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WLS-INKJƐT SHEET
WALLIS
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| Tik : | |
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Wallis 500 maykron PETG shit fɔ paspɔt data pej projɛkt dɛn dɔn divɛlɔp fɔ sikyɔriti-dɔkyumɛnt manifakta dɛn, kad laminatɔ dɛn, gɔvmɛnt-dɔkyumɛnt kɔntrakta dɛn ɛn aydentifikeshɔn-matirial distribyushɔn dɛn we nid transparent, translucent-wayt ɔ opaque-wayt PETG layers. Kastom gej frɔm 60 to 500 maykron, wit we go rich 1200mm, mat sɔfays ɛn prɔjek-spɛsifi k ɔptik prɔpati dɛn kin tɔk bɔt fɔ bɔlk B2B saplai.
PETG kin gi klia, tafnɛs, print kɔmpatibiliti ɛn lamineshɔn pefɔmɛns fɔ sɔm paspɔt, aydentifikeshɔn-kad ɛn sikyɔriti-dɔkyumɛnt kɔnstrɔkshɔn dɛn. Bɔt, jenɛrik PETG nɔ fɔ ɔtomɛtik diskrayb as ay-kɔntrast lɛsa-ɛngrav matirial. Laser rispɔns, imej density, dimɛnshɔnal stebiliti, layt adheshon ɛn kɔmplit-dɔkyumɛnt durabiliti fɔ validet yuz di bayer in aktual laser sistem ɛn multilayer strɔkchɔ.
Di mɔdan ay-sikyɔriti paspɔt data pej dɛn kin yuz laser-responsive polycarbonate bikɔs in layers kin fɔm wan monolithic strɔkchɔ afta lamination. PETG projɛkt dɛn fɔ so posishun kɔrɛkt wan: as transparent ɔ wayt sikyɔriti-dɔkyumɛnt shit, sɔpɔt layt, print layt ɔ ɔda sabstret fɔ apruv kɔnstrɔkshɔn—nɔto as garanti riplesmɛnt fɔ ɛvri polycarbonate paspɔt data pej.
| Tayp fɔ Prodakt | Transparent, translucent-wayt ɔ wayt PETG sheet fɔ paspɔt data pej ɛn sikyɔriti-dɔkyumɛnt prɔjek dɛn |
| Tiknɛs Rɛnj | 60–500 maykron; 500 maykron de fכ projεkt dεm we nid fכ tik strכkchכral layεr |
| Maksimal Width we pɔsin kin gɛt | I go rich 1200mm, we yu nid fɔ tik, flat, kɔt ɛn pak |
| Di Opshɔn dɛn fɔ di Surface | Mat, fayn mat, smol ɔ projɛkt-spɛsifi k printabl sɔfays we gɛt sampul aprɔval |
| Praymari Aplikeshɔn dɛn | Paspɔt data pej trayal, sikyɔriti ID kad, akses kad, badge, print sikyɔriti layt ɛn dɔkyumɛnt laminat |
| B2B Sɔpɔt | Sampul, kɔstɔm kɔt, printin tray, laser-rɛspɔns tɛst, laminɛshɔn tray, QC spɛsifikɛshɔn ɛn ɛkspɔt pak |
Rikwest PETG Sekyuriti Shit Sampul dɛn
Standard PETG na valyu fɔ tafnɛs, klia ɛn laminɛshɔn, bɔt ay-kɔntrast greyskel lɛsa pɔsnalayzeshɔn nid fɔ gɛt spɛshal ɛnjɛnɛri lɛsa-rɛspɔnsiv fɔmyulashɔn. Di wan dɛn we de bay fɔ tɛst pɔtrɛt kɔntrast, tɛks shapnɛs, barkɔd ridabiliti, engraving dip, ɔt distɔrshɔn ɛn ripit bifo dɛn diskrayb wan PETG layt as laser engravable.
Polycarbonate na tin we dɛn kin pik bɔku bɔku wan fɔ di mɔdan paspɔt data pej dɛn bikɔs bɔku layers kin fiuz witout kɔvɛnshɔnal adeziv ɛn sɔpɔt ɛmbaded laser-personalized infɔmeshɔn. Wan PETG sɔlvishɔn fɔ evalyu agens di isyu ɔtoriti in dɔkyumɛnt dizayn, durabiliti plan, pɔsnalayzeshɔn ikwipmɛnt ɛn sikyɔriti rikwaymɛnt.
