|
Inlay/ Prelam ƒe dɔwɔwɔ
Wallis ye nye esia
| Agbɔsɔsɔme: | |
|---|---|
| Agbɔsɔsɔ: | |
Wotrɔ asi le Wallis 13.56MHz HF RFID PVC prelam inlay agbalẽviwo ŋu abe dɔwɔwɔ ƒe nu vevitɔ na smart card siwo ŋu kadodo mele o, ID gbalẽviwo, mɔɖeɖegbalẽviwo, amedzrodzeƒe ƒe safuigbalẽviwo, hamevinyenye ƒe agbalẽviwo, ʋuɖogbalẽviwo kple NFC-siwo ŋu woate ŋu awɔ kaɖi ƒe ɖoɖowo le. Agbalẽvi ɖesiaɖe ƒoa HF chip tiatia kple antenna nu ƒu ɖekae le PVC xɔtuɖoɖo si dzi wokpɔna me, si le klalo na kaɖi-ŋutilã ƒe lamination mamlɛtɔ, tata, punching kple ame ŋutɔ ƒe tɔtrɔ.
B2B dɔwo ate ŋu atrɔ asi le to chip ƒe kpɔɖeŋu, ɖoɖowɔɖi, ŋkuɖodzinu, antenna geometry, agbalẽ ƒe lolome, kaɖi ƒe ɖoɖo, inlay titrime, chip ƒe nɔƒe, nu, kaɖi mamlɛtɔ tutu kple babla. Nufiameɖoɖo siwo wozãna ɖaa dometɔ aɖewoe nye 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kple 4 × 10, kple ɖoɖo siwo wowɔ ɖe ɖoɖo nu siwo me kaɖi geɖe le siwo li na lamination plate tɔxɛwo kple punching dɔwɔnuwo.
Mele be woaƒo chip ƒomewo nu ƒu ɖe xexeame katã ƒe ɖekawɔwɔ ƒe nya ɖeka te o. MIFARE Classic, MIFARE Ultralight, NTAG kple MIFARE DESFire ƒe nutovɛwo wɔa dɔ le ISO/IEC 14443 Ƒomevi A ƒe nɔnɔmewo me, esime ICODE ƒe nutovɛwo nɔa te ɖe ISO/IEC 15693 dzi zi geɖe. Ele be woaɖo kpe chip, nuxlẽla, dɔwɔwɔ ƒe kɔmpiuta dɔwɔɖoɖo kple dedienɔnɔ ƒe nudidi tututu dzi hafi woawɔ antenna ƒe ɖɔɖɔɖo kple ewɔwɔ le agbɔsɔsɔ gã me.
| Adzɔnu Ƒomevi | 13.56MHz HF RFID contactless prelaminated inlay agbalẽ na plastic-kaɖi wɔwɔ |
| Xexlẽme | 13.56MHz HF ƒe ŋusẽ; protocol kple ya ƒe ƒomedodo nɔ te ɖe chip si wotia dzi |
| Ðoɖo Siwo Woɖo Ðe Ðoɖo Nu | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 kple ɖoɖo siwo wowɔ ɖe ɖoɖo nu |
| Fifia ƒe Axa ƒe Titrime ƒe Nufiame | Anɔ abe 0.45 ± 0.02mm na HF xɔtuɖoɖo tiatia aɖewo; ɖo kpe edzi to chip, antenna, nu kple kaɖi mamlɛtɔ ƒe ƒuƒoƒo dzi |
| Nusiwo Wozãna le Gɔmeɖoanyi | PVC ɣi alo esi me kɔ; PETG kple polycarbonate-siwo sɔ kple dɔ siwo wowɔ le ɖoɖo vovovowo ƒe kpeɖodzinana te |
| Antenna ƒe Tiatiawɔblɔɖe | Akɔbli ka si wotsɔ de eme, aluminum si woŋlɔ kple dɔa koŋ ƒe antenna tutuwo |
| B2B Dɔwɔƒewo | Chip dzɔtsoƒe, antenna ƒe wɔwɔme, RF tuning, ɖoɖowɔwɔ ƒe mɔ̃ɖaŋu, kpɔɖeŋuwo, lamination dodokpɔwo, elektrik dodokpɔ, QC nyatakakawo kple dɔdɔ ɖa |
Bia HF RFID Inlay Kpɔɖeŋuwo kple Quote
Prelam inlay nye domedome kaɖi-wɔwɔ ƒe agbalẽ si me RFID chip, chip-to-antenna kadodo kple tuned antenna structure le plastic layers me. Zi geɖe la, menye agbalẽvi si woate ŋu ata si wowu enu lae o. Kpekpeɖeŋunalawo ƒoa prelam la nu ƒu kple nu veviwo ƒe agbalẽ siwo wota kple nusiwo wotsɔ tsyɔ wo dzi siwo me kɔ, emegbe wotsɔa laminate, fa, ƒoa agbalẽviawo eye wotrɔa asi le wo ŋu.
Antenna la xɔa ŋusẽ tso nuxlẽla ƒe teƒea eye wòtsɔa nyatakakawo yia nuxlẽla kple chip si wotsɔ de eme la dome. RF dɔwɔwɔ nɔ te ɖe antenna geometry, conductor tsitretsitsi, chip capacitance, resonance, kaɖi nu, ga si te ɖe eŋu, kaɖi mamlɛtɔ ƒe titrime kple nuxlẽla ƒe agble ƒe ŋusẽ dzi.
PVC core sheets siwo wota, nusiwo wotsɔ blaa nu siwo me kɔ, adhesives, magnetic stripes, signature panels kple ametakpɔnu ƒe nuwuwu kpena ɖe prelam la ƒe titrime ŋu. Ele be woawɔ ɖoɖo ɖe taɖodzinu si wowu kaɖi ƒe titrime ŋu tso ƒuƒoƒo bliboa me tsɔ wu be woawɔe tso prelam gauge ɖeɖeko me.
Chip ƒomea, antenna ƒe lolome, conductor, card material alo card ƒe nɔnɔme tɔtrɔ ate ŋu atrɔ resonance eye wòatrɔ nuxexlẽ ƒe dɔwɔwɔ. Mele be woagazã aɖaŋu si dzi woda asi ɖo na chip ɖeka le eɖokui si na chip bubu RF dzidzenu manɔmee o.
