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Polikabɔnɛt kɔr shit fɔ ID kad, drayvin laysens ɛn paspɔt data pej. Kastom tiknes, kala, opasiti, surface ɛn laserable gred, wit B2B sampul fɔ print, lamination ɛn tɛst.
WLS-PC Kɔr Shit
WALLIS
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| Sayz: | |
| Kwantiti: | |
Wallis polycarbonate core sheet de saplae to sekuriti printa, kad manifakta, inlay prodyusa, sistem intagreta en dokumɛnt kɔntrakta we de divɛlɔp multilayer aydentiti kredibiliti. Yu kin kɔnfigyut wayt, transparent ɛn prɔjek-spɛsifi k PC gred fɔ nashɔnal ID kad, drayvin laysens, rezidenshɛl pɔmit, i-paspɔt data pej, akses kredibiliti ɛn ɔda lɔng layf kad strɔkchɔ.
di tik we de fכm de frכm 50μm to 800μm , wit standad shit fכmat dεm lεk 505×590mm εn 295×485mm. Di wan dɛn we de bay kin spɛsifa tik, opasiti, kɔlɔ, sɔfays tɛkstɔr, printin tritmɛnt, laser rispɔns, protɛktiv fim ɛn ɛkspɔt pak akɔdin to di aprɔv dɔkyumɛnt kɔnstrɔkshɔn ɛn prodakshɔn ikwipmɛnt.
Impɔtant sɛlɛkshɔn not: 'PC kɔr shit,' 'printable PC film,' 'laserable PC film' ɛn 'transparent PC ɔvlay' de diskrayb difrɛn fɛnshɔnal layers. Laser mak pefɔmans na fɔmyulashɔn- ɛn layt-spɛsifi k; i mכs kכnfכm wit di aktual lεzεr sistεm, layt stak εn pכsכnalayzεshכn tכgεt bifo bכlk prodakshכn.
Ful-PC dokumɛnt strɔkchɔ: dɛn mek am fɔ kɔmpitabl polikabɔnɛt layers we de fiuz ɔnda kɔntrol ɔt ɛn prɛshɔn.
Projek-spɛsifi k printin: ɔfset, skrin ɛn UV printin kin evalyu wit di ink ɛn kɔring sistɛm we dɛn dɔn pik.
Laserable options: de we di layt we dɛn spɛsifa fɔ jenarayz kɔntrol greyskel ɔ blak kɔntrast.
OEM kɔnvɔshɔn: kɔstɔmayz tik, shit saiz, kɔlɔ, sɔfa ɛn pak fɔ industrial prodakshɔn.
Sampul validɛshɔn: printin, laminɛshɔn, lɛsa, kɔt ɛn finish-dɔkyumɛnt tɛst bifo kɔmɛshɔnal aprɔval.
Rikwest PC Kɔr Shit Sampul ɛn Tɛknikal Rivyu
Di valyu dɛn we de dɔŋ ya de diskrayb di kɔrɛnt prodak rɛnj ɛn di tipik rɛfrɛns data. Faynal tolerans, optik prɔpati, laser rispɔns, lamineshɔn paramita ɛn akseptans krayteria fɔ rikodɔ insay di apruv tɛknikal spɛsifikɛshɔn ɔ Golden Sampul fɔ ɛni prɔjek.