Wan pɔsin we de gi shit nɔ go ebul fɔ sɛtify paspɔt na intanashɔnal aksept. ICAO Doc 9303 rikwaymɛn dɛn de aplay to di kɔmplit travul dɔkyumɛnt we mashin kin rid, we inklud layout, data we mashin kin rid, chip fɛnshɔn usay i apɔynt, sikyɔriti dizayn ɛn ishu kɔntrol. Dɛn fɔ asɛs di bɔdi we go de fɔ lɔng tɛm bak na di paspɔt buk we ful-ɔp wit pɔsin in yon.
Transparent ɛn Wayt PETG Layers
Sekyuriti Dokumɛnt Matirial Trial dɛn
| Paramita | Spɛsifikeshɔn ɛn B2B Bay Notis |
|---|---|
| Polima we dɛn kɔl | PETG ɔ prɔjek-spɛsifi k modifyed PETG ; ekzak gred ɛn aditiv pakej fɔ fiks bay prodak kɔd |
| Tik we i tik | 60–500μm, ɛn di ɔda wan dɛn; difayn avrej tiknes εn poynt-to-pכynt tכlerεns fכ εvri כda |
| Wayd | Maksimal 1200mm na di; kɔstɔmayz sheet lɔng ɛn kɔt fɔmat de sɔbjɛkt fɔ rivyu |
| Kɔlɔ / Opasiti | Klia, translucent wayt, opaque wayt ɔ kɔstɔmayz tint wit gri optik target |
| Sho | Mat, fayn mat ɔ smol; wan-sayd ɔ tu-sayd tritmɛnt we de ɔnda printin ɛn lamineshɔn trayal |
| Di Kɔmpatibiliti fɔ Print | Ɔfset, silk skrin, UV ɛn ɔda sikyɔriti-printin sistem dɛn afta ink ɛn sɔfayz validɛshɔn |
| Laser Pɔsnalayzeshɔn | Na fɔ wan kɔnfyus laser-rɛspɔnsiv gred ɛn aprɔv laser paramita dɛn nɔmɔ; jenɛrik PETG pefɔmɛns nɔ fɔ asum |
| Fɔmat fɔ di Sapɔt | Kɔt sheet ɔ rol dɛn akɔdin to di gej, wit, waynd, sɔfa ɛn kɔnvɔyt rikwaymɛnt |
Wan 500μm PETG shit rili tik fɔ wan singl sikyɔriti-dɔkyumɛnt layt. I kin evalyu as strɔkchɔral kɔr, sɔpɔtin shit, tik wayt layt ɔ sabstret fɔ sɔm kad ɛn data-pej kɔnstrɔkshɔn dɛn we dɛn dɔn pik. Di fainal layt plan fɔ akɔn fɔ transparent Overlay film s, print film, sikyɔriti ficha, adeziv ɔ tay layt, hinj intagreshɔn ɛn ɛni ɛmbaded chip ɔ ɛntena.
| Posisibul Layer Fɔnkshɔn | Dizayn Rikwaymɛnt |
|---|---|
| Wait Strukchɔral Kɔr | Opasiti, tiknɛs tolɛreshɔn, flatnɛs, print rɛjista ɛn dimɛnshɔnal stebiliti |
| Transparent Sɔpɔt Laya | Haz, klia, inklushɔn, winda dizayn ɛn kɔmpatibiliti wit print ɔ layz-rɛspɔnsiv layers |
| Di Sikyuriti Lay we dɛn dɔn print | Surface enaji, ink adheshon, drying, rejista en lamination resistans |
| Layer-Rɛspɔnsiv Layer | Speshal fɔmyulashɔn, ay-rɛzolushɔn greyskel, kɔntrol dip ɛn limited ɔt distɔrshɔn |
| Ilɛktronik Inlay Sɔpɔt | Chip kaviti, antena protɛkshɔn, adhesive kɔmpatibiliti, prɛshɔn distribyushɔn ɛn RF pefɔmɛns |
Balans frɔnt ɛn bak layers kin ɛp fɔ kɔntrol wɔp afta dɛn dɔn ɔt ɛn kol. Mashin dairekshɔn, transvas dairekshɔn, print kɔvarej ɛn sɔfayz tɛkstɔr fɔ rikodɔ so di aprɔv stak kin riprodyuz insay prodakshɔn.