Embedded HF Chip kple Antenna Dɔwɔɖoɖo
Multi-Card Sheet Ðoɖowɔwɔ na Lamination
Ele be woatia chip la tso nuxlẽla ƒe ɖoɖowɔɖi, ŋkuɖodzinu ƒe hiahiã, dedienɔnɔ ƒe ɖoɖo, asitsatsa ƒe duƒuƒu, agbenɔƒe, ɖaseɖigbalẽ kple kɔmpiuta dɔwɔɖoɖowo ƒe lãwo ƒe agbenɔnɔ me. Adzɔnu ƒe ŋkɔwo abe MIFARE, NTAG kple ICODE nye adzɔnuwo ƒe ƒomewo tsɔ wu be woanye nya siwo wozãna le mɔ vovovowo nu siwo woate ŋu atrɔ.
| Chip Ƒome / Tiatia | Protocol Positioning | Typical Project Fit | Vevietɔ B2B De dzesii |
|---|---|---|---|
| Fudan F08 / Domenyinu 1K Tiatia si sɔ | Wobiaa zi geɖe na ISO/IEC 14443 Ƒomevi A ƒe ɖoɖo siwo sɔ; ele be woaɖo kpe akpaa ƒe xexlẽdzesi tututu dzi | Domenyinu ƒe mɔɖeɖe, hamevinyenye kple installed-reader ɖɔliɖɔlidɔwo | Kpe ɖe adzɔnuwɔƒe, ŋkuɖodzinu, UID, ɖaseɖiɖi, nuxlẽla ƒe sɔsɔ kple adzɔnu ƒe dzeside si le se nu dzi |
| MIFARE Klasik EV1 1K / 4K ƒe ʋuƒoƒo | ISO/IEC 14443-3 Ƒomevi A, 106kbit/s | Ʋuɖoɖo, tikitiwo, mɔɖeɖe kple fefewɔƒe ƒe xɔtuɖoɖo siwo li fifia | Domenyinu ƒe adzɔnuwo ƒe ƒome; zãe le afisiwo ɖoɖo si woda ɖe eme la bia ko eye nàda egbegbe mɔnu bubu si le dedie si woate ŋu azã ɖe aɖaŋu yeyewo teƒe la kpɔ |
| MIFARE Ultralight EV1 ƒe ʋu si me kɔ | ISO/IEC 14443 Ƒomevi A ƒe nɔnɔme | Tiketi siwo wozãna seɖoƒe li na, wɔnawo, nuteƒewɔwɔ kple ɖoɖo bɔbɔe siwo me kadodo mele o | Tsɔ ŋkuɖodzinu, nyagbe ɣaɣla kple gbãtɔ ƒe nɔnɔmewo sɔ kple dɔwɔwɔ ƒe ŋɔdzidoname ƒe kpɔɖeŋu |
| NTAG 213 / 215 / 216. Ƒe 1999 me | NFC Forum Ƒomevi 2 Tag kple ISO/IEC 14443 Ƒomevi A | NFC dɔwɔgbalẽviwo, ɖaseɖiɖi ƒe kadodowo, asitelefon dzi nuwɔwɔ kple nusiwo do ƒome kplii | Zãla ƒe ŋkuɖodzinu to vovo le eƒe kpɔɖeŋu nu; ɖo kpe NDEF ƒe lolome, nyagbe ɣaɣla kple gbãtɔ ƒe nudidiwo dzi |
| MIFARE DZIDZƆDZƆDZƆ EV3 | ISO/IEC 14443 Ƒomevi A ƒe akpa 1–4 kple dɔwɔwɔ siwo le dedie wu | Mɔɖeɖe dedie, ʋuɖoɖo, sukuxɔ, dzesideŋkɔ, nuteƒewɔwɔ kple dɔbiagbalẽvi geɖe | Ebia safuiwo dzikpɔkpɔ, dɔwɔwɔ ƒe ame ŋutɔ ƒe tɔtrɔ kple nuxlẽla/kɔmpiutadziɖoɖowo ƒe ƒoƒo ɖekae |
| ICODE SLIX2 / ISO 15693 Ƒomea | ISO/IEC 15693, NFC Forum Ƒomevi 5 ƒe nɔƒe | Vicinity-card, agbalẽdzraɖoƒe, nunɔamesi, dzesidede kple didiƒe-kple-adzɔge dɔwo | Womate ŋu atrɔe kple ISO/IEC 14443 Ƒomevi A xlẽlawo o; ɖo kpe nuxlẽla ƒe ɖoɖowɔɖi kple antenna ƒe lolome dzi |
Dzidzenu geɖe siwo me kadodo mele o wɔa dɔ le 13.56MHz. Nuxlẽla ateŋu ado alɔ ISO/IEC 14443 Ƒomevi A, Ƒomevi B, ISO/IEC 15693, NFC Forum tag ƒomeviwo alo dɔwɔwɔ ƒe ƒuƒoƒo si nye etɔ. Zi geɖe ɖeɖe mesɔ gbɔ be woada asi ɖe nuwɔwɔ ɖekae dzi o.
Gadzraɖoƒewo, fexexe, dziɖuɖu ƒe dzesideŋkɔ kple mɔzɔzɔdɔ siwo ŋu wowɔ ɖoɖo ɖo ate ŋu abia chips siwo ŋu woɖo kpee, safui dodo dedie, adzɔnuwo wɔwɔ si ŋu wodzro, ɖoɖoa ƒe mɔɖeɖe kple dɔbiagbalẽvi dodokpɔ. Mele be woadzra HF inlay si wozãna le mɔ vovovowo nu be edzra ɖo ɖe fexexe ŋu ne womexɔ dzeside si wobia o.