| Paramita | Avaylabl Spɛsifikeshɔn |
|---|---|
| Tin dɛn | Polycarbonate (PC) film ɔ sheet fɔ multilayer sikyɔriti-dɔkyumɛnt strɔkchɔ dɛn |
| Di Rol we pɔsin kin du fɔ wok | Kor, print kor ɔ projɛkt-spɛsifi k intanɛnt strɔkchɔral layt; konfam if di gred we yu pik na laserable |
| Tiknɛs Rɛnj | 50–800μm (0.05-0.80mm) ɛn di ɔda wan dɛn; fainal avaylabl dipכnt pan gred, kכla, sכfayz εn כda volyum |
| Standart Shit Sayz dɛn | 505×590mm, 295×485mm ɛn kɔstɔmayt dimɛnshɔn dɛn |
| Kɔlɔ ɛn Opasiti | Wait, transparent ɔ kɔstɔmayt; difayn opasiti, waytnɛs ɛn kɔlɔ tolɛreshɔn we nid de |
| Di Opshɔn dɛn fɔ di Surface | Mat, fayn mat, glos ɔ prɔjek-spɛsifi k tɛkstɔr; printin tritmɛnt we de bay gred |
| Di we aw Dɛn De Print | Ɔfset, silk-skrin ɛn UV printin we de ɔnda ink, prɛtritmɛnt, kɔring ɛn laminɛshɔn trayal |
| Laser Pɔsnalayzeshɔn | Laserable fɔmyulashɔn dɛn we de; spɛsifa laser wɛvlɛnj, fokal strateji, target kɔntrast ɛn layt pozishɔn |
| Laminɛshɔn we dɛn kin yuz | Kontrold ay-tεmpratura PC laminεshכn; tεmprachכ, prεshכn, dwεl εn kol de dipכnt pan di komplit stak |
| Ilɛktronik Integreshɔn | Yu kin evalyu wit kɔntaktlɛs inlay, kɔntakt mɔdyul ɛn transparent-windo strɔkchɔ |
| Di we aw dɛn de pak di tin dɛn | Protektiv film, moisture-resistant wrapping, katon, palet ɛn kɔstɔmayz batch lɛbl |
| MOQ ɛn Lid Taym | Konfam akɔdin to gred, dimɛnshɔn, kɔlɔ, sɔfa, tolɛreshɔn ɛn prodakshɔn schedule |
Dɛn figa ya yusful fɔ di fɔs injinɛri diskishɔn bɔt nɔto garanti yunivasal spɛsifikɛshɔn fɔ ɛvri PC gred. Di fainal TDS, inspekshɔn we ɛn tolɛreshɔn fɔ kɔnfyus fɔ di matirial we dɛn dɔn pik.
| Prɔpati | Dairekshɔn / Mɛtɔd | Yunit | Tipik Rifrɛns |
|---|---|---|---|
| Tik | — | g/cm⊃3 we de na di bɔdi; | 1,22 ±0,05. Di wan dɛn we de wok |
| Tensile Strɔng we pɔsin kin gɛt | Mashin / ɔrizɔntal | MPa | ≥50 |
| Tensile Strɔng we pɔsin kin gɛt | Transvas / vertikal | MPa | ≥50 |
| Vicat Softening Tɛmpratura | Spɛsifi k tɛst kɔndishɔn fɔ kɔnfɔm | °C | 145 ±2 |
| Surface Dyne Level we de na di wɔl | Tritmɛnt say we dɛn kin print | dinayn/cm | ≥38 |
| Tiknɛs Tolɛreshɔn | Projek-spɛsifi k mɛzhɔmɛnt plan | μm ɔ % . | Kɔnfɛm bay gred ɛn bay spɛsifikɛshɔn |
| Shrinkage / Flatnɛs we pɔsin kin gɛt | Afta apruv lamination saykl | — | Difain wit di komplit kad stak |
Wan sikrit polycarbonate dokumɛnt kin gɛt sɔm PC layers wit difrɛn wok dɛn. Yuz di kɔrɛkt tɛminɔlɔji na di RFQ de mek di wan dɛn we de bay nɔ gɛt transparent ɔvlay we dɛn nid opaque printabl kɔr, ɔ wan nɔ-laserable film we dɛn nid intanɛnt laser pɔsnalayzeshɔn.
