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Teslin® sintetik pepa fɔ RFID, akses, ɔtel, mɛmbaship ɛn sikyɔriti ID kad. Kastom gred, tiknes, sheet saiz ɛn kɔt, wit sampul fɔ print, lamination ɛn OEM kad tɛst ɔlsay na di wɔl.
kad matirial
WALLIS
| Di tin we dɛn yuz: | |
|---|---|
| Sayz: | |
| Di kayn we aw dɛn print: Di say | |
| Kwantiti: | |
Wallis de saplae Teslin® sintetik pepa fɔ RFID kad manufakchurin , sikyɔriti ID kredibiliti, akses kad, ɔtel ki kad, mɛmbaship kad, smart kad ɛn laminated kad prodak. I maykroporous strɔkchɔ de sɔpɔt ay-difinishɔn printin, strɔng laminat ankɔrej ɛn kusɛn rawnd ɛmbaded chips ɛn ɛntena dɛn.
Fɔ B2B kad manifakta, kredibiliti prodyusɔ, RFID kɔnvɔta ɛn printin kɔmni, dɛn fɔ pik di kɔrɛkt Teslin sabstret gred akɔdin to di printin prɔses, laminate sistem, finish-kad kɔnstrɔkshɔn ɛn ɛnd-yuz rikwaymɛnt. Wallis de sɔpɔt kɔstɔm shit saiz, tiknɛs sɛlɛkshɔn, sampul kwalifayeshɔn, kɔt ɛn ɛkspɔt pak.
Matirial aydentifikeshɔn: TESLIN® na wan rɛjista tredmak fɔ PPG Industries. Di wan dɛn we de bay fɔ kɔnfɔm if di kot kɔba tru tru PPG TESLIN® sabstret, di patikyula prodak gred ɛn di sɔpɔtin matirial dɔkyumentri. 'Teslin pepa' nɔ fɔ yuz as jenɛrik diskripshɔn fɔ sintetik pepa dɛn we nɔ gɛt ɛnitin fɔ du wit am.
| Paramita | B2B Spɛsifikeshɔn Gaydɛns |
|---|---|
| Sɔntin | Maykroporous polyolefin-bεys sεntetik kad sabstεrayt; jɛnɛral PPG TESLIN® gred fɔ kɔnfyus insay di kot ɛn aprɔv sampul. |
| Standart Shit Sayz | A4 210 × 297mm frɔm di kɔrɛnt prodakt spɛsifikɛshɔn; yu kin rivyu di kɔstɔm kad-prɔdakshɔn shit saiz dɛn. |
| Tik we i tik | Di Wallis pej rεnj we de naw: 100–300 maykron. Faynal tiknes we de dipen pan di Teslin gred we yu dɔn pik, stok fɔmat ɛn kɔnvɔshɔn rikwaymɛnt. |
| Sho | Wait mat maykroporous sɔfays; standad, thermal stabilized, inkjet-coated, dijital-print ɔ sikyɔriti gred dɛn kin spɛsifa akɔdin to di prɔjek. |
| Fɔ print | Ɔfset, skrin, fleksografik, grev, tɛmal transfɔm, lɛsa, inkjɛt ɛn sɛlɛkɛt dijital sistem, we de ɔnda gred ɛn ikwipmɛnt kwalifayeshɔn. |
| Laminɛshɔn we dɛn kin yuz | Kompatibl wit platen ɔ rol lamination we dɛn mach wit wan apruv laminate, tɛmpracha, prɛshɔn, dwɛl tɛm ɛn kol saykl. |
| Di Strukchɔ dɛn fɔ di Kad dɛn | Print kad layt, sɛntral sabstret ɔ kusɛn layt we dɛn jɔyn wit PVC, PET, PETG, PC, ɔvlay, RFID inlay, magnɛtik strɛp ɔ ɔda kɔmpɔnɛnt dɛn we dɛn dɔn gri fɔ. |
| Kastamayzeshɔn | Shit dimɛnshɔn, tik/grɛd, kɔt, printin rod, laminat pe, pak, lɛbl ɛn inspekshɔn rikwaymɛnt. |
| Kwaliti Dokumɛnt dɛn | Matirial aydentifikeshɔn, lɔt infɔmeshɔn, spɛsifikɛshɔn shit, inspekshɔn ripɔt ɛn ɔda dɔkyumɛnt dɛn we de ɔnda di kɔnfyus sapɔt skɔp. |
Teslin sabstεrayt nכto kכvεshכnal sεlulכz pepa. na wan layεr, maykroporous, hεli fulכp polyolefin-bεys sεntetik mεtirial. I porous matris de aksept ink, toner, adhesives, coatings ɛn laminates insay di strɔkchɔ pas fɔ lɛf dɛn nɔmɔ pan wan smol smol say.
