Kpɔɖeŋuwo kple Nyayɔyɔ

Nukae Nye 13.56MHz HF RFID Prelam Inlay Agbalẽvi?

Prelam inlay nye domedome kaɖi-wɔwɔ ƒe agbalẽ si me RFID chip, chip-to-antenna kadodo kple tuned antenna structure le plastic layers me. Zi geɖe la, menye agbalẽvi si woate ŋu ata si wowu enu lae o. Kpekpeɖeŋunalawo ƒoa prelam la nu ƒu kple core sheets siwo wota kple Overlay film s siwo me kɔ, emegbe wowɔa laminate, fa, ƒoa ka eye wowɔa wo ame ŋutɔ tɔ.

Inlay la Naa Dɔwɔwɔ si Me Kadodo Mele O

Antenna la xɔa ŋusẽ tso nuxlẽla ƒe teƒea eye wòtsɔa nyatakakawo yia nuxlẽla kple chip si wotsɔ de eme la dome. RF dɔwɔwɔ nɔ te ɖe antenna geometry, conductor tsitretsitsi, chip capacitance, resonance, kaɖi nu, ga si te ɖe eŋu, kaɖi mamlɛtɔ ƒe titrime kple nuxlẽla ƒe agble ƒe ŋusẽ dzi.

prelam la Nye Kpekpeɖeŋugbalẽvi si Wowu Nu ƒe Akpa Ðeka Ko

Wota PVC core sheets, transparent Overlay film s, adhesives, magnetic stripes, signature panels kple ametakpɔnu ƒe nuwuwu kpena ɖe prelam la ƒe titrime ŋu. Ele be woawɔ ɖoɖo ɖe taɖodzinu si wowu kaɖi ƒe titrime ŋu tso ƒuƒoƒo bliboa me tsɔ wu be woawɔe tso prelam gauge ɖeɖeko me.

Ele Be Woawɔ Chip Kple Antenna Be Woanye Dɔwɔɖoɖo Si Sɔ Kple Wo Nɔewo

Chip ƒomea, antenna ƒe lolome, conductor, card material alo card ƒe nɔnɔme tɔtrɔ ate ŋu atrɔ resonance eye wòatrɔ nuxexlẽ ƒe dɔwɔwɔ. Mele be woagazã aɖaŋu si dzi woda asi ɖo na chip ɖeka le eɖokui si na chip bubu RF dzidzenu manɔmee o.

HF Chip kple Protocol Tiatia

Ele be woatia chip la tso nuxlẽla ƒe ɖoɖowɔɖi, ŋkuɖodzinu ƒe hiahiã, dedienɔnɔ ƒe seƒe, asitsatsa ƒe duƒuƒu, agbenɔƒe, ɖaseɖigbalẽ kple kɔmpiuta dɔwɔɖoɖo ƒe dzɔdzɔmeɖoɖo. Adzɔnu ƒe ŋkɔwo abe MIFARE, NTAG kple ICODE nye adzɔnuwo ƒe ƒomewo tsɔ wu be woanye nya siwo wozãna le mɔ vovovowo nu siwo woate ŋu atrɔ.

Chip Ƒome / Tiatia	Protocol Positioning	Typical Project Fit	Vevietɔ B2B De dzesii
Fudan F08 / Domenyinu 1K Tiatia si sɔ	Wobiana zi geɖe na ISO /IEC 14443 Ƒomevi A ƒe ɖoɖo siwo sɔ; ele be woaɖo kpe akpaa ƒe xexlẽdzesi tututu dzi	Domenyinu ƒe mɔɖeɖe, hamevinyenye kple installed-reader ɖɔliɖɔlidɔwo	Kpe ɖe adzɔnuwɔƒe, ŋkuɖodzinu, UID, ɖaseɖiɖi, nuxlẽla ƒe sɔsɔ kple adzɔnu ƒe dzeside si le se nu dzi
MIFARE Klasik EV1 1K / 4K ƒe ʋuƒoƒo	ISO /IEC 14443-3 Ƒomevi A, 106kbit/s	Ʋuɖoɖo, tikitiwo, mɔɖeɖe kple fefewɔƒe ƒe xɔtuɖoɖo siwo li fifia	Domenyinu ƒe adzɔnuwo ƒe ƒome; zãe le afisiwo ɖoɖo si woda ɖe eme la bia ko eye nàda egbegbe mɔnu bubu si le dedie si woate ŋu azã ɖe aɖaŋu yeyewo teƒe la kpɔ
MIFARE Ultralight EV1 ƒe ʋu si me kɔ	ISO /IEC 14443 Ƒomevi A ƒe nɔnɔme	Tiketi siwo wozãna seɖoƒe li na, wɔnawo, nuteƒewɔwɔ kple ɖoɖo bɔbɔe siwo me kadodo mele o	Tsɔ ŋkuɖodzinu, nyagbe ɣaɣla kple gbãtɔ ƒe nɔnɔmewo sɔ kple dɔwɔwɔ ƒe ŋɔdzidoname ƒe kpɔɖeŋu
NTAG 213 / 215 / 216. Ƒe 1999 me	NFC Nyamedzroƒe Ƒomevi 2 Tag kple ISO /IEC 14443 Ƒomevi A	NFC dɔwɔgbalẽviwo, ɖaseɖiɖi ƒe kadodowo, asitelefon dzi nuwɔwɔ kple nusiwo do ƒome kplii	Zãla ƒe ŋkuɖodzinu to vovo le eƒe kpɔɖeŋu nu; ɖo kpe NDEF ƒe lolome, nyagbegbɔgblɔ kple gbãtɔ ƒe nudidiwo dzi
MIFARE DZIDZƆDZƆDZƆ EV3	ISO /IEC 14443 Ƒomevi A ƒe akpa 1–4 kple dɔwɔwɔ siwo le dedie wu	Dedienɔnɔ ƒe mɔɖeɖe, ʋuɖoɖo, sukuxɔ, dzesideŋkɔ, nuteƒewɔwɔ kple dɔbiagbalẽvi geɖe	Ebia safuiwo dzikpɔkpɔ, dɔwɔwɔ ƒe ame ŋutɔ ƒe tɔtrɔ kple nuxlẽla/kɔmpiutadziɖoɖowo ƒe ƒoƒo ɖekae
ICODE SLIX2 / ISO 15693 Ƒome	ISO /IEC 15693, NFC Nyamedzroƒe Ƒomevi 5 ƒe nɔƒe	Vicinity-card, agbalẽdzraɖoƒe, nunɔamesi, dzesidede kple didiƒe-kadodo-adzɔge dɔwo	Womate ŋu atrɔe kple ISO /IEC 14443 Ƒomevi A xlẽlawo o; ɖo kpe nuxlẽla ƒe ɖoɖowɔɖi kple antenna ƒe lolome dzi

'13.56MHz' Meɖe Ðoɖowɔɖia Gɔme o

Dzidzenu geɖe siwo me kadodo mele o wɔa dɔ le 13.56MHz. Nuxlẽla ateŋu ado alɔ ISO /IEC 14443 Ƒomevi A, Ƒomevi B, ISO /IEC 15693, NFC Forum tag ƒomeviwo alo dɔwɔwɔ ƒe ƒuƒoƒo si nye etɔ. Zi geɖe ɖeɖe mesɔ gbɔ be woada asi ɖe nusiwo sɔ dzi o.