| Lay Tayp | Praymari Fɔnkshɔn | Ki RFQ Kwɛshɔn dɛn |
|---|---|---|
| Wait / Opak PC Kor | Gi opasiti, kala bakgrɔn, tik ɛn strɔkchɔral sɔpɔt; kin kɛr grafik dɛn bak we dɛn dɔn print | Rikwayd tik, wayt, opasiti, sɔfa, printin we ɛn if laser rispɔns nid |
| Transparent PC Kor / Windo Film | Krio transparent eria, winda ɔ intanɛnt strɔkchɔral layers | Optik klia, haz, tɛkstɔr, tik, winda jɔyometri ɛn lamineshɔn kɔmpatibiliti |
| PC Film we yu kin print | Risiv ɔfset, skrin ɔ UV ink bifo lamination | Printin sayd, dain levul, ink sistem, curing, adheshon en kala target |
| Film PC we yu kin yuz laserable | Jenarayz kɔntrol laser kɔntrast fɔ tɛks, pɔtrɛt ɔ sikyɔriti grafik | Laser sistem, wevlɛnj, fokal dip, greyskel, blak density, taktil rikwaymɛnt ɛn layt pozishɔn |
| Nɔn-Laserable PC Ɔvlay | Protekt di print ɔ laserable layers witout ad unwanted laser riakshɔn | Transparency, surface texture, tiknes, skrach bihayvya ɛn plet rilis |
| Kot / Bonding PC Ɔvlay | Yuz wan kɔtin fɔ impɔtant bonding insay wan spɛsifikɛd haybrid ɔ print kɔnstrɔkshɔn | Kotin sayd, kompitibul sabstret, peel target, hεt saykl εn stכrej kכndishכn |
Di rayt nɔmba ɛn di pozishɔn fɔ di layers na di pɔsin we mek di dɔkyumɛnt de disayd. Di ɛgzampul we de kam biɛn ya de sho wetin mek dɛn fɔ pik di kɔr shit as pat pan wan kɔmplit stak pas fɔ pik am as isol komoditi.
| Ɛgzampul Pozishɔn | Posisibul Matirial | Pɔpɔshɔn ɛn Validɛshɔn |
|---|---|---|
| Ɔta Sɔfays | Transparent non-laserable ɔ protɛktiv PC ɔvlay | Surface texture, abrasion protection, optik klia ɛn kɔmpatibiliti wit pɔsnalayzeshɔn dip |
| Laser Pɔsnalayzeshɔn Layer | Transparent ɔ wayt laserable PC film | Portret, teks, greyskayl, CLI/MLI ɔ projɛkt-spɛsifi k laser grafik |
| Layer we dɛn print | Wait ɔ transparent PC fim we yu kin print | Guilloche, maykrotekst, UV grafik, bakgrɔn ɛn vayriɔbul dizayn ɛlimɛnt dɛn |
| Strukchɔral Kɔr | Wait, transparent ɔ kɔlɔ PC kɔr sheet | Bil de dokumɛnt tik, rigiditi, opasiti ɛn intanɛnt layt intɛgriti |
| Ilɛktronik Inlay Layer | PC-kompatibl antena ɛn chip inlay | Chip posishun, antena tuning, prɛshɔn distribyushɔn ɛn post-laminɛshɔn RF pefɔmɛns |
| Windo / Sekyuriti Layer | Transparent PC insεt ɔ kɔstɔmayz winda layt | Windo jɔyometri, rɛjista, edj fiushɔn ɛn optik kwaliti |
| Rivεs Layεr dεm | Miro print, laserable ɛn ɔvlay arenjmɛnt as dɛn disayn am | Balans tik, flatnɛs, bɛnd bihayvya ɛn finish dɔkyumɛnt simɛtri |
Kompatibl polycarbonate layers kin fכm wan kohεsiv kad bכdi כnda validet hεt, prεshכn εn kol saykl. Di sikyɔriti valyu kɔmɔt frɔm di kɔmplit bond kɔnstrɔkshɔn: layt fɔmyulashɔn, print ink, inlay dizayn, winda, ɔvlay ɛn pɔsnalayzeshɔn ɔl fɔ injinia togɛda.
Laserable PC gred kin mek tɛks, nɔmba, pɔtrɛt ɛn greyskayl infɔmeshɔn dɔŋ di dɔkyumɛnt sɔfa. Di gred we yu dɔn pik fɔ tɛst fɔ kɔntrast, rizɔlt, fokal dip, layt diskɔlɔreshɔn ɛn impak pan transparent ɔ print layers we de nia.
Wait opaque film kin ayd antena ɛn gi kɔntrol print bakgrɔn, we transparent film kin sɔpɔt winda ɛn optik sikyɔriti layout. Opasiti, waytnɛs, haz ɛn sɔfayz tɛkstɔr fɔ spɛsifa as valyu dɛn we dɛn kin mɛzhɔ usay di dɔkyumɛnt dizayn dipen pan dɛn.
PC kor sheet dem de yuz in elevated-temperature lamination sistem, bot dimenshonal pefomans dipen pan di gred en saikl. Mekɔp mashin-dayrɛkshɔn ɛn transvas shrinkage, shit kɔl, finish tik ɛn flatnɛs afta di aktual ɔt ɛn kol sikwins.
