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Pampiri ea maiketsetso ea Teslin® bakeng sa RFID, phihlello, hotele, botho le likarete tse sireletsehileng tsa ID. Boemo ba tloaelo, botenya, boholo ba lakane le ho itšeha, ka lisampole tsa khatiso, lamination le tlhahlobo ea likarete tsa OEM lefatšeng ka bophara.
thepa ea karete
WALLIS
| Boitsebiso: | |
|---|---|
| Boholo: | |
| Mofuta oa Khatiso: | |
| Bongata: | |
Wallis e fana ka pampiri ea maiketsetso ea Teslin® bakeng sa ho etsa likarete tsa RFID , mangolo-tsoibila a sireletsehileng, likarete tsa phihlello, likarete tsa linotlolo tsa hotele, likarete tsa litho, likarete tse bohlale le lihlahisoa tsa likarete tse nang le laminated. Sebopeho sa eona sa microporous se tšehetsa khatiso ea litlhaloso tse phahameng, anchorage e matla ea laminate le ho pota-pota li-chips tse kentsoeng le li-antenna.
Bakeng sa baetsi ba likarete tsa B2B, bahlahisi ba bopaki, li-converter tsa RFID le lik'hamphani tsa khatiso, ho lokela ho khethoa sehlopha se nepahetseng sa Teslin substrate ho latela mokhoa oa khatiso, tsamaiso ea laminate, kaho ea karete e phethiloeng le litlhoko tsa tšebeliso ea ho qetela. Wallis e ts'ehetsa boholo ba maqephe a tloaelo, khetho ea botenya, mangolo a lisampole, ho seha le ho paka kantle ho naha.
Boitsebiso ba thepa: TESLIN® ke letšoao la khoebo le ngolisitsoeng la PPG Industries. Bareki ba lokela ho netefatsa hore na khotheishene e akaretsa karoloana ea 'nete ea PPG TESLIN®, boemo bo khethehileng ba sehlahisoa le litokomane tse tšehetsang. 'Teslin paper' ha ea lokela ho sebelisoa e le tlhaloso e akaretsang bakeng sa lipampiri tsa maiketsetso tse sa amaneng.
| Parameter | B2B Specification Tataiso |
|---|---|
| Sehlahisoa | Microporous polyolefin-based synthetic card substrate; PPG TESLIN® ea 'nete e tla netefatsoa khotheishene le sampole e amohetsoeng. |
| Boemo ba Leqephe le Tloaelehileng | A4 210 × 297mm ho tloha ho tlhaloso ea hona joale ea sehlahisoa; boholo ba leqephe la tlhahiso ea likarete bo ka hlahlojoa. |
| Botenya | Leqephe la hajoale la Wallis: 100–300 microns. Botenya ba ho qetela bo fumanehang bo ipapisitse le sehlopha se khethiloeng sa Teslin, sebopeho sa stock le tlhoko ea phetoho. |
| Bokaholimo | White matte microporous holim'a metsi; maemo a tloaelehileng, a tsitsitseng ka mocheso, a koahetsoeng ka inkjet, likhatiso tsa digital kapa tšireletso li ka hlalosoa ho latela morero. |
| Khatiso | Offset, screen, flexographic, gravure, thermal transfer, laser, inkjet le lisebelisoa tse khethiloeng tsa digital, tse itšetlehileng ka grade le litlhoko tsa thepa. |
| Lamination | E lumellana le platen kapa roll lamination ha e tsamaisana le laminate e amohelehang, mocheso, khatello, nako ea ho lula le potoloho ea ho pholile. |
| Mehaho ea likarete | Lera la karete e hatisitsoeng, substrate e bohareng kapa cushioning layer e kopantsoeng le PVC, PET, PETG, PC, li-overlays, li-inlay tsa RFID, likhoele tsa makenete kapa likarolo tse ling tse amohetsoeng. |
| Boikemisetso | Litekanyo tsa maqephe, botenya / mophato, ho itšeha, tsela ea khatiso, ho palama ha laminate, ho paka, lileibole le litlhoko tsa tlhahlobo. |
| Litokomane tsa boleng | Boitsebiso ba thepa, lintlha tsa lotho, leqephe la lintlha, tlaleho ea tlhahlobo le litokomane tse ling tse ipapisitseng le sebaka se netefalitsoeng sa phepelo. |
Teslin substrate ha se pampiri e tloaelehileng ea cellulose. Ke lera le le leng, microporous, e tletseng haholo polyolefin-based synthetic material. Matrix a eona a porous a amohela li-inks, toner, li-adhesives, li-coatings le laminate ka har'a mohaho ho e-na le ho li siea feela sebakeng se boreleli.