Lamineshɔn prɛshɔn, tɛmal shrinkage, adhesive flɔ, printin ɛn ɛmbaded kɔmpɔnɛnt dɛn kin chenj fayn tiknɛs. Mɛzhɔ di ful kɔndishɔn, dɔn sampul pas fɔ abop pan prɛ-laminɛshɔn matirial valyu dɛn nɔmɔ.
| Laser Tɛst | Aprɔval Krayteria |
|---|---|
| Greyskayl Pɔtrɛt | di ditel fכ di fes, di tכnal rεnj, kכntrast, yunifכmiti εn ripitabiliti kכros di shit |
| Fayn Tɛks ɛn Maykrotɛks | Lijibiliti, edj shapnɛs, minim karakta saiz ɛn absɛns ɔf mɛlt halo |
| Barcode / Mak we pɔsin kin rid wit mashin | Skan ridabiliti, kwayɛt zon, kɔntrast ɛn dimɛnshɔnal akkuracy |
| Taktil ɔ Rilif Ficha | Kontrol ayt, edj kwaliti, durabiliti ɛn nɔ layt krak |
| Impekt we di tɛmal we dɛn de du | Nɔ nɔ akseptabl wɔp, bɔbul, wayt, delamination ɔ chip damej |
| Prɔses Window | Stebul autput akɔs aprɔv pawa, spid, frikshɔn, fɔs ɛn prodakshɔn-lɔt vɛryushɔn |
Laser paramita dɛn na mashin- ɛn fɔmyulashɔn-spɛsifi k. Wallis nɔ fɔ pablish wan yunivasal pawa ɔ spid sɛtin. Di bayer in laser spɔlayt, dɔkyumɛnt intagreta ɛn matirial injinia fɔ jɔyn an fɔ gri fɔ di pɔsnalayzeshɔn rɛsipɛkt.
| Optik Prɔpati | Wetin Mek I Impɔtant |
|---|---|
| Haze ɛn Klari | Afɛkt transparent winda, ɛmbaded grafik, inspekshɔn ɛn fayn vijual kwaliti |
| Wait ɛn Opasiti | Kɔntrol print kɔlɔ akkuracy, pɔtrɛt bakgrɔn ɛn ayd fɔ intanɛnt strɔkchɔ dɛn |
| Gloss ɛn Surface Tɛkstɔr | Influens glare, taktil fil, ink holdout, lamination rilis ɛn skan imej |
| Fluorescence we dɛn kin yuz fɔ mek tin dɛn | Sekyuriti-dɔkyumɛnt program dɛn kin spɛsifa kɔntrol ɔ lɔw bakgrɔn fluoresɛns ɔnda UV inspekshɔn |
| Kɔlɔ Kɔnsistɛns | Lot-to-lot L*, a*, b* kɔntrol de ɛp fɔ mek di dɔkyumɛnt apin ɛn pɔsnalayz kɔntrast |
Wait ɛn Translucent PETG Opshɔn dɛn
Transparent Sekyuriti-Dokumɛnt Layers
PETG sheet kin sɔpɔt print sikyɔriti grafik ɛn layt dɔkyumɛnt dizayn, bɔt di fim insɛf nɔ de mek ɔlogram, watamak ɔ tamper ɛvidɛns ɔtomɛtik wan. Ɛni sikyɔriti ficha nid fɔ gɛt wan dediket matirial, ink, optik divays ɔ prodakshɔn prɔses ɛn dɛn fɔ intagret am insay di apruv dɔkyumɛnt strɔkchɔ.