Di kɔrɛkt kɔr matirial dipen pan dɔkyumɛnt layf, pɔsnalayzeshɔn tɛknɔlɔji, prodakshɔn ikwipmɛnt, kɔst target ɛn kɔmplians rikwaymɛnt. PC nɔto ɔtomɛtik di bɛst chus fɔ ɛvri kɔmɛshɔnal kad, ɛn dɛn nɔ fɔ chenj PVC ɔ PETG to ful-PC sikyɔriti dɔkyumɛnt we dɛn dɔn gri fɔ we dɛn nɔ kwalifay bak.
| Selekshɔn Faktɔ | Polikabɔnɛt Kɔr | PVC Kɔr | PETG Kɔr |
|---|---|---|---|
| Tipik Program dɛn we dɛn kin du | Nashɔnal ID, drayvin laysens, rezidenshɛl pɔmit, paspɔt data pej ɛn sikyɔriti kredibiliti we go de te | Bank, mɛmbaship, gift, ɔtel, tɛlikɔm ɛn jenɛral kɔmɛshɔn kad | Kɔmishɔn kad ɛn sɔm sɛlɛkshɔn lɔwa-tɛmpracha durable ɔ ridyus-PVC strɔkchɔ dɛn |
| Lamineshɔn Sistɛm | Higher-temperature kompitibul PC stak wit kɔntrol kol | Konvɛnshɔnal PVC kad laminɛshɔn saykl | PETG-spɛsifi k ɔ kɔmpatibl haybrid saykl |
| Laser Pɔsnalayzeshɔn | Purpose-made laserable greds we dɛn kin yuz bɔku bɔku wan fɔ intanɛnt pɔsnalayzeshɔn | Jɛnɛral wan i kin abop pan printin ɔ ɔda pɔsnalayzeshɔn pas nɔmɔ dɛn mek am spɛshal wan | Sɔntɛm dɛn kin gɛt spɛshal gred dɛn; validet aktual laser bihayvya |
| Transparent Window dɛn | Wel fit fɔ ful-PC transparent-window dizayn dɛn we dɛn ɛnjinia am as stak | Posisibul wit insεt כ כvlay bכt difrεnt fכs bihayv | Posisibul in kompitibl PETG strכkchכ dεm |
| Miks we dɛn de miks di tin dɛn | Bɛst pefɔmɛns nɔmal wan nid fɔ gɛt validet kɔmpatibl layt famili | Haybrid strכkchכ dεm nid adheshon εn shrinkage trial | Haybrid strכkchכ dεm nid adheshon εn tεmral-saykl trial |
| Fit fɔ du sɔntin | Ful dɔkyumɛnt tɛst, sikyɔriti dizayn aprɔval ɛn prɔjek-spɛsifi k akseptɛns | Printin, lamination ɛn finish-kad validɛshɔn | Printin, lamination, durabiliti ɛn finish-kad validɛshɔn |
PC kor matirial kin spɛsifa insay multilayer gɔvmɛnt kredibiliti we nid durable kad jɔyometri, intanɛnt laser pɔsnalayzeshɔn ɛn intagreshɔn wit vijual ɔ ilɛktronik sikyɔriti ficha dɛn. Faynal suitability na di isyu ɔtoriti ɛn apruv dɔkyumɛnt spɛsifikɛshɔn de kɔntrol am.
Fɔ paspɔt data pej dɛn, di kɔr shit na jɔs wan pat pan di kɔnstrɔkshɔn. Di wan dɛn we de bay fɔ difayn bak hinj intagreshɔn, chip ɛn ɛntena plesmɛnt, transparent winda, layt sikyud, pɔsnalayzeshɔn teknɔlɔji, pej stiffnɛs ɛn buklet asɛmbli rikwaymɛnt.
Drayvin-laysens program dɛn kin yuz opaque ɛn transparent PC layers fɔ print grafik, laser portret, taktil ifɛkt ɛn infɔmeshɔn we mashin kin rid. Matirial akseptans fɔ inklud dimɛnshɔnal, optik, bɛnd ɛn pɔsnalayzeshɔn tɛst.