Sebopeho sena se ka ntlafatsa print anchorage, laminate bonding le ho hanyetsa ho tlosoa ha data. E ka fana ka cushioning ho pota-potile lichifi tsa RFID, likhokahano tsa li-antenna le lisebelisoa tse ling tsa elektroniki tse kentsoeng ha karete e felletseng e entsoe ka nepo.
Mosebetsi oa RFID o fanoa ke chip e khethiloeng, antenna, sebopeho sa inlay le protocol ea 'mali. Teslin ke karolo e ka hatisoang kapa ea sebopeho e potolohileng likarolo tseo. Ka hona, tšebelisano ea RFID e tlameha ho netefatsoa ka LF, HF, NFC kapa UHF inlay, sebopeho sa laminate le sistimi ea 'mali.
Mabitso a lihlahisoa a kang SP, TS, IJWP, Digital le Security Grade a hlalosa lipakane tse fapaneng tsa tshebetso. Tlhaloso ea '100–300 micron Teslin sheet' e akaretsang ha ea lekana bakeng sa tumello ea tlhahiso. Kereiti, botenya ba lebitso, tataiso ea lakane, mokhoa oa khatiso le sistimi ea laminate e lokela ho ngoloa ka mokhoa o amohetsoeng.
| Grade Category | Tloaelehileng Mosebetsi | Card-Project Menahano |
|---|---|---|
| SP Standard Grade | Kakaretso ea morero oa khatiso le lisebelisoa tsa laminated. | Netefatsa nomoro ea grade ea SP, botenya, tsamaiso ea enke le ho khomarela laminate ka liteko tsa tlhahiso. |
| TS Thermally Stabilized | Lisebelisoa tse hlokang taolo e matla ea ho honyela ha mocheso. | E thusa ha ho ngolisoa ha khatiso, ho bata ha lakane kapa ho pepesetsoa mocheso khafetsa; netefatsa potoloho e feletseng ea lamination. |
| IJWP Inkjet Kereiti | Sets'oants'o sa enke se entsoeng ka dae se nang le sekoaelo se ntlafetseng sa mahlakoreng a mabeli. | Se ke oa nahana hore kereiti e sa koaeloang e tla fana ka enke e ts'oanang, ho omisa kapa ho hanyetsa metsi. |
| Digital Print Kereiti | Li-platform tsa khatiso tsa dijithale tse khethehileng kapa litsamaiso tse tšoanelehang tsa electrophotographic. | Moetso oa printa, mocheso oa kobo, toner/inki e khomarelang le ho sebetsa li tlameha ho ba le mangolo. |
| Mophato wa Tshireletso | Sireletsa lintlha tse hlokang ts'ireletso e kenelletseng kapa likarolo tse ikhethileng tsa lenaneo. | Ho ba teng, tumello, ketane ea tlhokomelo le litokomane tsa morero li tlameha ho netefatsoa ka thoko. |
| Pampiri e Tšoanang ea Synthetic | Mefuta e meng ea li-microporous kapa coated synthetic substrates. | Ha ea lokela ho rekisoa e le Teslin ea 'nete ntle le haeba e fanoe ka tlas'a lebitso le boitsebiso bo molaong. |
Teslin substrate e ts'ehetsa mefuta e mengata ea mahlale a khatiso, empa boemo bo nepahetseng bo ipapisitse le ts'ebetso. Lifeme tsa likarete li lokela ho lekola boima ba setšoantšo, phaello ea matheba, ho omisoa kapa ho folisa, ho khomarela toner, boleng ba data bo fapaneng, ngoliso le ponahalo ea kamora ho lamination pele e fana ka tumello ea lisebelisoa tse ngata.