| Sekyuriti Ficha | PETG Integreshɔn Kɔnsidɛreshɔn |
|---|---|
| Guilloche ɛn Fayn-Layn Printin | Sɔfayz tritmɛnt, rɛjista, ink spred ɛn rizɔlt fɔ kɔntrol |
| UV -Flɔrosɛnt Printin | Bakgrɔn fluoresɛns, ink kɔmpatibiliti ɛn post-laminɛshɔn visibiliti nid fɔ gɛt aprɔval |
| Ink we kin chenj bay optik wan | Surface texture, ink tiknes, viewing angle ɛn Overlay film ifɛkt dɛn fɔ ebul fɔ evaluate |
| Holografik / DOVID Ficha | Hot-stamp, embedded ɔ laminated optik divays nid fɔ gɛt sɛpret spɔlayt ɛn bond tɛst |
| Windo we de transparent | Layer rejista, edj klia, optik distɔshɔn ɛn tamper-evident kɔnstrɔkshɔn na impɔtant tin |
| Maykrotɛks ɛn Hiden Imej | Printin ɔ laser teknɔlɔji fɔ ajɔst di rizɔlt ɛn inspekshɔn ripitabiliti we dɛn nid |
| Di we aw fɔ print we | dɛn nid fɔ validet |
|---|---|
| Ɔfset Printin we yu de print | Surface enaji, ink wet, drying, blok, fayn-layn rεsכlushכn εn laminεshכn rεsistεns |
| Silk Skrin we dɛn de print | Ink tiknes, solvent resistans, opasiti, kur ɛn layt bonding |
| UV Inkjet we dɛn kin yuz | Prayma, kur lɛvɛl, fleksibiliti, ɔda, adheshon ɛn ɔt ɛksplɔshɔn we dɛn de lamin |
| Sekyuriti Ink Sistem dɛn | Supplier aprɔval, inspekshɔn rispɔns, kemikal rɛsistɛns ɛn kɔmpatibiliti wit Overlay film s |
Korona ɔ plasma tritmɛnt kin go dɔŋ as tɛm de go. Di wan dɛn we de bay fɔ spɛsifa wan dain target, tɛst we, di tritmɛnt sayd ɛn maksimal intaval bitwin prodakshɔn ɛn printin.
Di fɔs ink adheshon nɔ go du. Print sɛmpul dɛn fɔ lamin, kol, fleks ɛn ɛksplɔz to di envayrɔmɛnt kɔndishɔn we dɛn de ɛkspɛkt bifo di ink ɛn prayma sistɛm kɔmɔt.
PETG kin izi fכ laminate pas sכm hכy tεmprachכ polimכr dεm, bכt di kכrekt tεmprachכ, prεshכn, dwεl εn kol saykl dipכnt pan di εksakεt fכmyuleshכn εn layεr stak. If di wam wam pasmak, i kin mek i shrinkage, i kin mak di say we i de, i kin blok, i kin mek di optik distɔrshɔn ɔ i kin mek di chip pwɛl.
Kɔndishɔn ɔl di matirial dɛn: Stebul PETG , print layers, Overlay film s, hinj film ɛn inlays ɔnda kɔntrol tɛmpracha ɛn humiditi.
Kɔnfɔm layt ɔryenteshɔn: Rikɔd mashin dairekshɔn ɛn sɔfa sayd fɔ ɛvri sheet.
Rɔn wan step tɛmpracha trayal: No di saykl we smɔl pas ɔl we de ajɔst di bond we dɛn nid witout distorshɔn we nɔ akseptabl.
Kontrol prɛshɔn distribyushɔn: Protɛkt chips, ɛntena, optik ficha ɛn transparent winda frɔm lokal prɛshɔn we pasmak.
Kul ɔnda kɔntrol kɔndishɔn: Kul rit ɛn prɛshɔn de inflɔws flatnɛs, haz ɛn rɛsɛdyual strɛs.
Kɔndishɔn bifo yu tɛst: Mekɔp di tik, shrink, kɔl ɛn pil trɛnk afta di tɛm we dɛn gri fɔ mek yu wɛl.
Dokumɛnt di apruv rɛsipɛkt: Fiks plet finish, rilis fim, stak sikyud, tɛmpracha, prɛshɔn, tɛm ɛn kol.
PETG -to- PETG , PETG -to- PC , PETG -to-TPU ɛn PETG -to-printed-layer bɔnd kin nid difrɛn tay layers. Adhesive choice fɔ tink bɔt transparency, ɔt resistans, humidity aging, kemikal resistans ɛn tamper-evident failure mod.
Multilayer Lamineshɔn Evalueshɔn
Layer Bond ɛn Stebiliti Tɛstin
| Kɔmpɔnɛnt | B2B Valideshɔn Rikwaymɛnt |
|---|---|
| Chip we nɔ gɛt kɔntakt | Tεmכl εkspכzכn, prεshכn, kaviti disayn, ilektrikal fכnshכn εn post-laminεshכn rid/rayt tεst |
| Antena we dɛn kɔl | Jiometri, adeziv, kɔndɔkt intɛgriti, rɛsɔnans shift ɛn bɛnd durabiliti |
| Chip Modul Eria fɔ di ples | Lokal tik, strɛs kɔnsɛntreshɔn, sɔfa flatnɛs ɛn protɛkshɔn agens impak |
| Hinge Film we dɛn kɔl | Bonding to di data pej, tear propagation resistance, fleks saykl ɛn buklet intagreshɔn |
| Buklet Asɛmbli | Siwin, hinj pozishɔn, pej tɔn, kɔva intarakshɔn ɛn kɔmplit-buk durabiliti |
Paspɔt hinj matirial dɛn nid fɔ bɛnd ripit ɛn strɔng bon to di data pej. PETG shit nɔ fɔ prɛzɛnt as hinj sɔlvishɔn pas dɛn dɔn divɛlɔp wan dediket fleksibul hinj kɔnstrɔkshɔn ɛn pas kɔmplit-buk tɛst.