Di wokman we dɔn de wok fɔ lɔng tɛm, polis, sojaman, wɛlbɔdi biznɛs ɛn akses kredibiliti kin yuz PC strɔkchɔ dɛn we di prɔjek nid fɔ gɛt strɔng kɔnstrɔkshɔn ɛn kɔntrol pɔsnalayzeshɔn. Akses teknɔlɔji kɔmpatibiliti fɔ verify sɛpret frɔm di plastic sabstret.
PC-kompatibl inlays kin embed insay wan balans layt stak. Validate antena frikshɔn, chip pozishɔn, modul kaviti, kɔyl ɔ etched antena jɔyometri, lamination prɛshɔn ɛn rid pefɔmɛns bifo ɛn afta pɔsnalayzeshɔn.
| Kastamayzeshɔn Aytem | Opshɔn fɔ Tɔk bɔt | Infɔmeshɔn we Yu nid frɔm Baya |
|---|---|---|
| Tiknɛs ɛn Shit Sayz | 50–800μm rεnj, standad כ kכstכm-kכt shit dεm | Layer drowing, finished tiknes, plet saiz, koleshɔn ɛn kɔt layout |
| Kɔlɔ ɛn Opasiti | Wait, transparent ɔ prɔjek-spɛsifi k kɔlɔ | Kɔlɔ target, opasiti ɔ transmishɔn rikwaymɛnt, aprɔval we |
| Tekstɔr we de na di surface | Mat, fayn mat, glos ɔ spɛsifikɛd tɛkstɔr | Printin prɔses, plet finish, taktil target ɛn dɔkyumɛnt apinɛns |
| Di Tritmɛnt fɔ Print | Ɔfset, skrin ɔ UV-printabl sɔfays bay gred | Ink brand, curing sistem, dain target ɛn adheshon we |
| Laser Rispɔns we dɛn kin gi | Nɔn-laserable, laserable ɔ projɛkt-spɛsifi k kɔntrast | Laser ikwipmɛnt, wɛvlɛnj, fokal dip, blak dɛnsiti ɛn greyskel target |
| Fim we de protɛkt pɔsin | Wan-sayd ɔ tu-sayd protɛkshɔn usay i de | Pil dairekshɔn, klin-rum rikwaymɛnt ɛn prodakshɔn hanlin |
| Di we aw dɛn de pak di tin dɛn | Katon, palet, mɔstɔ barɛri ɛn prayvet lɛbl dɛn | Pak kwantiti, palet limit, dɛstineshɔn ɛn batch traysabiliti fɔmat |
Sɔbmit di dɔkyumɛnt stak: gi wan layt drɔin wit tik, fɛnshɔn, kɔlɔ, printin, lɛsa ɛn ilɛktronik ɛlimɛnt fɔ ɛvri layt.
Kɔnfɛm di kandidet gred dɛn: difrɛns di kɔr, printabl, lɛsa, nɔ-lɛsa ɛn kɔt matirial bifo dɛn kɔt sɛmpul dɛn.
Rɔn inkam inspekshɔn: rikodɔ tik, dimɛnshɔn, flatnɛs, apinans, kɔlɔ, protɛktiv film ɛn batch aydentifikeshɔn.
Print prodakshɔn sɛmpul dɛn: yuz di aktual ɔfset, skrin ɔ UV ink, kɔring sɛtin ɛn artwok kɔvarej.
Laminate di ful stak: yuz di plan stɛl plet, kusɛn, rilis layers, prɛshɔn, ɔt ɛn kol sikwins.
Test pɔsnalayzeshɔn: evalyu laser kɔntrast, greyskel, fokal dip, tɛks rizɔlt ɛn intarakshɔn wit print ɔ transparent ficha dɛn.
Kɔmplit dɔkyumɛnt tɛst dɛn: inspɛkt di rɛsistɛns fɔ di pil, flatnɛs, bɛnd, tɔshɔn, edj kwaliti, winda rɛjista ɛn RFID pefɔmɛns usay i apɔynt.
Apruv wan Golden Sampul: sayn di aksepted kɔnstrɔkshɔn, prɔses winda, inspekshɔn we, pak ɛn difɛkt krayteria bifo bɔlk saplai.