Dis strɔkchɔ kin impruv print ankɔrej, laminate bonding ɛn resistans to data rimɔv. I kin gi kusɛn bak rawnd RFID chips, ɛntena kɔnɛkshɔn ɛn ɔda ɛmbaded ilɛktroniks we di ful kad kɔnstrɔkshɔn dɔn ɛnjɛnɛri fayn fayn wan.
Di RFID fɛnshɔn na di chip we yu dɔn pik, ɛntena, inlay layout ɛn rida protɔkɔl de saplae am. Teslin na di printabl ɔ strɔkchɔral sabstret we de rawnd dɛn kɔmpɔnɛnt dɛn de. RFID kompitibiliti so fɔ validet wit di aktual LF, HF, NFC ɔ UHF inlay, laminate strɔkchɔ ɛn rida sistem.
Prodak nem dɛm lɛk SP, TS, IJWP, Dijital ɛn Sikyuriti Gred de diskrayb difrɛn pefɔmɛns target dɛm. Wan jenɛrik '100–300 maykron Teslin shit' diskripshɔn nɔ inof fɔ prodakshɔn aprɔval. Di gred, nominal tiknes, sheet dairekshɔn, print we ɛn laminate sistem fɔ rikodɔ insay di apruv spesifikeshɔn.
| Gret Kategori | Tipik Fɔnkshɔn | Kad-Projɛkt Kɔnsidɛreshɔn |
|---|---|---|
| SP Standart Gred | Jɛnɛral-pɔpɔs print ɛn laminated aplikeshɔn dɛn. | Konfam di ekzak SP gred nomba, tiknes, ink sistem en laminate adheshon tru prodakshon trials. |
| TS we dɛn dɔn stebul wit tɛmal | Aplikeshɔn dɛn we nid fɔ gɛt tayt tɛmral-shrinkage kɔntrol. | Yusful we print rɛjista, sheet flat ɔ ripit ɔt ɛksplɔshɔn rili impɔtant; verify di komplit lamination saykl. |
| IJWP Inkjet Gret we yu de yuz | Day-bɛs inkjɛt imej wit tu-sayd print-ɔptimayz kɔtin. | Nɔ tink se wan standad gred we nɔ gɛt kɔt go gi di sem ink holdout, drying ɔ wata resistance. |
| Dijital Print Gret | Speshal dijital prɛs pletfɔm ɔ kwalifay ilɛktrɔfɔtografik sistem dɛn. | Printa mɔdel, blankit tɛmpracha, toner/ink adheshon ɛn runnabiliti fɔ kwalifay. |
| Sekyuriti Gret | Sikyu kredɛns we nid fɔ ɛmbas ɔ program-spɛsifi k sikyɔriti ficha dɛn. | Di avaylabl, ɔtorizeshɔn, chen fɔ kustodi ɛn di prɔjek dɔkyumentri fɔ kɔnfɔm sɛpret wan. |
| Ikual Sintetik Pepa | Alternativ maykroporous ɔ kɔt sintetik sabstret dɛn. | Nɔ fɔ makɛt am as tru tru Teslin pas dɛn saplae am ɔnda di rayt brand ɛn gred aydentifikeshɔn. |
Teslin sabstret de sɔpɔt bɔku bɔku print tɛnkɔlɔji dɛn, bɔt di kɔrɛkt gred na prɔses-spɛsifi k. Kad faktri dɛn fɔ tɛst imej density, dot geyn, drying ɔ curing, toner adhesion, variebul-data kwaliti, rejista ɛn post-lamination apinans bifo dɛn apruv bulk matirial.