ISO /IEC 18745-1 de gi wan strɔkchɔ we fɔ evaluate di fizik durabiliti fɔ ful pɔsnalayz paspɔt buk dɛn we pɔsin kin rid wit mashin. So matirial kwalifayeshɔn fɔ go bifo frɔm shit tɛst to laminated data-pej tɛst ɛn las las to kɔmplit-buk tɛst.
| Test Kategori | Rikɔmɛnd Evalueshɔn |
|---|---|
| Dimenshɔn ɛn Flatnɛs | Pej saiz, tiknes, kɔl, edj lift ɛn optik-windo distɔrshɔn afta kondishɔn |
| Bɛnd ɛn Tɔshɔn | Ripit pej fleks, torshɔn, layt krak, hinj damej ɛn pɔrmanent difɔmeshɔn |
| Tɛmpratura ɛn Humiditi | Hot, kol, humid ɛn saykli ɛksplɔshɔn we dɛn de fala bay dimɛnshɔnal ɛn fɛnshɔnal chɛk |
| Abrashɔn ɛn Skrach | Surface wear, portrait readability, print-ficha lɔs ɛn haz inkris |
| Kεmikכl εn Kɔntaminεshכn | Skin ɔyl, tin dɛn fɔ klin, kɔsmɛtik, wata ɛn ɔda tin dɛn we gɛt fɔ du wit di tin dɛn we pɔsin kin si |
| Delamination ɛn Tamper Evidɛns | Pil rɛsistɛns, ed atak, ɔt atak ɛn visible damej afta ɔltɛrayshɔn tray |
| Mashin Ridabiliti | MRZ ridin, barɔd skan, chip kɔmyunikeshɔn ɛn inspekshɔn-sistim kɔmpatibiliti afta strɛs |
| Sɛlɛkshɔn Fakta | PETG | Polikabɔnɛt |
|---|---|---|
| Klari ɛn Print | Gud klia ɛn brayt printin pɔtnɛshɛl afta sɔfa validɛshɔn | I de insay transparent, wayt ɛn spɛshal sikyɔriti-fim gred dɛn |
| Laser Engraving we dɛn kin yuz fɔ mek tin dɛn | Rikways wan dediket laser-responsiv fɔmyulashɔn ɛn sistɛm validɛshɔn | Established hai-kontrast laser-personalization gred dem de plenti |
| Layer Fusion we dɛn kɔl | I kin laminate fayn, bɔt miks-matirial strɔkchɔ kin nid tay layers | Kompatibl PC layers kin fuz insay wan monolitik kɔnstrɔkshɔn |
| Risistɛns fɔ Ɔt | Lɔs pas PC ; di rayt gred ɛn di strɔkchɔ fɔ tɛst | Jɛnɛral wan ay ɛn fit fɔ dimand lɔng layf dɔkyumɛnt dɛn |
| Tipik Pozishɔn | Selekt sikyɔriti kad dɛn, print layers, transparent layers ɛn apruv dɔkyumɛnt prɔjek dɛn | ID kad dɛn we gɛt ay sikyɔriti, laysens fɔ drayv ɛn paspɔt data pej dɛn |
Sikyu ID ɛn akses kad: Print, laminated ɔ kɔntaktlɛs kredibiliti we nid fɔ taf ɛn kɔstɔm optik prɔpati.
Gɔvmɛnt ɛn institiushɔnal kad dɛn: Sɔpɔt layers fɔ prɔjek dɛn we spɛsifa PETG afta ful kwalifayeshɔn.
Di wokman ɛn visitɔ badge: Wayt ɔ transparent matirial fɔ sikyɔriti printin, barɔd ɛn RFID .
Sekyuriti lɛbl ɛn dɔkyumɛnt kɔmpɔnɛnt dɛn: Tik PETG sabstret usay tamper-evident kɔnstrɔkshɔn de sɛpret ɛnjinia.
Prototype security documents: Material trials fɔ optik winda, print layers, laser rispɔns ɛn multilayer bonding.
