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Iphepha lokwenziwa le-Teslin® le RFID , ukufinyelela, ihhotela, ubulungu namakhadi kamazisi avikelekile. Ibanga ngokwezifiso, ukujiya, usayizi weshidi nokusikwa, namasampula wokuphrinta, ukulanyiswa kanye nokuhlolwa kwekhadi OEM emhlabeni jikelele.
impahla yekhadi
WALLIS
| Impahla: | |
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| Usayizi: | |
| Uhlobo Lokuphrinta: | |
| Ubuningi: | |
U-Wallis uhlinzeka ngephepha lokwenziwa le-Teslin® RFID lokwenziwa kwamakhadi , izifakazelo ezivikelekile zikamazisi, amakhadi okufinyelela, amakhadi okhiye behhotela, amakhadi obulungu, amakhadi ahlakaniphile nemikhiqizo yamakhadi ane-laminated. Isakhiwo sayo se-microporous sisekela ukuphrinta kwe-high-definition, i-laminate anchorage eqinile kanye ne-cushioning ezungeze ama-chips ashumekiwe kanye nezimpondo.
Kubakhiqizi bamakhadi e-B2B, abakhiqizi abaqinisekisayo, iziguquli ze RFID nezinkampani zokuphrinta, ibanga elifanele le-Teslin substrate kufanele likhethwe ngokuya ngenqubo yokuphrinta, isistimu ye-laminate, ukwakhiwa kwekhadi eliphelile kanye nezidingo zokusetshenziswa kokugcina. I-Wallis isekela osayizi beshidi bangokwezifiso, ukukhethwa kogqinsi, ukufaneleka kwesampula, ukusika nokupakisha okuthekelisa.
Ukuhlonza okubalulekile: I-TESLIN® wuphawu lokuthengisa olubhalisiwe lwe PP G Industries. Abathengi kufanele baqinisekise ukuthi ingabe ikhotheshini ihlanganisa PP i-G TESLIN® substrate yangempela, izinga lomkhiqizo othile kanye namadokhumenti asekelayo. 'Iphepha le-Teslin' akufanele lisetshenziswe njengencazelo ejwayelekile yamaphepha okwenziwa angahlobene.
| Isiqondiso | sokucaciswa kwe-B2B |
|---|---|
| Umkhiqizo | I-microporous polyolefin-based synthetic card substrate; okwangempela PP Ibanga le-G TESLIN® elizoqinisekiswa kwikhotheshini nesampula eligunyaziwe. |
| Usayizi Weshidi Elijwayelekile | I-A4 210 × 297mm kusukela ekucacisweni komkhiqizo wamanje; osayizi beshidi lokukhiqiza amakhadi ngokwezifiso bangabuyekezwa. |
| Ubukhulu | Ibanga lamanje lekhasi le-Wallis: 100–300 microns. Ugqinsi olutholakalayo lokugcina luncike ebangeni elikhethiwe le-Teslin, ifomethi yesitoko kanye nemfuneko yokuguqulwa. |
| Ubuso | I-white matte microporous surface; amabanga ajwayelekile, azinzile ngokwe-thermal, ahlanganiswe nge-inkjet, ama-digital-print noma amamaki okuphepha angacaciswa ngokuya ngephrojekthi. |
| Ukuphrinta | I-offset, isikrini, i-flexographic, i-gravure, i-thermal transfer, i-laser, inkjet kanye nezinhlelo zedijithali ezikhethiwe, kuncike ebangeni kanye neziqu zemishini. |
| I-Lamination | Ihambisana ne-platen noma i-roll lamination uma ifaniswe ne-laminate egunyaziwe, izinga lokushisa, ingcindezi, isikhathi sokuhlala kanye nomjikelezo wokupholisa. |
| Izakhiwo Zamakhadi | Isendlalelo sekhadi eliphrintiwe, i-substrate emaphakathi noma isendlalelo se-cushioning esihlanganiswe PVC , PET , PETG , PC , Ifilimu ye-overlay s, RFID ama-inlay, imigqa kazibuthe noma ezinye izingxenye ezigunyaziwe. |
| Ukwenza ngokwezifiso | Ubukhulu beshidi, ukujiya/ibanga, ukusika, umzila wokuphrinta, ukubhanqa kwe-laminate, ukupakisha, amalebula nezidingo zokuhlola. |
| Amadokhumenti Ekhwalithi | Ukuhlonza okubalulekile, imininingwane yenkatho, ishidi lokucaciswayo, umbiko wokuhlola namanye amadokhumenti angaphansi kobubanzi bokunikezwayo obuqinisekisiwe. |
I-Teslin substrate ayilona iphepha le-cellulose elivamile. Iwungqimba olulodwa, i-microporous, i-polyolefin egcwele kakhulu eyenziwe ngezinto zokwenziwa. I-matrix yayo enezimbotshana yamukela oyinki, amathoni, izinamatheliso, izimbotshana kanye namalayini esakhiweni kunokuwashiya endaweni ebushelelezi kuphela.