| Print Prɔses | Rikɔmɛnd Kwalifayeshɔn | Ki Risk fɔ Chɛk |
|---|---|---|
| Ɔfset Litografi | Kɔnfɛm ink siriɔs, di we aw dɛn de drɛy, di totɛl ink kɔvarej ɛn di shit fidin. | Set-off, ink absכpshכn bεlε, kכla dεnsiti εn distorshכn afta laminεshכn. |
| Fɔ Print na Skrin | Validate ink kemistri, mesh, diposit tiknes en curing kondishon. | Blɔk, brit ink layers ɛn laminate bonding oba ebi ink kɔvarej. |
| Laser / Dray Toner we yu kin yuz | Yuz wan gred we kwalifay fɔ di rayt printa ɛn di fiuz-tɛmpracha rɛnj. | Kul, shrinkage, toner ofset, jamming ɛn toner adheshon. |
| Inkjet we dɛn mek wit day | Spɛsifik wan fayn inkjɛt gred lɛk IJWP usay dɛn nid am. | Blɔd, ɔva-satyureshɔn, drying tɛm, kɔlɔ density ɛn wata rɛsistɛns. |
| HP Indigo / Dijital Prɛs | Kɔnfɛm di gred we dɛn dɔn gri fɔ ɛn di rayt prɛs mɔdel. | Blanket kompitibiliti, opareshɔn winda, ink transfa ɛn adheshon. |
| Tεmכl Transfεr εn Vεriεbul Data | Test ribin tayp, print ɛnaji, barɔd gred ɛn abrashɔn rɛsistɛns. | Po ed difinishɔn, lɔw kɔntrast ɔ data damej we dɛn de lamin. |
Kwalifayeshɔn rul: 'Ɔfset / skrin / dijital kɔmpatibl' nɔ min se wan gred na ɔtomɛtik fit fɔ ɛvri printa. Faynal aprɔval fɔ yuz di pɔsin we bay in aktual printa, ink ɔ toner, artwok kɔvarej ɛn prodakshɔn spid.
Wan tipik RFID ɔ sikyuɔr kredibiliti kin jɔyn print Teslin layers wit wan kɔntaktlɛs inlay ɛn ɛksternal protɛktiv film dɛn. Di fainal strɔkchɔ fɔ bi ɛnjinɛri as kɔmplit sistɛm pas fɔ evalyu di sɛntetik pepa nɔmɔ.
| Layer | Tipik Fɔnkshɔn | Aprɔval Point |
|---|---|---|
| Front Ɔvlay ɔ Laminat | I de protɛkt printin ɛn i kin gɛt ɔlografik, UV ɔ sɔfayz sikyɔriti ficha dɛn. | Klari, bonding, abrashɔn, kɔl ɛn pɔsnalayzeshɔn kɔmpatibiliti. |
| Front Printed Teslin Layer we dɛn dɔn print | I de kɛr foto, tɛks, grafik, barɔd, QR kɔd ɛn sikyɔriti print. | Print gred, rɛjista, imej kwaliti ɛn laminat adheshon. |
| RFID Inlay / Chip ɛn Antena | Provayd di kɔntaktlɛs ilɛktronik fɛnshɔn. | Frikyuɛnsi, protɔkɔl, ɛntena pozishɔn, chip ayt, rid rɛnj ɛn ɛnkɔdin. |
| Bak Print Teslin Layer we dɛn dɔn print | Balans di kɔnstrɔkshɔn ɛn kɛr rivas-sayd grafik ɔ data. | Gren/dayrɛkshɔn, tiknɛs simɛtri ɛn print-laminɛshɔn kɔmpatibiliti. |
| Bak Ɔvlay ɔ Laminat | Gi protɛkshɔn ɛn fayn kad sɔfays pefɔmɛns. | Pil trɛnk, skrach rɛsistɛns ɛn magnɛtik strɛp/sayn panɛl kɔmpatibiliti. |
Di laminate fɔ mach to di Teslin gred, print prɔses ɛn finish-kad tiknes. Kad faktri fɔ verify laminate kemistri, tik, mɛlt ɔ aktiveshɔn rɛnj ɛn fayn peel pefɔmɛns. Di sem lamination resipi nɔ fɔ asum fɔ PVC, PET, PETG ɛn PC kɔva film.