Diskus Yu PC Kad Stak wit Wallis
| Inspekshɔn Stej | Rikɔmɛnd Chɛk | B2B Akseptans Besis |
|---|---|---|
| Matirial we de kam insay | Tiknes map, sheet dimɛnshɔn, skwea, flatnɛs, sɔfays dɛfɛkt, protɛktiv film ɛn batch lɛbl | Aprɔv spɛsifikɛshɔn, sampling plan ɛn kalibrayt mɛzhɔmɛnt mɛtɔd |
| Optik Prɔpati dɛn | Wait, difrɛns pan kɔlɔ, opasiti, transmishɔn, haz ɛn glos usay i apɔynt | Baya-difayn inschrumɛnt, iluminant, bak ɛn tolɛreshɔn |
| Fɔ print | Dyne levul, wetin, imej density, ink adheshon, curing, blok en kala konsistens | Aktual ink sistem ɛn apruv print sampul |
| Laminɛshɔn we dɛn kin yuz | Layεr rεjistεshכn, fכs, pil bihayvya, shrinkεj, kכl, bכbul, plet rilis εn finish tik | Aprɔv ful-stak saykl ɛn kol sampul |
| Laser Pɔsnalayzeshɔn | Kɔntrast, greyskel, rizɔlt, fokal dip, ripit data ɛn edj artifakt | Aktual laser sistem ɛn apruv pɔsnalayzeshɔn fayl |
| Ilɛktronik Pɔfɔmɛnshɔn | Chip fכnshכn, antena kכntinyu, frikכnshכn rεspכns εn rid distans bifo εn afta laminεshכn | Spɛsifi k rida, tɛst pozishɔn ɛn ɛnkɔdin kɔndishɔn |
| Kɔnvɛnshɔn | Day kot, mil, panch, edj kwaliti, dimɛnshɔn ɛn modul kaviti pozishɔn | Aprɔv drɔin ɛn daunstrim ikwipmɛnt tolɛreshɔn |
| Di we aw dɛn de pak di tin dɛn | Surface protɛkshɔn, mɔstɔ barɛri, pak kwantiti, palet kɔndishɔn ɛn traysabiliti lɛbl dɛn | Purchase order ɛn apruv pak instrɔkshɔn |
| Isyu | Posisibul Kɔz | Chɛk ɛn Kɔrɛkt Akshɔn |
|---|---|---|
| Wik Layer Bonding we nɔ gɛt wan prɔblɛm | Gret we nɔ kɔmpitabl, we nɔ de ɔt, we nɔ gɛt inɔf prɛshɔn, ink barɛri we dɔn wɛl ɔ we gɛt kɔntaminɛshɔn | Kɔnfɔm layt famili ɛn ɔriɛnteshɔn; inspɛkt di ink we dɛn kɔba; ajɔst validet ɔt, prɛshɔn ɛn dwɛl winda |
| Kad Kul ɔ Warpage | Stak we nɔ balans, dairekshɔn shrinkage, nɔ ivin ɔt ɔ prɛshɔn rilis kwik | Balans layt tik; rikodɔ MD/TD dairekshɔn; kol ɔnda kɔntrol prɛshɔn |
| Lɔw Laser Kɔntrast | Rɔng gred, kɔrɛkt fokal dip, lɔw ɛnaji ɔ layz layt we dɛn posishun tu dip | Verifay fɔmyulashɔn ɛn layt pozishɔn; optimize laser parameters yuz wan kɔntrol tɛst matris |
| Laser Darkening we yu nɔ want | Laser-sensitiv matirial we dɛn yuz usay dɛn nid klia nɔ-riaktiv layt | Riples wit verified non-laserable film ɔ rivays fokal strateji ɛn layt sikwins |
| Ink Delaminɛshɔn | Lɔw sɔfayz ɛnaji, ink we nɔ kɔmpitabl, we nɔ kɔmplit fɔ mɛn ɔ we ink kɔba | Chek di dayne ɛn tritmɛnt ej; test ink adhesion bifo ɛn afta lamination |
| Antena ɔ Chip we pɔsin kin si | Insufisεnt opasiti, tin kכr, po kכmכpכnt plesmεnt כ prεshכn imprint | Inkris validet opasiti; rivays layt balans ɛn inlay kaviti; evaluate kusɛn ɛn stɛl plet sistɛm |
| Window Rejista Mistek | Kכt insεt tכlerεns, kolεshכn muvmεnt כ tεmral shrinkεj | Difayn X/Y rɛjista tolɛreshɔn; yuz alaynɛshɔn mak ɛn mɛzhɔ afta yu dɔn kol |
PC sheet dɛn fɔ klin, flat ɛn protɛkt frɔm mɔs, dɔst, skrach ɛn chenj we di tɛmpracha chenj pasmak. Kip di matirial dɛn na dɛn ɔrijinal pak te yu yuz am, alaw kondishɔn matirial fɔ rich di prodakshɔn-rum ɛnvayrɔmɛnt bifo yu opin, ɛn fala fɔs-in-fɔs-ɔut kɔntrol usay di ej fɔ trit di sɔfayz de afɛkt di printin.