Lesi sakhiwo singathuthukisa i-anchorage yokuphrinta, i-laminate bonding kanye nokumelana nokususwa kwedatha. Ingase futhi ihlinzeke ngama-cushion RFID ama-chip, uxhumo lwe-antenna namanye ama-electronic ashumekiwe lapho ukwakhiwa kwekhadi eligcwele kubunjiniyela ngendlela efanele.
Umsebenzi we RFID uhlinzekwa i-chip ekhethiwe, uthi, ukwakheka kwe-inlay nephrothokholi yokufunda. I-Teslin iyingxenye ephrintekayo noma eyakhiwe ezungeze lezo zingxenye. Ngakho-ke ukuhambisana kwe RFID kufanele kuqinisekiswe LF , HF , NFC noma UHF inlay, isakhiwo se-laminate kanye nesistimu yokufunda.
Amagama omkhiqizo afana ne-SP, TS, IJWP, Digital kanye neBanga Lokuphepha achaza okuhloswe ukusebenza okuhlukile. Incazelo '100–300 micron yeshidi le-Teslin' evamile ayanele ekugunyazweni kokukhiqiza. Ibanga, ukujiya okuzisholo, isiqondiso seshidi, indlela yokuphrinta kanye nesistimu ye-laminate kufanele kurekhodwe esimisweni esigunyaziwe.
| Isigaba Sebanga Lesigaba | Esijwayelekile Somsebenzi | Wekhadi-Ukucatshangelwa Kwephrojekthi |
|---|---|---|
| Ibanga Elijwayelekile le-SP | Izinhloso ezijwayelekile zokuphrinta kanye nezicelo ze-laminated. | Qinisekisa inombolo eqondile yebanga le-SP, ukujiya, isistimu kayinki kanye nokunamathela kwe-laminate ngokusebenzisa izivivinyo zokukhiqiza. |
| I-TS Thermally Stabilized | Izinhlelo zokusebenza ezidinga isilawuli esiqinile sokuncipha kwe-thermal. | Iwusizo lapho ukubhaliswa kokuphrinta, ukuvuleka kweshidi noma ukuchayeka kokushisa okuphindaphindiwe kubalulekile; qinisekisa umjikelezo ophelele we-lamination. |
| I-IJWP Inkjet Ibanga | Isithombe se-inkjet esisekelwe kudayi esinoqweqwe olunezinhlangothi ezimbili olulungiselelwe ukuphrinta. | Ungacabangi ukuthi izinga elijwayelekile elingagcotshiwe lizohlinzeka ngokubamba kukayinki okufanayo, ukomisa noma ukumelana namanzi. |
| Ibanga Lokuphrinta Kwedijithali | Amapulatifomu athile okushicilela edijithali noma amasistimu we-electrophotographic afanelekile. | Imodeli yephrinta, izinga lokushisa lengubo, ukunamathela kwe-toner/inki nokusebenziseka kufanele kuqeqeshwe. |
| Ibanga Lezokuphepha | Vikela izifakazelo ezidinga izici zokuphepha ezishumekiwe noma eziqondene nohlelo oluthile. | Ukutholakala, ukugunyazwa, uchungechunge lokugcinwa kanye nemibhalo yephrojekthi kumele kuqinisekiswe ngokwehlukana. |
| Iphepha Elilinganayo Lokwenziwa | Amanye ama-microporous noma ama-synthetic substrates ahlanganiswe. | Akumele imakethwe njenge-Teslin yangempela ngaphandle uma ihlinzekwe ngaphansi kophawu olusemthethweni kanye nebanga. |
I-Teslin substrate isekela ububanzi obubanzi bobuchwepheshe bokuphrinta, kodwa ibanga elilungile liqondene nenqubo ethile. Izimboni zamakhadi kufanele zihlole ukuminyana kwesithombe, ukuzuza kwamachashazi, ukomiswa noma ukuphulukiswa, ukunamathela kwe-toner, ikhwalithi yedatha eguquguqukayo, ukubhaliswa nokubukeka kwangemva kokucwebezelwa ngaphambi kokugunyaza impahla eyinqwaba.