Fexexe Kple Kpekpeɖeŋugbalẽvi Siwo Ŋu Wowɔ Ðoɖo Ðo Bia Nu Geɖe Wu Chip Si Sɔ Kple Wo Nɔewo

Gadzraɖoƒewo, fexexe, dziɖuɖu ƒe dzesideŋkɔ kple mɔzɔzɔdɔ siwo ŋu wowɔ ɖoɖo ɖo ate ŋu abia chips siwo ŋu woɖo kpee, safui dodo dedie, nuwo wɔwɔ ƒe agbalẽdzikpɔkpɔ, ɖoɖoa ƒe mɔɖeɖe kple dɔbiagbalẽvi dodokpɔ. Mele be woadzra HF inlay si nye generic abe fexexe si sɔ na fexexe ƒe dzeside si hiã manɔmee o.

Sheet Layout, Agbɔsɔsɔme kple Titrime Tiatia

Parameter	Available Mɔfiame	Production Control
2 × 5 Ðoɖowɔɖi	A4-ƒomevi ƒe kpɔɖeŋu kple kaɖi siwo ƒe lolome le sue wu wɔwɔ	Ðo kpe agbalẽa ƒe didime tututu, kaɖi ƒe gbeɖiɖi kple ŋkɔ ŋɔŋlɔ ƒe dzesiwo dzi
3 × 7 / 3 × 8 ƒe lolome	Dɔwɔƒewo ƒe smart-card ƒe agbalẽvi ƒe ɖoɖo siwo bɔ	Match lamination gbadzɛwo, punching dɔwɔnu, tata nu veviwo kple collation mɔfiame
4 × 8 / 4 × 10 / 5 × 5 ƒe lolome	Dɔwɔwɔ ƒe ɖoɖo siwo de ŋgɔ wu kple dɔwɔnu siwo ku ɖe asisiwo koŋ ŋu	Kpɔ RF ƒe kadodo si le antenna siwo te ɖe wo nɔewo ŋu kple agbalẽ ƒe tɔtrɔ dome dzi
Ðoɖo si Wowɔ Ðe Ðoɖo Nu	Kpekpeɖeŋugbalẽvi ƒe didime siwo wowɔ ɖe ɖoɖo nu, safuiwo, kaɖi suewo alo punching ƒe nɔnɔme tɔxɛwo	Na CAD ƒe nɔnɔmetata, nusiwo wowɔ vɔ ƒe nɔnɔmetata, chip ƒe nɔƒe, antenna ƒe teƒe kple lãɖeɖe ƒe mɔɖeɖe
prelam Titrime	Fifia ƒe axadzinufiame si ade 0.45 ± 0.02mm; xɔtuɖoɖo siwo wowɔ ɖe ɖoɖo nu siwo li	Ðo kpe mamã dedie, teƒe ƒe tɔtrɔ, chip-bump zone kple final-card stack akɔntabubu dzi
Nu	White PVC , PVC si me kɔ kple dɔwɔwɔ tɔxɛ PETG alo PC -siwo sɔ ƒe wɔwɔmewo	Da asi ɖe shrinkage, kadodo, dzoxɔxɔ, RF tuning kple nuwuwu-kaɖi ƒe anyinɔnɔ dzi

Ele be Woabu Kpekpeɖeŋugbalẽvi si Wowu Nu ƒe Titrime Ðe Vovo

Zi geɖe la, wowɔa CR80/ID-1 kaɖi si bɔ la wògogo 0.76mm, gake mɔɖeɖe ɖe eŋu tututu nɔ te ɖe kaɖia kple dɔwɔnuwo ƒe nɔnɔme dzi. Ele be woatsɔ nu vevi siwo wota, ŋgɔgbe kple megbe Overlay film s, adhesives kple local chip ƒe titrime ade akɔntabubua me.

Chip Bump kple Antenna Crossovers Kpɔa Ŋusẽ Ðe Nutoa Me ƒe Titrime Dzi

Agbalẽa ate ŋu anɔ gauge tolerance le mama dedie nu me esime chip zone la le kpekpem wu le nutoa me. Ele be do ƒe nɔnɔme, cushioning, press pressure kple layer tiatia naxe mɔ ɖe bumps siwo woate ŋu akpɔ, bonding gbɔdzɔgbɔdzɔ kple chip ƒe gbegblẽ nu.

Antenna Mɔ̃ɖaŋununya kple RF Tuning

Antenna Factor	Ŋusẽkpɔɖeamedzi ɖe Kpekpeɖeŋugbalẽvia dzi	hiã Validation
Coil ƒe Geometry	Ekpɔa inductance, coupling nuto kple lãɖeɖe ƒe ʋuʋu si li dzi	Match chip capacitance, card ƒe didime, nuxlẽla kple taɖodzinu nuto
Akɔbli Ka ƒe Antenna	Doa alɔ embedded coil designs kple geometry si te ŋu trɔna	Wire ƒe didime, embedding goglome, crossover, kadodo ƒuƒoƒo kple yiyi
Aluminium Antenna si woŋlɔ ɖe agbalẽ dzi	Doa alɔ antenna si ƒe nɔnɔme le sesẽm ŋutɔ	Trace kekeme, tsitretsitsi, xɔxlɔ̃ takpɔkpɔ, chip attachment kple lamination nuwɔna
Chip ƒe Ŋutete	Trɔa antenna/chip ƒe nutome ƒe ɖiɖi	Trɔ asi le eŋu ne èle chip ƒome alo package trɔm
Kpekpeɖeŋugbalẽviwo ƒe Ƒuƒoƒo	Plastik, ink, foil, metalized graphics kple Overlay film s ateŋu atrɔ coupling eye woaɖe antenna la ɖa	Do agbalẽvi si nèwu enu la kpɔ, ke menye prelam ƒuƒlu la ɖeɖeko o
Zã Nutoa Me	Ga siwo wotsɔ wɔe, telefonwo, gakotokuwo, kaɖi siwo te ɖe wo ŋu kple tsi ate ŋu akpɔ ŋusẽ ɖe dɔwɔwɔ dzi	Da nuxlẽla si woɖo be, eɖoɖo ƒe nɔnɔme kple zãla ƒe dɔwɔwɔ kpɔ