| Mokhoa oa ho Hatisa | o khothalelitsoe | Likotsi tsa Konokono tsa Litšoaneleho tse lokelang ho hlahlojoa |
|---|---|---|
| Lithography ea Offset | Netefatsa letoto la enke, mokhoa oa ho omisa, kakaretso ea enke le ho fepa maqephe. | Ho emisa, ho monya enke ho leka-lekana, bongata ba mebala le ho sotha ka mor'a ho lamination. |
| Khatiso ea skrine | Netefatsa k'hemistri ea enke, letlooeng, botenya ba depositi le maemo a ho folisa. | Li-blocking, li-layers tsa enke tse brittle le maqhama a laminate holim'a tšireletso e boima ea enke. |
| Laser / Dry Toner | Sebelisa kereiti e tšoanelehang bakeng sa printa le mefuta e fapaneng ea mocheso. | Curl, shrinkage, toner offset, jamming le toner adhesion. |
| Inkjet e thehiloeng ho Dae | Hlalosa kereiti e loketseng ea inkjet joalo ka IJWP moo ho hlokahalang. | Ho tsoa mali, ho tlala ho feta tekano, nako ea ho omisa, ho teteana ha mebala le ho hanyetsa metsi. |
| HP Indigo / Digital Press | Netefatsa kereiti e amohetsoeng le mofuta o nepahetseng oa khatiso. | Ho lumellana le kobo, fensetere ea ts'ebetso, phetisetso ea enke le ho khomarela. |
| Phetisetso ea Mocheso le Boitsebiso bo Fetohang | Lekola mofuta oa ribone, matla a khatiso, kereiti ea barcode le khanyetso ea abrasion. | Tlhaloso e fokolang ea moeli, phapang e tlaase kapa tšenyo ea data nakong ea lamination. |
Molao oa litšoaneleho: 'Offset / screen / digital compatible' ha e bolele hore mophato o le mong o loketse printa e ngoe le e ngoe ka bo eona. Tumello ea ho qetela e lokela ho sebelisa printa ea 'nete ea moreki, enke kapa toner, ts'ebetso ea bonono le lebelo la tlhahiso.
RFID e tloaelehileng kapa bopaki bo sireletsehileng bo ka kopanya likarolo tsa Teslin tse hatisitsoeng ka inlay e sa amaneng le lifilimi tse sireletsang kantle. Sebopeho sa ho qetela se tlameha ho etsoa e le tsamaiso e feletseng ho e-na le ho hlahloba pampiri ea maiketsetso feela.
| Lera | Mosebetsi | Sebaka se Tloaelehileng sa Tumello ea |
|---|---|---|
| Mokhabiso o ka pele kapa oa Laminate | E sireletsa khatiso 'me e ka ba le likarolo tsa holographic, UV kapa tšireletso ea holim'a metsi. | Ho hlaka, tlamahano, abrasion, curling le tšebelisano ea botho. |
| Lera le Hatisitsoeng la Teslin le ka Pele | E na le linepe, mongolo, lits'oants'o, libarcode, likhoutu tsa QR le khatiso ea ts'ireletso. | Print grade, ngodiso, boleng ba setšoantšo le laminate adhesion. |
| RFID Inlay / Chip le Antenna | E fana ka ts'ebetso ea elektroniki e se nang mabitso. | Khafetsa, protocol, boemo ba antenna, bophahamo ba chip, sebaka sa ho bala le khouto. |
| Lera le Hatisitsoeng la Teslin | E leka-lekanya moaho mme e jara lits'oants'o tse ka morao kapa data. | Mabele/tataiso, botenya ba symmetry le ho tsamaellana le print-lamination. |
| Back Overlay kapa Laminate | E fana ka ts'ireletso le ts'ebetso ea ho qetela ea karete ea holimo. | Matla a lekhapetla, ho hanyetsana le mongoapo le khoele ea khoheli/matla a liphanele tsa ho saena. |
Laminate e tlameha ho bapisoa le boemo ba Teslin, mokhoa oa khatiso le botenya ba karete e felileng. Lifeme tsa likarete li lokela ho netefatsa k'hemistri ea laminate, botenya, ho qhibiliha kapa sebaka sa ts'ebetso le ts'ebetso ea ho qetela ea peel. Recipe e tšoanang ea lamination ha ea lokela ho nkoa bakeng sa lifilimi tsa PVC, PET, PETG le PC.