Di tɛmpracha we pasmak ɔ di tɛm we yu de de kin mek yu shrinkage, kɔl, imej muvmɛnt ɔ RFID kɔmpɔnɛnt strɛs. If yu nɔ gɛt ɔt ɔ prɛshɔn, dat kin mek di bɔdi wik. Rikɔd platin ɔ rol tɛmpracha, prɛshɔn, tɛm fɔ de, tɛm fɔ kol ɛn stak kɔnstrɔkshɔn di tɛm we dɛn de gri fɔ di sampul.
Afta lamineshɔn, inspɛkt kad flatnɛs, ed intɛgriti, kɔna kwaliti, tik, fleks rɛsistɛns ɛn ilɛktronik pefɔmɛns. RFID rid tɛst fɔ ripit afta lamination ɛn day kɔt bikɔs antena tuning ɛn chip kɔnɛkshɔn kin afɛkt di fayn kad strɔkchɔ.
Teslin sabstret de yuz usay print durabiliti, laminate bonding ɛn protɛkshɔn fɔ ɛmbaded data ɔ ilɛktroniks impɔtant. Dɛn fɔ gri fɔ di kɔrɛkt matirial gred ɛn kɔmplit kad kɔnstrɔkshɔn fɔ ɛni ɛnd yus.
RFID akses kɔntrol kad ɛn wokman kredibiliti
NFC mɛmbaship, lɔyalti ɛn gɔst-savis kad dɛn
Di ɔtel ki kad dɛn bin mach to di spɛsifikɛd lɔk-sistim chip
Sikyuɔr ID kad, pɔmit ɛn gɔvmɛnt kredibiliti
Inshɔrans, laybri, wɛlbɔdi biznɛs ɛn ɛdyukeshɔn kad dɛn
Ivent pas, ki tag ɛn durable laminated badge
Smat kad dɛn we gɛt chip, ɛntena, magnɛtik strɛp ɔ barɔd
Peyment ɛn gɔvmɛnt program dɛn: dɛn fɔ mek yu fit fɔ gɛt bank kad, ɔfishal aydentiti kredibiliti ɔ rigyuletɛd sikyɔriti program dɛn tru di pɔsin we gi am in tɛknikal spɛsifikɛshɔn, sikyɔriti rikwaymɛnt ɛn sɛtifiket dɛn we dɛn nid. Matirial sɛlɛkshɔn nɔmɔ nɔ de sho se dɛn de fala di lɔ.
| Inspekshɔn Aytem | Wetin fɔ Kɔnfɔm |
|---|---|
| Matirial Aydentiti | Brand, prodak gred, lot nɔmba ɛn sɔpɔtin spɛsifikɛshɔn dɔkyumɛnt dɛn. |
| Tiknɛs ɛn Besis Weyt | Nominal valyu, gri tolɛreshɔn ɛn mɛzhɔmɛnt we. |
| Dimenshɔn dɛn fɔ di Sheet | Lɛngth, wit, skwea, ed kɔndishɔn ɛn kɔt dairekshɔn. |
| Aw a luk | Wait, sɔfa yunifom, dɔst, mak, wrinkles ɛn kɔntaminɛshɔn. |
| Fɔ print | Kɔlɔ density, imej rɛsɔlɔshɔn, barɔd ridabiliti, toner/ink adheshon ɛn drying. |
| Laminɛshɔn we dɛn kin yuz | Pil trɛnk, bɔbul, silva, kɔl, shrinkage ɛn visual distɔrshɔn. |
| RFID Pɔfɔmɛnshɔn | Chip rispɔns, rid rɛnj, ɛnkɔdin, UID/data verifyeshɔn ɛn post-laminɛshɔn yield. |
| Kad we dɛn dɔn dɔn | Tiknɛs, flatnɛs, fleks, edj kwaliti, abrashɔn ɛn envayrɔmɛnt tɛst dɛn we di pɔsin we de bay nid. |
Submit projɛkt data: kad yus, finish saiz, layt strɔkchɔ, printa mɔdel, laminate ɛn RFID inlay.