Xlẽƒe ƒe Agbɔsɔsɔme Menye Inlay ƒe Nɔnɔme Si Woɖo Ðe Ðoɖo Nu O

Nuxexlẽ ƒe didime nɔ te ɖe chip, antenna ƒe teƒe, nyonyome ƒe akpa, nuxlẽla ƒe ŋusẽ, nuxlẽla ƒe antenna, ɖoɖowɔɖi, kaɖi ƒe mɔfiame, kaɖi mamlɛtɔ ƒe ƒuƒoƒo kple nuto dzi. Ele be nyayɔyɔa nagblɔ dodokpɔ xlẽla kple to/do kpo didime tsɔ wu be wòazã xexeame katã ƒe xexlẽdzesi ɖeka.

Mele Be Kpekpeɖeŋugbalẽvi Siwo Te Ðe Wo Nɔewo Ŋu Nagblẽ Nu Le Wo Nɔewo Ŋu O

Antenna siwo le kaɖi geɖe ƒe agbalẽ dzi hiã dometsotso si sɔ tso ka siwo wotso, do siwo me woŋlɔa ŋkɔ ɖo kple teƒe siwo te ɖe wo ŋu gbɔ. Ele be RF dodokpɔ siwo wowɔna le agbalẽ dzi la nabu akɔnta le kadodo si le antennawo dome hafi woaƒo kaɖiawo ŋu.

Smart card Layer Structure

Layer	Dɔwɔwɔ	Safui Dziɖuɖu
Ŋgɔgbe Overlay film	Ekpɔa nɔnɔmetata siwo wota ta eye wònaa keklẽ, matte, frosted alo dedienɔnɔ ƒe nuwuwu	Titrime, kadodo, abrasion kple ame ŋutɔ ƒe nɔnɔme ƒe sɔsɔ
Ŋgɔgbe si Wota Nu vevi	Etsɔa nɔnɔmetata siwo woɖo ɖi, nuŋɔŋlɔ, dzesidenu kple dedienɔnɔ ƒe agbalẽtata	Ta ƒe ŋkɔ ŋɔŋlɔ, ink dɔyɔyɔ, shrinkage kple RF-dedie ga ŋusẽkpɔɖeamedziwo
HF Prelam inlay	Chip, antenna, elektrik-ƒuƒoƒo kple plastik-kplu siwo kpena ɖe eŋu le eme	RF tuning, chip ƒe nɔƒe, titrime, alignment, bond kple elektrikŋusẽ ƒe kutsetse
Back Printed Core	Edaa asɔ le ŋgɔgbekpa dzi eye wòtsɔa megbekpa dzi nutatawo	Gauge balance, magnetic-stripe ƒe nɔnɔme kple agbalẽtata ƒe nutsyɔnu
Trɔ yi megbe Overlay film	Ekpɔa nutatawo ta eye ate ŋu anye stripe, signature panel alo security feature	Bonding, flatness, encoding kple anyigba mamlɛtɔ

Ga Tata Ate Ŋu Akpɔ Ŋusẽ Ðe Dɔwɔwɔ Si Me Kakaɖedzi Le O Dzi

Ga gbadzɛ siwo wotsɔ ga wɔe, ink siwo kplɔa nu alo ga ƒokpli siwo te ɖe antenna ŋu ate ŋu aɖe kadodo alo tɔtrɔ ƒe tuning dzi akpɔtɔ. De atsyɔ̃ɖonu mamlɛawo RF dodokpɔwo me eye nàlé nuto siwo me kɔ me ɖe asi le afisi wòhiã le.

Layers Dadasɔ Naa Flatness nyona ɖe edzi

Ele be woada asɔ le ŋgɔgbe kple megbe layer gauges, material direction kple print coverage le afisi wòanya wɔ le. Asymmetrical stacks ate ŋu awɔ card curl le dzoxɔxɔ kple fafa vɔ megbe.

HF RFID prelam Lamination Dɔwɔna

1. Ðo kpe stack si dzi woda asi ɖo dzi: Ŋlɔ Overlay film , nu vevi ɖesiaɖe si wota, inlay, adhesive, stripe kple security layer.

2. Dzra agbalẽawo katã ɖo: Na nuwo nali ke le nuto si me wowɔa wo le me eye nàna woanɔ dzadzɛ, woanɔ gbadzaa eye woaƒu.

3. Kpɔ alesi woɖoe ɖa: Tsɔ agbalẽvi ƒe mɔfiame, kaɖi ƒe gbeɖiɖi, chip ƒe nɔƒe, antenna ƒe nɔƒe, nutata kple punching dzesiwo sɔ kple wo nɔewo.

4. Tu lamination ƒe tsatsam ɖo: Ðo dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe, agbalẽvi ƒe nuwuwu, asiɖeɖe le agbalẽ ŋu kple fafa na nusiwo sɔ pɛpɛpɛ ƒe ƒuƒoƒo.

5. Takpɔ chip zone ta: Kpɔ teƒea ƒe nyaƒoɖeamenu dzi eye nàƒo asa na nu sesẽwo, plate ƒe gbagbãƒewo alo nusiwo ƒe sisi fũu akpa ƒo xlã IC.

6. Fafa le nyaƒoɖeamenu si dzi wokpɔ ŋusẽ ɖo me: Fafa kpɔa ŋusẽ ɖe gbadzaƒe, layer adhesion, chip stress kple dimensional stability dzi.

7. Dodokpɔ hafi nàƒoe: Kpɔ elektrikŋusẽ ƒe dɔwɔwɔ le agbalẽa ƒe ɖoƒe, eƒe dzedzeme, eƒe titrime, eƒe kadodo kple eƒe ŋkɔ ŋɔŋlɔ ɖa.