| Parameter | Available Mɔfiame | Production Control |
|---|---|---|
| 2 × 5 Ðoɖowɔɖi | A4-ƒomevi ƒe kpɔɖeŋu kple kaɖi siwo ƒe lolome le sue wu wɔwɔ | Kpe ɖe agbalẽa ƒe didime tututu, kaɖi ƒe gbeɖiɖi kple ŋkɔ ŋɔŋlɔ ƒe dzesiwo dzi |
| 3 × 7 / 3 × 8 ƒe lolome | Dɔwɔƒewo ƒe smart-card ƒe agbalẽvi ƒe ɖoɖo siwo bɔ | Match lamination gbadzɛwo, punching dɔwɔnu, tata nu veviwo kple collation mɔfiame |
| 4 × 8 / 4 × 10 / 5 × 5 ƒe lolome | Dɔwɔwɔ ƒe ɖoɖo siwo de ŋgɔ wu kple dɔwɔnu siwo ku ɖe asisiwo koŋ ŋu | Kpɔ RF ƒe kadodo si le antenna siwo te ɖe wo nɔewo ŋu kple agbalẽ ƒe tɔtrɔ dome dzi |
| Ðoɖo si Wowɔ Ðe Ðoɖo Nu | Kpekpeɖeŋugbalẽvi ƒe didime siwo wowɔ ɖe ɖoɖo nu, safuiwo, kaɖi suewo alo punching ƒe nɔnɔme tɔxɛwo | Na CAD ƒe nɔnɔmetata, nusi wowɔ vɔ ƒe nɔnɔmetata, chip ƒe nɔƒe, antenna ƒe teƒe kple lãɖeɖe ƒe mɔɖeɖe |
| Prelam ƒe Titrime | Fifia ƒe axadzinufiame si ade 0.45 ± 0.02mm; xɔtuɖoɖo siwo wowɔ ɖe ɖoɖo nu siwo li | Ðo kpe mamã dedie, teƒe ƒe tɔtrɔ, chip-bump zone kple final-card stack akɔntabubu dzi |
| Nu | PVC ɣi, PVC si me kɔ kple dɔa koŋ ƒe PETG alo PC-si sɔ ƒe xɔtuɖoɖowo | Da asi ɖe shrinkage, kadodo, dzoxɔxɔ, RF tuning kple nuwuwu-kaɖi ƒe anyinɔnɔ dzi |
Zi geɖe la, wowɔa CR80/ID-1 kaɖi si bɔ la wògogo 0.76mm, gake mɔɖeɖe ɖe eŋu tututu nɔ te ɖe kaɖia kple dɔwɔnuwo ƒe nɔnɔme dzi. Ele be woatsɔ nu vevi siwo wota, ŋgɔgbe kple megbe ƒe nutsyɔnu, nusiwo wotsɔna léa nu ɖe nu ŋu kple nutoa me ƒe chip ƒe titrime ade akɔntabubua me.
Agbalẽa ate ŋu anɔ gauge tolerance le mama dedie nu me esime chip zone la le kpekpem wu le nutoa me. Ele be do ƒe nɔnɔme, cushioning, press pressure kple layer tiatia naxe mɔ ɖe bumps siwo woate ŋu akpɔ, bonding gbɔdzɔgbɔdzɔ kple chip ƒe gbegblẽ nu.
| Antenna Factor | Ŋusẽkpɔɖeamedzi ɖe Kpekpeɖeŋugbalẽvia dzi | hiã Validation |
|---|---|---|
| Coil ƒe Geometry | Ekpɔa inductance, coupling nuto kple lãɖeɖe ƒe ʋuʋu si li dzi | Match chip capacitance, card ƒe didime, nuxlẽla kple taɖodzinu nuto |
| Akɔbli Ka ƒe Antenna | Doa alɔ embedded coil designs kple geometry si te ŋu trɔna | Wire ƒe didime, embedding goglome, crossover, kadodo ƒuƒoƒo kple yiyi |
| Aluminium Antenna si woŋlɔ ɖe agbalẽ dzi | Doa alɔ antenna si ƒe nɔnɔme le sesẽm ŋutɔ | Trace kekeme, tsitretsitsi, xɔxlɔ̃ takpɔkpɔ, chip attachment kple lamination nuwɔna |
| Chip ƒe Ŋutete | Trɔa antenna/chip ƒe nutome ƒe ɖiɖi | Trɔ asi le eŋu ne èle chip ƒome alo package trɔm |
| Kpekpeɖeŋugbalẽviwo ƒe Ƒuƒoƒo | Plastik, ink, foil, metalized graphics kple overlays ate ŋu atrɔ coupling eye wòaɖe detune antenna la | Do agbalẽvi si nèwu enu la kpɔ, ke menye prelam ƒuƒlu la ɖeɖeko o |
| Zã Nutoa Me | Ga siwo wotsɔ wɔe, telefonwo, gakotokuwo, kaɖi siwo te ɖe wo ŋu kple tsi ate ŋu akpɔ ŋusẽ ɖe dɔwɔwɔ dzi | Da nuxlẽla si woɖo be, eɖoɖo ƒe nɔnɔme kple zãla ƒe dɔwɔwɔ kpɔ |
Nuxexlẽ ƒe didime nɔ te ɖe chip, antenna ƒe teƒe, nyonyome ƒe akpa, nuxlẽla ƒe ŋusẽ, nuxlẽla ƒe antenna, ɖoɖowɔɖi, kaɖi ƒe mɔfiame, kaɖi mamlɛtɔ ƒe ƒuƒoƒo kple nuto dzi. Ele be nyayɔyɔa nagblɔ dodokpɔ xlẽla kple to/do kpo didime tsɔ wu be wòazã xexeame katã ƒe xexlẽdzesi ɖeka.
Antenna siwo le kaɖi geɖe ƒe agbalẽ dzi hiã dometsotso si sɔ tso ka siwo wotso, do siwo me woŋlɔa ŋkɔ ɖo kple teƒe siwo te ɖe wo ŋu gbɔ. Ele be RF dodokpɔ siwo wowɔna le agbalẽ dzi la nabu akɔnta le kadodo si le antennawo dome hafi woaƒo kaɖiawo ŋu.
| Layer | Dɔwɔwɔ | Safui Dziɖuɖu |
|---|---|---|
| Ŋgɔgbe ƒe Nutsyɔnu | Ekpɔa nɔnɔmetata siwo wota ta eye wònaa keklẽ, matte, frosted alo dedienɔnɔ ƒe nuwuwu | Titrime, kadodo, abrasion kple ame ŋutɔ ƒe nɔnɔme ƒe sɔsɔ |
| Ŋgɔgbe si Wota Nu vevi | Etsɔa nɔnɔmetata siwo woɖo ɖi, nuŋɔŋlɔ, dzesidenu kple dedienɔnɔ ƒe agbalẽtata | Ta ƒe ŋkɔ ŋɔŋlɔ, ink dɔyɔyɔ, shrinkage kple RF-dedie ga ŋusẽkpɔɖeamedziwo |
| H. F. Prelam Inlay ƒe agbalẽ | Chip, antenna, elektrik-ƒuƒoƒo kple plastik-kplu siwo kpena ɖe eŋu le eme | RF tuning, chip ƒe nɔƒe, titrime, alignment, bond kple elektrikŋusẽ ƒe kutsetse |
| Back Printed Core | Edaa asɔ le ŋgɔgbekpa dzi eye wòtsɔa megbekpa dzi nutatawo | Gauge balance, magnetic-stripe ƒe nɔnɔme kple agbalẽtata ƒe nutsyɔnu |
| Megbe ƒe Nutsyɔnu | Ekpɔa nutatawo ta eye ate ŋu anye stripe, signature panel alo security feature | Bonding, flatness, encoding kple anyigba mamlɛtɔ |
Ga gbadzɛ siwo wotsɔ ga wɔe, ink siwo kplɔa nu alo ga ƒokpli siwo te ɖe antenna ŋu ate ŋu aɖe kadodo alo tɔtrɔ ƒe tuning dzi akpɔtɔ. De atsyɔ̃ɖonu mamlɛawo RF dodokpɔwo me eye nàlé nuto siwo me kɔ me ɖe asi le afisi wòhiã le.