Dɛn fɔ kɔnfɔm se i fit fɔ ɛni aplikeshɔn. Wan matirial we dɛn dɔn gri fɔ fɔ wokman badge nɔ kin fayn fɔ paspɔt ɔtomɛtik wan, ɛn wan sheet we dɛn yuz as print layt nɔ kin kwalifay ɔtomɛtik wan as di laser-personalized data layer.
| Inspekshɔn Aytem | Rikɔmɛnd Kɔntrol |
|---|---|
| Tiknɛs Profayl | Avrej gej, kros-wɛb vɛryushɔn, pɔynt-to-pɔynt tolɛreshɔn ɛn lɔt kɔnsistɛns |
| Width ɛn Kɔt | Wid, lɔng, skwea, edj kwaliti, tɛliskɔp ɛn rol wayndin usay i apɔynt |
| Optik Kwaliti | Haz, klia, wayt, opasiti, glos, inklushɔn, blak spat, jel ɛn skrat |
| Kwaliti fɔ di Surface | Tekscha, roughness, dyne level, tritment sayd en protektiv-film kondishon |
| Dimɛnshɔnal Stebiliti | Hεt shrinkεj, kכl, rεsidyual strεs εn post-laminεshכn flatnɛs |
| Mekanikal Prɔpati dɛn | Tensile, elongation, impact, folding, tear ɛn brittleness we yu de yuz di we dɛn we dɛn gri pan |
| Prɔses Trial dɛn | Printin, laser rispɔns, lamination, peel, chip funkshɔn ɛn kɔt pan apruv sɛmpul dɛn |
| Traceability we pɔsin kin tray fɔ no | Prodakt kɔd, raw-matirial lɔt, ɛkstrushɔn de, sɔfa sayd, tritmɛnt de, rol/shit nɔmba ɛn inspekshɔn ripɔt |
Stebul sikyɔriti-dɔkyumɛnt shit saplai nid fɔ kɔntrol di ɛkstrushɔn, tiknɛs, optik kwaliti, sɔfays finish, kɔt, protɛktiv pak ɛn traysabiliti. Prodakshɔn sɛmpul dɛn fɔ kɔmpia wit di sayn rɛfrɛns bifo ɛni bɔlk shipmɛnt.
Shit Ekstrushɔn ɛn Prɔses Kɔntrol
Kastom Tiknɛs ɛn Width Saplai
Wallis de saplae rilayt PC ɛn kɔt- Overlay film matirial dɛn bak fɔ kɔstɔma dɛn we de kɔmpia PETG wit polikabɔnɛt sikyɔriti-dɔkyumɛnt strɔkchɔ dɛn. Di pikchɔ we de dɔŋ ya de sho wan rilayt polikabɔnɛt Overlay film prodak ɛn dɛn kip am frɔm di ɔrijinal pej; i nɔ fɔ prɛzɛnt as PETG prodak imej.
Rilat PC Overlay film Matirial fɔ Sikyuriti Dokumɛnt dɛn
Stɔr sheet ɔ rol dɛn na say we klin, dray ɛn we dɛn kin kɔntrol di tɛmpracha we de fa frɔm dairekt san layt ɛn hita.
Kip di matirial sial te i rich na di printin ɔ lamination rum fɔ ridyus di dɔst ɛn mɔstɔ.
Sɔpɔt flat sheet dɛn ivin ɛn avɔyd fɔ prɛs di palet pasmak we kin mek dɛn blok ɔ kɔl.
Protekt mat ɛn optik sɔfays frɔm finga prɛnt, skrach, ɔyl ɛn abrasive intalivin.
Kɔndishɔn di matirial bifo yu prosɛs am we di westɛm ɛn prodakshɔn-rum tɛmpracha difrɛn.
Yuz rap we nɔ de mek wata, katon we dɛn dɔn riinfɔs, kɔna protɛkshɔn ɛn ɛkspɔt palet.
Aplay fɔs-in, fɔs-ɔut kɔntrol ɛn richɛk dayn lɛvɛl ɛn flatnɛs afta yu dɔn kip am fɔ lɔng tɛm.
Protɛkt Wɛya ɛn Ɛkspɔt Pak
kכstכm tiknes kεpabiliti: PETG sheet dεm frכm 60 to 500 maykron εn widths te to 1200mm kin dכn tכk bכt.
Transparent ɛn wayt opshɔn dɛn: Optik prɔpati, opasiti, kɔlɔ ɛn sɔfayz tɛkstɔr kin mach to di prɔjek.