8. Do kaɖi siwo wowu enu kpɔ: Punch, personalize eye nàɖo kpe RF ƒe dɔwɔwɔ, didime, bending kple dɔwɔwɔ ƒe ɖekawɔwɔ dzi.

Lamination Afɔku	Ate ŋu atso	Ðɔɖɔɖo Mɔfiame
Chip ƒe Dodokpɔ	Dzoxɔxɔ si gbɔ eme, teƒea ƒe nyaƒoɖeamenu, elektrikŋusẽ ƒe gbegblẽ alo chip ƒe kadodo si gbɔdzɔ	To chip package ƒe seɖoƒewo, dɔwɔwɔ ƒe nyaƒoɖeamenu, ESD dziɖuɖuwo kple kadodo ƒe nyonyome me
Ʋu Antenna ƒe Nutome Gã	Conductor gbagbã, ƒunukpeƒe gbegblẽ, lãɖeɖe ƒe gbegblẽ alo keke si gbɔ eme	Kpɔ ŋgɔyiyi, conductor mɔ, punching clearance kple mɔ̃ ƒe nuteɖeamedzi
Nuxexlẽ ƒe Agbɔsɔsɔme Gbɔdzɔgbɔdzɔ	Detuning, conductor ƒe bu, nuxlẽla ƒe masɔmasɔ, metalized artwork alo card-stack ƒe tɔtrɔ	Dzidze resonance eye nàgbugbɔ aɖɔe ɖo to kaɖi kple taɖodzinu xlẽla si nèwu enu la zazã me
Chip Bump si Wokpɔna	Fexexe si mesɔ gbɔ o, module ƒe titrime si gbɔ eme alo nyaƒoɖeamenu si mesɔ o	Na nutoa me dowo, layer gauges, cushioning kple pressing nɔnɔmewo nanyo ɖe edzi
Delamination (Dzidzedzekpɔkpɔ).	Ðiƒoƒo, nusiwo mewɔ ɖeka o, dzoxɔxɔ sue alo fafa si mesɔ o	To nusiwo wotsɔ wɔe ƒe sɔsɔ, dzadzɛnyenye, tsatsam kple lãgbalẽ ƒe dɔwɔwɔ me
Agbalẽvi alo Kpekpeɖeŋugbalẽvi ƒe Warpage	Stack si meda sɔ o, dzoxɔxɔ si gbɔ eme, nyaƒoɖeamenu si mesɔ o alo fafa kabakaba si dzi womeɖu o	Da sɔ le ƒuƒoƒoawo me eye nàna dzoxɔxɔ, agbalẽvi ƒe gbadzaƒe kple fafa nanyo ɖe edzi

Elektrik, RF kple Mɔ̃ɖaŋununya ƒe Nyonyome Dzikpɔkpɔ

Dzroƒe Nu	Kafukafu B2B Dzikpɔkpɔ
Chip ƒe Dzesidede Ame	Kpɔ egbɔ be ewɔla, akpa ƒe xexlẽdzesi tututu, ŋkuɖodzinu, UID tiatia, ɖoɖowɔɖi kple lot traceability
Elektrikŋusẽ ƒe Dɔwɔwɔ	Xlẽ chip UID, ŋkuɖodzinu alo sedede si woɖe fia si woɖo ɖe kaɖi ƒe nɔƒe ɖesiaɖe le ŋkuléleɖenuŋu ƒe ɖoɖoa nu
Antenna ƒe Yiyi	De dzesi nutomeʋuʋu siwo le ʋuʋu ɖi, ʋuƒo kpuiwo, ƒunukpeƒe siwo gbɔdzɔ, elektrikŋusẽnamɔ̃ ƒe gbɔdzɔgbɔdzɔwo kple crossover siwo gblẽ
Resonance / RF Dɔwɔwɔ	Dzidze RF parameter alo dɔwɔwɔ ƒe nuxexlẽ ƒe didime si dzi wolɔ̃ ɖo to dodokpɔ dɔwɔnu kple fixture si woɖe fia zazã me
Chip kple Antenna ƒe Nɔnɔme	Kpɔ teƒe si wòle le CAD, kaɖi ƒe nɔnɔmetata, punch clearance kple antenna siwo te ɖe eŋu me
Agbalẽvi ƒe Dzidzemewo	Didime, kekeme, dzogoe ene me, kaɖi ƒe kɔkɔme, do siwo me woŋlɔ ŋkɔ ɖo kple nugbɔ ƒe nyonyome
Titrime Kple Eƒe Gãnyenye	Mamã dedie ƒe titrime, nutoa me ƒe chip-zone ƒe titrime, curl, bow kple point-to-point ƒe tɔtrɔ
Nukpɔkpɔ ƒe Dzodzro	Ðiƒoƒo, kuɖɔ, flitete, teƒe yibɔwo, conductor ƒe ɖeɖefia, ʋuʋudedi kple layer ƒe gbagbã
Kpekpeɖeŋugbalẽvi ƒe Dodokpɔ si Wu enu	RF dɔwɔwɔ, didime, titrime, bending, torsion, dzoxɔxɔ, fafa, peel kple nuxlẽla ƒe sɔsɔ
Nusiwo woate ŋu akpɔ	Chip lot, antenna lot, PVC lot, ŋkeke si dzi wowɔe, ɖoɖo, dodokpɔ ƒe ɖoɖowɔɖi, agbalẽ ƒe xexlẽdzesi kple packing record

Ðe Nusi '100% Dzodzro' De eme la gɔme

Dzodzro blibo ateŋu afia elektrik nuxexlẽ dodokpɔ le teƒe ɖesiaɖe, esime zi geɖe la, wowɔa dodokpɔ siwo nye dimensional, peel kple destructive dodokpɔwo ƒe kpɔɖeŋu. Ele be nuƒle ƒe nɔnɔmetata naɖe dodokpɔnuwo, fixture, lɔlɔ̃ ɖe edzi ƒe dzidzenuwo, kpɔɖeŋuɖoɖo kple nyatakaka me.

Dodokpɔ Do Ŋgɔ Na Kpekpeɖeŋugbalẽvi Mamlɛtɔ Lamination Kple Emegbe

Prelam ateŋu ato elektrik dodokpɔ me eye wòado kpo nu kokoko le dzoxɔxɔ si gbɔ eme, nyaƒoɖeamenu, atamkaka alo ame ŋutɔ ƒe tɔtrɔ megbe. Ele be B2B ƒe dzeside nalɔ incoming-inlay kple finished-card ƒe dɔwɔwɔ siaa ɖe eme.