Ele be woada asɔ le ŋgɔgbe kple megbe layer gauges, material direction kple print coverage le afisi wòanya wɔ le. Asymmetrical stacks ate ŋu awɔ card curl le dzoxɔxɔ kple fafa vɔ megbe.
Ðo kpe stack si dzi woda asi ɖo dzi: Ŋlɔ nu ɖesiaɖe si wotsɔ blae, nu vevi si wota, nusi wotsɔ blae, adhesive, stripe kple security layer.
Dzra agbalẽawo katã ɖo: Na nuwo nali ke le nuto si me wowɔa wo le me eye nàna woanɔ dzadzɛ, woanɔ gbadzaa eye woaƒu.
Kpɔ alesi woɖoe ɖa: Tsɔ agbalẽvi ƒe mɔfiame, kaɖi ƒe gbeɖiɖi, chip ƒe nɔƒe, antenna ƒe nɔƒe, nutata kple punching dzesiwo sɔ kple wo nɔewo.
Tu lamination ƒe tsatsam ɖo: Ðo dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe, agbalẽvi ƒe nuwuwu, asiɖeɖe le agbalẽ ŋu kple fafa na nusiwo sɔ pɛpɛpɛ ƒe ƒuƒoƒo.
Takpɔ chip zone ta: Kpɔ teƒea ƒe nyaƒoɖeamenu dzi eye nàƒo asa na nu sesẽwo, plate ƒe gbagbãƒewo alo nusiwo ƒe sisi fũu akpa ƒo xlã IC.
Fafa le nyaƒoɖeamenu si dzi wokpɔ ŋusẽ ɖo me: Fafa kpɔa ŋusẽ ɖe gbadzaƒe, layer adhesion, chip stress kple dimensional stability dzi.
Dodokpɔ hafi nàƒoe: Kpɔ elektrikŋusẽ ƒe dɔwɔwɔ le agbalẽa ƒe ɖoƒe, eƒe dzedzeme, eƒe titrime, eƒe kadodo kple eƒe ŋkɔ ŋɔŋlɔ ɖa.
Do kaɖi siwo wowu enu kpɔ: Punch, personalize eye nàɖo kpe RF ƒe dɔwɔwɔ, didime, bending kple dɔwɔwɔ ƒe ɖekawɔwɔ dzi.
| Lamination Afɔku | Ate ŋu atso | Ðɔɖɔɖo Mɔfiame |
|---|---|---|
| Chip ƒe Dodokpɔ | Dzoxɔxɔ si gbɔ eme, teƒea ƒe nyaƒoɖeamenu, elektrikŋusẽ ƒe gbegblẽ alo chip ƒe kadodo si gbɔdzɔ | To chip package ƒe seɖoƒewo, dɔwɔwɔ ƒe nyaƒoɖeamenu, ESD dziɖuɖuwo kple kadodo ƒe nyonyome me |
| Ʋu Antenna ƒe Nutome Gã | Conductor gbagbã, ƒunukpeƒe gbegblẽ, lãɖeɖe ƒe gbegblẽ alo keke si gbɔ eme | Kpɔ ŋgɔyiyi, conductor mɔ, punching clearance kple mɔ̃ ƒe nuteɖeamedzi |
| Nuxexlẽ ƒe Agbɔsɔsɔme Gbɔdzɔgbɔdzɔ | Detuning, conductor ƒe bu, nuxlẽla ƒe masɔmasɔ, metalized artwork alo card-stack ƒe tɔtrɔ | Dzidze resonance eye nàgbugbɔ aɖɔe ɖo to kaɖi kple taɖodzinu xlẽla si nèwu enu la zazã me |
| Chip Bump si Wokpɔna | Fexexe si mesɔ gbɔ o, module ƒe titrime si gbɔ eme alo nyaƒoɖeamenu si mesɔ o | Na nutoa me dowo, layer gauges, cushioning kple pressing nɔnɔmewo nanyo ɖe edzi |
| Delamination (Dzidzedzekpɔkpɔ). | Ðiƒoƒo, nusiwo mewɔ ɖeka o, dzoxɔxɔ sue alo fafa si mesɔ o | To nusiwo wotsɔ wɔe ƒe sɔsɔ, dzadzɛnyenye, tsatsam kple lãgbalẽ ƒe dɔwɔwɔ me |
| Agbalẽvi alo Kpekpeɖeŋugbalẽvi ƒe Warpage | Stack si meda sɔ o, dzoxɔxɔ si gbɔ eme, nyaƒoɖeamenu si mesɔ o alo fafa kabakaba si dzi womeɖu o | Da sɔ le ƒuƒoƒoawo me eye nàna dzoxɔxɔ, agbalẽvi ƒe gbadzaƒe kple fafa nanyo ɖe edzi |
| Dzroƒe Nu | Kafukafu B2B Dzikpɔkpɔ |
|---|---|
| Chip ƒe Dzesidede Ame | Kpɔ egbɔ be ewɔla, akpa ƒe xexlẽdzesi tututu, ŋkuɖodzinu, UID tiatia, ɖoɖowɔɖi kple lot traceability |
| Elektrikŋusẽ ƒe Dɔwɔwɔ | Xlẽ chip UID, ŋkuɖodzinu alo sedede si woɖe fia si woɖo ɖe kaɖi ƒe nɔƒe ɖesiaɖe le ŋkuléleɖenuŋu ƒe ɖoɖoa nu |
| Antenna ƒe Yiyi | De dzesi nutomeʋuʋu siwo le ʋuʋu ɖi, ʋuƒo kpuiwo, ƒunukpeƒe siwo gbɔdzɔ, elektrikŋusẽnamɔ̃ ƒe gbɔdzɔgbɔdzɔwo kple crossover siwo gblẽ |
| Resonance / RF Dɔwɔwɔ | Dzidze RF parameter alo dɔwɔwɔ ƒe nuxexlẽ ƒe didime si dzi wolɔ̃ ɖo to dodokpɔ dɔwɔnu kple fixture si woɖe fia zazã me |
| Chip kple Antenna ƒe Nɔnɔme | Kpɔ teƒe si wòle le CAD, kaɖi ƒe nɔnɔmetata, punch clearance kple antenna siwo te ɖe eŋu me |
| Agbalẽvi ƒe Dzidzemewo | Didime, kekeme, dzogoe ene me, kaɖi ƒe kɔkɔme, do siwo me woŋlɔ ŋkɔ ɖo kple nugbɔ ƒe nyonyome |
| Eƒe Titrime Kple Eƒe Gãnyenye | Mamã dedie ƒe titrime, nutoa me ƒe chip-zone ƒe titrime, curl, bow kple point-to-point ƒe tɔtrɔ |
| Nukpɔkpɔ ƒe Dzodzro | Ðiƒoƒo, kuɖɔ, flitete, teƒe yibɔwo, conductor ƒe ɖeɖefia, ʋuʋudedi kple layer ƒe gbagbã |
| Kpekpeɖeŋugbalẽvi ƒe Dodokpɔ si Wu enu | RF dɔwɔwɔ, didime, titrime, bending, torsion, dzoxɔxɔ, fafa, peel kple nuxlẽla ƒe sɔsɔ |
| Nusiwo woate ŋu akpɔ | Chip lot, antenna lot, PVC lot, ewɔwɔ ŋkeke, ɖoɖo, dodokpɔ ɖoɖowɔɖi, agbalẽvi xexlẽdzesi kple packing nuŋlɔɖi |
Dzodzro blibo ateŋu afia elektrik nuxexlẽ dodokpɔ le teƒe ɖesiaɖe, esime zi geɖe la, wowɔa dodokpɔ siwo nye dimensional, peel kple destructive dodokpɔwo ƒe kpɔɖeŋu. Ele be nuƒle ƒe nɔnɔmetata naɖe dodokpɔnuwo, fixture, lɔlɔ̃ ɖe edzi ƒe dzidzenuwo, kpɔɖeŋuɖoɖo kple nyatakaka me.