Yuz fim we de protɛkt, intaliv ɔ klin rap we fit di say we yu dɔn pik.
Stɔr sheet dɛn flat pan sɔpɔt palet ɛn avɔyd lokal lod we kin introduks kɔl.
Protɛkt katon dɛn frɔm kɔndenseshɔn we dɛn de transfa di westɛm ɛn intanashɔnal shiping.
Identify gred, tiknes, surface, printable sayd, batch nɔmba ɛn kwantiti pan ɛni paket.
Kip di gred dɛn we dɛn kin yuz fɔ lɛsa ɛn di gred dɛn we nɔ gɛt lɛsa we dɛn kin separet pan fizik fɔ mek dɛn nɔ miks di prodakshɔn.
Wallis de saplae kad-matirial sistem pas fɔ trit ɛvri PC film lɛk di sem prodak. Di B2B rivyu kin kɔba kɔr shit, printabl layers, transparent ɔvlay, laserable film, inlay strɔkchɔ ɛn pak so bayer dɛn kin kɔmpia di prɔpɔz matirial dɛn agens wan kɔmplit dɔkyumɛnt stak.
Aplikeshɔn-bɛs gred sɛlɛkshɔn: difrɛns opasiti, printabiliti, laser rispɔns ɛn ɔvlay fɛnshɔn.
Kastom kɔnvɔyt: tik, dimɛnshɔn, sɔfa, kɔlɔ ɛn protɛktiv pak fɔ prodakshɔn layout.
Sampul-fɔs validɛshɔn: matirial fɔ print, laminɛshɔn, lɛsa ɛn finish-dɔkyumɛnt trayal.
Batch kɔmyunikeshɔn: bay spɛsifikɛshɔn, lɛbl ɛn kwaliti krayteria fɔ ripit saplai.
Ekspɔt kɔdineshɔn: protɛktiv pak ɛn shiping sɔpɔt fɔ kad faktri, distribyushɔn ɛn sikyɔriti-dɔkyumɛnt kɔntrakta dɛn.
Rikwest B2B PC Kɔr Shit Sampul ɛn Prayz
Na opaque, transparent ɔ kala PC layt we dɛn kin yuz insay wan multilayer kad ɔ dɔkyumɛnt. Dipen pan di gred, i kin gi strɔkchɔ, opasiti, printabiliti ɔ kɔntrol laser rispɔns. I nɔ fɔ kɔnfyus ɔtomɛtik wan wit transparent protɛktiv ɔvlay.
Di rεnj we de naw na 50–800μm. Di tik we yu pik fɔ kɔl togɛda wit ɔvlay, layers we yu kin print, layt we yu kin yuz lɛsa, ilɛktronik inlay ɛn di tik we yu want fɔ dɔn-dɔkyumɛnt.
Nɔ. Laser mak dipen pan di fɔmyulashɔn ɛn di layt pozishɔn we dɛn want. Spɛsifik if di layt fɔ bi nɔ-riaktiv, greyskel lɛsabl ɔ ay-kɔntrast lɛsa, dɔn tɛst am wit di aktual layz ikwipmɛnt.
Dɛn kin ebul fɔ evalyu di gred dɛn we dɛn kin print fɔ ɔfset, silk-skrin ɛn UV printin. Konfam di printabl sayd, dain levul, ink sistem, curing kondishon en adheshon afta lamination bifo komershal prodakshon.
Dɛn tu kin riak to laser ɛnaji, bɔt dɛn kin tek difrɛn pozishɔn ɛn sav difrɛn strɔkchɔral ɔ optik rol dɛn. Di chukchuk afɛkt di fɔs dip, di we aw di pɔtrɛt de luk, di transparency ɛn di sikyɔriti-ficha dizayn.