Kɔnfɛm matirial: tru tru Teslin brand stetɔs, gred, tiknɛs, sheet saiz ɛn di dɔkyumentri we dɛn nid.
Rɔn print trayal: evalyu imej kwaliti, vayriɔbul data, barɔd ɛn ink ɔ tona adheshon.
Run lamination trials: rεkכd di ful tεmprachכ, prεshכn, dwεl εn kol rεsipi.
Test finish kad: inspek peel, fleks, day kot, apinans en RFID pefomans.
Apruv di Golden Sampul: yuz di sampul we dɛn sayn ɛn di spɛsifikɛshɔn we dɛn gri fɔ as di bɔlk-prɔdakshɔn rɛfrɛns.
| we dɛn nid Ɛgzampul | dɛn |
|---|---|
| Di Tin dɛn we Dɛn nid | Jɛnɛral PPG TESLIN® ɔ di ikwal we dɛn dɔn gri fɔ; SP, TS, IJWP, Dijital ɔ Sikyuriti Gred. |
| Tik ɛn Sayz | Nominal maykron/mil, A4 ɔ kɔstɔm shit dimɛnshɔn, kɔt tolɛreshɔn ɛn kwantiti. |
| Ikwipmɛnt fɔ Print | Ɔfset prɛs, skrin layn, lɛsa printa, inkjɛt mɔdel, HP Indigo ɔ ɔda dijital prɛs. |
| Kad Kɔnstrɔkshɔn | Frɔnt/bak laminat, Teslin layers, RFID inlay, magnɛtik strɛp, signɛshɔn panɛl ɛn fayn tiknɛs. |
| RFID Sistem fɔ di RFID | Chip, frikshɔn, protɔkɔl, ɛntena layout, rida mɔdel, ɛnkɔdin ɛn target rid distans. |
| Test ɛn Dokumɛnt dɛn | TDS, inspekshɔn ripɔt, sampul kwantiti, kɔmplians diklareshɔn ɛn lɔt traysabiliti. |
| Ditiɛl dɛn bɔt Kɔmishɔn | Trayal kwantiti, anual dimand, dilivri dɛstineshɔn, pak ɛn Incoterm. |
Shit fɔ protɛkt frɔm dɔst, mɔstɔ, ed damej, bɛnd ɛn ɔt we dɛn nɔ kɔntrol we dɛn de kip ɛn transpɔt. Di pak kin inklud sial insay rap, rigid katon, palet protɛkshɔn, kɔstɔm lɛbl ɛn lɔt aydentifikeshɔn akɔdin to di ɔda we dɛn gri.
Kip di matirial flat insay di fɔs pak ɛn alaw am fɔ aklimatiz to di printrum bifo yu opin. Spɛsifi k stɔrɔj kɔndishɔn ɛn shelf-layf gayd fɔ fala di kɔnfyus gred dɔkyumentri ɛn spɛsifikɛshɔn fɔ di saplay.
Wallis de sɔpɔt kad manifakta ɛn kɔnvɔta wit matirial sɛlɛkshɔn, kɔstɔm shit kɔt, sampul tɛst ɛn wan-stɔp kɔdineshɔn fɔ kad kɔr shit, ɔvlay, RFID inlay ɛn finish-kad strɔkchɔ.