| Inqubo Yokuphrinta | Inconyiwe | Izingozi Eziyinhloko Zokufaneleka Ongazihlola |
|---|---|---|
| I-Lithography ye-Offset | Qinisekisa uchungechunge lukayinki, indlela yokomisa, ukumbozwa kukayinki okuphelele kanye nokuphakelwa kwamashidi. | Ukusetha, ibhalansi yokumunca uyinki, ukuminyana kombala kanye nokuhlanekezela ngemva kokucwala. |
| Ukuphrinta Isikrini | Qinisekisa ikhemistri ye-inki, i-mesh, ubukhulu bediphozithi nezimo zokuphulukisa. | Ukuvinjwa, izendlalelo ze-inki eziphukayo kanye nokubopha nge-laminate phezu kokufakwa kukayinki osindayo. |
| I-Laser / Ithoni Eyomile | Sebenzisa ibanga elifanelekele iphrinta kanye nobubanzi bezinga lokushisa elihlanganisiwe. | I-Curl, i-shrinkage, i-toner offset, i-jamming ne-toner adhesion. |
| I-Inkjet Esekelwe Kudayi | Cacisa ibanga elifanelekile le-inkjet njenge-IJWP lapho kudingeka khona. | Ukopha, ukugcwala ngokweqile, isikhathi sokumisa, ukuminyana kombala nokumelana namanzi. |
| HP Indigo / Digital Press | Qinisekisa ibanga eligunyaziwe kanye nemodeli yezindaba eqondile. | Ukuhambisana kwengubo, iwindi lokusebenza, ukudluliswa kukayinki nokunamathela. |
| Ukudlulisa Okushisayo Nedatha Eguquguqukayo | Hlola uhlobo lweribhoni, amandla okuphrinta, ibanga lebhakhodi kanye nokumelana nemihuzuko. | Ukuchazwa konqenqema okungekuhle, ukungafani okuphansi noma ukulimala kwedatha phakathi ne-lamination. |
Umthetho wokufaneleka: 'Offset / screen / digital compatible' akusho ukuthi ibanga elilodwa lifaneleka ngokuzenzakalelayo kuyo yonke iphrinta. Ukugunyazwa kokugcina kufanele kusebenzise iphrinta yangempela yomthengi, uyinki noma i-toner, ukufakwa komsebenzi wobuciko kanye nesivinini sokukhiqiza.
I RFID evamile noma imininingwane evikelekile ingase ihlanganise izendlalelo ze-Teslin eziphrintiwe ne-inlay engathinteki namafilimu angaphandle avikelayo. Isakhiwo sokugcina kufanele senziwe njengohlelo oluphelele kunokuhlola iphepha lokwenziwa lodwa.
| Wesendlalelo | Komsebenzi | Iphuzu Lokuvunyelwa |
|---|---|---|
| Ngaphambili Ifilimu yokumboza noma i-Laminate | Ivikela ukuphrinta futhi ingase iphathe i-holographic, UV noma izici zokuphepha ezingaphezulu. | Ukucaca, ukubopha, ukuhuzuka, ukugoqa kanye nokuhambisana komuntu siqu. |
| I-Front Printed Teslin Layer | Iphethe izithombe, umbhalo, ihluzo, amabhakhodi, amakhodi e-QR nokuphrinta kokuphepha. | Ibanga lokuphrinta, ukubhaliswa, ikhwalithi yesithombe nokunamathela kwe-laminate. |
| RFID Inlay / I-Chip ne-Antenna | Ihlinzeka ngomsebenzi we-elekthronikhi ongathinteki. | Imvamisa, iphrothokholi, indawo ye-antenna, ukuphakama kwe-chip, ububanzi bokufunda nombhalo wekhodi. |
| Isendlalelo Se-Teslin Esiphrintiwe Emuva | Ibhalansisa ukwakhiwa futhi iphathe izithombe ze-reverse-side noma idatha. | Okusanhlamvu/isiqondiso, ukujiya kokulinganisa nokuhambisana nokuphrinta-lamination. |
| Emuva Ifilimu yokumboza noma i-Laminate | Ihlinzeka ngokuvikeleka nokusebenza kokugcina kwekhadi eliphezulu. | Amandla e-peel, ukumelana nokuklwebheka kanye nomugqa kazibuthe/ukuhambisana kwephaneli yesiginesha. |
I-laminate kufanele ifaniswe nebanga le-Teslin, inqubo yokuphrinta kanye nokuqina kwekhadi eliqediwe. Izimboni zamakhadi kufanele ziqinisekise ukwakheka kwe-laminate, ukujiya, ukuncibilika noma uhla lokuvula kanye nokusebenza kokugcina kwekhasi. Iresiphi efanayo ye-lamination akumele kucatshangwe ukuthi PVC , PET , PETG kanye PC namafilimu ekhava.