13.56MHz ƒe dɔwɔwɔwo HF PVC Prelam inlay s

Dɔwɔwɔ ƒe	Chip / Protocol Mɔfiame	Vevitɔ ƒe Dzesidede
Dɔwɔla Kple Mɔɖeɖe ƒe Kpekpeɖeŋugbalẽviwo	Legacy Type A, MIFARE Plus alo DESFire le mɔɖeɖe ƒe ɖoɖo si woda ɖe eme nu	Nuxlẽla ƒe sɔsɔ, safuiwo dzikpɔkpɔ, ŋkɔ ŋɔŋlɔ kple gbesiagbe bɔbɔ
Amedzrodzeƒea ƒe Safuigbalẽviwo	Chip si amedzrodzeƒe-lock-nuƒolanɔƒea hiã	Lock encoder, amedzro-dzikpɔkpɔ ɖoɖo, kaɖi ƒe titrime kple fafa ƒe ɖeɖefia
Ʋuɖoɖo Kple Sukuxɔ me Kpekpeɖeŋugbalẽviwo	Dedie multi-application chip abe DESFire le afisi system architecture bia le	Asitsatsa ƒe duƒuƒu, dedienɔnɔ, nuxlẽla ƒe nunɔamesiwo, ame ŋutɔ ƒe nɔnɔme kple agbenɔƒe
Hamevinyenye Kple Nuteƒewɔwɔ ƒe Gbalẽviwo	Ŋlɔ A memory chip, NTAG alo secure application chip le ɖoɖowɔɖia ƒe ɖoɖo nu	Nuxlẽla alo telefon ƒe sɔsɔ, nyatakakadzraɖoƒe, adzamenyawo kple eŋudɔwɔwɔ enuenu
NFC Asitsatsa kple Asitsatsa ƒe Kpekpeɖeŋugbalẽviwo	NTAG alo NFC Forum ƒe chip bubu si sɔ	NDEF ƒe ŋutete, telefon ƒe sɔsɔ, URL ƒe dedienɔnɔ kple scan ƒe nɔƒe
Agbalẽdzraɖoƒe, Nuwo Kple Nutoa Me Kpekpeɖeŋugbalẽviwo	ISO /IEC 15693 / ICODE-ƒomevi ƒe egbɔkpɔnu	Nuxlẽla ƒe ɖoɖowɔɖi, antenna ƒe lolome, taɖodzinu ƒe didime, anti-collision kple EAS ƒe nudidiwo
Dzesidede Ame Ŋu Kple Fexexe ƒe Dɔwɔnawo	Chip dedie si ŋu woɖo kpee kple dɔwɔwɔ ƒe xɔtuɖaŋu si dzi woda asi ɖo	Ðaseɖigbalẽ, safui dodo, nuzazãwo ƒe kɔsɔkɔsɔ si wodzro kple ɖoɖo tɔxɛ ƒe mɔɖeɖe

HF RFID Inlay Dɔwɔwɔwo na Smart card Dɔwɔɖoɖowo

Dedienɔnɔ, UID kple Nyatakakawo ƒe Ame ŋutɔ ƒe Tɔtrɔ

Nyatakaka / Dedienɔnɔ ƒe Nu	B2B Nudidi
UID	Kpe ɖe UID ƒe didime, ID ƒe nuwɔna si woɖo ɖi alo esi wowɔ le vome, nyatakakadzraɖoƒe ƒe nɔnɔme kple nuxlẽla ƒe kpekpeɖeŋu dzi
Ŋkuɖodzinyawo ƒe Encoding	Ðe nyatakakawo ƒe ɖoɖo, akpawo/faɛlwo/axawo, NDEF nuŋlɔɖi, lock bits kple kpeɖodzinana gɔme
Nyateƒetoto ƒe Safuiwo	Ðe nu vevi siwo nye nutɔnyenye, atike dodo ƒe ɖoɖo, ʋuɖoɖo takpɔkpɔ, vovototodedeameme kple agbalẽdzikpɔkpɔ ƒe mɔ gɔme
Password / Mɔɖeɖe ƒe Ðoɖowɔɖi	Tsɔ nyagbegbɔgblɔ, mɔɖeɖe ƒe bits, xexlẽdzesiwo, gbãtɔ ƒe dodokpɔ kple lock-state dodokpɔ le afisi wodo alɔe le
Nyatakaka Siwo Trɔna Si Wota	Tsɔ xexlẽdzesi si wota, barcode alo QR code do ƒome kple chip data to dzadzraɖo si dzi wokpɔna me
Kpekpeɖeŋugbalẽvi Siwo Wogbe	Ma kaɖi siwo me safui gbagbewo, dzesidenu alo nyatakaka siwo woŋlɔ ɖe kɔpi me le la ɖe vovo, xlẽ wo eye nàtsrɔ̃ wo dedie

UID Ðeka Menye Dzesidede Sesẽ O

Nuɖoanyi si naa mɔnukpɔkpɔ ame be wòage ɖe eme tso dzesidenu si woate ŋu axlẽ le dutoƒo ko dzi ate ŋu anye esi woate ŋu awɔ kɔpi alo awɔ eƒe kpɔɖeŋu bɔbɔe. Ele be dɔ siwo ku ɖe dedienɔnɔ ŋu nazã chip kple megbenyawo ƒe xɔtuɖaŋu si doa alɔ nya ɣaɣlawo ƒe kpeɖodzi si sɔ.

Key Injection Nye Subɔsubɔdɔ si Le Dedie si To Vovo

Chip si le dedie nana melɔa dɔwɔnua ƒe ɖoɖowɔwɔ alo safuiwo dzi kpɔkpɔ ɖe eme le eɖokui si o. Ðe amesi wɔa safuiwo, dzraa wo ɖo, tsɔa wo dea agba me eye woɖoa kpe wo dzi, kple nenye be ehiã be woawɔ dedienɔnɔ-ame ŋutɔ ƒe nɔnɔme si wodzro.

Hybrid kple Multi-Frequency Inlay Tiatiawɔblɔɖewo

Smart card si wotsɔ tsaka ateŋu aƒo HF nu ƒu kple LF , UHF , kadodo ƒe chip alo HF dɔwɔnu bubu. Xɔtuɖoɖo siawo hiã teƒe geɖe wu, antennawo mama nyuie, nutoa me ƒe titrime dzi kpɔkpɔ bubuwo kple lamination kple dodokpɔ ƒe ɖoɖo tɔxɛ aɖe.