Divεlכpmεnt we de fכkus pan di prכsεs: dεn kin evalyu printin, lεzεr rεspכns, laminεshכn εn kכt bifo bכlk prodakshכn.
Sekyuriti-dɔkyumɛnt matirial pɔtfɔlio: PETG , PC , Overlay film s ɛn kad matirial dɛn kin kɔmpia fɔ di kɔnstrɔkshɔn we dɛn nid.
Rispɔnsibul tɛknikal pozishɔn: Prodakt klem kin tay to aktual tɛst data pas jenɛrik matirial asɔmpshɔn.
Factory-direct B2B supply: I fayn fɔ di wan dɛn we de intagret dɔkyumɛnt, di wan dɛn we de mek kad, di wan dɛn we de kɔnvɔyt, di wan dɛn we de import ɛn di wan dɛn we de sheb di matirial.
Aplikeshɔn: paspɔt data pej, ID kad, akses kad, badge ɔ print sikyɔriti layt.
PETG funkshɔn: strɔkchɔral kɔr, wayt layt, transparent layt, layt we dɛn kin print ɔ layt we kin ansa layz.
Rikwayd tik, tolɛreshɔn, wit, shit lɔng ɔ rol spɛsifikɛshɔn.
Klia, translucent wayt, opaque wayt, kɔstɔm tint, haz ɛn opasiti target.
Surface finish, roughness, tritmɛnt sayd ɛn target dayn lɛvɛl.
Printin we, ink sistem, sikyɔriti ficha ɛn artwok kɔvarej.
Laser manifakta, wevlɛnj, pɔsnalayzeshɔn tayp ɛn kɔntrast we dɛn nid.
Lay strɔkchɔ, adhesive ɔ tay layt, laminɛshɔn tɛmpracha, prɛshɔn ɛn saykl.
Chip, antena, hinj, optik winda ɛn kɔmplit-dɔkyumɛnt tɛst rikwaymɛnt dɛn.
Sampul kwantiti, ɛni ia fɔkɔs, dɛstineshɔn pɔt, pak ɛn delivri schedule.
Diskus Yu PETG Paspɔt Matirial Projɛkt
Nɔto ɔtomɛtik wan. High-contrast laser personalization nid fɔ gɛt wan rispɔnsiv fɔmyulashɔn ɛn apruv laser sɛtin. Jɛnɛrik klia PETG kin sho limited mak ɔ pasmak ɔt distɔrshɔn.
Nɔ. Polikabɔnɛt na wan establish matirial fɔ ay-sikyɔriti laser-pɔsɔnalayz data pej dɛn. PETG kin tink bɔt ɔl we di kɔmplit strɔkchɔ, sikyɔriti ficha dɛn, layz sistɛm ɛn durabiliti tɛst dɛn sɔpɔt in yus.
di kכrant prodakt rεnj na 60–500 maykron. Tiknɛs tolɛreshɔn, wit ɛn flatnɛs fɔ gri fɔ ɛni gej ɛn aplikeshɔn.
Wallis list wan maksimal wit we na 1200mm. Aktual avaylabl dipen pan gej, kɔlɔ, finish, sheet ɔ rol fɔmat, kɔt ɛn pak rikwaymɛnt.
Dɛn kin rivyu di opshɔn dɛn we klia, translucent-wayt ɛn opaque-wayt. Di wan dɛn we de bay fɔ difayn haz, opasiti, waytnɛs ɛn kɔlɔ tolɛreshɔn pas fɔ abop pan wan visual diskripshɔn nɔmɔ.
Yes, suitable trited or coated PETG kin evalyu fɔ ɔfset printin. Ink adheshon, drying, blok, fayn-layn rεsכlushכn εn lamination rεsistεns mכst tεst.
I kin kɔmpitabl afta yu dɔn pik di kɔrɛkt sɔfa tritmɛnt, prayma ɛn ink. Cure level, solvent resistance, flexibility ɛn post-lamination adheshon fɔ validet.
PETG kin bi pat pan wan strɔkchɔ we gɛt optik ɔ print sikyɔriti ficha dɛn, bɔt dɛn ficha dɛn de nid dediket matirial ɛn prɔses. Dɛn bond, visibiliti ɛn tamper bihayvya fɔ tɛst afta lamination.
Nɔ. Wan sikyɔriti transparent winda dipen pan layt dizayn, rɛjista, intagreted ficha dɛn, edj kɔnstrɔkshɔn ɛn rɛsistɛns to ɔltɛrayshɔn. Transparency nɔmɔ nɔto tin we de agens kɔmpitishɔn.