Teknik diskishɔn bays pan di aktual printa, laminate ɛn RFID sistem
Kastom sheet saiz, tiknes selekshɔn, kɔt ɛn pak sɔpɔt
Sampul ɛn Golden Sampul aprɔval bifo bɔku bɔku prodakshɔn
Kɔdinɛshɔn fɔ kad sabstret, ɔvlay, inlay ɛn rilayt kad matirial
Ekspɔt pak, shipmɛnt mak ɛn prɔjek dɔkyumentri sɔpɔt
Nɔ. TESLIN® na wan rɛjista PPG brand fɔ wan spɛshal maykroporous, polyolefin-bɛs sɛntetik sabstret. Ɔda sintetik pepa dɛn kin gɛt difrɛn kɔmpɔzishɔn, print bihayvya ɛn lamination pefɔmɛns.
Teslin sabstret na PPG de mek am. Wallis kin akt lɛk kad-matirial saplay ɔ kɔnvɔta. Di kot fɔ sho klia wan di brand, gred, tik ɛn sɔpɔt dɔkyumɛnt dɛn we de insay di sapɔt skɔp.
Di ansa dipen pan di printa, laminate, thermal cycle, kad strɔkchɔ ɛn sikyɔriti rikwaymɛnt. SP, TS, IJWP, Dijital ɛn Sikyuriti gred dɛn de du difrɛn tin dɛn, so dɛn nid fɔ gɛt sampul kwalifayeshɔn.
Yɛs, bɔt dɛn fɔ pik di kɔrɛkt gred. Day-based inkjet aplikeshɔn dɛn kin nid fɔ gɛt print-ɔptimayz gred lɛk IJWP. Printa, ink, drying ɛn wata-rɛsistɛns tɛst fɔ dɔn bifo dɛn prodyuz.
Di gred dɛn we fit kin bi we dɛn kin print wit lɛsa, bɔt dɛn fɔ tɛst di ɛksaktɔl printa mɔdel, di fiuz tɛmpracha, di tik we di shit tik, di kɔl ɛn di tona adheshon. Jɛnɛrik kɔmpitibliti klem nɔ inof fɔ prodakshɔn aprɔval.
Nɔ, Teslin na di sabstret we dɛn kin print ɔ we dɛn kin mek fɔ mek di kad. Di RFID fɛnshɔn kɔmɔt frɔm wan sɛpret chip ɛn ɛntena inlay we dɛn fɔ pik fɔ di frikshɔn, protɔkɔl ɛn rida sistem we dɛn nid.
I maykroporous strɔkchɔ kin gi kusɛn insay wan prɔpa dizayn laminated kredibiliti. Protɛkshɔn stil dipen pan chip ayt, ɛntena layout, laminate choice, prɛshɔn, tɛmpracha ɛn finish-kad tɛst.
Nɔ. I kin riples ɔ kɔmplit PVC insay sɔm strɔkchɔ dɛn, bɔt dɛn fɔ ebul fɔ evaluate di kad stiffness, tiknes, print prɔses, laminate kemistri, envayrɔmɛnt ɛksplɔshɔn ɛn rigyuletɔri rikwaymɛnt fɔ ɛni prɔjek.
Di sintetik sabstret nɔ de mek wata ɛn mɔstɔ, bɔt di we aw di fayn kad go de te, i dipen bak pan printin, laminate sil, kɔt ed, adeziv ɛn ɛmbaded kɔmpɔnɛnt dɛn.
Custom sheet cutting ɛn tiknes sɛlɛkshɔn kin rivyu. Avaylabl dipen pan di Teslin gred we yu dɔn pik, masta-shit fɔmat, ɔda kwantiti ɛn di tin dɛn we yu nid fɔ kɔt.
Di wan dɛn we de bay fɔ tɛst print kwaliti, toner ɔ ink adheshon, lamination peel, shrinkage, curl, day cutting, finished-card flex ɛn RFID rid pefɔmɛns yuz di aktual prodakshɔn ikwipmɛnt.
Gi di brand ɛn gred we dɛn nid, tiknɛs, shit saiz, printa mɔdel, laminat strɔkchɔ, RFID chip ɛn ɛntena, kwantiti, dɔkyumentri nid, pak ɛn delivri dɛstineshɔn.