Hybrid Structure	Zazã Nudzɔdzɔ	Mɔ̃ɖaŋudɔwɔwɔ ƒe Afɔku
LF + HF	Ʋuʋu tso domenyinu ƒe teteɖeanyi ƒe mɔɖeɖe yi HF smart-card ɖoɖowo gbɔ	Antenna ƒe teƒe, wo nɔewo ƒe kadodo, kaɖi ƒe titrime kple nuxlẽla eve dodokpɔ
HF + UHF	Dzesidede ame si le didiƒe kpui aɖe kpe ɖe kplɔkplɔ si didi wu ŋu	Antenna ƒe ɖoɖo vovovowo, nusiwo ƒe ŋusẽkpɔɖeamedzi kple UHF seselelãme si te ɖe ŋutilã alo ga ŋu
HF Chips eve	Dɔdamɔnu siwo ɖe vovo alo domenyiŋusẽfianu siwo le wo ɖokui si	Nuxlẽla ƒe tiatia, antenna ƒe kadodo, nyatakakawo ƒe amesinɔnɔ kple kaɖi ƒe ɖoɖo ƒe mɔxenuwo
Kadodo + Kadodo aɖeke manɔmee	Dual-interface dedie dzesideŋkɔ, telefonkadodo alo fexexe ƒe xɔtuɖaŋu	Module do, antenna kadodo, lamination, ɖaseɖigbalẽ kple ame ŋutɔ ƒe tɔtrɔ

Hybrid Designs Nye Nusiwo To Vovo

Mele be woaɖɔ HF prelam si wozãna zi ɖeka ƒe ɖoɖowɔɖi si sɔ be edoa alɔ LF alo UHF le eɖokui si o. Multi-frequency xɔtuɖoɖowo hiã woawo ŋutɔ ƒe nutata, chip xexlẽdzesi, RF dodokpɔwo, titrime ƒe nɔnɔme kple asi.

RFID prelam Agbalẽviwo ƒe Babla Kple Wo Dzadzraɖo

• Dzra prelam-gbadzɛwo ɖo gbadzaa ɖe nubablɛ siwo wotu nu ɖo, siwo le dzadzɛ eye wole ƒuƒuie me le afisi ɣe ƒe keklẽ kple dzoxɔxɔ tẽ nagage ɖo o.

• Zã ʋuƒo sesẽwo, nusiwo wotsɔ dea wo nɔewo me kple kakɛ siwo wokpɔ ta na be woaxe mɔ ɖe ƒoƒo, ƒoƒo kple chip-zone ƒe nyaƒoɖeamenu nu.

• Ƒo asa na elektrikŋusẽ ƒe dodo sesẽ eye nàzã ESD ƒe dɔwɔwɔ ƒe mɔ̃ siwo sɔ le afisi wòhiã le.

• Mègatsɔ agba kpekpe siwo mesɔ o da ɖe agbalẽa ƒe ƒuƒoƒoa dzi alo nàɖe mɔ pallet la natsi dzi o.

• Nɔnɔme nusiwo le lamination xɔa me hafi woawɔ dɔ ne nudzraɖoƒe kple ewɔwɔ ƒe nɔnɔmewo to vovo.

• De dzesi pack ɖesiaɖe to chip model, antenna design, layout, titrime, batch kple inspection status nu.

• Zã nudzraɖoƒe gbãtɔ, gbãtɔ si dona le eme eye nàgbugbɔ ado nusiwo wotsɔ dzrae kpɔ le wo dzadzraɖo alo wo tsɔtsɔ yi teƒe bubuwo ɣeyiɣi didi megbe.

Takpɔkpɔ Flat Packing na HF RFID prelam Agbalẽviwo

Team, Dɔwɔƒe kple Smart card Nuwɔwɔ ƒe Kpekpeɖeŋu

Prelam wɔwɔ si ŋu kakaɖedzi le bia be woakpɔ antenna embedding alo etching dzi, chip attachment, sheet registration, plastic lamination, elektrik dodokpɔ, didime me dzodzro, dzadzɛ handling kple batch traceability. Ele be chip, antenna tata kple RF dodokpɔ mɔnu si dzi woda asi ɖo la nanɔ teƒe ɖeka na nudɔdɔ gbugbɔgawɔ negbe ɖe wolɔ̃ ɖe tɔtrɔ si dzi wokpɔ ŋusẽ ɖo dzi hafi.

Nukatae Nàtia Wallis na 13.56MHz HF Prelam inlay s?

• Chip tiatia si wotu ɖe dɔwɔwɔ dzi: Woateŋu ama domenyinu ƒe mɔɖeɖe, NFC , dɔwɔwɔ geɖe siwo le dedie kple ISO 15693 dɔwo dome to ɖoɖowɔɖi kple dedienɔnɔ ƒe hiahiã nu.

• Antenna ƒe mɔ̃ɖaŋununya si wowɔ ɖe ɖoɖo nu: Woate ŋu ato coil geometry, conductor, chip capacitance, card outline kple target reader me ɖekae.

• Agbalẽviawo ƒe ɖoɖo si te ŋu trɔna: Kaɖi geɖe ƒe ɖoɖo siwo wowɔna ɖaa kple kaɖi ƒe gbeɖiɖi siwo asisiwo koŋ le la li.

• Card-material integration: PVC prelam ateŋu awɔ ɖeka kple nu vevi siwo wota, Overlay film s, magnetic stripes kple finished-card structures.

• Dzeside ƒe kpekpeɖeŋu: Kpɔɖeŋuwo, lamination dodokpɔwo, RF dodokpɔ, titrime dodokpɔ kple finished-card verification ɖea dɔa ƒe afɔku dzi kpɔtɔna.

• Factory-direct B2B supply: Esɔ na smart-card dɔwɔƒewo, agbalẽtamɔ̃wo, tɔtrɔlawo, ɖoɖo integrators, issuers, importers kple mamalawo.

Nyatakaka Siwo Hiã Na B2B Quotation Kabakaba

• Dɔwɔwɔ, nuxlẽla ƒe dzesi/kpɔɖeŋu, ɖoɖowɔɖi kple kɔmpiutadziɖoɖo ƒe mɔ̃ si woda ɖe eme.

• Chip wɔla kple akpa ƒe xexlẽdzesi, ŋkuɖodzinu, UID kple dedienɔnɔ ƒe nudidiwo pɛpɛpɛ.

• Agbalẽviawo ƒe ɖoɖo, woƒe didime katã, kaɖi ƒe gbeɖiɖi, ŋkɔ ŋɔŋlɔ ƒe dzesiwo kple agbɔsɔsɔ.

• Kpekpeɖeŋugbalẽvi ƒe lolome, antenna ƒe nuto si me kɔ, chip ƒe nɔƒe kple punching ƒe nɔnɔmetata.

• prelam nusi wotsɔ wɔe, amadede, ŋkɔ me titrime kple mɔɖeɖe ɖe nu ŋu.