No say nɔ de we de ɔlsay na di wɔl. Tεmprachכ, prεshכn, dwεl εn kol mכst divεlכp fכ di εksakεt PETG gred, tiknes, print layεr dεm, adeziv dεm εn εmbaded kכmכpכnt dεm.
Di kɔmɔn tin dɛn we kin mek i gɛt bɔku ɔt, layers we nɔ balans, ɔriɛnteshɔn we nɔ kin kɔrɛkt, we nɔ kin kɔba di print we nɔ ivin, we i nɔ kin kol fayn, we kin mek i strɛs we lɛf ɔ we dɛn kin mɛzhɔ di sampul bifo dɛn kondishɔn am.
miks-matirial strכkchכ dεm kin divεlכp, bכt dεn kin nid wan kompatibl adhesive כ tay layεr. Pil trɛnk, optik kwaliti, ɔt ol ɛn tamper ɛvidɛns fɔ tɛst.
Dɛn kin ebul fɔ evalyu am as pat pan ilɛktronik dɔkyumɛnt strɔkchɔ. Chip tɛmpracha, lamineshɔn prɛshɔn, ɛntena rɛsɔnans, adhesive ɛn post-strɛs rid pefɔmɛns fɔ gɛt aprɔval.
Intanɛshɔnal akseptɛns de aplay to di kɔmplit paspɔt we gɔvmɛnt we gɛt ɔtorizeshɔn gi ɛn we dɛn mek fɔ di rilevɛns ICAO rikwaymɛnt dɛn. Wan raw PETG sheet bay insɛf nɔ gɛt intanashɔnal paspɔt aprɔval.
PETG de gi yusful tafnɛs, bɔt wan sɔfa we nɔ gɛt kɔt kin stil skrach. Skrach pefɔmans dipen pan tɛkstɔr, kɔtin, Overlay film , hanlin ɛn di dɔn dɔkyumɛnt kɔnstrɔkshɔn.
UV pefɔmɛns na gred-spɛsifi k. Nɔ mek lɔng tɛm UV -rɛsistɛns klem we nɔ gɛt aksɛleret wɛda, kɔlɔ-chenj, ɔptik ɛn mɛkanikal data fɔ di ɛksaktɔ fɔmyulashɔn.
PETG na teknikal risaykul insay wan kɔmpatib dediket strim, bɔt mɔltilayer dɔkyumɛnt dɛn we gɛt ink, adeziv, chip, ɛntena ɛn sikyɔriti divays dɛn kin nid spɛshal prɔsesin. Dɛn fɔ kɔnfyus di lokal kɔlɛkshɔn we de.
Stɔr di tin dɛn we dɛn dɔn sidɔm na say we klin, dray ɛn we dɛn kin kɔntrol di tɛmpracha, we nɔ de mek di san ɛn wam wam. Kip di say dɛn we dɛn dɔn protɛkt ɛn kɔndishɔn di matirial bifo yu print ɔ lamin.
Yɛs. Dɛn fɔ tɛst di sampul dɛn bay we dɛn yuz di printin, lɛsa, lamineshɔn, chip ɛn kɔmplit-dɔkyumɛnt prɔses we dɛn bin want bifo dɛn gri fɔ mek dɛn gi bɔku bɔku spɛsifikɛshɔn.
MOQ dipen pan tik, wit, kɔlɔ, opasiti, sɔfa, tritmɛnt, laser-responsiv fɔmyulashɔn, kɔt, rol ɔ shit pak ɛn ɛni ia dimand.
Gi di dɔkyumɛnt aplikeshɔn, layt fɛnshɔn, tiknɛs, wit, kɔlɔ, optik target, sɔfays, printin, lɛsa sistɛm, laminɛshɔn strɔkchɔ, chip rikwaymɛnt, kwantiti ɛn dɛstineshɔn.
Kɔntakt Wallis Plastic fɔ transparent, translucent-wayt ɛn wayt PETG shit fɔ paspɔt data pej trayal, sikyuɔr kad ɛn aydentifikeshɔn-dɔkyumɛnt prɔjek. Wi tim de sɔpɔt kɔstɔm gej ɛn wit, optik-prɔpati maching, printin ɛn laser-rɛspɔns tɛst, lamination trayal, QC spɛsifikɛshɔn ɛn faktri-dayrɛkt B2B saplai.