Mocheso o feteletseng kapa nako ea ho lula e ka baka shrinkage, curl, motsamao oa setšoantšo kapa khatello ea karolo ea RFID. Mocheso o sa lekaneng kapa khatello e ka baka maqhama a fokolang. Rekota mocheso oa platen kapa roll, khatello, nako ea ho lula, nako ea ho pholisa le kaho ea mekotla nakong ea tumello ea sampole.
Ka mor'a lamination, hlahloba flatness karete, bohale botshepehi, sekhutlo boleng, botenya, flex ho hanyetsa le tshebetso ya elektronike. Liteko tsa ho bala tsa RFID li lokela ho phetoa kamora ho lamination le ho seha lefu hobane tokiso ea antenna le likhokahano tsa chip li ka angoa ke sebopeho sa karete ea ho qetela.
Teslin substrate e sebelisoa moo ho tšoarellang ha khatiso, bonding ba laminate le tšireletso ea data e kenyelitsoeng kapa lisebelisoa tsa elektronike li bohlokoa. Mokhahlelo o nepahetseng oa thepa le kaho e felletseng ea likarete li lokela ho amoheloa bakeng sa ts'ebeliso e 'ngoe le e' ngoe.
Likarete tsa taolo ea phihlello ea RFID le lintlha tsa basebetsi
Botho ba NFC, botšepehi le likarete tsa tšebeletso ea baeti
Likarete tsa linotlolo tsa hotele li tsamaellana le chip e boletsoeng ea senotlolo
Sireletsa likarete tsa ID, mangolo a tumello le mangolo a 'muso
Inshorense, laeborari, tlhokomelo ea bophelo bo botle le likarete tsa thuto
Lipallo tsa ketsahalo, li-tag tsa bohlokoa le libeche tse tšoarellang tsa laminated
Likarete tse bohlale tse nang le lichipisi, li-antenna, likhoele tsa makenete kapa libarcode
Mananeo a tefo le a mmuso: ho tšoaneleha bakeng sa likarete tsa banka, mangolo a boitsebiso a semmuso kapa mananeo a ts'ireletso a laoloang a tlameha ho theoa ka lintlha tsa tekheniki tsa mofani, litlhoko tsa ts'ireletso le litifikeiti tse hlokahalang. Khetho ea lintho tse bonahalang feela ha e fane ka ho lumellana.
| Ntho ea Tlhahlobo | Seo U Lokelang ho se Tiisa |
|---|---|
| Boitsebiso ba Lintho | Brand, boemo ba sehlahisoa, nomoro ea lotho le litokomane tse tšehetsang. |
| Botenya le Boima ba Motheo | Boleng ba lebitso, mamello e lumellanoeng le mokhoa oa ho lekanya. |
| Litekanyo tsa Leqephe | Bolelele, bophara, squareness, boemo ba bohale le tataiso ea ho itšeha. |
| Ponahalo | Bosoeu, ho tšoana ha bokaholimo, lerōle, matšoao, masoebe le tšilafalo. |
| Khatiso | Botenya ba mebala, qeto ea setšoantšo, ho baloa ha barcode, toner/inki e khomarelang le ho omisa. |
| Lamination | Matla a peel, li-bubble, silvering, curl, shrinkage le ho sotha pono. |
| RFID Tshebetso | Karabelo ea chip, sebaka sa ho bala, khouto, netefatso ea UID/data le tlhahiso ea kamora ho lamination. |
| Karete e phethiloeng | Botenya, ho batalla, ho tenyetseha, boleng bo holimo, ho khoptjoa le liteko tsa tikoloho tse hlokoang ke moreki. |
Kenya lintlha tsa morero: tšebeliso ea karete, boholo bo felileng, sebopeho sa lera, mohlala oa khatiso, laminate le RFID inlay.