Prelam ateŋu ato elektrik dodokpɔ me eye wòado kpo nu kokoko le dzoxɔxɔ si gbɔ eme, nyaƒoɖeamenu, atamkaka alo ame ŋutɔ ƒe tɔtrɔ megbe. Ele be B2B ƒe dzeside nalɔ incoming-inlay kple finished-card ƒe dɔwɔwɔ siaa ɖe eme.
| Dɔwɔwɔ | Chip / Protocol Mɔfiame | Vevietɔ Validation |
|---|---|---|
| Dɔwɔla Kple Mɔɖeɖe ƒe Kpekpeɖeŋugbalẽviwo | Legacy Type A, MIFARE Plus alo DESFire le mɔɖeɖe ƒe ɖoɖo si woda ɖe eme nu | Nuxlẽla ƒe sɔsɔ, safuiwo dzikpɔkpɔ, ŋkɔ ŋɔŋlɔ kple gbesiagbe bɔbɔ |
| Amedzrodzeƒea ƒe Safuigbalẽviwo | Chip si amedzrodzeƒe-lock-nuƒolanɔƒea hiã | Lock encoder, amedzro-dzikpɔkpɔ ɖoɖo, kaɖi ƒe titrime kple fafa ƒe ɖeɖefia |
| Ʋuɖoɖo Kple Sukuxɔ me Kpekpeɖeŋugbalẽviwo | Dedie multi-application chip abe DESFire le afisi system architecture biae le | Asitsatsa ƒe duƒuƒu, dedienɔnɔ, nuxlẽla ƒe nunɔamesiwo, ame ŋutɔ ƒe nɔnɔme kple agbenɔƒe |
| Hamevinyenye Kple Nuteƒewɔwɔ ƒe Gbalẽviwo | Ŋlɔ A memory chip, NTAG alo secure application chip le ɖoɖowɔɖia ƒe ɖoɖo nu | Nuxlẽla alo telefon ƒe sɔsɔ, nyatakakadzraɖoƒe, adzamenyawo kple eŋudɔwɔwɔ enuenu |
| NFC ƒe Asitsatsa kple Asitsatsa ƒe Kpekpeɖeŋugbalẽviwo | NTAG alo NFC Forum ƒe chip bubu si sɔ | NDEF ƒe ŋutete, telefon ƒe sɔsɔ, URL ƒe dedienɔnɔ kple scan ƒe nɔƒe |
| Agbalẽdzraɖoƒe, Nuwo Kple Nutoa Me Kpekpeɖeŋugbalẽviwo | ISO/IEC 15693 / ICODE-ƒomevi ƒe egbɔkpɔnu | Nuxlẽla ƒe ɖoɖowɔɖi, antenna ƒe lolome, taɖodzinu ƒe didime, anti-collision kple EAS ƒe nudidiwo |
| Dzesidede Ame Ŋu Kple Fexexe ƒe Dɔwɔnawo | Chip dedie si ŋu woɖo kpee kple dɔwɔwɔ ƒe xɔtuɖaŋu si dzi woda asi ɖo | Ðaseɖigbalẽ, safui dodo, nuzazãwo ƒe kɔsɔkɔsɔ si wodzro kple ɖoɖo tɔxɛ ƒe mɔɖeɖe |
HF RFID Inlay Dɔwɔwɔwo na Smart Card Dɔwɔɖoɖowo
| Nyatakaka / Dedienɔnɔ ƒe Nu | B2B Nudidi |
|---|---|
| UID | Kpe ɖe UID ƒe didime, ID ƒe nuwɔna si woɖo ɖi alo esi wowɔ le vome, nyatakakadzraɖoƒe ƒe nɔnɔme kple nuxlẽla ƒe kpekpeɖeŋu dzi |
| Ŋkuɖodzinyawo ƒe Encoding | Ðe nyatakakawo ƒe ɖoɖo, akpawo/faɛlwo/axawo, NDEF nuŋlɔɖi, lock bits kple kpeɖodzinana gɔme |
| Nyateƒetoto ƒe Safuiwo | Ðe nu vevi siwo nye nutɔnyenye, atike dodo ƒe ɖoɖo, ʋuɖoɖo takpɔkpɔ, vovototodedeameme kple agbalẽdzikpɔkpɔ ƒe mɔ gɔme |
| Password / Mɔɖeɖe ƒe Ðoɖowɔɖi | Tsɔ nyagbegbɔgblɔ, mɔɖeɖe ƒe bits, xexlẽdzesiwo, gbãtɔ ƒe dodokpɔ kple lock-state dodokpɔ le afisi wodo alɔe le |
| Nyatakaka Siwo Trɔna Si Wota | Tsɔ xexlẽdzesi si wota, barcode alo QR code do ƒome kple chip data to dzadzraɖo si dzi wokpɔna me |
| Kpekpeɖeŋugbalẽvi Siwo Wogbe | Ma kaɖi siwo me safui gbagbewo, dzesidenu alo nyatakaka siwo woŋlɔ ɖe kɔpi me le la ɖe vovo, xlẽ wo eye nàtsrɔ̃ wo dedie |
Nuɖoanyi si naa mɔnukpɔkpɔ ame be wòage ɖe eme tso dzesidenu si woate ŋu axlẽ le dutoƒo ko dzi ate ŋu anye esi woate ŋu awɔ kɔpi alo awɔ eƒe kpɔɖeŋu bɔbɔe. Ele be dɔ siwo ku ɖe dedienɔnɔ ŋu nazã chip kple megbenyawo ƒe xɔtuɖaŋu si doa alɔ nya ɣaɣlawo ƒe kpeɖodzi si sɔ.