Izinga lokushisa eleqile noma isikhathi sokuhlala singabangela ukuncipha, ukugoqa, ukunyakaza kwesithombe noma RFID ukucindezeleka kwengxenye. Ukushisa okunganele noma ukucindezela kungabangela ukuhlangana okubuthakathaka. Rekhoda izinga lokushisa lepuleti noma le-roll, ingcindezi, isikhathi sokuhlala, isikhathi sokupholisa kanye nokwakhiwa kwesitaki ngesikhathi sokugunyazwa kwesampula.
Ngemuva kwe-lamination, hlola ukuqina kwekhadi, ubuqotho bomphetho, ikhwalithi yekona, ukujiya, ukumelana nokuguquguquka nokusebenza kwe-elekthronikhi. RFID ukuhlolwa kokufunda kufanele kuphindwe ngemva kokucwiliswa kanye nokusikwa kwe-fae ngoba ukushuna kwe-antenna nokuxhumeka kwe-chip kungase kuthikamezeke isakhiwo sokugcina sekhadi.
I-Teslin substrate isetshenziswa lapho ukuqina kokuphrinta, ukubopha kwe-laminate nokuvikelwa kwedatha eshumekiwe noma i-electronics kubalulekile. Ibanga elifanele lempahla kanye nokwakhiwa kwekhadi eliphelele kufanele kuvunywe ukusetshenziswa ngakunye.
RFID amakhadi okulawula ukufinyelela nemininingwane yesisebenzi
NFC ubulungu, ukwethembeka namakhadi ezivakashi
Amakhadi okhiye behhotela afaniswe ne-chip yesistimu yokukhiya eshiwo
Vikela ama-ID amakhadi, izimvume kanye nemininingwane kahulumeni
Umshwalense, umtapo wolwazi, ukunakekelwa kwezempilo kanye namakhadi emfundo
Ukudlula komcimbi, amathegi abalulekile namabheji ahlala njalo ane-laminated
Amakhadi ahlakaniphile anama-chips, izimpondo, imigqa kazibuthe noma amabhakhodi
Izinhlelo zokukhokha nezikahulumeni: ukufaneleka kwamakhadi asebhange, izifakazelo zobunikazi ezisemthethweni noma izinhlelo zokuphepha ezilawulwayo kufanele zisungulwe ngokucaciswa kobuchwepheshe kokhiphayo, izimfuneko zokuphepha nezitifiketi ezidingekayo. Ukukhethwa kwezinto kukodwa akuqinisekisi ukuthobelana.
| Yokuhlola Yabakhi Bekhadi Le-B2B | Yini Okufanele Uyiqinisekise |
|---|---|
| I-Material Identity | Ibhrendi, izinga lomkhiqizo, inombolo yenkatho kanye nemibhalo ecacisayo esekelayo. |
| Ukuqina kanye Nesisindo Esiyisisekelo | Inani eliphansi, ukubekezelelana okuvunyelwene ngakho kanye nendlela yokulinganisa. |
| Ubukhulu beshidi | Ubude, ububanzi, isikwele, isimo somphetho kanye nesiqondiso sokusika. |
| Ukubukeka | Ubumhlophe, ukufana kwendawo, uthuli, izimpawu, imibimbi kanye nokungcola. |
| Ukuphrinta | Ukuminyana kombala, ukucaca kwesithombe, ukufundeka kwebhakhodi, ukunamathela kwe-toner/inki nokomiswa. |
| I-Lamination | Amandla e-peel, amabhamuza, ukwenza isiliva, ukugoqa, ukushwabana nokuhlanekezela okubonakalayo. |
| RFID Ukusebenza | Impendulo ye-chip, ububanzi bokufunda, ukubhala ngekhodi, i-UID/ukuqinisekiswa kwedatha kanye nesivuno sangemva kokucwaswa. |
| Ikhadi eliphelile | Ubukhulu, ukucaba, ukugoba, ikhwalithi yonqenqema, ukuhuzuka kanye nokuhlolwa kwemvelo okudingwa umthengi. |
Thumela idatha yephrojekthi: ukusetshenziswa kwekhadi, usayizi oqediwe, isakhiwo sesendlalelo, imodeli yephrinta, i-laminate kanye ne RFID inlay.