• Antenna mɔ̃ɖaŋununya, taɖodzinu ƒe gbeɖiɖi alo dɔwɔwɔ ƒe nuxexlẽ ƒe didime dodokpɔ.

• Kpekpeɖeŋugbalẽvi mamlɛtɔ ƒe ƒuƒoƒo, nu vevi siwo wota, Overlay film s, ga tata, fli alo asidede agbalẽ te ƒe akpa.

• Lamination press, dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe, fafa kple agbalẽvi didimewo.

• Elektrik dodokpɔ, RF dodokpɔ, didime me dzodzro kple lɔlɔ̃ ɖe edzi ƒe dzidzenuwo.

• Encoding, key injection, UID list, nyatakaka siwo trɔna alo nyatakakadzraɖoƒe ƒe sɔsɔ.

• Kpɔɖeŋu agbɔsɔsɔme, ƒe sia ƒe ƒe nyagblɔɖi, nudɔdɔ gbugbɔgawɔ ƒe ɖoɖowɔɖi kple tɔtrɔ-dzikpɔkpɔ ƒe nudidiwo.

• Nubablɛ, ŋkuléleɖenuŋu ƒe nuŋlɔɖiwo, melidzeƒe si woɖo tae kple ŋkeke si wobia be woatsɔe aɖo ɖe amewo.

Dzro Wò HF RFID Inlay Dɔwɔwɔ me

Nya Siwo Wobia Enuenu

Nukae nye 13.56MHz HF RFID prelam inlay?

Enye kaɖi-wɔwɔ ƒe nu vevi agbalẽ si me 13.56MHz ƒe chip kple antenna le le plastik-kpluwo me. Wotsɔa nu vevi siwo wota kple Overlay film s ƒoa xlãe be woawɔ kaɖi siwo me kadodo mele o siwo wowɔ vɔ.

Ðe prelam inlay sɔ kple smart card si wowɔ vɔa?

Ao, prelam nye domedome dɔwɔwɔ ƒe ƒuƒoƒo. Kpekpeɖeŋugbalẽvi siwo wowɔ vɔ hiã tata bubuwo, Overlay film s, lamination, fafa, punching kple ame ŋutɔ ƒe tɔtrɔ alo encoding si woate ŋu atia.

13.56MHz ƒe ɖoɖowɔɖi kawoe li?

Dɔwɔwɔwo ateŋu azã ISO /IEC 14443 Ƒomevi A, Ƒomevi B, ISO /IEC 15693 alo NFC Forum ƒe chips siwo sɔ. Ðoɖo si tututu woawɔ la nɔ te ɖe IC kple nuxlẽla ƒe ɖoɖo si nètia dzi.

Ðe MIFARE, NTAG kple ICODE nye esiwo woate ŋu atrɔa?

Ao, wonye adzɔnuwo ƒe ƒome vovovo siwo ƒe ɖoɖowɔɖi, ŋkuɖodzinu, sededewo, dedienɔnɔ kple dɔwɔɖoɖowo to vovo. Ðo kpe chip kple nuxlẽla si sɔ pɛpɛpɛ dzi hafi nàbia.

Àte ŋu ana Fudan F08-siwo sɔ kple inlays?

Woate ŋu adzro tiatia siwo sɔ kple 1K ƒe domenyinu mawo me. Na chip ƒe nudidi tututu kple nuxlẽla ƒe kpɔɖeŋu, elabena ele be woaɖo kpe ewɔla, UID, ŋkuɖodzinu kple ɖaseɖiɖi ƒe ɖekawɔwɔ dzi.

Ðe wokafu MIFARE Classic na ɖoɖo yeye siwo le dediea?

Ekpɔtɔ sɔ na domenyinu ƒe ɖoɖo siwo woda ɖe eme, gake ele be egbegbe dedienɔnɔdɔwo nada fifia ƒe mɔnu bubuwo abe MIFARE DESFire alo MIFARE Plus ene kpɔ le ɖoɖoa ƒe xɔtuɖoɖo nu.

Chip kae sɔ na NFC dɔwɔgbalẽviwo?

NTAG 213, 215 alo 216 kple NFC Forum ƒe chip bubu siwo sɔ nye tiatia siwo bɔ. Tia kpɔɖeŋua tso NDEF ŋkuɖodzinu si hiã, telefon ƒe wɔwɔ ɖekae kple dedienɔnɔ ƒe nɔnɔmewo me.

Chip kae sɔ na mɔɖeɖe alo ʋuɖoɖo dedie?

Dɔwɔwɔ geɖe ƒe chip si le dedie abe MIFARE DESFire ene ateŋu asɔ, gake ele be woaɖo kpe nuxlẽla ƒe kpekpeɖeŋu, safuiwo dzikpɔkpɔ, ɖaseɖigbalẽ, dɔwɔwɔ ƒe faɛlwo kple kɔmpiuta dɔwɔɖoɖowo dzi.

Ɣekaɣie wòle be woatia ISO /IEC 15693?

ISO /IEC 15693 wozãna na nuto-kaɖi dɔwɔwɔwo afisi nuxlẽla, antenna ƒe lolome kple taɖodzinu ƒe kadodo ƒe didime to vovo tso tete-kaɖi ɖoɖo siwo wotu ɖe ISO /IEC 14443 dzi.

Agbalẽvi ƒe ɖoɖo kawoe li?

Tiatia siwo bɔ dometɔ aɖewoe nye 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kple 4 × 10. Woate ŋu awɔ ɖoɖo siwo wowɔ ɖe ɖoɖo nu tso nuƒlela ƒe lamination kple punching ƒe nɔnɔmetata me.

Nukae nye dzidzenu HF prelam ƒe titrime?

Adzɔnu ƒe axa si li fifia la ƒo nu tso abe 0.45 ± 0.02mm ene na HF xɔtuɖoɖo tiatia aɖewo. Titrime mamlɛtɔ nɔ te ɖe chip, antenna, nu, card stack kple nutoa me chip-zone ƒe nudidiwo dzi.

Ðe woate ŋu atrɔ asi le eƒe titrime ŋu wòasɔ ɖe woƒe didi nua?

Ɛ̃. Na taɖodzinu si wu-kaɖi ƒe titrime, Overlay film kple printed-core gauges, chip package kple lamination process ale be woateŋu abu stack bliboa.

Àte ŋu atrɔ asi le antenna la ŋu wòasɔ ɖe wò didi nua?

Ɛ̃. Woateŋu ato antenna geometry vɛ ƒo xlã chip ƒe capacitance, card ƒe lolome, nuxlẽla, taɖodzinu ƒe dɔwɔwɔ, chip ƒe nɔƒe kple lãɖeɖe ƒe clearances.