Chip si le dedie nana melɔa dɔwɔnua ƒe ɖoɖowɔwɔ alo safuiwo dzi kpɔkpɔ ɖe eme le eɖokui si o. Ðe amesi wɔa safuiwo, dzraa wo ɖo, tsɔa wo dea agba me eye woɖoa kpe wo dzi, kple nenye be ehiã be woawɔ dedienɔnɔ-ame ŋutɔ ƒe nɔnɔme si wodzro.
Hybrid smart card ateŋu aƒo HF nu ƒu kple LF, UHF, contact chip alo HF dɔwɔnu bubu. Xɔtuɖoɖo siawo hiã teƒe geɖe wu, antennawo mama nyuie, nutoa me ƒe titrime dzi kpɔkpɔ bubuwo kple lamination kple dodokpɔ ƒe ɖoɖo tɔxɛ aɖe.
| Hybrid Structure | Zazã Nudzɔdzɔ | Mɔ̃ɖaŋudɔwɔwɔ ƒe Afɔku |
|---|---|---|
| LF + HF ƒe dɔwɔwɔ | Ʋuʋu tso domenyinu tete ɖe HF smart-card ɖoɖowo gbɔ | Antenna ƒe teƒe, wo nɔewo ƒe kadodo, kaɖi ƒe titrime kple nuxlẽla eve dodokpɔ |
| HF + UHF ƒe dɔwɔwɔ | Dzesidede ame si le didiƒe kpui aɖe kpe ɖe kplɔkplɔ si didi wu ŋu | Antenna ƒe ɖoɖo vovovowo, nusiwo ƒe ŋusẽkpɔɖeamedzi kple UHF ƒe seselelãme si te ɖe ŋutilã alo ga ŋu |
| HF Chips eve | Dɔdamɔnu siwo ɖe vovo alo domenyiŋusẽfianu siwo le wo ɖokui si | Nuxlẽla ƒe tiatia, antenna ƒe kadodo, nyatakakawo ƒe amesinɔnɔ kple kaɖi ƒe ɖoɖo ƒe mɔxenuwo |
| Kadodo + Kadodo aɖeke manɔmee | Dual-interface dedie dzesideŋkɔ, telefonkadodo alo fexexe ƒe xɔtuɖaŋu | Module do, antenna kadodo, lamination, ɖaseɖigbalẽ kple ame ŋutɔ ƒe tɔtrɔ |
Mele be woaɖɔ HF prelam si wozãna zi ɖeka si wozãna ɖaa be edoa alɔ LF alo UHF le eɖokui si o. Multi-frequency xɔtuɖoɖowo hiã woawo ŋutɔ ƒe nutata, chip xexlẽdzesi, RF dodokpɔwo, titrime ƒe nɔnɔme kple asi.
Dzra prelam-gbadzɛwo ɖo gbadzaa ɖe nubablɛ siwo wotu nu ɖo, siwo le dzadzɛ eye wole ƒuƒuie me le afisi ɣe ƒe keklẽ kple dzoxɔxɔ tẽ nagage ɖo o.
Zã ʋuƒo sesẽwo, nusiwo wotsɔ dea wo nɔewo me kple kakɛ siwo wokpɔ ta na be woaxe mɔ ɖe ƒoƒo, ƒoƒo kple chip-zone ƒe nyaƒoɖeamenu nu.
Ƒo asa na elektrikŋusẽ ƒe dodo sesẽ eye nàzã ESD ƒe dɔwɔwɔ ƒe mɔ̃ siwo sɔ le afisi wòhiã le.
Mègatsɔ agba kpekpe siwo mesɔ o da ɖe agbalẽa ƒe ƒuƒoƒoa dzi alo nàɖe mɔ pallet la natsi dzi o.
Nɔnɔme nusiwo le lamination xɔa me hafi woawɔ dɔ ne nudzraɖoƒe kple ewɔwɔ ƒe nɔnɔmewo to vovo.
De dzesi pack ɖesiaɖe to chip model, antenna ƒe nɔnɔme, ɖoɖo, titrime, batch kple inspection status nu.
Zã nudzraɖoƒe gbãtɔ, gbãtɔ si dona le eme eye nàgbugbɔ ado nusiwo wotsɔ dzrae kpɔ le wo dzadzraɖo alo wo tsɔtsɔ yi teƒe bubuwo ɣeyiɣi didi megbe.
Takpɔkpɔ Flat Packing na HF RFID Prelam Agbalẽviwo
Prelam wɔwɔ si ŋu kakaɖedzi le bia be woakpɔ antenna embedding alo etching dzi, chip attachment, sheet registration, plastic lamination, elektrik dodokpɔ, didime me dzodzro, dzadzɛ handling kple batch traceability. Ele be chip, antenna tata kple RF dodokpɔ mɔnu si dzi woda asi ɖo la nanɔ teƒe ɖeka na nudɔdɔ gbugbɔgawɔ negbe ɖe wolɔ̃ ɖe tɔtrɔ si dzi wokpɔ ŋusẽ ɖo dzi hafi.
RFID Inlay Dɔwɔɖoɖo kple Mɔ̃ɖaŋununya ƒe Ƒuƒoƒo
Prelam Inlay Nuwɔwɔ ƒe Dɔwɔƒe
Antenna kple Inlay Dɔwɔwɔ Dzikpɔkpɔ
Elektrikŋusẽ Kple Agbɔsɔsɔme Ŋuti Dzodzro
Chip tiatia si wotu ɖe dɔwɔwɔ dzi: Woate ŋu ama domenyinu ƒe mɔɖeɖe, NFC, dɔwɔnu geɖe siwo le dedie kple ISO 15693 dɔwo dome to ɖoɖowɔɖi kple dedienɔnɔ ƒe hiahiã nu.