Qinisekisa impahla: isimo sangempela somkhiqizo we-Teslin, ibanga, ukujiya, usayizi weshidi kanye nemibhalo edingekayo.
Yenza izivivinyo zokuphrinta: hlola ikhwalithi yesithombe, idatha eguquguqukayo, amabhakhodi kanye nokunamathela kwe-inki noma kwe-toner.
Yenza izivivinyo ze-lamination: rekhoda izinga lokushisa eligcwele, ingcindezi, ukuhlala kanye nokupholisa iresiphi.
Hlola amakhadi aqediwe: hlola ikhasi, i-flex, i-die cut, ukubukeka kanye nokusebenza RFID .
Gunyaza Isampula Legolide: sebenzisa isampula esayiniwe kanye nezincazelo okuvunyelwene ngazo njengereferensi yokukhiqiza ngobuningi.
| Zolwazi Oludingekayo | Izibonelo |
|---|---|
| Imfuneko Yempahla | Okwangempela PP G TESLIN® noma okulinganayo okugunyaziwe; SP, TS, IJWP, Digital noma Ibanga Lokuphepha. |
| Ubukhulu kanye Nobukhulu | I-micron/mil, i-A4 noma ubukhulu beshidi langokwezifiso, ukubekezelela ukusika kanye nenani. |
| Izisetshenziswa Zokuphrinta | Ukucindezela kwe-offset, umugqa wesikrini, iphrinta ye-laser, imodeli ye-inkjet, i-HP Indigo noma omunye umshini wedijithali. |
| Ukwakhiwa Kwekhadi | I-laminate yangaphambili/emuva, izendlalelo ze-Teslin, RFID inlay, umugqa kazibuthe, iphaneli yesiginesha nokujiya kokugcina. |
| RFID Uhlelo | I-chip, imvamisa, iphrothokholi, ukwakheka kwe-antenna, imodeli yokufunda, umbhalo wekhodi nebanga lokufunda okuqondiwe. |
| Ukuhlola kanye Nemibhalo | I-TDS, umbiko wokuhlola, inani lesampula, izimemezelo zokuthobela kanye nokulandelelwa kwenkatho. |
| Imininingwane Yezohwebo | Inani lesivivinyo, isidingo sonyaka, indawo yokulethwa, ukupakishwa kanye ne-Incoterm. |
Amashidi kufanele avikelwe othulini, umswakama, umonakalo onqenqemeni, ukugoba kanye nokushisa okungalawuleki ngesikhathi sokugcinwa nokuthutha. Ukupakishwa kungase kuhlanganise ukugoqa kwangaphakathi okuvaliwe, amabhokisi aqinile, ukuvikelwa kwe-pallet, amalebula angokwezifiso kanye nokuhlonza inkatho ngokuvumelana nomyalelo okuvunyelwene ngawo.
Gcina okokusebenza kusicaba emaphaketheni ako okuqala futhi ukuvumele ukuthi kujwayelane negumbi lokuphrinta ngaphambi kokuvula. Izimo ezithile zokulondoloza kanye nesiqondiso sempilo yeshelufu kufanele kulandele amadokhumenti ebanga eliqinisekisiwe kanye nencazelo yabahlinzeki.
I-Wallis isekela abakhiqizi bamakhadi neziguquli ngokukhetha okubalulekile, ukusika amashidi ngokwezifiso, ukuhlolwa kwesampula kanye nokuxhumana kwendawo eyodwa yamashidi angumongo wekhadi, Ifilimu ye-overlay s, RFID ama-inlay kanye nezakhiwo zamakhadi aphelile.