Wan haybrid strɔkchɔ pɔsibul ɔl afta dɛn validet tɛmal ɛkspɛnshɔn, sɔftɛn bihayvya, bɔndin, shrinkage ɛn finish-kad durabiliti. Nɔ tink se matirial we dɛn mek fɔ ful-PC stak go fiuz kɔrɛkt wan wit PVC ɔ PETG.
No say nɔ de we de ɔlsay na di wɔl. Tεmpratura, prεshכn, dwεl, ramp rεt εn kol dipכnt pan di gred, shit tiknes, ink kכvεrej, inlay strכkchכ, plet sistεm εn tכtal stak. Establish di prodakshɔn winda tru kɔntrol trial dɛn.
I kin evalyu as wan layt insay wan kɔmplit data-pej dizayn. Di projɛkt fɔ validet hinj kɔnstrɔkshɔn, transparent winda, ilɛktronik kɔmpɔnɛnt, laminɛshɔn, lɛsa pɔsnalayzeshɔn, buklet asɛmbli ɛn ishu-ɔtoriti rikwaymɛnt dɛn separet wan.
Nɔ. Dokumɛnt sikyɔriti kɔmɔt frɔm di kɔntrol dizayn ɛn mek di ful kredibiliti, inklud matirial, printin, laser pɔsnalayzeshɔn, ilɛktronik kɔmpɔnɛnt dɛn, sikyɔriti ficha dɛn, isyu ɛn verifyeshɔn sistem.
Yes, i go bi se na gred ɛn prodakshɔn fisibiliti. Gi di kɔlɔ, opasiti, haz, glos ɔ tɛkstɔr target dɛn we yu kin mɛzhɔ ɛn difayn aw di pɔsin we bay go gri fɔ dɛn.
Kip dɛn klin, dray, flat ɛn protɛkt dɛn na di ɔrijinal pak. Nɔ kɔndɛns, dɔst ɛn sɔfays damej. Kɔndishɔn pak dɛn we nɔ opin to di prodakshɔn ɛnvayrɔmɛnt bifo yu yuz am we di westɛm ɛn rum tɛmpracha difrɛn.
Test tiknes, printin, ink adheshon, lamination, shrinkage, flatness, peel bihayv, laser kontrast, kot en RFID pefomans we i apɔynt. Apruv wan Golden Sample ɛn rayt akseptans krayteria.
Gi di aplikeshɔn, layt drɔin, tiknes, sheet saiz, kɔlɔ, opasiti, sɔfays, printin prɔses, laser rikwaymɛnt, ɛni ia volyum, sampling nid, pak ɛn ples fɔ go.
| RFQ Aytem | Ditiɛl fɔ Gi |
|---|---|
| Dokumɛnt Aplikeshɔn | Nashɔnal ID, drayvin laysens, rɛsidɛns pɔmit, paspɔt data pej, akses kredibiliti ɔ ɔda program |
| Layer Fɔnkshɔn | Opak kor, transparent kor, printable layt, laserable layt ɔ non-laserable ɔvlay |
| Dimenshɔn dɛn | Tiknes, sheet saiz, yuzable eria, gren / extrusion dairekshɔn ɛn dimɛnshɔnal tolɛreshɔn |
| Optik Rikwaymɛnt dɛn | Kɔlɔ, waytnɛs, opasiti, transmishɔn, haz, glos ɛn sɔfays tɛkstɔr |
| Fɔ print | Ɔfset, skrin ɔ UV prɔses, ink brand, curing sistem ɛn artwok kɔvarej |
| Laser we dɛn kin yuz | Mashin, wevlɛnj, fɔs strateji, target kɔntrast, greyskel ɛn layt dip we dɛn want |
| Laminɛshɔn we dɛn kin yuz | Komplit stak, plet ɛn kusɛn sistɛm, tɛmpracha, prɛshɔn, dwɛl ɛn kol |
| Ilɛktronik tin dɛn | Chip, antena, modul, winda ɔ hinj intagreshɔn usay i apɔynt |
| Ditiɛl dɛn bɔt Kɔmishɔn | Sampul kwantiti, trayal volyum, ɛni ia fɔkɔs, ples fɔ go ɛn pak rikwaymɛnt |