Antenna ƒe mɔ̃ɖaŋununya si wowɔ ɖe ɖoɖo nu: Woate ŋu ato coil geometry, conductor, chip capacitance, card outline kple target reader me ɖekae.
Agbalẽviawo ƒe ɖoɖo si te ŋu trɔna: Kaɖi geɖe ƒe ɖoɖo siwo wowɔna ɖaa kple kaɖi ƒe gbeɖiɖi siwo asisiwo koŋ le la li.
Kpekpeɖeŋugbalẽvi-nuawo ƒe ƒoƒo ɖekae: Woate ŋu awɔ ɖeka kple PVC prelam kple nu vevi siwo wota, nusiwo wotsɔ tsyɔ wo dzi, magnet-kaɖiwo kple kaɖi ƒe xɔtuɖoɖo siwo wowu enu.
Dzeside ƒe kpekpeɖeŋu: Kpɔɖeŋuwo, lamination dodokpɔwo, RF dodokpɔ, titrime dodokpɔ kple finished-card verification ɖea dɔa ƒe afɔku dzi kpɔtɔna.
Factory-direct B2B supply: Esɔ na smart-card dɔwɔƒewo, agbalẽtamɔ̃wo, tɔtrɔlawo, ɖoɖo integrators, issuers, importers kple mamalawo.
Dɔwɔwɔ, nuxlẽla ƒe dzesi/kpɔɖeŋu, ɖoɖowɔɖi kple kɔmpiutadziɖoɖo ƒe mɔ̃ si woda ɖe eme.
Chip wɔla kple akpa ƒe xexlẽdzesi, ŋkuɖodzinu, UID kple dedienɔnɔ ƒe nudidiwo pɛpɛpɛ.
Agbalẽviawo ƒe ɖoɖo, woƒe didime bliboa, kaɖi ƒe gbeɖiɖi, ŋkɔ ŋɔŋlɔ ƒe dzesiwo kple agbɔsɔsɔ.
Kpekpeɖeŋugbalẽvi ƒe lolome, antenna ƒe teƒe si me kɔ, chip ƒe nɔƒe kple punching ƒe nɔnɔmetata.
Prelam nu, amadede, ŋkɔ me titrime kple mɔɖeɖe ɖe nu ŋu.
Antenna mɔ̃ɖaŋununya, taɖodzinu ƒe ɖiɖi alo dɔwɔwɔ ƒe nuxexlẽ ƒe didime dodokpɔ.
Kpekpeɖeŋugbalẽvi mamlɛtɔ ƒe ƒuƒoƒo, nu vevi siwo wota, nutsyɔnu, ga tata, fli alo asidede agbalẽ te.
Lamination press, dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe, fafa kple agbalẽvi didimewo.
Elektrik dodokpɔ, RF dodokpɔ, didime me dzodzro kple lɔlɔ̃ ɖe edzi ƒe dzidzenuwo.
Encoding, key injection, UID list, nyatakaka siwo trɔna alo nyatakakadzraɖoƒe ƒe sɔsɔ.
Kpɔɖeŋu agbɔsɔsɔme, ƒe sia ƒe ƒe nyagblɔɖi, nudɔdɔ gbugbɔgawɔ ƒe ɖoɖowɔɖi kple tɔtrɔ-dzikpɔkpɔ ƒe nudidiwo.
Nubablɛ, ŋkuléleɖenuŋu ƒe nuŋlɔɖiwo, melidzeƒe si woɖo tae kple ŋkeke si wobia be woatsɔe aɖo ɖe amewo.
Dzro Wò HF RFID Inlay Dɔwɔɖoɖoa me
Enye kaɖi-wɔwɔ ƒe nu vevi agbalẽvi si me 13.56MHz ƒe chip kple antenna le le plastik-kpluwo me. Wotsɔa nu vevi siwo wota kple nusiwo wotsɔ tsyɔa nu dzi la ƒoa xlãe be wòawɔ agbalẽvi siwo wometsɔ ka ɖe wo nɔewo dzi o siwo wowɔ vɔ.
Ao, prelam nye domedome dɔwɔwɔ ƒe ƒuƒoƒo. Kpekpeɖeŋugbalẽvi siwo wowɔ vɔ la hiã be woata agbalẽ bubuwo, woatsɔ wo atsyɔ wo dzi, woaƒo wo nu ƒu, woafa wo, woaƒo wo eye woatrɔ asi le wo ŋu alo awɔ wo ŋudɔ le wo ɖokui si.
Dɔwo ateŋu azã ISO/IEC 14443 Ƒomevi A, Ƒomevi B, ISO/IEC 15693 alo NFC Forum ƒe chip siwo sɔ. Ðoɖo si tututu woawɔ la nɔ te ɖe IC kple nuxlẽla ƒe ɖoɖo si nètia dzi.
Ao, wonye adzɔnuwo ƒe ƒome vovovo siwo ƒe ɖoɖowɔɖi, ŋkuɖodzinu, sededewo, dedienɔnɔ kple dɔwɔɖoɖowo to vovo. Ðo kpe chip kple nuxlẽla si sɔ pɛpɛpɛ dzi hafi nàbia.
Woate ŋu adzro tiatia siwo sɔ kple 1K ƒe domenyinu mawo me. Na chip ƒe nudidi tututu kple nuxlẽla ƒe kpɔɖeŋu, elabena ele be woaɖo kpe ewɔla, UID, ŋkuɖodzinu kple ɖaseɖiɖi ƒe ɖekawɔwɔ dzi.
Ekpɔtɔ sɔ na domenyinu ƒe ɖoɖo siwo woda ɖe eme, gake ele be egbegbe dedienɔnɔdɔwo nada fifia ƒe mɔnu bubuwo abe MIFARE DESFire alo MIFARE Plus ene kpɔ le ɖoɖoa ƒe xɔtuɖoɖo nu.
NTAG 213, 215 alo 216 kple NFC Forum ƒe chip bubu siwo sɔ nye tiatia siwo bɔ. Tia kpɔɖeŋua tso NDEF ŋkuɖodzinu si hiã, telefon ƒe wɔwɔ ɖekae kple dedienɔnɔ ƒe nɔnɔmewo me.
Dɔwɔwɔ geɖe ƒe chip si le dedie abe MIFARE DESFire ene ateŋu asɔ, gake ele be woaɖo kpe nuxlẽla ƒe kpekpeɖeŋu, safuiwo dzikpɔkpɔ, ɖaseɖigbalẽ, dɔwɔwɔ ƒe faɛlwo kple kɔmpiuta dɔwɔɖoɖowo dzi.