Netefatsa thepa: boemo ba 'nete ba lebitso la Teslin, kereiti, botenya, boholo ba lakane le litokomane tse hlokahalang.
Etsa liteko tsa khatiso: lekola boleng ba setšoantšo, data e feto-fetohang, libarcode le enke kapa toner adhesion.
Etsa liteko tsa lamination: rekota mocheso o felletseng, khatello, ho lula le ho pholisa risepe.
Likarete tse phethiloeng tsa liteko: hlahloba peel, flex, ho itšeha, ponahalo le ts'ebetso ea RFID.
Amohela Mohlala oa Khauta: sebelisa sampole e saennoeng le lintlha tseo ho lumellanoeng ka tsona e le tšupiso ea tlhahiso e ngata.
| e Hlokehang ea Boitsebiso | Mehlala |
|---|---|
| Tlhokahalo ea Lintho | PPG TESLIN® ea 'nete kapa e lekanang le eona; SP, TS, IJWP, Digital kapa Kereiti ya Tshireletso. |
| Botenya le Boholo | Micron / mil ka lebitso, A4 kapa litekanyo tsa maqephe a tloaelo, mamello le bongata. |
| Thepa ea ho Hatisa | Tobetsa ea Offset, mohala oa skrineng, printa ea laser, mofuta oa inkjet, HP Indigo kapa mochini o mong oa khatiso oa dijithale. |
| Kaho ea Karete | Laminate e ka pele / e ka morao, likarolo tsa Teslin, RFID inlay, khoele ea makenete, phanele ea ho saena le botenya ba ho qetela. |
| Sistimi ea RFID | Chip, frequency, protocol, sebopeho sa antenna, mohlala oa 'mali, khouto le sebaka sa ho bala sepheo. |
| Teko le Litokomane | TDS, tlaleho ea tlhahlobo, bongata ba sampole, liphatlalatso tsa ho latela melao le ho lateloa ha lotho. |
| Lintlha tsa Khoebo | Palo ea teko, tlhokahalo ea selemo, sebaka sa ho fihla, ho paka le Incoterm. |
Lipampiri li lokela ho sireletsoa lerōleng, mongobo, tšenyo e ka thōko, ho kobeha le mocheso o sa laoleheng nakong ea polokelo le lipalangoang. Liphutheloana li ka kenyelletsa mokhabiso o ka hare o tiisitsoeng, mabokose a thata, tšireletso ea pallet, li-labels le boitsebiso ba lotho ho latela taelo eo ho lumellanoeng ka eona.
Boloka thepa e bataletse ka har'a sephutheloana sa eona sa mantlha 'me u e lumelle ho ikamahanya le kamore ea khatiso pele e bula. Maemo a khethehileng a polokelo le tataiso ea bophelo ba lishelefo li lokela ho latela litokomane tse tiisitsoeng tsa sehlopha le litlhaloso tsa mofani oa thepa.
Wallis e ts'ehetsa baetsi ba likarete le li-converter ka khetho ea thepa, ho seha lipampiri tse tloahelehileng, tlhahlobo ea sampole le khokahano e le 'ngoe bakeng sa maqephe a mantlha a karete, likoahelo, li-inlay tsa RFID le meaho ea likarete tse felileng.