Ingxoxo yobuchwepheshe esekelwe kuphrinta yangempela, i-laminate kanye nesistimu ye RFID
Usayizi weshidi ngokwezifiso, ukukhetha ukujiya, ukusika nokusekela ukupakisha
Ukugunyazwa kwesampula kanye Nesampula Yegolide ngaphambi kokukhiqizwa kwenqwaba
Ukudidiyelwa kwama-substrates ekhadi, Ifilimu ye-overlay s, ama-inlay nezinto zamakhadi ezihlobene
Thumela amaphakheji, ukumakwa kokuthunyelwa kanye nokusekelwa kwemibhalo yephrojekthi
Cha. I-TESLIN® iwuphawu olubhalisiwe lwe PP G lwe-microporous, polyolefin-based synthetic substrate ethile. Amanye amaphepha okwenziwa angase abe nokwakheka okuhlukile, ukuziphatha kokuphrinta kanye nokusebenza kokucwenga.
I-Teslin substrate ikhiqizwa i PP G. Wallis ingasebenza njengomnikezeli wezinto zekhadi noma isiguquli. Ikhotheshini kufanele ihlonze ngokucacile uhlobo, ibanga, ukujiya kanye namadokhumenti asekelayo afakwe kububanzi bokunikezwayo.
Impendulo incike kwiphrinta, i-laminate, umjikelezo oshisayo, isakhiwo sekhadi kanye nezidingo zokuphepha. I-SP, TS, IJWP, Digital kanye namamaki Ezokuphepha anezinjongo ezihlukene, ngakho ukufaneleka okuyisampula kuyadingeka.
Yebo, kodwa kufanele kukhethwe ibanga elifanele. Izinhlelo zokusebenza ze-inkjet ezisekelwe kudayi zingase zidinge izinga lokuphrinta elilungiselelwe njenge-IJWP. Ukuhlolwa kokuphrinta, uyinki, okomisa kanye nokumelana namanzi kufanele kuqedwe ngaphambi kokukhiqiza.
Amamaki afanelekayo angaphrintwa nge-laser, kodwa imodeli yephrinta okuyiyonayona, izinga lokushisa lokuhlanganisa, ukujiya kweshidi, ukugoqa nokunamathela kwe-toner kufanele kuhlolwe. Izimangalo zokusebenzisana ezijwayelekile azanele ukuze kugunyazwe ukukhiqizwa.
Cha. I-Teslin iyi-substrate yekhadi eliphrintekayo noma lesakhiwo. Umsebenzi we RFID uvela ku-chip ehlukile kanye ne-antenna inlay okumele ikhethelwe imvamisa edingekayo, iphrothokholi nesistimu yokufunda.
Isakhiwo sayo se-microporous singanikeza i-cushioning ekuqinisekiseni okuklanywe kahle kwe-laminated. Ukuvikela kusancike ekuphakameni kwe-chip, ukwakheka kwe-antenna, ukukhetha kwe-laminate, ingcindezi, izinga lokushisa nokuhlolwa kwekhadi eliphelile.
Cha. Ingathatha indawo noma igcwalise PVC kwezinye izakhiwo, kodwa ukuqina kwekhadi, ukujiya, inqubo yokuphrinta, ikhemikhali ye-laminate, ukuchayeka kwemvelo kanye nezimfuneko zokulawula kufanele zihlolwe kuphrojekthi ngayinye.
I-substrate yokwenziwa imelana namanzi kanye nomswakama, kodwa ukuqina kwekhadi lokugcina futhi kuncike ekunyatheliseni, izimpawu ze-laminate, imiphetho enqunyiwe, izinamathiselo kanye nezingxenye ezishunyekiwe.
Ukusikwa kweshidi ngokwezifiso nokukhethwa kokuqina kungabuyekezwa. Ukutholakala kuncike ebangeni elikhethiwe le-Teslin, ifomethi ye-master-sheet, inani le-oda kanye nezidingo zokusika.
Abathengi kufanele bahlole ikhwalithi yokuphrinta, i-toner noma ukunamathela kukayinki, ikhasi le-lamination, ukushwabana, ukugoba, i-die cutting, i- finish-card flex kanye RFID nokufunda ukusebenza kusetshenziswa okokusebenza kwangempela kokukhiqiza.
Nikeza uhlobo oludingekayo kanye nebanga, ukujiya, usayizi weshidi, imodeli yephrinta, isakhiwo se-laminate, RFID chip kanye nothi, inani, izidingo zamadokhumenti, indawo yokupakisha nendawo yokudiliva.