Antenna mɔ̃ɖaŋununya kawoe li?

Woate ŋu adzro akɔbli-ka kple etched-aluminum tiatia siwo wotsɔ de eme la me. Xɔtutu nyuitɔ nɔ te ɖe gbeɖiɖi ƒe sesẽme, tsitretsitsi, titrime, kadodo, kaɖi ƒe nɔnɔme kple RF taɖodzinu dzi.

Nuxexlẽ ƒe didime kae kaɖia ate ŋu aɖo?

Xexeame katã ƒe didime aɖeke meli o. Enɔ te ɖe chip, antenna, nuxlẽla, kaɖi ƒe ƒuƒoƒo, mɔfiame kple nuto dzi. Ðe dodokpɔ xlẽla kple dɔwɔwɔ ƒe didime suetɔ gɔme.

Ðe woate ŋu azã gatata ɖe agbalẽvia dzia?

Woate ŋu azãe le RF dodokpɔ vɔ megbe. Ga gbadzɛ alo nuŋlɔtsi si kplɔa nu si te ɖe antenna la ŋu ate ŋu aɖe asi le kadodo si me kadodo mele o ŋu alo akpɔ eta.

Ðe woate ŋu atsɔ PETG alo polycarbonate awɔ nusi wotsɔ blae la?

Woate ŋu ato nu bubuwo ƒe xɔtuɖoɖowo me, gake ele be woaɖo kpe shrinkage, bonding, lamination temperature, RF tuning kple finished-card durability dzi ɖe vovo.

Ðe woate ŋu ata agbalẽawo do ŋgɔa?

Zi geɖe la, wotsɔa prelam la naa abe dɔwɔwɔ ƒe nuto ƒuƒlu ene. Zi geɖe la, wozãa agbalẽtata ɖe agbalẽ vevi vovovowo dzi, togbɔ be woate ŋu adzro xɔtuɖoɖo siwo ku ɖe dɔa koŋ ŋu me hã.

Lamination ƒe dzoxɔxɔ kae wòle be woazã?

Mele be woata xexeame katã ƒe nɔnɔme aɖeke na xɔtuɖoɖo ɖesiaɖe o. Tu dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe kple fafa ɖo ƒo xlã PVC , Overlay film , ink, chip kple antenna wɔwɔ pɛpɛpɛ.

Aleke woxea mɔ na chip ƒe gbegblẽ le lamination wɔwɔ me?

Zã chip ƒe babla siwo sɔ, teƒea ƒe titrime si dzi wokpɔna, agbalẽ siwo le dzadzɛ, nyaƒoɖeamenu si da sɔ, dzoxɔxɔ ƒe tsatsam si dzi woda asi ɖo kple elektrik dodokpɔ do ŋgɔ na lamination kple emegbe.

Ðe nèdoa chip ƒe nɔnɔme ɖesiaɖe kpɔna?

Woate ŋu agblɔ elektrikŋusẽ dodokpɔ bliboe. Ele be nuƒle ƒe nubabla la naɖe sedede siwo ŋu woléa ŋku ɖo le teƒe ɖesiaɖe kple dodokpɔ siwo gblẽa nu alo didime ƒe dodokpɔ siwo zãa kpɔɖeŋuwo xɔxɔ la me.

Ðe woate ŋu aŋlɔ nu siwo wotsɔ de eme la do ŋgɔa?

Woateŋu aƒo nu tso UID xexlẽ, ŋkuɖodzinu ƒe nuŋɔŋlɔ, NDEF nuŋɔŋlɔ alo dɔwɔwɔ ƒe ame ŋutɔ ƒe tɔtrɔ ŋu. Dedienɔnɔ-safui subɔsubɔdɔwo hiã be woawɔ ɖoɖo ɖe vovo si dzi wokpɔna.

Àte ŋu ana LF + HF alo HF + UHF hybrid inlays?

Woate ŋu ato atsyã siwo wotsɔ tsakae vɛ abe nusiwo to vovo ene. Wobia antenna ƒe ɖoɖo tɔxɛwo, ɖoɖowɔwɔ ɖe eƒe titrime ŋu, nuxlẽla ƒe dodokpɔwo kple asixɔxɔ.

Ðe woate ŋu ado kpɔɖeŋuwo kpɔ hafi woawɔ wo le agbɔsɔsɔ gã mea?

Ɛ̃. Dɔwɔwɔ si wodi wue nye be woado prelam la kpɔ, awɔ laminate na kaɖi ƒe ƒuƒoƒo bliboa, aƒo kaɖiwo eye woaɖo kpe RF, mɔ̃ɖaŋu kple ame ŋutɔ ƒe dɔwɔwɔ dzi.

Nukae afia nudɔdɔ ƒe agbɔsɔsɔ suetɔ kekeake?

MOQ nɔ te ɖe chip ƒe anyinɔnɔ, antenna dɔwɔnu siwo wowɔ ɖe ɖoɖo nu, ɖoɖo, nusi wotsɔ wɔe, titrime, dodokpɔ ƒe ɖoɖowɔɖi, encoding kple nenye be woate ŋu azã ɖoɖowɔɖi si dzi woda asi ɖo si sɔ dzi.

Nyatakaka kawoe hiã hafi woate ŋu ayɔ nya si woyɔ wòde pɛpɛpɛ?

Na chip, nuxlẽla, ɖoɖowɔɖi, ɖoɖo, agbalẽ ƒe lolome, kaɖi ƒe nɔnɔmetata, titrime, antenna ƒe taɖodzinu, kaɖi mamlɛtɔ ƒe ƒuƒoƒo, dodokpɔwo, agbɔsɔsɔme, babla kple teƒe si woɖo tae.

Bia Trɔ asi le 13.56MHz HF RFID prelam Kpɔɖeŋuwo

Te ɖe Wallis Plastic ŋu hena 13.56MHz HF RFID PVC prelam inlay sheets hena mɔɖeɖe, ID, amedzrodzeƒe, hamevinyenye, ʋuɖoɖo, NFC kple smart-card wɔwɔ. Míaƒe ƒuƒoƒoa doa alɔ chip tiatia, antenna ƒe nɔnɔme, agbalẽ ƒe ɖoɖo, RF tuning, lamination dodokpɔwo, elektrik dodokpɔ, encoding, nyonyome ƒe nɔnɔmewo kple dɔwɔƒe- tẽ B2B nana.

Bia Kpɔɖeŋuwo Kple Dɔwɔƒe ƒe Nyayɔyɔ