Wozãa ISO/IEC 15693 na nuto-kaɖi ƒe dɔwɔwɔ siwo me nuxlẽla, antenna ƒe lolome kple taɖodzinu ƒe kadodo ƒe didime to vovo tso tete-kaɖi ƒe ɖoɖo siwo wotu ɖe ISO/IEC 14443 dzi gbɔ.
Tiatia siwo bɔ dometɔ aɖewoe nye 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 kple 4 × 10. Woate ŋu awɔ ɖoɖo siwo wowɔ ɖe ɖoɖo nu tso nuƒlela ƒe lamination kple punching ƒe nɔnɔmetata me.
Fifia ƒe adzɔnuwo ƒe axa ƒo nu tso abe 0.45 ± 0.02mm ene na HF xɔtuɖoɖo tiatia aɖewo. Titrime mamlɛtɔ nɔ te ɖe chip, antenna, nu, card stack kple nutoa me chip-zone ƒe nudidiwo dzi.
Ɛ̃. Na taɖodzinua wu-kaɖi ƒe titrime, nutsyɔnu kple tata-nu vevi gauges, chip package kple lamination ɖoɖo ale be woate ŋu abu stack bliboa.
Ɛ̃. Woateŋu ato antenna geometry vɛ ƒo xlã chip ƒe capacitance, card ƒe lolome, nuxlẽla, taɖodzinu ƒe dɔwɔwɔ, chip ƒe nɔƒe kple lãɖeɖe ƒe clearances.
Woate ŋu adzro akɔbli-ka kple etched-aluminum tiatia siwo wotsɔ de eme la me. Xɔtutu nyuitɔ nɔ te ɖe gbeɖiɖi ƒe sesẽme, tsitretsitsi, titrime, kadodo, kaɖi ƒe nɔnɔme kple RF taɖodzinu dzi.
Xexeame katã ƒe didime aɖeke meli o. Enɔ te ɖe chip, antenna, nuxlẽla, kaɖi ƒe ƒuƒoƒo, mɔfiame kple nuto dzi. Ðe dodokpɔ xlẽla kple dɔwɔwɔ ƒe didime suetɔ gɔme.
Woate ŋu azãe le RF dodokpɔ vɔ megbe. Ga gbadzɛ gã alo nuŋlɔtsi si kplɔa nu le si te ɖe antenna la ŋu ate ŋu aɖe kadodo si me kadodo mele o la ɖa alo akpɔ eta.
Woate ŋu ato nu bubuwo ƒe xɔtuɖoɖowo me, gake ele be woaɖo kpe shrinkage, bonding, lamination temperature, RF tuning kple finished-card durability dzi ɖe vovo.
Zi geɖe la, wotsɔa prelam la naa abe dɔwɔwɔ ƒe nuto ƒuƒlu ene. Zi geɖe la, wozãa agbalẽtata ɖe agbalẽ vevi vovovowo dzi, togbɔ be woate ŋu adzro xɔtuɖoɖo siwo ku ɖe dɔa koŋ ŋu me hã.
Mele be woata xexeame katã ƒe nɔnɔme aɖeke na xɔtuɖoɖo ɖesiaɖe o. Tu dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe kple fafa ƒo xlã PVC, nutsyɔnu, nuŋlɔtsi, chip kple antenna wɔwɔ pɛpɛpɛ.
Zã chip ƒe babla siwo sɔ, teƒea ƒe titrime si dzi wokpɔna, agbalẽ siwo le dzadzɛ, nyaƒoɖeamenu si da sɔ, dzoxɔxɔ ƒe tsatsam si dzi woda asi ɖo kple elektrik dodokpɔ do ŋgɔ na lamination kple emegbe.
Woate ŋu agblɔ elektrikŋusẽ dodokpɔ bliboe. Ele be nuƒle ƒe nubabla la naɖe sedede siwo ŋu woléa ŋku ɖo le teƒe ɖesiaɖe kple dodokpɔ siwo gblẽa nu alo didime ƒe dodokpɔ siwo zãa kpɔɖeŋuwo xɔxɔ la me.
Woateŋu aƒo nu tso UID xexlẽ, ŋkuɖodzinu ƒe nuŋɔŋlɔ, NDEF nuŋɔŋlɔ alo dɔwɔwɔ ƒe ame ŋutɔ ƒe tɔtrɔ ŋu. Dedienɔnɔ-safui subɔsubɔdɔwo hiã be woawɔ ɖoɖo ɖe vovo si dzi wokpɔna.
Woate ŋu ato atsyã siwo wotsɔ tsakae vɛ abe nusiwo to vovo ene. Wobia antenna ƒe ɖoɖo tɔxɛwo, ɖoɖowɔwɔ ɖe eƒe titrime ŋu, nuxlẽla ƒe dodokpɔwo kple asixɔxɔ.
Ɛ̃. Dɔwɔwɔ si wodi wue nye be woado prelam la kpɔ, awɔ laminate na kaɖi ƒe ƒuƒoƒo bliboa, aƒo kaɖiwo eye woaɖo kpe RF, mɔ̃ɖaŋu kple ame ŋutɔ ƒe dɔwɔwɔ dzi.
MOQ nɔ te ɖe chip ƒe anyinɔnɔ, antenna dɔwɔnu siwo wowɔ ɖe ɖoɖo nu, ɖoɖo, nusi wotsɔ wɔe, titrime, dodokpɔ ƒe ɖoɖowɔɖi, encoding kple nenye be woate ŋu azã ɖoɖowɔɖi si dzi woda asi ɖo si sɔ dzi.
Na chip, nuxlẽla, ɖoɖowɔɖi, ɖoɖo, agbalẽ ƒe lolome, kaɖi ƒe nɔnɔmetata, titrime, antenna ƒe taɖodzinu, kaɖi mamlɛtɔ ƒe ƒuƒoƒo, dodokpɔwo, agbɔsɔsɔ, babla kple teƒe si woɖo tae.
Te ɖe Wallis Plastic ŋu hena 13.56MHz HF RFID PVC prelam inlay agbalẽ siwo wowɔ ɖe ɖoɖo nu hena mɔɖeɖe, ID, amedzrodzeƒe, hamevinyenye, ʋuɖoɖo, NFC kple smart-card wɔwɔ. Míaƒe ƒuƒoƒoa doa alɔ chip tiatia, antenna ƒe nɔnɔme, agbalẽ ƒe ɖoɖo, RF tuning, lamination dodokpɔwo, elektrik dodokpɔ, encoding, nyonyome ƒe nɔnɔmewo kple dɔwɔƒe- tẽ B2B nana.