Puisano ea tekheniki e ipapisitseng le mochini oa sebele oa khatiso, laminate le RFID
Saese e kgethehileng ya lakane, kgetho ya botenya, tshehetso ya ho seha le ho paka
Tumello ea Mehlala le ea Khauta pele ho tlhahiso e ngata
Khokahano ea li-substrates tsa likarete, li-overlays, li-inlay le lisebelisoa tse amanang le likarete
Liphutheloana tsa kantle ho naha, matšoao a thomello le tšehetso ea litokomane tsa morero
Che. TESLIN® ke lets'oao le ngolisitsoeng la PPG bakeng sa substrate e ikhethileng e entsoeng ke microporous, polyolefin-based. Lipampiri tse ling tsa maiketsetso li ka ba le sebopeho se fapaneng, boitšoaro ba khatiso le ts'ebetso ea lamination.
Teslin substrate e entsoe ke PPG. Wallis e ka sebetsa joalo ka morekisi oa thepa ea karete kapa converter. Khotheishene e lokela ho hlakisa lebitso, kereiti, botenya le litokomane tse tšehetsang tse kenyellelitsoeng sebakeng sa phepelo.
Karabo e itšetlehile ka mochine oa khatiso, laminate, potoloho ea mocheso, sebopeho sa karete le litlhoko tsa tšireletso. Limaraka tsa SP, TS, IJWP, Digital le Security li sebeletsa merero e fapaneng, kahoo ho hlokahala mangolo a thuto.
E, empa kereiti e nepahetseng e tlameha ho khethoa. Lisebelisoa tsa inkjet tse thehiloeng ho dae li ka hloka kereiti e ntlafalitsoeng ea khatiso joalo ka IJWP. Liteko tsa khatiso, enke, ho omisa le ho thibela metsi li lokela ho phethoa pele ho tlhahiso.
Limaraka tse loketseng li ka hatisoa ka laser, empa mohlala o nepahetseng oa printa, mocheso o kopanyang, botenya ba lakane, curl le ho khomarela toner li tlameha ho lekoa. Litlaleho tsa litšebelisano tse akaretsang ha lia lekana bakeng sa tumello ea tlhahiso.
Che. Teslin ke karete e ka hatisoang kapa ea sebopeho sa karete. Mosebetsi oa RFID o tsoa ho chip e arohaneng le inlay ea antenna e lokelang ho khethoa bakeng sa maqhubu a hlokahalang, protocol le tsamaiso ea ho bala.
Sebopeho sa eona sa microporous se ka fana ka cushioning ka mokhoa o nepahetseng oa laminated credential. Tšireletso e ntse e itšetlehile ka bophahamo ba chip, sebopeho sa antenna, khetho ea laminate, khatello, mocheso le tlhahlobo ea karete e felileng.
Che. E ka nkela sebaka kapa ea tlatselletsa PVC meahong e meng, empa ho satalla ha karete, botenya, mokhoa oa khatiso, k'hemistri ea laminate, ho pepeseha ha tikoloho le litlhoko tsa taolo li tlameha ho hlahlojoa bakeng sa morero o mong le o mong.
Substrate ea maiketsetso e hanyetsana le metsi le mongobo, empa ho tšoarella ha karete ea ho qetela ho boetse ho itšetlehile ka khatiso, litiiso tsa laminate, likhahla tse sehiloeng, li-adhesives le likarolo tse kentsoeng.
Khetho e ikhethileng ea lakane le botenya e ka hlahlojoa. Ho fumaneha ho ipapisitse le kereiti ea Teslin e khethiloeng, sebopeho sa sheet-sheet, palo ea odara le litlhoko tsa ho itšeha.
Bareki ba lokela ho hlahloba boleng ba khatiso, toner kapa inki adhesion, lamination peel, shrinkage, curl, die cutting, finish-card flex le ts'ebetso ea ho bala ea RFID ba sebelisa thepa ea sebele ea tlhahiso.
Fana ka lets'oao le kereiti e hlokahalang, botenya, boholo ba lakane, mohlala oa khatiso, sebopeho sa laminate, chip ea RFID le antenna, bongata, litlhoko tsa litokomane, ho paka le ho fihla moo u eang teng.
